HMC8193 [ADI]
2.5 GHz to 8.5 GHz, I/Q Mixer;
| 型号： | HMC8193 |
| 厂家： | 
ADI |
| 描述： | 2.5 GHz to 8.5 GHz, I/Q Mixer |
| 文件： | 总36页 (文件大小：577K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.5 GHz to 8.5 GHz, I/Q Mixer
Data Sheet
HMC8193
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Passive I/Q mixer
RF and LO range: 2.5 GHz to 8.5 GHz
Wide IF range: dc to 4 GHz
Single-ended RF, LO, and IF
Conversion loss (downconverter): 9 dB (typical)
Image rejection (downconverter): 25 dBc (typical)
SSB noise figure (downconverter): 11.5 dB (typical)
Input IP3 (downconverter): 20 dBm (typical)
Input P1dB compression point (downconverter): 13 dBm
(typical)
1
2
3
4
5
6
NIC
NIC
18 NIC
17 NIC
16 GND
HMC8193
GND
RF
15
14
13
LO
GND
NIC
GND
NIC
PACKAGE
BASE
Input IP2 (downconverter): 58 dBm (typical)
RF to IF isolation (downconverter): 22 dB (typical)
LO to RF isolation (downconverter): 48 dB (typical)
LO to IF isolation (downconverter): 38 dB (typical)
Amplitude balance (downconverter): 0.5 dB (typical)
Phase balance (downconverter): 5° (typical)
RF return loss: 13 dB (typical)
GND
Figure 1.
LO return loss 13 dB (typical)
IF return loss: 17 dB (typical)
Exposed pad, 4 mm × 4 mm, 24-terminal, ceramic
LCC package
APPLICATIONS
Test and measurement instrumentation
Military, aerospace, and radar
Direct conversion receivers
GENERAL DESCRIPTION
The HMC8193 is a passive, in phase/quadrature (I/Q), monolithic
microwave integrated circuit (MMIC) mixer that can be used
either as an image rejection mixer for receiver operations, or as
a single-sideband upconverter for transmitter operations from
2.5 GHz to 8.5 GHz. The inherent I/Q architecture of the
HMC8193 offers excellent image rejection and thereby eliminates
the need for expensive filtering of unwanted sidebands. The
mixer also provides excellent local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) isolation
and reduces the effect of LO leakage to ensure signal integrity.
Being the HMC8913 is a passive mixer, it does not require any
dc power sources. The device offers a lower noise figure than an
active mixer, ensuring superior dynamic range for high
performance and precision applications.
The HMC8193 is fabricated on a gallium arsenide (GaAs),
metal semiconductor field effect transistor (MESFET) process
and uses Analog Devices, Inc., mixer cells and a 90° hybrid. It is
available in a compact, 4 mm × 4 mm, 24-lead LCC package
and operates over the −40°C to +85°C temperature range. An
evaluation board for this device is also available.
Rev. B
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2017–2018 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC8193
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Upconverter Performance......................................................... 18
Isolation and Return Loss ......................................................... 24
IF Bandwidth .............................................................................. 26
Amplitude and Phase Imbalance ............................................. 27
Spurious and Harmonics Performance ................................... 29
Theory of Operation ...................................................................... 32
Applications Information .............................................................. 33
Soldering Information and Recommended Land Pattern .... 34
Evaluation Board Information.................................................. 35
Outline Dimensions....................................................................... 36
Ordering Guide .......................................................................... 36
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance...................................................... 6
REVISION HISTORY
5/2018—Rev. A to Rev. B
Changes to Applications Information Section............................ 33
1/2018—Rev. 0 to Rev. A
Changes to Features.......................................................................... 1
Changed Single-Sideband (SSB) Noise Figure Parameter from
15 dB Typical to 11.5 dB Typical, Table 1...................................... 3
Changes to Ordering Guide .......................................................... 36
8/2017—Revision 0: Initial Version
Rev. B | Page 2 of 36
Data Sheet
HMC8193
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, and LO drive = 18 dBm; all measurements performed as downconverter with lower sideband selected, unless
otherwise noted.
Table 1.
