ADSP-BF544 [ADI]

Embedded Processor; 嵌入式处理器
ADSP-BF544
型号: ADSP-BF544
厂家: ADI    ADI
描述:

Embedded Processor
嵌入式处理器

文件: 总82页 (文件大小:1486K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Blackfin®  
Embedded Processor  
Preliminary Technical Data  
ADSP-BF542/BF544/BF547/BF548/BF549  
FEATURES  
PERIPHERALS  
Up to 600 MHz High-Performance Blackfin Processor  
High-Speed USB On-the-Go (OTG) with Integrated PHY  
Two 16-Bit MACs, Two 40-Bit ALUs, Four 8-Bit Video ALUs  
RISC-Like Register and Instruction Model  
SD/SDIO Controller  
ATA/ATAPI-6 Controller  
0.9 V to 1.3 V Core VDD with On-chip Voltage Regulation  
2.5 V and 3.3 V-Tolerant I/O with Specific 5V-Tolerant Pins  
400-ball Lead-Free mBGA and 360-ball Lead-Free pBGA pack-  
age options.  
Up to four Synchronous Serial Ports (SPORTs)  
Up to three Serial Peripheral Interfaces (SPI-Compatible)  
Up to four UARTs, two with Automatic Hardware Flow  
Control  
Up to two CAN (Controller Area Network) 2.0B Interfaces  
Up to two TWI (Two-Wire Interface) Controllers  
8- or 16-Bit Asynchronous Host DMA Interface  
Multiple Enhanced Parallel Peripheral Interfaces (EPPIs), Sup-  
porting ITU-R BT.656 Video Formats and 18/24-bit LCD  
Connections  
MEMORY  
Up to 324K bytes of on-chip memory comprised of:  
Instruction SRAM/cache; instruction SRAM;  
data SRAM/cache; additional dedicated data SRAM;  
scratchpad SRAM (see Table 1 on Page 3 for available  
memory configurations  
External Sync Memory Controller Supporting  
DDR/Mobile DDR SDRAM  
External Async Memory Controller Supporting 8/16 bit Async  
Memories and Burst Flash Devices  
Media Transceiver (MXVR) for connection to a MOST®  
Network  
Pixel Compositor for overlays, alpha blending, and color  
conversion  
Up to eleven 32-Bit Timers/Counters with PWM Support  
Real-Time Clock (RTC) and Watchdog Timer  
Up/Down Counter With Support for Rotary Encoder  
Up to 152 General Purpose I/O (GPIOs)  
On-Chip PLL Capable of 0.5x to 64x Frequency Multiplication  
Debug/JTAG Interface  
NAND Flash Controller  
Four Memory-to-Memory DMA pairs, two with ext. requests  
Memory Management Unit Providing Memory Protection  
Flexible Booting Options  
Code Security with LockboxTM Secure Technology  
One-Time-Programmable (OTP) Memory  
VOLTAGE  
REGULATOR  
JTAG TEST AND  
EMULATION  
WATCHDOG  
TIMER  
CAN (0-1)  
RTC  
OTP  
TWI (0-1)  
HOST DMA  
UART (0-1)  
UART (2-3)  
SPI (0-1)  
PAB 16  
TIMERS(0-10)  
INTERRUPTS  
B
COUNTER  
KEYPAD  
L2  
SRAM  
L1  
INSTR ROM  
L1  
L1  
INSTR SRAM  
DATA SRAM  
SPI (2)  
32-BIT DMA  
16-BIT DMA  
MXVR  
DAB1 32  
DAB0 16  
DCB 32  
EAB 64  
DEB 32  
SPORT (2-3)  
SPORT (0-1)  
SD / SDIO  
USB  
BOOT  
ROM  
EXTERNAL PORT  
NOR, DDR1 CONTROL  
ATAPI  
EPPI (0-2)  
DDR1  
16  
ASYNC  
16  
NAND FLASH  
CONTRLOLLER  
PIXEL  
COMPOSITOR  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Figure 1. ADSP-BF549 Functional Block Diagram  
Rev. PrG  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O.Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel:781/329-4700  
Fax:781/461-3113  
www.analog.com  
© 2007 Analog Devices, Inc. All rights reserved.  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
TABLE OF CONTENTS  
General Description ................................................. 3  
Low-Power Architecture ......................................... 4  
System Integration ................................................ 4  
ADSP-BF542/4/7/8/9 Processor Peripherals ................ 4  
Blackfin Processor Core .......................................... 4  
Memory Architecture ............................................ 5  
DMA Controllers ................................................ 10  
Real-Time Clock ................................................. 11  
Watchdog Timer ................................................ 12  
Timers ............................................................. 12  
Up/Down Counter and Thumbwheel Interface .......... 12  
Serial Ports (SPORTs) .......................................... 12  
Serial Peripheral Interface (SPI) Ports ...................... 13  
UART Ports (UARTs) .......................................... 13  
Controller Area Network (CAN) ............................ 13  
TWI Controller Interface ...................................... 14  
Ports ................................................................ 14  
Pixel Compositor (PIXC) ...................................... 14  
Enhanced Parallel Peripheral Interface (EPPI) ........... 14  
USB On-The-Go Dual-Role Device Controller ........... 15  
ATA/ATAPI–6 Interface ...................................... 15  
Keypad Interface ................................................. 15  
Secure Digital (SD)/SDIO Controller ....................... 15  
Code Security .................................................... 15  
Media Transceiver Mac Layer (MXVR) .................... 16  
Dynamic Power Management ................................ 16  
Voltage Regulation .............................................. 17  
Clock Signals ...................................................... 17  
Booting Modes ................................................... 19  
Instruction Set Description .................................... 22  
Development Tools .............................................. 22  
Designing an Emulator-Compatible Processor Board  
(Target) ......................................................... 22  
Related Documents .............................................. 22  
Pin Descriptions .................................................... 23  
Specifications ........................................................ 32  
Operating Conditions ........................................... 32  
Electrical Characteristics ....................................... 34  
ESD Sensitivity ................................................... 34  
Absolute Maximum Ratings ................................... 35  
Package Information ............................................ 35  
Timing Specifications ........................................... 36  
Power Dissipation ............................................... 64  
Test Conditions .................................................. 64  
Environmental Conditions .................................... 65  
400-Ball CSP_BGA PACKAGE .................................. 67  
360-Ball pBGA PACKAGE ....................................... 73  
Outline Dimensions ................................................ 79  
Surface Mount Design .......................................... 81  
Ordering Guide ..................................................... 82  
REVISION HISTORY  
Revision PrG: Corrections and additions to PrF:  
• Addition of DDR and Mobile DDR Timing parameters.  
Rev. PrG  
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Page 2 of 82  
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December 2007  
Preliminary Technical Data  
GENERAL DESCRIPTION  
The ADSP-BF542/4/7/8/9 processors are members of the Black-  
fin family of products, incorporating the Analog Devices/Intel  
Micro Signal Architecture (MSA). Blackfin processors combine  
a dual-MAC state-of-the-art signal processing engine, the  
advantages of a clean, orthogonal RISC-like microprocessor  
instruction set, and single-instruction, multiple-data (SIMD)  
multimedia capabilities into a single instruction-set  
architecture.  
ADSP-BF542/4/7/8/9  
Specific peripherals for ADSP-BF542/4/7/8/9 processors are  
shown in Table 2.  
Table 2. ADSP-BF54x Specific Peripherals for Processors  
Module  
Specific performance and memory configurations for  
ADSP-BF542/4/7/8/9 processors are shown in Table 1.  
EBIU (async)  
NAND Flash Controller  
ATAPI  
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Table 1. ADSP-BF542/4/7/8/9 Processor Features  
Processor  
Features  
Host DMA Port (HOSTDP)  
SD/SDIO Controller  
EPPI0  
3
3
3
3
3
LockboxTM Code Security  
SD/SDIO Controller  
Pixel Compositor  
18- or 24-bit EPPI0 with LCD  
16-bit EPPI1, 8-bit EPPI2  
Host DMA Port  
NAND Flash Controller  
ATAPI  
1
1
1
1
1
1
1
1
1
1
1
2
2
3
4
4
1
1
1
1
1
1
1
1
1
1
1
2
2
3
4
4
1
1
1
1
1
1
1
1
1
1
1
2
3
4
4
1
1
1
1
1
1
1
2
2
2
3
3
1
1
1
1
1
1
1
1
1
1
1
2
3
3
1
8
EPPI1  
3
3
EPPI2  
SPORT0  
SPORT1  
3
3
3
3
3
3
3
3
3
3
SPORT2  
SPORT3  
SPI0  
SPI1  
SPI2  
High Speed USB OTG  
Keypad Interface  
MXVR  
UART0  
3
3
3
3
UART1  
CAN ports1  
UART2  
UART3  
3
3
3
3
TWI ports  
High Speed USB OTG  
CAN01  
CAN11  
SPI ports  
3
3
3
3
3
3
3
UART ports  
SPORTs  
TWI0  
3
3
3
3
3
3
3
Up / Down Counter  
Timers  
TWI1  
11 11 11 11  
152 152 152 152 152  
Timer 0-7  
Timer 8-10  
Up / Down Counter  
Keypad Interface  
MXVR  
3
General-purpose I/O pins  
Memory  
Configura-  
tions  
L1 Instruction SRAM/Cache 16 16 16 16 16  
3
3
L1 Instruction SRAM  
L1 Data SRAM/Cache  
L1 Data SRAM  
L1 Scratchpad SRAM  
L1 ROM2  
48 48 48 48 48  
32 32 32 32 32  
32 32 32 32 32  
(K Bytes)  
GPIOs  
3
3
3
3
4
4
4
4
4
1 CAN on the ADSP-BF544 and ADSP-BF542 is only available on automotive  
grade devices.  
64 64 64 64 64  
L2  
128 128 128 64  
4
L3 Boot ROM2  
4
4
4
4
Maximum Core Instruction Rate (MHz) 533 600 600 533 600  
1 Automotive Only.  
2 This ROM is not customer configurable.  
Rev. PrG  
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Page 3 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
The ADSP-BF542/4/7/8/9 processors are completely code and  
pin compatible. They differ only with respect to their perfor-  
mance, on-chip memory, and selection of I/O peripherals.  
Specific performance, memory, and feature configurations, are  
shown in Table 1.  
memory spaces, including external DDR and asynchronous  
memory. Multiple on-chip buses running at up to 133 MHz  
provide enough bandwidth to keep the processor core running  
along with activity on all of the on-chip and external  
peripherals.  
By integrating a rich set of industry-leading system peripherals  
and memory, Blackfin processors are the platform of choice for  
next-generation applications that require RISC-like program-  
mability, multimedia support and leading-edge signal  
processing in one integrated package.  
The ADSP-BF542/4/7/8/9 processor includes an on-chip volt-  
age regulator in support of the ADSP-BF542/4/7/8/9 processor  
dynamic power management capability. The voltage regulator  
provides a range of core voltage levels when supplied from a sin-  
gle 2.70 V to 3.6 V input. The voltage regulator can be bypassed  
at the user's discretion.  
LOW-POWER ARCHITECTURE  
BLACKFIN PROCESSOR CORE  
Blackfin processors provide world-class power management  
and performance. Blackfin processors are designed in a low  
power and low voltage design methodology and feature on-chip  
dynamic power management, the ability to vary both the voltage  
and frequency of operation to significantly lower overall power  
consumption. Varying the voltage and frequency can result in a  
substantial reduction in power consumption, compared with  
just varying the frequency of operation. This translates into  
longer battery life for portable appliances.  
As shown in Figure 2 on Page 5, the Blackfin processor core  
contains two 16-bit multipliers, two 40-bit accumulators, two  
40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu-  
tation units process 8-bit, 16-bit, or 32-bit data from the register  
file.  
The compute register file contains eight 32-bit registers. When  
performing compute operations on 16-bit operand data, the  
register file operates as 16 independent 16-bit registers. All  
operands for compute operations come from the multiported  
register file and instruction constant fields.  
SYSTEM INTEGRATION  
The ADSP-BF542/4/7/8/9 processors are highly integrated sys-  
tem-on-a-chip solutions for the next generation of embedded  
network connected applications. By combining industry-stan-  
dard interfaces with a high performance signal processing core,  
users can develop cost-effective solutions quickly without the  
need for costly external components. The system peripherals  
include a high speed USB OTG (On-The-Go) controller with  
integrated PHY, CAN 2.0B controllers, TWI controllers, UART  
ports, SPI ports, serial ports (SPORTs), ATAPI controller,  
SD/SDIO controller, a real-time clock, a watchdog timer, LCD  
controller, and multiple enhanced parallel peripheral interfaces.  
Each MAC can perform a 16-bit by 16-bit multiply in each  
cycle, accumulating the results into the 40-bit accumulators.  
Signed and unsigned formats, rounding, and saturation are  
supported.  
The ALUs perform a traditional set of arithmetic and logical  
operations on 16-bit or 32-bit data. In addition, many special  
instructions are included to accelerate various signal processing  
tasks. These include bit operations such as field extract and pop-  
ulation count, modulo 232 multiply, divide primitives, saturation  
and rounding, and sign/exponent detection. The set of video  
instructions include byte alignment and packing operations, 16-  
bit and 8-bit adds with clipping, 8-bit average operations, and 8-  
bit subtract/absolute value/accumulate (SAA) operations. Also  
provided are the compare/select and vector search instructions.  
ADSP-BF542/4/7/8/9 PROCESSOR PERIPHERALS  
The ADSP-BF542/4/7/8/9 processor contains a rich set of  
peripherals connected to the core via several high bandwidth  
buses, providing flexibility in system configuration as well as  
excellent overall system performance (see Figure 1 on Page 1).  
The general-purpose peripherals include functions such as  
UARTs, SPI, TWI, timers with pulse width modulation (PWM)  
and pulse measurement capability, general purpose I/O pins, a  
real-time clock, and a watchdog timer. This set of functions sat-  
isfies a wide variety of typical system support needs and is  
augmented by the system expansion capabilities of the part. The  
ADSP-BF542/4/7/8/9 processor contains dedicated network  
communication modules and high-speed serial and parallel  
ports, an interrupt controller for flexible management of inter-  
rupts from the on-chip peripherals or external sources, and  
power management control functions to tailor the performance  
and power characteristics of the processor and system to many  
application scenarios.  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). By also using the second  
ALU, quad 16-bit operations are possible.  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
indirect conditional jumps (with static branch prediction), and  
subroutine calls. Hardware is provided to support zero-over-  
head looping. The architecture is fully interlocked, meaning that  
the programmer need not manage the pipeline when executing  
instructions with data dependencies.  
All of the peripherals, except for general-purpose I/O, CAN,  
TWI, real-time clock, and timers, are supported by a flexible  
DMA structure. There are also separate memory DMA channels  
dedicated to data transfers between the processor's various  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
Rev. PrG  
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Page 4 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
length, and base registers (for circular buffering), and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. The two data memories hold  
data, and a dedicated scratchpad data memory stores stack and  
local variable information.  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
In addition, multiple L1 memory blocks are provided, offering a  
configurable mix of SRAM and cache. The memory manage-  
ment unit (MMU) provides memory protection for individual  
tasks that may be operating on the core and can protect system  
registers from unintended access.  
The Blackfin processor assembly language uses an algebraic syn-  
tax for ease of coding and readability. The architecture has been  
optimized for use in conjunction with the C/C++ compiler,  
resulting in fast and efficient software implementations.  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
P5  
P4  
P3  
P2  
P1  
P0  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG1  
DAG0  
DA1 32  
DA0 32  
32  
PREG  
32  
RAB  
SD 32  
LD1 32  
LD0 32  
ASTAT  
32  
32  
SEQUENCER  
ALIGN  
R7.H  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R7.L  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.L  
R0.L  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
resources, including internal memory, external memory, and  
I/O control registers, occupy separate sections of this common  
address space. The memory portions of this address space are  
MEMORY ARCHITECTURE  
The ADSP-BF542/4/7/8/9 processor views memory as a single  
unified 4G byte address space, using 32-bit addresses. All  
Rev. PrG  
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Page 5 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
arranged in a hierarchical structure to provide a good cost/per-  
formance balance of some very fast, low-latency on-chip  
memory as cache or SRAM, and larger, lower-cost and perfor-  
mance off-chip memory systems. See Figure 3 on Page 6.  
0xFFFF FFFF  
The on-chip L1 memory system is the highest-performance  
memory available to the Blackfin processor. The off-chip mem-  
ory system, accessed through the external bus interface unit  
(EBIU), provides expansion with flash memory, SRAM, and  
double-rate SDRAM (DDR1), optionally accessing up to  
516M bytes of physical memory.  
CORE MMR REGISTERS (2M BYTE)  
0xFFE0 0000  
0xFFC0 0000  
SYSTEM MMR REGISTERS (2M BYTE)  
RESERVED  
0xFFB0 1000  
0xFFB0 0000  
SCRATCHPAD SRAM (4K BYTE)  
RESERVED  
0xFFA2 4000  
0xFFA1 4000  
Most of the ADSP-BF542/4/7/8/9 processors also include an L2  
SRAM memory array which provides up to 128K bytes of high  
speed SRAM operating at one half the frequency of the core, and  
slightly longer latency than the L1 memory banks (For informa-  
tion on L2 memory in each processor, see Table 1.) The L2  
memory is a unified instruction and data memory and can hold  
any mixture of code and data required by the system design.  
The Blackfin cores share a dedicated low latency 64-bit wide  
data path port into the L2 SRAM memory.  
L1 ROM (64K BYTE)  
INSTRUCTION SRAM / CACHE (16K BYTE)  
RESERVED  
0xFFA1 0000  
0xFFA0 C000  
INSTRUCTION BANK B SRAM (16K BYTE)  
0xFFA0 8000  
INSTRUCTION BANK A SRAM (32K BYTE)  
RESERVED  
0xFFA0 0000  
0xFF90 8000  
DATA BANK B SRAM / CACHE (16K BYTE)  
DATA BANK B SRAM (16K BYTE)  
0xFF90 4000  
The memory DMA controllers (DMAC1 and DMAC0) pro-  
vides high-bandwidth data-movement capability. They can  
perform block transfers of code or data between the internal  
memory and the external memory spaces.  
0xFF90 0000  
0xFF80 8000  
0xFF80 4000  
RESERVED  
DATA BANK A SRAM / CACHE (16K BYTE)  
DATA BANK A SRAM (16K BYTE)  
RESERVED  
0xFF80 0000  
0xFEB2 0000  
L2 SRAM (128K BYTE)  
0xFEB0 0000  
0xEF00 1000  
0xEF00 0000  
RESERVED  
BOOT ROM (4K BYTE)  
RESERVED  
0x3000 0000  
0x2C00 0000  
ASYNC MEMORY BANK 3 (64M BYTE)  
ASYNC MEMORY BANK 2 (64M BYTE)  
0x2800 0000  
0x2400 0000  
ASYNC MEMORY BANK 1 (64M BYTE)  
ASYNC MEMORY BANK 0 (64M BYTE)  
0x2000 0000  
RESERVED  
TOP OF LAST  
DDR PAGE  
DDR1 MEM BANK 1 (8M BYTE 256M BYTE)  
DDR1 MEM BANK 0 (8M BYTE 256M BYTE)  
0x0000 0000  
Figure 3. ADSP-BF547BF548/BF549 Internal/External Memory Map1  
1
This memory map applies to all ADSP-BF542/4/7/8/9 processors, except for L2  
memory population. ADSP-BF544 includes 64K Byte of L2 memory: 0xFEB0  
0000 - 0xFEB0 FFFF. ADSP-BF542 includes no L2 memory. See also Table 1.  
Internal (On-Chip) Memory  
The ADSP-BF542/4/7/8/9 processor has several blocks of on-  
chip memory providing high-bandwidth access to the core.  
The first block is the L1 instruction memory, consisting of  
48K bytes SRAM, and also 16K bytes that can be configured as a  
four-way set-associative cache or SRAM. This memory is  
accessed at full processor speed.  
The second on-chip memory block is the L1 data memory, con-  
sisting of 64K bytes SRAM, of which 32K bytes can be  
configured as a two-way set associative cache. This memory  
block is accessed at full processor speed.  
Rev. PrG  
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Page 6 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
The third memory block is a 4K byte scratchpad SRAM which  
runs at the same speed as the L1 memories, but is only accessible  
as data SRAM and cannot be configured as cache memory.  
Another common use of NAND flash is for storage of multime-  
dia files or other large data segments. In this case, a software file  
system may be used to manage reading and writing of the  
NAND flash device. The file system selects memory segments  
for storage with the goal of avoiding bad blocks and equally dis-  
tributing memory accesses across all address locations.  
Hardware features of the NFC include:  
The fourth memory block is the factory programmed L1  
instruction ROM, operating at full processor speed. This ROM  
is not customer configurable.  
The fifth memory block is the L2 SRAM, providing 128K bytes  
of unified instruction and data memory, operating at one half  
the frequency of the core.  
• Support for page program, page read, and block erase of  
NAND flash devices, with accesses aligned to page  
boundaries.  
Finally, there is a 4K boot ROM connected as L3 memory. It  
operates at full SCLK rate.  
• Error checking and correction (ECC) hardware that facili-  
tates error detection and correction.  
External (Off-Chip) Memory  
• A single 8-bit or 16-bit external bus interface for com-  
mands, addresses and data.  
Through the External Bus Interface Unit (EBIU) the  
ADSP-BF542/4/7/8/9 processors provide glueless connectivity  
to external 16-bit wide memories, such as DDR SDRAM,  
Mobile DDR, SRAM, NOR flash, NAND flash, and FIFO  
devices. To provide the best performance, the bus system of the  
DDR interface is completely separate from the other parallel  
interfaces.  
• Support for SLC (single level cell) NAND flash devices  
unlimited in size, with page sizes of 256 and 512 bytes.  
Larger page sizes can be supported in software.  
• Capability of releasing external bus interface pins during  
long accesses.  
• Support for internal bus requests of 16 or 32 bits.  
The DDR/Mobile DDR memory controller can gluelessly man-  
age up to two banks of double-rate synchronous dynamic  
memory (DDR1 SDRAM). The 16-bit wide interface operates at  
SCLK frequency, enabling maximum throughput of 532  
Mbyte/s. The DDR controller is augmented with a queuing  
mechanism that performs efficient bursts into the DDR. The  
controller is an industry standard DDR1 SDRAM controller  
with each bank supporting from 64 Mbit to 512 Mbit device  
sizes and 4-, 8-, or 16-bit widths. The controller supports up to  
256 Mbytes per external bank. With 2 external banks, the con-  
troller supports up to 512 Mbytes total. Each bank is  
independently programmable and is contiguous with adjacent  
banks regardless of the sizes of the different banks or their  
placement.  
• DMA engine to transfer data between internal memory and  
NAND flash device.  
One-time-Programmable Memory  
The ADSP-BF542/4/7/8/9 has 64K bits of one-time program-  
mable (OTP) non-volatile memory that can be programmed by  
the developer only one time. It includes the array and logic to  
support read access and programming. Additionally, its pages  
can be write protected.  
OTP enables developers to store both public and private data  
on-chip. In addition to storing public and private key data for  
applications requiring security, it also allows developers to store  
completely user-definable data such as customer ID, product  
ID, MAC address, etc. Hence generic parts can be shipped  
which are then programmed and protected by the developer  
within this non-volatile memory.  
Traditional 16-bit asynchronous memories, such as SRAM,  
EPROM, and flash devices, can be connected to one of the four  
64 MByte asynchronous memory banks, represented by four  
memory select strobes. Alternatively, these strobes can function  
as bank-specific read or write strobes preventing further glue  
logic when connecting to asynchronous FIFO devices.  
I/O Memory Space  
The ADSP-BF542/4/7/8/9 processors do not define a separate  
I/O space. All resources are mapped through the flat 32-bit  
address space. On-chip I/O devices have their control registers  
mapped into memory-mapped registers (MMRs) at addresses  
near the top of the 4G byte address space. These are separated  
into two smaller blocks, one which contains the control MMRs  
for all core functions, and the other which contains the registers  
needed for setup and control of the on-chip peripherals outside  
of the core. The MMRs are accessible only in supervisor mode  
and appear as reserved space to on-chip peripherals.  
In addition, the external bus can connect to advanced flash  
device technologies, such as:  
• Page-mode NOR flash devices  
• Synchronous burst-mode NOR flash devices  
• NAND flash devices  
NAND Flash Controller (NFC)  
The ADSP-BF542/4/7/8/9 provides a NAND Flash Controller  
(NFC) as part of the external bus interface. NAND flash devices  
provide high-density, low-cost memory. However, NAND flash  
devices also have long random access times, invalid blocks, and  
lower reliability over device lifetimes. Because of this, NAND  
flash is often used for read-only code storage. In this case, all  
DSP code can be stored in NAND flash and then transferred to a  
faster memory (such as DDR or SRAM) before execution.  
Booting  
The ADSP-BF542/4/7/8/9 processor contains a small on-chip  
boot kernel, which configures the appropriate peripheral for  
booting. If the ADSP-BF542/4/7/8/9 processor is configured to  
Rev. PrG  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
boot from boot ROM memory space, the processor starts exe-  
cuting from the on-chip boot ROM. For more information, see  
Booting Modes on Page 19.  
Table 3. Core Event Controller (CEC)  
Priority  
Event Class  
EVT Entry  
(0 is Highest)  
Event Handling  
0
Emulation/Test Control EMU  
Reset RST  
Non-Maskable Interrupt NMI  
The event controller on the ADSP-BF542/4/7/8/9 processor  
handles all asynchronous and synchronous events to the proces-  
sor. The ADSP-BF542/4/7/8/9 processor provides event  
handling that supports both nesting and prioritization. Nesting  
allows multiple event service routines to be active simulta-  
neously. Prioritization ensures that servicing of a higher-  
priority event takes precedence over servicing of a lower-prior-  
ity event. The controller provides support for five different types  
of events:  
1
2
3
Exception  
EVX  
4
Reserved  
5
Hardware Error  
IVHW  
IVTMR  
IVG7  
6
Core Timer  
7
General Interrupt 7  
General Interrupt 8  
General Interrupt 9  
General Interrupt 10  
General Interrupt 11  
General Interrupt 12  
General Interrupt 13  
General Interrupt 14  
General Interrupt 15  
8
IVG8  
• Emulation. An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
9
IVG9  
10  
11  
12  
13  
14  
15  
IVG10  
IVG11  
IVG12  
IVG13  
IVG14  
IVG15  
• Reset. This event resets the processor.  
• Non-Maskable Interrupt (NMI). The NMI event can be  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut-  
down of the system.  
Although the ADSP-BF542/4/7/8/9 processor provides a default  
mapping, the user can alter the mappings and priorities of  
interrupt events by writing the appropriate values into the inter-  
rupt assignment registers (IAR). Table 4 describes the inputs  
into the SIC and the default mappings into the CEC.  
• Exceptions. Events that occur synchronously to program  
flow (that is, the exception is taken before the instruction is  
allowed to complete). Conditions such as data alignment  
violations and undefined instructions cause exceptions.  
• Interrupts. Events that occur asynchronously to program  
flow. They are caused by input pins, timers, and other  
peripherals, as well as by an explicit software instruction.  
Table 4. System Interrupt Controller (SIC)  
Peripheral IRQ  
(IRQ) Source  
IRQ  
GP IRQ  
Core  
Each event type has an associated register to hold the return  
address and an associated return-from-event instruction. When  
an event is triggered, the state of the processor is saved on the  
supervisor stack.  
