HMC554ALC3B [ADI]
10 GHz to 20 GHz, GaAs, MMIC, Double Balanced Mixer;
| 型号： | HMC554ALC3B |
| 厂家： | 
ADI |
| 描述： | 10 GHz to 20 GHz, GaAs, MMIC, Double Balanced Mixer |
| 文件： | 总26页 (文件大小：420K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
10 GHz to 20 GHz, GaAs, MMIC,
Double Balanced Mixer
HMC554ALC3B
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
HMC554ALC3B
Conversion loss: 8.5 dB
LO to RF isolation: 37 dB
12 11 10
Input IP3: 20 dBm
RoHS compliant, 2.90 mm × 2.90 mm, 12-terminal LCC package
1
2
3
9
8
7
GND
RF
GND
LO
APPLICATIONS
GND
GND
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
4
5
6
PACKAGE
BASE
GND
Figure 1.
GENERAL DESCRIPTION
The HMC554ALC3B is a general-purpose, double balanced
mixer in a leadless RoHS compliant leadless chip carrier (LCC)
package that can be used as an upconverter or downconverter
between 10 GHz and 20 GHz. This mixer is fabricated in a
gallium arsenide (GaAs) metal semiconductor field effect
transistor (MESFET) process and requires no external
components or matching circuitry. The HMC554ALC3B
provides excellent local oscillator (LO) to RF and LO to
intermediate frequency (IF) isolation due to optimized balun
structures. The RoHS compliant HMC554ALC3B eliminates the
need for wire bonding and is compatible with high volume
surface-mount manufacturing techniques.
Rev. A
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Tel: 781.329.4700 ©2018–2019 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC554ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance, IF = 3000 MHz ...................... 10
Upconverter Performance, IFIN = 100 MHz ........................... 13
Upconverter Performance, IFIN = 3000 MHz ......................... 16
Isolation and Return Loss ......................................................... 19
IF Bandwidth—Downconverter............................................... 21
Spurious and Harmonics Performance ................................... 23
Theory of Operation ...................................................................... 24
Applications Information.............................................................. 25
Typical Application Circuit....................................................... 25
Evaluation PCB Information .................................................... 25
Outline Dimensions....................................................................... 26
Ordering Guide .......................................................................... 26
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance, IF = 100 MHz........................... 6
REVISION HISTORY
10/2019—Rev. 0 to Rev. A
Changes to 10 GHz to 20 GHz Performance, Downconverter,
Input 1 dB Compression Point Parameter, Table 1 and 12 GHz to
16 GHz Performance, Downconverter, Input 1 dB Compression
Point Parameter, Table 1 .................................................................... 3
Changes to Figure 13 and Figure 15............................................... 7
Changes to Figure 27 and Figure 30............................................. 10
4/2018—Revision 0: Initial Version
Rev. A | Page 2 of 26
Data Sheet
HMC554ALC3B
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless otherwise noted, on the
evaluation printed circuit board (PCB).
Table 1.
Parameter
Symbol
Min
Typ
Max
Unit
FREQUENCY
RF Pin
IF Pin
LO Pin
10
DC
10
9
20
6
20
15
GHz
GHz
GHz
dBm
LO AMPLITUDE
13
10 GHz TO 20 GHz PERFORMANCE
Downconverter
Conversion Loss
8.5
9.5
20
10
46
11.5
dB
dB
dBm
dBm
dBm
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
SSB NF
IP3
P1dB
IP2
19
IFIN
Conversion Loss
7
dB
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
IP3
P1dB
19.5
10
dBm
dBm
RF to IF
LO to RF
LO to IF
24
25
23
41
37
41
dB
dB
dB
12 GHz TO 16 GHz PERFORMANCE
Downconverter
Conversion Loss
8
dB
Single Sideband Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
SSB NF
IP3
P1dB
IP2
9
dB
16
19.5
9.5
45
dBm
dBm
dBm
IFIN
Conversion Loss
Input Third-Order Intercept
Input 1 dB Compression Point
6.5
18
10
dB
dBm
dBm
IP3
P1dB
Rev. A | Page 3 of 26
HMC554ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
Parameter
Rating
25 dBm
26 dBm
25 dBm
3 mA
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Reflow Temperature
Maximum Junction Temperature
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
260°C
175°C
Table 3. Thermal Resistance
Package Type
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 3.7 mW/°C Above 85°C)
