HMC951A [ADI]
5.6 GHz to 8.6 GHz, GaAs, MMIC, I/Q Downconverter;
| 型号： | HMC951A |
| 厂家： | 
ADI |
| 描述： | 5.6 GHz to 8.6 GHz, GaAs, MMIC, I/Q Downconverter |
| 文件： | 总31页 (文件大小：645K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
5.6 GHz to 8.6 GHz,
GaAs, MMIC, I/Q Downconverter
HMC951A
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
HMC951A
Conversion gain: 13 dB typical
Image rejection: 32 dBc typical
Input P1dB compression: −6 dBm typical
Input IP3: 3 dBm typical, 6.0 GHz to 8.6 GHz
Noise figure: 2 dB typical
LO to RF isolation: 48 dBm typical
LO to IF isolation: 13 dBm typical
RF to IF isolation: 10 dBm typical
Amplitude balance: 0.2 dB typical
Phase balance: −2° typical
NIC 1
VDRF 2
NIC 3
18 NIC
17
16
15
NIC
VDLO
NIC
4
GND
RFIN 5
14 NIC
13 NIC
6
GND
RF return loss: 10 dB typical
EXPOSED
PAD
LO return loss: 15 dB typical
IF return loss: 15 dB typical
Exposed paddle, 4 mm × 4 mm, 24-lead, LFCSP
Figure 1.
APPLICATIONS
Point to point and point to multipoint radios
Military radars, electronic warfare, and electronic
intelligence
Satellite communications
Sensors
GENERAL DESCRIPTION
The HMC951A is a compact gallium arsenide (GaAs),
select the required sideband. The I/Q mixer topology reduces
the need for filtering of unwanted sideband. The HMC951A
is a smaller alternative to hybrid style, single sideband (SSB)
downconverter assemblies, and it eliminates the need for wire
bonding by allowing the use of surface-mount manufacturing
techniques.
monolithic microwave integrated circuit (MMIC), in-phase
quadrature (I/Q) downconverter in a RoHS compliant package
that operates from 5.6 GHz to 8.6 GHz. This device provides a
small signal conversion gain of 13 dB with a noise figure of 2 dB
and an image rejection of 32 dBc. The HMC951A uses a low noise
amplifier (LNA) followed by an image mixer that is driven by a
local oscillator (LO) buffer amplifier. The image reject mixer
eliminates the need for a filter following the LNA and removes
thermal noise at the image frequency. The IF1 and IF2 mixer
outputs are provided and an external 90° hybrid is needed to
The HMC951A is available in 4 mm × 4 mm, 24-lead lead
frame chip scale package (LFCSP) and operates over the
−40°C to +85°C temperature range. An evaluation board for
the HMC951A is also available upon request.
Rev. A
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rightsof third parties that may result fromits use. Specifications subject to change without notice. No
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2018 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC951A
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Isolation and Return Loss ......................................................... 19
IF Bandwidth Performance......................................................... 21
Amplitude and Phase Imbalance Performance...................... 23
Spurious Performance ............................................................... 25
Theory of Operation ...................................................................... 27
LO Driver Amplifier .................................................................. 27
Mixer............................................................................................ 27
LNA .............................................................................................. 27
Applications Information .............................................................. 28
Typical Application Circuit....................................................... 28
Performance at Lower IF Frequencies..................................... 29
Evaluation Board Information.................................................. 29
Outline Dimensions....................................................................... 31
Ordering Guide .......................................................................... 31
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
5.6 GHz to 6.0 GHz ...................................................................... 3
6.0 GHz to 8.6 GHz ...................................................................... 4
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Interface Schematics..................................................................... 6
Typical Performance Characteristics ............................................. 7
Lower Sideband (High-Side LO)................................................ 7
Upper Sideband (Low-Side LO)............................................... 13
REVISION HISTORY
4/2018—Rev. 0 to Rev. A
Changes to Performance at Lower IF Frequencies Section....... 29
Removed Figure 99; Renumbered Sequentially.......................... 29
3/2018—Revision 0: Initial Version
Rev. A | Page 2 of 31
Data Sheet
HMC951A
SPECIFICATIONS
5.6 GHz TO 6.0 GHz
TA = 25°C, intermediate frequency (IF) = 1000 MHz, VDRF = VDLO = 5 V, local oscillator (LO) power = 0 dBm, unless otherwise noted.
