APT5518BFLL [ADPOW]

POWER MOS 7 FREDFET; 功率MOS 7 FREDFET
APT5518BFLL
型号: APT5518BFLL
厂家: ADVANCED POWER TECHNOLOGY    ADVANCED POWER TECHNOLOGY
描述:

POWER MOS 7 FREDFET
功率MOS 7 FREDFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总5页 (文件大小:96K)
中文:  中文翻译
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APT5518BFLL  
APT5518SFLL  
550V 31A 0.180Ω  
BFLL  
R
POWER MOS 7 FREDFET  
D3PAK  
TO-247  
Power MOS 7® is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS. Both conduction and switching  
losses are addressed with Power MOS 7® by significantly lowering RDS(ON)  
and Qg. Power MOS 7® combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT's  
patented metal gate structure.  
SFLL  
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• IncreasedPowerDissipation  
• Easier To Drive  
• TO-247 or Surface Mount D3PAK Package  
D
S
G
FAST RECOVERY BODY DIODE  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT5518  
550  
UNIT  
VDSS  
ID  
Drain-Source Voltage  
Volts  
Continuous Drain Current @ TC = 25°C  
31  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
124  
VGS  
VGSM  
Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
±30  
±40  
Total Power Dissipation @ TC = 25°C  
Linear Derating Factor  
Watts  
W/°C  
403  
PD  
3.23  
-55 to 150  
300  
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063" from Case for 10 Sec.  
1
IAR  
Avalanche Current  
(Repetitive and Non-Repetitive)  
31  
1
EAR  
EAS  
30  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
4
1300  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
550  
31  
TYP  
MAX  
UNIT  
BVDSS  
ID(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
Volts  
2
On State Drain Current  
(VDS > ID(on) x RDS(on) Max, VGS = 10V)  
Amps  
2
RDS(on)  
Drain-Source On-State Resistance  
(VGS = 10V, 15.5A)  
Ohms  
µA  
0.180  
250  
Zero Gate Voltage Drain Current (VDS = 550V, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 440V, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 1mA)  
IDSS  
1000  
±100  
5
IGSS  
nA  
VGS(th)  
Volts  
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
APT5518 BFLL - SFLL  
DYNAMIC CHARACTERISTICS  
Symbol  
Ciss  
Coss  
Crss  
Qg  
MIN  
TYP  
MAX  
Characteristic  
UNIT  
TestConditions  
V
= 0V  
Input Capacitance  
3286  
625  
31  
GS  
V
= 25V  
pF  
Output Capacitance  
DS  
f = 1 MHz  
Reverse Transfer Capacitance  
3
V
= 10V  
Total Gate Charge  
67  
GS  
V
= 275V  
Qgs  
nC  
ns  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
DD  
26  
I
= 31A @ 25°C  
D
Qgd  
34  
RESISTIVESWITCHING  
td(on)  
tr  
15  
V
= 15V  
GS  
11  
V
= 275V  
DD  
td(off)  
37  
Turn-off Delay Time  
Fall Time  
I
= 31A @ 25°C  
D
tf  
R
= 0.6Ω  
11  
G
INDUCTIVESWITCHING@25°C  
6
Eon  
Eoff  
339  
190  
585  
227  
Turn-on Switching Energy  
V
= 367V, V = 15V  
GS  
DD  
I
Turn-off Switching Energy  
= 31A, R = 5Ω  
D
G
µJ  
INDUCTIVESWITCHING@125°C  
6
Eon  
Eoff  
Turn-on Switching Energy  
V
= 367V V = 15V  
GS  
DD  
Turn-off Switching Energy  
I
= 31A, R = 5Ω  
D
G
SOURCE-DRAINDIODERATINGSANDCHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
31  
UNIT  
IS  
Continuous Source Current (Body Diode)  
Amps  
1
ISM  
VSD  
Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
124  
1.3  
15  
2
Volts  
V/ns  
(VGS = 0V, IS = -31A)  
dv  
/
dv  
5
Peak Diode Recovery  
/
dt  
dt  
Reverse Recovery Time  
(IS = -31A, di/dt = 100A/µs)  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
250  
400  
trr  
ns  
µC  
Reverse Recovery Charge  
(IS = -31A, di/dt = 100A/µs)  
1.9  
6
Qrr  
Peak Recovery Current  
(IS = -31A, di/dt = 100A/µs)  
15  
26  
IRRM  
Amps  
THERMALCHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.31  
40  
UNIT  
RθJC  
RθJA  
Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive Rating: Pulse width limited by maximum junction  
temperature  
4 Starting T = +25°C, L = 2.71mH, R = 25, Peak I = 31A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See MIL-STD-750 Method 3471  
device itself.  