333 mW
θJA
θJC
Unit
E-12-41
120
195
°C/W
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
−40°C to +85°C
−65°C to +150°C
1 Test Condition 1: JEDEC standard JESD51-2.
250 V; Class 0B
1250 V; Class IV
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 4 of 26
Data Sheet
HMC554ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC554ALC3B
TOP VIEW
(Not to Scale)
12 11 10
1
2
3
9
8
7
GND
RF
GND
LO
GND
GND
4
5
6
PACKAGE
BASE
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 3, 4, 6, 7, 9
2
5
GND
LO
IF
Ground. These pins and package bottom must be connected to RF/dc ground.
LO Port. This pin is ac-coupled and matched to 50 Ω.
IF Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port
externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source/sink more than 3 mA of current or die malfunction and
possible die failure may result.
8
RF
RF Port. This pin is ac-coupled and matched to 50 Ω.
10, 11, 12
NIC
EPAD
Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
IF
Figure 3. GND Interface Schematic
Figure 5. IF Interface Schematic
RF
LO
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. A | Page 5 of 26
HMC554ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE, IF = 100 MHz
Upper Sideband (Low-Side LO)
–5
–5
–6
–6
–7
–7
–8
–8
–9
–9
–10
–11
–10
–11
–12
–13
–14
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
5
0
5
LO = 9dBm
0
10
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
14
14
12
10
8
12
10
8
6
6
4
4
2
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
2
0
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 9. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 6 of 26
Data Sheet
HMC554ALC3B
20
18
16
14
12
10
8
20
15
10
5
6
4
2
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
0
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 15. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 13. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
70
60
50
40
30
70
60
50
40
30
20
10
0
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 16. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 14. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Rev. A | Page 7 of 26
HMC554ALC3B
Data Sheet
Lower Sideband (High-Side LO)
–5
–5
–6
–6
–7
–7
–8
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 20. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
5
5
LO = 9dBm
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 18. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 21. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
14
14
12
10
8
12
10
8
6
6
4
4
2
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
2
0
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 19. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 22. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 8 of 26
Data Sheet
HMC554ALC3B
70
60
50
40
30
70
60
50
40
30
20
10
0
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 23. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 9 of 26
HMC554ALC3B
Data Sheet
DOWNCONVERTER PERFORMANCE, IF = 3000 MHz
Upper Sideband (Low-Side LO)
–5
–5
–6
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
–6
–7
A
A
A
–7
–8
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 28. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
5
5
LO = 9dBm
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 29. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
LO = 15dBm
LO = 13dBm
LO = 11dBm
15
10
5
15
10
5
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 27. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 30. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 10 of 26
Data Sheet
HMC554ALC3B
70
60
50
40
30
70
60
50
40
30
20
10
0
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 31. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 11 of 26
HMC554ALC3B
Data Sheet
Lower Sideband (High-Side LO)
–5
–5
–6
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
–6
–7
A
A
A
–7
–8
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 36. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
LO = 15dBm
LO = 13dBm
LO = 11dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
5
5
LO = 9dBm
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 37. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 34. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
70
60
50
40
30
70
60
50
40
30
20
10
0
20
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
10
LO = 9dBm
0
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 38. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 35. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 12 of 26
Data Sheet
HMC554ALC3B
UPCONVERTER PERFORMANCE, IFIN = 100 MHz
Upper Sideband (Low-Side LO)
–5
–5
–6
–6
–7
–7
–8
–8
–9
–9
–10
–10
–11
–12
–13
–14
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
–11
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 39. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 42. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
5
5
LO = 9dBm
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 40. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 43. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
25
20
15
10
5
25
20
15
10
5
0
10
0
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 41. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 44. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 13 of 26