ID (at Reset) IRQ ID  
PLL Wakeup IRQ  
0
1
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG8  
IVG8  
IVG9  
IVG9  
IVG9  
IVG9  
IVG10  
IVG10  
IVG10  
IVG11  
IVG11  
0
0
0
0
0
0
0
1
1
2
2
2
2
3
3
3
4
4
DMAC0 Status (generic)  
EPPI0 Error IRQ  
The ADSP-BF542/4/7/8/9 processor event controller consists of  
two stages, the core event controller (CEC) and the system  
interrupt controller (SIC). The core event controller works with  
the system interrupt controller to prioritize and control all sys-  
tem events. Conceptually, interrupts from the peripherals enter  
into the SIC, and are then routed directly into the general-pur-  
pose interrupts of the CEC.  
2
SPORT0 Error IRQ  
SPORT1 Error IRQ  
SPI0 Status IRQ  
3
4
5
UART0 Status IRQ  
Real-Time Clock IRQ  
DMA12 IRQ (EPPI0)  
DMA0 IRQ (SPORT0 RX)  
DMA1 IRQ (SPORT0 TX)  
DMA2 IRQ (SPORT1 RX)  
DMA3 IRQ (SPORT1 TX)  
DMA4 IRQ (SPI0)  
6
7
Core Event Controller (CEC)  
8
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest-priority inter-  
rupts (IVG15–14) are recommended to be reserved for software  
interrupt handlers, leaving seven prioritized interrupt inputs to  
support the peripherals of the ADSP-BF542/4/7/8/9 processor.  
Table 3 describes the inputs to the CEC, identifies their names  
in the event vector table (EVT), and lists their priorities.  
9
10  
11  
12  
13  
14  
15  
16  
17  
DMA6 IRQ (UART0 RX)  
DMA7 IRQ (UART0 TX)  
Timer 8 IRQ  
System Interrupt Controller (SIC)  
The system interrupt controller provides the mapping and rout-  
ing of events from the many peripheral interrupt sources to the  
prioritized general-purpose interrupt inputs of the CEC.  
Timer 9 IRQ  
Rev. PrG  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 4. System Interrupt Controller (SIC) (Continued)  
Table 4. System Interrupt Controller (SIC) (Continued)  
Peripheral IRQ  
(IRQ) Source  
IRQ  
GP IRQ  
Core  
Peripheral IRQ  
(IRQ) Source  
IRQ  
GP IRQ  
Core  
ID (at Reset) IRQ ID  
ID (at Reset) IRQ ID  
Timer 10 IRQ  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
IVG11  
IVG12  
IVG12  
IVG13  
IVG13  
IVG13  
IVG7  
4
5
5
6
6
6
0
0
0
0
0
0
0
0
0
2
2
2
2
2
2
3
3
3
3
3
3
4
4
4
4
6
6
4
4
4
0
0
0
Host DMA Status  
Reserved  
57  
58  
59  
60  
61  
62  
63  
63  
63  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
IVG7  
IVG7  
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin IRQ 0 (PINT0)  
Pin IRQ 1 (PINT1)  
Pixel Compositor (PIXC) Status IRQ  
NFC Status IRQ  
ATAPI Status IRQ  
CAN1 Status IRQ  
DMAR0 Block IRQ  
DMAR1 Block IRQ  
DMAR0 Overflow Error IRQ  
DMAR1 Overflow Error IRQ  
DMA15 IRQ (PIXC IN0)  
DMA16 IRQ (PIXC IN1)  
DMA17 IRQ (PIXC OUT)  
DMA22 IRQ (SDH/NFC)  
Counter (CNT) IRQ  
Keypad (KEY) IRQ  
CAN1 RX IRQ  
IVG7  
MDMA Stream 0 IRQ  
MDMA Stream 1 IRQ  
Software Watchdog Timer IRQ  
DMAC1 Status (generic)  
SPORT2 Error IRQ  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
IVG7  
SPORT3 Error IRQ  
IVG7  
IVG7  
MXVR Synchronous Data IRQ  
SPI1 Status IRQ  
IVG7  
IVG7  
IVG7  
IVG8  
SPI2 Status IRQ  
IVG7  
IVG8  
UART1 Status IRQ  
IVG7  
IVG8  
UART2 Status IRQ  
IVG7  
IVG8  
CAN0 Status IRQ  
IVG7  
IVG8  
DMA18 IRQ (SPORT2 RX)  
DMA19 IRQ (SPORT2 TX)  
DMA20 IRQ (SPORT3 RX)  
DMA21 IRQ (SPORT3 TX)  
DMA13 IRQ (EPPI1)  
DMA14 IRQ (EPPI2, Host DMA)  
DMA5 IRQ (SPI1)  
IVG9  
IVG8  
IVG9  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG11  
IVG9  
CAN1 TX IRQ  
IVG9  
SDH Mask 0 IRQ  
SDH Mask 1 IRQ  
Reserved  
IVG9  
IVG9  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG10  
IVG11  
IVG11  
IVG11  
IVG11  
IVG13  
IVG13  
IVG11  
IVG11  
IVG11  
IVG7  
USB_INT0 IRQ  
USB_INT1 IRQ  
USB_INT2 IRQ  
USB_DMAINT IRQ  
OTPSEC IRQ  
DMA23 IRQ (SPI2)  
DMA8 IRQ (UART1 RX)  
DMA9 IRQ (UART1 TX)  
DMA10 IRQ (ATAPI RX)  
DMA11 IRQ (ATAPI TX)  
TWI0 IRQ  
Reserved  
Reserved  
TWI1 IRQ  
Reserved  
CAN0 Receive IRQ  
Reserved  
CAN0 Transmit IRQ  
MDMA Stream 2 IRQ  
MDMA Stream 3 IRQ  
MXVR Status IRQ  
Reserved  
Reserved  
Timer 0 IRQ  
Timer 1 IRQ  
MXVR Control Message IRQ  
MXVR Asynchronous Packet IRQ  
EPPI1 Error IRQ  
Timer 2 IRQ  
Timer 3 IRQ  
Timer 4 IRQ  
EPPI2 Error IRQ  
IVG7  
Timer 5 IRQ  
UART3 Status IRQ  
IVG7  
Timer 6 IRQ  
Rev. PrG  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 4. System Interrupt Controller (SIC) (Continued)  
triggered the interrupt. A set bit indicates the peripheral is  
asserting the interrupt, and a cleared bit indicates the  
peripheral is not asserting the event.  
Peripheral IRQ  
(IRQ) Source  
IRQ  
GP IRQ  
Core  
ID (at Reset) IRQ ID  
• SIC interrupt wakeup enable register (SIC_IWR). By  
enabling the corresponding bit in this register, a peripheral  
can be configured to wake up the processor, should the  
core be idled when the event is generated. (For more infor-  
mation, see Dynamic Power Management on Page 16.)  
Timer 7 IRQ  
93  
94  
95  
IVG11  
IVG12  
IVG12  
4
5
5
Pin IRQ 2 (PINT2)  
Pin IRQ 3 (PINT3)  
Because multiple interrupt sources can map to a single general-  
purpose interrupt, multiple pulse assertions can occur simulta-  
neously, before or during interrupt processing for an interrupt  
event already detected on this interrupt input. The IPEND reg-  
ister contents are monitored by the SIC as the interrupt  
acknowledgement.  
Event Control  
The ADSP-BF542/4/7/8/9 processor provides the user with a  
very flexible mechanism to control the processing of events. In  
the CEC, three registers are used to coordinate and control  
events. Each register is 16 bits wide:  
• CEC interrupt latch register (ILAT). The ILAT register  
indicates when events have been latched. The appropriate  
bit is set when the processor has latched the event and  
cleared when the event has been accepted into the system.  
This register is updated automatically by the controller, but  
it may be written only when its corresponding IMASK bit  
is cleared.  
The appropriate ILAT register bit is set when an interrupt rising  
edge is detected (detection requires two core clock cycles). The  
bit is cleared when the respective IPEND register bit is set. The  
IPEND bit indicates that the event has entered into the proces-  
sor pipeline. At this point the CEC recognizes and queues the  
next rising edge event on the corresponding event input. The  
minimum latency from the rising edge transition of the general-  
purpose interrupt to the IPEND output asserted is three core  
clock cycles; however, the latency can be much higher, depend-  
ing on the activity within and the state of the processor.  
• CEC interrupt mask register (IMASK). The IMASK regis-  
ter controls the masking and unmasking of individual  
events. When a bit is set in the IMASK register, that event is  
unmasked and is processed by the CEC when asserted. A  
cleared bit in the IMASK register masks the event, prevent-  
ing the processor from servicing the event even though the  
event may be latched in the ILAT register. This register  
may be read or written while in supervisor mode. (Note  
that general-purpose interrupts can be globally enabled and  
disabled with the STI and CLI instructions, respectively.)  
DMA CONTROLLERS  
ADSP-BF542/4/7/8/9 processors have multiple, independent  
DMA channels that support automated data transfers with min-  
imal overhead for the processor core. DMA transfers can occur  
between the ADSP-BF542/4/7/8/9 processor’s internal memo-  
ries and any of its DMA-capable peripherals. Additionally,  
DMA transfers can be accomplished between any of the DMA-  
capable peripherals and external devices connected to the exter-  
nal memory interfaces, including DDR and asynchronous  
memory controllers.  
• CEC interrupt pending register (IPEND). The IPEND reg-  
ister keeps track of all nested events. A set bit in the IPEND  
register indicates the event is currently active or nested at  
some level. This register is updated automatically by the  
controller but may be read while in supervisor mode.  
While the USB controller and MXVR have their own dedicated  
DMA controllers, the other on-chip peripherals are managed by  
two centralized DMA controllers, called DMAC1 (32-bit) and  
DMAC0 (16-bit). Both operate in the SCLK domain. Each DMA  
controller manages twelve independent peripheral DMA chan-  
nels, as well as 2 independent memory DMA streams. The  
DMAC1 controller masters high-bandwidth peripherals over a  
dedicated 32-bit DMA access bus (DAB32). Similarly, the  
DMAC0 controller masters most of serial interfaces over the 16-  
bit DAB16 bus. Individual DMA channels have fixed access pri-  
ority on the DAB buses. DMA priority of peripherals is  
The SIC allows further control of event processing by providing  
three 32-bit interrupt control and status registers. Each register  
contains a bit corresponding to each of the peripheral interrupt  
events shown in Table 4 on Page 8.  
• SIC interrupt mask register (SIC_IMASK). This register  
controls the masking and unmasking of each peripheral  
interrupt event. When a bit is set in the register, that  
peripheral event is unmasked and is processed by the sys-  
tem when asserted. A cleared bit in the register masks the  
peripheral event, preventing the processor from servicing  
the event.  
managed by flexible peripheral-to-DMA channel assignment.  
All four DMA controllers use the same 32-bit DCB bus to  
exchange data with L1 memory. This includes L1 ROM, but  
excludes scratchpad memory. Fine granulation of L1 memory  
and special DMA buffers minimize potential memory conflicts,  
if the L1 memory is accessed by the core contemporaneously.  
Similarly, there are dedicated DMA buses between the DMAC1,  
DMAC0, and USB DMA controllers and the external bus inter-  
face unit (EBIU) that arbitrates DMA accesses to external  
memories and boot ROM.  
• SIC interrupt status register (SIC_ISR). As multiple periph-  
erals can be mapped to a single event, this register allows  
the software to determine which peripheral event source  
Rev. PrG  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
The ADSP-BF542/4/7/8/9 processor DMA controllers support  
both 1-dimensional (1D) and 2-dimensional (2D) DMA trans-  
fers. DMA transfer initialization can be implemented from  
registers or from sets of parameters called descriptor blocks.  
configuration words in order to send/receive data to any valid  
internal or external memory location. The Host DMA Port con-  
troller includes the following features:  
• Allows an external master to configure DMA read/write  
data transfers and read port status  
The 2D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be de-  
interleaved on the fly.  
• Uses a flexible asynchronous memory protocol for its  
external interface  
• Allows an 8- or 16-bit external data interface to the host  
device  
• Supports half-duplex operation  
Examples of DMA types supported by the ADSP-BF542/4/7/8/9  
processor DMA controller include:  
• Supports Little/Big Endian data transfers  
• Acknowledge mode allows flow control on host  
transactions  
• A single, linear buffer that stops upon completion  
• A circular, auto-refreshing buffer that interrupts on each  
full or fractionally full buffer  
• Interrupt mode guarantees a burst of FIFO depth host  
transactions  
• 1-D or 2-D DMA using a linked list of descriptors  
REAL-TIME CLOCK  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page  
The ADSP-BF542/4/7/8/9 processor Real-Time Clock (RTC)  
provides a robust set of digital watch features, including current  
time, stopwatch, and alarm. The RTC is clocked by a  
32.768 KHz crystal external to the ADSP-BF542/4/7/8/9 proces-  
sors. The RTC peripheral has dedicated power supply pins so  
that it can remain powered up and clocked even when the rest of  
the processor is in a low-power state. The RTC provides several  
programmable interrupt options, including interrupt per sec-  
ond, minute, hour, or day clock ticks, interrupt on  
In addition to the dedicated peripheral DMA channels, both the  
DMAC1 and the DMAC0 controllers feature two memory  
DMA channel pairs for transfers between the various memories  
of the ADSP-BF542/4/7/8/9 processor system. This enables  
transfers of blocks of data between any of the memories—  
including external DDR, ROM, SRAM, and flash memory—  
with minimal processor intervention. Like peripheral DMAs,  
memory DMA transfers can be controlled by a very flexible  
descriptor-based methodology or by a standard register-based  
autobuffer mechanism.  
programmable stopwatch countdown, or interrupt at a pro-  
grammed alarm time.  
The 32.768 KHz input clock frequency is divided down to a  
1 Hz signal by a prescaler. The counter function of the timer  
consists of four counters: a 60-second counter, a 60-minute  
counter, a 24-hour counter, and an 32,768-day counter.  
The memory DMA channels of the DMAC1 controller  
(MDMA2 and MDMA3) can be optionally controlled by the  
external DMA request input pins. When used in conjunction  
with the External Bus Interface Unit (EBIU), this so-called  
Handshaked Memory DMA (HMDMA) scheme can be used to  
efficiently exchange data with block-buffered or FIFO-style  
devices connected externally. Users can select whether the DMA  
request pins control the source or the destination side of the  
memory DMA. It allows control of the number of data transfers  
for memory DMA. The number of transfers per edge is pro-  
grammable. This feature can be programmed to allow memory  
DMA to have an increased priority on the external bus relative  
to the core.  
When enabled, the alarm function generates an interrupt when  
the output of the timer matches the programmed value in the  
alarm control register. There are two alarms: The first alarm is  
for a time of day. The second alarm is for a day and time of that  
day.  
The stopwatch function counts down from a programmed  
value, with one-second resolution. When the stopwatch is  
enabled and the counter underflows, an interrupt is generated.  
Like the other peripherals, the RTC can wake up the  
ADSP-BF542/4/7/8/9 processor from sleep mode upon genera-  
tion of any RTC wakeup event. Additionally, an RTC wakeup  
event can wake up the ADSP-BF542/4/7/8/9 processor from  
deep sleep mode, and wake up the on-chip internal voltage reg-  
ulator from the hibernate operating mode.  
Host DMA Port Interface  
The Host DMA port (HOSTDP) facilitates a host device exter-  
nal to the ADSP-BF542/4/7/8/9 to be a DMA master and  
transfer data back and forth. The host device always masters the  
transactions and the processor is always a DMA slave device.  
The HOSTDP port is enabled through the peripheral access bus.  
Once the port has been enabled, the transaction are controlled  
by the external host. The external host programs standard DMA  
Rev. PrG  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Connect RTC pins RTXI and RTXO with external components  
as shown in Figure 4.  
The timer units can be used in conjunction with the two UARTs  
and the CAN controller to measure the width of the pulses in  
the data stream to provide a software auto-baud detect function  
for the respective serial channels.  
The timers can generate interrupts to the processor core provid-  
ing periodic events for synchronization, either to the system  
clock or to a count of external signals.  
RTXI  
RTXO  
R1  
X1  
In addition to the general-purpose programmable timers,  
another timer is also provided by the processor core. This extra  
timer is clocked by the internal processor clock and is typically  
used as a system tick clock for generation of operating system  
periodic interrupts.  
C1  
C2  
UP/DOWN COUNTER AND THUMBWHEEL  
INTERFACE  
SUGGESTED COMPONENTS:  
ECLIPTEK EC38J (THROUGH-HOLE PACKAGE)  
EPSON MC405 12 PF LOAD (SURFACE MOUNT PACKAGE)  
C1 = 22 PF  
C2 = 22 PF  
R1 = 10 M:  
A 32-bit up/down counter is provided that can sense 2-bit  
quadrature or binary codes as typically emitted by industrial  
drives or manual thumb wheels. The counter can also operate in  
general-purpose up/down count modes. Then, count direction  
is either controlled by a level-sensitive input pin or by two edge  
detectors.  
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.  
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2  
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 PF.  
Figure 4. External Components for RTC  
A third input can provide flexible zero marker support and can  
alternatively be used to input the push-button signal of thumb  
wheels. All three pins have a programmable debouncing circuit.  
WATCHDOG TIMER  
The ADSP-BF542/4/7/8/9 processor includes a 32-bit timer that  
can be used to implement a software watchdog function. A soft-  
ware watchdog can improve system availability by forcing the  
processor to a known state through generation of a hardware  
reset, non-maskable interrupt (NMI), or general-purpose inter-  
rupt, if the timer expires before being reset by software. The  
programmer initializes the count value of the timer, enables the  
appropriate interrupt, then enables the timer. Thereafter, the  
software must reload the counter before it counts to zero from  
the programmed value. This protects the system from remain-  
ing in an unknown state where software, which would normally  
reset the timer, has stopped running due to an external noise  
condition or software error.  
An internal signal forwarded to the timer unit enables one timer  
to measure the intervals between count events. Boundary regis-  
ters enable auto-zero operation or simple system warning by  
interrupts when programmable count values are exceeded.  
SERIAL PORTS (SPORTS)  
The ADSP-BF542/4/7/8/9 processor incorporates up to four  
dual-channel synchronous serial ports (SPORT0, SPORT1,  
SPORT2, SPORT3) for serial and multiprocessor communica-  
tions. The SPORTs support the following features:  
• I2S capable operation.  
• Bidirectional operation. Each SPORT has two sets of inde-  
pendent transmit and receive pins, enabling eight channels  
of I2S stereo audio.  
If configured to generate a hardware reset, the watchdog timer  
resets both the core and the ADSP-BF542/4/7/8/9 processor  
peripherals. After a reset, software can determine if the watch-  
dog was the source of the hardware reset by interrogating a  
status bit in the watchdog timer control register.  
• Buffered (8-deep) transmit and receive ports. Each port has  
a data register for transferring data words to and from  
other processor components and shift registers for shifting  
data in and out of the data registers.  
The timer is clocked by the system clock (SCLK), at a maximum  
frequency of fSCLK  
.
• Clocking. Each transmit and receive port can either use an  
external serial clock or generate its own, in frequencies  
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.  
TIMERS  
There are up to two timer units in the ADSP-BF542/4/7/8/9  
processors. One unit provides eight general-purpose program-  
mable timers and the other unit provides three. Each timer has  
an external pin that can be configured either as a Pulse Width  
Modulator (PWM) or timer output, as an input to clock the  
timer, or as a mechanism for measuring pulse widths and peri-  
ods of external events. These timers can be synchronized to an  
external clock input on the TMRx pins, an external clock  
TMRCLK input pin, or to the internal SCLK.  
• Word length. Each SPORT supports serial data words from  
3 to 32 bits in length, transferred most-significant-bit first  
or least-significant-bit first.  
• Framing. Each transmit and receive port can run with or  
without frame sync signals for each data word. Frame sync  
signals can be generated internally or externally, active high  
or low, and with either of two pulsewidths and early or late  
frame sync.  
Rev. PrG  
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ADSP-BF542/4/7/8/9  
• Companding in hardware. Each SPORT can perform  
A-law or μ-law companding according to ITU recommen-  
dation G.711. Companding can be selected on the transmit  
and/or receive channel of the SPORT without additional  
latencies.  
includes support for 5 to 8 data bits, 1 or 2 stop bits, and none,  
even, or odd parity. Each UART port supports two modes of  
operation:  
• PIO (programmed I/O). The processor sends or receives  
data by writing or reading I/O-mapped UART registers.  
The data is double-buffered on both transmit and receive.  
• DMA operations with single-cycle overhead. Each SPORT  
can automatically receive and transmit multiple buffers of  
memory data. The processor can link or chain sequences of  
DMA transfers between a SPORT and memory.  
• DMA (Direct Memory Access). The DMA controller trans-  
fers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. Each UART has two dedicated  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower default priority than most DMA  
channels because of their relatively low service rates. Flexi-  
ble interrupt timing options are available on the transmit  
side.  
• Interrupts. Each transmit and receive port generates an  
interrupt upon completing the transfer of a data word or  
after transferring an entire data buffer or buffers through  
DMA.  
• Multichannel capability. Each SPORT supports 128 chan-  
nels out of a 1024-channel window and is compatible with  
the H.100, H.110, MVIP-90, and HMVIP standards.  
Each UART port's baud rate, serial data format, error code gen-  
eration and status, and interrupts are programmable:  
SERIAL PERIPHERAL INTERFACE (SPI) PORTS  
• Supporting bit rates ranging from (fSCLK/ 1,048,576) to  
(fSCLK) bits per second.  
The ADSP-BF542/4/7/8/9 processor has up to three SPI-com-  
patible ports that allow the processor to communicate with  
multiple SPI-compatible devices.  
• Supporting data formats from 7 to 12 bits per frame.  
• Both transmit and receive operations can be configured to  
generate maskable interrupts to the processor.  
Each SPI port uses three pins for transferring data: two data pins  
(master output-slave input, MOSI, and master input-slave out-  
put, MISO) and a clock pin (serial clock, SCK). An SPI chip  
select input pin (SPISS) lets other SPI devices select the proces-  
sor, and three SPI chip select output pins per SPI port let the  
processor select other SPI devices. The SPI select pins are recon-  
figured programmable flag pins. Using these pins, the SPI ports  
provide a full-duplex, synchronous serial interface, which sup-  
ports both master/slave modes and multimaster environments.  
The UART port’s clock rate is calculated as:  
f
SCLK  
-----------------------------------------------------------------------------  
UART Clock Rate =  
(1 EDBO)  
16  
× UART_Divisor  
Where the 16-bit UART Divisor comes from the UARTx_DLH  
register (most significant 8 bits) and UARTx_DLL register (least  
significant 8 bits, and EDBO is a bit in the UARTx_GCTL  
register).  
The SPI port’s baud rate and clock phase/polarities are pro-  
grammable, and it has an integrated DMA controller,  
configurable to support transmit or receive data streams. The  
SPI’s DMA controller can only service unidirectional accesses at  
any given time.  
In conjunction with the general-purpose timer functions, auto-  
baud detection is supported.  
UART1 and UART3 feature a pair of RTS (request to send) and  
CTS (clear to send) signals for hardware flow purposes. The  
transmitter hardware is automatically prevented from sending  
further data when the CTS input is de-asserted. The receiver can  
automatically de-assert its RTS output when the enhanced  
receive FIFO exceeds a certain high-water level. The capabilities  
of the UARTs are further extended with support for the Infrared  
Data Association (IrDA®) Serial Infrared Physical Layer Link  
Specification (SIR) protocol.  
The SPI port’s clock rate is calculated as:  
f
SCLK  
--------------------------------  
SPI Clock Rate =  
2 × SPI_Baud  
Where the 16-bit SPI_BAUD register contains a value of 2 to  
65,535.  
During transfers, the SPI port simultaneously transmits and  
receives by serially shifting data in and out on its two serial data  
lines. The serial clock line synchronizes the shifting and sam-  
pling of data on the two serial data lines.  
CONTROLLER AREA NETWORK (CAN)  
The ADSP-BF542/4/9 processor offers up to two CAN control-  
lers that are communication controllers that implement the  
Controller Area Network (CAN) 2.0B (active) protocol. This  
protocol is an asynchronous communications protocol used in  
both industrial and automotive control systems. The CAN pro-  
tocol is well suited for control applications due to its capability  
to communicate reliably over a network since the protocol  
incorporates CRC checking message error tracking, and fault  
node confinement. CAN controllers are only available on the  
Automotive Grade versions for ADSP-BF542 and ADSP-BF544  
processors. CAN is always available on the Industrial Grade ver-  
UART PORTS (UARTS)  
The ADSP-BF542/4/7/8/9 processor provides up to four full-  
duplex Universal Asynchronous Receiver/Transmitter (UART)  
ports. Each UART port provides a simplified UART interface to  
other peripherals or hosts, supporting full-duplex, DMA-sup-  
ported, asynchronous transfers of serial data. A UART port  
Rev. PrG  
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ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
sion of the ADSP-BF548 processor and the Automotive Grade  
version of the ADSP-BF549 processor since those only have one  
version each offered.  
functions, the richness of GPIO functionality guarantees unre-  
strictive pin usage. Every pin that is not used by any function  
can be configured in GPIO mode on an individual basis.  
The ADSP-BF542/4/9 CAN controllers offer the following  
features:  
After reset, all pins are in GPIO mode by default. Neither GPIO  
output nor input drivers are active by default. Unused pins can  
be left unconnected, therefore. GPIO data and direction control  
registers provide flexible write-one-to-set and write-one-to-  
clear mechanisms so that independent software threads do not  
need to protect against each other because of expensive read-  
modify-write operations when accessing the same port.  
• 32 mailboxes (8 receive only, 8 transmit only, 16 config-  
urable for receive or transmit).  
• Dedicated acceptance masks for each mailbox.  
• Additional data filtering on first two bytes.  
• Support for both the standard (11-bit) and extended (29-  
bit) identifier (ID) message formats.  
Pin Interrupts  
Due to its large number of port pins, the ADSP-BF542/4/7/8/9  
processors introduce a new scheme to manage pin interrupts.  
Every port pin can request interrupts in either an edge-sensitive  
or a level-sensitive manner with programmable polarity. Inter-  
rupt functionality is decoupled from GPIO operation. Four  
system-level interrupt channels (INT0, INT1, INT2 and INT3)  
are reserved for this purpose. Each of these interrupt channels  
can manage up to 32 interrupt pins. The assignment from pin to  
interrupt is not performed at a pin by pin level. Rather, groups  
of eight pins (half ports) can be flexibly assigned to interrupt  
channels.  
• Support for remote frames.  
• Active or passive network support.  
• CAN wakeup from hibernation mode (lowest static power  
consumption mode).  
• Interrupts, including: TX complete, RX complete, error,  
global.  
The electrical characteristics of each network connection are  
very demanding so the CAN interface is typically divided into  
two parts: a controller and a transceiver. This allows a single  
controller to support different drivers and CAN networks. The  
ADSP-BF542/4/9 CAN module represents only the controller  
part of the interface. The controller interface supports connec-  
tion to 3.3V high-speed, fault-tolerant, single-wire transceivers.  
Every pin interrupt channel features a special set of 32-bit mem-  
ory-mapped registers that enable half-port assignment and  
interrupt management. This not only includes masking, identi-  
fication, and clearing of requests, it also enables access to the  
respective pin states and use of the interrupt latches regardless  
of whether the interrupt is masked or not. Most control registers  
feature multiple MMR address entries to write-one-to-set or  
write-one-to-clear them individually.  
