ACT-F128K32N-090P3I [AEROFLEX]
ACT-F128K32 High Speed 4 Megabit FLASH Multichip Module; ACT- F128K32高速4兆位闪存多芯片模块![ACT-F128K32N-090P3I](http://pdffile.icpdf.com/pdf1/p00045/img/icpdf/ACT-F128K32N-090P3I_235725_icpdf.jpg)
型号: | ACT-F128K32N-090P3I |
厂家: | ![]() |
描述: | ACT-F128K32 High Speed 4 Megabit FLASH Multichip Module |
文件: | 总20页 (文件大小:203K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ACT–F128K32 High Speed
4 Megabit FLASH Multichip Module
CIRCUIT TECHNOLOGY
www.aeroflex.com
Features
■ 4 Low Power 128K x 8 FLASH Die in One MCM
■ MIL-PRF-38534 Compliant MCMs Available
■ Industry Standard Pinouts
Package
■ Organized as 128K x 32
■ Packaging – Hermetic Ceramic
● User Configurable to 256K x 16 or 512K x 8
● Upgradable to 512K x 32 in same Package Style
■ Access Times of 60, 70, 90, 120 and 150ns
■ +5V Programing, 5V ±10% Supply
■ 100,000 Erase/Program Cycles Typical, 0°C to +70°C
■ Low Standby Current
● 68 Lead, .88" x .88" x .160" Single-Cavity Small
Outline gull wing, Aeroflex code# "F5" (Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
● 66 Pin, 1.08" x 1.08" x .160" PGA Type, No
Shoulder, Aeroflex code# "P3"
● 66 Pin, 1.08" x 1.08" x .185" PGA Type, With
Shoulder, Aeroflex code# "P7"
■ TTL Compatible Inputs and CMOS Outputs
■ Embedded Erase and Program Algorithms
■ Page Program Operation and Internal Program
Control Time
■ Commercial, Industrial and Military Temperature
Ranges
■ Sector Architecture (Each Die)
● 8 Equal size sectors of 64K bytes each
● Any Combination of Sectors can be erased with
one command sequence
● Supports Full Chip Erase
■ DESC SMD# 5962–94716 Released (P3,P7,F5)
General Description
Block Diagram – PGA Type Package(P3,P7) & CQFP(F5)
The ACT–F128K32 is a high
speed, 4 megabit CMOS flash
WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4
multichip
module
(MCM)
OE
A0–A16
designed for full temperature
range military, space, or high
reliability applications.
128Kx8
128Kx8
128Kx8
128Kx8
The MCM can be organized
as a 128K x 32 bits, 256K x 16
bits or 512K x 8 bits device and
is input TTL and output CMOS
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
compatible.
The
command
register is written by bringing
WE to a logic low level (VIL),
while CE is low and OE is at
logic high level (VIH). Reading is
accomplished by chip Enable
(CE) and Output Enable (OE)
being logically active, see
Figure 9. Access time grades of
60ns, 70ns, 90ns, 120ns and
150ns maximum are standard.
Pin Description
I/O0-31
Data I/O
A0–16 Address Inputs
WE1-4 Write Enables
CE1-4 Chip Enables
OE Output Enable
VCC Power Supply
GND
Ground
The
ACT–F128K32
is
packaged in a hermetically
NC Not Connected
eroflex Circuit Technology - Advanced Multichip Modules © SCD1667 REV A 4/28/98
General Description, Cont’d,
sealed co-fired ceramic 66 pin, 1.08" sq
PGA or a 68 lead, .88" sq Ceramic Gull
Wing CQFP package for operation over the
temperature range of -55°C to +125°C and
military environment.
second. Erase is accomplished by
executing the erase command sequence.
This will invoke the Embedded Erase
Algorithm which is an internal algorithm
that automatically preprograms the array, (if
it is not already programmed before)
executing the erase operation. During
erase, the device automatically times the
erase pulse widths and verifies proper cell
margin.
Each flash memory die is organized as
128KX8 bits and is designed to be
programmed in-system with the standard
system 5.0V Vcc supply. A 12.0V VPP is
not required for write or erase operations.
The MCM can also be reprogrammed with
standard EPROM programmers (with the
proper socket).
Each die in the module or any individual
sector of the die is typically erased and
verified in 1.3 seconds (if already
completely preprogrammed).
The standard ACT-F128K32 offers
access times between 60ns and 150ns,
Each die also features a sector erase
architecture. The sector mode allows for
allowing
operation
of
high-speed
microprocessors without wait states. To 16K byte blocks of memory to be erased
eliminate bus contention, the device has
separate chip enable (CE) and write enable
(WE). The ACT-F128K32 is command set
compatible with JEDEC standard 1 Mbit
EEPROMs. Commands are written to the
and reprogrammed without affecting other
blocks. The ACT-F128K32 is erased when
shipped from the factory.
The device features single 5.0V power
supply operation for both read and write
command
register
using
standard
functions.
lnternally
generated
and
microprocessor write timings. Register
contents serve as input to an internal
state-machine which controls the erase and
programming circuitry. Write cycles also
internally latch addresses and data needed
for the programming and erase operations.
regulated voltages are provided for the
program and erase operations. A low VCC
detector
automatically
inhibits
write
operations on the loss of power. The end of
program or erase is detected by Data
Polling of D7 or by the Toggle Bit feature on
D6. Once the end of a program or erase
cycle has been completed,-+ the device
internally resets to the read mode.