I
-I 31A  
/
700A/µs  
V
R V  
T 150°C  
J
dt  
S
D
DSS  
6
Eon includes diode reverse recovery. See figures 18, 20.  
APTReservestherighttochange,withoutnotice,thespecificationsandinformationcontainedherein.  
0.35  
0.30  
0.9  
0.25  
0.7  
0.20  
Note:  
0.5  
0.15  
t
1
0.3  
0.10  
t
2
t
1
Duty Factor D =  
/
t
2
0.05  
0
0.1  
Peak T = P  
x Z + T  
J
DM  
θJC C  
0.05  
SINGLEPULSE  
10-3  
10-5  
10-4  
10-2  
10-1  
1.0  
RECTANGULARPULSEDURATION(SECONDS)  
FIGURE1,MAXIMUMEFFECTIVETRANSIENTTHERMALIMPEDANCE,JUNCTION-TO-CASEvsPULSEDURATION  
Typical Performance Curves  
APT5518 BFLL - SFLL  
100  
80  
60  
40  
20  
0
V
=15 & 10V  
GS  
RC MODEL  
Junction  
temp. ( ”C)  
7.5V  
7V  
0.119  
0.0135F  
0.319F  
Power  
(Watts)  
6.5V  
6V  
0.191  
Case temperature  
5.5V  
5V  
0
5
10  
15  
20  
25  
30  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
FIGURE2, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGURE3,LOW VOLTAGE OUTPUTCHARACTERISTICS  
100  
1.40  
NORMALIZED TO  
V
> I (ON) x  
R
(ON)MAX.  
DS  
DS  
D
V
= 10V  
@
15.5A  
250µSEC. PULSE TEST  
GS  
@ <0.5 % DUTY CYCLE  
1.30  
1.20  
1.10  
1.00  
80  
60  
40  
V
=10V  
GS  
T
= +125°C  
= +25°C  
V
=20V  
J
GS  
T
20  
0
J
0.90  
0.80  
T
= -55°C  
J
0
2
4
6
8
10  
0
10  
20  
30  
40  
50  
60  
V
,GATE-TO-SOURCEVOLTAGE(VOLTS)  
I ,DRAINCURRENT(AMPERES)  
GS  
D
FIGURE4, TRANSFERCHARACTERISTICS  
FIGURE5,R (ON)vsDRAINCURRENT  
DS  
35  
30  
25  
20  
15  
10  
05  
0
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50 75 100 125 150  
T ,CASETEMPERATURE(°C)  
T ,JUNCTIONTEMPERATURE(°C)  
C
J
FIGURE6,MAXIMUMDRAINCURRENTvsCASETEMPERATURE  
FIGURE7,BREAKDOWNVOLTAGEvsTEMPERATURE  
2.5  
1.2  
I
= 15.5A  
= 10V  
D
V
GS  
1.1  
1.0  
0.9  
0.8  
2.0  
1.5  
1.0  
0.5  
0.0  
0.7  
0.6  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T ,JUNCTIONTEMPERATURE(°C)  
T ,CASETEMPERATURE(°C)  
J
C
FIGURE8,ON-RESISTANCEvs.TEMPERATURE  
FIGURE9,THRESHOLDVOLTAGEvsTEMPERATURE  
APT5518 BFLL - SFLL  
126  
50  
10,000  
1,000  
100  
OPERATIONHERE  
LIMITEDBYR (ON)  
DS  
C
iss  
100µS  
C
oss  
10  
1mS  
T
=+25°C  
C
J
C
rss  
T =+150°C  
SINGLEPULSE  
10mS  
1
10  
1
10  
100  
550  
0
10  
20  
30  
40  
50  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
DS  
FIGURE10,MAXIMUMSAFEOPERATINGAREA  
FIGURE11, CAPACITANCEvsDRAIN-TO-SOURCEVOLTAGE  
16  
200  
I
= 31A  
D
100  
V
=110V  
12  
DS  
T =+150°C  
J
V
=275V  
T =+25°C  
J
DS  
V
=440V  
DS  
8
10  
4
0
1
0
20  
g