TWI CONTROLLER INTERFACE  
The ADSP-BF542/4/7/8/9 processor includes up to two Two  
Wire Interface (TWI) modules for providing a simple exchange  
method of control data between multiple devices. The modules  
are compatible with the widely used I2C bus standard. The TWI  
modules offer the capabilities of simultaneous Master and Slave  
operation, support for both 7-bit addressing and multimedia  
data arbitration. Each TWI interface uses two pins for transfer-  
ring clock (SCL) and data (SDA) and supports the protocol at  
speeds up to 400k bits/sec. The TWI interface pins are compati-  
ble with 5 V logic levels.  
PIXEL COMPOSITOR (PIXC)  
The pixel compositor (PIXC) provides image overlay with  
transparent-color support, alpha blending, and color space con-  
version capability for output to TFT-LCDs as well as  
NTSC/PAL video encoders. It provides all of the control to  
allow two data streams from two separate data buffers to be  
combined, blended, and converted into appropriate forms for  
both LCD panels and digital video outputs. The main image  
buffer provides the basic background image, which is presented  
in the data stream. The overlay image buffer allows the user to  
add multiple foreground text, graphics, or video objects on top  
of the main image or video data stream.  
Additionally, the ADSP-BF542/4/7/8/9 processor’s TWI mod-  
ules are fully compatible with Serial Camera Control Bus  
(SCCB) functionality for easier control of various CMOS cam-  
era sensor devices.  
PORTS  
ENHANCED PARALLEL PERIPHERAL INTERFACE  
(EPPI)  
Because of their rich set of peripherals, the  
ADSP-BF542/4/7/8/9 processors group the many peripheral  
signals to ten ports—referred to as Port A to Port J. Most ports  
contain 16 pins, a few have less. Many of the associated pins are  
shared by multiple signals. The ports function as multiplexer  
controls. Every port has its own set of memory-mapped regis-  
ters to control port muxing and GPIO functionality.  
The ADSP-BF542/4/7/8/9 processor provides up to three  
Enhanced Parallel Peripheral Interfaces (EPPIs), supporting  
data widths up to 24 bits wide. The EPPI supports direct con-  
nection to TFT LCD panels, parallel A/D and D/A converters,  
video encoders and decoders, image sensor modules and other  
general purpose peripherals.  
General-Purpose I/O (GPIO)  
Every pin in Port A to Port J can function as a GPIO pin result-  
ing in a GPIO pin count of 154. While it is unlikely that all  
GPIOs will be used in an application as all pins have multiple  
Rev. PrG  
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Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
The following features are supported in the EPPI module.  
ATA/ATAPI–6 INTERFACE  
• Programmable data length: 8, 10, 12, 14, 16, 18, and 24 bits  
per clock.  
The ATAPI interface connects to CD/DVD and HDD drives,  
and is ATAPI-6 compliant. The controller implements the  
peripheral I/O mode, the multi-DMA mode, and the Ultra  
DMA mode. The DMA modes enable faster data transfer and  
reduced host management. The ATAPI Controller supports  
PIO, Multi-DMA, and Ultra DMA ATAPI accesses. Key fea-  
tures include:  
• Bi-directional and half-duplex port.  
• Clock can be provided externally or can be generated  
internally.  
• Various framed and non-framed operating modes. Frame  
syncs can be generated internally or can be supplied by an  
external device.  
• Supports PIO modes 0,1,2,3,4  
• Supports Multiword DMA modes 0,1,2  
• Various general purpose modes with one frame syncs, two  
frame syncs, three frame syncs and zero frame sync modes  
for both receive and transmit directions.  
• Supports Ultra DMA modes 0,1,2,3,4,5 (up to UDMA 100)  
• Programmable timing for ATA interface unit  
• Supports CompactFlash Card using True IDE mode  
• ITU-656 status word error detection and correction for  
ITU-656 Receive modes.  
KEYPAD INTERFACE  
• ITU-656 preamble and status word decode.  
The keypad interface is a 16-pin interface module that is used to  
detect the key pressed in a 8x8 (maximum) keypad matrix. The  
size of the input keypad matrix is programmable. The interface  
is capable of filtering the bounce on the input pins, which is  
common in keypad applications. The width of the filtered  
bounce is programmable. The module is capable of generating  
an interrupt request to the core once it identifies that any key  
has been pressed.  
• Three different modes for ITU-656 receive modes: active  
video only, vertical blanking only, and entire field mode.  
• Horizontal and vertical windowing for GP 2 and 3 frame  
sync modes.  
• Optional packing and unpacking of data to/from 32 bits  
from/to 8, 16 and 24 bits. If packing/unpacking is enabled,  
endianness can be changed to change the order of pack-  
ing/unpacking of bytes/words.  
The interface supports a press-release-press mode and infra-  
structure for a press-hold mode. The former mode identifies a  
press, release and press of a key as two consecutive presses of the  
same key whereas the later mode checks the input key’s state in  
periodic intervals to determine the number of times the same  
key is meant to be pressed. It is possible to detect when multiple  
keys are pressed simultaneously, and to provide limited key res-  
olution capability when this happens.  
• Optional sign extension or zero fill for receive modes.  
• During receive modes, alternate even or odd data samples  
can be filtered out.  
• Programmable clipping of data values for 8-bit transmit  
modes.  
• RGB888 can be converted to RGB666 or RGB565 for trans-  
mit modes.  
SECURE DIGITAL (SD)/SDIO CONTROLLER  
• Various de-interleaving/interleaving modes for receiv-  
ing/transmitting 4:2:2 YCrCb data.  
The SD/SDIO controller is a serial interface that stores data at a  
data rate of up to 10M bytes per second using a 4-bit data line.  
The interface runs at 25 MHz.  
• FIFO watermarks and urgent DMA features.  
• Clock gating by an external device asserting the clock gat-  
ing control signal.  
The SD/SDIO controller supports the SD memory mode only.  
The interface supports all the power modes and performs error  
checking by CRC.  
• Configurable LCD Data Enable (DEN) output available on  
Frame Sync 3.  
CODE SECURITY  
USB ON-THE-GO DUAL-ROLE DEVICE CONTROLLER  
An OTP/security system consisting of a blend of hardware and  
software provides customers with a flexible and rich set of code  
The USB OTG controller provides a low-cost connectivity solu-  
tion for consumer mobile devices such as cell phones, digital  
still cameras and MP3 players, allowing these devices to transfer  
data using a point-to-point USB connection without the need  
for a PC host. The USBDRC module can operate in a traditional  
USB peripheral-only mode as well as the host mode presented  
in the On-The-Go (OTG) supplement [1] to the USB 2.0 Speci-  
fication [2]. In host mode, the USB module supports transfers at  
high-speed (480Mbps), full-speed (12Mbps), and low-speed  
(1.5Mbps) rates. Peripheral-only mode supports the high- and  
full-speed transfer rates.  
TM  
security features with Lockbox 1 secure technology. Key fea-  
tures include:  
• OTP memory  
• Unique chip ID  
• Code authentication  
• Secure mode of operation  
1 Lockbox is a trademark of Analog Devices, Inc.  
Rev. PrG  
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ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
The security scheme is based upon the concept of authentica-  
tion of digital signatures using standards-based algorithms and  
provides a secure processing environment in which to execute  
code and protect assets.  
of the ADSP-BF542/4/7/8/9 processor peripherals also reduces  
power consumption. See Table 5 for a summary of the power  
settings for each mode.  
Full-On Operating Mode – Maximum Performance  
MEDIA TRANSCEIVER MAC LAYER (MXVR)  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the power-up default execution state in which maximum per-  
formance can be achieved. The processor core and all enabled  
peripherals run at full speed.  
The ADSP-BF549 processor provides a Media Transceiver  
(MXVR) MAC layer, allowing the processor to be connected  
directly to a MOST®1 network through just an FOT or Electrical  
PHY.  
The MXVR is fully compatible with the industry standard stan-  
dalone MOST controller devices, supporting 22.579 Mbps or  
24.576 Mbps data transfer. It offers faster lock times, greater jit-  
ter immunity, a sophisticated DMA scheme for data transfers,  
and the high-speed internal interface to the core and L1 mem-  
ory allows the full bandwidth of the network to be utilized. The  
MXVR can operate as either the network master or as a network  
slave.  
Active Operating Mode – Moderate Power Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clock (CCLK) and system  
clock (SCLK) run at the input clock (CLKIN) frequency. In this  
mode, the CLKIN to CCLK multiplier ratio can be changed,  
although the changes are not realized until the Full-On mode is  
entered. DMA access is available to appropriately configured L1  
memories.  
The MXVR supports synchronous data, asynchronous packets,  
and control messages using dedicated DMA channels which  
operate autonomously from the processor core moving data to  
and from L1 and/or L2 memory. Synchronous data is trans-  
ferred to or from the synchronous data physical channels on the  
MOST bus through eight programmable DMA channels. The  
synchronous data DMA channels can operate in various modes  
including modes which trigger DMA operation when data pat-  
terns are detected in the receive data stream. Furthermore two  
DMA channels support asynchronous traffic and a further two  
support control message traffic.  
In the active mode, it is possible to disable the PLL through the  
PLL Control register (PLL_CTL). If disabled, the PLL must be  
re-enabled before transitioning to the full-on or sleep modes.  
Table 5. Power Settings  
Full On  
Active  
Enabled  
No  
Enabled Enabled On  
Enabled Enabled On  
Interrupts are generated when a user defined amount of syn-  
chronous data has been sent or received by the processor or  
when asynchronous packets or control messages have been sent  
or received.  
Enabled/ Yes  
Disabled  
Sleep  
Enabled  
-
-
-
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
Deep Sleep Disabled  
Hibernate Disabled  
The MXVR peripheral can wake up the ADSP-BF549 processor  
from sleep mode when a wakeup preamble is received over the  
network or based on any other MXVR interrupt event. Addi-  
tionally, detection of network activity by the MXVR can be used  
to wake up the ADSP-BF549 processor from sleep mode or  
hibernate. These features allow the ADSP-BF549 to operate in a  
low-power state when there is no network activity or when data  
is not currently being received or transmitted by the MXVR.  
Sleep Operating Mode – High Dynamic Power Savings  
The sleep mode reduces dynamic power dissipation by disabling  
the clock to the processor core (CCLK). The PLL and system  
clock (SCLK), however, continue to operate in this mode. Typi-  
cally an external event or RTC activity will wake up the  
processor. When in the sleep mode, assertion of wakeup will  
cause the processor to sense the value of the BYPASS bit in the  
PLL control register (PLL_CTL). If BYPASS is disabled, the pro-  
cessor will transition to the full on mode. If BYPASS is enabled,  
the processor will transition to the active mode.  
The MXVR clock is provided through a dedicated external crys-  
tal or crystal oscillator. The frequency of external crystal or  
crystal oscillator can be 256Fs, 384Fs, 512Fs, or 1024Fs for  
Fs = 38kHz, 44.1kHz, or 48kHz. If using a crystal to provide the  
MXVR clock, use a parallel-resonant, fundamental mode,  
microprocessor-grade crystal.  
When in the sleep mode, system DMA access to L1 memory is  
not supported.  
DYNAMIC POWER MANAGEMENT  
Deep Sleep Operating Mode – Maximum Dynamic Power  
Savings  
The ADSP-BF542/4/7/8/9 processor provides five operating  
modes, each with a different performance/power profile. In  
addition, dynamic power management provides the control  
functions to dynamically alter the processor core supply voltage,  
further reducing power dissipation. Control of clocking to each  
The deep sleep mode maximizes dynamic power savings by dis-  
abling the clocks to the processor core (CCLK) and to all  
synchronous peripherals (SCLK). Asynchronous peripherals,  
such as the RTC, may still be running but will not be able to  
access internal resources or external memory. This powered-  
1 MOST is a registered trademark of Standard Microsystems, Corp.  
Rev. PrG  
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Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
down mode can only be exited by assertion of the reset interrupt  
(RESET) or by an asynchronous interrupt generated by the  
RTC. When in deep sleep mode, an RTC asynchronous inter-  
rupt causes the processor to transition to the active mode.  
Assertion of RESET while in deep sleep mode causes the proces-  
sor to transition to the full on mode.  
VOLTAGE REGULATION  
The ADSP-BF542/4/7/8/9 processor provides an on-chip volt-  
age regulator that can generate processor core voltage levels  
from an external supply. (Note specifications as indicated in  
Operating Conditions on Page 32.) Figure 5 shows the typical  
external components required to complete the power manage-  
ment system. The regulator controls the internal logic voltage  
levels and is programmable with the voltage regulator control  
register (VR_CTL) in increments of 50 mV. To reduce standby  
power consumption, the internal voltage regulator can be pro-  
grammed to remove power to the processor core while keeping  
Hibernate State – Maximum Static Power Savings  
The hibernate state maximizes static power savings by disabling  
the voltage and clocks to the processor core (CCLK) and to all  
the synchronous peripherals (SCLK). The internal voltage regu-  
lator for the processor can be shut off by writing b#00 to the  
FREQ bits of the VR_CTL register. This disables both CCLK  
and SCLK. Furthermore, it sets the internal power supply volt-  
age (VDDINT) to 0V to provide the greatest power savings mode.  
Any critical information stored internally (memory contents,  
register contents, etc.) must be written to a non-volatile storage  
device prior to removing power if the processor state is to be  
preserved.  
I/O power supplied. While in hibernate mode, VDDEXT, VDDRTC  
,
V
DDDDR, VDDUSB, and VDDVR can still be applied, eliminating the  
need for external buffers. The voltage regulator can be activated  
from this power down state by assertion of the RESET pin,  
which will then initiate a boot sequence. The regulator can also  
be disabled and bypassed at the user’s discretion. For additional  
information, see “Switching Regulator Design Considerations  
for the ASDP-BF533 Blackfin Processors” (EE-228).  
Since VDDEXT is still supplied in this mode, all of the external  
pins tri-state, unless otherwise specified. This allows other  
devices that may be connected to the processor to have power  
still applied without drawing unwanted current.  
The internal supply regulator can be woken up by CAN, by the  
MXVR, by the keypad, by the up/down counter, by the USB,  
and by some GPIO pins. It can also be woken up by a real-time  
clock wakeup event or by asserting the RESET pin. Waking up  
from hibernate state initiates the hardware reset sequence.  
2.70V TO 3.6V  
INPUT VOLTAGE  
RANGE  
S E T OF DE COUPL ING  
CAP ACITOR S  
V
DDVR  
(L OW-INDUCTANCE )  
V
V
DDVR  
DDINT  
+
100μF  
With the exception of the VR_CTL and the RTC registers, all  
internal registers and memories lose their content in hibernate  
state. State variables may be held in external SRAM or SDRAM.  
10μH  
100nF  
+
+
100μF  
FDS 9431A  
100μF  
10μF  
LOW E S R  
Power Savings  
ZHC S 1000  
VR  
VR  
OUT  
OUT  
As shown in Table 6, the ADSP-BF542/4/7/8/9 processor sup-  
ports different power domains. The use of multiple power  
domains maximizes flexibility, while maintaining compliance  
with industry standards and conventions. By isolating the inter-  
nal logic of the ADSP-BF542/4/7/8/9 processor into its own  
power domain, separate from the RTC and other I/O, the pro-  
cessor can take advantage of dynamic power management,  
without affecting the RTC or other I/O devices. There are no  
sequencing requirements for the various power domains.  
S HOR T AND L OW-  
INDUCTANCE WIR E  
NOTE : DE S IGNE R S HOUL D MINIMIZE  
TR ACE L E NGTH TO FDS 9431A.  
GND  
Figure 5. Voltage Regulator Circuit  
Table 6. Power Domains  
CLOCK SIGNALS  
Power Domain  
VDD Range  
VDDINT  
The ADSP-BF542/4/7/8/9 processor can be clocked by an exter-  
nal crystal, a sine wave input, or a buffered, shaped clock  
derived from an external clock oscillator.  
All internal logic, except RTC, DDR, and USB  
RTC internal logic and crystal I/O  
DDR external memory supply  
USB internal logic and crystal I/O  
Internal voltage regulator  
MXVR PLL and logic  
VDDRTC  
VDDDDR  
VDDUSB  
VDDVR  
If an external clock is used, it should be a TTL compatible signal  
and must not be halted, changed, or operated below the speci-  
fied frequency during normal operation. This signal is  
connected to the processor’s CLKIN pin. When an external  
clock is used, the XTAL pin must be left unconnected.  
VDDMP  
All other I/O  
VDDEXT  
Alternatively, because the ADSP-BF542/4/7/8/9 processor  
includes an on-chip oscillator circuit, an external crystal may be  
used. For fundamental frequency operation, use the circuit  
Rev. PrG  
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Page 17 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
shown in Figure 6. A parallel-resonant, fundamental frequency,  
microprocessor-grade crystal is connected across the CLKIN  
and XTAL pins. The on-chip resistance between CLKIN and the  
XTAL pin is in the 500 kΩ range. Further parallel resistors are  
typically not recommended. The two capacitors and the series  
resistor shown in Figure 6 fine tune phase and amplitude of the  
sine frequency.  
voltages VDDINT and VDDEXT, the VCO is always permitted to run  
up to the frequency specified by the part’s speed grade. The  
CLKOUT pin reflects the SCLK frequency to the off-chip world.  
It functions as reference for many timing specifications. While  
inactive by default, it can be enabled using the EBIU_SDGCTL  
and EBIU_AMGCTL registers.  
The capacitor and resistor values shown in Figure 6 are typical  
values only. The capacitor values are dependent upon the crystal  
manufacturers’ load capacitance recommendations and the PCB  
physical layout. The resistor value depends on the drive level  
specified by the crystal manufacturer. System designs should  
verify the customized values based on careful investigations on  
multiple devices over temperature range.  
DYNAMIC MODIFICATION  
ON-THE-FLY  
DYNAMIC MODIFICATION  
REQUIRES PLL SEQUENCING  
CCLK  
SCLK  
1, 2, 4, 8  
1:15  
PLL  
0.5x - 64x  
CLKIN  
VCO  
BLACKFIN  
SCLK CCLK/2  
SCLK 133MHz  
CLKOUT  
TO PLL CIRCUITRY  
EN  
CLKBUF  
Figure 7. Frequency Modification Methods  
EN  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are two  
through 15. Table 7 illustrates typical system clock ratios. The  
default ratio is 4.  
XTAL  
CLKIN  
18 pF*  
3306*  
FOR OVERTONE  
OPERATION ONLY:  
18 pF*  
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED  
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE  
ANALYZE CAREFULLY.  
Table 7. Example System Clock Ratios  
Example Frequency Ratios  
(MHz)  
VCO  
200  
Signal Name Divider Ratio  
Figure 6. External Crystal Connections  
SSEL3–0  
VCO/SCLK  
SCLK  
100  
50  
0010  
2:1  
A third-overtone crystal can be used at frequencies above 25  
MHz. The circuit is then modified to ensure crystal operation  
only at the third overtone, by adding a tuned inductor circuit as  
shown in Figure 6. A design procedure for third-overtone oper-  
ation is discussed in detail in application note EE-168.  
0110  
6:1  
300  
1010  
10:1  
500  
50  
Note that the divisor ratio must be chosen to limit the system  
clock frequency to its maximum of fSCLK. The SSEL value can be  
changed dynamically without any PLL lock latencies by writing  
the appropriate values to the PLL divisor register (PLL_DIV).  
The Blackfin core runs at a different clock rate than the on-chip  
peripherals. As shown in Figure 7 on Page 18, the core clock  
(CCLK) and system peripheral clock (SCLK) are derived from  
the input clock (CLKIN) signal. An on-chip PLL is capable of  
multiplying the CLKIN signal by a programmable  
0.5
؋
 to 64
؋
 multiplication factor (bounded by specified mini-  
mum and maximum VCO frequencies). The default multiplier  
is 8
؋
, but it can be modified by a software instruction sequence.  
On-the-fly frequency changes can be effected by simply writing  
to the PLL_DIV register.  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL1–0 bits of the PLL_DIV register.  
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in  
Table 8. The default ratio is 1. This programmable core clock  
capability is useful for fast core frequency modifications.  
On-the-fly CCLK and SCLK frequency changes can be effected  
by simply writing to the PLL_DIV register. Whereas the maxi-  
mum allowed CCLK and SCLK rates depend on the applied  
Rev. PrG  
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Page 18 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
The maximum CCLK frequency not only depends on the part's  
speed grade, it also depends on the applied VDDINT voltage. See  
Table 16 through Table 18 for details.  
pins of the reset configuration register, sampled during power-  
on resets and software-initiated resets, implement the following  
modes:  
• Idle–no boot mode (BMODE=0x0) — In this mode, the  
processor goes into idle. The idle boot mode helps to  
recover from illegal operating modes, in the case the user  
misconfigured the OTP memory.  
Table 8. Core Clock Ratios  
Signal Name Divider Ratio Example Frequency Ratios  
CSEL1–0  
VCO/CCLK  
(MHz)  
VCO  
300  
• Boot from 8- or 16-bit external flash memory  
(BMODE=0x1) — In this mode, the boot kernel loads the  
first block header from address 0x2000 0000 and—depend-  
ing on instructions containing in the header—the boot  
kernel performs 8-bit or 16-bit boot or starts program exe-  
cution at the address provided by the header. By default, all  
configuration settings are set for the slowest device possible  
(3-cycle hold time; 15-cycle R/W access times; 4-cycle  
setup).  
CCLK  
300  
150  
125  
25  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
300  
500  
200  
BOOTING MODES  
The ADSP-BF542/4/7/8/9 processor has many mechanisms  
(listed in Table 9) for automatically loading internal and exter-  
nal memory after a reset. The boot mode is defined by four  
BMODE input pins dedicated to this purpose. There are two  
categories of boot modes: In master boot modes the processor  
actively loads data from parallel or serial memories. In slave  
boot modes the processor receives data from an external host  
devices.  
The ARDY is not enabled by default. It can however, be  
enabled by OTP programming. Similarly, all interface  
behavior and timings can customized up by OTP program-  
ming. This includes activation of burst-mode or page-  
mode operation. In this mode, all signals belonging to the  
asynchronous interface are enabled at port muxing level.  
• Boot from 16-bit asynchronous FIFO (BMODE=0x2) — In  
this mode, the boot kernel starts booting from address  
0x2030 0000. Every 16-bit word that boot kernel has to read  
from the FIFO must be requested by an low pulse on the  
DMAR1 pin.  
Table 9. Booting Modes  
BMODE3–0 Description  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
Idle–no boot  
• Boot from serial SPI memory, EEPROM or flash  
Boot from 8- or 16-bit external flash memory  
Boot from 16-bit asynchronous FIFO  
Boot from serial SPI memory (EEPROM or flash)  
Boot from SPI host device  
Boot from serial TWI memory (EEPROM/flash)  
Boot from TWI host  
(BMODE=0x3) — Eight-, 16-, 24- or 32-bit addressable  
devices are supported. (internal note: no special support for  
DataFlashes, as they understand now also standard SPI  
protocol). The processor uses the PE4 GPIO pin to select a  
single SPI EEPROM/flash device, submits a read command  
and successive address bytes (0x00) until a valid 8-, 16-,  
24-, or 32-bit addressable device is detected. Pull-up resis-  
tors are required on the SSEL and MISO pins. By default, a  
value of 0x85 is written to the SPI_BAUD register.  
Boot from UART host  
Reserved  
Reserved  
• Boot from SPI host device (BMODE=0x4) — The proces-  
sor operates in SPI slave mode (using SPI0) and is  
configured to receive the bytes of the.LDR file from an SPI  
host (master) agent. In the host, the HWAIT signal must be  
interrogated by the host before every transmitted byte. A  
pull-up resistor is required on the SPISS input. A pull-  
down on the serial clock may improve signal quality and  
booting robustness.  
Boot from (DDR) SDRAM  
Boot from OTP memory  
Reserved  
Boot from 8- or16-bit NANDflash memory via NFC  
Boot from 16-Bit Host DMA  
Boot from 8-Bit Host DMA  
• Boot from serial TWI memory, EEPROM/flash  
The boot modes listed in Table 9 provide a number of mecha-  
nisms for automatically loading the processor’s internal and  
external memories after a reset. By default all boot modes use  
the slowest meaningful configuration settings. Default settings  
can be altered via the initialization code feature at boot time or  
by proper OTP programming at pre-boot time.The BMODE  
(BMODE=0x5) — The processor operates in master mode  
(using TWI0) and selects the TWI slave with the unique id  
0xA0. The processor submits successive read commands to  
the memory device starting at two byte internal address  
0x0000 and begins clocking data into the processor. The  
TWI memory device should comply with Philips I2C Bus  
Specification version 2.1 and have the capability to auto-  
increment its internal address counter such that the con-  
tents of the memory device can be read sequentially. By  
default, a prescale value of 0xA and CLKDIV value of  
Rev. PrG  
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ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
0x0811 is used. Unless, altered by OTP settings an I2C  
memory that takes two address bytes is assumed. Develop-  
ment tools ensure that data that is booted to memories that  
cannot be accessed by the Blackfin core is written to inter-  
mediate storage place and then copied to final destination  
via Memory DMA.  
NAND flash boot supports the following features:  
• Device Auto Detection.  
• Error Detection & Correction for maximum  
reliability.  
• No boot stream size limitation.  
• Boot from TWI host (BMODE=0x6) — The TWI host  
agent selects the slave with the unique id 0x5F. The proces-  
sor (using TWI0) replies with an acknowledgement and the  
host can then download the boot stream. The TWI host  
agent should comply with Philips I2C Bus Specification ver-  
sion 2.1. An I2C multiplexer can be used to select one  
processor at a time when booting multiple processors from  
a single TWI.  
• Peripheral DMA via channel 22 providing efficient  
transfer of all data (excluding the ECC parity data).  
• Software configurable boot mode for booting from  
boot streams expanding multiple blocks including bad  
blocks.  
• Software configurable boot mode for booting from  
multiple copies of the boot stream allowing for han-  
dling of bad blocks and uncorrectable errors.  
• Boot from UART host (BMODE=0x7) — In this mode, the  
processor uses UART1 as booting source. Using an auto-  
baud handshake sequence, a boot-stream-formatted  
program is downloaded by the host. The host agent selects  
a bit rate within the UART’s clocking capabilities.  
• Configurable timing via OTP memory.  
Small page NAND flash devices must have a 512 byte page  
size, 32 pages per block, a 16 byte spare area size and a bus  
configuration of 8 bits. By default all read requests from the  
NAND flash are followed by 4 address cycles. If the NAND  
flash device requires only 3 address cycles the device must  
be capable of ignoring the additional address cycles.  
When performing the autobaud, the UART expects a “@”  
(0x40) character (eight bits data, one start bit, one stop bit,  
no parity bit) on the RXD pin to determine the bit rate. It  
then replies with an acknowledgement which is composed  
of 4 bytes: 0xBF, the value of UART_DLL, the value of  
UART_DLH, 0x00. The host can then download the boot  
stream. The processor deasserts the RTS output to hold off  
the host; CTS functionality is not enabled at boot time.  
The small page NAND flash device must comply with the  
following command set:  
Reset: 0xFF  
Read lower half of page: 0x00  
Read upper half of page: 0x01  
Read spare area: 0x50  
• Boot from (DDR) SDRAM (BMODE=0xA) — In this  
mode, the boot kernel starts booting from address  
0x0000 0010. This is a warm boot scenario only. The  
SDRAM is expected to contain a valid boot stream and the  
SDRAM controller must have been configured by the OTP  
settings.  