Reading data out of the device is similar
to reading from 12.0V Flash or EPROM
devices. The ACT-F128K32 is programmed
by executing the program command
sequence. This will invoke the Embedded
Program Algorithm which is an internal
algorithm that automatically times the
program pulse widths and verifies proper
cell margin. Typically, each sector can be
programmed and verified in less than 0.3
All bits of each die, or all bits within a
sector of
a
die, are erased via
Fowler-Nordhiem tunneling. Bytes are
programmed one byte at a time by hot
electron injection.
DESC Standard Military Drawing (SMD)
numbers are released.
2
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
z
Absolute Maximum Ratings
Parameter
Symbol
TC
Range
-55 to +125
-65 to +150
-2.0 to +7.0
-2.0 to +7.0
300
Units
°C
Case Operating Temperature
Storage Temperature Range
Supply Voltage Range
TSTG
VCC
°C
V
VG
V
Signal Voltage Range (Any Pin Except A9) Note 1
Maximum Lead Temperature (10 seconds)
Data Retention
°C
10
Years
100,000 Minimum
-2.0 to +14.0
Endurance (Write/Erase cycles)
A9 Voltage for sector protect, Note 2
VID
V
Note 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may undershoot VSS to -2.0v for periods of up
to 20ns. Maximum DC voltage on input and I/O pins is VCC + 0.5V. During voltage transitions, inputs and I/O pins may overshoot to
VCC + 2.0V for periods up to 20 ns.
Note 2. Minimum DC input voltage on A9 is -0.5V. During voltage transitions, A9 may undershoot VSS to -2.0V for periods of up to 20ns.
Maximum DC input voltage on A9 is +12.5V which may overshoot to 14.0V for periods up to 20ns.
Normal Operating Conditions
Symbol Parameter
Minimum
+4.5
Maximum
Units
V
VCC
VIH
VIL
TC
+5.5
Power Supply Voltage
Input High Voltage
+2.0
V
+ 0.5
V
CC
+0.8
-0.5
V
Input Low Voltage
-55
+125
12.5
°C
V
Operating Temperature (Military)
A9 Voltage for sector protect
VID
11.5
Capacitance
(VIN= 0V, f = 1MHz, TC = 25°C)
Symbol Parameter
Maximum
Units
CAD
50
50
pF
pF
A0 – A16 Capacitance
OE Capacitance
COE
CWE
Write Enable Capacitance
CQFP(F5) Package
20
20
20
20
pF
pF
pF
pF
PGA(P3,P7) Package
Chip Enable Capacitance
I/O0 – I/O31 Capacitance
CCE
CI/O
Parameters Guaranteed but not tested
DC Characteristics – CMOS Compatible
(Vcc = 5.0V, Vss = 0V, TC = -55°C to +125°C, unless otherwise indicated)
Speeds 60, 70, 90, 120 & 150ns
Parameter
Sym
Conditions
Minimum
Maximum
10
Units
µA
µA
mA
mA
mA
mA
V
ILI
Input Leakage Current
VCC = 5.5V, ViN = GND to VCC
VCC = 5.5V, ViN = GND to VCC
CE = VIL, OE = VIH, f = 5MHz
CE = VIL, OE = VIH
ILOX32
ICC1
ICC2
ICC3
ICC4
VOL
10
Output Leakage Current
140
Active Operating Supply Current for Read (1)
Active Operating Supply Current for Program or Erase(2)
Standby Supply Current
200
6.5
VCC = 5.5V, CE = VIH, f = 5MHz
VCC = 5.5V, CE = VIH
0.6
Static Supply Current (4)
0.45
Output Low Voltage
IOL = +8.0 mA, VCC = 4.5V
IOH = –2.5 mA, VCC = 4.5V
IOH = –100 µA, VCC = 4.5V
VOH1
VOH2
VLKO
0.85 x VCC
VCC – 0.4
3.2
V
Output High Voltage
V
Output High Voltage (4)
V
Low Power Supply Lock-Out Voltage (4)
Note 1. The Icc current listed includes both the DC operating current and the frequency dependent component (At 5 MHz). The frequency
component typically is less than 2 mA/MHz, with OE at VIN.
Note 2. Icc active while Embedded Algorithm (Program or Erase) is in progress.
Note 3. DC Test conditions: VIL = 0.3V, VIH = VCC - 0.3V, unless otherwise indicated
Note 4. Parameter Guaranteed but not tested.