Measurements performed with lower sideband selected and an external 90° hybrid at the IF ports, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
OPERATING CONDITIONS
Frequency Range
Radio Frequency (RF)
LO
IF
5.6
4.5
DC
−4
6.0
12.1
3.5
+4
GHz
GHz
GHz
dBm
LO Drive Range
0
PERFORMANCE
Conversion Gain
Image Rejection
Input Power for 1 dB Compression (P1dB)
Input Third-Order Intercept (IP3)
Amplitude Balance
Phase Balance
Isolation
10
20
13
32
−6
2
0.2
−2
dB
dBc
dBm
dBm
dB
0
Degree
LO to RF
LO to IF
RF to IF
Noise Figure
Return Loss
RF
LO
IF
40
9
48
13
10
2
dB
dB
dB
dB
2.5
10
15
15
dB
dB
dB
POWER SUPPLY
Drain Current
Low Noise Amplifier (IDD1
LO Amplifier (IDD2
Total Drain Current (IDD
)
75
80
155
85
95
mA
mA
mA
)
)
Rev. A | Page 3 of 31
HMC951A
Data Sheet
6.0 GHz TO 8.6 GHz
TA = 25°C, intermediate frequency (IF) = 1000 MHz, VDRF = VDLO = 5 V, local oscillator (LO) power = 0 dBm, unless otherwise noted.
Measurements performed with lower sideband selected and an external 90° hybrid at the IF ports, unless otherwise noted.
Table 2.
Parameter
Min
Typ
Max
Unit
OPERATING CONDITIONS
Frequency Range
Radio Frequency (RF)
LO
IF
6.0
4.5
DC
−4
8.6
12.1
3.5
+4
GHz
GHz
GHz
dBm
LO Drive Range
0
PERFORMANCE
Conversion Gain
Image Rejection
Input Power for 1 dB Compression (P1dB)
Input Third-Order Intercept (IP3)
Amplitude Balance
Phase Balance
Isolation
10
20
13
32
−6
3
0.2
−2
dB
dBc
dBm
dBm
dB
1
Degree
LO to RF
LO to IF
RF to IF
Noise Figure
Return Loss
RF
LO
IF
40
9
48
13
10
2
dB
dB
dB
dB
2.5
10
15
15
dB
dB
dB
POWER SUPPLY
Drain Current
Low Noise Amplifier (IDD1
LO Amplifier (IDD2
Total Drain Current (IDD
)
75
80
155
85
95
mA
mA
mA
)
)
Rev. A | Page 4 of 31
Data Sheet
HMC951A
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
Drain Bias Voltage (VDRF, VDLO)
Input Power
5.5 V
LO
RF
20 dBm
15 dBm
MSL3
175°C
−65°C to +150°C
−40°C to +85°C
260°C
θ
JA is the junction to ambient (or die to ambient) thermal
resistance measured in a one cubic foot sealed enclosure, and
JC is the junction to case (or die to package) thermal resistance.
Moisture Sensitivity Level (MSL) Rating1
Maximum Junction Temperature
Storage Temperature Range
Operating Temperature Range
Reflow Temperature
Electrostatic Discharge Sensitivity
Human Body Model (HBM)
θ
Table 4. Thermal Resistance
Package Type
HCP-24-31
θJA
θJC
Unit
40.9
46.4
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 4 × 4 thermal vias. Refer to JEDEC standard JESD51-2 for additional
information.
1000 V
750 V
Field Induced Charged Device Model
(FICDM)
1 See the Ordering Guide.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 5 of 31
HMC951A
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC 1
VDRF 2
NIC 3
18 NIC
17
16
15
NIC
HMC951A
VDLO
NIC
TOP VIEW
4
GND
(Not to Scale)
RFIN 5
14 NIC
13 NIC
6
GND
EXPOSED
PAD
NOTES
1. NIC = NOT INTERNALLY CONNECTED. HOWEVER, THESE
PINS CAN BE CONNECTED TO RF/DC GROUND WITHOUT
AFFECTING PERFORMANCE.
2. EXPOSED PAD. CONNECT TO A LOW IMPEDANCE THERMAL
AND ELECTRICAL GROUND PLANE.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 7, 8, 12 to 15, 17, 18
NIC
Not Internally Connected. However, these pins can be connected to RF/dc ground without
affecting performance.
2
VDRF
GND
RFIN
LOIN
VDLO
Power Supply Voltage for the RF Amplifier. See Figure 3 for the interface schematic. Refer to the
typical application circuit (see Figure 96) for the required external components.
Ground Connect. See Figure 4 for the interface schematic. These pins and package bottom must
be connected to RF/dc ground.
Radio Frequency Input. See Figure 5 for the interface schematic. This pin is ac-coupled and
matched to 50 Ω.
Local Oscillator Input. See Figure 6 for the interface schematic. This pin is ac-coupled and
matched to 50 Ω.
4, 6, 9, 11, 19, 21, 22, 24
5
10
16
Power Supply Voltage for the LO Amplifier. See Figure 3 for the interface schematic. Refer to the
typical application circuit (see Figure 96) for the required external components.
20, 23
IF2, IF1
Quadrature Intermediate Frequency Outputs. See Figure 7 for the interface schematic. For
applications not requiring operation to dc, use an off chip dc blocking capacitor. For operation to
dc, these pins must not source or sink more than 3 mA of current or device malfunction and
failure can result.
EPAD
Exposed Pad. Connect to a low impedance thermal and electrical ground plane.