Parameter
Symbol
RF
Min
Typ
Max
Unit
RADIO FREQUENCY
LOCAL OSCILLATOR
Frequency
2.5
8.5
GHz
LO
2.5
DC
8.5
4
GHz
dBm
GHz
Drive Level
18
INTERMEDIATE FREQUENCY
RF PERFORMANCE AS DOWNCONVERTER
Conversion Loss
IF
9
11
dB
Image Rejection
23
16
25
11.5
20
13
58
dBc
dB
dBm
dBm
dBm
Single-Sideband (SSB) Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Isolation
IP3
P1dB
IP2
RF to IF
LO to RF
LO to IF
Amplitude Balance
Phase Balance
13
37
30
22
48
38
0.5
5
dB
dB
dB
dB
Degrees
RF PERFORMANCE AS UPCONVERTER
Conversion Loss
Sideband Rejection
Input Third-Order Intercept
RETURN LOSS PERFORMANCE
RF
8.5
23
21
dB
dBc
dBm
IP3
13
13
17
dB
dB
dB
LO
IFx
Rev. B | Page 3 of 36
HMC8193
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
21 dBm
25 dBm
21 dBm
6 mA
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 12.44 mW/°C Above 85°C)
Table 3. Thermal Resistance
Package Type
E-24-11
θJA
θJC
Unit
1120 mW
120
80
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 4 × 4 thermal vias. See JEDEC JESD51-12 for additional information.
Maximum Junction Temperature
Maximum Peak Reflow Temperature (MSL3)
Operating Temperature Range
Storage Temperature Range
175°C
260°C
−40°C to +85°C
−65°C to +150°C
ESD CAUTION
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
2000 V
Field Induced Charged Device Model (FICDM) 1250 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 4 of 36
Data Sheet
HMC8193
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC 1
NIC 2
18 NIC
NIC
17
HMC8193
TOP VIEW
(Not to Scale)
3
16 GND
15 LO
GND
RF 4
14
GND
GND 5
13 NIC
6
NIC
NOTES
1. NOT INTERNALLY CONNECTED. NO CONNECTION IS
REQUIRED. THESE PINS CAN BE CONNECTED TO
RF/DC GROUND WITHOUT AFFECTING PERFORMANCE.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 2, 6 to 8, 10, 13, 17 to 24 NIC
Not Internally Connected. No connection is required. These pins can be connected to RF/dc
ground without affecting performance.
3, 5, 12, 14, 16
GND
RF
Ground Connect. These pins and package bottom must be connected to RF/dc ground. See Figure 3
for the interface schematic.
Radio Frequency. This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface
schematic.
First and Quadrature Intermediate Frequency. This pin is dc-coupled. For applications not
requiring operation to dc, dc block this port externally using a series capacitor with a value
selected to pass the necessary IF frequency range. For operation to dc, this pin must not source or
sink more than 6 mA of current; otherwise, the device does not function and may fail. See Figure 4
for the interface schematic.
4
9
IF1
11
15
IF2
Second Quadrature Intermediate Frequency. This pin is dc-coupled. For applications not
requiring operation to dc, dc block this port externally using a series capacitor with a value
selected to pass the necessary IF frequency range. For operation to dc, this pin must not source or
sink more than 6 mA of current; otherwise, the device does not function and may fail. See Figure 4 for
the interface schematic.
Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface
schematic.
LO
EPAD
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
RF
Figure 3. GND Interface Schematic
Figure 5. RF Interface Schematic
IF1, IF2
LO
Figure 6. LO Interface Schematic
Figure 4. IF1, IF2 Interface Schematic
Rev. B | Page 5 of 36
HMC8193
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter Performance at IF = 100 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
20dBm
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 10. Conversion Gain vs. RF Frequency at Various LO Drives
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures
40
40
20dBm
18dBm
+85°C
+25°C
–40°C
35
35
16dBm
14dBm
30
30
25
20
15
10
5
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 11. Image Rejection vs. RF Frequency at Various LO Drives
Figure 8. Image Rejection vs. RF Frequency at Various Temperatures
40
40
20dBm
18dBm
+85°C
+25°C
–40°C
35
35
16dBm
14dBm
30
30
25
20
15
10
5
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 12. Input IP3 vs. RF Frequency at Various LO Drives
Figure 9. Input IP3 vs. RF Frequency at Various Temperatures
Rev. B | Page 6 of 36
Data Sheet
HMC8193
100
100
90
80
70
60
50
40
30
20
10
0
20dBm
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
90
80
70
60
50
40
30
20
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Input IP2 vs. RF Frequency at Various Temperatures
Figure 15. Input IP2 vs. RF Frequency at Various LO Drives
25
25
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
20
15
10
5
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Noise Figure vs. RF Frequency at Various LO Drives
Figure 14. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 7 of 36
HMC8193
Data Sheet
Downconverter Performance at IF = 1000 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
20dBm
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 20. Conversion Gain vs. RF Frequency at Various LO Drives
Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures
70
70
20dBm
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