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Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Characteristics – Read Only Operations
(Vcc = 5.0V, Vss = 0V, TC = -55°C to +125°C)
Symbol –60
JEDEC Stand’d Min Max Min Max Min Max Min Max
–70
–90
–120
–150
Min Max
150
Parameter
Units
tAVAV
tAVQV
tELQV
tGLQV
tEHQZ
tGHQZ
tAXQX
tRC
tACC
tCE
60
70
90
120
ns
ns
ns
ns
ns
ns
ns
Read Cycle Time
60
60
30
20
20
70
70
35
20
20
90
90
40
25
25
120
120
50
150
Address Access Time
150
Chip Enable Access Time
tOE
tDF
55
Output Enable to Output Valid
30
35
Chip Enable to Output High Z (1)
Output Enable High to Output High Z (1)
Output Hold from Address, CE or OE Change, whichever is first
Note 1. Guaranteed by design, but not tested
tDF
30
35
tOH
0
0
0
0
0
AC Characteristics – Write/Erase/Program Operations, WE Controlled
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Symbol –60
–70
–90
–120
–150
Parameter
Units
JEDEC Stand’d Min Max Min Max Min Max Min Max Min Max
tAVAC
tELWL
tWLWH
tAVWL
tWC
tCE
60
0
70
0
90
0
120
0
150
0
ns
ns
Write Cycle Time
Chip Enable Setup Time
Write Enable Pulse Width
Address Setup Time
tWP
tAS
30
0
35
0
45
0
50
0
50
0
ns
ns
tDVWH
tWHDX
tWLAX
tDS
30
0
30
0
45
0
50
0
50
0
ns
Data Setup Time
tDH
tAH
tCH
tWPH
ns
Data Hold Time
45
0
45
0
45
0
50
0
50
0
ns
Address Hold Time
tWHEH
tWHWL
tWHWH1
tWHWH2
tWHWH3
ns
Chip Enable Hold Time (1)
Write Enable Pulse Width High
Duration of Byte Programming Operation
Sector Erase Time
20
20
20
20
20
ns
14 TYP 14 TYP 14 TYP 14 TYP 14 TYP
µs
60
60
60
60
60
Sec
Sec
µs
120
120
120
120
120
Chip Erase Time
tGHWL
0
0
0
0
0
Read Recovery Time before Write (1)
Vcc Setup Time (1)
tVCE
50
50
50
50
50
µs
12.5
12.5
12.5
12.5
12.5
Sec
ns
Chip Programming Time
Output Enable Setup Time (1)
Output Enable Hold Time (1)
Note 1. Guaranteed by design, but not tested
tOES
tOEH
0
0
0
0
0
10
10
10
10
10
ns
AC Characteristics – Write/Erase/Program Operations, CE Controlled
(Vcc = 5.0V, Vss = 0V, TC = -55°C to +125°C)
Symbol –60
JEDEC Stand’d Min Max Min Max Min Max Min Max Min Max
–70
–90
–120
–150
Parameter
Units
tAVAC
tWLEL
tELEH
tWC
tWS
tCP
60
0
70
0
90
0
120
0
150
0
ns
ns
Write Cycle Time
Write Enable Setup Time
Chip Enable Pulse Width
Address Setup Time
35
0
35
0
45
0
50
0
55
0
ns
tAVEL
tAS
ns
tDVEH
tDS
30
0
30
0
45
0
50
0
55
0
ns
Data Setup Time
tEHDX
tDH
tAH
tWH
tCPH
ns
Data Hold Time
tELAX
45
0
45
0
45
0
50
0
55
0
ns
Address Hold Time
tEHWH
tEHEL
ns
Write Enable Hold Time (1)
Write Select Pulse Width High
Duration of Byte Programming
Sector Erase Time
20
20
20
20
20
ns
tWHWH1
tWHWH2
tWHWH3
14 TYP 14 TYP 14 TYP 14 TYP 14 TYP
µs
60
60
60
60
60
Sec
Sec
ns
120
120
120
120
120
Chip Erase Time
tGHEL
0
0
0
0
0
Read Recovery Time (1)
Chip Programming Time
Note 1. Guaranteed by design, but not tested
12.5
12.5
12.5
12.5
12.5
Sec
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Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
current consumed is typically less than 400 µA; and a
TTL standby mode (CE is held VIH) is approximately 1
mA. In the standby mode the outputs are in a high
impedance state, independent of the OE input.
Device Operation
The ACT-F128K32 MCM is composed of four, one
megabit flash EEPROMs. The following description is for
the individual flash EEPROM device, is applicable to
each of the four memory chips inside the MCM. Chip 1 is
distinguished by CE1 and I/O1-7, Chip 2 by CE2 and
I/08-15, Chip 3 by CE3 and I/016-23, and Chip 4 by CE4 and
I/024-31.
If the device is deselected during erasure or
programming, the device will draw active current until the
operation is completed.
WRITE
Programming of the ACT-F128K32 is accomplished by
executing the program command sequence.
The
Device erasure and programming are accomplished via
the command register. The contents of the register serve
as input to the internal state machine. The state machine
outputs dictate the function of the device.
program algorithm, which is an internal algorithm,
automatically times the program pulse widths and verifies
proper cell status. Sectors can be programed and
verified in less than 0.3 second. Erase is accomplished
by executing the erase command sequence. The erase
algorithm, which is internal, automatically preprograms
the array if it is not already programed before executing
The command register itself does not occupy an
addressable memory location. The register is a latch
used to store the command, along with address and data
information needed to execute the command. The
command register is written by bringing WE to a logic low
level (VIL), while CE is low and OE is at VIH. Addresses
are latched on the falling edge of WE or CE, whichever
happens later. Data is latched on the rising edge of the
the erase operation.
During erase, the device
automatically times the erase pulse widths and verifies
proper cell status. The entire memory is typically erased
and verified in 3 seconds (if pre-programmed). The
sector mode allows for 16K byte blocks of memory to be
erased and reprogrammed without affecting other blocks.
WE or CE whichever occurs first.
Standard
microprocessor write timings are used. Refer to AC
Program Characteristics and Waveforms, Figures 3,
8 and 13.
Bus Operation
READ
Command Definitions
The ACT-F128K32 has two control functions, both of
which must be logically active, to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output-Enable (OE)
is the output control and should be used to gate data to
the output pins of the chip selected. Figure 7 illustrates
AC read timing waveforms.