For large page NAND flash devices the 4 byte electronic  
signature is read in order to configure the kernel for boot-  
ing, this allows support for multiple large page devices.  
Byte 4 of the electronic signature must comply with the fol-  
lowing specification in Table 10 on page 21.  
• Boot from 8-bit and 16-bit external NAND flash memory  
(BMODE=0xD) - In this mode, auto detection of the  
NAND flash device is performed. The processor configures  
PORTJ GPIO pins PJ1 and PJ2 to enable the NAND CE  
and NAND RB signals respectively. For correct device  
operation pull-up resistors are required on both CE (PJ1)  
and RB (PJ2) signals. By default a value of 0x0033 is written  
to the NFC_CTL register. The booting procedure always  
starts by booting from byte 0 of block 0 of the NAND flash  
device.  
Any configuration from Table 10 that also complies with  
the command set listed below is directly supported by the  
boot kernel. There are no restrictions on the page size or  
block size as imposed by the small page boot kernel.  
Large page devices must support the following command  
set:  
Reset: 0xFF  
Read Electronic Signature: 0x90  
Read: 0x00, 0x30 (confirm command)  
Large page devices must not support or react to NAND  
flash command 0x50. This is a small page NAND flash  
command used for device auto detection.  
By default the boot kernel will always issue 5 address cycles,  
therefore if a large page device requires only 4 cycles, the  
device must be capable of ignoring the additional address  
cycles.  
Rev. PrG  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
16-bit NAND flash memory devices must only support the  
issuing of command and address cycles via the lower 8 bits  
of the data bus. Devices that make use of the full 16-bit bus  
for command and address cycles are not supported.  
as the SDRAM controller, then returns using an RTS  
instruction. The routine may also by the final application  
which will never return to the boot kernel.  
• Boot from 8-Bit Host DMA (BMODE=0xF) — In this  
mode, the Host DMA port is configured in 8-bit interrupt  
mode, little endian. Unlike in other modes, here the host is  
responsible for interpreting the boot stream. It writes data  
block per data block into the Host DMA port. Before con-  
figuring the DMA settings for each block, the host may  
either poll the ALLOW_CONFIG bit in HOST_STATUS  
or wait to be interrupted by the HWAIT signal. When  
using HWAIT, the host must still check ALLOW_CONFIG  
at least once before beginning to configure the Host DMA  
Port. The host will receive an interrupt from the  
Table 10. Byte 4 Electronic Signature Specification  
Page Size (excluding D1:D0 00  
1KBytes  
spare area)  
01  
2KBytes  
10  
11  
4KBytes  
8KBytes  
HOST_ACK signal every time it is allowed to send the next  
FIFO depth (Sixteen 32-bit words) of information. When  
the host sends an HIRQ control command, the boot kernel  
issues a CALL instruction to address 0xFFA0 0000. It is the  
host's responsibility to ensure valid code has been place at  
this address. The routine at 0xFFA0 0000 can be a simple  
initialization routine to configure internal resources, such  
as the SDRAM controller, then returns using an RTS  
instruction. The routine may also by the final application  
which will never return to the boot kernel.  
Spare Area Size  
D2  
0
1
8Bytes / 512Bytes  
16Bytes /  
512Bytes  
BlockSize(excluding D5:4  
spare area)  
00  
01  
10  
11  
0
64KBytes  
128 kBytes  
256KBytes  
512KBytes  
x8  
For each of the boot modes, a 16-byte header is first read from  
an external memory device. The header specifies the number of  
bytes to be transferred and the memory destination address.  
Multiple memory blocks may be loaded by any boot sequence.  
Once all blocks are loaded, program execution commences from  
the address stored in the EVT1 register.  
Bus width  
D6  
1
x16  
Not Used for  
configuration  
D3, D7  
Prior to booting, the pre-boot routine interrogates the OTP  
memory. Individual boot modes can be customized or even dis-  
abled based on OTP programming. External hardware,  
especially booting hosts may watch the HWAIT signal to deter-  
mine when the pre-boot has finished and the boot kernel starts  
the boot process. By programming OTP memory, the user can  
instruct the preboot routine to also customize: PLL and Voltage  
Regulator; DDR Controller; and Asynchronous Interface.  
• Boot from OTP memory (BMODE=0xB) — This provides  
a stand-alone booting method. The boot stream is loaded  
from on-chip OTP memory. By default the boot stream is  
expected to start from OTP page 0x40 on and can occupy  
all public OTP memory up to page 0xDF. This is 2560  
bytes. Since the start page is programmable the maximum  
size of the boot stream can be extended to 3072 bytes.  
The boot kernel differentiates between a regular hardware reset  
and a wakeup-from-hibernate event to speed up booting in the  
later case. Bits 6-4 in the system reset configuration (SYSCR)  
register can be used to bypass pre-boot routine and/or boot ker-  
nel in case of a software reset. They can also be used to simulate  
a wakeup-from-hibernate boot in the software reset case.  
• Boot from 16-Bit Host DMA (BMODE=0xE) — In this  
mode, the host DMA port is configured in 16-bit Acknowl-  
edge mode, little endian. Unlike in other modes, here the  
host is responsible for interpreting the boot stream. It  
writes data block per data block into the Host DMA port.  
Before configuring the DMA settings for each block, the  
host may either poll the ALLOW_CONFIG bit in  
HOST_STATUS or wait to be interrupted by the HWAIT  
signal. When using HWAIT, the host must still check  
ALLOW_CONFIG at least once before beginning to con-  
figure the Host DMA Port. After completing the  
configuration the host is required to poll the READY bit in  
HOST_STATUS before beginning to transfer data. When  
the host sends an HIRQ control command, the boot kernel  
issues a CALL instruction to 0xFFA0 0000 address. It is the  
host's responsibility to ensure valid code has been placed at  
this address. The routine at 0xFFA0 0000 can be a simple  
initialization routine to configure internal resources, such  
The boot process can be further customized by “initialization  
code.” This is a piece of code that is loaded and executed prior to  
the regular application boot. Typically, this is used to configure  
the DDR controller or to speed up booting by managing PLL,  
clock frequencies, wait states, or serial bit rates.  
The boot ROM also features C-callable function entries that can  
be called by the user application at run time. This enables sec-  
ond-stage boot or boot management schemes to be  
implemented with ease.  
Rev. PrG  
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Page 21 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
allowing the developer to load code, set breakpoints, observe  
variables, observe memory, and examine registers. The proces-  
sor must be halted to send data and commands, but once an  
operation has been completed by the emulator, the processor  
system is set running at full speed with no impact on system  
timing.  
INSTRUCTION SET DESCRIPTION  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax designed for ease of coding and  
readability. The instructions have been specifically tuned to pro-  
vide a flexible, densely encoded instruction set that compiles to  
a very small final memory size. The instruction set also provides  
fully featured multifunction instructions that allow the pro-  
grammer to use many of the processor core resources in a single  
instruction. Coupled with many features more often seen on  
microcontrollers, this instruction set is very efficient when com-  
piling C and C++ source code. In addition, the architecture  
supports both user (algorithm/application code) and supervisor  
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-  
tion, allowing multiple levels of access to core processor  
resources.  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see Analog Devices JTAG Emulation Technical Reference  
(EE-68) on the Analog Devices web site under  
www.analog.com/ee-notes. This document is updated regularly  
to keep pace with improvements to emulator support.  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
RELATED DOCUMENTS  
The following publications that describe the  
• Seamlessly integrated DSP/MCU features are optimized for  
both 8-bit and 16-bit operations.  
ADSP-BF542/4/7/8/9 processors (and related processors) can  
be ordered from any Analog Devices sales office or accessed  
electronically on our Website:  
• A multi-issue load/store modified-Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
• ADSP-BF54x Blackfin Processor Hardware Reference  
• ADSP-BF54x Blackfin Processor Peripheral Reference  
• ADSP-BF54x Blackfin Processor Programming Reference  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space, providing a simplified program-  
ming model.  
• ADSP-BF542 Blackfin Embedded Processor Silicon Anom-  
aly List (in preparation)  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data-types; and separate user and  
supervisor stack pointers.  
• ADSP-BF544 Blackfin Embedded Processor Silicon Anom-  
aly List (in preparation)  
• ADSP-BF548 Blackfin Embedded Processor Silicon Anom-  
aly List (in preparation)  
• Code density enhancements, which include intermixing of  
16- and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded in  
16 bits.  
• ADSP-BF549 Blackfin Embedded Processor Silicon Anom-  
aly List  
DEVELOPMENT TOOLS  
The ADSP-BF542/4/7/8/9 processor is supported with a com-  
plete set of CROSSCORE® software and hardware development  
tools, including Analog Devices emulators and VisualDSP++®  
development environment. The same emulator hardware that  
supports other Blackfin processors also fully emulates the  
ADSP-BF542/4/7/8/9 processor.  
EZ-KIT Lite® Evaluation Board  
For evaluation of ADSP-BF542/4/7/8/9 processors, use the  
ADSP-BF548 EZ-KIT Lite board available from Analog Devices.  
Order part number ADDS-BF548-EZLITE. The board comes  
with on-chip emulation capabilities and is equipped to enable  
software development. Multiple daughter cards are available.  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD (TARGET)  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs to test and debug hardware and software  
systems. Analog Devices has supplied an IEEE 1149.1 JTAG  
Test Access Port (TAP) on each JTAG processor. The emulator  
uses the TAP to access the internal features of the processor,  
Rev. PrG  
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Page 22 of 82  
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December 2007  
Preliminary Technical Data  
PIN DESCRIPTIONS  
ADSP-BF542/4/7/8/9  
ADSP-BF542/4/7/8/9 processor pin multiplexing scheme is  
listed in Table 11 and the pin definitions are listed in Table 12.  
Table 11. Pin Multiplexing  
Primary Pin  
Function  
First Peripheral  
Function  
Second Peripheral  
Function  
Third Peripheral  
Function  
Fourth Peripheral  
Function  
Interrupt Capability  
(Number of  
Pins)1, 2  
Port A  
GPIO (16 pins)  
SPORT2 (8 pins)  
SPORT3 (8 pins)  
TMR4 (1 pin)  
TMR5 (1 pin)  
TMR6 (1 pin)  
TMR7 (1 pin)  
TACI7 (1 shared pin)  
TACLK7-0 (8 pins)  
Interrupts (16 pins)  
Port B  
GPIO (15 pins)  
TWI1 (2 pins)  
HWAIT (1 pin)  
UART2 or 3 CTL (2 pins)  
UART2 (2 pins)  
UART3 (2 pins)  
TACI2-3 (2 pins)  
HWAIT (1 pin)  
Interrupts (15 pins)  
SPI2 SEL (4 pins)  
SPI2 (3 pins)  
TMR0–2 (3 pins)  
TMR3 (1 pin)  
Port C  
GPIO (16 pins)  
SPORT0 (8 pins)  
SDH (6 pins)  
MXVR MMCLK, MBCLK  
(2 pins)  
Interrupts (8 pins)3  
Interrupts (8 pins)  
Port D  
GPIO (16 pins)  
EPPI1 D0–15 (16 pins) Host D0–15 (16 pins) SPORT1 (8 pins)  
EPPI2 D0–7 (8 pins)  
EPPI0 D18– 23 (6 pins) Interrupts (8 pins)  
Keypad  
Interrupts (8 pins)  
Interrupts (8 pins)  
Interrupts (8 pins)  
Row 0–3  
Col 0–3 (8 pins)  
Port E  
GPIO (16 pins)  
SPI0 (7 pins)  
Keypad  
TACI0 (1 pin)  
Row 4–6  
Col 4–7 (7 pins)  
UART0 TX (1 pin)  
Keypad R7 (1 pin)  
UART0 RX (1 pin)  
UART0 or 1 CTL (2 pins)  
EPPI1 CLK,FS (3 pins)  
5V-Tolerant inputs TWI0 (2 pins)  
Port F  
GPIO (16 pins)  
EPPI0 D0–15 (16 pins)  
Interrupts (8 pins)  
Interrupts (8 pins)  
Rev. PrG  
|
Page 23 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 11. Pin Multiplexing  
Primary Pin  
Function  
First Peripheral  
Function  
Second Peripheral  
Function  
Third Peripheral  
Function  
Fourth Peripheral  
Function  
Interrupt Capability  
(Number of  
Pins)1, 2  
Port G  
GPIO (16 pins)  
EPPI0 CLK,FS (3 pins) TMRCLK (1 pin)  
DATA 16–17 (2 pins)  
Interrupts (8 pins)  
Interrupts (8 pins)  
SPI1 SEL1–3 (3 pins)  
SPI1 (4 pins)  
Host CTL (3 pins)  
EPPI2 CLK,FS (3 pins) CZM (1 pin)  
MXVR MTXON (1 pin) TACI4-5 (2 pins)  
CAN0 (2 pins)  
CAN1 (2 pins)  
Port H  
GPIO (14 pins)  
UART1 (2 pins)  
EPPI0-1_FS3 (2 pins)  
TMR8 (1 pin)  
TACI1 (1 pin)  
Interrupts (8 pins)  
ATAPI_RST (1 pin)  
HOST_ADDR (1 pin)  
EPPI2_FS3 (1 pin)  
TMR9 (1 pin)  
Counter Down/Gate  
(1 pin)  
HOST_ACK (1 pin)  
TMR10 (1 pin)  
Counter Up/Dir  
(1 pin)  
MXVR MRX, MTX,  
MRXON (3 pins)  
DMAR 0–1 (2 pins)  
TACI8-10 (3 shared  
pins)  
TACLK8-10 (3 shared  
pins)  
HWAIT  
AMC Addr 4-9 (6 pins)  
Interrupts (6 pins)  
Port I  
GPIO (16 pins)  
Async Addr10–25  
(16 pins)  
Interrupts (8 pins)  
Interrupts (8 pins)  
Port J  
GPIO (14 pins)  
Async CTL and MISC  
Interrupts (8 pins)  
Interrupts (6 pins)  
1 Port connections may be inputs or outputs after power up depending on BF54x family member number and boot mode chosen.  
2 All Port connections always power up as inputs for some period of time and require resistive termination to a safe condition if used as outputs in the system.  
3 A total of 32 interrupts at once are available from Ports C through J, configurable in byte-wide blocks.  
ADSP-BF542/4/7/8/9 processor pin definitions are listed in  
Table 12. To see the pin multiplexing scheme, see Table 11.  
Rev. PrG  
|
Page 24 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 12. Pin Descriptions  
Pin Name  
I/O1 Function (First/Second/Third/Fourth)  
Port A: GPIO/SPORT2–3/TMR4–7  
PA0 / TFS2  
I/O GPIO/SPORT2 Transmit Frame Sync  
I/O GPIO/SPORT2 Transmit Data Secondary/Timer 4  
I/O GPIO/SPORT2 Transmit Data Primary  
I/O GPIO/SPORT2 Transmit Serial Clock  
I/O GPIO/SPORT2 Receive Frame Sync  
PA1 / DT2SEC /TMR4  
PA2 / DT2PRI  
PA3 / TSCLK2  
PA4 / RFS2  
PA5 / DR2SEC/TMR5  
PA6 / DR2PRI  
I/O GPIO/SPORT2 Receive Data Secondary/Timer 5  
I/O GPIO/SPORT2 Receive Data Primary  
PA7 / RSCLK2/TACLK0  
PA8 / TFS3/TACLK1  
PA9 / DT3SEC /TMR6  
PA10 / DT3PRI /TACLK2  
PA11 / TSCLK3/TACLK3  
PA12 / RFS3/TACLK4  
PA13 / DR3SEC/TMR7/TACLK5  
PA14 / DR3PRI/TACLK6  
PA15 / RSCLK3/TACLK7 and TACI7  
Port B: GPIO/TWI1/UART2–3/SPI2/TMR0–3  
PB0/SCL1  
I/O GPIO/SPORT2 Receive Serial Clock/Alternate Input Clock 0  
I/O GPIO/SPORT3 Transmit Frame Sync/Alternate Input Clock 1  
I/O GPIO/SPORT3 Transmit Data Secondary/Timer 6  
I/O GPIO/SPORT3 Transmit Data Primary/Alternate Input Clock 2  
I/O GPIO/SPORT3 Transmit Serial Clock/Alternate Input Clock 3  
I/O GPIO/SPORT3 Receive Frame Sync/Alternate Input Clock 4  
I/O GPIO/SPORT3 Receive Data Secondary/Timer 7/Alternate Input Clock 5  
I/O GPIO/SPORT3 Receive Data Primary/Alternate Input Clock 6  
I/O GPIO/SPORT3 Receive Serial Clock/Alt Input Clock 7 and Alt Capture Input 7  
I/O GPIO/TWI1 Serial Clock  
PB1/SDA1  
I/O GPIO/TWI1 Serial Data  
PB2/UART3RTS  
I/O GPIO/UART3 Request To Send  
I/O GPIO/UART3 Clear To Send  
PB3/UART3CTS  
PB4/UART2TX  
I/O GPIO/UART2 Transmit  
PB5/UART2RX/TACI2  
PB6/UART3TX  
I/O GPIO/UART2 Receive/Alternate Capture Input 2  
I/O GPIO/UART3 Transmit  
PB7/UART3RX/TACI3  
PB8/SPI2SS/TMR0  
PB9/SPI2SEL1/TMR1  
PB10/SPI2SEL2/TMR2  
PB11/SPI2SEL3/TMR3/ HWAIT5  
PB12/SPI2SCK  
I/O GPIO/UART3 Receive/Alternate Capture Input 3  
I/O GPIO/SPI2 Slave Select Input/Timer 0  
I/O GPIO/SPI2 Slave Select Enable 1/Timer 1  
I/O GPIO/SPI2 Slave Select Enable 2/Timer 2  
I/O GPIO/SPI2 Slave Select Enable 3/Timer 3/Boot Host Wait  
I/O GPIO/SPI2 Clock  
PB13/SPI2MOSI  
I/O GPIO/SPI2 Master Out Slave In  
I/O GPIO/SPI2 Master In Slave Out  
PB14/SPIMISO  
Rev. PrG  
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Page 25 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 12. Pin Descriptions (Continued)  
Pin Name  
I/O1 Function (First/Second/Third/Fourth)  
Port C: GPIO/SPORT0/SD Controller/MXVR (MOST)  
PC0/TFS0  
I/O GPIO/SPORT0 Transmit Frame Sync  
I/O GPIO/SPORT0 Transmit Data Secondary/MXVR Master Clock  
I/O GPIO/SPORT0 Transmit Data Primary  
I/O GPIO/SPORT0 Transmit Serial Clock  
I/O GPIO/SPORT0 Receive Frame Sync  
I/O GPIO/SPORT0 Receive Data Secondary/MXVR Bit Clock  
I/O GPIO/SPORT0 Receive Data Primary  
I/O GPIO/SPORT0 Receive Serial Clock  
I/O GPIO/SD Data Bus  
PC1/DT0SEC /MMCLK  
PC2/DT0PRI  
PC3/TSCLK0  
PC4/RFS0  
PC5/DR0SEC/MBCLK  
PC6/DR0PRI  
PC7/RSCLK0  
PC8/SD_D0  
PC9/SD_D1  
I/O GPIO/SD Data Bus  
PC10/SD_D2  
I/O GPIO/SD Data Bus  
PC11/SD_D3  
I/O GPIO/SD Data Bus  
PC12/SD_CLK  
I/O GPIO/SD Clock Output  
PC13/SD_CMD  
I/O GPIO/SD Command  
Port D: GPIO/EPPI0–2/SPORT 1/Keypad/Host DMA  
PD0/PPI1_D0/HOST_D8/ TFS1/PPI0_D18  
PD1/PPI1_D1/HOST_D9/ DT1SEC /PPI0_D19  
PD2/PPI1_D2/HOST_D10/ DT1PRI /PPI0_D20  
PD3/PPI1_D3/HOST_D11/ TSCLK1/PPI0_D21  
PD4/PPI1_D4/HOST_D12/RFS1/PPI0_D22  
PD5/PPI1_D5/HOST_D13/DR1SEC/PPI0_D23  
PD6/PPI1_D6/HOST_D14/DR1PRI  
PD7/PPI1_D7/HOST_D15/RSCLK1  
PD8/PPI1_D8/HOST_D0/ PPI2_D0/KEY_ROW0  
PD9/PPI1_D9/HOST_D1/PPI2_D1/KEY_ROW1  
PD10/PPI1_D10/HOST_D2/PPI2_D2/KEY_ROW2  
PD11/PPI1_D11/HOST_D3/PPI2_D3/KEY_ROW3  
PD12/PPI1_D12/HOST_D4/PPI2_D4/KEY_COL0  
PD13/PPI1_D13/HOST_D5/PPI2_D5/KEY_COL1  
PD14/PPI1_D14/HOST_D6/PPI2_D6/KEY_COL2  
PD15/PPI1_D15/HOST_D7/PPI2_D7/KEY_COL3  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Frame Sync/EPPI0 Data  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Data Secondary/EPPI0 Data  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Data Primary/EPPI0 Data  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Transmit Serial Clock/EPPI0 Data  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Receive Frame Sync/EPPI0 Data  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Receive Data Secondary/EPPI0 Data  
I/O GPIO/EPPI1 Data/Host DMA/SPORT 1 Receive Data Primary  
I/O GPIO/EPPI1 Data /Host DMA/SPORT 1 Receive Serial Clock  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Row Input  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output  
I/O GPIO/EPPI1 Data/Host DMA/EPPI2 Data/Keypad Column Output  
Rev. PrG  
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Page 26 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 12. Pin Descriptions (Continued)  
Pin Name  
I/O1 Function (First/Second/Third/Fourth)  
Port E: GPIO/SPI0/UART0-1/EPPI1/TWI0/Keypad  
PE0/SPI0SCK/KEY_COL72  
PE1/SPI0MISO/KEY_ROW62  
PE2/SPI0MOSI/KEY_COL6  
PE3/SPI0SS/KEY_ROW5  
PE4/SPI0SEL1/KEY_COL52  
PE5/SPI0SEL2/KEY_ROW4  
PE6/SPI0SEL3/KEY_COL4  
PE7/UART0TX/KEY_ROW7  
PE8/UART0RX/TACI0  
PE9/UART1RTS  
I/O GPIO/SPI0 Clock/Keypad Column Output  
I/O GPIO/SPI0 Master In Slave Out/Keypad Row Input  
I/O GPIO/SPI0 Master Out Slave In/Keypad Column Output  
I/O GPIO/SPI0 Slave Select Input/Keypad Row Input  
I/O GPIO/SPI0 Slave Select Enable 1/Keypad Column Output  
I/O GPIO/SPI0 Slave Select Enable 2/Keypad Row Input  
I/O GPIO/SPI0 Slave Select Enable 3/Keypad Column Output  
I/O GPIO/UART0 Transmit/Keypad Row Input  
I/O GPIO/UART0 Receive/Alternate Capture Input 0  
I/O GPIO/UART1 Request To Send  
PE10/UART1CTS  
I/O GPIO/UART1 Clear To Send  
PE11/PPI1_CLK  
I/O GPIO / EPPI1Clock  
PE12/PPI1_FS1  
I/O GPIO/EPPI1 Frame Sync 1  
PE13/PPI1_FS2  
I/O GPIO/EPPI1 Frame Sync 2  
PE14/SCL03  
I/O GPIO/TWI0 Serial Clock  
PE15/SDA03  
I/O GPIO/TWI0 Serial Data  
Port F: GPIO / EPPI0 / Alternate ATAPI Data  
PF0/PPI0_D0/ATAPI_D0A4  
PF1/PPI0_D1/ATAPI_D1A4  
PF2/PPI0_D2/ATAPI_D2A4  
PF3/PPI0_D3/ATAPI_D3A4  
PF4/PPI0_D4/ATAPI_D4A4  
PF5/PPI0_D5/ATAPI_D5A4  
PF6/PPI0_D6/ATAPI_D6A4  
PF7/PPI0_D7/ATAPI_D7A4  
PF8/PPI0_D8/ATAPI_D8A4  
PF9/PPI0_D9/ATAPI_D9A4  
PF10/PPI0_D10/ATAPI_D10A4  
PF11/PPI0_D11/ATAPI_D11A4  
PF12/PPI0_D12/ATAPI_D12A4  
PF13/PPI0_D13/ATAPI_D13A4  
PF14/PPI0_D14/ATAPI_D14A4  
PF15/PPI0_D15/ATAPI_D15A4  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
I/O GPIO/EPPI0 Data/Alternate ATAPI Data  
Rev. PrG  
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Page 27 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 12. Pin Descriptions (Continued)  
Pin Name  
I/O1 Function (First/Second/Third/Fourth)  
Port G: GPIO / EPPI0 / SPI1 / EPPI2 / Up-Down Counter / CAN0–1 / Host DMA/ MXVR (MOST)  
PG0/PPI0_CLK/TMRCLK  
I/O GPIO/EPPI0 Clock/External Timer Reference  
I/O GPIO/EPPI0 Frame Sync 1  
PG1/PPI0_FS1  
PG2/PPI0_FS2/ATAPI_A0A4  
PG3/PPI0_D16/ATAPI_A1A4  
PG4/PPI0_D17/ATAPI_A2A4  
PG5/SPI1SEL1/HOST_CE/PPI2_FS2/ CZM  
I/O GPIO/EPPI0 Frame Sync 2/Alternate ATAPI Address  
I/O GPIO/EPPI0 Data/Alternate ATAPI Address  
I/O GPIO/EPPI0 Data/Alternate ATAPI Address  
I/O GPIO/SPI1 Slave Select/Host DMA Chip Enable/EPPI2 Frame Sync 2/Counter Zero  
Marker  
PG6/SPI1SEL2/HOST_RD/ PPI2_FS1  
PG7/SPI1SEL3/HOST_WR/ PPI2_CLK  
PG8/SPI1SCK  
I/O GPIO/SPI1 Slave Select/ Host DMA Read/EPPI2 Frame Sync 1  
I/O GPIO/SPI1 Slave Select/Host DMA Write/EPPI2 Clock  
I/O GPIO/SPI1 Clock  
PG9/SPI1MISO  
I/O GPIO/SPI1 Master In Slave Out  
PG10/SPI1MOSI  
I/O GPIO/SPI1 Master Out Slave In  
PG11/SPI1SS/MTXON  
PG12/CAN0TX  
I/O GPIO/SPI1 Slave Select Input/MXVR Transmit Phy On  
I/O GPIO/CAN0 Transmit  
PG13/CAN0RX/TACI4  
PG14/CAN1TX  
I/O GPIO/CAN0 Receive/Alternate Capture Input 4  
I/O GPIO/CAN1 Transmit  
PG15/CAN1RX/TACI5  
I/O GPIO/CAN1 Receive/Alternate Capture Input 5  
Port H: GPIO/AMC / EXTDMA / UART1 / EPPI0–2 / ATAPI Interface / Up-Down Counter /TMR8-10/ Host DMA / MXVR (MOST)  
PH0/UART1TX/PPI1_FS3_DEN  
PH1/UART1RX/PPI0_FS3_DEN/TACI1  
PH2/ATAPI_RESET /TMR8/PPI2_FS3_DEN  
PH3/HOST_ADDR/TMR9/CDG  
PH4/HOST_ACK/TMR10/CUD  
PH5/MTX/DMAR0/TACI8 and TACLK8  
PH6/MRX/DMAR1/TACI9 and TACLK9  
PH7/MRXON/TACI10 and TACLK10/HWAITA5  
PH8/A46  
I/O GPIO/UART1 Transmit/EPPI1 Frame Sync 3  
I/O GPIO/UART 1 Receive/ EPPI0 Frame Sync 3/Alternate Capture Input 1  
I/O GPIO/ATAPI Interface Hard Reset Signal/Timer 8/EPPI2 Frame Sync 3  
I/O GPIO/HOST Address/Timer 9/Count Down and Gate  
I/O GPIO/HOST Acknowledge/Timer 10/Count Up and Direction  
I/O GPIO/MXVR Transmit Data/Ext. DMA Request/Alt Capt. In. 8 /Alt In. Clk 8  
I/O GPIO/MXVR Receive Data/Ext. DMA Request/Alt Capt. In. 9 /Alt In. Clk 9  
I/O GPIO/MXVR Receive Phy On /Alt Capt. In. 10 /Alt In. Clk 10/Alternate Boot Host Wait  
I/O GPIO/Address Bus for Async Access  
PH9/A56  
I/O GPIO/Address Bus for Async Access  
PH10/A66  
I/O GPIO/Address Bus for Async Access  
PH11/A76  
I/O GPIO/Address Bus for Async Access  
PH12/A86  
I/O GPIO/Address Bus for Async Access  
PH13/A96  
I/O GPIO/Address Bus for Async Access  
Rev. PrG  
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Page 28 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 12. Pin Descriptions (Continued)  
Pin Name  
I/O1 Function (First/Second/Third/Fourth)  
Port I: GPIO / AMC  
PI0/A106  
PI1/A116  
PI2/A126  
PI3/A136  
PI4/A146  
PI5/A156  
PI6/A166  
PI7/A176  
PI8/A186  
PI9/A196  
PI10/A206  
PI11/A216  
PI12/A226  
PI13/A236  
PI14/A246  
PI15/A25/NR_CLK6  
Port J: GPIO / AMC / ATAPI Controller  
PJ0 / ARDY/WAIT  
PJ1 / ND_CE7  
PJ2 / ND_RB  
PJ3 / ATAPI_DIOR  
PJ4 / ATAPI_DIOW  
PJ5 / ATAPI_CS0  
PJ6 / ATAPI_CS1  
PJ7 / ATAPI_DMACK  
PJ8 / ATAPI_DMARQ  
PJ9 / ATAPI_INTRQ  
PJ10 / ATAPI_IORDY  
PJ11 / BR8  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access  
I/O GPIO/Address Bus for Async Access/ NOR clock  
I/O GPIO/Async Ready/NOR Wait  
I/O GPIO/NAND Chip Enable  
I/O GPIO/Ready Busy Signal  
I/O GPIO/ATAPI Read  
I/O GPIO/ATAPI Write  
I/O GPIO/ATAPI Chip Select Signal Command Block  
I/O GPIO/ATAPI Chip Select Signal  
I/O GPIO/ATAPI DMA Acknowledge Signal  
I/O GPIO/ATAPI DMA Request Signal  
I/O GPIO/Interrupt Request from the Device  
I/O GPIO/ATAPI Ready Handshake Signal  
I/O GPIO/Bus Request  
PJ12 / BG6  
I/O GPIO/Bus Grant  
PJ13 / BGH6  
Memory Interface  
DA0–12  
I/O GPIO/Bus Grant Hang  
O
O
DDR Address Bus  
DBA0–1  
DDR Bank Active Strobe  
DQ0–15  
I/O DDR Data Bus  
DQS0–1  
I/O DDR Data Strobe  
DQM0–1  
O
O
O
O
O
O
O
O
DDR Data Mask for Reads and Writes  
DDR Output Clock  
DCLK0–1  
DCLK0–1  
DDR Complementary Output Clock  
DDR Chip Selects  
DCS0–1  
DCLKE  
DDR Clock Enable  
DRAS  
DDR Row Address Strobe  
DDR Column Address Strobe  
DDR Write Enable  
DCAS  
DWE  
Rev. PrG  
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Page 29 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 12. Pin Descriptions (Continued)  
Pin Name  
I/O1 Function (First/Second/Third/Fourth)  
Memory Interface (Continued)  
DDR_VREF  
I
I
DDR Voltage Reference  
DDR_VSSR  
DDR Voltage Reference Shield (connect to GND)  
Asynchronous Memory Interface  
A1-3  
O
Address Bus for Async and ATAPI Addresses  
D0-15/ND_D0-15/ATAPI_D0-15  
AMS0–3  
I/O Data Bus for Async, NAND and ATAPI Accesses  
O
O
O
O
O
O
Bank Selects  
ABE0 /ND_CLE  
ABE1/ND_ALE  
AOE/NR_ADV  
ARE  
Byte Enables:Data Masks for Asynchronous Access/NAND Command Latch Enable  
Byte Enables:Data Masks for Asynchronous Access/NAND Address Latch Enable  
Output Enable/NOR Address Data Valid  
Read Enable/NOR Output Enable  
AWE  
Write Enable  
ATAPI Controller Pins  
ATAPI_PDIAG  
High Speed USB OTG Pins9  
USB_DP  
I
I/O USB D+ pin  
I/O USB D- pin  
USB_DM  
USB_XI  
C
C
I
Clock XTAL input  
USB_XO  
USB_ID10  
Clock XTAL output  
USB ID pin  
USB_VBUS  
I/O USB VBUS pin  
USB_VREF  
A
A
USB voltage reference. Connect 0.1 F capacitor between USB_VREF and GND.  