60
50
40
30
20
10
0
60
50
40
30
20
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 21. Image Rejection vs. RF Frequency at Various LO Drives
Figure 18. Image Rejection vs. RF Frequency at Various Temperatures
40
40
20dBm
18dBm
+85°C
+25°C
–40°C
35
35
16dBm
14dBm
30
30
25
20
15
10
5
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 22. Input IP3 vs. RF Frequency at Various LO Drives
Figure 19. Input IP3 vs. RF Frequency at Various Temperatures
Rev. B | Page 8 of 36
Data Sheet
HMC8193
100
100
90
80
70
60
50
40
30
20
10
0
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
90
80
70
60
50
40
30
20
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 23. Input IP2 vs. RF Frequency at Various Temperatures
Figure 25. Input IP2 vs. RF Frequency at Various LO Drives
25
+85°C
+25°C
–40°C
20
15
10
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 24. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 9 of 36
HMC8193
Data Sheet
Downconverter Performance at IF = 3500 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
20dBm
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 26. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 29. Conversion Gain vs. RF Frequency at Various LO Drives
70
70
20dBm
18dBm
+85°C
+25°C
–40°C
16dBm
60
50
40
30
20
10
0
60
14dBm
50
40
30
20
10
0
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 27. Image Rejection vs. RF Frequency at Various Temperatures
Figure 30. Image Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
35
35
16dBm
14dBm
30
30
25
20
15
10
5
25
20
15
10
5
0
0
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 28. Input IP3 vs. RF Frequency at Various Temperatures
Figure 31. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 10 of 36
Data Sheet
HMC8193
100
100
90
80
70
60
50
40
30
20
10
0
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
90
80
70
60
50
40
30
20
10
0
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 32. Input IP2 vs. RF Frequency at Various Temperatures
Figure 34. Input IP2 vs. RF Frequency at Various LO Drives
25
+85°C
+25°C
–40°C
20
15
10
5
0
2.5
3.5
4.5
5.5
6.5
7.5
RF FREQUENCY (GHz)
Figure 33. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 11 of 36
HMC8193
Data Sheet
Downconverter Performance at IF = 100 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
20dBm
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 35. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 38. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
20dBm
+85°C
+25°C
–40°C
18dBm
35
30
25
20
15
10
5
35
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 36. Image Rejection vs. RF Frequency at Various Temperatures
Figure 39. Image Rejection vs. RF Frequency at Various LO Drives
40
40
20dBm
+85°C
+25°C
–40°C
18dBm
35
30
25
20
15
10
5
35
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 37. Input IP3 vs. RF Frequency at Various Temperatures
Figure 40. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 12 of 36
Data Sheet
HMC8193
100
100
90
80
70
60
50
40
30
20
10
0
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
90
80
70
60
50
40
30
20
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 41. Input IP2 vs. RF Frequency at Various Temperatures
Figure 43. Input IP2 vs. RF Frequency at Various LO Drives
25
+85°C
+25°C
–40°C
20
15
10
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 42. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 13 of 36
HMC8193
Data Sheet
Downconverter Performance at IF = 1000 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
–10
–15
–20
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 44. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 47. Conversion Gain vs. RF Frequency at Various LO Drives
50
50
45
40
35
30
25
20
+85°C
45
+25°C
–40°C
40
35
30
25
20
15
10
5
15
20dBm
18dBm
10
5
16dBm
14dBm
0
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 45. Image Rejection vs. RF Frequency at Various Temperatures
Figure 48. Image Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
35
30
25
20
15
10
5
35
18dBm
16dBm
14dBm
30
25
20
15
10
5
0
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 46. Input IP3 vs. RF Frequency at Various Temperatures
Figure 49. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 14 of 36
Data Sheet
HMC8193
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 50. Input IP2 vs. RF Frequency at Various Temperatures
Figure 52. Input IP2 vs. RF Frequency at Various LO Drives
25
+85°C
+25°C
–40°C
20
15
10
5
0
2.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
Figure 51. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 15 of 36
HMC8193
Data Sheet
Downconverter Performance at IF = 3500 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
–10
–15
–20
5
6
7
8
9
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 55. Conversion Gain vs. RF Frequency at Various LO Drives
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures
40
40
20dBm
+85°C
35
35
30
25
20
15
10
5
18dBm
16dBm
14dBm
+25°C
–40°C
30
25
20
15
10
5
0
0
5
6
7
8
9