Device operations are selected by writing specific
address and data sequences into the command register.
Table 3 defines these register command sequences.
READ/RESET COMMAND
The read or reset operation is initiated by writing the
read/reset command sequence into the command
register. Microprocessor read cycles retrieve array data
from the memory. The device remains enabled for reads
until the command register contents are altered.
OUTPUT DISABLE
With Output-Enable at a logic high level (VIH), output from
the device is disabled. Output pins are placed in a high
impedance state.
The device will automatically power-up in the read/reset
state. In this case, a command sequence is not required
to read data. Standard microprocessor read cycles will
STANDBY MODE
The ACT-F128K32 has two standby modes, a CMOS
standby mode (CE input held at Vcc + 0.5V), where the
retrieve array data.
power-up in the read/reset state. In this case, a command
sequence is not required to read data. Standard
The device will automatically
Microprocessor read cycles will retrieve array data. This
Table 1 – Bus Operations
Table 2 – Sector Addresses Table
Operation
READ
CE OE WE A0 A1 A9
I/O
A16 A15 A14
Address Range
00000h – 03FFFh
04000h – 07FFFh
08000h – 0BFFFh
0C000h – 0FFFFh
10000h – 13FFFh
14000h – 17FFFh
18000h – 1BFFFh
1C000h – 1FFFFh
L
H
L
L
X
H
H
H
X
H
L
A0 A1 A9 DOUT
SA0
SA1
SA2
SA3
SA4
SA5
SA6
SA7
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
X
X
X
X
X
X
HIGH Z
HIGH Z
DIN
STANDBY
OUTPUT DISABLE
WRITE
L
A0 A1 A9
ENABLE SECTOR
PROTECT
L
L
VID
L
L
X
L
X
H
VID
X
VERIFY SECTOR
PROTECT
H
VID Code
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Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Table 3 — Commands Definitions
Bus
Write
Fourth Bus
Read/Write
First Bus Write Second Bus Write Third Bus Write
Cycle Cycle Cycle
Fifth Bus Write Sixth Bus Write
Cycle Cycle
Command
Sequence
Cycle
Cycle
Req’d Addr
Data
AAH
AAH
AAH
AAH
Addr
Data
55H
55H
55H
55H
Addr
Data
F0H
A0H
80H
80H
Addr
Data
RD
Addr
Data
Addr
Data
Read/Reset
Byte Program
Chip Erase
4
6
6
6
5555H
5555H
5555H
5555H
2AAAH
2AAAH
2AAAH
2AAAH
5555H
5555H
5555H
5555H
RA
PA
PD
5555H
5555H
AAH
AAH
2AAAH 55H
2AAAH 55H
5555H 10H
SA 30H
Sector Erase
NOTES:
1. Address bit A15 = X = Don't Care. Write Sequences may be initiated with A15 in either state.
2. Address bit A16 = X = Don't Care for all address commands except for Program Address (PA) and Sector Address (SA).
3. RA = Address of the memory location to be read
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of the WE pulse.
SA = Address of the sector to be erased. The combination of A16, A15, A14 will uniquely select any sector.
4. RD = Data read from location RA during read Operation.
PD = Data to be programmed at location PA. Data is latched on the rising edge of WE.
default value ensures that no spurious alteration of the
memory content occurs during the power transition.
CHIP ERASE
Chip erase is a six bus cycle operation. There are two
'unlock' write cycles. These are followed by writing the
“set-up” command. Two more “unlock” write cycles are
then followed by the chip erase command.
Refer to the AC Read Characteristics and Figure 7 for the
specific timing parameters.
BYTE PROGRAMING
Chip erase does not require the user to program the
device prior to erase. Upon executing the Embedded
Erase Algorithm command sequence (Figure 4) the
device will automatically program and verify the entire
memory for an all zero data pattem prior to electrical
erase. The erase is performed concurrently on all sectors
at the same time . The system is not required to provide
any controls or timings during these operations. Note:
Post Erase data state is all "1"s.
The device is programmed on a byte-byte basis.
Programming is a four bus cycle operation. There are
two "unlock" write cycles. These are followed by the
program set-up command and data write cycles.
Addresses are latched on the falling edge of CE or WE,
whichever occurs later, while the data is latched on the
rising edge of CE or WE whichever occurs first. The
rising edge of CE or WE (whichever happens first) begins
programming using the Embedded Program Algorithm.
Upon executing the program algorithm command
sequence the system is not required to provide further
controls or timings. The device will automatically provide
adequate internally generated program pulses and verify
the programmed cell.
The automatic erase begins on the rising edge of the last
WE pulse in the command sequence and terminates
when the data on D7 is "1" (see Write Operation Status
section - Table 3) at which time the device retums to read
mode. See Figures 4 and 9.
The automatic programming operation is completed
when the data on D7 (also used as Data Polling) is
equivalent to data written to this bit at which time the
device returns to the read mode and addresses are no
longer latched. Therefore, the device requires that a valid
address be supplied by the system at this particular
instance of time for Data Polling operations. Data Polling
must be performed at the memory location which is being
programmed.
SECTOR ERASE
Sector erase is a six bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"setup" command. Two more "unlock" write cycles are
then followed by the sector erase command. The sector
address (any address location within the desired sector)
is latched on the falling edge of WE, while the command
(30H) is latched on the rising edge of WE. After a
time-out of 80µs from the rising edge of the last sector
erase command, the sector erase operation will begin.