INTERFACE SCHEMATICS
VDRF, VDLO
ESD
LOIN
Figure 3. VDRF, VDLO Interface
Figure 6. LOIN Interface
GND
IF1, IF2
Figure 4. GND Interface
Figure 7. IF2, IF1 Interface
RFIN
Figure 5. RFIN Interface
Rev. A | Page 6 of 31
Data Sheet
HMC951A
TYPICAL PERFORMANCE CHARACTERISTICS
LOWER SIDEBAND (HIGH-SIDE LO)
IF = 1000 MHz and RF input power = −20 dBm. Data de-embedded for RF trace loss, unless otherwise noted.
20
18
16
14
12
10
8
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
6
4
4
2
2
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Conversion Gain vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 11. Conversion Gain vs. RF Frequency over LO Powers, TA = 25°C
50
45
40
35
30
25
50
45
40
35
30
25
20
20
+85°C
+4dBm
15
+25°C
–40°C
15
10
5
+2dBm
0dBm
–2dBm
10
–4dBm
5
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 9. Image Rejection vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 12. Image Rejection vs. RF Frequency over LO Powers,
T
A = 25°C
6
6
5
4
3
2
1
0
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
5
4
3
2
1
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 10. Noise Figure vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 13. Noise Figure vs. RF Frequency over LO Powers,
A = 25°C
T
Rev. A | Page 7 of 31
HMC951A
Data Sheet
10
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
8
6
6
4
4
2
2
0
0
–2
5.6
–2
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 14. Input IP3 vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 16. Input IP3 vs. RF Frequency over LO Powers,
T
A = 25°C
0
0
–2
–2
–4
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
+85°C
+25°C
–40°C
–4
–6
–6
–8
–8
–10
–12
–14
–16
–10
–12
–14
–16
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 15. Input P1dB vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 17. Input P1dB vs. RF Frequency over LO Powers,
A = 25°C
T
Rev. A | Page 8 of 31
Data Sheet
HMC951A
IF = 150 MHz and RF input power = −20 dBm. Data de-embedded for RF trace loss, unless otherwise noted.
20
18
16
14
12
10
8
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
6
4
4
2
2
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 18. Conversion Gain vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 21. Conversion Gain vs. RF Frequency over LO Powers, TA = 25°C
50
45
40
35
30
25
50
45
40
35
30
25
20
20
+85°C
+4dBm
15
+25°C
–40°C
15
10
5
+2dBm
0dBm
–2dBm
10
–4dBm
5
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 19. Image Rejection vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 22. Image Rejection vs. RF Frequency over LO Powers, TA = 25°C
6
6
+85°C
+25°C
–40°C
+4dBm
5
5
+2dBm
0dBm
–2dBm
–4dBm
4
4
3
2
1
0
3
2
1
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 20. Noise Figure vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 23. Noise Figure vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 9 of 31
HMC951A
Data Sheet
10
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
8
6
6
4
4
2
2
0
0
–2
5.6
–2
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 24. Input IP3 vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 26. Input IP3 vs. RF Frequency over LO Powers, TA = 25°C
0
0
–2
–4
–2
–4
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
+85°C
+25°C
–40°C
–6
–6
–8
–8
–10
–12
–14
–16
–10
–12
–14
–16
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 25. Input P1dB vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 27. Input P1dB vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 10 of 31
Data Sheet
HMC951A
IF = 3100 MHz and RF input power = −20 dBm. Data de-embedded for RF trace loss, unless otherwise noted.
20
18
16
14
12
10
8
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
6
4
4
2
2
0
4.6
0
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 28. Conversion Gain vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 31. Conversion Gain vs. RF Frequency over LO Powers, TA = 25°C
50
45
40
35
30
25
50
45
40
35
30
25
20
20
+85°C
+4dBm
15
+25°C
–40°C
15
10
5
+2dBm
0dBm
–2dBm
10
–4dBm
5
0
4.6
0
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 29. Image Rejection vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 32. Image Rejection vs. RF Frequency over LO Powers, TA = 25°C
6
6
+85°C
+25°C
–40°C
+4dBm
5
5
+2dBm
0dBm
–2dBm
–4dBm
4
4
3
2
1
0
3
2
1
0
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 30. Noise Figure vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 33. Noise Figure vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 11 of 31
HMC951A
Data Sheet
10
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
8
6
6
4
4
2
2
0
0
–2
4.6
–2
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 34. Input IP3 vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 36. Input IP3 vs. RF Frequency over LO Powers, TA = 25°C
0
0
–2
–4
–2
–4
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
+85°C
+25°C
–40°C
–6
–6
–8
–8
–10
–12
–14
–16
–10
–12
–14
–16
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
4.6
5.1
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 35. Input P1dB vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 37. Input P1dB vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 12 of 31
Data Sheet
HMC951A
UPPER SIDEBAND (LOW-SIDE LO)
IF = 150 MHz and RF input power = −20 dBm. Data de-embedded for RF trace loss, unless otherwise noted.