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 56. Input IP3 vs. RF Frequency at Various LO Drives
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures
Rev. B | Page 16 of 36
Data Sheet
HMC8193
100
100
90
80
70
60
50
40
30
20
10
0
+85°C
+25°C
–40°C
90
80
70
60
50
40
30
20
10
0
20dBm
18dBm
16dBm
14dBm
5
6
7
8
9
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 57. Input IP2 vs. RF Frequency at Various Temperatures
Figure 59. Input IP2 vs. RF Frequency at Various LO Drives
25
+85°C
+25°C
–40°C
20
15
10
5
0
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 58. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 17 of 36
HMC8193
Data Sheet
UPCONVERTER PERFORMANCE
Upconverter Performance at IF = 100 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 60. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 63. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
35
30
25
20
15
10
5
35
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 61. Sideband Rejection vs. RF Frequency at Various Temperatures
Figure 64. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
35
30
25
20
15
10
5
35
18dBm
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 62. Input IP3 vs. RF Frequency at Various Temperatures
Figure 65. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 18 of 36
Data Sheet
HMC8193
Upconverter Performance at IF = 1000 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
–5
–10
–15
–20
–10
–15
–20
20dBm
18dBm
16dBm
14dBm
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 66. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 69. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
35
30
25
20
15
10
5
35
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 67. Sideband Rejection vs. RF Frequency at Various Temperatures
Figure 70. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
35
30
25
20
15
10
5
35
18dBm
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 68. Input IP3 vs. RF Frequency at Various Temperatures
Figure 71. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 19 of 36
HMC8193
Data Sheet
Upconverter Performance at IF = 3500 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
–5
0
+85°C
+25°C
–40°C
–5
–10
–15
–20
–10
–15
–20
20dBm
18dBm
16dBm
14dBm
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 72. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 75. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
35
30
25
20
15
10
5
35
16dBm
14dBm
30
25
20
15
10
5
0
0
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 73. Sideband Rejection vs. RF Frequency at Various Temperatures
Figure 76. Sideband Rejection vs. RF Frequency at Various LO Drives
35
35
+85°C
+25°C
–40°C
20dBm
18dBm
30
30
16dBm
14dBm
25
20
15
10
5
25
20
15
10
5
0
0
2
3
4
5
6
7
2
3
4
5
6
7
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 74. Input IP3 vs. RF Frequency at Various Temperatures
Figure 77. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 20 of 36
Data Sheet
HMC8193
Upconverter Performance at IF = 100 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 78. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 81. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
30
20
10
0
30
20
10
0
14dBm
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 79. Sideband Rejection vs. RF Frequency at Various Temperatures
Figure 82. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
30
20
10
0
30
20
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 80. Input IP3 vs. RF Frequency at Various Temperatures
Figure 83. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 21 of 36
HMC8193
Data Sheet
Upconverter Performance at IF = 1000 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
–10
–15
–20
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 84. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 87. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
35
30
25
20
+85°C
+25°C
–40°C
35
30
25
20
15
10
5
15
20dBm
18dBm
16dBm
14dBm
10
5
0
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 85. Sideband Rejection vs. RF Frequency at Various Temperatures
Figure 88. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
35
30
25
20
15
10
5
35
30
18dBm
16dBm
14dBm
25
20
15
10
5
0
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 86. Input IP3 vs. RF Frequency at Various Temperatures
Figure 89. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 22 of 36
Data Sheet
HMC8193
Upconverter Performance at IF = 3500 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
–10
–15
–20
5
6
7
8
9
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 90. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 92. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
35
30
25
20
15
10
5
35
18dBm
16dBm
14dBm
30
25
20
15
10
5
0
0
5
6
7
8
9
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 91. Input IP3 vs. RF Frequency at Various Temperatures
Figure 93. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 23 of 36
HMC8193
Data Sheet
ISOLATION AND RETURN LOSS
Data taken at LO drive = 18 dBm, TA = 25°C, unless otherwise noted.