USB_RSET  
USB resistance set. Preliminary designs should connect USB_RSET to an unpopu-  
lated resistor pad. Connect the other terminal of the unpopulated resistor to GND.  
MXVR (MOST) Interface  
MFS  
O
A
A
C
C
MXVR Frame Sync  
MLF_P  
MXVR Loop Filter Plus  
MXVR Loop Filter Minus  
MXVR Crystal Input  
MXVR Crystal Output  
MLF_M  
MXI11  
MXO  
Mode Control Pins  
BMODE0–3  
JTAG Port Pins  
TDI  
I
Boot Mode Strap 0–3  
I
JTAG Serial Data In  
JTAG Serial Data Out  
JTAG Reset  
TDO  
TRST12  
O
I
TMS  
I
JTAG Mode Select  
JTAG Clock  
TCK  
I
EMU  
O
Emulation Output  
Voltage Regulator  
VROUT0, VROUT113  
Real Time Clock  
RTXO  
O
External FET/BJT Drivers  
C
C
RTC Crystal Output  
RTC Crystal Input  
RTXI11  
Rev. PrG  
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Page 30 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 12. Pin Descriptions (Continued)  
Pin Name  
Clock (PLL) Pins  
CLKIN  
I/O1 Function (First/Second/Third/Fourth)  
C
O
C
O
O
I
Clock/Crystal Input  
Clock Output  
CLKOUT  
XTAL  
Crystal Output  
CLKBUF  
EXT_WAKE  
RESET  
Buffered Oscillator output  
External Wakeup from hibernate output  
Reset  
NMI14  
I
Non-maskable Interrupt  
Supplies  
VDDINT  
P
P
P
P
P
P
G
P
G
Internal Power Supply  
External Power Supply  
External DDR Power Supply  
External USB Power Supply  
RTC Clock Supply  
15  
VDDEXT  
VDDDDR  
15  
VDDUSB  
VDDRTC  
16  
VDDVR  
Internal Voltage Regulator Power Supply  
Ground  
GND  
15  
VDDMP  
MXVR PLL Power Supply  
17, 18  
GNDMP  
MXVR PLL Ground  
1 I = Input, O = Output, P =Power, G = Ground, C = Crystal, A = Analog.  
2 To use the SPI memory boot, SCLK0 should have a pulldown, MISO should have a pullup, and SPISEL1 is used as CS with a pullup.  
3 To use the serial TWI memory boot, SDA0 and SCL0 should have a pullup.  
4 By default the ATAPI bus shares the data pins D0-15 and the address pins A0-2 with the asynchronous memory interface and the NAND controller. When PORTF_MUX[1:0]  
= b#01, then the ATAPI data bus is available through Port F and the address line can be found at Port G.  
5 The Boot Host Wait (HWAIT) signal on PB11 is a GPIO output that is driven and toggled by the boot kernel at boot time. An external pulling resistor is required for proper  
operation. A pull-up resistor instructs the HWAIT signal to behave active high (low when ready for data). A pull-down resistor instructs the HWAIT signal to behave active  
low (high when ready for data). After boot it can be used for other purposes. If the PB11 pin is required for other purposes (for example, timer or SPI operation) the Alternate  
Boot Host Wait (HWAITA) on PH7 can be used instead. This is enabled by programming the OTP_ALTERNATE_HWAIT bit in the PBS00L OTP memory page.  
6 This pin should not be used as GPIO if booting in mode 1.  
7 This pin should always be enabled as ND_CE in software and pulled HIGH with a resistor when using NAND flash.  
8 This pin should always be enabled as bus request in software and pulled HIGH to enable the Async access.  
9 For the ADSP-BF542/4/7/8/9, the unused USB pins should be terminated as follows: USB_DP --> GND; USB_DM -->GND; USB_XTALIN --> GND; USB_XTALOUT -->  
NC (No Connect); USB_ID --> VSS; USB_VREF --> NC; USB_RSET --> NC; USB_VBUS --> VSS; VDDUSB --> VDDEXT  
10In the case that USB is used in device mode only, the USB_ID pin should be either pulled HIGH or left unconnected.  
11This pin should always be pulled either HIGH or LOW, but must not be left floating.  
12This pin should be pulled LOW if the JTAG port will not be used.  
13Always connect VROUT0 and VROUT1 together to reduce signal impedance.  
14This pin should always be pulled HIGH when not used.  
15Power and ground pins of peripherals should be driven to their specified level even if the associated peripheral is not used in the application.  
16The VDDVR pin must always be connected. If the internal voltage regulator is not being used, this pin may be connected to VDDEXT. Otherwise it should be powered  
according to the VDDVR specification.  
17Analog ground for MXVR.  
18Connect to GND when MXVR is not used.  
Rev. PrG  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
SPECIFICATIONS  
Note that component specifications are subject to change  
without notice.  
OPERATING CONDITIONS  
Parameter1  
Minimum  
Nominal  
Maximum Unit  
2
VDDINT  
Internal Supply Voltage  
0.9  
1.0  
1.43  
1.38  
3.6  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Internal Supply Voltage for Automotive Grade  
3,4  
4
VDDEXT  
External Supply Voltage for 3.3V I/O  
External Supply Voltage for 2.5V I/O7  
2.7  
3.3  
2.5  
3.3  
3.3  
2.25  
2.7  
2.75  
3.6  
External Supply Voltage for Automotive Grade  
USB External Supply Voltage  
VDDUSB  
3.0  
3.6  
5
VDDMP  
MXVR PLL Supply Voltage  
0.9  
1.43  
1.38  
3.6  
MXVR PLL Supply Voltage for Automotive Grade  
Real Time Clock Power Supply Voltage  
1.0  
4
VDDRTC  
2.25  
2.7  
Real Time Clock Power Supply Voltage for Automotive Grade  
DDR Memory Supply Voltage  
3.3  
2.5  
1.8  
3.3  
3.6  
4
VDDDDR  
2.3  
2.7  
DDR Memory Supply Voltage for Mobile DDR  
Internal Voltage Regulator Supply Voltage  
High Level Input Voltage for 3.3V I/O7,8 @ VDDEXT =maximum  
High Level Input Voltage for 2.5VI/O7,8 @ VDDEXT =maximum  
High Level Input Voltage for 3.3V I/O9 @ VDDEXT =maximum  
High Level Input Voltage for 2.5V I/O9 @ VDDEXT =maximum  
High Level Input Voltage10  
High Level Input Voltage for Mobile DDR10  
High Level Input Voltage for 3.3V I/O11, @ VDDEXT =maximum  
High Level Input Voltage for 2.5V I/O11, @ VDDEXT =maximum  
High Level Input Voltage for USB_DP, USB_DM, and USB_VBUS12  
Low Level Input Voltage for 3.3V I/O7, 13, @ VDDEXT =minimum  
Low Level Input Voltage for 2.5V I/O7, 13 @ VDDEXT =minimum  
Low Level Input Voltage for 3.3V I/O14, @ VDDEXT =minimum  
Low Level Input Voltage for 2.5V I/O14 @ VDDEXT =minimum  
Low Level Input Voltage10  
1.7  
1.9  
6
VDDVR  
2.7  
3.6  
VIH  
2.0  
3.6  
TBD  
2.2  
3.6  
VIHCLKIN  
VIHDDR  
VIH5V  
3.6  
TBD  
VREFDDR + 0.15  
0.8 x VDDDDR  
2.0  
3.6  
VDDDDR + 0.3 V  
VDDDDR + 0.3 V  
5.5  
5.5  
V
V
V
V
V
V
V
TBD  
VIHUSB  
VIL  
5.5  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
-0.3  
0.6  
TBD  
0.8  
VIL5V  
TBD  
VILDDR  
VREFDDR - 0.15 V  
Low Level Input Voltage for Mobile DDR10  
0.2 x VDDDDR  
V
VREFDDR  
TJ15  
TJ15  
DDR VREF Pin Input Voltage  
0.49 x VDDDDR 0.50 x VDDDDR 0.51 x VDDDDR  
V
Junction Temperature @TAMBIENT = –40ºC to +85ºC  
Junction Temperature @TAMBIENT = 0ºC to +70ºC  
–40  
0
+105  
+90  
ºC  
ºC  
1 Specifications subject to change without notice.  
2 VDDINT maximum is 1.10 V during One-Time-Programmable (OTP) memory programming operations. VDDINT maximum is per the operating conditions table for OTP  
memory read operations.  
3 VDDEXTis 3.0 V min and 3.6 V max duringOTPmemory programming operations. VDDEXT isspecified per the operating conditionstablefor OTPmemory readoperations.  
4 Must remain powered (even if associated function not used).  
5 Connect to VDDINT if MXVR is not used.  
6 VDDVR must always be connected. If the internal voltage regulator is not being used, this pin may be connected to VDDEXT. Otherwise it should be powered according to  
this specification.  
7 The ADSP-BF542/4/7/8/9 processor is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT  
,
because VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bi-directional pins (D15–0, PA15–0, PB14–0, PC15–0, PD15–0, PE15–0,  
PF15–0, PG15–0, PH13–0, PI15–0, PJ14–0) and input only pins (ATAPI_PDIAG, USB_ID, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE3–0).  
8 Parameter value applies to all input and bi-directional pins, except CLKIN, PB0, PB1, PE14, PE15, PG15–11, PH6, PH7, and the pins listed in table note 10 of the Operating  
Conditions table.  
Rev. PrG  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
9 Parameter value applies to CLKIN pin only.  
10Parameter value applies to DA0–12, DBA0–1, DQ0–15, DQS0–1, DQM0–1, DCLK1–2, DCLK1–2, DCS0–1, DCLKE, DRAS, DCAS, and DWE pins only.  
11Certain ADSP-BF542/4/7/8/9 processor pins are 5.0 V tolerant (accept up to 5.5 V maximum VIH when power is applied to VDDEXT pins). Voltage compliance on outputs  
(VOH) dependson theinput VDDEXT, because VOH (maximum) approximately equalsVDDEXT (maximum). The5.0Vtolerancefeature appliesto PB0, PB1, PE14, PE15, PG15–11,  
PH6, and PH7 pins only. The 5.0 V tolerance exists only when power is applied to the VDDEXT pins. The PB0, PB1, PE14, and PE15 pins are open drain (regardless of pin  
functionality) and therefore require a pullup resistor. Consult the I2C specification version 2.1 for the proper resistor value and other open drain pin electrical parameters.  
12See Absolute Maximum Ratings.  
13Parameter value applies to all input and bi-directional pins, except PB0, PB1, PE14, PE15, PG15–11, PH6, and PH7.  
14Parameter value applies to the following pins only: PB0, PB1, PE14, PE15, PG15–11, PH6, and PH7.  
15Tj must meet the following conditions during OTP memory programming operations: 0ЊC < Tj < 55ЊC. During OTP memory read operations, Tj should meet the conditions  
specified in the operating conditions table.  
Rev. PrG  
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Page 33 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
Min  
Typical  
Max  
Unit  
VOH  
High Level Output Voltage for 3.3V @ VDDEXT = 2.7V, IOH = –0.5 mA  
I/O1  
2.4  
V
High Level Output Voltage for 2.5V @ VDDEXT = 2.25V, IOH = -0.5 mA  
I/O1  
TBD  
V
VOHDDR  
High Level Output Voltage2  
@ VDDDDR = 2.3V, IOH = -8.1 mA  
@ VDDDDR = 1.7V, IOH = -8.1 mA  
1.74  
TBD  
V
V
High Level Output Voltage for  
Mobile DDR2  
VOL  
Low Level Output Voltage for 3.3V @ VDDEXT = 2.7V, IOL = 2.0 mA  
I/O1  
0.4  
V
V
Low Level Output Voltage for 2.5V @ VDDEXT = 2.25V, IOL = 2.0 mA  
I/O1  
TBD  
VOLDDR  
Low Level Output Voltage2  
@ VDDDDR = 2.3V, IOL = 8.1 mA  
@ VDDDDR = 1.7V, IOL = 8.1 mA  
0.56  
TBD  
V
V
Low Level Output Voltage for  
Mobile DDR2  
IIH  
High Level Input Current3  
High Level Input Current JTAG4  
Low Level Input Current3  
Low Level Input Current JTAG4  
Three-State Leakage Current7  
Three-State Leakage Current7  
Input Capacitance8  
@ VDDEXT = 3.6V, VIN = VIH Maximum  
10.0  
50.0  
10.0  
TBD  
10.0  
10.0  
88  
μA  
μA  
μA  
μA  
μA  
μA  
pF  
IIHP  
@ VDDEXT = 3.6V, VIN = VIH Maximum  
5
IIL  
@ VDDEXT = 3.6V, VIN = 0 V  
5
IILP  
@ VDDEXT = 3.6V, VIN = 0 V  
6
IOZH  
@ VDDEXT = 3.6V, VIN = VIH Maximum  
5
IOZL  
@ VDDEXT = 3.6V, VIN = 0 V  
CIN  
fIN = TBD MHz, TAMBIENT = TBD°C, VIN = TBD V  
48  
IDDHIBERNATE  
IDDDEEPSLEEP  
IDDSLEEP  
IDDTYP  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
μA  
mA  
mA  
mA  
μA  
IDDRTC  
1 Applies to output and bidirectional pins, except the pins listed in table note 10 of the Operating Conditions table.  
2 Applies to output and bidirectional pins listed in table note 10 of the Operating Conditions table.  
3 Applies to input pins except JTAG inputs.  
4 Applies to JTAG input pins (TCK, TDI, TMS, TRST).  
5 Absolute value.  
6 For DDR pins (DQ0-15, DQS0-1), test conditions are VDDDDR = Maximum, VIN = VDDDDR Maximum.  
7 Applies to three-statable pins.  
8 Guaranteed, but not tested.  
ESD SENSITIVITY  
ESD (electrostatic discharge) sensitive device.  
Charged devices and circuit boards can discharge  
without detection. Although this product features  
patented or proprietary circuitry, damage may occur  
on devices subjected to high energy ESD. Therefore,  
proper ESD precautions should be taken to avoid  
performance degradation or loss of functionality.  
Rev. PrG  
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Page 34 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
ABSOLUTE MAXIMUM RATINGS  
Internal (Core) Supply Voltage1 (VDDINT) 0.3 V to +1.43 V  
External (I/O) Supply Voltage1 (VDDEXT) 0.3 V to +3.8 V  
Input Voltage1,2, 3  
Output Voltage Swing1  
Load Capacitance1  
0.5 V to +3.6 V  
0.5 V to VDDEXT +0.5 V  
200 pF  
Storage Temperature Range1  
Junction Temperature Underbias1  
65ºC to +150ºC  
+125ºC  
1 Stresses greater than those listed above may cause permanent damage to the  
device. These are stress ratings only. Functional operation of the device at these  
or any other conditions greater than those indicated in the operational sections  
of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
2 Applies to all bidirectional and input only pins except PB0, PB1, PE14, PE15,  
PG15–11, PH6, and PH7. Absolute maximum input voltage range on pins PB0,  
PB1, PE14, PE15, PG15–11, PH6, and PH7 is –0.5 V to +5.5 V.  
3 Pins USB_DP, USB_DM, and USB_VBUS are 5 V tolerant when VDDUSB is  
powered according to the operating conditions table. If VDDUSB supply  
voltage does not meet the specification in the operating conditions table, these  
pins could suffer long term damage when driven to +5V. If this condition is  
seen in the application, it can be corrected with additional circuitry to use the  
external host to power only the VDDUSB pins. Contact factory for application  
detail and reliability information.  
Table 13. Maximum Duty Cycle for Input1 Transient Voltage  
VIN Max (V)  
3.63  
VIN Min (V)  
–0.33  
Maximum Duty Cycle  
100%  
48%  
30%  
20%  
10%  
8%  
3.80  
–0.50  
3.90  
–0.60  
4.00  
–0.70  
4.10  
–0.80  
4.20  
–0.90  
4.30  
–1.00  
5%  
1 Does not apply to CLKIN. Absolute maximum for pins PBO, PB1, PE14, PE15,  
PG15-11, PH6, AND PH7 is +5.5V.  
PACKAGE INFORMATION  
The information presented in Figure 8 and Table 14 provides  
information about how to read the package brand and relate it  
to specific product features. For a complete listing of product  
offerings, see the Ordering Guide on Page 82.  
Table 14. Package Information  
Brand Key  
Description  
t
Temperature Range  
Package Type  
pp  
Z
RoHS Compliant part  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
Date Code  
cc  
vvvvvv.x-q  
n.n  
a
ADSP-BF54x  
yyww  
tppZ-cc  
vvvvvv.x-q n.n  
yyww country_of_origin  
B
Figure 8. Product Information on Package  
Rev. PrG  
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Page 35 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
TIMING SPECIFICATIONS  
Table 15, Table 16, Table 17, and Table 18 describe the timing  
requirements for the ADSP-BF542/4/7/8/9 processor clocks.  
Take care in selecting MSEL, SSEL, and CSEL ratios so as not to  
exceed the maximum core clock and system clock. Table 19  
describes phase-locked loop operating conditions. Table 20 and  
Figure 9 describe Clock Input and Reset Timing. Table 21  
describes Clock Out Timing.  
Clock Signals  
Table 15. System Clock Requirements  
Parameter  
fSCLK  
Condition  
Minimum  
Maximum Unit  
VDDEXT = 3.3 V, VDDINT TBD  
VDDEXT = 3.3 V, VDDINT < TBD  
VDDEXT = 2.5 V, VDDINT TBD  
VDDEXT = 2.5 V, VDDINT < TBD  
CLKOUT Width High  
CLKOUT Width Low  
133  
100  
133  
100  
MHz  
MHz  
MHz  
MHz  
ns  
fSCLK  
fSCLK  
fSCLK  
tSCLKH  
tSCLKL  
2.5  
2.5  
ns  
Table 16. Core Clock Requirements—600 MHz Speed Grade1  
Parameter  
Minimum  
Maximum Unit  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V )  
600  
TBD  
TBD  
TBD  
TBD  
MHz  
MHz  
MHz  
MHz  
MHz  
1 The speed grade of a given part may be seen on the Ordering Guide on Page 82. It stands for the maximum allowed CCLK frequency at VDDINT = minimum and the maximum  
allowed VCO frequency at any supply voltage.  
Table 17. Core Clock Requirements—533 MHz Speed Grade1  
Parameter  
fCCLK  
Minimum  
Maximum Unit  
Core Clock Frequency (VDDINT =1.188 V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V )  
533  
TBD  
TBD  
TBD  
TBD  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
1 The speed grade of a given part may be seen on the Ordering Guide on Page 82. It stands for the maximum allowed CCLK frequency at VDDINT = minimum and the maximum  
allowed VCO frequency at any supply voltage.  
Table 18. Core Clock Requirements—400 MHz Speed Grade1  
Parameter  
fCCLK  
Minimum  
Maximum Unit  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT = TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V minimum)  
Core Clock Frequency (VDDINT =TBD V )  
400  
TBD  
TBD  
TBD  
TBD  
MHz  
MHz  
MHz  
MHz  
MHz  
fCCLK  
fCCLK  
fCCLK  
fCCLK  
1 The speed grade of a given part may be seen on the Ordering Guide on Page 82. It stands for the maximum allowed CCLK frequency at VDDINT = minimum and the maximum  
allowed VCO frequency at any supply voltage.  
Rev. PrG  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 19. Phase-Locked Loop Operating Conditions  
Parameter  
Minimum  
Maximum Unit  
Speed Grade1 MHz  
fVCO  
Voltage Controlled Oscillator (VCO) Frequency  
50  
1 The speed grade of a given part may be seen on the “Ordering Guide” on page 82. It stands for the Maximum allowed CCLK frequency at VDDINT = minimum and the maximum  
allowed VCO frequency at any supply voltage.  
Table 20. Clock Input and Reset Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
tCKIN  
CLKIN Period1,2,3,4  
CLKIN Low Pulse2  
CLKIN High Pulse2  
20.0  
8.0  
100.0  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCKINL  
tCKINH  
tBUFDLAY  
tWRST  
8.0  
CLKIN to CLKBUF Delay  
RESET Asserted Pulsewidth Low5  
RESET High to First HWAIT/HWAITA transition (Boot Host Wait Mode)6  
RESET High to First HWAIT/HWAITA transition (Reset Output Mode)7  
11 tCKIN  
tRHWFT  
tRHWFT  
TBD tCKIN  
TBD tCKIN  
TBD tCKIN  
1 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in the previous Clock tables.  
2 Applies to PLL bypass mode and PLL nonbypass mode.  
3 CLKIN frequency and duty cycle must not change on the fly.  
4 If the DF bit in the PLL_CTL register is set, then the maximum tCKIN period is 50 ns.  
5 Applies after power-up sequence is complete. At power-up, the processor’s internal phase locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted,  
assuming stable power supplies and CLKIN (not including startup time of external clock oscillator).  
6 Maximum value varies with OTP memory programming and boot mode.  
7 When enabled by OTP_RESETOUT_HWAIT bit. If regular HWAIT is not required in an application, the OTP_RESETOUT_HWAIT bit in the same page instructs the  
HWAIT or HWAITA to simulate Reset Output functionality. Then an external resistor is expected to pull the signal to the reset level, as the pin itself is in high-performance  
mode during reset.  
tCKIN  
CLKIN  
t CKINL tCKINH  
t
BUFDLAY  
t BUFDLAY  
CLKBUF  
t WRST  
RESET  
t RHWFT  
HWAIT(A)  
Figure 9. Clock and Reset Timing  
Rev. PrG  
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Page 37 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 21. Clock Out Timing  
Parameter  
Min  
Max  
Unit  
Switching Characteristics  
tSCLK  
CLKOUT Period1  
TBD  
TBD  
TBD  
ns  
ns  
ns  
tSCLKH  
tSCLKL  
CLKOUT Width High  
CLKOUT Width Low  
1 The tSCLK value is the inverse of the fSCLK specification. Reduced supply voltages affect the best-case value of TBD ns listed here.  
tSCLK  
tSCLKH  
CLKOUT  
tSCLKL  
Figure 10. CLKOUT Interface Timing  
Rev. PrG  
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Page 38 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Asynchronous Memory Read Cycle Timing  
Table 22 and Table 23 on Page 40 and Figure 11 and Figure 12  
on Page 40 describe asynchronous memory read cycle opera-  
tions for synchronous and for asynchronous ARDY.  