20
18
16
14
12
10
8
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
6
4
4
2
2
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 38. Conversion Gain vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 41. Conversion Gain vs. RF Frequency over LO Powers, TA = 25°C
50
45
40
35
30
25
50
45
40
35
30
25
20
20
+85°C
+4dBm
15
+25°C
–40°C
15
10
5
+2dBm
0dBm
–2dBm
10
–4dBm
5
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 39. Image Rejection vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 42. Image Rejection vs. RF Frequency over LO Powers, TA = 25°C
6
6
+85°C
+25°C
–40°C
+4dBm
5
5
+2dBm
0dBm
–2dBm
–4dBm
4
4
3
2
1
0
3
2
1
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 40. Noise Figure vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 43. Noise Figure vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 13 of 31
HMC951A
Data Sheet
10
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
8
6
6
4
4
2
2
0
0
–2
5.6
–2
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 44. Input IP3 vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 46. Input IP3 vs. RF Frequency over LO Powers, TA = 25°C
0
0
–1
–2
–1
+4dBm
+2dBm
0dBm
–2dBm
+85°C
+25°C
–40°C
–2
–3
–3
–4dBm
–4
–4
–5
–5
–6
–6
–7
–7
–8
–8
–9
–9
–10
5.6
–10
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 45. Input P1dB vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 47. Input P1dB vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 14 of 31
Data Sheet
HMC951A
IF = 1000 MHz and RF input power = −20 dBm. Data de-embedded for RF trace loss, unless otherwise noted.
20
18
16
14
12
10
8
20
18
16
14
12
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
6
4
4
2
2
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 48. Conversion Gain vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 51. Conversion Gain vs. RF Frequency over LO Powers, TA = 25°C
50
45
40
35
30
25
50
45
40
35
30
25
20
20
+85°C
+4dBm
15
+25°C
–40°C
15
10
5
+2dBm
0dBm
–2dBm
10
–4dBm
5
0
5.6
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 49. Image Rejection vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 52. Image Rejection vs. RF Frequency over LO Powers, TA = 25°C
6
6
+85°C
+25°C
–40°C
+4dBm
5
5
+2dBm
0dBm
–2dBm
–4dBm
4
4
3
2
1
0
3
2
1
0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 50. Noise Figure vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 53. Noise Figure vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 15 of 31
HMC951A
Data Sheet
10
10
8
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
8
6
6
4
4
2
2
0
0
–2
5.6
–2
5.6
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 54. Input IP3 vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 56. Input IP3 vs. RF Frequency over LO Powers, TA = 25°C
0
0
–2
–4
–2
–4
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
+85°C
+25°C
–40°C
–6
–6
–8
–8
–10
–12
–14
–16
–10
–12
–14
–16
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 55. Input P1dB vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 57. Input P1dB vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 16 of 31
Data Sheet
HMC951A
IF = 3100 MHz and RF input power = −20 dBm. Data de-embedded for RF trace loss, unless otherwise noted.
20
18
16
14
12
10
8
20
18
16
14
12
10
8
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
+85°C
+25°C
–40°C
6
6
4
4
2
2
0
6.6
0
6.6
7.1
7.6
8.1
8.6
9.1
9.6
7.1
7.6
8.1
8.6
9.1
9.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 58. Conversion Gain vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 61. Conversion Gain vs. RF Frequency over LO Powers, TA = 25°C
100
100
90
90
80
80
70
70
+4dBm
60
60
+2dBm
0dBm
+85°C
+25°C
–40°C
–2dBm
50
50
–4dBm
40
40
30
6.6
30
6.6
7.1
7.6
8.1
8.6
9.1
9.6
7.1
7.6
8.1
8.6
9.1
9.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 59. Image Rejection vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 62. Image Rejection vs. RF Frequency over LO Powers, TA = 25°C
6
6
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
5
5
–2dBm
–4dBm
4
4
3
2
1
0
3
2
1
0
7.6
7.8
8.0
8.2
8.4
8.6
8.8
9.0
9.2
9.4
9.6
7.6
7.8
8.0
8.2
8.4
8.6
8.8
9.0
9.2
9.4
9.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 60. Noise Figure vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 63. Noise Figure vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 17 of 31
