HMC977LP4ETR [ADI]
GaAs, MMIC, I/Q, Downconverter, 20 GHz to 28 GHz;
| 型号： | HMC977LP4ETR |
| 厂家： | 
ADI |
| 描述： | GaAs, MMIC, I/Q, Downconverter, 20 GHz to 28 GHz |
| 文件： | 总20页 (文件大小：797K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GaAs, MMIC, I/Q, Downconverter,
20 GHz to 28 GHz
Data Sheet
HMC977
FEATURES
FUNCTIONAL BLOCK DIAGRAM
HMC977
Conversion gain: 14 dB typical
Image rejection: 21 dBc typical at 20 GHz to 26.5 GHz
2× LO to RF isolation: 45 dB typical at 20 GHz to 26.5 GHz
Noise figure: 2.5 dB typical at 20 GHz to 26.5 GHz
Input IP3: 1 dBm typical at 20 GHz to 26.5 GHz
LO drive range: 2 dBm to 6 dBm
NIC
NIC
1
NIC
GND
IF2
18
17
16
15
14
13
24-lead 4 mm × 4 mm LFCSP
2
APPLICATIONS
VDRF
3
4
5
6
Point to point and point to multipoint radios
Military radar, electronic warfare (EW), and electronic
intelligence (ELINT)
NIC
IF1
VDLO2
VDLO1
NIC
×2
GND
Satellite communications
Figure 1.
GENERAL DESCRIPTION
The HMC977 is a compact, gallium arsenide (GaAs),
mixer eliminates the need for a filter following the LNA and
removes thermal noise at the image frequency. I and Q mixer
outputs are provided and an external 90° hybrid is required to
select the required sideband. The HMC977 is a much smaller
alternative to hybrid style image reject mixer downconverter
assemblies and is compatible with surface-mount manufacturing
techniques.
monolithic microwave integrated circuit (MMIC), inphase and
quadrature (I/Q) downconverter in a leadless, RoHS compliant,
surface-mount technology (SMT) package. This device provides a
small signal conversion gain of 14 dB with a noise figure of
2.5 dB and 21 dBc of image rejection. The HMC977 utilizes a
low noise amplifier (LNA) followed by an image reject mixer
which is driven by an active 2× multiplier. The image reject
Rev. D
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Tel: 781.329.4700
Technical Support
©2019 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC977
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 1000 MHz, Lower Sideband ............................................. 10
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Specifications............................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 6
Typical Performance Characteristics ............................................. 7
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 2000 MHz, Upper Sideband ............................................. 11
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 2000 MHz, Lower Sideband ............................................. 12
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 3300 MHz, Upper Sideband ............................................. 13
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 3300 MHz, Lower Sideband ............................................. 14
Spurious Performance ............................................................... 15
Theory of Operation ...................................................................... 16
Applications Information.............................................................. 17
Evaluation PCB........................................................................... 18
Layout .......................................................................................... 19
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 1000 MHz, Upper Sideband ............................................... 7
Quadrature Channel Data Taken Without 90° Hybrid at the
IF Ports, IF = 1000 MHz, Upper Sideband ............................... 9
REVISION HISTORY
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Added Figure 2; Renumbered Sequentially ...................................5
Changes to M × N Spurious Outputs,
IF = 1000 MHz Section.................................................................. 15
Added Theory of Operation Section ........................................... 16
Added Applications Information Section ................................... 17
Changes to Figure 52...................................................................... 17
Change to Table 6 ........................................................................... 18
Added Figure 54 ............................................................................. 19
11/2019—v02.0815 to Rev. D
Updated Format..................................................................Universal
Changed HMC977LP4E to HMC977..............................Universal
Changes to Figure 1.......................................................................... 1
Changes to the Electrical Specifications Section.......................... 3
Rev. D | Page 2 of 20
Data Sheet
HMC977
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
20 GHz to 26.5 GHz
TA = 25°C, IF = 1000 MHz, local oscillator (LO) = 6 dBm, drain bias voltage (VDD) = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper
sideband. All measurements performed as downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless
otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ Max
Units
FREQUENCY RANGE
RF
LO
IF
20
8.3
DC
2
26.5
15
3.5
GHz
GHz
GHz
dBm
dB
LO DRIVE RANGE
6
CONVERSION GAIN (AS IMAGE REJECT
MIXER (IRM))
11
14
NOISE FIGURE
2.5
21
−8
dB
IMAGE REJECTION
dBc
dBm
INPUT POWER FOR 1 dB COMPRESSION (P1dB)
ISOLATION
2× LO to RF
2× LO to IF
35
45
20
1
dB
dB
INPUT THIRD-ORDER INTERCEPT (IP3)
AMPLITUDE BALANCE
PHASE BALANCE
dBm
dB
Data taken without external 90° hybrid at the IF ports
Data taken without external 90° hybrid at the IF ports
No power sequence is required
0.3
17
Degree
V
SUPPLY VOLTAGE
3.325 3.5
3.675
TOTAL SUPPLY CURRENT
170 210
mA
26.5 GHz to 28 GHz
TA = 25°C, IF = 1000 MHz, LO = 6 dBm, VDD = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper sideband. All measurements performed as
downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless otherwise noted
Table 2.
