ADP7102ACPZ-3.0-R7 [ADI]
20 V, 300 mA, Low Noise, CMOS LDO; 20 V 300毫安,低噪声, CMOS LDO型号: | ADP7102ACPZ-3.0-R7 |
厂家: | ADI |
描述: | 20 V, 300 mA, Low Noise, CMOS LDO |
文件: | 总28页 (文件大小:744K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
20 V, 300 mA, Low Noise, CMOS LDO
Data Sheet
ADP7102
FEATURES
TYPICAL APPLICATION CIRCUITS
Input voltage range: 3.3 V to 20 V
Maximum output current: 300 mA
VOUT = 5V
VIN
VOUT
VIN = 8V
+
+
CIN
1µF
COUT
1µF
SENSE
Low noise: 15 µV rms for fixed output versions
PSRR performance of 60 dB at 10 kHz, VOUT = 3.3 V
Reverse current protection
Low dropout voltage: 200 mV at 300 mA load
Initial accuracy: 0.8%
RPG
100kΩ
R1
100kΩ
ON
EN/
UVLO
OFF
R2
100kΩ
PG
PG
GND
Accuracy over line, load, and temperature: −2%, +1%
Low quiescent current (VIN = 5 V), IGND = 750 μA with 300 mA
load
Low shutdown current: 40 µA at VIN = 12 V
Stable with small 1 µF ceramic output capacitor
7 fixed output voltage options: 1.5 V, 1.8 V, 2.5 V, 3 V, 3.3 V,
5 V, and 9 V
Adjustable output from 1.22 V to VIN – VDO
Foldback current limit and thermal overload protection
User programmable precision UVLO/enable
Power good indicator
Figure 1. ADP7102 with Fixed Output Voltage, 5 V
VOUT = 5V
COUT
1µF
VIN
VOUT
ADJ
VIN = 8V
+
+
CIN
1µF
R1
40.2kΩ
R2
13kΩ
R3
100kΩ
ON
RPG
100kΩ
EN/
UVLO
OFF
R4
100kΩ
PG
PG
GND
Figure 2. ADP7102 with Adjustable Output Voltage, 5 V
8-lead LFCSP and 8-lead SOIC packages
APPLICATIONS
Regulation to noise sensitive applications: ADC, DAC
circuits, precision amplifiers, high frequency oscillators,
clocks, and PLLs
Communications and infrastructure
Medical and healthcare
Industrial and instrumentation
GENERAL DESCRIPTION
The ADP7102 is a CMOS, low dropout linear regulator that
operates from 3.3 V to 20 V and provides up to 300 mA of
output current. This high input voltage LDO is ideal for
regulation of high performance analog and mixed signal
circuits operating from 19 V to 1.22 V rails. Using an
advanced proprietary architecture, it provides high power
supply rejection, low noise, and achieves excellent line and
load transient response with just a small 1 µF ceramic
output capacitor.
The ADP7102 output noise voltage is 15 μV rms and is inde-
pendent of the output voltage. A digital power good output
allows power system monitors to check the health of the output
voltage. A user programmable precision undervoltage lockout
function facilitates sequencing of multiple power supplies.
The ADP7102 is available in 8-lead, 3 mm × 3 mm LFCSP
and 8-lead SOIC packages. The LFCSP offers a very compact
solution and also provides excellent thermal performance for
applications requiring up to 300 mA of output current in a
small, low-profile footprint.
The ADP7102 is available in 7 fixed output voltage options and
an adjustable version, which allows output voltages that range
from 1.22 V to VIN − VDO via an external feedback divider.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rightsof third parties that may result fromits use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks andregisteredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2011 Analog Devices, Inc. All rights reserved.
ADP7102
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 17
Applications Information .............................................................. 18
Capacitor Selection .................................................................... 18
Programable Undervoltage Lockout (UVLO)........................... 19
Power Good Feature .................................................................. 20
Noise Reduction of the Adjustable ADP7102 ........................ 20
Current Limit and Thermal Overload Protection ................. 21
Thermal Considerations............................................................ 21
Printed Circuit Board Layout Considerations............................ 24
Outline Dimensions....................................................................... 25
Ordering Guide .......................................................................... 26
Applications....................................................................................... 1
Typical Application Circuits............................................................ 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Input and Output Capacitor, Recommended Specifications.. 4
Absolute Maximum Ratings............................................................ 5
Thermal Data ................................................................................ 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7
REVISION HISTORY
11/11—Rev. 0 to Rev. A
Changes to Figure 50...................................................................... 14
10/11—Revision 0: Initial Version
Rev. A | Page 2 of 28
Data Sheet
ADP7102
SPECIFICATIONS
VIN = (VOUT + 1 V) or 3.3 V (whichever is greater), EN = VIN, IOUT = 10 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
Table 1.