Table 22. Asynchronous Memory Read Cycle Timing with Synchronous ARDY  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSDAT  
tHDAT  
tSARDY  
tHARDY  
tDO  
DATA15–0 Setup Before CLKOUT  
DATA15–0 Hold After CLKOUT  
2.1  
0.8  
4.0  
0.0  
ns  
ns  
ns  
ns  
ns  
ns  
ARDY Setup Before the Falling Edge of CLKOUT  
ARDY Hold After the Falling Edge of CLKOUT  
Output Delay After CLKOUT1  
6.0  
tHO  
Output Hold After CLKOUT1  
0.8  
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
ACCESS EXTENDED  
3 CYCLES  
4 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHARDY  
tSARDY  
tHARDY  
ARDY  
tSARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 11. Asynchronous Memory Read Cycle Timing with Synchronous ARDY  
Rev. PrG  
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Page 39 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 23. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSDAT  
tHDAT  
tDANR  
tHAA  
DATA15–0 Setup Before CLKOUT  
DATA15–0 Hold After CLKOUT  
ARDY Negated Delay from AMSx Asserted1  
ARDY Asserted Hold After ARE Negated  
Output Delay After CLKOUT2  
2.1  
0.8  
ns  
ns  
(S+RA–2)*tSCLK ns  
ns  
0.0  
0.8  
tDO  
6.0  
ns  
ns  
tHO  
Output Hold After CLKOUT2  
1 S = number of programmed setup cycles, RA = number of programmed read access cycles.  
2 Output pins include AMS3–0, ABE1–0, ADDR19–1, AOE, ARE.  
HOLD  
1 CYCLE  
SETUP  
2 CYCLES  
PROGRAMMED READ ACCESS  
4 CYCLES  
ACCESS EXTENDED  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
AOE  
tDO  
tHO  
ARE  
tHAA  
tDANR  
ARDY  
tSDAT  
tHDAT  
DATA15–0  
READ  
Figure 12. Asynchronous Memory Read Cycle Timing with Asynchronous ARDY  
Rev. PrG  
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Page 40 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Asynchronous Memory Write Cycle Timing  
Table 24 and Table 25 on Page 42 and Figure 13 and Figure 14  
on Page 42 describe asynchronous memory write cycle opera-  
tions for synchronous and for asynchronous ARDY.  
Table 24. Asynchronous Memory Write Cycle Timing with Synchronous ARDY  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSARDY  
tHARDY  
ARDY Setup Before the Falling Edge of CLKOUT  
ARDY Hold After the Falling Edge of CLKOUT  
4.0  
0.0  
ns  
ns  
Switching Characteristics  
tDDAT  
tENDAT  
tDO  
DATA15–0 Disable After CLKOUT  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA15–0 Enable After CLKOUT  
Output Delay After CLKOUT1  
Output Hold After CLKOUT1  
1.0  
0.8  
tHO  
1 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.  
ACCESS  
EXTENDED  
1 CYCLE  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tSARDY  
ARDY  
tSARDY  
tHARDY  
tHARDY  
tDDAT  
tENDAT  
DATA15–0  
WRITE DATA  
Figure 13. Asynchronous Memory Write Cycle Timing with Synchronous ARDY  
Rev. PrG  
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Page 41 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 25. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tDANR  
tHAA  
Switching Characteristics  
ARDY Negated Delay from AMSx Asserted1  
ARDY Asserted Hold After ARE Negated  
(S+WA–2)*tSCLK ns  
ns  
0.0  
tDDAT  
tENDAT  
tDO  
DATA15–0 Disable After CLKOUT  
6.0  
6.0  
ns  
ns  
ns  
ns  
DATA15–0 Enable After CLKOUT  
Output Delay After CLKOUT2  
Output Hold After CLKOUT2  
1.0  
0.8  
tHO  
1 S = number of programmed setup cycles, WA = number of programmed write access cycles.  
2 Output pins include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.  
ACCESS  
EXTENDED  
SETUP  
2 CYCLES  
HOLD  
1 CYCLE  
PROGRAMMED WRITE  
ACCESS 2 CYCLES  
CLKOUT  
tDO  
tHO  
AMSx  
ABE1–0  
BE, ADDRESS  
ADDR19–1  
tDO  
tHO  
AWE  
tDANW  
tHAA  
ARDY  
tENDAT  
DATA15–0  
WRITE DATA  
Figure 14. Asynchronous Memory Write Cycle Timing with Asynchronous ARDY  
Rev. PrG  
|
Page 42 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
DDR SDRAM Read Cycle Timing  
Table 26. DDR SDRAM Read Cycle Timing, VDDDDR nominal 2.5V  
Parameter  
Symbol  
Minimum  
Maximum Unit  
Timing Requirements  
Access window of DQ to CK  
Access window of DQS to CK  
tAC  
TBD  
TBD  
TBD  
TBD  
0.90  
ns  
ns  
ns  
tDQSCK  
DQS-DQ skew, DQS to last DQ tDQSQ  
valid  
DQ-DQS hold, DQS to first DQ to tQH  
go invalid  
2.50  
ns  
DQS Read preamble  
DQS Read postamble  
Switching Characteristic  
Clock Period  
tRPRE  
tRPST  
TBD  
TBD  
tCK  
tCK  
tCK  
tAS  
7.50  
TBD  
ns  
ns  
Address and Control output  
SETUP time relative to clock, CK  
Address and Control output  
HOLD time relative to clock, CK  
tAH  
TBD  
TBD  
ns  
ns  
TBD  
TBD  
Mobile DDR SDRAM Read Cycle Timing  
Table 27. Mobile DDR SDRAM Read Cycle Timing, VDDDDR nominal 1.8 V  
Parameter  
Symbol  
Minimum  
Maximum Unit  
Timing Requirements  
Access window of DQ to CK  
Access window of DQS to CK  
tAC  
TBD  
TBD  
TBD  
TBD  
ns  
ns  
ns  
tDQSCK  
DQS-DQ skew, DQS to last DQ tDQSQ  
valid  
DQ-DQS hold, DQS to first DQ to tQH  
go invalid  
TBD  
ns  
DQS Read preamble  
DQS Read postamble  
Switching Characteristic  
Clock Period  
tRPRE  
tRPST  
TBD  
TBD  
tCK  
tCK  
tCK  
tAS  
TBD  
TBD  
ns  
ns  
Address and Control output  
SETUP time relative to clock, CK  
Address and Control output  
HOLD time relative to clock, CK  
tAH  
TBD  
TBD  
ns  
ns  
TBD  
TBD  
Rev. PrG  
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Page 43 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
t
t
DQSCK (Min)  
DQSCK (MAX)  
CK  
t
t
AC (MIN)  
AC (MAX)  
t
t
RPST  
RPRE  
DQS  
DQ15-0  
t
t
DQSQ  
DQSQ  
t
t
QH  
QH  
Figure 15. DDR SDRAM Controller Input AC Timing  
Rev. PrG  
|
Page 44 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
DDR SDRAM Write Cycle Timing  
Table 28. DDR SDRAM Write Cycle Timing, VDDDDR nominal 2.5V  
Parameter  
Symbol  
Minimum  
Maximum Unit  
Switching Characteristics  
Clock Period  
tCK  
7.50  
TBD  
0.90  
0.90  
TBD  
ns  
Write cmd to first DQS  
DQ/DQM setup to DQS  
DQ/DQM hold to DQS  
tDQSS  
tDS  
TBD  
tCK  
ns  
tDH  
ns  
DQS falling to CK rising (DQS  
setup)  
tDSS  
tCK  
DQS falling to CK rising (DQS  
hold)  
tDSH  
TBD  
tCK  
DQS Hi pulse width  
DQS Lo pulse width  
DQS Write preamble  
DQS Write postamble  
tDQSH  
tDQSL  
tWPRE  
tWPST  
tAS  
TBD  
TBD  
TBD  
TBD  
TBD  
tCK  
tCK  
tCK  
tCK  
ns  
Address and Control output  
SETUP time relative to clock, CK  
Address and Control output  
HOLD time relative to clock, CK  
tAH  
TBD  
TBD  
ns  
ns  
TBD  
TBD  
Mobile DDR SDRAM Write Cycle Timing  
Table 29. Mobile DDR SDRAM Write Cycle Timing, VDDDDR nominal 1.8V  
Parameter  
Symbol  
Minimum  
Maximum Unit  
Switching Characteristics  
Clock Period  
tCK  
TBD  
TBD  
TBD  
TBD  
TBD  
ns  
Write cmd to first DQS  
DQ/DQM setup to DQS  
DQ/DQM hold to DQS  
tDQSS  
tDS  
TBD  
tCK  
ns  
tDH  
ns  
DQS falling to CK rising (DQS  
setup)  
tDSS  
tCK  
DQS falling to CK rising (DQS  
hold)  
tDSH  
TBD  
tCK  
DQS Hi pulse width  
DQS Lo pulse width  
DQS Write preamble  
DQS Write postamble  
tDQSH  
tDQSL  
tWPRE  
tWPST  
tAS  
TBD  
TBD  
TBD  
TBD  
TBD  
tCK  
tCK  
tCK  
tCK  
ns  
Address and Control output  
SETUP time relative to clock, CK  
Address and Control output  
HOLD time relative to clock, CK  
tAH  
TBD  
TBD  
ns  
ns  
TBD  
TBD  
Rev. PrG  
|
Page 45 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
t
CK  
CK  
t
t
DSS  
DSH  
t
DQSS  
DQS  
t
t
t
t
DQSL  
DQSH  
WPST  
WPRE  
DQ/DM  
t
t
AH  
AS  
t
t
DH  
DS  
ADDR  
CTL  
Figure 16. DDR SDRAM Controller Output AC Timing  
Rev. PrG  
|
Page 46 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
External Port Bus Request and Grant Cycle Timing  
Table 30 and Table 31 on Page 48 and Figure 17 and Figure 18  
on Page 48 describe external port bus request and grant cycle  
operations for synchronous and for asynchronous BR.  
Table 30. External Port Bus Request and Grant Cycle Timing with Synchronous BR  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tBS  
BR Setup to Falling Edge of CLKOUT  
4.0  
0.0  
ns  
ns  
tBH  
Falling Edge of CLKOUT to BR Deasserted Hold Time  
Switching Characteristics  
tSD  
CLKOUT Low to xMS, Address, and RD/WR disable  
4.5  
4.5  
3.6  
3.6  
3.6  
3.6  
ns  
ns  
ns  
ns  
ns  
ns  
tSE  
CLKOUT Low to AMSx, Address, and ARE/AWE enable  
CLKOUT High to BG High Setup  
tDBG  
tEBG  
tDBH  
tEBH  
CLKOUT High to BG Deasserted Hold Time  
CLKOUT High to BGH High Setup  
CLKOUT High to BGH Deasserted Hold Time  
CLKOUT  
tBS  
tBH  
BR  
tSD  
tSE  
AMSx  
tSD  
tSE  
ADDR19-1  
ABE1-0  
tSD  
tSE  
ARE  
BG  
tDBG  
tEBG  
tDBH  
tEBH  
BGH  
Figure 17. External Port Bus Request and Grant Cycle Timing with Synchronous BR  
Rev. PrG  
|
Page 47 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 31. External Port Bus Request and Grant Cycle Timing with Asynchronous BR  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tWBR  
BR Pulsewidth  
2 x tSCLK  
ns  
Switching Characteristics  
tSD  
CLKOUT Low to xMS, Address, and RD/WR disable  
4.5  
4.5  
3.6  
3.6  
3.6  
3.6  
ns  
ns  
ns  
ns  
ns  
ns  
tSE  
CLKOUT Low to AMSx, Address, and ARE/AWE enable  
CLKOUT High to BG High Setup  
tDBG  
tEBG  
tDBH  
tEBH  
CLKOUT High to BG Deasserted Hold Time  
CLKOUT High to BGH High Setup  
CLKOUT High to BGH Deasserted Hold Time  
CLKOUT  
tWBR  
BR  
tSD  
tSE  
AMSx  
tSD  
tSE  
ADDR19-1  
ABE1-0  
tSD  
tSE  
AWE  
ARE  
tDBG  
tEBG  
BG  
tDBH  
tEBH  
BGH  
Figure 18. External Port Bus Request and Grant Cycle Timing with Asynchronous BR  
Rev. PrG  
|
Page 48 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Enhanced Parallel Peripheral Interface Timing  
Table 32 and Figure 19 on Page 49 describes Enhanced Parallel  
Peripheral Interface operations.  
Table 32. Enhanced Parallel Peripheral Interface Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
tPCLKW  
tPCLK  
PPI_CLK Width  
PPI_CLK Period  
TBD  
TBD  
ns  
ns  
Timing Requirements - GP Input and Frame Capture Modes  
tSFSPE  
tHFSPE  
tSDRPE  
tHDRPE  
External Frame Sync Setup Before PPI_CLK  
External Frame Sync Hold After PPI_CLK  
Receive Data Setup Before PPI_CLK  
Receive Data Hold After PPI_CLK  
TBD  
TBD  
TBD  
TBD  
ns  
ns  
ns  
ns  
Switching Characteristics - GP Output and Frame Capture Modes  
tDFSPE  
tHOFSPE  
tDDTPE  
tHDTPE  
Internal Frame Sync Delay After PPI_CLK  
Internal Frame Sync Hold After PPI_CLK  
Transmit Data Delay After PPI_CLK  
Transmit Data Hold After PPI_CLK  
TBD  
TBD  
ns  
ns  
ns  
ns  
TBD  
TBD  
Figure 19. Enhanced Parallel Peripheral Interface Timing  
Rev. PrG  
|
Page 49 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Serial Ports Timing  
Table 33 through Table 36 on Page 51 and Figure 20 on Page 52  
through Figure 22 on Page 54 describe Serial Port operations.  
Table 33. Serial Ports—External Clock  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSFSE  
TFS/RFS Setup Before TSCLK/RSCLK (externally generated TFS/RFS)1  
3.0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSE  
TFS/RFS Hold After TSCLK/RSCLK (externally generated TFS/RFS)1  
Receive Data Setup Before RSCLK1  
Receive Data Hold After RSCLK1  
TSCLK/RSCLK Width  
3.0  
tSDRE  
3.0  
tHDRE  
tSCLKEW  
tSCLKE  
tRCLKE  
3.0  
4.5  
TSCLK/RSCLK Period  
RSCLK Period2  
15.0  
11.1  
Switching Characteristics  
tDFSE  
tHOFSE  
tDDTE  
tHDTE  
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)3  
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS3  
Transmit Data Delay After TSCLK3  
10.0  
10.0  
ns  
ns  
ns  
ns  
0.0  
0.0  
Transmit Data Hold After TSCLK3  
1 Referenced to sample edge.  
2 For serial port receive with external clock and external frame sync only.  
3 Referenced to drive edge.  
Table 34. Serial Ports—Internal Clock  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tSFSI  
TFS/RFS Setup Before TSCLK/RSCLK (externally generated TFS/RFS)1  
8.0  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSI  
TFS/RFS Hold After TSCLK/RSCLK (externally generated TFS/RFS)1  
Receive Data Setup Before RSCLK1  
Receive Data Hold After RSCLK1  
TSCLK/RSCLK Width  
–1.5  
8.0  
tSDRI  
tHDRI  
tSCLKEW  
tSCLKE  
–1.5  
4.5  
TSCLK/RSCLK Period  
15.0  
Switching Characteristics  
tDFSI  
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)2  
Transmit Data Delay After TSCLK2  
3.0  
3.0  
ns  
ns  
ns  
ns  
ns  
tHOFSI  
tDDTI  
–1.0  
tHDTI  
Transmit Data Hold After TSCLK2  
–2.0  
4.5  
tSCLKIW  
TSCLK/RSCLK Width  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Rev. PrG  
|
Page 50 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 35. Serial Ports—Enable and Three-State  
Parameter  
Min  
0
Max  
Unit  
Switching Characteristics  
tDTENE  
tDDTTE  
tDTENI  
tDDTTI  
Data Enable Delay from External TSCLK1  
Data Disable Delay from External TSCLK1  
Data Enable Delay from Internal TSCLK1  
Data Disable Delay from Internal TSCLK1  
ns  
ns  
ns  
ns  
10.0  
3.0  
–2.0  
1 Referenced to drive edge.  
Table 36. External Late Frame Sync  
Parameter  
Min  
Max  
Unit  
Switching Characteristics  
tDDTLFSE  
tDTENLFS  
Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 01, 2  
Data Enable from late Frame Sync or MCE = 1, MFD = 01, 2  
10.0  
ns  
ns  
0
1 MCE = 1, TFS enable and TFS valid follow tDTENLFS and tDDTLFSE  
2 If external RFS/TFS setup to RSCLK/TSCLK > tSCLKE/2, then tDDTE/I and tDTENE/I apply; otherwise tDDTLFSE and tDTENLFS apply.  
.
Rev. PrG  
|
Page 51 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
DATA RECEIVE- INTERNAL CLOCK  
DATA RECEIVE- EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
RSCLK  
RSCLK  
tDFSE  
tDFSE  
tHOFSE  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
RFS  
RFS  
tSDRI  
tHDRI  
tSDRE  
tHDRE  
DR  
DR  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DATA TRANSMIT- INTERNAL CLOCK  
DATA TRANSMIT- EXTERNAL CLOCK  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
tSCLKIW  
tSCLKEW  
TSCLK  
TSCLK  
tDFSI  
tDFSE  
tHOFSI  
tSFSI  
tHFSI  
tHOFSE  
tSFSE  
tHFSE  
TFS  
TFS  
tDDTI  
tDDTE  
tHDTI  
tHDTE  
DT  
DT  
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK OR TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE.  
DRIVE  
EDGE  
DRIVE  
EDGE  
TSCLK (EXT)  
TFS ("LATE", EXT.)  
TSCLK / RSCLK  
tDDTTE  
tDTENE  
DT  
DRIVE  
EDGE  
DRIVE  
EDGE  
TSCLK (INT)  
TFS ("LATE", INT.)  
TSCLK / RSCLK  
tDTENI  
tDDTTI  
DT  
Figure 20. Serial Ports  
Rev. PrG  
|
Page 52 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
EXTERNAL RFS WITH MCE = 1, MFD = 0 (INTERNAL OR EXTERNAL CLOCK)  
DRIVE SAMPLE DRIVE  
RSCLK  
tHOFSE/I  
tSFSE/I  
RFS  
tDDTE/I  
tDTENLFS  
tHDTE/I  
1ST BIT  
2ND BIT  
DT  
tDDTLFSE  
LATE EXTERNAL TFS (INTERNAL OR EXTERNAL CLOCK)  
DRIVE SAMPLE  
DRIVE  
TSCLK  
tSFSE/I  
tHOFSE/I  
TFS  
tDDTE/I  
TDTENLFS  
tHDTE/I  
DT  
1ST BIT  
2ND BIT  
tDDTLFSE  
Figure 21. External Late Frame Sync (Frame Sync Setup < tSCLKE/2)  
Rev. PrG  
|
Page 53 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
EXTERNAL RFS WITH MCE = 1, MFD = 0  
DRIVE  
SAMPLE  
DRIVE  
RSCLK  
RFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
1ST BIT  
DT  
2ND BIT  
tDDTLSCK  
LATE EXTERNAL TFS  
DRIVE  
SAMPLE  
DRIVE  
TSCLK  
TFS  
tSFSE/I  
tHOFSE/I  
tDDTE/I  
tHDTE/I  
tDTENLSCK  
DT  
1ST BIT  
2ND BIT  
tDDTLSCK  
Figure 22. External Late Frame Sync (Frame Sync Setup > tSCLKE/2)  
Rev. PrG  
|
Page 54 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Serial Peripheral Interface (SPI) Port—Master Timing  
Table 37 and Figure 23 describe SPI port master operations.  
Table 37. Serial Peripheral Interface (SPI) Port—Master Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
tSSPIDM  
tHSPIDM  
Data input valid to SCK edge (data input setup)  
SCK sampling edge to data input invalid  
7.5  
ns  
ns  
–1.5  
Switching Characteristics  
tSDSCIM  
tSPICHM  
tSPICLM  
tSPICLK  
SPISELx low to first SCK edge (x=0 or 1)  
2tSCLK 1.5  
2tSCLK 1.5  
2tSCLK 1.5  
4tSCLK 1.5  
2tSCLK 1.5  
2tSCLK 1.5  
0
ns  
ns  
ns  
ns  
ns  
ns  
Serial clock high period  
Serial clock low period  
Serial clock period  
tHDSM  
Last SCK edge to SPISELx high (x=0 or 1)  
Sequential transfer delay  
tSPITDM  
tDDSPIDM  
tHDSPIDM  
SCK edge to data out valid (data out delay)  
SCK edge to data out invalid (data out hold)  
6
ns  
ns  
–1.0  
4.0  
SPISELx  
(OUTPUT)  
tSPICLK  
tHDSM  
tSPITDM  
tSDSCIM  
tSPICHM  
tSPICLM  
SCK  
(CPOL = 0)  
(OUTPUT)  
tSPICLM  
tSPICHM  
SCK  
(CPOL = 1)  
(OUTPUT)  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA=1  
tSSPIDM  
tHSPIDM  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
tDDSPIDM  
tHDSPIDM  
MOSI  
(OUTPUT)  
MSB  
LSB  
CPHA=0  
tSSPIDM  
tHSPIDM  
MISO  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 23. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. PrG  
|
Page 55 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Serial Peripheral Interface (SPI) Port—Slave Timing  
Table 38 and Figure 24 describe SPI port slave operations.  
Table 38. Serial Peripheral Interface (SPI) Port—Slave Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
Serial clock high period  
2tSCLK 1.5  
2tSCLK 1.5  
4tSCLK 1.5  
2tSCLK 1.5  
2tSCLK 1.5  
2tSCLK 1.5  
1.6  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial clock low period  
Serial clock period  
Last SCK edge to SPISS not asserted  
Sequential Transfer Delay  
tSPITDS  
tSDSCI  
tSSPID  
tHSPID  
SPISS assertion to first SCK edge  
Data input valid to SCK edge (data input setup)  
SCK sampling edge to data input invalid  
1.6  
Switching Characteristics  
tDSOE  
SPISS assertion to data out active  
0
0
0
0
8
ns  
ns  
ns  
ns  
tDSDHI  
tDDSPID  
tHDSPID  
SPISS deassertion to data high impedance  
SCK edge to data out valid (data out delay)  
SCK edge to data out invalid (data out hold)  
8
10  
10  
SPISS  
(INPUT)  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
tSPITDS  
SCK  
(CPOL = 0)  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
SCK  
(CPOL = 1)  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
tDDSPID  
tDSDHI  
MISO  
(OUTPUT)  
MSB  
LSB  
tHSPID  
tSSPID  
CPHA=1  
tSSPID  
tHSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
tDSOE  
tDDSPID  
tDSDHI  
MISO  
(OUTPUT)  
MSB  
LSB  
tHSPID  
CPHA=0  
tSSPID  
MOSI  
(INPUT)  
MSB VALID  
LSB VALID  
Figure 24. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. PrG  
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Page 56 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Universal Asynchronous Receiver-Transmitter  
(UART) Ports—Receive and Transmit Timing  
Figure 25 describes the UART ports receive and transmit opera-  
tions. The maximum baud rate is SCLK/16. There is some  
latency between the generation of internal UART interrupts  
and the external data operations. These latencies are negligible  
at the data transmission rates for the UART.  
CLKOUT  
(SAMPLE  
CLOCK)  
UARTx Rx  
RECEIVE  
DATA(5-8)  
DATA(5-8)  
STOP  
INTERNAL  
UARTRECEIVE  
INTERRUPT  
UARTRECEIVE BIT SET BY  
DATA STOP ;  
CLEARED BY FIFO READ  
START  
UARTx Tx  
STOP(1-2)  
TRANSMIT  
INTERNAL  
UART TRANSMIT  
INTERRUPT  
UART TRANSMIT BIT SETBY PROGRAM;  
CLEARED BY WRITE TO TRANSMIT  
Figure 25. UART Ports—Receive and Transmit Timing  
General-Purpose Port Timing  
Table 39 and Figure 26 describe general-purpose  
port operations.  
Table 39. General-Purpose Port Timing  
Parameter  
Minimum  
tSCLK + 1  
0
Maximum Unit  
Timing Requirement  
tWFI  
General-Purpose Port Pin Input Pulse Width  
ns  
Switching Characteristic  
tGPOD  
General-Purpose Port Pin Output Delay from CLKOUT Low  
6
ns  
CLKOUT  
tGPOD  
GPP OUTPUT  
tWFI  
GPP INPUT  
Figure 26. General-Purpose Port Timing  
Rev. PrG  
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Page 57 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Timer Cycle Timing  
Table 40 and Figure 27 describe timer expired operations. The  
input signal is asynchronous in “width capture mode” and  
“external clock mode” and has an absolute maximum input fre-  
quency of (fSCLK/2) MHz.  
Table 40. Timer Cycle Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Characteristics  
tWL  
tWH  
tTIS  
tTIH  
Timer Pulse Width Input Low (Measured In SCLK Cycles)1  
Timer Pulse Width Input High (Measured In SCLK Cycles)1  
Timer Input Setup Time Before CLKOUT Low2  
1tSCLK  
1tSCLK  
5
ns  
ns  
ns  
ns  
Timer Input Hold Time After CLKOUT Low2  
–2  
Switching Characteristic  
tHTO Timer Pulse Width Output (Measured In SCLK Cycles)  
tTOD Timer Output Update Delay After CLKOUT High  
1tSCLK  
(232–1)tSCLK  
6
ns  
ns  
1 The minimum pulse widths apply for TMRx signals in width capture and external clock modes.  
2 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize timer flag inputs.  
CLKOUT  
tTOD  
TIMER OUTPUT  
tHTO  
tTIS  
tTIH  
TIMER INPUT  
tWH, tWL  
Figure 27. Timer Cycle Timing  
Rev. PrG  
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Page 58 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
ATA/ATAPI Controller Timing  
Table 41. ATA/ATAPI Controller Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
TBD  
Switching Characteristic  
TBD TBD  
TBD  
TBD  
ns  
TBD  
ns  
Figure 28. ATA/ATAPI Controller Timing  
Up/Down Counter/Rotary Encoder Timing  
Table 42. Up/Down Counter/Rotary Encoder Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
tWCOUNT  
Up/Down Counter/Rotary Encoder Input Pulse Width  
tSCLK + 1  
ns  
Switching Characteristic  
tCIS  
tCIH  
Counter Input Setup Time Before CLKOUT Low1  
Counter Input Hold Time After CLKOUT Low1  
TBD  
TBS  
TBD  
TBD  
ns  
ns  
1 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize counter inputs.  
CLKOUT  
tCIS  
tCIH  
CUD/CDG/CZM  
tWCOUNT  
Figure 29. Up/Down Counter/Rotary Encoder Timing  
Rev. PrG  
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Page 59 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
SD/SDIO Controller Timing  
Table 43. SD/SDIO Controller Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Requirements  
TBD  
TBD  
TBD  
ns  
Switching Characteristic  
TBD  
TBD  
TBD  
ns  
Figure 30. SD/SDIO Controller Timing  
MXVR Timing  
Table 44 and Table 45 describe the MXVR timing requirements.  
