HMC745LC3TR [ADI]
13 Gbps, Fast Rise Time XOR/XNOR Gate with Programmable Output Voltage and Positive Supply;
| 型号： | HMC745LC3TR |
| 厂家： | 
ADI |
| 描述： | 13 Gbps, Fast Rise Time XOR/XNOR Gate with Programmable Output Voltage and Positive Supply 栅 电信 电信集成电路 石英晶振 |
| 文件： | 总12页 (文件大小：634K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
13 Gbps, Fast Rise Time XOR/XNOR Gate with
Programmable Output Voltage and Positive Supply
Data Sheet
HMC745
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Inputs terminated internally at 50 Ω
Differential and single-ended operation
Fast rise and fall times: 21/19 ps
Low power consumption: 240 mW (typical)
Programmable differential
V
V
CC
CC
GND 1
12
GND
50Ω
50Ω
Output voltage swing: 600 mV to 1200 mV
Propagation delay: 95 ps
Single supply: 3.3 V
AN
AP
2
3
4
1 1 DP
10
9
DN
50Ω
50Ω
16-terminal, ceramic 3 mm × 3 mm LCC package
GND
GND
50Ω
50Ω
V
V
CC
CC
APPLICATIONS
PACKAGE
BASE
RF automatic test equipment (ATE) applications
Broadband test and measurement
Serial data transmission up to 13 Gbps
Digital logic systems up to 13 GHz
Figure 1.
GENERAL DESCRIPTION
The HMC745 is a XOR/XNOR gate function designed to
support data transmission rates of up to 13 Gbps, and clock
frequencies as high as 13 GHz. The HMC745 also features an
output level control pin, VR, which permits loss compensation
or signal level optimization.
Inputs or outputs can be connected directly to a 50 Ω VCC
terminated system, while dc blocking capacitors may be used if
the terminating system is 50 Ω to ground. The HMC745
operates from a single 3.3 V dc supply, and is available in a
ceramic, RoHS compliant, 3 mm × 3 mm LCC package.
All input and output signals to the HMC745 are terminated
with 50 Ω to VCC on-chip, and can be either ac-coupled or
dc-coupled.
Rev. C
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www.analog.com
HMC745* PRODUCT PAGE QUICK LINKS
Last Content Update: 10/31/2017
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DESIGN RESOURCES
• HMC745 Material Declaration
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EVALUATION KITS
• HMC745LC3 Evaluation Board
• Quality And Reliability
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DOCUMENTATION
Data Sheet
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• HMC745: 13 Gbps, Fast Rise Time XOR/XNOR Gate with
Programmable Output Voltage and Positive Supply Data
Sheet
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TOOLS AND SIMULATIONS
• HMC745 IBIS Model
TECHNICAL SUPPORT
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REFERENCE MATERIALS
Quality Documentation
DOCUMENT FEEDBACK
Submit feedback for this data sheet.
• Package/Assembly Qualification Test Report: LC3, LC3B,
LC3C (QTR: 2014-00376 REV: 01)
• Semiconductor Qualification Test Report: BiCMOS-C (QTR:
2013-00241)
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HMC745
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Applications Information .................................................................9
Evaluation Printed Circuit Board (PCB)....................................9
Outline Dimensions....................................................................... 11
Ordering Guide .......................................................................... 11
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Specifications............................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
10/2017—Rev. 02.0514 to Rev. C
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Updated Format..................................................................Universal
Change to Features Section, General Description Section, and
Figure 1 Caption................................................................................. 1
Changes to Table 2............................................................................ 4
Changes to Figure 2 Caption........................................................... 5
Deleted Figure 7; Renumbered Sequentially................................. 5
Changes to Theory of Operation Section...................................... 8
Changes to Evaluation Printed Circuit Board (PCB) Section .... 9
Changes to Figure 18 Caption....................................................... 10
Changes to Figure 19 Caption....................................................... 11
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 12
Rev. C | Page 2 of 11
Data Sheet
HMC745
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
TA = 25°C and VCC = 3.3 V, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
POWER SUPPLY VOLTAGE
Voltage
3.0
3.3
3.6
V
Current
72
13
13
MAXIMUM DATA RATE
MAXIMUM CLOCK RATE
INPUT VOLTAGE
High
Gbps
GHz
2.8
2.1
3.8
3.3
V
V
Low
INPUT RETURN LOSS
OUTPUT AMPLITUDE
Single-Ended
Differential
Frequency < 13 GHz
10
dB
550
1100
mV p-p
mV p-p
OUTPUT VOLTAGE
High
Low
3.25
2
V
V
OUTPUT
Rise Time
Fall Time
Differential, 20 % to 80 %
Frequency < 13 GHz
21
19
10
27
ps
ps
dB
dB
OUTPUT RETURN LOSS
SMALL SIGNAL GAIN
JITTER
Random, JR
Deterministic, JD
PROPAGATION DELAY, tD
0.2
ps, rms
ps p-p
ps
215 − 1 PRBS input1
2
95
1 Deterministic jitter is calculated by simultaneously measuring the jitter of a 300 mV input, 13 GHz input, a 215 − 1 PRBS input, and a single-ended output.