Parameter
Symbol
VIN
Conditions
Min
Typ
400
450
650
750
40
Max
Unit
V
INPUT VOLTAGE RANGE
OPERATING SUPPLY CURRENT
3.3
20
IGND
IOUT = 100 µA, VIN = 10 V
IOUT = 100 µA, VIN = 10 V, TJ = −40°C to +125°C
IOUT = 10 mA, VIN = 10 V
IOUT = 10 mA, VIN = 10 V, TJ = −40°C to +125°C
IOUT = 150 mA, VIN = 10 V
IOUT = 150 mA, VIN = 10 V, TJ = −40°C to +125°C
IOUT = 300 mA, VIN = 10 V
IOUT = 300 mA, VIN = 10 V, TJ = −40°C to +125°C
EN = GND, VIN = 12 V
EN = GND, VIN = 12 V, TJ = −40°C to +125°C
EN = GND, VIN = 0 V, VOUT = 20 V
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
900
1050
1250
1400
75
SHUTDOWN CURRENT
IGND-SD
INPUT REVERSE CURRENT
IREV-INPUT
0.3
EN = GND, VIN = 0 V, VOUT = 20 V, TJ = −40°C to +125°C
5
OUTPUT VOLTAGE ACCURACY
Fixed Output Voltage Accuracy
VOUT
IOUT = 10 mA
1 mA < IOUT < 300 mA, VIN = (VOUT + 1 V) to 20 V,
TJ = −40°C to +125°C
–0.8
–2
+0.8
+1
%
%
Adjustable Output Voltage
Accuracy
VADJ
IOUT = 10 mA
1.21
1.22 1.23
1.232
V
V
1 mA < IOUT < 300 mA, VIN = (VOUT + 1 V) to 20 V,
TJ = −40°C to +125°C
1.196
−0.015
LINE REGULATION
LOAD REGULATION 1
∆VOUT/∆VIN VIN = (VOUT + 1 V) to 20 V, TJ = −40°C to +125°C
∆VOUT/∆IOUT IOUT = 1 mA to 300 mA
+0.015 %/V
%/A
0.2
IOUT = 1 mA to 300 mA, TJ = −40°C to +125°C
1.0
%/A
nA
ADJ INPUT BIAS CURRENT
SENSE INPUT BIAS CURRENT
DROPOUT VOLTAGE2
ADJI-BIAS
1 mA < IOUT < 300 mA, VIN = (VOUT + 1 V) to 20 V,
ADJ connected to VOUT
1 mA < IOUT < 300 mA, VIN = (VOUT + 1 V) to 20 V,
SENSE connected to VOUT, VOUT = 1.5 V
10
1
SENSEI-BIAS
VDROPOUT
μA
IOUT = 10 mA
IOUT = 10 mA, TJ = −40°C to +125°C
IOUT = 150 mA
IOUT = 150 mA, TJ = −40°C to +125°C
IOUT = 300 mA
IOUT = 300 mA, TJ = −40°C to +125°C
VOUT = 5 V
20
mV
mV
mV
mV
mV
mV
µs
40
100
200
175
325
750
START-UP TIME3
tSTART-UP
ILIMIT
800
575
CURRENT-LIMIT THRESHOLD4
PG OUTPUT LOGIC LEVEL
PG Output Logic High
PG Output Logic Low
450
1.0
mA
PGHIGH
PGLOW
IOH < 1 µA
IOL < 2 mA
V
V
0.4
PG OUTPUT THRESHOLD
Output Voltage Falling
Output Voltage Rising
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
PGFALL
PGRISE
−9.2
−6.5
%
%
TSSD
TJ rising
150
15
°C
°C
TSSD-HYS
Rev. A | Page 3 of 28
ADP7102
Data Sheet
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
PROGRAMMABLE EN/UVLO
UVLO Threshold rising
UVLO Threshold falling
UVLORISE
UVLOFALL
3.3 V ≤ VIN ≤ 20 V, TJ = −40°C to +125°C
3.3 V ≤ VIN ≤ 20 V, TJ = −40°C to +125°C, 10 kΩ
in series with enable pin
1.18
1.23 1.28
1.13
V
V
UVLO Hysteresis Current
Enable Pulldown Current
INPUT VOLTAGE
UVLOHYS
IEN-IN
VEN > 1.25 V, TJ = −40°C to +125°C
EN = VIN
7.5
9.8
500
12
µA
nA
Start Threshold
Shutdown Threshold
Hysteresis
VSTART
VSHUTDOWN
TJ = −40°C to +125°C
TJ = −40°C to +125°C
3.2
V
V
mV
2.45
250
15
15
15
15
18
OUTPUT NOISE
OUTNOISE
10 Hz to 100 kHz, VIN = 5.5 V, VOUT = 1.8 V
10 Hz to 100 kHz, VIN = 6.3 V, VOUT = 3.3 V
10 Hz to 100 kHz, VIN = 8 V, VOUT = 5 V
10 Hz to 100 kHz, VIN = 12 V, VOUT = 9 V
10 Hz to 100 kHz, VIN = 5.5 V, VOUT = 1.5 V,
adjustable mode
µV rms
µV rms
µV rms
µV rms
µV rms
10 Hz to 100 kHz, VIN = 12 V, VOUT = 5 V,
adjustable mode
10 Hz to 100 kHz, VIN = 18 V, VOUT = 15 V,
adjustable mode
30
65
µV rms
µV rms
POWER SUPPLY REJECTION RATIO PSRR
100 kHz, VIN = 4.3 V, VOUT = 3.3 V
100 kHz, VIN = 6 V, VOUT = 5 V
10 kHz, VIN = 4.3 V, VOUT = 3.3 V
10 kHz, VIN = 6 V, VOUT = 5 V
100 kHz, VIN = 3.3 V, VOUT = 1.8 V, adjustable mode
100 kHz, VIN = 6 V, VOUT = 5 V, adjustable mode
100 kHz, VIN = 16 V, VOUT = 15 V, adjustable mode
10 kHz, VIN = 3.3 V, VOUT = 1.8 V, adjustable mode
10 kHz, VIN = 6 V, VOUT = 5 V, adjustable mode
10 kHz, VIN = 16 V, VOUT = 15 V, adjustable mode
50
50
60
60
50
60
60
60
80
80
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1 Based on an end-point calculation using 1 mA and 300 mA loads. See Figure 6 for typical load regulation performance for loads less than 1 mA.
2 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output
voltages above 3.0 V.
3 Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value.
4 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 5.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 5.0 V, or 4.5 V.
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
Table 2.
Parameter
Minimum Input and Output Capacitance1
Capacitor ESR
Symbol
CMIN
RESR
Conditions
Min
0.7
0.001
Typ
Max
Unit
µF
Ω
TA = −40°C to +125°C
TA = −40°C to +125°C
0.2
1 The minimum input and output capacitance should be greater than 0.7 μF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended;
Y5V and Z5U capacitors are not recommended for use with any LDO.
Rev. A | Page 4 of 28
Data Sheet
ADP7102
ABSOLUTE MAXIMUM RATINGS
Table 3.
board design is required. The value of θJA may vary, depending
on PCB material, layout, and environmental conditions. The
specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit
board. See JESD51-7 and JESD51-9 for detailed information on
the board construction. For additional information, see the
AN-617 Application Note, MicroCSP™ Wafer Level Chip Scale
Package, available at www.analog.com.
Parameter
Rating
VIN to GND
VOUT to GND
EN/UVLO to GND
–0.3 V to +22 V
–0.3 V to +20 V
–0.3 V to VIN
PG to GND
–0.3 V to VIN
SENSE/ADJ to GND
–0.3 V to VOUT
–65°C to +150°C
–40°C to +125°C
–40°C to +85°C
JEDEC J-STD-020
ΨJB is the junction-to-board thermal characterization parameter
Storage Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
with units of °C/W. The package’s ΨJB is based on modeling and
calculation using a 4-layer board. The JESD51-12, Guidelines
for Reporting and Using Electronic Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. ΨJB measures the
component power flowing through multiple thermal paths
rather than a single path as in thermal resistance, θJB. Therefore,
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Ψ
JB thermal paths include convection from the top of the
package as well as radiation from the package, factors that make
JB more useful in real-world applications. Maximum junction
Ψ
temperature (TJ) is calculated from the board temperature (TB)
and power dissipation (PD) using the formula
THERMAL DATA
TJ = TB + (PD × ΨJB)
Absolute maximum ratings apply individually only, not in
combination. The ADP7102 can be damaged when the junction
temperature limit is exceeded. Monitoring ambient temperature
does not guarantee that TJ is within the specified temperature
limits. In applications with high power dissipation and poor
thermal resistance, the maximum ambient temperature may
have to be derated.
See JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
Thermal Resistance
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
θ
JC is a parameter for surface-mount packages with top
mounted heatsinks. θJC is presented here for reference only.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-
ambient thermal resistance of the package (θJA).
Table 4. Thermal Resistance
Package Type
8-Lead LFCSP
8-Lead SOIC
ΨJB
Unit
°C/W
°C/W
θJA
θJC
40.1
48.5
27.1
58.4
17.2
31.3
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
ESD CAUTION
TJ = TA + (PD × θJA)
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
Rev. A | Page 5 of 28
ADP7102
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VOUT 1
SENSE/ADJ 2
GND 3
8 VIN
VOUT
SENSE/ADJ
GND
1
2
3
4
8
7
6
5
VIN
ADP7102
7 PG
ADP7102
PG
TOP VIEW
TOP VIEW
6 GND
5 EN/UVLO
GND
(Not to Scale)
(Not to Scale)
NC
EN/UVLO
NC 4
NOTES
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO
THIS PIN.
1. NC = NO CONNECT. DO NOT CONNECT TO
THIS PIN.
2. IT IS HIGHLY RECOMMENDED THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNECTED TO THE GROUND
PLANE ON THE BOARD.
2. IT IS HIGHLY RECOMMENDED THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNECTED TO THE GROUND
PLANE ON THE BOARD.
Figure 3. LFCSP Package
Figure 4. Narrow Body SOIC Package
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
VOUT
SENSE/ADJ
Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.
Sense (SENSE). Measures the actual output voltage at the load and feeds it to the error amplifier.
Connect SENSE as close as possible to the load to minimize the effect of IR drop between the
regulator output and the load. This function applies to fixed voltages only.
Adjust Input (ADJ). An external resistor divider sets the output voltage. This function applies to
adjustable voltages only.
3
4
5
GND
NC
EN/UVLO
Ground.
Do Not Connect to this Pin.
Enable Input (EN). Drive EN high to turn on the regulator; drive EN low to turn off the regulator.
For automatic startup, connect EN to VIN.
Programmable Undervoltage Lockout (UVLO). When the programmable UVLO function is used,
the upper and lower thresholds are determined by the programming resistors.
6
7
GND
PG
Ground.
Power Good. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the
part is in shutdown, current limit, thermal shutdown, or falls below 90% of the nominal output
voltage, PG immediately transitions low. If the power good function is not used, the pin may be
left open or connected to ground.
8
VIN
Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
EPAD
Exposed Pad. Exposed paddle on the bottom of the package. The EPAD enhances thermal
performance and is electrically connected to GND inside the package. It is highly recommended
that the EPAD be connected to the ground plane on the board.
Rev. A | Page 6 of 28
Data Sheet
ADP7102
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 5 V, VOUT = 3.3 V, IOUT = 1 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
900
800
700
600
500
400
300
200
100
0
3.35
3.33
3.31
3.29
3.27
3.25
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
–40°C
–5°C
25°C
°C
85°C
125°C
–40°C
–5°C
25°C
°C
85°C
125°C
T
(
)
T
(
)
J
J
Figure 5. Output Voltage vs. Junction Temperature
Figure 8. Ground Current vs. Junction Temperature
3.35
3.33
3.31
3.29
3.27
3.25
700
600
500
400
300
200
100
0
0.1
1
10
(mA)
100
1000
0.1
1
10
(mA)
100
1000
I
I
LOAD
LOAD
Figure 6. Output Voltage vs. Load Current
Figure 9. Ground Current vs. Load Current
3.35
3.33
3.31
3.29
3.27
3.25
900
800
700
600
500
400
300
200
100
0
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
4
6
8
10
12
(V)
14
16
18
20
4
6
8
10
12
(V)
14
16
18
20
V
V
IN
IN
Figure 10. Ground Current vs. Input Voltage
Figure 7. Output Voltage vs. Input Voltage
Rev. A | Page 7 of 28
ADP7102
Data Sheet
1400
1200
1000
800
600
400
200
0
160
3.3V
4.0V
6.0V
8.0V
12.0V
20.0V
140
120
100
80
60
40
LOAD = 5mA
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 300mA
20
0
–50
3.10
3.20
3.30
3.40
(V)
3.50
3.60
3.70
–25
0
25
50
75
100
125
V
TEMPERATURE (°C)
IN
Figure 11. Shutdown Current vs. Temperature at Various Input Voltages
Figure 14. Ground Current vs. Input Voltage (in Dropout)
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
200
V
A
= 3.3V
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
OUT
T
= 25°C
180
160
140
120
100
80
60
40
20
0
1
10
100
1000
–40°C
–5°C
25°C
°C
85°C
125°C
I
(mA)
T
(
)
LOAD
J
Figure 12. Dropout Voltage vs. Load Current
Figure 15. Output Voltage vs. Junction Temperature, VOUT = 5 V
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
3.35
3.30
3.25
3.20
3.15
3.10
3.05
3.00
2.95
2.90
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
0.1
1
10
(mA)
100
1000
3.10
3.20
3.30
3.40
(V)
3.50
3.60
3.70
I
LOAD
V
IN
Figure 13. Output Voltage vs. Input Voltage (in Dropout)
Figure 16. Output Voltage vs. Load Current, VOUT = 5 V
Rev. A | Page 8 of 28
Data Sheet
ADP7102
5.05
900
800
700
600
500
400
300
200
100
0
LOAD = 100µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 1mA
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
6
8
10
12
14
16
18
20
6
8
10
12
14
16
18
20
V
(V)
IN
V
(V)
IN