Table 44. MXVR Timing—MXI Center Frequency Requirements  
Parameter  
Fs = 38 KHz Fs = 44.1 KHz Fs = 48 KHz Unit  
fMXI  
fMXI  
fMXI  
fMXI  
MXI Center Frequency (256Fs)  
MXI Center Frequency (384Fs)  
MXI Center Frequency (512Fs)  
MXI Center Frequency (1024Fs)  
9.728  
11.2896  
16.9344  
22.5792  
45.1584  
12.288  
18.432  
24.576  
49.152  
MHz  
MHz  
MHz  
MHz  
_256  
_384  
_512  
_1024  
14.592  
19.456  
38.912  
Table 45. MXVR Timing— MXI Clock Requirements  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
FSMXI  
FTMXI  
DCMXI  
MXI Clock Frequency Stability  
MXI Frequency Tolerance Over Temperature  
MXI Clock Duty Cycle  
–50  
–300  
40  
+50  
+300  
60  
ppm  
ppm  
%
Rev. PrG  
|
Page 60 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
HOSTDP A/C Timing- Host Read Cycle  
Table 46 describe the HOSTDP A/C Host Read Cycle timing  
requirements.  
Table 46. Host Read Cycle Timing Requirements  
Parameter  
Minimum  
Maximum  
Units  
Timing Requirements  
tSADRDL  
tHADRDH  
tRDWL  
HOST_ADDR and Host_CE Setup before Host_RD assertion 1.5 * tsclk  
ns  
ns  
ns  
HOST_ADDR and Host_CE Hold after Host_RD assertion  
Host_RD pulse width low  
2.5  
tDRDYRDL + tRDYPRD + tDRDHRDY (ACK  
mode)  
1.5 * tsclk + 8.7 (INT mode)  
2 * tsclk  
ns  
ns  
ns  
tRDWH  
Host_RD pulse width high  
tDRDHRDY  
Host_RD de-assertion delay after Host_ACK de-assertion TBD  
Switching Characteristics  
tSDATRDY  
tDRDYRDL  
tRDYPRD  
Data valid after Host_ACK assertion  
tsclk  
ns  
ns  
ns  
ns  
Host_ACK assertion delay after Host_RD  
Host_ACK low pulse-width for Read access  
Data disable after Host_RD  
1.5 * tsclk + 8.7  
Data Delay  
1.0  
tHDARWH  
HOST_ADDR  
HOST_CE  
tHADRDH  
tSADRDL  
tRDWH  
tRDWL  
HOST_RD  
tDRDYRDL  
tRDYPRD  
tDRDHRDY  
HOST_ACK  
tHDARWH  
tSDATRDY  
HOST_D15-0  
Figure 31. HOSTDP A/C- Host Read Cycle  
Rev. PrG  
|
Page 61 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
HOSTDP A/C Timing- Host Write Cycle  
Table 47 describes the HOSTDP A/C Host Write Cycle timing  
requirements.  
Table 47. Host Write Cycle Timing Requirements  
Parameter  
Minimum  
Maximum  
Units  
Timing Requirements  
tSADWRH  
tHADWRH  
tWRWL  
HOST_ADDR/Host_CE Setup before Host_WR (1.5 * tsclk)+ 10.8  
ns  
ns  
HOST_ADDR/Host_CE Hold after Host_WR  
Host_WR pulse width low  
2.5  
tDRDYWRL + tRDYPRD + tDWRHRDY (ACK  
mode)  
1.5 * tsclk + 8.7 (INT mode)  
ns  
ns  
ns  
tWRWH  
Host_WR pulse width high  
2 * tsclk  
TBD  
tDWRHRDY  
Host_WR de-assertion delay after Host_ACK  
de-assertion  
tHDATWH  
tSDATWH  
Data Hold after Host_WR de-assertion  
Data Setup before Host_WR de-assertion  
2.5  
2.5  
ns  
ns  
Switching Characteristics  
tDRDYWRL Host_ACK low delay after Host_WR/Host_CE  
tRDYPWR  
1.5 * tsclk  
ns  
Host_ACK low pulse-width for Write access  
HOST_ADDR  
HOST_CE  
tHADWRH  
tSADWRH  
tWRWH  
tWRWL  
wrh  
HOST_WR  
tDWRHRDY  
tDRDYWRL  
tRDYPWR  
HOST_ACK  
tHDATWH  
tSDATWH  
HOST_D15-0  
Figure 32. HOSTDP A/C- Host Write Cycle  
Table 48. OTP Timing Parameters1  
Parameter  
Minimum  
Maximum Unit  
tFACC  
tRPGM  
tCPS  
OTP Memory Bit Read Access Time  
OTP Memory Charge Pump Release Time  
400  
1
ns  
s  
OTP Memory Charge Pump Setup Time  
OTP Memory Charge Pump Hold Time  
OTP Memory Bit Program Time  
0
0
s  
s  
s  
tCPH  
tPGM  
10  
1 These parameters are programmed into the OTP_TIMING register. See ADSP-BF54x Blackfin Processor Hardware Reference for details.  
Rev. PrG  
|
Page 62 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
JTAG Test And Emulation Port Timing  
Table 49 and Figure 33 describe JTAG port operations.  
Table 49. JTAG Port Timing  
Parameter  
Minimum  
Maximum Unit  
Timing Parameters  
tTCK  
TCK Period  
20  
4
ns  
tSTAP  
tHTAP  
tSSYS  
tHSYS  
tTRSTW  
TDI, TMS Setup Before TCK High  
TDI, TMS Hold After TCK High  
System Inputs Setup Before TCK High1  
System Inputs Hold After TCK High1  
TRST Pulsewidth2 (measured in TCK cycles)  
ns  
4
ns  
4
ns  
5
ns  
4
TCK  
Switching Characteristics  
tDTDO TDO Delay from TCK Low  
tDSYS  
System Outputs Delay After TCK Low3  
10  
12  
ns  
ns  
0
1 System Inputs=PA15–0, PB14–0, PC15–0, PD15–0, PE15–0, PF15–0, PG15–0, PH13–0, PI15–0, PJ14–0, DQ15–0, DQS1–0, D15–0, ATAPI_PDIAG, CLKIN, RESET, NMI,  
BMODE3–0, MFS, MLF_P, and MLF_M.  
2 50 MHz Maximum  
3 System Outputs=PA15–0, PB14–0, PC15–0, PD15–0, PE15–0, PF15–0, PG15–0, PH13–0, PI15–0, PJ14–0, DQ15–0, DQS1–0, D15–0, DA12–0, DBA1–0, DQM1–0,  
DCLK0-1, DCLK0–1, DCS1–0, DCLKE, DRAS, DCAS, DWE, AMS3–0, ABE1–0, AOE, ARE, AWE, EMU, CLKOUT, CLKBUF, EXT_WAKE.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tHSYS  
tSSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 33. JTAG Port Timing  
Rev. PrG  
|
Page 63 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
POWER DISSIPATION  
TEST CONDITIONS  
Total power dissipation has two components: one due to inter-  
nal circuitry (PINT) and one due to the switching of external  
output drivers (PEXT). Table 50 through Table 52 show the  
power dissipation for internal circuitry (VDDINT).  
All timing parameters appearing in this data sheet were mea-  
sured under the conditions described in this section.  
Output Enable Time  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving. The output enable time tENA is the interval from  
the point when a reference signal reaches a high or low voltage  
level to the point when the output starts driving as shown in the  
Output Enable/Disable diagram (Figure 34). The time  
tENA_MEASURED is the interval from when the reference signal  
switches to when the output voltage reaches 2.0 V (output high)  
or 1.0 V (output low). Time tTRIP is the interval from when the  
output starts driving to when the output reaches the 1.0 V or  
2.0 V trip voltage. Time tENA is calculated as shown in the  
equation:  
See the ADSP-BF549 Blackfin Processor Hardware Reference for  
definitions of the various operating modes and for instructions  
on how to minimize system power.  
Many operating conditions can affect power dissipation. System  
designers should refer to Estimating Power for ADSP-  
BF542/BF544/BF547/BF548/BF549 Blackfin Processors (EE-  
TBD) on the Analog Devices website (www.analog.com)—use  
site search on “EE-TBD.” This document provides detailed  
information for optimizing your design for lowest power.  
Table 50. Internal Power Dissipation (Hibernate mode)  
IDD (nominal)  
TBD  
Unit  
μA  
t
= t  
t  
ENA_MEASURED TRIP  
1
IDDHIBERNATE  
ENA  
2
IDDRTC  
TBD  
μA  
If multiple pins (such as the data bus) are enabled, the measure-  
ment value is that of the first pin to start driving.  
1 Measured at VDDEXT = 3.65 V with voltage regulator off (VDDINT = 0 V).  
2 Measured at VDDRTC = 3.3 V at 25°C.  
Output Disable Time  
Table 51. Internal Power Dissipation (Deep Sleep mode)  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The time for the voltage on the bus  
to decay by ΔV is dependent on the capacitive load, CL and the  
load current, IL. This decay time can be approximated by the  
equation:  
1
VDDINT  
IDD (nominal2)  
Unit  
mA  
mA  
mA  
mA  
mA  
0.8  
TBD  
TBD  
TBD  
TBD  
TBD  
0.9  
1.0  
1.1  
t
= (C ΔV) ⁄ I  
DECAY  
L
L
1.26  
1 Assumes VDDINT is regulated externally.  
The output disable time tDIS is the difference between  
2 Nominal assumes an operating temperature of 25°C.  
t
DIS_MEASURED and tDECAY as shown in Figure 34. The time  
DIS_MEASURED is the interval from when the reference signal  
t
Table 52. Internal Power Dissipation (Full On1 mode)  
switches to when the output voltage decays ΔV from the mea-  
sured output high or output low voltage. The time tDECAY is  
calculated with test loads CL and IL, and with ΔV equal to 0.5 V.  
VDDINT2 @ fCCLK  
0.8 @ TBD MHz  
0.8 @ TBD MHz  
0.9 @ TBD MHz  
1.0 @ TBD MHz  
1.1 @ TBD MHz  
1.26 @ TBD MHz  
IDD (nominal3)  
Unit  
mA  
mA  
mA  
mA  
mA  
mA  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
1 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.  
2 Assumes VDDINT is regulated externally.  
3 Nominal assumes an operating temperature of 25°C.  
Rev. PrG  
|
Page 64 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
ENVIRONMENTAL CONDITIONS  
To determine the junction temperature on the application  
printed circuit board use:  
T
= T  
+ (Ψ × P )  
JT  
REFERENCE  
SIGNAL  
J
CASE  
D
where:  
TJ = Junction temperature (؇C)  
tDIS_MEASURED  
tENA-MEASURED  
tDIS  
tENA  
V
OH  
(MEASURED)  
V
TCASE = Case temperature (؇C) measured by customer at top  
OH  
V
(MEASURED) $V  
(MEASURED) + $ V  
2.0V  
OH  
(MEASURED)  
center of package.  
V
1.0V  
OL  
V
OL  
V
OL  
(MEASURED)  
ΨJT = From Table 53  
(MEASURED)  
tDECAY  
tTRIP  
PD = Power dissipation (see Power Dissipation on Page 64 for  
the method to calculate PD)  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
HIGH IMPEDANCE STATE.  
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
TEST CONDITIONS CAUSE THIS  
VOLTAGE TO BE APPROXIMATELY 1.5V.  
T
= T + (θ × P )  
JA  
J
A
D
Figure 34. Output Enable/Disable  
where:  
TA = Ambient temperature (؇C)  
Example System Hold Time Calculation  
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose ΔV  
to be the difference between the ADSP-BF542/4/7/8/9 proces-  
sor’s output voltage and the input threshold for the device  
requiring the hold time. A typical ΔV will be 0.4 V. CL is the total  
bus capacitance (per data line), and IL is the total leakage or  
three-state current (per data line). The hold time will be tDECAY  
plus the minimum disable time (for example, tDDAT for an asyn-  
chronous memory write cycle).  
Values of θJC are provided for package comparison and printed  
circuit board design considerations when an external heatsink is  
required.  
Values of θJB are provided for package comparison and printed  
circuit board design considerations.  
In Table 53, airflow measurements comply with JEDEC stan-  
dards JESD51-2 and JESD51-6, and the junction-to-board  
measurement complies with JESD51-8. The junction-to-case  
measurement complies with MIL-STD-883 (Method 1012.1).  
All measurements use a 2S2P JEDEC test board.  
Table 53. Thermal Characteristics, 400-Ball CSP_BGA  
506  
TO  
OUTPUT  
PIN  
1.5V  
Parameter Condition  
Typical Unit  
30pF  
θJA  
0 linear m/s air flow  
18.4  
15.8  
15.0  
9.75  
6.37  
0.27  
0.60  
0.66  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
1 linear m/s air flow  
2 linear m/s air flow  
θJB  
θJC  
ΨJT  
Figure 35. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
INPUT  
OR  
1.5V  
1.5V  
OUTPUT  
Figure 36. Voltage Reference Levels for AC  
Measurements (Except Output Enable/Disable)  
Rev. PrG  
|
Page 65 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
In Table 54, airflow measurements comply with JEDEC stan-  
dards JESD51-2 and JESD51-6, and the junction-to-board  
measurement complies with JESD51-8. The junction-to-case  
measurement complies with MIL-STD-883 (Method 1012.1).  
All measurements use a 2S2P JEDEC test board.  
Table 54. Thermal Characteristics, 360-Ball PBGA  
Parameter Condition  
Typical Unit  
θJA  
0 linear m/s air flow  
17.5  
15.2  
14.4  
7.2  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
؇C/W  
1 linear m/s air flow  
2 linear m/s air flow  
θJB  
θJC  
ΨJT  
5.9  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
0.22  
0.35  
0.42  
Rev. PrG  
|
Page 66 of 82  
|
December 2007  
Preliminary Technical Data  
400-BALL CSP_BGA PACKAGE  
ADSP-BF542/4/7/8/9  
Table 55 lists the CSP_BGA package by signal for the ADSP-  
BF549. Table 56 on Page 70 lists the CSP_BGA package by ball  
number.  
Table 55. 400-Ball CSP_BGA Ball Assignment (Alphabetically by Signal)  
Signal  
A1  
Ball No.  
B2  
Signal  
DA4  
Ball No.  
G16  
F19  
D20  
C20  
F18  
E19  
B20  
F17  
D19  
H17  
H16  
F16  
E16  
D16  
C18  
D18  
B18  
C19  
B19  
M20  
N20  
L18  
M19  
L19  
L20  
L17  
K16  
K20  
K17  
K19  
J20  
Signal  
DQS1  
DRAS  
DWE  
EMU  
EXT_WAKE  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
Ball No.  
H18  
E17  
E18  
R5  
Signal  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GNDMP  
MFS  
Ball No.  
L10  
L11  
L12  
L13  
L14  
M6  
A2  
A2  
DA5  
A3  
B3  
DA6  
ABE0  
ABE1  
AMS0  
AMS1  
AMS2  
AMS3  
AOE  
C17  
C16  
A10  
D9  
DA7  
DA8  
M18  
A1  
DA9  
DA10  
DA11  
DA12  
DBA0  
DBA1  
DCAS  
DCLK0  
DCLK0  
DCLK1  
DCLK1  
DCLKE  
DCS0  
DCS1  
DDR_VREF  
DDR_VSSR  
DQ0  
A13  
A20  
B11  
D1  
M7  
B10  
D10  
C10  
B12  
P19  
D12  
W1  
M8  
M9  
M10  
M11  
M12  
M13  
M14  
N6  
ARE  
D4  
ATAPI_PDIAG  
AWE  
BMODE0  
BMODE1  
BMODE2  
BMODE3  
CLKBUF  
CLKIN  
CLKOUT  
D0  
E3  
F3  
F6  
W2  
F14  
G9  
W3  
N7  
W4  
G10  
G11  
H7  
N8  
D11  
A11  
L16  
D13  
C13  
B13  
B15  
A15  
B16  
A16  
B17  
C14  
C15  
A17  
D14  
D15  
E15  
E14  
D17  
G19  
G17  
E20  
G18  
N9  
N10  
N11  
N12  
N13  
N14  
P8  
H8  
H9  
D1  
H10  
H11  
H12  
J7  
D2  
DQ1  
D3  
DQ2  
D4  
DQ3  
P9  
D5  
DQ4  
J8  
P10  
P11  
P12  
P13  
R9  
D6  
DQ5  
J9  
D7  
DQ6  
J10  
J11  
J12  
K7  
D8  
DQ7  
D9  
DQ8  
D10  
DQ9  
R13  
R14  
R16  
U8  
D11  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQM0  
DQM1  
DQS0  
K18  
H20  
J19  
K8  
D12  
K9  
D13  
K10  
K11  
K12  
K13  
L7  
D14  
J18  
V6  
D15  
J17  
Y1  
DA0  
J16  
Y20  
E7  
DA1  
G20  
H19  
F20  
DA2  
L8  
E6  
DA3  
L9  
MLF_M  
F4  
Rev. PrG  
|
Page 67 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 55. 400-Ball CSP_BGA Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
MLF_P  
MXI  
Ball No.  
E4  
Signal  
PC5  
Ball No.  
G1  
Signal  
PE15  
PF0  
Ball No.  
W17  
K3  
Signal  
PH7  
PH8  
PH9  
PH10  
PH11  
PH12  
PH13  
PI0  
Ball No.  
H4  
C2  
PC6  
J5  
D5  
MXO  
NMI  
PA0  
C1  
PC7  
H3  
PF1  
J1  
C4  
C11  
U12  
V12  
W12  
Y12  
W11  
V11  
Y11  
U11  
U10  
Y10  
Y9  
PC8  
Y14  
V13  
U13  
W14  
Y15  
W15  
P3  
PF2  
K2  
C7  
PC9  
PF3  
K1  
C5  
PA1  
PC10  
PC11  
PC12  
PC13  
PD0  
PD1  
PD2  
PD3  
PD4  
PD5  
PD6  
PD7  
PD8  
PD9  
PD10  
PD11  
PD12  
PD13  
PD14  
PD15  
PE0  
PF4  
L2  
D7  
PA2  
PF5  
L1  
C6  
PA3  
PF6  
L4  
A3  
PA4  
PF7  
K4  
PI1  
B4  
PA5  
PF8  
L3  
PI2  
A4  
PA6  
P4  
PF9  
M1  
M2  
M3  
M4  
N4  
PI3  
B5  
PA7  
R1  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PG0  
PG1  
PG2  
PG3  
PG4  
PG5  
PG6  
PG7  
PG8  
PG9  
PG10  
PG11  
PG12  
PG13  
PG14  
PG15  
PH0  
PH1  
PH2  
PH3  
PH4  
PH5  
PH6  
PI4  
A5  
PA8  
R2  
PI5  
B6  
PA9  
T1  
PI6  
A6  
PA10  
PA11  
PA12  
PA13  
PA14  
PA15  
PB0  
R3  
PI7  
B7  
V10  
Y8  
T2  
N1  
PI8  
A7  
R4  
N2  
PI9  
C8  
W10  
Y7  
U1  
J4  
PI10  
PI11  
PI12  
PI13  
PI14  
PI15  
PJ0  
B8  
U2  
K5  
A8  
W9  
W5  
Y2  
T3  
L5  
A9  
V1  
N3  
C9  
PB1  
T4  
P1  
D8  
PB2  
T6  
V2  
V15  
Y17  
W16  
V16  
Y19  
Y18  
U15  
P16  
R18  
Y13  
W13  
W18  
U14  
V17  
V18  
U17  
C3  
B9  
PB3  
U6  
U4  
R20  
N18  
M16  
T20  
N17  
U20  
P18  
N16  
R19  
P17  
T19  
M17  
P20  
N19  
C12  
A14  
B14  
PB4  
Y4  
U3  
PJ1  
PB5  
Y3  
V19  
T17  
U18  
V14  
Y16  
W20  
W19  
R17  
V20  
U19  
T18  
P2  
PJ2  
PB6  
W6  
V7  
PE1  
PJ3  
PB7  
PE2  
PJ4  
PB8  
W8  
V8  
PE3  
PJ5  
PB9  
PE4  
PJ6  
PB10  
PB11  
PB12  
PB13  
PB14  
PC0  
U7  
PE5  
PJ7  
W7  
Y6  
PE6  
PJ8  
PE7  
PJ9  
V9  
PE8  
PJ10  
PJ11  
PJ12  
PJ13  
RESET  
RTXI  
RTXO  
Y5  
PE9  
H2  
PE10  
PE11  
PE12  
PE13  
PE14  
PC1  
J3  
PC2  
J2  
M5  
P5  
PC3  
H1  
PC4  
G2  
U16  
D6  
Rev. PrG  
|
Page 68 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 55. 400-Ball CSP_BGA Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
TCK  
Ball No.  
V3  
Signal  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
Ball No.  
J14  
J15  
K14  
K15  
E5  
Signal  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
Ball No.  
N5  
Signal  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDMP  
VDDRTC  
VDDUSB  
VDDUSB  
VDDVR  
Ball No.  
G13  
J6  
TDI  
V5  
N15  
P15  
R6  
TDO  
V4  
J13  
L6  
TMS  
U5  
TRST  
T5  
R7  
L15  
P6  
USB_DM  
USB_DP  
USB_ID  
USB_RSET  
USB_VBUS  
USB_VREF  
USB_XI  
USB_XO  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
E2  
E9  
R8  
E1  
E10  
E11  
E12  
F7  
R15  
T7  
P7  
G3  
P14  
R10  
R11  
R12  
U9  
D3  
T8  
D2  
T9  
B1  
F8  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
F9  
F1  
F13  
G5  
F2  
E8  
F10  
F11  
F12  
G15  
H13  
H14  
H15  
G6  
E13  
F5  
G7  
G14  
H5  
G4  
F15  
A18  
A19  
A12  
H6  
VROUT0  
VROUT1  
XTAL  
K6  
G8  
M15  
G12  
Rev. PrG  
|
Page 69 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 56 lists the CSP_BGA package by ball number for the  
ADSP-BF549. Table 55 on Page 67 lists the CSP_BGA package  
by signal.  
Table 56. 400-Ball CSP_BGA Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Signal  
GND  
A2  
Ball No.  
C1  
Signal  
MXO  
MXI  
Ball No.  
E1  
Signal  
USB_DP  
USB_DM  
GND  
Ball No.  
G1  
Signal  
PC5  
A2  
C2  
E2  
G2  
PC4  
A3  
PI0  
C3  
PH5  
E3  
G3  
USB_ID  
VDDUSB  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
GND  
A4  
PI2  
C4  
PH9  
E4  
MLF_P  
VDDEXT  
MFS  
G4  
A5  
PI4  
C5  
PH11  
PH13  
PH10  
PI9  
E5  
G5  
A6  
PI6  
C6  
E6  
G6  
A7  
PI8  
C7  
E7  
GNDMP  
VDDMP  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDRTC  
D14  
G7  
A8  
PI11  
PI12  
AMS0  
CLKIN  
XTAL  
GND  
RTXI  
D4  
C8  
E8  
G8  
A9  
C9  
PI13  
E9  
G9  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
A20  
B1  
C10  
C11  
C12  
C13  
C14  
C15  
C16  
C17  
C18  
C19  
C20  
D1  
AOE  
E10  
E11  
E12  
E13  
E14  
E15  
E16  
E17  
E18  
E19  
E20  
F1  
G10  
G11  
G12  
G13  
G14  
G15  
G16  
G17  
G18  
G19  
G20  
H1  
GND  
NMI  
GND  
RESET  
D1  
VDDINT  
VDDINT  
VDDEXT  
VDDDDR  
DA4  
D8  
D9  
D13  
D6  
ABE1  
ABE0  
DCLK1  
DCS0  
DA7  
DCLK0  
DRAS  
DWE  
D10  
VROUT0  
VROUT1  
GND  
USB_VREF  
A1  
DA1  
DA3  
DA9  
DA0  
DA2  
DQM0  
PC3  
GND  
USB_VBUS  
USB_RSET  
GND  
PH8  
USB_XI  
USB_XO  
GND  
B2  
D2  
F2  
H2  
PC0  
B3  
A3  
D3  
F3  
H3  
PC7  
B4  
PI1  
D4  
F4  
MLF_M  
VDDUSB  
GND  
H4  
PH7  
B5  
PI3  
D5  
F5  
H5  
VDDEXT  
VDDEXT  
GND  
B6  
PI5  
D6  
PH6  
F6  
H6  
B7  
PI7  
D7  
PH12  
PI14  
F7  
VDDEXT  
VDDEXT  
VDDINT  
VDDDDR  
VDDDDR  
VDDDDR  
VDDEXT  
GND  
H7  
B8  
PI10  
PI15  
AMS2  
GND  
ARE  
D8  
F8  
H8  
GND  
B9  
D9  
AMS1  
AMS3  
CLKBUF  
AWE  
F9  
H9  
GND  
B10  
B11  
B12  
B13  
B14  
B15  
B16  
B17  
B18  
B19  
B20  
D10  
D11  
D12  
D13  
D14  
D15  
D16  
D17  
D18  
D19  
D20  
F10  
F11  
F12  
F13  
F14  
F15  
F16  
F17  
F18  
F19  
F20  
H10  
H11  
H12  
H13  
H14  
H15  
H16  
H17  
H18  
H19  
H20  
GND  
GND  
GND  
D2  
D0  
VDDDDR  
VDDDDR  
VDDDDR  
DBA1  
DBA0  
DQS1  
DQM1  
DQ11  
RTXO  
D3  
D11  
D12  
VDDVR  
D5  
DCLK0  
D15  
DCAS  
DA11  
DA8  
D7  
DCLKE  
DCS1  
DA10  
DCLK1  
DA12  
DA6  
DA5  
DQS0  
Rev. PrG  
|
Page 70 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 56. 400-Ball CSP_BGA Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No.  
J1  
Signal  
PF1  
Ball No.  
L1  
Signal  
PF5  
Ball No.  
N1  
Signal  
PF14  
PF15  
PG3  
Ball No.  
R1  
Signal  
PD2  
J2  
PC2  
L2  
PF4  
N2  
R2  
PD3  
J3  
PC1  
L3  
PF8  
N3  
R3  
PD5  
J4  
PG0  
L4  
PF6  
N4  
PF13  
VDDEXT  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
VDDEXT  
PJ7  
R4  
PD7  
J5  
PC6  
L5  
PG2  
N5  
R5  
EMU  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
VDDINT  
VDDINT  
VDDINT  
GND  
GND  
VDDEXT  
GND  
PE7  
J6  
VDDINT  
GND  
GND  
GND  
GND  
GND  
GND  
VDDINT  
VDDDDR  
VDDDDR  
DQ15  
DQ14  
DQ13  
DQ12  
DQ9  
PF3  
L6  
VDDINT  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
VDDINT  
CLKOUT  
DQ4  
N6  
R6  
J7  
L7  
N7  
R7  
J8  
L8  
N8  
R8  
J9  
L9  
N9  
R9  
J10  
J11  
J12  
J13  
J14  
J15  
J16  
J17  
J18  
J19  
J20  
K1  
L10  
L11  
L12  
L13  
L14  
L15  
L16  
L17  
L18  
L19  
L20  
M1  
N10  
N11  
N12  
N13  
N14  
N15  
N16  
N17  
N18  
N19  
N20  
P1  
R10  
R11  
R12  
R13  
R14  
R15  
R16  
R17  
R18  
R19  
R20  
T1  
PJ4  
DQ0  
PJ1  
PG13  
PJ8  
DQ2  
PJ13  
DQ3  
DDR_VSSR  
PG4  
PJ0  
PF9  
PD4  
K2  
PF2  
M2  
PF10  
PF11  
PF12  
PE12  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
VDDEXT  
PJ2  
P2  
PE11  
PD0  
T2  
PD6  
K3  
PF0  
M3  
P3  
T3  
PD10  
PD12  
TRST  
PB2  
K4  
PF7  
M4  
P4  
PD1  
T4  
K5  
PG1  
M5  
P5  
PE13  
VDDINT  
VDDINT  
GND  
GND  
GND  
GND  
GND  
GND  
VDDINT  
VDDEXT  
PG12  
PJ9  
T5  
K6  
VDDEXT  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
VDDDDR  
VDDDDR  
DQ5  
DQ7  
DQ10  
DQ8  
DQ6  
M6  
P6  
T6  
K7  
M7  
P7  
T7  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
PE1  
K8  
M8  
P8  
T8  
K9  
M9  
P9  
T9  
K10  
K11  
K12  
K13  
K14  
K15  
K16  
K17  
K18  
K19  
K20  
M10  
M11  
M12  
M13  
M14  
M15  
M16  
M17  
M18  
M19  
M20  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
P17  
P18  
P19  
P20  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
T17  
T18  
T19  
T20  
PJ11  
EXT_WAKE  
DQ1  
PJ6  
PE10  
PJ10  
ATAPI_PDIAG  
PJ12  
DDR_VREF  
PJ3  
Rev. PrG  
|
Page 71 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 56. 400-Ball CSP_BGA Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No.  
