HMC606LC5TR [ADI]
HMC606LC5TR;
| 型号： | HMC606LC5TR |
| 厂家： | 
ADI |
| 描述： | HMC606LC5TR 射频 微波 |
| 文件： | 总10页 (文件大小：236K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GaAs, InGaP, HBT, MMIC, Ultralow Phase Noise,
Distributed Amplifier, 2 GHz to 18 GHz
Data Sheet
HMC606LC5
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Ultralow phase noise: −160 dBc/Hz typical at 10 kHz
Output power for 1 dB compression (P1dB): 15 dBm typical
at 2 GHz to 12 GHz frequency range
Gain: 13.5 dB typical at 2 GHz to 12 GHz frequency range
Output third-order intercept (IP3): 27 dBm typical at 2 GHz to
12 GHz frequency range
NC
1
2
3
4
5
6
7
8
NC
NC
22 GND
24
23
HMC606LC5
V
1
CC
NC
21 RFOUT
GND
RFIN
GND
NC
GND
NC
NC
20
19
18
17
Supply voltage: 5.0 V at 64 mA typical
50 Ω matched input/output
NC
NC
32-terminal, ceramic, leadless chip carrier (LCC)
PACKAGE
BASE
APPLICATIONS
GND
Radars, electronic warfare (EW), and electronic counter
measures (ECMs)
Figure 1.
Microwave radios
Test instrumentation
Military and space
Fiber optic systems
GENERAL DESCRIPTION
The HMC606LC5 is a gallium arsenide (GaAs), indium gallium
phosphide (InGaP), heterojunction bipolar transistor (HBT),
monolithic microwave integrated circuit (MMIC) distributed
amplifier housed in a 32-terminal, ceramic, leadless chip carrier
(LCC) package that operates from 2 GHz to 18 GHz. With an
input signal of 12 GHz, the amplifier provides ultralow phase noise
performance of −160 dBc/Hz at a 10 kHz offset, representing a
significant improvement over field effect transistor (FET)-based
distributed amplifiers.
The HMC606LC5 provides 13.5 dB of small signal gain, 27 dBm
output IP3, and 15 dBm of output power for 1 dB compression
while requiring 64 mA from a 5.0 V supply. The input and output
of the HMC606LC5 amplifier are internally matched to 50 Ω
and are internally dc blocked.
Rev. I
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Tel: 781.329.4700 ©2017–2018 Analog Devices, Inc. All rights reserved.
Technical Support
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HMC606LC5
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Applications information .................................................................9
Evaluation Printed Circuit Board (PCB) ...................................9
Outline Dimensions....................................................................... 10
Ordering Guide .......................................................................... 10
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Specifications............................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
1/2018—Rev. H to Rev. I
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Changes to Figure 16, Figure 16 Caption, Figure 17, Figure 17
Caption, Figure 18, Figure 18 Caption, and Figure 19 ................ 8
Changes to Ordering Guide .......................................................... 10
2/2017—Rev. 05.0514 to Rev. F
Updated Format..................................................................Universal
Changes to Features Section and General Description Section........1
Changes to Table 4.............................................................................4
Updated Outline Dimensions..........................................................9
Changes to Ordering Guide.............................................................9
10/2017—Rev. G to Rev. H
Changes to Typical Performance Characteristics Section........... 7
Added Figure 19; Renumbered Sequentially ................................ 9
Updated Outline Dimensions ...................................................... 10
Changes to Ordering Guide .......................................................... 10
8/2017—Rev. F to Rev. G
Changes to Continuous Power Dissipation, PDISS Parameter,
Table 4 ................................................................................................ 4
Rev. I | Page 2 of 10
Data Sheet
HMC606LC5
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
TA = 25°C, VCC1 = VCC2 = 5 V, unless otherwise noted.
Table 1.