HMC951A
Data Sheet
10
10
8
8
+85°C
+25°C
–40°C
6
4
6
4
2
2
0
0
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
–2
–4
–6
–2
–4
–6
6.6
7.1
7.6
8.1
8.6
9.1
9.6
6.6
7.1
7.6
8.1
8.6
9.1
9.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 64. Input IP3 vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 66. Input IP3 vs. RF Frequency over LO Powers, TA = 25°C
0
0
–2
–4
–6
–8
–2
–4
+85°C
+25°C
–40°C
–6
–8
–10
–12
–14
–16
–10
–12
–14
–16
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6.6
7.1
7.6
8.1
8.6
9.1
9.6
6.6
7.1
7.6
8.1
8.6
9.1
9.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 65. Input P1dB vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 67. Input P1dB vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 18 of 31
Data Sheet
HMC951A
ISOLATION AND RETURN LOSS
40
70
60
50
40
30
20
10
0
IF1 +85°C
IF1 +25°C
IF1 –40°C
IF2 +85°C
IF2 +25°C
IF2 –40°C
35
30
25
20
15
10
5
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
0
3
4
5
6
7
8
9
10
11
12
5.6
6.1
6.6
7.1
7.6
8.1
8.6
LO FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 68. LO to IF Isolation vs. LO Frequency over Temperatures,
LO Power = 0 dBm
Figure 71. LO to RF Isolation vs. RF Frequency over LO Powers, TA = 25°C
40
30
IF1 +85°C
IF1 +4dBm
IF1 +2dBm
IF1 0dBm
IF1 –2dBm
IF1 –4dBm
IF2 +4dBm
IF2 +2dBm
IF2 0dBm
IF2 –2dBm
IF2 –4dBm
35
30
25
20
15
10
5
IF1 +25°C
IF1 –40°C
IF2 +85°C
IF2 +25°C
IF2 –40°C
25
20
15
10
5
0
0
–5
5.6
3
4
5
6
7
8
9
10
11
12
6.1
6.6
7.1
7.6
8.1
8.6
LO FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 69. LO to IF Isolation vs. LO Frequency over LO Powers, TA = 25°C
Figure 72. RF to IF Isolation vs. RF Frequency over Temperatures,
LO Power = 0 dBm
70
60
50
40
30
25
20
15
10
30
+85°C
+25°C
–40°C
IF1 +4dBm
IF1 +2dBm
IF1 0dBm
IF1 –2dBm
IF1 –4dBm
IF2 +4dBm
IF2 +2dBm
IF2 0dBm
IF2 –2dBm
IF2 –4dBm
20
10
0
5
0
–5
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 70. LO to RF Isolation vs. RF Frequency over Temperatures,
LO Power = 0 dBm
Figure 73. RF to IF Isolation vs. RF Frequency over LO Powers, TA = 25°C
Rev. A | Page 19 of 31
HMC951A
Data Sheet
0
0
–2
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
–5
–4
–6
–10
–15
–20
–25
–30
–8
–10
–12
–14
–16
–18
–20
+85°C
+25°C
–40°C
3
4
5
6
7
8
9
10
11
12
13
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
LO FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 74. LO Return Loss vs. LO Frequency over Temperatures,
LO Power = 0 dBm
Figure 77. RF Return Loss vs. RF Frequency over LO Powers,
LO Frequency = 7 GHz, TA = 25°C
0
0
IF1 +85°C
IF1 +25°C
IF1 –40°C
IF2 +85°C
IF2 +25°C
IF2 –40°C
–5
–10
–15
–20
–25
–30
–35
–40
–5
–10
–15
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
–20
–25
–30
3
4
5
6
7
8
9
10
11
12
13
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 75. LO Return Loss vs. LO Frequency over LO Powers,
Figure 78. IF Return Loss vs. IF Frequency over Temperatures,
LO Frequency = 7 GHz, LO Power = 0 dBm
T
A = 25°C
0
–2
0
–5
+85°C
+25°C
–40°C
–4
–10
–15
–20
–25
–6
–8
–10
–12
–14
–16
–18
–20
–30
–35
–40
IF1 +4dBm
IF1 +2dBm
IF1 0dBm
IF1 –2dBm
IF1 –4dBm
IF2 +4dBm
IF2 +2dBm
IF2 0dBm
IF2 –2dBm
IF2 –4dBm
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
RF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 76. RF Return Loss vs. RF Frequency over Temperatures,
LO Frequency = 7 GHz, LO Power = 0 dBm
Figure 79. IF Return Loss vs. IF Frequency over LO Powers,
LO Frequency = 7 GHz, TA = 25°C
Rev. A | Page 20 of 31
Data Sheet
HMC951A
IF BANDWIDTH PERFORMANCE
Lower Sideband (High-Side LO)
20
20
18
16
14
12
10
8
18
16
14
12
10
8
+85°C
6
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
+25°C
–40°C
4
4
2
0
2
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 80. Conversion Gain vs. IF Frequency over Temperatures,
LO Frequency = 7 GHz, LO Power = 0 dBm
Figure 82. Conversion Gain vs. IF Frequency over LO Powers,
LO Frequency = 7 GHz, TA = 25°C
10
10
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
8
6
8
–2dBm
–4dBm
6
4
4
2
2
0
0
–2
0.5
–2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.0
1.5
2.0
2.5
3.0
3.5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 81. Input IP3 vs. IF Frequency over Temperatures,
LO Frequency = 7 GHz, LO Power = 0 dBm
Figure 83. Input IP3 vs. IF Frequency over LO Powers,