U1  
Signal  
PD8  
PD9  
PD15  
PD14  
TMS  
PB3  
Ball No.  
V1  
Signal  
PD11  
PD13  
TCK  
Ball No.  
W1  
Signal  
BMODE0  
BMODE1  
BMODE2  
BMODE3  
PB0  
Ball No.  
Y1  
Signal  
GND  
PB1  
U2  
V2  
W2  
Y2  
U3  
V3  
W3  
Y3  
PB5  
U4  
V4  
TDO  
TDI  
W4  
Y4  
PB4  
U5  
V5  
W5  
Y5  
PB14  
PB12  
PA14  
PA12  
PA10  
PA9  
U6  
V6  
GND  
PB7  
W6  
PB6  
Y6  
U7  
PB10  
GND  
VDDINT  
PA8  
V7  
W7  
PB11  
PB8  
Y7  
U8  
V8  
PB9  
W8  
Y8  
U9  
V9  
PB13  
PA11  
PA5  
W9  
PA15  
PA13  
PA4  
Y9  
U10  
U11  
U12  
U13  
U14  
U15  
U16  
U17  
U18  
U19  
U20  
V10  
V11  
V12  
V13  
V14  
V15  
V16  
V17  
V18  
V19  
V20  
W10  
W11  
W12  
W13  
W14  
W15  
W16  
W17  
W18  
W19  
W20  
Y10  
Y11  
Y12  
Y13  
Y14  
Y15  
Y16  
Y17  
Y18  
Y19  
Y20  
PA7  
PA6  
PA0  
PA1  
PA2  
PA3  
PC10  
PH1  
PC9  
PG15  
PC11  
PC13  
PG7  
PG14  
PC8  
PE3  
PG11  
PE14  
PH4  
PG5  
PG8  
PH2  
PH3  
PE0  
PC12  
PE4  
PE15  
PH0  
PG6  
PE2  
PG10  
PG9  
PE9  
PE6  
PJ5  
PE8  
PE5  
GND  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20  
R
R
A
B
C
D
E
F
R
G
S
S
S
S
S
S
S
S
S
S
S
S
S
G
H
J
S
S
S
K
L
R
G
M
N
P
R
T
U
V
W
Y
KEY:  
V
S
SUPPLIES: V  
, V  
,V  
, V  
,V  
DDINT  
DDDDR  
DDMP DDUSB  
DDRTC DDVR  
V
R
G
REFERENCES: VROUT0, VROUT1,DDR_V  
, USB_V  
REF  
DDEXT  
REF  
GROUNDS: GND , DDR_V  
GND  
NC  
MP  
SSR  
I/O SIGNALS  
Figure 37. 400-Ball Mini-BGA Ground Configuration (Top View)  
Rev. PrG  
|
Page 72 of 82  
|
December 2007  
Preliminary Technical Data  
360-BALL PBGA PACKAGE  
ADSP-BF542/4/7/8/9  
Table 57 lists the 360-Ball PBGA package by signal for the  
ADSP-BF549. Table 58 on Page 76 lists the 360-Ball PBGA  
package by ball number.  
Table 57. 360-Ball PBGA Ball Assignment (Alphabetically by Signal)  
Signal  
A1  
Ball No.  
A2  
Signal  
DA0  
Ball No.  
F26  
Signal  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQM0  
DQM1  
DQS0  
DQS1  
DRAS  
DWE  
EMU  
Ball No.  
V26  
W26  
Y26  
AA26  
AB26  
N26  
P25  
P26  
R25  
L26  
Signal  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GNDMP  
MFS  
Ball No.  
R12  
A2  
B3  
DA1  
E26  
R13  
A3  
A3  
DA2  
D26  
C26  
D25  
E25  
R14  
ABE0  
ABE1  
AMS0  
AMS1  
AMS2  
AMS3  
AOE  
C20  
C19  
B13  
C11  
C10  
C9  
DA3  
R15  
T12  
DA4  
DA5  
T13  
DA6  
F25  
T14  
DA7  
G25  
H25  
J25  
T15  
DA8  
U12  
U13  
U14  
U15  
V12  
V13  
V14  
V15  
AB24  
AC23  
AC4  
AD24  
AD3  
AE2  
AF1  
AF26  
N11  
C6  
C12  
A12  
P24  
B12  
AD12  
AD13  
AD14  
AD15  
D3  
DA9  
ARE  
DA10  
DA11  
DA12  
DBA0  
DBA1  
DCAS  
DCLK0  
DCLK0  
DCLK1  
DCLK1  
DCLKE  
DCS0  
DCS1  
DDR_VREF  
DDR_VSSR  
DQ0  
G26  
K25  
N25  
AD6  
D24  
A1  
ATAPI_PDIAG  
AWE  
BMODE0  
BMODE1  
BMODE2  
BMODE3  
CLKBUF  
CLKIN  
CLKOUT  
D0  
K26  
EXT_WAKE  
GND  
J26  
H26  
M26  
G24  
H24  
E24  
GND  
A26  
B15  
B2  
GND  
GND  
GND  
B25  
C24  
C3  
A15  
A25  
B17  
A17  
B18  
A18  
B19  
A19  
B20  
A20  
B21  
A21  
B22  
A22  
B23  
A23  
B24  
A24  
GND  
F24  
GND  
M25  
L25  
GND  
D23  
D4  
D1  
GND  
D2  
AC26  
AE26  
AE25  
AC25  
AB25  
AA25  
Y25  
GND  
L13  
D3  
GND  
M12  
M13  
M14  
M15  
N12  
N13  
N14  
N15  
P11  
P12  
P13  
P14  
P15  
D4  
GND  
D5  
GND  
D6  
DQ1  
GND  
MLF_M  
MLF_P  
MXI  
C7  
D7  
DQ2  
GND  
C8  
D8  
DQ3  
GND  
C4  
D9  
DQ4  
W25  
V25  
GND  
MXO  
NMI  
C5  
D10  
DQ5  
GND  
C14  
AE13  
AE12  
AF13  
AF12  
AE11  
D11  
DQ6  
U25  
T25  
GND  
PA0  
D12  
DQ7  
GND  
PA1  
D13  
DQ8  
R26  
GND  
PA2  
D14  
DQ9  
T26  
GND  
PA3  
D15  
DQ10  
U26  
GND  
PA4  
Rev. PrG  
|
Page 73 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 57. 360-Ball PBGA Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
PA5  
Ball No.  
AF11  
AE10  
AF10  
AE9  
AF9  
AE8  
AF8  
AE7  
AF7  
AE6  
AF6  
AD4  
AD5  
AB1  
AC1  
AC2  
AD2  
AD1  
AE1  
AF2  
AE3  
AF3  
AE4  
AF4  
AE5  
AF5  
H2  
Signal  
PC10  
PC11  
PC12  
PC13  
PD0  
PD1  
PD2  
PD3  
PD4  
PD5  
PD6  
PD7  
PD8  
PD9  
PD10  
PD11  
PD12  
PD13  
PD14  
PD15  
PE0  
Ball No.  
AE15  
AF15  
AE16  
AF16  
P1  
Signal  
PF0  
Ball No.  
H3  
Signal  
PH4  
PH5  
PH6  
PH7  
PH8  
PH9  
PH10  
PH11  
PH12  
PH13  
PI0  
Ball No.  
AF17  
G3  
PA6  
PF1  
J3  
PA7  
PF2  
L2  
F3  
PA8  
PF3  
K3  
E3  
PA9  
PF4  
M2  
B4  
PA10  
PA11  
PA12  
PA13  
PA14  
PA15  
PB0  
R2  
PF5  
L3  
A4  
R1  
PF6  
N2  
B5  
T2  
PF7  
M3  
A5  
T1  
PF8  
N3  
B6  
U2  
PF9  
P3  
A6  
U1  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PG0  
PG1  
PG2  
PG3  
PG4  
PG5  
PG6  
PG7  
PG8  
PG9  
PG10  
PG11  
PG12  
PG13  
PG14  
PG15  
PH0  
PH1  
PH2  
PH3  
R3  
B7  
V2  
T3  
PI1  
A7  
PB1  
V1  
U3  
PI2  
B8  
PB2  
W2  
V3  
PI3  
A8  
PB3  
W1  
W3  
PI4  
B9  
PB4  
Y2  
Y3  
PI5  
A9  
PB5  
Y1  
K1  
PI6  
B10  
A10  
B11  
A11  
B14  
A14  
C13  
C17  
C18  
A13  
C21  
C22  
C23  
M24  
N24  
R24  
T24  
U24  
V24  
AA24  
PB6  
AA2  
AA1  
AB2  
AF23  
AF24  
AF25  
AE23  
AE24  
AD23  
AC24  
AD20  
AD21  
AE22  
AD22  
N1  
L1  
PI7  
PB7  
AA3  
AB3  
AC3  
AE21  
AE20  
AF20  
AE19  
AF19  
AE18  
AF18  
AD19  
AD18  
AD17  
AD16  
AF21  
AF22  
Y24  
AE17  
PI8  
PB8  
PI9  
PB9  
PI10  
PI11  
PI12  
PI13  
PI14  
PI15  
PJ0  
PB10  
PB11  
PB12  
PB13  
PB14  
PC0  
PC1  
PC2  
PC3  
PC4  
PC5  
PC6  
PC7  
PC8  
PC9  
PE1  
PE2  
PE3  
PE4  
PE5  
PE6  
H1  
PE7  
PJ1  
J2  
PE8  
PJ2  
J1  
PE9  
PJ3  
F1  
PE10  
PE11  
PE12  
PE13  
PE14  
PE15  
PJ4  
G1  
PJ5  
K2  
P2  
PJ6  
G2  
M1  
PJ7  
AE14  
AF14  
AD25  
AD26  
PJ8  
PJ9  
Rev. PrG  
|
Page 74 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 57. 360-Ball PBGA Ball Assignment (Alphabetically by Signal) (Continued)  
Signal  
PJ10  
Ball No.  
W24  
J24  
Signal  
USB_XI  
USB_XO  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDDDR  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
Ball No.  
B1  
Signal  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
Ball No.  
L10  
L11  
L12  
L14  
L15  
M10  
M11  
N10  
P10  
P9  
Signal  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDMP  
VDDRTC  
VDDUSB  
VDDUSB  
VDDVR  
Ball No.  
K17  
L16  
PJ11  
C1  
PJ12  
K24  
L24  
B16  
C15  
C16  
AD11  
AD10  
AD9  
AD8  
AD7  
D1  
N16  
P16  
P17  
R16  
R17  
T16  
T17  
U16  
U17  
J12  
L17  
PJ13  
M16  
M17  
M18  
N17  
N18  
P18  
R18  
K16  
J14  
RESET  
RTXI  
RTXO  
TCK  
TDI  
TDO  
TMS  
R10  
R11  
R9  
TRST  
USB_DM  
USB_DP  
USB_ID  
USB_RSET  
USB_VBUS  
USB_VREF  
J13  
M9  
E1  
K10  
K11  
K12  
K13  
K14  
T10  
T11  
U10  
U11  
K15  
N9  
E2  
J15  
D2  
VROUT0  
VROUT1  
XTAL  
B26  
C25  
A16  
F2  
C2  
Rev. PrG  
|
Page 75 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 58 lists the 360-Ball PBGA package by ball number for the  
ADSP-BF549. Table 59 on Page 81 lists the 360-Ball PBGA  
package by signal.  
Table 58. 360-Ball PBGA Ball Assignment (Numerically by Ball Number)  
Ball No.  
A1  
Signal  
GND  
A1  
Ball No.  
B15  
B16  
B17  
B18  
B19  
B20  
B21  
B22  
B23  
B24  
B25  
B26  
C1  
Signal  
GND  
RESET  
D0  
Ball No.  
D3  
Signal  
CLKBUF  
GND  
Ball No.  
K1  
Signal  
PG0  
A2  
D4  
K2  
PC6  
A3  
A3  
D23  
D24  
D25  
D26  
E1  
GND  
K3  
PF3  
A4  
PH9  
PH11  
PH13  
PI1  
D2  
EXT_WAKE  
DA4  
K10  
K11  
K12  
K13  
K14  
K15  
K16  
K17  
K24  
K25  
K26  
L1  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDMP  
VDDINT  
PJ12  
A5  
D4  
A6  
D6  
DA2  
A7  
D8  
USB_DP  
USB_ID  
PH7  
A8  
PI3  
D10  
E2  
A9  
PI5  
D12  
E3  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
A20  
A21  
A22  
A23  
A24  
A25  
A26  
B1  
PI7  
D14  
E24  
E25  
E26  
F1  
DCLK1  
DA5  
PI9  
GND  
VROUT0  
USB_XO  
USB_VREF  
GND  
MXI  
ARE  
PI15  
PI11  
CLKIN  
XTAL  
D1  
DA1  
PC4  
DA11  
C2  
F2  
USB_VBUS  
PH6  
DA12  
C3  
F3  
PG1  
C4  
F24  
F25  
F26  
G1  
DCLK1  
DA6  
L2  
PF2  
C5  
MXO  
MFS  
L3  
PF5  
D3  
C6  
DA0  
L10  
L11  
L12  
L13  
L14  
L15  
L16  
L17  
L24  
L25  
L26  
M1  
VDDEXT  
VDDEXT  
VDDEXT  
GND  
D5  
C7  
MLF_M  
MLF_P  
AMS3  
AMS2  
AMS1  
AOE  
PC5  
D7  
C8  
G2  
PC7  
D9  
C9  
G3  
PH5  
D11  
D13  
D15  
CLKOUT  
GND  
USB_XI  
GND  
A2  
C10  
C11  
C12  
C13  
C14  
C15  
C16  
C17  
C18  
C19  
C20  
C21  
C22  
C23  
C24  
C25  
C26  
D1  
G24  
G25  
G26  
H1  
DCLK0  
DA7  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
PJ13  
DA10  
PC1  
PI12  
NMI  
H2  
PC0  
RTXI  
H3  
PF0  
DCS0  
B2  
RTXO  
PI13  
H24  
H25  
H26  
J1  
DCLK0  
DA8  
DRAS  
B3  
PE13  
B4  
PH8  
PH10  
PH12  
PI0  
PI14  
DBA1  
PC3  
M2  
PF4  
B5  
ABE1  
ABE0  
PJ0  
M3  
PF7  
B6  
J2  
PC2  
M9  
VDDUSB  
VDDEXT  
VDDEXT  
GND  
B7  
J3  
PF1  
M10  
M11  
M12  
M13  
M14  
M15  
M16  
M17  
B8  
PI2  
PJ1  
J12  
J13  
J14  
J15  
J24  
J25  
J26  
VDDEXT  
VDDEXT  
VDDRTC  
VDDVR  
PJ11  
B9  
PI4  
PJ2  
B10  
B11  
B12  
B13  
B14  
PI6  
GND  
VROUT1  
DA3  
GND  
PI8  
GND  
AWE  
AMS0  
PI10  
GND  
USB_DM  
USB_RSET  
DA9  
VDDINT  
VDDINT  
D2  
DBA0  
Rev. PrG  
|
Page 76 of 82  
|
December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
Table 58. 360-Ball PBGA Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No.  
M18  
M24  
M25  
M26  
N1  
Signal  
VDDINT  
PJ3  
Ball No.  
R10  
R11  
R12  
R13  
R14  
R15  
R16  
R17  
R18  
R24  
R25  
R26  
T1  
Signal  
VDDEXT  
VDDEXT  
GND  
Ball No.  
V1  
Signal  
PD8  
Ball No.  
AC25  
AC26  
AD1  
Signal  
DQ0  
V2  
PD7  
DCS1  
PB6  
DCKE  
V3  
PF13  
GND  
GND  
GND  
GND  
PJ8  
DCAS  
PE11  
GND  
V12  
V13  
V14  
V15  
V24  
V25  
V26  
W1  
AD2  
PB5  
GND  
AD3  
GND  
PB0  
N2  
PF6  
GND  
AD4  
N3  
PF8  
VDDDDR  
VDDDDR  
VDDINT  
PJ5  
AD5  
PB1  
N9  
VDDUSB  
VDDEXT  
GNDMP  
GND  
AD6  
EMU  
TRST  
TMS  
N10  
N11  
N12  
N13  
N14  
N15  
N16  
N17  
N18  
N24  
N25  
N26  
P1  
DQ5  
DQ11  
PD10  
PD9  
AD7  
AD8  
DQS1  
DQ8  
AD9  
TDO  
GND  
W2  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
AD16  
AD17  
AD18  
AD19  
AD20  
AD21  
AD22  
AD23  
AD24  
AD25  
AD26  
AE1  
TDI  
GND  
PD4  
W3  
PF14  
PJ10  
DQ4  
DQ12  
PD12  
PD11  
PF15  
PH2  
TCK  
GND  
T2  
PD3  
W24  
W25  
W26  
Y1  
BMODE0  
BMODE1  
BMODE2  
BMODE3  
PG15  
PG14  
PG13  
PG12  
PE7  
VDDDDR  
VDDINT  
VDDINT  
PJ4  
T3  
PF11  
T10  
T11  
T12  
T13  
T14  
T15  
T16  
T17  
T24  
T25  
T26  
U1  
VDDEXT  
VDDEXT  
GND  
Y2  
DWE  
GND  
Y3  
DQM0  
PD0  
GND  
Y24  
Y25  
Y26  
AA1  
AA2  
AA3  
AA24  
AA25  
AA26  
AB1  
AB2  
AB3  
AB24  
AB25  
AB26  
AC1  
AC2  
AC3  
AC4  
AC23  
AC24  
GND  
DQ3  
DQ13  
PD14  
PD13  
PG2  
P2  
PE12  
VDDDDR  
VDDDDR  
PJ6  
P3  
PF9  
PE8  
P9  
VDDEXT  
VDDEXT  
GND  
PE10  
PE5  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
P17  
P18  
P24  
P25  
P26  
R1  
DQ7  
DQ9  
PJ9  
GND  
PE14  
PE15  
PB7  
GND  
PD6  
DQ2  
DQ14  
PB2  
GND  
U2  
PD5  
GND  
U3  
PF12  
GND  
U10  
U11  
U12  
U13  
U14  
U15  
U16  
U17  
U24  
U25  
U26  
VDDEXT  
VDDEXT  
GND  
PD15  
PG3  
AE2  
GND  
PB9  
VDDDDR  
VDDDDR  
VDDINT  
ATAPI_PDIAG  
DQM1  
DQS0  
PD2  
AE3  
GND  
DQ1  
DQ15  
PB3  
AE4  
PB11  
PB13  
PA14  
PA12  
PA10  
PA8  
GND  
AE5  
GND  
AE6  
GND  
AE7  
VDDDDR  
VDDDDR  
PJ7  
PB4  
AE8  
PG4  
AE9  
R2  
PD1  
GND  
GND  
PE6  
AE10  
AE11  
AE12  
PA6  
R3  
PF10  
DQ6  
PA4  
R9  
VDDEXT  
DQ10  
PA1  
Rev. PrG  
|
Page 77 of 82  
|
December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Table 58. 360-Ball PBGA Ball Assignment (Numerically by Ball Number) (Continued)  
Ball No.  
AE13  
AE14  
AE15  
AE16  
AE17  
AE18  
AE19  
AE20  
AE21  
AE22  
AE23  
Signal  
PA0  
Ball No.  
AE24  
AE25  
AE26  
AF1  
Signal  
PE4  
Ball No.  
AF9  
Signal  
PA9  
Ball No.  
AF20  
AF21  
AF22  
AF23  
AF24  
AF25  
AF26  
Signal  
PG7  
PH0  
PH1  
PE0  
PC8  
DDR_VSSR  
DDR_VREF  
GND  
AF10  
AF11  
AF12  
AF13  
AF14  
AF15  
AF16  
AF17  
AF18  
AF19  
PA7  
PC10  
PC12  
PH3  
PG10  
PG8  
PG6  
PG5  
PE9  
PA5  
PA3  
AF2  
PB8  
PA2  
PE1  
AF3  
PB10  
PC9  
PE2  
AF4  
PB12  
PC11  
PC13  
PH4  
PG11  
PG9  
GND  
AF5  
PB14  
AF6  
PA15  
AF7  
PA13  
PE3  
AF8  
PA11  
2
R
4
6
8
10 12  
14 16 18  
20 22 24 26  
1
3
5
7
9
11 13 15 17 19 21 23 25  
A
B
C
R
R
D
E
F
G
H
J
K
S
S
S
L
M
N
P
R
S
S
S
S
S
S
S
G
S
S
S
S
T
U
V
W
Y
AA  
AB  
AC  
AD  
AE  
AF  
G
R
V
S
R
SUPPLIES: V  
, V  
,V  
, V  
, V  
DDVR  
DDINT  
DDDDR  
DDMP DDUSB  
DDRTC  
V
DDEXT  
REFERENCES: VROUT0, VROUT1, DDR_VREF, USB_VREF  
GROUNDS: GNDMP, DDR_VSSR  
G
GND  
NC  
I/O SIGNALS  
Figure 38. 360-Ball PBGA Ground Configuration (Top View)  
Rev. PrG  
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Page 78 of 82  
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December 2007  
Preliminary Technical Data  
OUTLINE DIMENSIONS  
ADSP-BF542/4/7/8/9  
Dimensions for the 17 mm ϫ 17 mm CSP_BGA package in  
Figure 39 are shown in millimeters.  
15.20 BSC SQ  
17.00 BSC SQ  
A1 BALL  
0.80 BSC BALL PITCH  
A1 BALL INDICATOR  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
20 19 18 17 16 1514 13 12 11 10  
9 8 7 6 5 4 3 2 1  
BOTTOM VIEW  
TOP VIEW  
0.28 MIN  
0.12 MAX  
COPLANARITY  
SIDE VIEW  
1.70 MAX  
0.50  
0.45  
0.40  
SEATING PLANE  
BALL DIAMETER  
DETAIL A  
DETAIL A  
NOTES:  
1. ALL DIMENSIONS ARE IN MILLIMETERS.  
2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,  
WITH THE EXCEPTION OF BALL DIAMETER.  
3. CENTER DIMENSIONS ARE NOMINAL.  
Figure 39. 400-Ball, 17 mm ϫ 17 mm CSP_BGA (Chip Scale Package Ball Grid Array) (BC-400)  
Rev. PrG  
|
Page 79 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
Dimensions for the 360-ball PBGA 27 mm ϫ 27 mm package in  
Figure 40 are shown in millimeters.  
360-Ball Plastic Ball Grid Array [PBGA]  
(B-360-1)  
Dimensions shown in millimeters  
27.20  
27.00 SQ  
26.80  
A1 BALL  
PAD CORNER  
6.75 BSC  
26 24 22 20 18 16 14 12 10  
25 23 21 19 17 15 13 11  
8
6
4
2
A1 BALL  
PAD  
9
7
5
3
1
CORNER  
A
B
C
D
E
F
G
24.20  
24.00 SQ  
23.80  
H
J
K
L
M
N
25.00  
P
BSC SQ  
R
T
U
V
W
Y
1.00  
BSC  
AA  
AB  
AC  
AD  
AE  
AF  
TOP VIEW  
BOTTOM VIEW  
1.22  
1.00 REF  
DETAIL A  
2.40  
2.28  
2.13  
DETAIL A  
1.17  
1.12  
0.66  
0.61  
0.56  
COPLANARITY  
0.20 MAX  
0.50 NOM  
0.45 MIN  
0.70  
0.60  
0.50  
SEATING  
PLANE  
BALL DIAMETER  
COMPLIANT TO JEDEC STANDARDS MS-034-AAL-1  
Figure 40. 360-Ball, 27 mm ϫ 27 mm PBGA (B-360-1)  
Rev. PrG  
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Page 80 of 82  
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December 2007  
Preliminary Technical Data  
ADSP-BF542/4/7/8/9  
SURFACE MOUNT DESIGN  
Table 59 is provided as an aid to PCB design. For industry-  
standard design recommendations, refer to IPC-7351, Generic  
Requirements for Surface Mount Design and Land Pattern  
Standard.  
Table 59. BGA Data for Use with Surface Mount Design  
Package  
Ball Attach Type  
Solder Mask Opening  
Ball Pad Size  
400-Ball CSP_BGA (Chip Scale Package Ball Grid Array) BC-400 Solder Mask Defined  
360-Ball PBGA (B-360-1) Soldier Mask Defined  
0.40 mm diameter  
0.43 mm diameter  
0.50 mm diameter  
0.56 mm diameter  
Rev. PrG  
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Page 81 of 82  
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December 2007  
ADSP-BF542/4/7/8/9  
Preliminary Technical Data  
ORDERING GUIDE  
Part numbers that include “Z” are RoHS Compliant.  
Part Number  
Temperature SpeedGrade Operating Voltage (Nominal) Package Description Package Option  
Range (Ambient)  
(Max)  
533 MHZ  
533 MHZ  
533 MHZ  
533 MHZ  
533 MHZ  
533 MHZ  
ADSP-BF549BBCZ-ENG -40ЊC to 85ЊC  
ADSP-BF549BBZ-ENG -40ЊC to 85ЊC  
ADSP-BF548BBCZ-5X -40ЊC to 85ЊC  
ADSP-BF547BBCZ-5X -40ЊC to 85ЊC  
ADSP-BF544BBCZ-5X -40ЊC to 85ЊC  
ADSP-BF542BBCZ-5X -40ЊC to 85ЊC  
1.25 V internal, 2.5 V or 3.3 V I/O 400-Ball CSP_BGA  
1.25 V internal, 2.5 V or 3.3 V I/O 360-Ball PBGA  
1.25 V internal, 2.5 V or 3.3 V I/O 400-Ball CSP_BGA  
1.25 V internal, 2.5 V or 3.3 V I/O 400-Ball CSP_BGA  
1.25 V internal, 2.5 V or 3.3 V I/O 400-Ball CSP_BGA  
1.25 V internal, 2.5 V or 3.3 V I/O 400-Ball CSP_BGA  
BC-400  
B-360  
BC-400  
BC-400  
BC-400  
BC-400  
©
2007 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR06512-0-12/07(PrG)  
Rev. PrG  
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Page 82 of 82  
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December 2007  

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