Any commands written to the chip during the Embedded
Program Algorithm will be ignored.
Multiple sectors may be erased concurrently by writing
the six bus cycle operations as described above. This
sequence is followed with writes of the sector erase
command to addresses in other sectors desired to be
concurrently erased. The time between writes must be
less than 80µs otherwise that command will not be
accepted and erasure will start. It is recommended that
processor interrupts be disabled during this time to
Programming is allowed in any sequence and across
sector boundaries. Beware that a data "0" cannot be
programmed back to a “1". Attempting to do so may
cause the device to exceed programming time limits (D5
= 1) or result in an apparent success, according to the
data polling algorithm, but a read from reset/read mode
will show that the data is still “0". Only erase operations
can convert “0"s to “1"s.
guarantee this condition.
The interrupts can be
Figure 3 illustrates the programming algorithm using
typical command strings and bus operations.
re-enabled after the last Sector Erase command is
written. A time-out of 80µs from the rising edge of the
last WE will initiate the execution of the Sector Erase
command(s). If another falling edge of the WE occurs
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Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
within the 80µs time-out window the timer is reset.
(Monitor D3 to determine if the sector erase timer window
is still open, see section D3, Sector Erase Timer.) Any
commarid other than Sector Erase during this period will
reset the device to read mode, ignoring the previous
command string. In that case, restart the erase on those
sectors and allow them to complete.
LOGICAL INHIBIT
Writing is inhibited by holding anyone of OE = VIL, CE =
VIH or WE = VIH. To initiate a write cycle CE and WE
must be logical zero while OE is a logical one.
POWER-UP WRITE INHIBIT
Loading the sector erase buffer may be done in any
sequence and with any number of sectors (0 to 7).
Power-up of the device with WE = CE = VIL and OE = VIH
will not accept commands on the rising edge of WE. The
internal state machine is automatically reset to the read
mode on power-up.
Sector erase does not require the user to program the
device prior to erase. The device automatically programs
all memory locations in the sector(s) to be erased prior to
electrical erase. When erasing a sector or sectors the
remaining unselected sectors are not affected. The
system is not required to provide any controls or timings
during these operations. Post Erase data state is all "1"s.
Write Operation Status
D7
DATA POLLING
The ACT-F128K32 features Data Polling as a method to
indicate to the host that the internal algorithms are in
progress or completed.
The automatic sector erase begins after the 80µs time
out from the rising edge of the WE pulse for the last
sector erase command pulse and terminates when the
data on D7, Data Polling, is “1" (see Write Operatlon
Status secton) at which time the device returns to read
mode. Data Polling must be performed at an address
within any of the sectors being erased.
During the program algorithm, an attempt to read the
device will produce compliment data of the data last
written to D7. Upon completion of the programming
algorithm an attempt to read the device will produce the
true data last written to D7. Data Polling is valid after the
rising edge of the fourth WE pulse in the four write pulse
sequence.
Figure 4 illustrates the Embedded Erase Algorithm.
Data Protection
The ACT-F128K32 is designed to offer protection against
accidental erasure or programming caused by spurious
system level singles that may exist during power
transitions. During power up the device automatically
resets the internal state machine in the read mode. Also,
with its control register architecture, alteration of the
memory content only occurs after successful completion
of specific multi-bus cycle command sequences.
During the erase algorithm, D7 will be "0" until the erase
operation is completed. Upon completion data at D7 is
"1". For chip erase, the Data Polling is valid after the
rising edge of the sixth WE pulse in the six write pulse
sequence. For sector erase, the Data Polling is Valid
after the last rising edge of the sector erase WE pulse.
The Data Polling feature is only active during the
programming algorithm, erase algorithm, or sector erase
time-out.
The device also incorporates several features to prevent
inadvertent write cycles resulting from Vcc power-up and
power-down transitions or system noise.
See Figures 6 and 10 for the Data Polling specifications.
LOW Vcc WRITE INHIBIT
D6
To avoid initiation of a write cycle during Vcc power-up
and power-down, a write cycle is locked out for VCC less
than 3.2V (typically 3.7V). If VCC < VLKO, the command
register is disabled and all internal program/erase circuits
are disabled. Under this condition the device will reset to
read mode. Subsequent writes will be ignored until the
TOGGLE BIT
The ACT-F128K32 also features the "Toggle Bit" as a
method to indicate to the host system that algorithms are
in progress or completed.
During a program or erase algorithm cycle, successive
attempts to read data from the device will result in D6
toggling between one and zero. Once the program or
erase algorithm cycle is completed, D6 Will stop toggling
and valid data will be read on successive attempts.
During programming the Toggle Bit is valid after the rising
edge of the fourth WE pulse in the four write pulse
sequence. For chip erase the Toggle Bit is valid after the
rising edge of the sixth WE pulse in the six write pulse
sequence. For Sector erase, the Toggle Bit is valid after
the last rising edge of the sector erase WE pulse. The
Toggle Bit is active during the sector time out.
Vcc level is greater than VLKO.
It is the users
responsibility to ensure that the control pins are logically
correct to prevent unintentional writes when Vcc is above
3.2V.
WRITE PULSE GLITCH PROTECTION
Noise pulses of less than 5ns (typical) on OE, CE or WE
will not initiate a write cycle.