Parameter
Test Conditions/Comments
Min
Typ Max
Units
FREQUENCY RANGE
RF
LO
26.5
11.5
DC
2
28
15.7
3.5
GHz
GHz
GHz
dBm
dB
IF
LO DRIVE RANGE
CONVERSION GAIN (AS IRM)
NOISE FIGURE
IMAGE REJECTION
INPUT P1dB
6
11
14
3
dB
20
−7
dBc
dBm
ISOLATION
2× LO to RF
2× LO to IF
34
39
30
3
dB
dB
INPUT IP3
dBm
dB
AMPLITUDE BALANCE
PHASE BALANCE
SUPPLY VOLTAGE
TOTAL SUPPLY CURRENT
Data taken without external 90° hybrid at the IF ports
Data taken without external 90° hybrid at the IF ports
No power sequence is required
0.3
12
Degree
V
3.325 3.5
3.675
170 210
mA
Rev. D | Page 3 of 20
HMC977
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
Thermal resistance is directly linked to printed circuit board (PCB)
design and operating environment. Close attention to PCB
thermal design is required.
Parameter
RF Input Power
LO Drive
VDD
Continuous Power Dissipation (PDISS), TA =
85°C (Derates 17.7 mW/°C Above 85°C)1
Temperature
Junction (Channel), TJ
Peak Reflow (Moisture Sensitivity Level 1,
MSL12)
Storage Range
Rating
2 dBm
10 dBm
5.0 V
θJC is the channel to case thermal resistance, channel to bottom
of package.
1.6 W
Table 4. Thermal Resistance
Package Type1
θJC
Unit
175°C
260°C
HCP-24-2
56.3
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 4 mm × 4 mm thermal vias. Refer to JEDEC standard JESD51-2 for
additional information.
−65°C to +150°C
−40°C to +85°C
Operating Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
ESD CAUTION
Class 1A (250 V)
1 PDISS is a theoretical number calculated by (TJ − 85°C)/θJC.
2 Based on IPC/JEDEC J-STD-20 MSL classifications.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. D | Page 4 of 20
Data Sheet
HMC977
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
18
NIC
NIC
NIC
17 GND
16
VDRF
VDLO2
VDLO1
NIC
IF2
HMC977
TOP VIEW
15
NIC
14 IF1
GND
13
NOTES
1. NIC = NOT INTERNALLY CONNECTED. DO NOT
CONNECT TO THIS PIN.
2. EPAD. THE EPAD MUST BE CONNECTED TO GND.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic
Description
1, 2, 6, 7, 10 to 12, NIC
15, 18 to 22
Not Internally Connected. These pins are not connected internally.
3
VDRF
Power Supply for the RF Low Noise Amplifier. See Figure 3 for the interface schematic.
4
5
8
VDLO2
VDLO1
LO
GND
IF1
Power Supply for the Second Stage LO Amplifier. See Figure 4 for the interface schematic.
Power Supply for the First Stage LO Amplifier. See Figure 5 for the interface schematic.
Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic.
Ground Connect. Connect these pins to RF and dc ground. See Figure 7 for the interface schematic.
First Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to
dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF
frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or
device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.
9, 13, 17, 24
14
16
23
IF2
Second Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation
to dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF
frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or
device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 9 for the interface
schematic.