70
70
60
50
40
30
20
10
0
60
50
40
IF1, –40°C
IF1, +25°C
IF1, +85°C
IF2, –40°C
IF2, +25°C
30
IF1, 14dBm
IF1, 16dBm
IF1, 18dBm
IF1, 20dBm
IF2, 14dBm
IF2, 16dBm
IF2, 18dBm
IF2, 20dBm
20
IF2, +85°C
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 97. LO to IF Isolation vs. LO Frequency at Various LO Drives
Figure 94. LO to IF Isolation vs. LO Frequency at Various Temperatures
70
60
50
40
30
70
60
50
40
30
20
20
20dBm
+85°C
18dBm
16dBm
+25°C
–40°C
10
0
14dBm
10
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 98. LO to RF Isolation vs. LO Frequency at Various LO Drives
Figure 95. LO to RF Isolation vs. LO Frequency at Various Temperatures
40
35
30
25
40
IF1, –40°C
IF1, +25°C
IF1, +85°C
IF2, –40°C
IF2, +25°C
IF2, +85°C
35
30
25
20
15
10
5
20
IF1, 14dBm
15
10
5
IF1, 16dBm
IF1, 18dBm
IF1, 20dBm
IF2, 14dBm
IF2, 16dBm
IF2, 18dBm
IF2, 20dBm
0
0
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 99. RF to IF Isolation vs. RF Frequency at Various LO Drives
Figure 96. RF to IF Isolation vs. RF Frequency at Various Temperatures
Rev. B | Page 24 of 36
Data Sheet
HMC8193
0
0
–5
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
–5
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 100. LO Return Loss vs. LO Frequency at Various Temperatures
Figure 103. LO Return Loss vs. LO Frequency at Various LO Drives
0
0
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
–5
–10
–15
–20
–25
–5
–10
–15
–20
–25
2
3
4
5
6
7
8
9
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 104. RF Return Loss vs. RF Frequency at Various LO Drives
LO Frequency = 5.5 GHz
Figure 101. RF Return Loss vs. RF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
0
0
IF1, 20dBm
IF1, 18dBm
IF1, 16dBm
IF2, 20dBm
IF1, +85°C
IF1, +25°C
IF1, –40°C
IF2, +85°C
IF2, +25°C
–5
–5
IF2, 18dBm
IF2, 16dBm
IF2, –40°C
–10
–10
–15
–20
–25
–15
–20
–25
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 105. IF Return Loss vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Figure 102. IF Return Loss vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Rev. B | Page 25 of 36
HMC8193
Data Sheet
IF BANDWIDTH
Data taken as a downconverter, lower sideband, at LO drive = 18 dBm, TA = 25°C, unless otherwise noted.
0
0
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
–5
–5
–10
–15
–20
–10
–15
–20
0
1
2
3
4
0
1
2
3
4
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 106. Conversion Gain vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Figure 108. Conversion Gain vs. IF Frequency at Various LO Drives
LO Frequency = 5.5 GHz
35
35
30
25
20
+85°C
+25°C
–40°C
30
25
20
15
10
5
15
20dBm
10
18dBm
16dBm
14dBm
5
0
0
0
1
2
3
4
0
1
2
3
4
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 107. Input IP3 vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Figure 109. Input IP3 vs. IF Frequency at Various LO Drives
LO Frequency = 5.5 GHz
Rev. B | Page 26 of 36
Data Sheet
HMC8193
AMPLITUDE AND PHASE IMBALANCE
Downconverter Performance, Lower Sideband
4
4
3
+85°C
+25°C
20dBm
3
2
–40°C
18dBm
16dBm
14dBm
2
1
1
0
0
–1
–2
–3
–4
–1
–2
–3
–4
2.5
3.5
4.5
5.5
6.5
7.5
8.5
2.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 110. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
Figure 112. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
10
10
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
5
0
5
0
–5
–5
–10
2.5
–10
2.5
3.5
4.5
5.5
6.5
7.5
8.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 111. Phase Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
Figure 113. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
Rev. B | Page 27 of 36
HMC8193
Data Sheet
Downconverter Performance, Upper Sideband
4
4
3
+85°C
+25°C
20dBm
18dBm
16dBm
14dBm
3
2
–40°C
2
1
1
0
0
–1
–2
–3
–4
–1
–2
–3
–4
2.5
3.5
4.5
5.5
6.5
7.5
8.5
2.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 114. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
Figure 116. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
10
10
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
5
0
5
0
–5
–5
–10
2.5
–10
2.5
3.5
4.5
5.5
6.5
7.5
8.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 115. Phase Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
Figure 117. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
Rev. B | Page 28 of 36
Data Sheet
HMC8193
IF = 1000 MHz, RF = 5500 MHz, LO = 6500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
SPURIOUS AND HARMONICS PERFORMANCE
All M × N spur data captured with the 90° hybrid attached.