See Figure 1 and 5.
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Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Table 4 — Hardware Sequence Flags
Status
D7
D6
D5 D4 D3
D2 – D0
D7 Toggle
0
0
0
1
1
1
0
0
1
0
0
1
0
1
1
0
1
1
Auto-Programming
Programming in Auto Erase
Erase in Auto Erase
Auto-Programming
Programming in Auto Erase
Erase in Auto Erase
In Progress
Reserved for
future use
0
0
Toggle
Toggle
D7 Toggle
T0 Toggle
Reserved for
future use
Exceeding Time Limits
0
Toggle
D5
Sector Protection
Algorithims
EXCEEDED TIMING LIMITS
D5 will indicate if the program or erase time has
exceeded the specified limits. Under these conditions
D5 will produce a "1". The Program or erase cycle was
not successfully completed. Data Polling is the only
operation function of the device under this condition.
The CE circuit will partially power down the device under
these conditions by approximately 8 mA per chip. The
OE and WE pins will control the output disable functions
as shown in Table 1. To reset the device, write the reset
command sequence to the device. This allows the
system to continue to use the other active sectors in the
device.
SECTOR PROTECTION
The ACT-F128K32 features hardware sector protection
which will disable both program and erase operations to
an individual sector or any group of sectors. To activate
this mode, the programming equipment must force VID
on control pin OE and address pin A9. The sector
addresses should be set using higher address lines A16,
A15, and A14. The protection mechanism begins on the
falling edge of the WE pulse and is terminated with the
rising edge of the same.
It is also possible to verify if a sector is protected during
the sector protection operation. This is done by setting
CE = OE = VIL and WE = VIH (A9 remains high at VID).
Reading the device at address location XXX2H, where
the higher order addresses (A16, A15 and A14) define a
particular sector, will produce 01H at data outputs D0 -
D7, for a protected sector.
D4 - HARDWARE SEQUENCE FLAG
If the device has exceeded the specified erase or
program time and D5 is "1", then D4 Will indicate which
step in the algorithm the device exceeded the limits. A
"0" in D4 indicates in programming, a "1" indicates an
erase. (See Table 4)
SECTOR UNPROTECT
D3
The ACT-F128K32 also features a sector unprotect
mode, so that a protected sector may be unprotected to
incorporate any changes in the code. All sectors should
be protected prior to unprotecting any sector.
SECTOR ERASE TIMER
After the completion of the initial sector erase command
sequence the sector erase time-out will begin. D3 will
remain low until the time-out is complete. Data Polling
and Toggle Bit are valid after the initial sector erase
command sequence.
To activate this mode, the programming equipment must
force VID on control pins OE, CE, and address pin A9.
The address pins A6, A7, and A12 should be set to VIH,
and A6 = VIL. The unprotection mechanism begins on
the falling edge of the WE pulse and is terminated with
the rising edge of the same.
If Data Polling or the Toggle Bit indicates the device has
been written with a valid erase command, D3 may be
used to determine if the sector erase timer window is still
open. If D3 is high ("1") the internally controlled erase
cycle has begun; attempts to write subsequent
commands to the device will be ignored until the erase
operation is completed as indicated by Data Polling or
Toggle Bit. If D3 is low ("0"), the device will accept
additional sector erase commands. To ensure the
command has been accepted, the software should check
the status of D3 prior to and following each subsequent
sector erase command. If D3 were high on the second
status check, the command may not have been
accepted.
It is also possible to determine if a sector is unprotected
in the system by writing the autoselect command.
Performing a read operation at address location XXX2H,
where the higher order addresses (A16, A15, and A14)
define a particular sector address, will produce 00H at
data outputs (D0-D7) for an unprotected sector.
8
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 1
AC Waveforms for Toggle Bit During Embedded Algorithm Operations
CE
tOEH
WE
tOES
OE
Data
D0-D7
D6
D0-D7
Valid
D6=Toggle
D6=Toggle
Stop Toggle
tOE
Figure 2
AC Test Circuit
Current Source
IOL
Parameter
Typical
Units
V
Input Pulse Level
0 – 3.0
5
Input Rise and Fall
ns
Input and Output Timing Reference
Output Lead Capacitance
1.5
V
VZ ~ 1.5 V (Bipolar Supply)
To Device Under Test
50
pF
CL =
50 pF
IOH
Current Source
Notes:
1) VZ is programmable from -2V to +7V. 2) IOL and IOH programmable from 0 to 16 mA. 3) Tester Impedance
ZO = 75Ω. 4) VZ is typically the midpoint of VOH and VOL. 5) IOL and IOH are adjusted to simulate a typical
resistance load circuit. 6) ATE Tester includes jig capacitance.
9
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 3
Programming Algorithm
Bus
Operations
Command
Sequence
Comments
Standby
Write
Program
Valid Address/Data Sequence
Read
Data Polling to Verify Programming
Compare Data Output to Data Expected
Standby
Start
Write Program Command Sequence
(See Below)
Data Poll Device
No
Increment
Address
Last Address
?