Figure 17. Output Voltage vs. Input Voltage, VOUT = 5 V
Figure 20. Ground Current vs. Input Voltage, VOUT = 5 V
180
160
140
120
100
80
1000
900
800
700
600
500
400
300
200
100
0
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
V
= 5V
= 25°C
OUT
T
A
60
40
20
0
1
10
100
1000
–40°C
–5°C
25°C
°C
85°C
125°C
I
(mA)
LOAD
T
(
)
J
Figure 18. Ground Current vs. Junction Temperature, VOUT = 5 V
Figure 21. Dropout Voltage vs. Load Current, VOUT = 5 V
700
600
500
400
300
200
100
0
5.05
5.00
4.95
4.90
4.85
4.80
4.75
4.70
4.65
LOAD = 5mA
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 300mA
0.1
1
10
(mA)
100
1000
4.8
4.9
5.0
5.1
(V)
5.2
5.3
5.4
I
V
LOAD
IN
Figure 22. Output Voltage vs. Input Voltage (in Dropout), VOUT = 5 V
Figure 19. Ground Current vs. Load Current, VOUT = 5 V
Rev. A | Page 9 of 28
ADP7102
Data Sheet
1.85
1.83
1.81
1.79
1.77
1.75
2500
2000
1500
1000
500
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 5mA
0
LOAD = 10mA
LOAD = 100mA
LOAD = 200mA
LOAD = 300mA
–500
2
4
6
8
10
12
(V)
14
16
18
20
4.80
4.90
5.00
5.10
(V)
5.20
5.30
5.40
V
IN
V
IN
Figure 23. Ground Current vs. Input Voltage (in Dropout), VOUT = 5 V
Figure 26. Output Voltage vs. Input Voltage, VOUT = 1.8 V
900
800
700
600
500
400
300
200
100
0
1.85
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
1.83
1.81
1.79
1.77
1.75
LOAD = 300mA
–40°C
–5°C
25°C
(°C)
85°C
125°C
–40°C
–5°C
25°C
°C
85°C
125°C
T
J
T
(
)
J
Figure 24. Output Voltage vs. Junction Temperature, VOUT = 1.8 V
Figure 27. Ground Current vs. Junction Temperature, VOUT = 1.8 V
700
600
500
400
300
200
100
0
1.85
1.83
1.81
1.79
1.77
1.75
0.1
1
10
(mA)
100
1000
0.1
1
10
(mA)
100
1000
I
I
LOAD
LOAD
Figure 25. Output Voltage vs. Load Current, VOUT = 1.8 V
Figure 28. Ground Current vs. Load Current, VOUT = 1.8 V
Rev. A | Page 10 of 28
Data Sheet
ADP7102
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
1200
LOAD = 100µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
1000
800
600
400
200
0
6
8
10
12
14
16
18
20
2
4
6
8
10
12
(V)
14
16
18
20
V
(V)
IN
V
IN
Figure 29. Ground Current vs. Input Voltage, VOUT = 1.8 V
Figure 32. Output Voltage vs. Input Voltage, VOUT = 5 V, Adjustable
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
2.0
3.3V
4V
5V
6V
8V
10V
12V
15V
18V
20V
1.5
1.0
0.5
0
–40°C
–5°C
25°C
°C
85°C
125°C
–40
–20
0
20
40
60
80
100
120
140
T
(
)
J
TEMPERATURE (°C)
Figure 33. Reverse Input Current vs. Temperature, VIN = 0 V, Different
Voltages on VOUT
Figure 30. Output Voltage vs. Junction Temperature, VOUT = 5 V, Adjustable
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
0
LOAD = 300mA
LOAD = 100mA
–10
LOAD = 10mA
LOAD = 1mA
–20
–30
–40
–50
–60
–70
–80
–90
–100
0.1
1
10
(mA)
100
1000
10
100
1k
10k
100k
1M
10M
I
LOAD
FREQUENCY (Hz)
Figure 34. Power Supply Rejection Ratio vs. Frequency, VOUT = 1.8 V,
IN = 3.3 V
Figure 31. Output Voltage vs. Load Current, VOUT = 5 V, Adjustable
V
Rev. A | Page 11 of 28
ADP7102
Data Sheet
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
LOAD = 1mA
LOAD = 300mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
10
100
1k
10k
100k
1M
10M
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 35. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V,
Figure 38. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6.5 V
VIN = 4.8 V
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
LOAD = 300mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 1mA
LOAD = 10mA
–10
LOAD = 100mA
LOAD = 300mA
–20
–30
–40
–50
–60
–70
–80
–90
–100
10
100
1k
10k
100k
1M
10M
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 36. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V,
Figure 39. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6 V
VIN = 4.3 V
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
LOAD = 1mA
LOAD = 300mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 10mA
–10
LOAD = 100mA
LOAD = 300mA
–20
–30
–40
–50
–60
–70
–80
–90
–100
10
100
1k
10k
100k
1M
10M
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 40. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 5.5 V
Figure 37. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V,
IN = 3.8 V
V
Rev. A | Page 12 of 28
Data Sheet
ADP7102
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
LOAD = 1mA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
10
100
1k
10k
100k
1M
10M
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 41. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 5.3 V
Figure 44. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6 V,
Adjustable with Noise Reduction Circuit
0
0
LOAD = 1mA
LOAD = 1mA
LOAD = 10mA
LOAD = 10mA
–10
–10
LOAD = 100mA
LOAD = 100mA
LOAD = 300mA
–20
LOAD = 300mA
–20
–30
–40
–50
–60
–70
–80
–90
–100
–30
–40
–50
–60
–70
–80
–90
–100
0
0.25
0.50
0.75
1.00
1.25
1.50
10
100
1k
10k
100k
1M
10M
HEADROOM VOLTAGE (V)
FREQUENCY (Hz)
Figure 42. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 5.2 V
Figure 45. Power Supply Rejection Ratio vs. Headroom Voltage, 100 Hz,
VOUT = 5 V
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
LOAD = 1mA
LOAD = 1mA
LOAD = 10mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
–10
LOAD = 100mA
LOAD = 300mA
–20
–30
–40
–50
–60
–70
–80
–90
–100