Downconverter M × N Spurious Outputs
N × LO
0
1
2
3
4
Mixer spurious products are measured in dBc from the IF output
power level, unless otherwise specified. Spur values are (M × RF) −
(N × LO).
0
1
2
3
4
Not applicable
2
0
61
70
68
19
31
65
76
69
13
38
64
67
77
35
40
70
71
73
12
71
68
64
M × RF
IF = 100 MHz, RF = 2500 MHz, LO = 2600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
IF = 1000 MHz, RF = 8500 MHz, LO = 9500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
0
1
2
3
4
Not applicable
0
0
69
82
83
34
29
73
89
79
33
41
70
69
89
47
46
85
87
92
22
84
84
82
N × LO
M × RF
0
1
2
3
4
0
1
2
3
4
Not applicable
−3
+0
+19 +12 +32
+35 +63 +51
+6
M × RF
+66
+59
+59
+69 +62 +67 +63
+66 +70 +67 +66
+60 +66 +70 +68
IF = 100 MHz, RF = 5500 MHz, LO = 5600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
IF = 3500 MHz, RF = 2500 MHz, LO = 6000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
0
1
2
3
4
Not applicable
9
0
68
82
80
35
53
69
84
79
29
47
70
67
83
48
52
81
80
91
23
81
80
77
N × LO
M × RF
0
1
2
3
4
0
1
2
3
4
Not applicable
4
0
61
78
94
36
49
80
87
97
13
60
87
91
92
52
44
81
88
88
20
74
87
92
M × RF
IF = 100 MHz, RF = 8500 MHz, LO = 8600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
IF = 3500 MHz, RF = 5500 MHz, LO = 9000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
0
1
2
3
4
Not applicable
1
0
76
77
72
30
53
72
79
76
35
69
78
89
80
48
57
76
77
87
15
76
70
67
N × LO
M × RF
0
1
2
3
4
0
1
2
3
4
Not applicable
7
0
91
90
88
23
37
88
89
93
28
55
81
93
93
41
56
83
87
85
14
85
88
87
M × RF
IF = 1000 MHz, RF = 2500 MHz, LO = 3500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
IF = 3500 MHz, RF = 8500 MHz, LO = 12,000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
0
1
2
3
4
Not applicable
−6
+0
+55
+68
+74
+22
+32
+77
+65
+59
+19
+36
+69
+59
+65
+33
+43
+72
+76
+68
+11
+74
+73
+71
N × LO
M × RF
0
1
2
3
4
0
1
2
3
4
Not applicable
−20
+0
+69
+61
+63
+5
+7
+20
−10
+60
+61
+54
+38 +61 +54
+64 +64 +61
+70 +64 +63
+53 +34 +62
M × RF
Rev. B | Page 29 of 36
HMC8193
Data Sheet
Upconverter M × N Spurious Outputs
IF = 1000 MHz, RF = 5500 MHz, LO = 6500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
Mixer spurious products are measured in dBc from the RF output
power level, unless otherwise specified. Spur values are (M × IF) −
(N × LO).
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
13
0
40
68
89
25
44
69
80
82
33
31
64
78
79
41
39
75
75
76
IF = 100 MHz, RF = 2500 MHz, LO = 2600 MHz, RF power =
−10 dBm, and LO power = +18 dBm..
11
63
84
84
M × IF
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
10
0
53
59
90
9
24
10
61
57
89
20
29
61
76
92
27
75
79
93
15
47
72
92
M × IF
IF = 1000 MHz, RF = 8500 MHz, LO = 9500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
−3
0
+24 +21 +34
+45 +36 +36
IF = 100 MHz, RF = 5500 MHz, LO = 5600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
+8
M × IF
+58
+70
+80
+37 +59 +63 +66
+70 +75 +69 +65
+80 +75 +70 +68
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
19
0
54
69
94
20
50
70
85
89
23
26
81
84
87
40
44
78
85
86
25
75
89
94
M × IF
IF = 3500 MHz, RF = 2500 MHz, LO = 6000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
20
0
71
79
91
25
33
62
80
95
22
43
75
79
97
29
41
70
88
92
IF = 100 MHz, RF = 8500 MHz, LO = 8600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
8
M × IF
67
87
85
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
−2
+0
+16 +18 +19
+31 +35 +46
20
67
77
92
M × IF
+50 +55 +67 +75
+70 +81 +79 +78
+86 +81 +80 +74
IF = 3500 MHz, RF = 5500 MHz, LO = 9000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
−5
0
+17 +42 +19
+40 +37 +49
IF = 1000 MHz, RF = 2500 MHz, LO = 3500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
+6
M × IF
+62
+91
+86
+67 +67 +88 +73
+82 +80 +79 +84
+94 +94 +89 +88
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
12
0
48
91
91
11
25
63
79
84
23
35
70
65
67
34
46
80
82
83
13
57
83
77
M × IF
IF = 3500 MHz, RF = 8500 MHz, LO = 12,000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
Not applicable
−1
0
+12 +5
+29 +58 +59
+7
−4
M × IF
+37
+53
+70
+44 +62 +71 +60
+69 +72 +70 +58
+79 +74 +72 +65
Rev. B | Page 30 of 36
Data Sheet
HMC8193
LO Harmonics
LO drive = 18 dBm and all values in are in dBc below the input
LO level measured at the RF port.