Yes
Programming Complete
Program Command Sequence (Address/Command):
5555H/AAH
2AAAH/55H
5555H/A0H
Programming Address/Program Data
10
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 4
Erase Algorithm
Bus
Operations
Command
Sequence
Comments
Standby
Write
Erase
Read
Data Polling to Verify Erasure
Compare Output to FFH
Standby
Start
Write Erase Command Sequence
(See Below)
Data Poll or Toggle Bit
Successfully Completed
Erasure Completed
Chip Erase Command Sequence
Individual Sector/Multiple Sector
Erase Command Sequence
(Address/Command)
(Address/Command)
5555H/AAH
5555H/AAH
2AAAH/55H
5555H/80H
5555H/AAH
2AAAH/55H
5555H/10H
2AAAH/55H
5555H/80H
5555H/AAH
2AAAH/55H
Sector Address/30H
Sector Address/30H
Sector Address/30H
Additional Sector
Erase Commands
are Optional
Note 1. To Ensure the command has been accepted, the system software should check the
status of D3 prior to and following each subsequent sector erase command. If D3 were high on
the second status check, the command may not have been accepted.
11
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 5
Figure 6
Toggle Bit Algorithm
Data Polling Algorithm
Start
Start
VA = Byte Address for Programming
VA = Byte Address for Programming
= Any of the Sector Addresses
within the sector being erased
during sector erase operation
= Any of the Sector Addresses
within the sector being erased
during sector erase operation
Read Byte
D0-D7
Address = VA
Read Byte
D0-D7
Address = VA
= XXXXH during Chip Erase
= XXXXH during Chip Erase
Yes
No
D7 = Data
?
D6 = Toggle
?
No
Yes
No
No
D5 = 1
?
D5 = 1
?
Yes
Yes
Read Byte
D0-D7
Address = VA
Read Byte
D0-D7
Address = VA
D6 =
Toggle?
(Note 1)
D7 =
Toggle?
(Note 1)
Yes
No
Pass
Pass
No
Yes
Fail
Fail
Note 1. D6 is rechecked even if D5 = "1" because D6 may stop toggling at
the same time as D5 changes to "1".
Note 1. D7 is rechecked even if D5 = "1" because D7 may change
simultaneously with D5.
12
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 7
AC Waveforms for Read Operations
tRC
Addresses
CE
Addresses Stable
tACC
tDF
OE
tOE
WE
tCE
tOH
High Z
High Z
Outputs
Output Valid
Figure 8
Write/Erase/Program
Operation, WE Controlled
Data Polling
Addresses
5555H
PA
PA
tRC
tWC
tAH
tAS
CE
OE
tGHWL
tWP
tWHWH1
tWPH
WE
tCE
tDF
tOE
tDH
AOH
PD
D7
DOUT
Data
5.0V
tDS
tOH
tCE
Notes:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the 0utput of the complement of the data written to the deviced.
4. Dout is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
13
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 9
AC Waveforms Chip/Sector
Erase Operations
Data Polling
5555H
tAH
5555H
2AAAH
5555H
2AAAH
SA
Addresses
tAS
CE
OE
WE
tGHWL
tWP
tWPH
tDH
tCE
AAH
55H
80H
AAH
55H
10H/30H
Data
VCC
tDS
tVCE
Notes:
1. SA is the sector address for sector erase.
Figure 10
AC Waveforms for Data Polling
During Embedded Algorithm Operations
tCH
CE
tDF
tOE
OE
tOEH
tCE
WE
tOH
*
High Z
D7=
D7
D7
Valid Data
tWHWH1 or 2
D0–D6
Valid Data
D0-D6
D0–D6=Invalid
tOE
* D7=Valid Data (The device has completed the Embedded operation).
14
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 11
Sector Protection Algorithm
Start
Set Up Sector Address
(A16, A15, A14)
PLSCNT = 1
OE = VID
A9 = VID, CE = VIL
Activate WE Pulse
Time Out 100µs
Increment
PLSCNT
Power Down OE
WE = VIH
CE = OE = VIH
A9 Should Remain VID
Read From Sector
Address = SA, A0 = 0, A1 = 1, A6 = 0
No
No
Data = 01H
PLSCNT = 25
?
?
Yes
Yes
Device Failure
Protect
Yes
Another
Sector?
No
Remove VID from A9
Write Reset Command
Sector Protection
Complete
15
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 12
Sector Unprotect Algorithm
Start
Set VCC = 5.0 V
Protect All Sectors
PLSCNT = 1
Set Up Sector Address
Unprotected Mode
(A12 = A7 = VIH, A6 = VIL)
Set VCC = 5.0 V
Set
OE = CE = A9 = VID
Activate WE Pulse
Time Out 10ms
Increment
PLSCNT
Set OE = CE = VIL
Remove VID from A9
Set VCC = 4.25 V
Write Autoselect
Command Sequence
Setup Sector Address SA0
Set A1 = 1, A0 = 0
Read Data
From Device
No
Increment
No
Write Reset
Command
Data = 00H
?
PLSCNT = 1000
?
Sector Address
Yes
Yes
Device Failure
Sector
No
Address = SA7
?