LO Frequency = 7 GHz, TA = 25°C
Rev. A | Page 21 of 31
HMC951A
Data Sheet
Upper Sideband (Low-Side LO)
20
20
18
16
14
12
10
8
18
16
14
12
10
8
+85°C
6
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
+25°C
–40°C
4
4
2
0
2
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 84. Conversion Gain vs. IF Frequency over Temperatures,
LO Frequency = 7 GHz, LO Power = 0 dBm
Figure 86. Conversion Gain vs. IF Frequency over LO Powers,
LO Frequency = 7 GHz, TA = 25°C
10
10
+85°C
+25°C
–40°C
+4dBm
+2dBm
0dBm
8
6
8
–2dBm
–4dBm
6
4
4
2
2
0
0
–2
0.5
–2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.0
1.5
2.0
2.5
3.0
3.5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 85. Input IP3 vs. IF Frequency over Temperatures,
LO Frequency = 7 GHz, LO Power = 0 dBm
Figure 87. Input IP3 vs. IF Frequency over LO Powers,
LO Frequency = 7 GHz, TA = 25°C
Rev. A | Page 22 of 31
Data Sheet
HMC951A
AMPLITUDE AND PHASE IMBALANCE PERFORMANCE
2.0
10
8
1.5
+85°C
+85°C
+25°C
–40°C
+25°C
–40°C
6
1.0
0.5
4
2
0
0
–2
–4
–6
–8
–10
–0.5
–1.0
–1.5
–2.0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 88. Amplitude Imbalance vs. RF Frequency over Temperatures,
LO Power = 0 dBm, IF = 1000 MHz, Lower Sideband
Figure 91. Phase Imbalance vs. RF Frequency over Temperatures,
LO Power = 0 dBm, IF = 1000 MHz, Lower Sideband
2.0
10
+4dBm
+2dBm
0dBm
–2dBm
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
8
1.5
6
–4dBm
4
1.0
0.5
2
0
0
–2
–4
–6
–8
–10
–0.5
–1.0
–1.5
–2.0
5.6
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 89. Amplitude Imbalance vs. RF Frequency over LO Powers,
IF = 1000 MHz, TA = 25°C, Lower Sideband
Figure 92. Phase Imbalance vs. RF Frequency over LO Powers,
IF = 1000 MHz, TA = 25°C, Lower Sideband
2.0
10
+85°C
+85°C
+25°C
–40°C
6
+25°C
–40°C
8
1.5
1.0
0.5
4
2
0
0
–2
–4
–6
–8
–10
–0.5
–1.0
–1.5
–2.0
6.1
6.6
7.1
7.6
8.1
8.6
5.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 90. Amplitude Imbalance vs. RF Frequency over Temperatures,
LO Power = 0 dBm, IF = 1000 MHz, Upper Sideband
Figure 93. Phase Imbalance vs. RF Frequency over Temperatures,
LO Power = 0 dBm, IF = 1000 MHz, Upper Sideband
Rev. A | Page 23 of 31
HMC951A
Data Sheet
2.0
10
8
1.5
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
+4dBm
+2dBm
0dBm
–2dBm
–4dBm
6
1.0
4
0.5
2
0
0
–2
–4
–6
–8
–10
–0.5
–1.0
–1.5
–2.0
6.1
6.6
7.1
7.6
8.1
8.6
6.1
6.6
7.1
7.6
8.1
8.6
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 94. Amplitude Imbalance vs. RF Frequency over LO Powers,
IF = 1000 MHz, TA = 25°C, Upper Sideband
Figure 95. Phase Imbalance vs. RF Frequency over LO Powers,
IF = 1000 MHz, TA = 25°C, Upper Sideband
Rev. A | Page 24 of 31
Data Sheet
HMC951A
M × N Spurious Output, IF = 1000 MHz
SPURIOUS PERFORMANCE
RF = 5600 MHz, LO frequency = 6600 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
Mixer spurious products are measured in dBc from the RF
output power level. Spur values are (M × RF) − (N × LO). N/A
means not applicable.
N × LO
M × N Spurious Outputs, IF = 150 MHz
0
1
2
3
4
0
1
2
3
4
N/A
17
55
75
86
16
0
24
47
55
61
90
26
43
61
76
76
42
50
63
86
77
RF = 5600 MHz, LO frequency = 5750 MHz at LO input power =
0 dBm, RF input power = −20 dBm.
M × RF
61
88
89
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
17
57
70
84
15
0
33
30
60
59
88
18
37
57
59
70
34
43
71
68
81
M × RF
60
78
87
RF = 6100 MHz, LO frequency = 7100 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
23
57
72
82
17
0
14
49
54
65
91
21
41
68
68
83
32
59
68
87
77
RF = 6100 MHz, LO frequency = 6250 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
M × RF
54
83
89
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
22
58
71
83
18
0
26
39
68
70
88
27
38
68
62
77
29
41
73
82
81
M × RF
72
80
87
RF = 8500 MHz, LO frequency = 9500 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
28
52
78
77
13
0
19
39
55
88
86
13
44
68
76
87
39
57
82
84
81
RF = 8500 MHz, LO frequency = 8650 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
M × RF
78
81
82
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
28
53
79
79
16
0
13
46
63
85
86
23
53
69
68
84
28
59
64
86
82
M × RF
78
82
79
Rev. A | Page 25 of 31
HMC951A
Data Sheet
M × N Spurious Outputs, IF = 3100 MHz
RF = 8500 MHz, LO frequency = 11600 MHz at LO input
power = 0 dBm, IF input power = −20 dBm.