10
100
1k
10k
100k
1M
10M
0
0.25
0.50
0.75
1.00
1.25
1.50
FREQUENCY (Hz)
HEADROOM VOLTAGE
Figure 43. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6 V,
Adjustable
Figure 46. Power Supply Rejection Ratio vs. Headroom Voltage, 1 kHz,
OUT = 5 V
V
Rev. A | Page 13 of 28
ADP7102
Data Sheet
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
10
3.3V
LOAD = 1mA
5V
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
5V ADJ
5V ADJ NR
1
0.1
0.01
–100
0
0.25
0.50
0.75
1.00
1.25
1.50
10
100
1k
10k
100k
HEADROOM VOLTAGE (V)
FREQUENCY (Hz)
Figure 47. Power Supply Rejection Ratio vs. Headroom Voltage, 10 kHz,
Figure 50. Output Noise Spectral Density, ILOAD = 10 mA, COUT = 1 μF
VOUT = 5 V
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
LOAD CURRENT
1
OUTPUT VOLTAGE
2
B
CH1 200mA ΩB CH2 50mV
M 20µs
A CH1
76mA
0
0.25
0.50
0.75
1.00
1.25
1.50
W
W
T 10.4%
HEADROOM VOLTAGE (V)
Figure 48. Power Supply Rejection Ratio vs. Headroom Voltage, 100 kHz,
OUT = 5 V
Figure 51. Load Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA to 300 mA,
OUT = 1.8 V, VIN = 5 V
V
V
30
25
20
15
10
5
LOAD CURRENT
1
OUTPUT VOLTAGE
2
3.3V
1.8V
5V
ADJ
ADJ
5V
5V
NR
Ω B
0
B
W
CH1 200mA
CH2 50mV
M 20µs
A CH1
168mA
W
0.00001
0.0001
0.001
0.01
0.1
1
T
10.2%
LOAD CURRENT (A)
Figure 49. Output Noise vs. Load Current and Output Voltage,
COUT = 1 μF
Figure 52. Load Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA to 300 mA,
OUT = 3.3 V, VIN = 5 V
V
Rev. A | Page 14 of 28
Data Sheet
ADP7102
LOAD CURRENT
INPUT VOLTAGE
1
OUTPUT VOLTAGE
2
1
OUTPUT VOLTAGE
2
B
B
B
Ω B
W
W
CH1 1V
CH2 10mV
M 4µs
A CH4
1.56V
CH1 200mA
CH2 50mV
M 20µs
W
A CH1
216mA
W
T 9.8%
T
10.2%
Figure 55. Line Transient Response, CIN, COUT = 1 μF, ILOAD = 300 mA,
OUT = 3.3 V
Figure 53. Load Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA to 300 mA,
OUT = 5 V, VIN = 7 V
V
V
INPUT VOLTAGE
INPUT VOLTAGE
OUTPUT VOLTAGE
OUTPUT VOLTAGE
2
1
2
1
B
B
B
B
CH1 1V
CH2 10mV
M 4µs
T 9.8%
A CH4
1.56V
CH1 1V
CH2 10mV
M 4µs
W
A CH4
1.56V
W
W
W
T
9.8%
Figure 54. Line Transient Response, CIN, COUT = 1 μF, ILOAD = 300 mA,
OUT = 1.8 V
Figure 56. Line Transient Response, CIN, COUT = 1 μF, ILOAD = 300 mA, VOUT = 5 V
V
Rev. A | Page 15 of 28
ADP7102
Data Sheet
INPUT VOLTAGE
INPUT VOLTAGE
OUTPUT VOLTAGE
2
1
OUTPUT VOLTAGE
2
1
B
B
CH1 1V
CH2 10mV
M 4µs
T 9.8%
A CH4
1.56V
B
B
W
W
CH1 1V
CH2 10mV
M 4µs
T 9.8%
A CH4
1.56V
W
W
Figure 57. Line Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA, VOUT = 1.8 V
Figure 59. Line Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA, VOUT = 5 V
INPUT VOLTAGE
OUTPUT VOLTAGE
2
1
B
B
CH1 1V
CH2 10mV
M 4µs
T 9.8%
A CH4
1.56V
W
W
Figure 58. Line Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA, VOUT = 3.3 V
Rev. A | Page 16 of 28
Data Sheet
ADP7102
THEORY OF OPERATION
The ADP7102 is a low quiescent current, low-dropout linear
regulator that operates from 3.3 V to 20 V and provides up to
300 mA of output current. Drawing a low 750 μA of quiescent
current (typical) at full load makes the ADP7102 ideal for
battery-operated portable equipment. Typical shutdown
current consumption is 40 μA at room temperature.
is higher than the reference voltage, the gate of the PMOS
device is pulled higher, allowing less current to pass and
decreasing the output voltage.
The ADP7102 is available in 7 fixed output voltage options,
ranging from 1.8 V to 9 V and in an adjustable version with
an output voltage that can be set to between 1.22 V and 19 V
by an external voltage divider. The output voltage can be set
according to the following equation:
Optimized for use with small 1 µF ceramic capacitors, the
ADP7102 provides excellent transient performance.
V
OUT = 1.22 V(1 + R1/R2)
VIN
VOUT
VREG
10µA
VOUT = 5V
VIN
VOUT
VIN = 8V
SHORT-CIRCUIT,
THERMAL
GND
+
R1
+
PGOOD
R1
PG
CIN
1µF
COUT
1µF
40.2kΩ
PROTECT
ADJ
SENSE
R3
100kΩ
SHUTDOWN
ON
R2
RPG
100kΩ
EN/
UVLO
R2
13kΩ
OFF
EN/
UVLO
R4
100kΩ
PG
PG
GND
1.22V
REFERENCE
Figure 62. Typical Adjustable Output Voltage Application Schematic
Figure 60. Fixed Output Voltage Internal Block Diagram
The value of R2 should be less than 200 kΩ to minimize
errors in the output voltage caused by the ADJ pin input
current. For example, when R1 and R2 each equal 200 kΩ,
the output voltage is 2.44 V. The output voltage error
introduced by the ADJ pin input current is 2 mV or 0.08%,
assuming a typical ADJ pin input current of 10 nA at 25°C.
VIN
VOUT
VREG
10µA
SHORT-CIRCUIT,
THERMAL
GND
PGOOD
PG
PROTECT
SHUTDOWN
The ADP7102 uses the EN/UVLO pin to enable and disable
the VOUT pin under normal operating conditions. When
EN/UVLO is high, VOUT turns on, when EN is low, VOUT
turns off. For automatic startup, EN/UVLO can be tied to VIN.
EN/
UVLO
SENSE
1.22V
REFERENCE
The ADP7102 incorporates reverse current protections
circuitry that prevents current flow backwards through the
pass element when the output voltage is greater than the input
voltage. A comparator senses the difference between the input
and output voltages. When the difference between the input
voltage and output voltage exceeds 55 mV, the body of the PFET
is switched to VOUT and turned off or opened. In other words,
the gate is connected to VOUT.