Yes
Set VCC = 5.0 V
Notes:
SA0 = Sector Address for initial sector
SA7 = Sector Address for last sector
Please refer to Table 2
Write Reset Command
Sector Unprotect
Completed
16
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Figure 13
Write/Erase/Program Operation, CE Controlled
Data Polling
5555H
PA
PA
Addresses
tWC
tAS
tAH
WE
OE
tGHEL
tCP
tWHWH1
CE
tCPH
tDH
tWS
AOH
PD
D7
DOUT
Data
5.0V
tDS
Notes:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the 0utput of the complement of the data written to the device.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
17
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Pin Numbers & Functions
66 Pins — PGA
Pin#
1
Function
I/O8
I/O9
I/O10
A14
Pin#
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Function
A15
Pin#
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
Function
I/O25
I/O26
A7
Pin#
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
Function
WE3
CE3
2
Vcc
3
CE1
NC
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
4
A12
5
A16
I/O3
NC
6
A11
I/O15
I/O14
I/O13
I/O12
OE
A13
7
A0
A8
8
NC
I/O16
I/O17
I/O18
VCC
9
I/O0
I/O1
I/O2
WE2
CE2
GND
I/O11
A10
10
11
12
13
14
15
16
17
A2
NC
A3
WE1
I/O7
CE4
WE4
I/O27
A4
I/O23
I/O22
I/O21
I/O20
I/O6
I/O5
I/O4
A5
A9
I/O24
A6
"P3" — 1.08" SQ PGA Type (without shoulder) Package
"P7" — 1.08" SQ PGA Type (with shoulder) Package
Bottom View (P7 & P3)
Side View
(P7)
Side View
(P3)
1.085 SQ
MAX
.185
1.000
MAX
Pin 1
.600
.025
.035
Pin 56
.050
.100
1.030
1.040
1.030
1.040
.100
1.000
.020
.016
.020
.016
Pin 66
Pin 11
.180
TYP
.100
.180
TYP
.160
MAX
All dimensions in inches
18
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
Pin Numbers & Functions
68 Pins — CQFP Package
Pin#
1
Function
GND
CE3
A5
Pin#
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Function
GND
I/O8
Pin#
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
Function
OE
Pin#
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Function
GND
I/O23
I/O22
I/O21
I/O20
I/O19
I/O18
I/O17
I/O16
VCC
2
CE2
3
I/O9
NC
4
A4
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
VCC
WE2
WE3
WE4
NC
5
A3
6
A2
7
A1
8
A0
NC
9
NC
NC
10
11
12
13
14
15
16
17
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
I/O31
I/O30
I/O29
I/O28
I/O27
I/O26
I/O25
I/O24
A11
A10
A12
A9
A13
A8
A14
A7
A15
A6
A16
WE1
CE4
CE1
"F5" — Single-Cavity CQFP
Top View
Side View
0.990 SQ
±.010
0.880 SQ
0.160
MAX
±.010
Pin 9
Pin 61
Pin 10
Pin 60
0.010
REF
0.015
±.010
0.946
±.010
.010 R
3°-3°
0.040
0.010
±.005
Detail “A”
0.050
TYP
Pin 26
Pin 27
Pin 44
Pin 43
See Detail “A”
0.800 REF
All dimensions in inches
19
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
C I R C U I T T E C H N O L O G Y
Ordering Information
Model Number
DESC Drawing Number
5962-9471605HZX*
5962-9471604HZC
5962-9471603HZC
5962–9471602HZC
5962–9471601HZC
5962-9471605H8X*
5962-9471604H8C
5962-9471603H8C
5962–9471602H8C
5962–9471601H8C
5962-9471605HNX*
5962-9471604HNC
5962-9471603HNC
5962–9471602HNC
5962–9471601HNC
Speed
Package
PGA
ACT–F128K32N–060P3Q
ACT–F128K32N–070P3Q
ACT–F128K32N–090P3Q
ACT–F128K32N–120P3Q
ACT–F128K32N–150P3Q
ACT–F128K32N–060P7Q
ACT–F128K32N–070P7Q
ACT–F128K32N–090P7Q
ACT–F128K32N–120P7Q
ACT–F128K32N–150P7Q
ACT–F128K32N–060F5Q
ACT–F128K32N–070F5Q
ACT–F128K32N–090F5Q
ACT–F128K32N–120F5Q
ACT–F128K32N–150F5Q
* Pending
60 ns
70 ns
90 ns
120 ns
150 ns
60 ns
70 ns
90 ns
120 ns
150 ns
60 ns
70 ns
90 ns
120 ns
150 ns
PGA
PGA
PGA
PGA
PGA
PGA
PGA
PGA
PGA
CQFP
CQFP
CQFP
CQFP
CQFP
Part Number Breakdown
ACT– F 128K 32 N– 060 F5 Q
Aeroflex Circuit
Technology
Screening
Memory Type
C = Commercial Temp, 0°C to +70°C
I = Industrial Temp, -40°C to +85°C
T = Military Temp, -55°C to +125°C
M = Military Temp, -55°C to +125°C, Screened *
Q = MIL-STD-883 Compliant/SMD if applicable
F = FLASH EEPROM
Memory Depth
Memory Width, Bits
Package Type & Size
Options
Surface Mount Packages
F5 = .88"SQ 68 Lead
Single-Cavity CQFP
Thru-Hole Packages
P3 = 1.075"SQ PGA 66 Pins W/O Shoulder
P7 = 1.075"SQ PGA 66 Pins With Shoulder
N = None
Memory Speed, ns
*
Screened to the individual test methods of MIL-STD-883
Specification subject to change without notice
Aeroflex Circuit Technology
Telephone: (516) 694-6700
FAX: (516) 694-6715
Toll Free Inquiries: 1-(800) 843-1553
35 South Service Road
Plainview New York 11830
20
Aeroflex Circuit Technology
SCD1667 REV A 4/28/97 Plainview NY (516) 694-6700
相关型号:
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