RF
EPAD
Exposed Pad. The EPAD must be connected to GND.
Rev. D | Page 5 of 20
HMC977
Data Sheet
INTERFACE SCHEMATICS
VDRF
GND
Figure 7. GND Interface Schematic
Figure 3. VDRF Interface Schematic
IF1, IF2
VDLO2
Figure 8. IF1 and IF2 Interface Schematic
Figure 4. VDLO2 Interface Schematic
VDLO1
RF
Figure 5. VDLO1 Interface Schematic
Figure 9. RF Interface Schematic
LO
Figure 6. LO Interface Schematic
Rev. D | Page 6 of 20
Data Sheet
HMC977
TYPICAL PERFORMANCE CHARACTERISTICS
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, UPPER SIDEBAND
25
20
15
10
5
25
20
15
10
5
2dBm
4dBm
6dBm
8dBm
+85°C
+25°C
–40°C
0
20
0
20
21
22
23
24
25
26
27
28
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 10. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 13. Conversion Gain vs. RF Frequency at Various LO Drives
0
–5
0
–10
–20
–30
–40
–10
–15
–20
–25
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
–50
20
–30
20
21
22
23
24
25
26
27
28
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 11. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 14. RF Return Loss vs. RF Frequency Over Temperature,
LO Frequency = 24 GHz
0
0
IF1
IF2
–3
–6
–5
–10
–15
–20
–9
–12
–15
+85°C
+25°C
–40°C
–25
10
11
12
13
14
15
16
0
1
2
3
4
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 12. LO Return Loss vs. LO Frequency Over Temperature,
LO Drive = 6 dBm
Figure 15. IF Return Loss vs. IF Frequency, LO Frequency = 24 GHz,
LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
Rev. D | Page 7 of 20
HMC977
Data Sheet
20
0
2LO/RF
LO/RF
–10
–20
–30
–40
–50
–60
–70
–80
10
0
–10
–20
–30
–40
RF/IF2
RF/IF1
2LO/IF1
2LO/IF2
–50
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. RF to IF and LO to IF Isolation vs. RF Frequency, LO Drive = 6 dBm,
Data Taken Without External 90° Hybrid
Figure 19. LO to RF Isolation vs. RF Frequency LO Drive = 6 dBm,
Data Taken Without External 90° Hybrid
0
–2
15
10
5
–4
–6
–8
0
–10
–12
–5
–10
+85°C
+85°C
+25°C
–40°C
–14
+25°C
–40°C
–16
20
–15
20
21
22
23
24
25
26
27
28
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 17. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm
Figure 20. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
10
5
8
6
4
2
0
0
–5
2dBm
–10
4dBm
6dBm
8dBm
–15
20
21
22
23
24
25
26
27
28
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
RF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 18. Input IP3 vs. RF Frequency at Various LO Drives
Figure 21. Noise Figure vs. IF Frequency, LO Frequency = 10 GHz,
LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
Rev. D | Page 8 of 20
Data Sheet
HMC977
QUADRATURE CHANNEL DATA TAKEN WITHOUT 90° HYBRID AT THE IF PORTS, IF = 1000 MHZ, UPPER
SIDEBAND
6
5
4
3
2
1
0
20
15
10
5
0
–5
–10
–15
–20
+85°C
+25°C
–40°C
CONVERSION GAIN
RETURN LOSS
20
21
22
23
24
25
26
27
28
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
RF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 22. Noise Figure vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 24. Conversion Gain and Return Loss Over IF Bandwidth
35
2.0
2dBm
4dBm
6dBm
1.5
1.0
30
25
20
15
10
5
0.5
0
–0.5
–1.0
–1.5
–2.0
2dBm
4dBm
6dBm
0
–5
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 23. Amplitude Balance vs. RF Frequency at Various LO Drives
Figure 25. Phase Balance vs. RF Frequency at Various LO Drives
Rev. D | Page 9 of 20
HMC977
Data Sheet
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, LOWER SIDEBAND
25
20
15
10
5
25
20
15
10
5
2dBm
4dBm
6dBm
8dBm
+85°C
+25°C
–40°C
0
20
0
20
21
22
23
24
25
26
27
28
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 26. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 29. Conversion Gain vs. RF Frequency at Various LO Drives
0
0
+85°C
+25°C
–40°C
+85°C
+25°C
–2
–4
–40°C
–10
–20
–30
–40
–50
–60
–6
–8
–10
–12
–14
–16
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 27. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 30. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
15
10
5
+85°C
+25°C
–40°C
10
5
0
0
–5
–5
2dBm
–10
–15
–10
4dBm
6dBm
8dBm
–15
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 28. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
Figure 31. Input IP3 vs. RF Frequency at Various LO Drives