Figure 61. Adjustable Output Voltage Internal Block Diagram
Internally, the ADP7102 consists of a reference, an error
amplifier, a feedback voltage divider, and a PMOS pass
transistor. Output current is delivered via the PMOS pass
device, which is controlled by the error amplifier. The error
amplifier compares the reference voltage with the feedback
voltage from the output and amplifies the difference. If the
feedback voltage is lower than the reference voltage, the gate
of the PMOS device is pulled lower, allowing more current to
pass and increasing the output voltage. If the feedback voltage
Rev. A | Page 17 of 28
ADP7102
Data Sheet
APPLICATIONS INFORMATION
Figure 64 depicts the capacitance vs. voltage bias characteristic
of an 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a
capacitor is strongly influenced by the capacitor size and voltage
rating. In general, a capacitor in a larger package or higher voltage
rating exhibits better stability. The temperature variation of the
X5R dielectric is ~ 15% over the −40°C to +85°C temperature
range and is not a function of package or voltage rating.
1.2
CAPACITOR SELECTION
Output Capacitor
The ADP7102 is designed for operation with small, space-
saving ceramic capacitors but functions with most commonly
used capacitors as long as care is taken with regard to the
effective series resistance (ESR) value. The ESR of the out-
put capacitor affects the stability of the LDO control loop. A
minimum of 1 µF capacitance with an ESR of 0.2 Ω or less is
recommended to ensure the stability of the ADP7102. Transient
response to changes in load current is also affected by output
capacitance. Using a larger value of output capacitance improves
the transient response of the ADP7102 to large changes in load
current. Figure 63 shows the transient responses for an output
capacitance value of 1 µF.
1.0
0.8
0.6
0.4
0.2
0
LOAD CURRENT
1
0
2
4
6
8
10
VOLTAGE (V)
Figure 64. Capacitance vs. Voltage Characteristic
OUTPUT VOLTAGE
2
Use Equation 1 to determine the worst-case capacitance
accounting for capacitor variation over temperature,
component tolerance, and voltage.
C
EFF = CBIAS × (1 − TEMPCO) × (1 − TOL)
where:
BIAS is the effective capacitance at the operating voltage.
(1)
B
CH1 200mA ΩB CH2 50mV
M 20µs
T 10.4%
A CH1
76mA
W
W
C
Figure 63. Output Transient Response, VOUT = 1.8 V, COUT = 1 µF
TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.
Input Bypass Capacitor
Connecting a 1 µF capacitor from VIN to GND reduces
the circuit sensitivity to printed circuit board (PCB) layout,
especially when long input traces or high source impedance
are encountered. If greater than 1 µF of output capacitance is
required, the input capacitor should be increased to match it.
In this example, the worst-case temperature coefficient
(TEMPCO) over −40°C to +85°C is assumed to be 15% for
an X5R dielectric. The tolerance of the capacitor (TOL) is
assumed to be 10%, and CBIAS is 0.94 μF at 1.8 V, as shown
in Figure 64.
Input and Output Capacitor Properties
Substituting these values in Equation 1 yields
Any good quality ceramic capacitors can be used with the
ADP7102, as long as they meet the minimum capacitance and
maximum ESR requirements. Ceramic capacitors are manufac-
tured with a variety of dielectrics, each with different behavior
over temperature and applied voltage. Capacitors must have a
dielectric adequate to ensure the minimum capacitance over
the necessary temperature range and dc bias conditions. X5R
or X7R dielectrics with a voltage rating of 6.3 V to 50 V are
recommended. Y5V and Z5U dielectrics are not recommended,
due to their poor temperature and dc bias characteristics.
C
EFF = 0.94 μF × (1 − 0.15) × (1 − 0.1) = 0.719 μF
Therefore, the capacitor chosen in this example meets the
minimum capacitance requirement of the LDO over temper-
ature and tolerance at the chosen output voltage.
To guarantee the performance of the ADP7102, it is imperative
that the effects of dc bias, temperature, and tolerances on the
behavior of the capacitors be evaluated for each application.
Rev. A | Page 18 of 28
Data Sheet
ADP7102
PROGRAMABLE UNDERVOLTAGE LOCKOUT (UVLO)
VOUT = 5V
VIN
VOUT
VIN = 8V
ON
+
+
CIN
1µF
COUT
1µF
The ADP7102 uses the EN/UVLO pin to enable and disable
the VOUT pin under normal operating conditions. As shown
in Figure 65, when a rising voltage on EN crosses the upper
threshold, VOUT turns on. When a falling voltage on EN/
UVLO crosses the lower threshold, VOUT turns off. The
hysteresis of the EN/UVLO threshold is determined by
the Thevenin equivalent resistance in series with the EN/
UVLO pin.
SENSE
RPG
100kΩ
R1
100kΩ
EN/
UVLO
OFF
R2
100kΩ
PG
PG
GND
Figure 66. Typical EN Pin Voltage Divider
Figure 65 shows the typical hysteresis of the EN/UVLO pin.
This prevents on/off oscillations that can occur due to noise
on the EN pin as it passes through the threshold points.
2.0
1.8
1.6
1.4
1.2
The ADP7102 uses an internal soft-start to limit the inrush
current when the output is enabled. The start-up time for the
3.3 V option is approximately 580 μs from the time the EN
active threshold is crossed to when the output reaches 90%
of its final value. As shown in Figure 67, the start-up time is
dependent on the output voltage setting.
V
V
, EN RISE
, EN FALL
OUT
1.0
0.8
0.6
0.4
0.2
0
OUT
6
5V
5
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
4
Figure 65. Typical VOUT Response to EN Pin Operation
3.3V
The upper and lower thresholds are user programmable and
can be set using two resistors. When the EN/UVLO pin voltage
is below 1.22 V, the LDO is disabled. When the EN/UVLO pin
voltage transitions above 1.22 V, the LDO is enabled and 10 µA
hysteresis current is sourced out of the pin raising the voltage,
thus providing threshold hysteresis. Typically, two external
resistors program the minimum operational voltage for the LDO.
The resistance values, R1 and R2 can be determined from:
3
ENABLE
2
1
0
0
500
1000
1500
2000
TIME (µs)
R1 = VHYS/10 μA
R2 = 1.22 V × R1/(VIN − 1.22 V)
where:
Figure 67. Typical Start-Up Behavior
VIN is the desired turn-on voltage.
VHYS is the desired EN/UVLO hysteresis level.
Hysteresis can also be achieved by connecting a resistor in series
with EN/UVLO pin. For the example shown in Figure 66, the
enable threshold is 2.44 V with a hysteresis of 1 V.
Rev. A | Page 19 of 28
ADP7102
Data Sheet
POWER GOOD FEATURE
NOISE REDUCTION OF THE ADJUSTABLE
ADP7102
The ADP7102 provides a power good pin (PG) to indicate
the status of the output. This open-drain output requires an
external pull-up resistor to VIN. If the part is in shutdown
mode, current-limit mode, or thermal shutdown, or if it falls
below 90% of the nominal output voltage, the power-good pin
(PG) immediately transitions low. During soft-start, the rising
threshold of the power-good signal is 93.5% of the nominal
output voltage.