Table 5. Harmonics of LO
N × LO Spur at RF Port
LO Frequency (GHz)
1
2
3
4
2.5
3.5
4.5
5.5
6.5
7.5
8.5
50
47
50
52
50
49
40
45
46
63
68
66
63
59
61
56
65
61
66
69
59
66
71
60
69
73
62
81
Rev. B | Page 31 of 36
HMC8193
Data Sheet
THEORY OF OPERATION
The HMC8193 is a passive, wideband, I/Q, MMIC mixer that
can be used as an image rejection mixer or as a single-sideband
upconverter for transmitter operations. With an RF and LO
range of 2.5 GHz to 8.5 GHz, as well as an IF bandwidth of dc to
4 GHz, the HMC8193 is ideal for applications requiring wide
frequency range, excellent RF performance, and a simple design
that includes a few components and a small PCB footprint. A single
HMC8193 can replace multiple narrow-band mixers in a design.
The HMC8193 does not require any dc power sources because
it is a passive mixer. The device offers a lower noise figure than
an active mixer, ensuring superior dynamic range for high
performance and precision applications.
The HMC8193 is fabricated on a GaAs MESFET process and
uses Analog Devices mixer cells and a 90° hybrid. The HMC8193 is
available in a compact, 4 mm × 4 mm, 24-terminal LCC package
and operates over a −40°C to +85°C temperature range. An
evaluation board for the HMC8193 is also available from
Analog Devices.
The inherent I/Q architecture of the HMC8193 offers excellent
image rejection and sideband rejection, thereby eliminating the
need for expensive filtering of unwanted sidebands. The double
balanced architecture of the mixer also provides excellent LO to
RF and LO to IF isolation and reduces the effect of LO leakage
to ensure signal integrity.
For both upconversion and downconversion, an external 90°
hybrid is required. See the Applications Information section for
information regarding interfacing with an external 90° hybrid
Rev. B | Page 32 of 36
Data Sheet
HMC8193
APPLICATIONS INFORMATION
Figure 118 shows the typical application circuit for the
HMC8193. To select the appropriate sideband, an external 90°
hybrid is required. For applications not requiring operation to
dc, use an off-chip dc blocking capacitor. For applications that
require the LO signal at the output to be suppressed, use a bias
tee/RF choke as shown in Figure 118. Ensure that the source/
sink current used for LO suppression is less than 6 mA for each
IF port; otherwise, device damage may occur. The common-
mode voltage for each IF port is 0 V.
HMC8193 EVALUATION BOARD
1
2
3
4
5
6
18
17
16
15
14
13
RF
LO
To select the upper sideband when using as an upconverter,
connect the IF1 pin to the 90° port of the hybrid, and connect
the IF2 pin to the 0° port of the hybrid. To select the lower
sideband, connect IF1 to the 0° port of the hybrid and IF2 to the
90° port of the hybrid. The input is from the sum port of the
hybrid and the difference port is 50 Ω terminated.
BIAS TEE/
DC FEED FOR IF1
BIAS TEE/
DC FEED FOR IF2
DC BLOCKING
CAPACITORS
SUPPLY
FOR IF1
SUPPLY
FOR IF2
To select the upper sideband (low-side LO) when using as a
downconverter, connect the IF1 pin to the 0° port of the hybrid,
and connect the IF2 pin to the 90° port of the hybrid. To select
the lower sideband (high-side LO), connect the IF1 pin to the
90° port of the hybrid and IF2 to the 0° port of the hybrid. The
output is from the sum port of the hybrid, and the difference
port is 50 Ω terminated.