Rev. D | Page 10 of 20
Data Sheet
HMC977
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, UPPER SIDEBAND
15
10
5
25
20
15
10
5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0
–5
–10
–15
0
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 32. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 35. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
0
2dBm
4dBm
+85°C
+25°C
–40°C
6dBm
–10
10
8dBm
–20
–30
–40
–50
–60
5
0
–5
–10
–15
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 33. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 36. Input IP3 vs. RF Frequency at Various LO Drives
25
20
15
10
5
2dBm
4dBm
6dBm
8dBm
0
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 34. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 11 of 20
HMC977
Data Sheet
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, LOWER SIDEBAND
15
10
5
25
20
15
10
5
+85°C
+25°C
–40°C
0
–5
–10
–15
+85°C
+25°C
–40°C
0
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 37. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 40. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
0
2dBm
4dBm
+85°C
+25°C
6dBm
–40°C
10
8dBm
–10
5
0
–20
–30
–40
–50
–5
–10
–15
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 38. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 41. Input IP3 vs. RF Frequency at Various LO Drives
25
20
15
10
5
0
2dBm
4dBm
6dBm
8dBm
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 39. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 12 of 20
Data Sheet
HMC977
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, UPPER SIDEBAND
15
10
5
25
20
15
10
5
0
–5
–10
–15
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
0
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 42. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 45. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
10
5
0
–10
–20
–30
–40
0
–5
2dBm
–10
4dBm
+85°C
+25°C
–40°C
6dBm
8dBm
–50
20
–15
20
21
22
23
24
25
26
27
28
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 43. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 46. Input IP3 vs. RF Frequency at Various LO Drives
25
20
15
10
5
0
2dBm
4dBm
6dBm
8dBm
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 44. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 13 of 20
HMC977
Data Sheet
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, LOWER SIDEBAND
15
10
5
25
20
15
10
5
+85°C
+25°C
–40°C
0
–5
–10
–15
+85°C
+25°C
–40°C
0
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 47. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 50. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
0
+85°C
+25°C
–40°C
2dBm
4dBm
6dBm
10
8dBm
–10
–20
–30
–40
–50
5
0
–5
–10
–15
20
21
22
23
24
25
26
27
28
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 48. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
Figure 51. Input IP3 vs. RF Frequency at Various LO Drives
25
20
15
10
5
2dBm
4dBm
6dBm
8dBm
0
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 49. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 14 of 20
Data Sheet
HMC977
SPURIOUS PERFORMANCE
M × N Spurious Outputs, IF = 1000 MHz
RF = 24 GHz, and RF input power = −20 dBm. LO frequency =
11.5 GHz, and LO drive = 4 dBm. All values are in dBc below IF
power level (RF − 2 × LO). Spur values are (M × RF) − (N × LO).
N/A means not applicable.
N × LO
0
1
2
3
4
0
1
2
3
4
N/A
−20
−72.6
N/A
N/A
−22.6
−29.3
−72.6
N/A
−7.4
0
−28.8
−33
−37.2
−37.3
−51.6
−74.6
N/A
M × RF
−57.6
−74.6
N/A
−43.6
−74.6
N/A
N/A
Rev. D | Page 15 of 20
HMC977
Data Sheet
THEORY OF OPERATION
The HMC977 is a compact, GaAs, MMIC, I/Q downconverter
in a leadless, RoHS compliant, SMT package. The device can be
used as either an image reject mixer or a SSB upconverter. The
mixer uses two standard, double balanced, mixer cells and a
90° hybrid. This device is a smaller alternative to a hybrid style
image reject mixer and a SSB upconverter assembly. The
HMC977 eliminates the need for wire bonding, allowing the
use of the surface-mount manufacturing techniques.
Rev. D | Page 16 of 20
Data Sheet
HMC977
APPLICATIONS INFORMATION
Figure 52 shows the typical application circuit for the HMC977.