RF = 5600 MHz, LO frequency = 8700 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
N × LO
N × LO
0
1
2
3
4
0
1
2
3
4
0
1
2
3
4
N/A
27
53
80
77
4
24
28
67
84
86
27
65
57
86
83
0
0
1
2
3
4
N/A
14
54
74
84
21
0
14
32
61
59
78
23
43
62
83
88
37
52
68
77
88
0
75
70
82
86
M × RF
61
85
80
M × RF
50
81
88
RF = 6100 MHz, LO frequency = 9200 MHz at LO input power =
0 dBm, IF input power = −20 dBm.
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
19
55
68
81
16
0
19
33
59
64
86
14
47
56
84
86
29
50
65
81
88
M × RF
56
80
86
Rev. A | Page 26 of 31
Data Sheet
HMC951A
THEORY OF OPERATION
The HMC951A is a compact GaAs, MMIC, I/Q downconverter
in a RoHS compliant package optimized for point to point and
point to multipoint microwave radio applications operating in
the 5.6 GHz to 8.6 GHz input RF frequency range. The HMC951A
supports LO input frequencies of 4.5 GHz to 12.1 GHz and IF
output frequencies of dc to 3.5 GHz.
Inc., wideband synthesizer portfolio without the need for an
external LO driver amplifier.
MIXER
The mixer is an I/Q double balanced mixer, and this mixer
topology reduces the need for filtering the unwanted sideband.
An external 90° hybrid is required to select the desired sideband
of operation.
The HMC951A uses an RF LNA amplifier followed by an I/Q
double balanced mixer, where a driver amplifier drives the LO
(see Figure 1). The combination of design, process, and
packaging technology allows the functions of these subsystems
to be integrated into a single die, using mature packaging and
interconnection technologies to provide a high performance,
low cost design with excellent electrical, mechanical, and
thermal properties. In addition, the need for external
LNA
The LNA is self biased, and it requires only a single dc bias
voltage (VDRF) to operate. The bias current for the LNA is
75 mA at 5 V typically.
The typical application circuit (see Figure 96) provided shows
the necessary external components on the bias lines to eliminate
any undesired stability problems for the RF amplifier and the
LO amplifier.
components is minimized, optimizing cost and size.
LO DRIVER AMPLIFIER
The LO driver amplifier takes a single LO input and amplifies it
to the desired LO signal level for the mixer to operate optimally.
The LO driver amplifier is self biased, and it only requires a
single dc bias voltage (VDLO) to operate. The bias current for
the LO amplifier is 80 mA at 5 V typically. The LO drive range
of −4 dBm to +4 dBm makes it compatible with Analog Devices,
The HMC951A is a much smaller alternative to hybrid style
image reject converter assemblies, and it eliminates the need for
wire bonding by allowing the use of surface-mount manufacturing
assemblies.
The HMC951A downconverter comes in a compact, 4 mm ×
4 mm, 24-lead LFCSP. The HMC951A operates over the −40°C
to +85°C temperature range.
Rev. A | Page 27 of 31
HMC951A
Data Sheet
APPLICATIONS INFORMATION
LO suppression is <3 mA for each IF port to prevent damage to
the device. The common-mode voltage for each IF port is 0 V.
TYPICAL APPLICATION CIRCUIT
Figure 96 shows the typical application circuit for the
To select the lower sideband, connect the IF1 pin to the 90° port
of the hybrid and the IF2 pin to the 0° port of the hybrid. To
select the upper sideband, connect the IF1 pin to the 0° port of
the hybrid and the IF2 pin to the 90° port of the hybrid.
HMC951A. To select the appropriate sideband, an external 90°
hybrid is required. For applications not requiring operation to
dc, use an off-chip, dc blocking capacitor. For applications that
require the LO signal at the output to be suppressed, use a bias
tee or RF feed. Ensure that the source or sink current used for
HYBRID
COUPLER
IF
VDRF
OUTPUT
4.7µF
0.01µF
100pF
IF1
IF2
1
18
NIC
NIC
17
2
VDRF
NIC
16
3
NIC
VDLO
15
4
HMC951A
NIC
14
GND
RFIN
GND
RFIN
5
6
NIC
100pF
13
NIC
0.01µF
4.7µF
LOIN
VDLO
Figure 96. Typical Application Circuit
Rev. A | Page 28 of 31
Data Sheet
HMC951A
ground planes. The evaluation circuit board shown in Figure 100
is available from Analog Devices upon request.
PERFORMANCE AT LOWER IF FREQUENCIES
The HMC951A can operate at low IF frequencies approaching
dc. Figure 97 and Figure 98 show the conversion gain and image
rejection performance at lower IF frequencies.
25
EV1HMC951ALP4 Power-On Sequence
To power on the EV1HMC951ALP4, take the following steps:
1. Power up VDRF and VDLO with a 5 V supply.
2. Connect LOIN to the LO signal generator with an LO
power of 0 dBm (typical).
