UT63M147CPA [AEROFLEX]
MIL-STD-1553A/B Bus Transceiver; MIL -STD - 1553A / B总线收发器
| 型号： | UT63M147CPA |
| 厂家： | 
AEROFLEX CIRCUIT TECHNOLOGY |
| 描述： | MIL-STD-1553A/B Bus Transceiver |
| 文件： | 总20页 (文件大小：567K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Standard Products
UT63M147 MIL-STD-1553A/B Bus
Transceiver
Data Sheet
May 2006
FEATURES
INTRODUCTION
5-volt only operation (+10%)
The monolithic UT63M147 Transceivers are complete
transmitter and receiver pairs for MIL-STD-1553A and 1553B
applications. Encoder and decoder interfaces are idle low.
Fit and functionally compatible to industry standard
transceiver
The receiver section of the UT63M147 series accepts biphase-
modulated Manchester II bipolar data from a MIL-STD-1553
data bus and produces TTL-level signal data at its RXOUT and
RXOUT outputs. An external RXEN input enables or disables
the receiver outputs.
Idle low transmitter inputs and receiver outputs
Dual-channel 50-mil center 24-lead Flatpack
Dual-channel 100-mil center 36-pin DIP
Full military operating temperature range, -55°C to +125°C,
screened to QML Q or QML V requirements
Radiation hardened to 1.0E6 rads(Si)
Supports MIL-STD-1553 (UT63M147)
RXEN
Standard Microcircuit Drawing (SMD) 5962-93226 available
RXOUT
FILTER
RXIN
FILTER
TO DECODER
and
LIMITER
RXIN
RXOUT
TXIN
THRESHOLD
REFERENCE
DRIVERS
TXOUT
TXOUT
COMPARE
TXIN
TXIHB
Figure 1. Functional Block Diagram
1
The transmitter section accepts biphase TTL-level signal data
at its TXIN and TXIN and produces MIL-STD-1553 data
signals. The transmitter’s output voltage is typically
The UT63M14x series offers complete transmitter and receiver
pairs packaged in a dual-channel 36-pin DIP or 24-lead flatpack
configurations designed for use in any MIL-STD-1553
application.
12 V
. Activating the TXIHB input or setting both data
PP, L-L
inputs to the same logic level disables the transmitter outputs.
Legend for TYPE field:
TI
=
=
=
=
TTL input
TTL output
Differential output
Differential input
TO
DO
DI
DIO = Differential input/output
( )
[ ]
=
=
Channel designator
24-lead flatpack
TRANSMITTER
NAME
PIN
TYPE
DESCRIPTION
NUMBER
1
1 [1]
10 [7]
2 [2]
DO
[DIO]
Transmitter outputs: TXOUT and TXOUT are differential data
signals.
TXOUT
(A)
DO
[DIO]
TXOUT
(B)
1
DO
[DIO]
TXOUT is the half-cycle complement of TXOUT.
Transmitter inhibit: This is an active high input signal.
TXOUT
(A)
11 [8]
34 [22]
DO
[DIO]
TXOUT
(B)
TXIHB
(A)
TI
TXIHB
(B)
25 [16]
35 [23]
TI
TI
TXIN
(A)
Transmitter input: TXIN and TXIN are complementary TTL-
level Manchester II encoder inputs.
TXIN
(B)
26 [17]
36 [24]
TI
TI
TXIN
(A)
TXIN is the complement of TXIN input.
TXIN
(B)
27 [18]
TI
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
Appendix 2 - 2
RECEIVER
NAME
PIN
TYPE
DESCRIPTION
NUMBER
RXOUT
(A)
5 [4]
TO
Receiver outputs: RXOUT and RXOUT are complementary
Manchester II decoder outputs.
RXOUT
(B)
14 [10]
8 [6]
TO
TO
RXOUT
(A)
RXOUT is the complement of RXOUT output.
RXOUT
(B)
17 [12]
6 [5]
TO
TI
RXEN
(A)
Receiver enable/disable: This is an active high input signal.
RXEN
(B)
15 [11]
29 [1]
TI
1
DI
[DIO]
Receiver input: RXIN and RXIN are biphase-modulated
Manchester II bipolar inputs from MIL-STD-1553 data bus.
RXIN
(A)
20 [7]
30 [2]
21 [8]
DI
[DIO]
RXIN
(B)
1
DI
[DIO]
RXIN is the half-cycle complement of RXIN input.