The ultralow output noise of the fixed output ADP7102 is
achieved by keeping the LDO error amplifier in unity gain
and setting the reference voltage equal to the output voltage.
This architecture does not work for an adjustable output
voltage LDO. The adjustable output ADP7102 uses the more
conventional architecture where the reference voltage is fixed
and the error amplifier gain is a function of the output voltage.
The disadvantage of the conventional LDO architecture is that
the output voltage noise is proportional to the output voltage.
The open-drain output is held low when the ADP7102 has
sufficient input voltage to turn on the internal PG transistor.
The PG transistor is terminated via a pull-up resistor to VOUT
or VIN.
The adjustable LDO circuit may be modified slightly to
reduce the output voltage noise to levels close to that of the
fixed output ADP7102. The circuit shown in Figure 70 adds
two additional components to the output voltage setting resistor
divider. CNR and RNR are added in parallel with RFB1 to reduce
the ac gain of the error amplifier. RNR is chosen to be equal to
Power-good accuracy is 93.5% of the nominal regulator output
voltage when this voltage is rising, with a 90% trip point when
this voltage is falling. Regulator input voltage brownouts or
glitches trigger power no good signals if VOUT falls below 90%.
RFB2; this limits the ac gain of the error amplifier to approxi-
A normal power-down causes the power good signal to go low
when VOUT drops below 90%.
mately 6 dB. The actual gain is the parallel combination of RNR
and RFB1, divided by RFB2. This ensures that the error amplifier
always operates at greater than unity gain.
Figure 68 and Figure 69 show the typical power good rising and
falling threshold over temperature.
C
NR is chosen by setting the reactance of CNR equal to RFB1
−
6
RNR at a frequency between 50 Hz and 100 Hz. This sets the
PG –40°C
PG –5°C
PG +25°C
frequency where the ac gain of the error amplifier is 3 dB
down from its dc gain.
5
4
3
2
1
0
PG +85°C
PG +125°C
VOUT = 5V
COUT
1µF
VIN
VOUT
VIN = 8V
R
+
+
CIN
1µF
FB1
+
C
NR
40.2kΩ
100nF
ADJ
R
13kΩ
NR
ON
100kΩ
100kΩ
R
13kΩ
EN/
UVLO
100kΩ
OFF
FB2
PG
PG
GND
Figure 70. Noise Reduction Modification to Adjustable LDO
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
The noise of the LDO is approximately the noise of the fixed
output LDO (typically 15 µV rms) times the square root of the
parallel combination of RNR and RFB1 divided by RFB2. Based on
the component values shown in Figure 70, the ADP7102 has the
following characteristics:
V
(V)
OUT
Figure 68. Typical Power Good Threshold vs. Temperature, VOUT Rising
6
PG –40°C
PG –5°C
PG +25°C
PG +85°C
5
4
3
2
1
0
PG +125°C
•
•
•
•
•
DC gain of 4.09 (12.2 dB)
3 dB roll off frequency of 59 Hz
High frequency ac gain of 1.82 (5.19 dB)
Noise reduction factor of 1.35 (2.59 dB)
RMS noise of the adjustable LDO without noise reduction
of 27.8 µV rms
•
RMS noise of the adjustable LDO with noise reduc-
tion (assuming 15 µV rms for fixed voltage option) of
20.25 µV rms
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
V
(V)
OUT
Figure 69. Typical Power Good Threshold vs. Temperature, VOUT Falling
Rev. A | Page 20 of 28
Data Sheet
ADP7102
To guarantee reliable operation, the junction temperature
CURRENT LIMIT AND THERMAL OVERLOAD
PROTECTION
of the ADP7102 must not exceed 125°C. To ensure that the
junction temperature stays below this maximum value, the
user must be aware of the parameters that contribute to
junction temperature changes. These parameters include
ambient temperature, power dissipation in the power device,
and thermal resistances between the junction and ambient air
(θJA). The θJA number is dependent on the package assembly
compounds that are used and the amount of copper used to
solder the package GND pins to the PCB.
The ADP7102 is protected against damage due to excessive
power dissipation by current and thermal overload protection
circuits. The ADP7102 is designed to current limit when the
output load reaches 400 mA (typical). When the output load
exceeds 400 mA, the output voltage is reduced to maintain a
constant current limit.
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and/or
high power dissipation) when the junction temperature starts to
rise above 150°C, the output is turned off, reducing the output
current to zero. When the junction temperature drops below
135°C, the output is turned on again, and output current is
restored to its operating value.
Table 6 shows typical θJA values of the 8-lead SOIC and 8-lead
LFCSP packages for various PCB copper sizes. Table 7 shows
the typical ΨJB values of the 8-lead SOIC and 8-lead LFCSP.
Table 6. Typical θJA Values
θ
JA (°C/W)
SOIC
167.8
111
Copper Size (mm2)
251
100
500
LFCSP
165.1
125.8
68.1
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP7102 current limits, so that only 400 mA is
conducted into the short. If self heating of the junction is great
enough to cause its temperature to rise above 150°C, thermal
shutdown activates, turning off the output and reducing the
output current to zero. As the junction temperature cools and
drops below 135°C, the output turns on and conducts 400 mA
into the short, again causing the junction temperature to rise
above 150°C. This thermal oscillation between 135°C and
150°C causes a current oscillation between 400 mA and 0 mA
that continues as long as the short remains at the output.
65.9
1000
6400
56.4
42.1
56.1
45.8
1 Device soldered to minimum size pin traces.
Table 7. Typical ΨJB Values
Model
LFCSP
SOIC
ΨJB (°C/W)
15.1
31.3
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so the junction temperature does not exceed 125°C.
The junction temperature of the ADP7102 is calculated from
the following equation:
TJ = TA + (PD × θJA)
(2)
(3)
where:
THERMAL CONSIDERATIONS
TA is the ambient temperature.
PD is the power dissipation in the die, given by
In applications with low input-to-output voltage differential,
the ADP7102 does not dissipate much heat. However, in
applications with high ambient temperature and/or high
input voltage, the heat dissipated in the package may become
large enough that it causes the junction temperature of the
die to exceed the maximum junction temperature of 125°C.
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND
where:
)
I
LOAD is the load current.
IGND is the ground current.
VIN and VOUT are input and output voltages, respectively.
When the junction temperature exceeds 150°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 135°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the tempera-
ture rise of the package due to the power dissipation, as shown
in Equation 2.