HMC554ALC3B
Data Sheet
70
60
50
40
30
70
60
50
40
30
20
10
0
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 45. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 46. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 14 of 26
Data Sheet
HMC554ALC3B
Lower Sideband (High-Side LO)
–5
–5
–6
–6
–7
–7
–8
–8
–9
–9
–10
–11
–10
–11
–12
–13
–14
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
5
0
5
LO = 9dBm
0
10
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
70
60
50
40
30
70
60
50
40
30
20
10
0
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 49. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 52. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 15 of 26
HMC554ALC3B
Data Sheet
UPCONVERTER PERFORMANCE, IFIN = 3000 MHz
Upper Sideband (Low-Side LO)
–5
–5
–6
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
–6
–7
A
A
A
–7
–8
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
5
5
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
30
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
25
20
15
10
5
25
20
15
10
5
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 55. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 16 of 26
Data Sheet
HMC554ALC3B
70
60
50
40
30
70
60
50
40
30
20
10
0
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 59. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 60. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 17 of 26
HMC554ALC3B
Data Sheet
Lower Sideband (High-Side LO)
–5
–5
–6
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
–6
–7
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–7
–8
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 61. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 64. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
A
A
A
5
5
LO = 9dBm
0
10
0
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 62. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 65. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
70
60
50
40
30
70
60
50
40
30
20
10
0
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 63. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 66. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 18 of 26
Data Sheet
HMC554ALC3B
ISOLATION AND RETURN LOSS
70
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
RF FREQUENCY
Figure 67. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 70. LO to RF Isolation vs. RF Frequency at Various LO Power levels,
TA = 25°C
60
50
40
30
20
70
60
50
40
30
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
10
0
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 68. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 71. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
70
60
50
40
30
70
60
50
40
30
20
10
0
T
T
T
= +85°C
= +25°C
= –40°C
20
A
A
A
LO = 15dBm
LO = 13dBm
LO = 11dBm
10
LO = 9dBm
0
10
10
11
12
13
14
15
16
17
18
19
20
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY (GHz)
RF FREQUENCY
Figure 69. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 72. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 19 of 26
HMC554ALC3B
Data Sheet
0
–5
0
–5
–10
–15
–20
–25
–30
–35
–10
–15
–20
–25
–30
–35
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
0
1
2
3
4
5
6
10
11
12
13
14
15
16
17
18
19
20
IF FREQUENCY
LO FREQUENCY (GHz)
Figure 75. IF Return Loss vs. IF Frequency at LO Power Levels,
TA = 25°C, LO = 15 GHz
Figure 73. LO Return Loss vs. LO Frequency at LO = 13 dBm,
TA = 25°C
0
–5
–10
–15
–20
–25
–30
–35
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
10
11
12
13
14
15
16
17
18
19
20
RF FREQUENCY
Figure 74. RF Return Loss vs. RF Frequency at LO Power Levels,
TA = 25°C, LO = 15 GHz
Rev. A | Page 20 of 26
Data Sheet
HMC554ALC3B
IF BANDWIDTH—DOWNCONVERTER
Upper Sideband, LO Frequency = 12 GHz
–5
–5
–6
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
–6
T
= +85°C
= +25°C
= –40°C
A
T
A
–7
–8
–7
T
A
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IF BANDWIDTH
IF BANDWIDTH
Figure 76. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 78. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
LO = 15dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
LO = 13dBm
LO = 11dBm
LO = 9dBm
10
5
10
5
0
1.0
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IF BANDWIDTH
IF BANDWIDTH
Figure 77. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 79. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 21 of 26
HMC554ALC3B
Data Sheet
Lower Sideband, LO Frequency = 19 GHz
–5
–5
–6
LO = 15dBm
–6
T
= +85°C
= +25°C
= –40°C
LO = 13dBm
LO = 11dBm
LO = 9dBm
A
A
A
T
–7
–8
–7
T
–8
–9
–9
–10
–11
–12
–13
–14
–10
–11
–12
–13
–14
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IF BANDWIDTH
IF BANDWIDTH
Figure 80. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 82. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
5
0
5
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IF BANDWIDTH
IF BANDWIDTH
Figure 81. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Figure 83. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. A | Page 22 of 26
Data Sheet
HMC554ALC3B
M × N Spurious Outputs
SPURIOUS AND HARMONICS PERFORMANCE
Downconverter, Upper Sideband
Mixer spurious products are measured in dBc from the IF output
power level. N/A means not applicable.