Parameter
Min
2
Typ
Max
Unit
GHz
dB
dB
dB/°C
dB
FREQUENCY RANGE
GAIN
Flatness
Variation Over Temperature
NOISE FIGURE
INPUT RETURN LOSS
OUTPUT
12
10.5
13.5
1.0
0.021
5
20
dB
Return Loss
Power for 1 dB Compression (P1dB)
Saturated Power (PSAT
Third-Order Intercept (IP3)
PHASE NOISE
At 100 Hz
At 1 kHz
At 10 kHz
15
15
17
27
dB
12
dBm
dBm
dBm
)
−140
−150
−160
−170
64
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
mA
At 1 MHz
SUPPLY CURRENT
95
Table 2.
Parameter
Min
Typ
Max
Unit
GHz
dB
dB
dB/°C
dB
FREQUENCY RANGE
GAIN
Flatness
Variation Over Temperature
NOISE FIGURE
INPUT RETURN LOSS
OUTPUT
2
18
9.5
12.5
1.0
0.024
7
18
dB
Return Loss
Power for 1 dB Compression (P1dB)
Saturated Power (PSAT
Third-Order Intercept (IP3)
PHASE NOISE
At 100 Hz
At 1 kHz
At 10 kHz
15
13
15
22
dB
10
dBm
dBm
dBm
)
−140
−150
−160
−170
64
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
mA
At 1 MHz
SUPPLY CURRENT
95
Table 3. VCC1, VCC2 vs. Typical Supply Current
VCC1, VCC2 (V)
ICC1 + ICC2 (mA)
4.5
5.0
5.5
53
64
71
Rev. I | Page 3 of 10
HMC606LC5
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Table 4.
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
VCC1 = VCC
2
7 V
RF Input Power (RFIN)
Channel Temperature
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 10.9 mW/°C Above 85°C)
Maximum Peak Reflow Temperature (MSL3)1
15 dBm
175°C
0.978 W
260°C
92°C/W
ESD CAUTION
Thermal Resistance (Channel to Ground
Paddle)
Storage Temperature Range
Operating Temperature Range
ESD Sensitivity (Human Body Model, HBM)
−65°C to +150°C
−40°C to +85°C
Class 0, Pass 100 V
1 See the Ordering Guide section.
Rev. I | Page 4 of 10
Data Sheet
HMC606LC5
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NC
1
2
3
4
5
6
7
8
24 NC
23 NC
V
1
CC
22
GND
NC
HMC606LC5
21 RFOUT
GND
RFIN
GND
NC
TOP VIEW
20
19
GND
NC
(Not to Scale)
18 NC
17 NC
NC
PACKAGE
BASE
GND
NOTES
1. NC = NO CONNECT. THESE PINS MAY BE CONNECTED TO RF
GROUND. PERFORMANCE WILL NOT BE AFFECTED.
2. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 7 to 15, 17 to 19, 23 to 32
2, 16
NC
VCC1, VCC
No Connect. These pins may be connected to RF ground. Performance will not be affected.
Power Supply Voltages for the Amplifier. See Figure 3 for the interface schematic.
2
4, 6, 20, 22
GND
Ground. These pins must be connected to RF/dc ground. See Figure 4 for the interface
schematic.
5
RFIN
RF Input. This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface
schematic.
21
RFOUT
EPAD
RF Output. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface
schematic.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
V
1, V
2
CC
CC
RFIN
Figure 3. VCC1, VCC2 Interface Schematic
Figure 5. RFIN Interface Schematic
GND
RFOUT
Figure 6. RFOUT Interface Schematic
Figure 4. GND Interface Schematic
Rev. I | Page 5 of 10
HMC606LC5
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
20
16
12
8
20
S11
S21
S22
+85°C
+25°C
–40°C
10
0
–10
–20
–30
4
0
0
2
4
6
8
10
12
14
16
18
20
22
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. Response (Gain and Return Loss) vs. Frequency
Figure 10. Gain vs. Frequency for Various Temperatures
0
0
–5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
–5
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 8. Input Return Loss vs. Frequency for Various Temperatures
Figure 11. Output Return Loss vs. Frequency for Various Temperatures
20
14
+85°C
+25°C
–40°C
12
15
10
5
10
8
6
4
0
2
OUTPUT POWER
GAIN
PAE
–5
–15
0
–10
–5
0
5
10
2
4
6
8
10
12
14
16
18
P
(dBm)
IN
FREQUENCY (GHz)
Figure 9. Output Power (POUT), Gain, and Power Added Efficiency (PAE) vs.