Power dissipation due to ground current is quite small and
can be ignored. Therefore, the junction temperature equation
simplifies to the following:
TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA}
(4)
As shown in Equation 4, for a given ambient temperature,
input-to-output voltage differential, and continuous load
current, there exists a minimum copper size requirement for
the PCB to ensure that the junction temperature does not rise
above 125°C. Figure 71 to Figure 78 show junction temperature
calculations for different ambient temperatures, power dissipa-
tion, and areas of PCB copper.
Rev. A | Page 21 of 28
ADP7102
Data Sheet
145
135
125
115
105
95
145
135
125
115
105
95
85
85
75
75
65
65
55
55
2
2
45
6400mm
6400mm
45
2
2
500mm
500mm
2
2
35
25mm
25mm
35
T
MAX
T
MAX
J
J
25
25
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
TOTAL POWER DISSIPATION (W)
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
TOTAL POWER DISSIPATION (W)
Figure 71. LFCSP, TA = 25°C
Figure 74. SOIC, TA = 25°C
140
130
120
110
100
90
140
130
120
100
110
90
80
80
70
70
2
2
6400mm
6400mm
2
2
500mm
500mm
60
60
2
2
25mm
J
25mm
J
T
MAX
T
MAX
50
50
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
TOTAL POWER DISSIPATION (W)
TOTAL POWER DISSIPATION (W)
Figure 75. SOIC, TA = 50°C
Figure 72. LFCSP, TA = 50°C
145
135
125
115
105
95
145
135
125
115
105
95
85
85
2
2
6400mm
6400mm
2
2
75
500mm
500mm
75
2
2
25mm
J
25mm
J
T
MAX
T
MAX
65
65
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TOTAL POWER DISSIPATION (W)
TOTAL POWER DISSIPATION (W)
Figure 73. LFCSP, TA = 85°C
Figure 76. SOIC, TA = 85°C
Rev. A | Page 22 of 28
Data Sheet
ADP7102
140
120
100
80
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise (see Figure 77 and Figure 78).
Maximum junction temperature (TJ) is calculated from
the board temperature (TB) and power dissipation (PD)
using the following formula:
60
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP
40
package and 31.3°C/W for the 8-lead SOIC package.
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
20
140
T
MAX
J
0
120
100
80
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TOTAL POWER DISSIPATION (W)
Figure 78. SOIC
60
40
TB = 25°C
TB = 50°C
20
TB = 65°C
TB = 85°C
T
MAX
J
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
TOTAL POWER DISSIPATION (W)
Figure 77. LFCSP
Rev. A | Page 23 of 28
ADP7102
Data Sheet
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP7102. However, as listed in Table 6, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0805 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
Figure 80. Example SOIC PCB Layout
Figure 79. Example LFCSP PCB Layout
Rev. A | Page 24 of 28
Data Sheet
ADP7102
OUTLINE DIMENSIONS
2.48
2.38
2.23
3.00
BSC SQ
5
8
EXPOSED
PAD
1.74
1.64
1.49
0.50
0.40
0.30
4
1
INDEX
AREA
PIN 1
INDICATOR
(R 0.2)
TOP VIEW
BOTTOM VIEW
0.80 MAX
0.55 NOM
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.30
0.25
0.18
0.20 REF
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
Figure 81. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-5)
Dimensions shown in millimeters
5.00
4.90
4.80
3.098
0.356
5
6.20
6.00
5.80
8
4.00
3.90
3.80
2.41
0.457
4
1
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
BOTTOM VIEW
45°
1.27 BSC
3.81 REF
TOP VIEW
SECTION OF THIS DATA SHEET.
1.65
1.25
1.75
1.35
0.50
0.25
0.25
0.17
0.10 MAX
0.05 NOM
SEATING
PLANE
8°
0°
0.51
0.31
1.04 REF
COPLANARITY
0.10
1.27
0.40
COMPLIANT TO JEDEC STANDARDS MS-012-AA
Figure 82. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
Narrow Body
(RD-8-2)
Dimensions shown in millimeters
Rev. A | Page 25 of 28
ADP7102
Data Sheet
ORDERING GUIDE
Temperature
Range
Output
Package
Description
Package
Option
Model1
Voltage (V)2, 3
Branding
LHO
LJV
LJW
LJZ
LKO
LK1
LK2
ADP7102ACPZ-R7
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Adjustable
1.5
1.8
2.5
3.0
3.3
5
9
LFCSP_WD
LFCSP_WD
LFCSP_WD
LFCSP_WD
LFCSP_WD
LFCSP_WD
LFCSP_WD
LFCSP_WD
SOIC_N_EP
SOIC_N_EP
SOIC_N_EP
SOIC_N_EP
SOIC_N_EP
SOIC_N_EP
SOIC_N_EP
SOIC_N_EP
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
CP-8-5
RD-8-2
RD-8-2
RD-8-2
RD-8-2
RD-8-2
RD-8-2
RD-8-2
RD-8-2
ADP7102ACPZ-1.5-R7
ADP7102ACPZ-1.8-R7
ADP7102ACPZ-2.5-R7
ADP7102ACPZ-3.0-R7
ADP7102ACPZ-3.3-R7
ADP7102ACPZ-5.0-R7
ADP7102ACPZ-9.0-R7
ADP7102ARDZ-R7
ADP7102ARDZ-1.5-R7
ADP7102ARDZ-1.8-R7
ADP7102ARDZ-2.5-R7
ADP7102ARDZ-3.0-R7
ADP7102ARDZ-3.3-R7
ADP7102ARDZ-5.0-R7
ADP7102ARDZ-9.0-R7
ADP7102CP-EVALZ
ADP7102RD-EVALZ
ADP7102CPZ-REDYKIT
ADP7102RDZ-REDYKIT
LLC
Adjustable
1.5
1.8
2.5
3.0
3.3
5
9
3.3
3.3
LFCSP Evaluation Board
SOIC Evaluation Board
LFCSP REDYKIT
SOIC REDYKIT
1 Z = RoHS Compliant Part.
2 For additional voltage options, contact a local Analog Devices, Inc., sales or distribution representative.
3 The ADP7102CP-EVALZ and ADP7102RD-EVALZ evaluation boards are preconfigured with a 3.3 V ADP7102.
Rev. A | Page 26 of 28
Data Sheet
NOTES
ADP7102
Rev. A | Page 27 of 28
ADP7102
NOTES
Data Sheet
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09506-0-11/11(A)
Rev. A | Page 28 of 28
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