RXIN
(A)
DI
[DIO]
RXIN
(B)
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
POWER AND GROUND
NAME
PIN
TYPE
DESCRIPTION
NUMBER
V
(A)
33 [20]
24 [14]
PWR
+5 V power (±10%)
DC
CC
Recommended decoupling capacitors:
47µF (tantalum), 0.1µF (ceramic) and 0.01µF (ceramic)
PWR
GND
GND
V
(B)
CC
GND
(A)
3, 7, 31
[3,19,21]
Ground reference
GND
(B)
12, 16, 22
[9,13,15]
Appendix 2 - 3
1
2
3
36
35
34
33
32
TXIN
TXIN
TXIHB
VCC
TXOUT
TXOUT
GND
4
5
NC
CHANNEL A
NC
RXOUT
RXEN
GND
6
7
8
9
31
30
29
28
GND
RXIN
RXIN
NC
RXOUT
NC
10
27
26
25
24
23
22
21
20
19
TXOUT
TXOUT
GND
TXIN
TXIN
TXIHB
VCC
11
12
13
14
15
NC
CHANNEL B
RXOUT
RXEN
GND
NC
GND
RXIN
RXIN
NC
16
17
18
RXOUT
NC
Figure 2a. Functional Pin Diagram -- Dual Channel (36)
1
2
3
24
23
22
21
20
CHA
TXIN
CHA
TXIN
TXIHB
GND
VCC
GND
CHANNEL A
4
5
RXOUT
RXEN
6
19
GND
RXOUT
7
18
17
16
15
14
CHB
CHB
GND
TXIN
8
TXIN
9
TXIHB
CHANNEL B
10
11
12
RXOUT
RXEN
GND
VCC
13
RXOUT
GND
1
Figure 2b. Functional Pin Diagram -- Dual Channel (24)
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
Appendix 2 - 4
TRANSMITTER
TXIN
TXIN
BOTH HIGH
OR
BOTH LOW
The transmitter section accepts Manchester II biphase TTL data
and converts this data into differential phase-modulated current
drive. Transmitter current drivers are coupled to a MIL-STD-
1553 data bus via a transformer driven from the TXOUT and
TXOUT terminals. Transmitter output terminals’ non-
transmitting state is enabled by asserting TXIHB (logic “1”), or
by placing both TXIN and TXIN at the same logic level. Table
1, Transmit Operating Mode, lists the functions for the output
data in reference to the state of TXIHB. Figure 3 shows typical
transmitter waveforms.
TXIHB
LINE-TO-LINE
DIFFERENTIAL
OUTPUT
90%
10%
TXOUT, TXOUT
RECEIVER
The receiver section accepts biphase differential data from a
MIL-STD-1553 data bus at its RXIN and RXIN inputs. The
receiver converts input data to biphase Manchester II TTL
formatandisavailablefordecodingattheRXOUTandRXOUT
terminals. The outputs RXOUT and RXOUT represent positive
and negative excursions (respectively) of the inputs RXIN and
RXIN. Figure 4 shows typical receiver output waveforms.
TXIN
TXIN
tTXDD
Table 1. Transmit Operating Mode
TXIN
TXIN
TXIHB
TXOUT
2
1
x
1
Off
x
3
Figure 3. Typical Transmitter
Wave
Off
0
0
1
1
0
1
0
1
x
0
0
x
On
On
LINE-TO-LINE
DIFFERENTIAL
INPUT
3
Off
Notes:
1. x = Don’t care.
2. Transmitter output terminals are in the non-transmitting mode during
Off-time.
3. Transmitter output terminals are in the non-transmitting mode during
Off-time, independent of TXIHB status.
RXOUT
RXOUT
RXOUT
RXOUT
tRXDD
Figure 4. Typical Receiver Waveforms
Appendix 2 - 5
1
RECOMMENDED THERMAL PROTECTION
DATA BUS INTERFACE
All packages should mount to or contact a heat removal rail
located in the printed circuit board. To insure proper heat
transfer between the package and the heat removal rail, use a
thermally-conductivematerialbetweenthepackageandtheheat
removal rail. Use a material such as Mereco XLN-589 or
equivalent to insure heat transfer between the package and heat
removal rail.
The designer can connect the UT63M14x to the data bus via a
short-stub (direct-coupling) connection or a long-stub
(transformer-coupling)connection. Useashort-stubconnection
when the distance from the isolation transformer to the data bus
does not exceed a one-foot maximum. Use a long-stub
connection when the distance from the isolation transformer
exceeds the one-foot maximum and is less than twenty feet.
Figure 5 shows various examples of bus coupling
configurations.TheUT63M14xseriestransceiversaredesigned
to function with MIL-STD-1553A and 1553B compatible
transformers.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN and TXOUT to
RXIN for each channel.
SHORT-STUB
DIRECT COUPLING
1 FT. MAX.
ZO
1:2.5
55 OHMS
55 OHMS
+5V DC OPERATION
1:1.79
.75 ZO
.75 ZO
20 FT MAX
1:1.4
TXOUT
RXIN
TXOUT
RXIN
LONG-STUB
TRANSFORMER COUPLING
Note:
O defined per MIL-STD-1553B, Section 4.5.1.5.2.1.