20
15
10
5
3. Apply the RF signal.
EV1HMC951ALP4 Power-Off Sequence
To power off the EV1HMC951ALP4, take the following steps:
1. Turn off the LO and RF signals.
2. Set VDRF and VDLO to 0 V and then turn VDRF and
VDLO off.
Layout
0
100
1k
10k
100k
1M
10M
Solder the exposed pad on the underside of the HMC951A to a
low thermal and electrical impedance ground plane. This pad
is typically soldered to an exposed opening in the solder mask
on the evaluation board. Connect these ground vias to all
other ground layers on the evaluation board to maximize heat
dissipation from the device package. Figure 99 shows the PCB
land pattern footprint for the HMC951A evaluation board.
IF FREQUENCY (Hz)
Figure 97. Conversion Gain vs. IF Frequency at Low IF Frequencies,
LO = 7 GHz at 4 dBm, Upper Sideband (Low-Side LO)
60
50
40
30
20
10
0
0.178" SQUARE
0.006" MASK/METAL OVERLAP
SOLDERMASK
0.010" MIN MASK WIDTH
GROUND PAD
PAD SIZE
0.026" × 0.010"
PIN 1
0.0197"
[0.50]
0.116"
MASK
100
1k
10k
100k
1M
10M
OPENING
0.034"
IF FREQUENCY (Hz)
TYPICAL
VIA SPACING
Figure 98. Image Rejection vs. IF Frequency at Low IF Frequencies,
LO = 7 GHz at 4 dBm, Upper Sideband (Low-Side LO)
EVALUATION BOARD INFORMATION
0.010"
TYPICAL VIA
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance and
connect the package ground leads and exposed pad directly to
the ground plane similarly to that shown in Figure 99. Use a
sufficient number of via holes to connect the top and bottom
0.010" REF
0.030"
MASK OPENING
0.098" SQUARE MASK OPENING
0.020 × 45° CHAMFER FOR PIN 1
0.110" SQUARE
GROUND PAD
Figure 99. EV1HMC951ALP4 PCB Land Pattern Footprint
Rev. A | Page 29 of 31
HMC951A
Data Sheet
Figure 100. EV1HMC951ALP4 Evaluation Board Top Layer
Table 6. Bill of Materials for the EV1HMC951ALP41, 2 Evaluation Board PCB
Qty. Reference Designator Description
Manufacturer
Part Number
129744-1
1
Not applicable
PCB, EV1HMC951ALP4; circuit board material:
Rogers 4350
Analog Devices, Inc.
2
4
1
1
6
6
2
1
J1, J2
J3, J4
J5
SMA RF connectors, SRI
Johnson connectors, SRI
Header connectors, 2 mm, four vertical positions, SMT
Header connectors, 2 mm, four vertical positions, SMT
SRI Connector Gage Co. 25-146-1000-92
Johnson Components
Molex
142-0701-851
87759-0414
J6
Molex
87759-0614
C1, C4, C6, C8, C10, C13 Ceramic capacitors, 100 pF, 5%, 50 V, C0G, 0402
C2, C5, C7, C9, C11, C14 Ceramic capacitors, 0.01 µF, 50 V, 10%, X7R, 0603
C3, C12
H951A
Kemet
Murata
AVX Corp.
Analog Devices, Inc.
C0402C101J5GACTU
RM155R71H102KA01D
TAJA475M016R
HMC951A
Tantalum capacitors, 4.7 μF, 25 V, 10%, SMD, Case A
Device under test, HM951A
1 Reference this number when ordering the evaluation board PCB.
2 This is a generic evaluation board. Some components or bias lines shown in Figure 100 are not used for the HMC951A.
Rev. A | Page 30 of 31
Data Sheet
HMC951A
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
4.10
4.00 SQ
3.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
24
19
18
1
0.50
BSC
2.85
2.70 SQ
2.55
EXPOSED
PAD
13
12
6
7
0.50
0.40
0.30
0.20 MIN
TOP VIEW
SIDE VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.95
0.85
0.75
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
Figure 101. 24-Lead Lead Frame Chip Scale Package [LFCSP],
4 mm × 4 mm Body and 0.85 mm Package Height
(HCP-24-3)
Dimensions shown in millimeters
ORDERING GUIDE
Lead
Package
Model1
Temperature Range
Package Body Material
Finish Package Description
MSL Rating2 Option
HMC951ALP4E
−40°C to +85°C
Low Stress, Injected
Molded Plastic
Ag
24-Lead LFCSP
MSL3
HCP-24-3
HMC951ALP4ETR
EV1HMC951ALP4
−40°C to +85°C
Low Stress, Injected
Molded Plastic
Ag
24-Lead LFCSP
MSL3
HCP-24-3
Evaluation PCB Assembly
1 The HMC951ALP4E and the HMC951ALP4ETR are RoHS Compliant Parts.
2 See the Absolute Maximum Ratings section.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16348-0-4/18(A)
Rev. A | Page 31 of 31
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