40  
60  
80  
100  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
Q ,TOTALGATECHARGE(nC)  
,SOURCE-TO-DRAINVOLTAGE(VOLTS)  
SD  
FIGURE12,GATECHARGEvsGATE-TO-SOURCEVOLTAGE  
FIGURE13, SOURCE-DRAINDIODEFORWARDVOLTAGE  
60  
60  
V
= 367V  
DD  
= 5Ω  
R
T
G
50  
40  
30  
20  
50  
40  
30  
20  
t
d(off)  
= 125°C  
J
t
f
L = 100µH  
V
= 367V  
DD  
= 5Ω  
R
T
G
= 125°C  
J
L = 100µH  
t
d(on)  
t
10  
0
10  
0
r
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
I
(A)  
I (A)  
D
D
FIGURE 14, DELAY TIMES vs CURRENT  
FIGURE 15, RISE AND FALL TIMES vs CURRENT  
1000  
800  
600  
400  
1000  
V
= 367V  
DD  
= 5Ω  
R
T
G
E
= 125°C  
on  
800  
600  
400  
J
L = 100µH  
E
on  
EON includes  
diode reverse recovery.  
V
I
= 367V  
DD  
= 31A  
E
off  
D
T
= 125°C  
J
200  
0
200  
0
L = 100µH  
EON includes  
E
diode reverse recovery.  
off  
0
10  
20  
30  
40  
50  
0
5
10 15 20 25 30 35 40 45 50  
R ,GATERESISTANCE(Ohms)  
I
(A)  
D
G
FIGURE16, SWITCHING ENERGYvs CURRENT  
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE  
Typical Performance Curves  
APT5518 BFLL - SFLL  
Gate Voltage  
10 %  
90%  
t
Gate Voltage  
Drain Voltage  
Drain Current  
T
= 125 C  
T
= 125 C  
J
J
d(off)  
t
d(on)  
t
t
f
r
Drain Current  
Drain Voltage  
90%  
90%  
5 %  
5 %  
10%  
0
10 %  
Switching Energy  
Switching Energy  
Figure19,Turn-offSwitchingWaveformsandDefinitions  
Figure18,Turn-onSwitchingWaveformsandDefinitions  
APT30DF60B  
VCE  
IC  
VDD  
G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
D3PAKPackageOutline  
TO-247 Package Outline  
4.98 (.196)  
4.69 (.185)  
15.95 (.628)  
16.05 (.632)  
13.41 (.528)  
13.51 (.532)  
5.31 (.209)  
5.08 (.200)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15 (.045)  
1.49 (.059)  
2.49 (.098)  
1.47 (.058)  
1.57 (.062)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99 (.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
4.06 (.160)  
2.67 (.105)  
2.84 (.112)  
(Base of Lead)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
Heat Sink (Drain)  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.}  
1.01 (.040)  
1.40 (.055)  
Gate  
Drain  
Source  
Source  
Drain  
Gate  
Dimensions in Millimeters (Inches)  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT’sproductsarecoveredbyoneormoreofU.S.patents4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058andforeignpatents. USandForeignpatentspending. AllRightsReserved.  

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