Rev. C | Page 3 of 11
HMC745
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Table 2.
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Parameter
Rating
Power Supply Voltage (VCC)
VCC − 0.5 V to
3.75 V
VCC − 2 V to
+ VCC + 0.5 V
VCC − 1.5 V to
+ VCC + 0.5 V
0.68 W
Input Signals
Output Signals
ESD CAUTION
Continuous PDISS (T = 85°C) (Derate
17 mW/°C Above 85°C)
Thermal Resistance (RTH-JP), Worst Case
Junction to Package Pad
59°C/W
Maximum Junction Temperature
Storage Temperature Range
Operating Temperature Range
Electrostatic Discharge (ESD) Sensitivity,
Human Body Model (HBM)
125°C
−65°C to +150°C
−40°C to +85°C
Class 1C
Rev. C | Page 4 of 11
Data Sheet
HMC745
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
GND
12
GND
AN
HMC745
11 DP
TOP VIEW
10
AP
DN
(Not to Scale)
GND
9
GND
NOTES
1. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO GND.
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1, 4, 5, 8, 9, 12
2, 3
6, 7
10, 11
Mnemonic Description
GND
Signal Ground.
AN, AP
BP, BN
DN, DP
VCC
Clock/Data Input A.
Clock/Data Input B.
Clock/Data Output.
Positive Supply.
13, 16
14, Package Base GND
Supply Ground.
15
VR
EPAD
Output Level Control. Output level can be adjusted by applying a voltage to VR per Figure 10.
Exposed Pad. Exposed pad must be connected to GND.
INTERFACE SCHEMATICS
GND
V
CC
50Ω
DP,
DN
Figure 3. GND Interface Schematic
Figure 6. DN, DP Interface Schematic
V
CC
50Ω
VR
AP,
AN
Figure 4. AN, AP Interface Schematic
Figure 7. VR Interface Schematic
V
CC
50Ω
BP,
BN
Figure 5. BP, BN Interface Schematic
Rev. C | Page 5 of 11
HMC745
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
90
1200
1175
1150
1125
1100
1075
1050
1025
1000
+85°C
+85°C
+25°C
–40°C
+25°C
–40°C
85
80
75
70
65
60
55
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 8. DC Current vs. Supply Voltage, VR = 3.3 V, Frequency = 13 GHz
Figure 11. Output (VOUT) Differential vs. Supply Voltage, VR = 3.3 V, Frequency =
13 GHz
25
1400
1200
1000
800
RISE TIME
FALL TIME
23
21
19
17
15
600
400
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
2
4
6
8
10
12
14
16
18
SUPPLY VOLTAGE (V)
FREQUENCY (GHz)
Figure 9. Rise/Fall Time vs. Supply Voltage, Frequency = 13 GHz
Figure 12. Output (VOUT) Differential vs. Frequency, VR = 3.3 V
1400
25
RISE TIME
FALL TIME
+85°C
+25°C
–40°C
1200
1000
800
23
21
19
17
15
600
400
2.1
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
2.1
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
VR (V)
VR (V)
Figure 10. Output (VOUT) Differential vs. VR, Frequency = 13 GHz
Figure 13. Rise/Fall Time vs. VR, Frequency = 13 GHz
Rev. C | Page 6 of 11
Data Sheet
HMC745
0
–5
0
–5
–10
–15
–20
–25
–30
–35
–10
–15
–20
–25
–30
0
2
4
6
8
10
12
14
0
2
4
6
8
10
12
14
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 14. Input Return Loss vs. Frequency
Figure 16. Output Return Loss vs. Frequency
Figure 15. Eye Diagram, Waveform Generated with an Agilent N4903A J-Bert,
Rate = 13 Gbps, Eye Diagram Data Presented on a Tektronix CSA 8000,
Device is AC-Coupled to Scope
Rev. C | Page 7 of 11
HMC745
Data Sheet
THEORY OF OPERATION
The HMC745 consists of an XOR/XNOR stage followed by an
output driver stage. The XOR/XNOR stage accepts two differential
input pairs; AN/AP and BN/BP, and gives one differential output.