Input Power (PIN
Figure 12. Noise Figure vs. Frequency for Various Temperatures
)
Rev. I | Page 6 of 10
Data Sheet
HMC606LC5
20
16
12
8
25
21
17
13
9
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
4
0
5
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 13. Power for 1 dB Compression (P1dB) vs. Frequency for Various
Temperatures
Figure 15. Saturated Power (PSAT) vs. Frequency for Various Temperatures
35
+85°C
+25°C
–40°C
30
25
20
15
10
5
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
Figure 14. Output Third-Order Intercept (IP3) vs. Frequency for Various
Temperatures
Rev. I | Page 7 of 10
HMC606LC5
Data Sheet
–80
–80
–90
–90
–100
–110
–120
–130
–140
–150
–160
–170
–180
–100
–110
–120
–130
–140
–150
–160
–170
–180
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
OFFSET FREQUENCY (Hz)
OFFSET FREQUENCY (Hz)
Figure 16. Additive Phase Noise vs. Offset Frequency
RF Frequency = 12 GHz, RF Input Power = 3 dBm (P1dB)
Figure 18. Additive Phase Noise vs. Offset Frequency,
RF Frequency = 12 GHz, RF Input Power = 11 dBm (PSAT
)
–80
–90
–80
–90
–100
–110
–120
–130
–140
–150
–160
–170
–180
–100
–110
–120
–130
–140
–150
–160
–170
–180
10
100
1k
10k
100k
1M
100
1k
10k
100k
1M
OFFSET FREQUENCY (Hz)
OFFSET FREQUENCY (Hz)
Figure 17. Additive Phase Noise vs. Offset Frequency
RF Frequency = 12 GHz at Small Signal
Figure 19. Additive Phase Noise vs. Offset Frequency,
RF Frequency = 8 GHz, RF Input Power = 12 dBm (PSAT
)
Rev. I | Page 8 of 10
Data Sheet
HMC606LC5
APPLICATIONS INFORMATION
Use a sufficient number of via holes to connect the top and bottom
ground planes. Mount the evaluation PCB to an appropriate
heat sink. The evaluation PCB shown in Figure 20 is available
from Analog Devices, Inc., upon request.
EVALUATION PRINTED CIRCUIT BOARD (PCB)
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
the package ground leads and package bottom must be connected
directly to the ground plane similar to that shown in Figure 20.
Figure 20. Evaluation PCB
Table 6. List of Materials for Evaluation PCB (117156-HMC606LC51)
Item
J1, J2
J3, J4
C1, C2
C3, C4
C5, C6
U1
Description
SRI K connectors
2 mm Molex headers
4.7 μF, tantalum capacitors
100 pF capacitors, 0402 package
1000 pF capacitors, 0603 package
HMC606LC5
PCB
117325-1 evaluation PCB; circuit board material: Rogers 4350
1 Reference this number when ordering the complete evaluation PCB.
Rev. I | Page 9 of 10
HMC606LC5
Data Sheet
OUTLINE DIMENSIONS
5.05
4.90 SQ
4.75
0.36
0.30
0.24
PIN 1
0.08
REF
INDICATOR
PIN 1
32
25
24
1
0.50
BSC
3.60
3.50 SQ
3.40
EXPOSED
PAD
17
8
16
9
0.38
0.32
0.26
0.20 MIN
BOTTOM VIEW
3.50 REF
TOP VIEW
SIDE VIEW
1.10
1.00
0.90
4.10 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 21. 32-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC606LC5
HMC606LC5TR
HMC606LC5TR-R5
117156-HMC606LC5
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MSL Rating2
MSL3
MSL3
MSL3
Package Description
Package Option
E-32-1
E-32-1
32-Terminal Ceramic Leadless Chip Carrier [LCC]
32-Terminal Ceramic Leadless Chip Carrier [LCC]
32-Terminal Ceramic Leadless Chip Carrier [LCC]
Evaluation Board
E-32-1
1 All models are RoHS Compliant.
2 See the Absolute Maximum Ratings section.
©2017–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14968-0-1/18(I)
Rev. I | Page 10 of 10
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