EXTERNAL
90° HYBRID
50Ω
IF
NOTES
1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING.
Figure 118. Typical Application Circuit
Rev. B | Page 33 of 36
HMC8193
Data Sheet
thermal impedance and ensure electrical performance, solder
the pad to the low impedance ground plane on the PCB. To
further reduce thermal impedance, it is recommended that the
ground planes on all layers under the pad be stitched together
with vias.
SOLDERING INFORMATION AND RECOMMENDED
LAND PATTERN
Figure 119 and Figure 120 show the recommended land pattern
and solder stencil for the HMC8193, respectively. The HMC8193
is contained in a 4 mm × 4 mm, 24-terminal, ceramic, LCC
package, which has an exposed ground pad (EP). This pad is
internally connected to the ground of the chip. To minimize
The land pattern on the HMC8193 evaluation board provides a
simulated thermal resistance (θJA) of 120°C/W
.178" SQUARE
.004" MASK/METAL OVERLAP
.010" MIN MASK WIDTH
SOLDERMASK
GROUND PAD
PAD SIZE
.026" × .010"
PIN 1
.0197"
[0.50]
.116"
MASK
OPENING
.034"
TYPICAL
VIA
SPACING
ᶲ .010"
TYPICAL VIA
.010" REF
.030"
MASK OPENING
.098" SQUARE MASK OPENING
.020 × 45" CHAMFER FOR PIN 1
.106" SQUARE
GROUND PAD
Figure 119. Evaluation Board Land Pattern for the HMC8193 Package
0.094
0.019
0.017
TYP
0.020
TYP
0.176
0.094
SQUARE
0.024
TYP
R0.004
TYP
0.008
TYP
Figure 120. Solder Stencil for the HMC8193 Package on the HMC8193 Evaluation Board
Rev. B | Page 34 of 36
Data Sheet
HMC8193
shown in Figure 119. Use a sufficient number of via holes to
EVALUATION BOARD INFORMATION
connect the top and bottom ground planes. The evaluation
circuit board shown in Figure 121 is available from Analog
Devices upon request.
The EV1HMC8193LC4 evaluation PCB used in the application
must use RF circuit design techniques. Signal lines must have
50 Ω impedance and connect the package ground leads and
exposed pad directly to the ground plane, similar to what is
Figure 121. EV1HMC8193LC4 Evaluation PCB, Top Layer
Table 6. Bill of Materials for the EV1HMC8193LC41 Evaluation PCB
Quantity Reference Designator
Description
Manufacturer
Part Number
109996-1
21-146-1000-01
1
2
2
1
Not applicable
J1, J2
J3, J4
PCB, EV1HMC8193LC42
PCB mount SMA RF connector
PCB mount SMA connector
Device under test (HMC8193)
Analog Devices
SRI Connector Gage Co.
Johnson SMA Connector 142-0701-851
Analog Devices HMC8193
U1
1 Reference this number when ordering the evaluation PCB.
2 The circuit board material is Rogers 4350.
Rev. B | Page 35 of 36
HMC8193
Data Sheet
OUTLINE DIMENSIONS
4.05
3.90 SQ
3.75
0.36
0.30
0.24
PIN 1
0.08
BSC
INDICATOR
PIN 1
24
19
18
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
7
BOTTOM VIEW
2.50 REF
0.32
BSC
TOP VIEW
SIDE VIEW
1.00
0.90
0.80
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 122. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Package Body
Package
Model1
Temperature Range Material
−40°C to +85°C
−40°C to +85°C
Lead Finish
Package Description
MSL Rating2 Option
HMC8193LC4
HMC8193LC4TR
Alumina Ceramic Gold over Nickel 24-Terminal LCC
Alumina Ceramic Gold over Nickel 24-Terminal LCC
Alumina Ceramic Gold over Nickel 24-Terminal LCC
MSL3
MSL3
MSL3
E-24-1
E-24-1
E-24-1
HMC8193LC4TR-R5 −40°C to +85°C
EV1HMC8193LC4
Evaluation PCB Assembly
1 The HMC8193LC4, the HMC8193LC4TR, and the HMC8193LC4TR-R5 are RoHS compliant parts.
2 See the Absolute Maximum Ratings section.
©2017–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14353-0-5/18(B)
Rev. B | Page 36 of 36
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