The following output driving stage drives the line with a 50 Ω
single-ended or 100 Ω differential. The output stage has a tunable
voltage swing feature that allows the tune to swing between 600 mV
p–p to 1200 mV p–p. All input/output interfaces are referenced to
3.3 V with a 50 Ω resistor.
Rev. C | Page 8 of 11
Data Sheet
HMC745
APPLICATIONS INFORMATION
Truth Table1
Input
Outputs
A
L
B
L
D
L
L
H
H
H
L
H
H
H
L
1 A = AP – AN, B = BP – BN, D = DP – DN, H is the positive voltage level, and L is the negative voltage level.
AP
BP
td
td
80%
20%
80%
20%
DP
tf
Figure 17. Timing Diagram
tr
Table 5. List of Materials for Evaluation PCB 1225171
EVALUATION PRINTED CIRCUIT BOARD (PCB)
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance
while the package ground leads must be connected directly to
the ground plane. The exposed package base must be connected
to GND. A sufficient number of via holes must be used to
connect the top and bottom ground planes. The evaluation
circuit board shown is available from Analog Devices, Inc.,
upon request.
Item
J1 to J6
J7 to J9
JP1
C1, C2
C3 to C5
R2
Description
PCB mount SMA RF connectors
DC pin
Shorting jumper
4.7 μF capacitor, tantalum
100 pF capacitor, 0402 package
10 Ω resistor, 0603 package
HMC745LC3, high speed logic, XOR/XNOR
122515 evaluation board
U1
PCB2
Table 4. Connector Description
1 Reference this number when ordering complete evaluation PCB.
2 The circuit board material is Arlon 25FR.
Item
Description
J1
J2
AN
AP
J3
BP
J4
J5
J6
J7
BN
DN
DP
GND
VR
J8
J9
VCC
Rev. C | Page 9 of 11
HMC745
Data Sheet
Figure 18. Evaluation Board
J9
J8
+
+
C1
C2
4.7µF
4.7µF
R2
10Ω
C3
100pF
C5
100pF
C4
100pF
13 16
15
1, 4, 5, 8
9, 12, 14
V
V
VR
GND
CC
CC
J7
J6
J5
2
3
AN
AP
DP 11
J1
J2
DN 10
BP
6
BN
7
J3 J4
Figure 19. Evaluation Board Schematic
Rev. C | Page 10 of 11
Data Sheet
HMC745
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
PIN 1
0.08
BSC
INDICATOR
PIN 1
1.60
13
16
1
12
0.50
BSC
EXPOSED
PAD
1.50 SQ
1.40
9
4
8
5
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.50
REF
0.90
0.80
0.70
2.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 20. 16-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-16-1)
Dimensions shown in millimeters.
ORDERING GUIDE
Model1
HMC745LC3
HMC745LC3TR
HMC745LC3TR-R5
122517-HMC745LC3
MSL Rating2
MSL3
MSL3
MSL3
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
E-16-1
E-16-1
16-Terminal Ceramic Leadless Chip Carrier [LCC]
16-Terminal Ceramic Leadless Chip Carrier [LCC]
16-Terminal Ceramic Leadless Chip Carrier [LCC]
Evaluation Board
E-16-1
1 All models are RoHS compliant.
2 Maximum peak reflow temperature of 26 °C.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14819-0-10/17(C)
Rev. C | Page 11 of 11
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