Spur values are (M × RF) − (N × LO).
LO Harmonics
RF = 15.1 GHz at −10 dBm, LO = 15 GHz at 13 dBm.
LO = 13 dBm, all values in dBc below input LO level and
measured at RF port.
N × LO
0
1
2
3
4
5
Table 5. LO Harmonics at RF
0
1
2
3
4
5
N/A
48
14
0
47
70
60
79
74
27
72
79
70
80
72
N/A
65
74
78
88
81
N/A
N/A
68
71
78
88
N × LO Spur at RF Port
LO Frequency (GHz)
1
2
3
4
75
77
74
60
M × RF
12
13
15
16
18
19
21
39
38
38
37
36
36
36
39
40
48
56
54
53
46
59
70
49
50
N/A
N/A
N/A
57
65
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A 56
Upconverter, Upper Sideband
Spur values are (M × IF) + (N × LO).
IFIN = 100 MHz at −10 dBm, LO = 15 GHz at 13 dBm.
LO = 13 dBm, all values in dBc below input LO level and
measured at IF port.
N × LO
0
1
2
3
Table 6. LO Harmonics at IF
−5
−4
−3
−2
−1
0
89
88
91
91
36
N/A
36
88
90
90
88
80
79
66
67
0
73
73
74
74
35
17
35
73
74
73
72
67
68
66
66
20
22
19
65
66
65
66
N × LO Spur at IF Port
LO Frequency (GHz)
1
2
3
4
12
13
15
16
18
19
21
38
41
44
42
44
53
47
77
63
72
53
79
70
75
67
74
56
56
N/A
N/A
N/A
89
N/A
N/A
N/A
N/A
N/A
N/A
6
M × IF
+1
+2
+3
+4
+5
0
63
63
80
78
Rev. A | Page 23 of 26
HMC554ALC3B
Data Sheet
THEORY OF OPERATION
The HMC554ALC3B is a general-purpose, double balanced
mixer that can be used as an upconverter or a downconverter
from 10 GHz to 20 GHZ.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 6 GHz to radio frequencies between
10 GHz and 20 GHz.
When used as a downconverter, the HMC554ALC3B downconverts
RF between 10 GHz and 20 GHz to IF between dc and 6 GHz.
Rev. A | Page 24 of 26
Data Sheet
HMC554ALC3B
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 84 shows the typical application circuit for the
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 84). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 85 is
available from Analog Devices, Inc., upon request.
HMC554ALC3B. The HMC554ALC3B is a passive device
and does not require any external components. The IF pin
is internally dc-coupled. The RF and LO pins are internally
ac-coupled. When IF operation to dc is not required, using an
external series capacitor is recommended, of a value chosen to
pass the necessary IF frequency range. When IF operation to dc
is required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
Table 7. List of Materials for Evaluation PCB
EV1HMC554ALC3B
Item
J1, J2
J3
U1
PCB1
Description
12
11 10
PCB mount SRI 2.92 mm connectors
PCB mount Johnson SMA connector
HMC554ALC3B
HMC554ALC3B
GND
LO
GND
RF
9
8
7
1
2
3
LO
RF
117611-1 evaluation board on Rogers 4350
GND
GND
1 117611-1 is the raw bare PCB identifier. Reference EV1HMC554ALC3B when
ordering complete evaluation PCB.
4
5
6
IF
Figure 84. Typical Application Circuit
LO
RF
117611–1
554A
J2
J1
IF
U1
J3
Figure 85. Evaluation PCB Top Layer
Rev. A | Page 25 of 26
HMC554ALC3B
Data Sheet
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
PIN 1
INDICATOR
10
12
PIN 1
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
6
4
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.90
0.80
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 86. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC554ALC3B
HMC554ALC3BTR
HMC554ALC3BTR-R5
EV1HMC554ALC3B
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MSL Rating2
MSL3
MSL3
MSL3
Package Description
Package Option
12-Terminal Ceramic [LCC]
12-Terminal Ceramic [LCC]
12-Terminal Ceramic [LCC]
Evaluation PCB Assembly
E-12-4
E-12-4
E-12-4
1 All models are RoHS compliant.
2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13895-0-10/19(A)
Rev. A | Page 26 of 26
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