To select the appropriate sideband, an external 90° hybrid
coupler is needed. For applications not requiring operation to
dc, use an off chip dc blocking capacitor. The common-mode
voltage for each IF port is 0 V.
To select the lower sideband, connect the IF2 pin to the 90°
port of the hybrid and the IF1 pin to the 0° port of the hybrid.
To select the upper sideband (low side LO), connect the IF2 pin
to the 0° port of the hybrid and the IF1 pin to the 90° port of
the hybrid.
AUTOMATIC
GAIN
BAND-PASS
CONTROL
FILTER
COUPLER
LO
×2
IF OUT
8.3GHz TO 15.7GHz
RF
20GHz TO 28GHz
Figure 52. Typical Application Circuit
Rev. D | Page 17 of 20
HMC977
Data Sheet
Table 6. List of Materials for Evaluation PCB 1316561
EVALUATION PCB
Item
Description
It is recommended to use RF circuit design techniques with the
circuit board used in the application. Signal lines must have 50 Ω
impedance, and the package ground leads and exposed paddle
must be connected directly to the ground plane similar to that
shown Figure 54. A sufficient number of via holes must be used
to connect the top and bottom ground planes. The evaluation
circuit board shown in Figure 53 is available from Analog
Devices, Inc., upon request.
J1
PCB mount, Subminiature Version A (SMA), RF
connector, SRI
J2, J3
PCB mount K connectors, SRI
DC pins
100 pF capacitors, 0402 package
10 nF capacitors, 0402 package
4.7 μF capacitors, Case A package
HMC977
J5 to J8
C1, C4, C7
C2, C5, C8
C3, C6, C9
U1
PCB2
131653 evaluation board
1 Reference this number when ordering complete evaluation PCB.
2 Circuit board material: Rogers 4350.
131653-1
VDL02 VDRF VDLO1
GND
J5 J6
J7
+
J8
U1
J3
+
C3
C9
+
RFIN
C6
J2
IF2
C4
C5
C7
H977
XXXX
C8
IF1
C2 C1
J4
LO
J1
Figure 53. Evaluation PCB
Rev. D | Page 18 of 20
Data Sheet
HMC977
0.178" SQUARE
LAYOUT
0.006" MASK/METAL OVERLAP
0.010" MIN MASK WIDTH
SOLDERMASK
GROUND PAD
Solder the exposed pad on the underside of the HMC977 to a
low thermal and electrical impedance ground plane. This pad is
typically soldered to an exposed opening in the solder mask on
the evaluation board. Connect these ground vias to all other
ground layers on the evaluation board to maximize heat
dissipation from the device package. Figure 54 shows the PCB
land pattern footprint for the HMC977 evaluation board.
PAD SIZE
0.026" × 0.010"
PIN 1
0.0197"
[0.50]
0.116"
MASK
OPENING
0.034"
TYPICAL
VIA SPACING
0.010"
TYPICAL VIA
0.010" REF
0.030"
MASK OPENING
0.098" SQUARE MASK OPENING
0.020 × 45° CHAMFER FOR PIN 1
0.110" SQUARE
GROUND PAD
Figure 54. 131656-HMC977LP4E PCB Land Pattern Footprint
Rev. D | Page 19 of 20
HMC977
Data Sheet
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
4.10
4.00 SQ
3.90
0.30
0.25
0.18
PIN 1
INDICATOR
PIN 1
S
INDICATOR AR EA OP TION
(SEE DETAIL A)
24
19
18
1
0.50
BSC
2.95
2.80 SQ
2.65
EXPOSED
PAD
13
12
6
7
0.50
0.40
0.30
0.20 MIN
TOP VIEW
BOTTOM VIEW
1.00
0.90
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.
Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.90 mm Package Height
(HCP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
MSL
Package
Model1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
Lead Finish
Rating2 Option
HMC977LP4E
HMC977LP4ETR
131656-HMC977LP4E
24-Lead Lead Frame Chip Scale Package [LFCSP]
24-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Assembly Board
100% Matte Sn MSL1
100% Matte Sn MSL1
HCP-24-2
HCP-24-2
1 The models are RoHS complaint parts.
2 See the Absolute Maximum Ratings section.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D21858-0-11/19(D)
Rev. D | Page 20 of 20
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