Figure 8. Transceiver Test Circuit MIL-STD-1553B
Z
ZO
Figure 5. Bus Coupling Configuration
Appendix 2 - 6
VCC
RECEIVER
2KOHMS
2KOHMS
RXOUT
15 pF
2.5:1
55 OHMS
35 OHMS
RXIN
RXIN
*
TP
RXOUT
15 pF
Vin
55 OHMS
TP
RXEN
TRANSMITTER
55 OHMS
1:2.5
TXOUT
TXOUT
TXIN
A
RL =
35 OHMS
55 OHMS
TXIN
TXIHB
Notes:
1. TP = Test point.
2. RL removed for terminal
input impedance test.
3. TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
Figure 6. Direct Coupled Transceiver with Load
VCC
RECEIVER
2KOHMS
RXOUT
2KOHMS
1.79:1
1.4:1
RXIN
15 pF
*
TP
TP
Vin
RXOUT
RXIN
15 pF
RXEN
1:1.79
TRANSMITTER
.75 ZO
1:1.4
TXOUT
TXIN
A
B
35 OHMS
.75 ZO
TXIN
TXOUT
TXIHB
Notes:
1. TP = Test point.
Figure 7. Transformer Coupled Transceiver with Load
2. RL removed for terminal impedance test.
3. TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
Appendix 2 - 7
TXOUT
RL
TXOUT
A
TERMINAL
Notes:
1. Transformer Coupled Stub:
Terminal is defined as transceiver plus isolation transformer. Point A is defined in figure 7.
2. Direct Coupled Stub:
Terminal is defined as transceiver plus isolation transformer and fault resistors. Point A is defined in figure 6.
Figure 8. Transceiver Test Circuit MIL-STD-1553
1
ABSOLUTE MAXIMUM RATINGS
PARAMETER
LIMITS
UNIT
V
-0.3 to +7.0
V
CC
Input voltage range (receiver)
10
V
PP, L-L
V
Logic input voltage range
-0.3 to +5.5
Power dissipation 100% duty cycle (per channel)
3.6
6.0
W
2
°C/W
Thermal impedance junction to case
Maximum junction temperature
Storage temperature
+175
°C
°C
V
-65 to +150
-5.0 to +5.0
Receiver common mode input voltage range
Notes:
1. Stress outside the listed absolute maximum rating may cause permanent damage to the devices. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Mounting per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
LIMITS
+4.50 to +5.50
0 to +5.0
8.0
UNIT
V
Supply voltage range
Logic input voltage range
V
Receiver differential voltage
V
P-P
Receiver common mode voltage range
Driver peak output current
Serial data rate
+4.0
600
V
mA
MHz
°C
0.3 to 1
-55 to +125
Case operating temperature range (T )
C
Appendix 2 - 8
1
DC ELECTRICAL CHARACTERISTICS
= 5.0V ±10%
V
CC
-55°C < T < +125°C
C
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
CONDITION
V
Input low voltage
Input high voltage
Input low current
0.8
V
RXEN, TXIHB, TXIN, TXIN
IL
IH
IL
V
2.0
V
RXEN, TXIHB, TXIN, TXIN
I
-0.1
mA
V
= 0.4V; RXEN, TXIHB, TXIN,
IL
TXIN
I
Input high current
-40
2.4
40
µA
V
IH
TXIN
= 2.7V; RXEN, TXIHB, TXIN,
IH
V
Output low voltage
Output high voltage
.55
V
V
I
I
= 4mA; RXOUT, RXOUT
= 0.4mA; RXOUT, RXOUT
OL
OH
CC
OL
OH
V
I
V
supply current
22
mA
mA
mA
mA
0% duty cycle (non-transmitting)
25% duty cycle (ƒ = 1MHz)
50% duty cycle (ƒ = 1MHz)
87.5% duty cycle (ƒ = 1MHz)
100% duty cycle (ƒ = 1MHz)
CC
200
380
650
740
2
mA
Note:
1. All tests guaranteed per test figure 6.
2. Guaranteed but not tested.
Appendix 2 - 9
1
RECEIVER ELECTRICAL CHARACTERISTICS
= 5.0V ±10%
V
CC
-55°C < T < +125°C
C
SYMBOL
PARAMETER
MINIMUM MAXIMUM
UNIT
CONDITION
2
Input capacitance
Output capacitance
15
pF
RXEN; input ƒ = 1MHz @ 0V
C
IN
2
20
pF
V
RXOUT, RXOUT; ƒ = 1MHz @ 0V
C
OUT
5
Common mode input
voltage
-5
5
Direct-coupled stub; input 1.2 V ,
200ns rise/fall time ±25ns,
ƒ = 1MHz
PP
V
IC
V
Input threshold
0.20
V
Transformer-coupled stub; input at
ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 → 1 transition)
TH
PP,L-L
4
voltage (no response)
Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output
0 → 1 transition)
V
V
PP,L-L
PP,L-L
0.28
14.0
Input threshold voltage
(no response)
Transformer-coupled stub; input at
ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 → 1 transition)
0.86
Input threshold
4
voltage (response)
Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output
0 → 1 transition)
V
PP,L-L
2
1.20
20.0
Input threshold voltage
(response)
5
3
Common mode
rejection ratio
N/A
CMRR
Pass/Fail
Notes:
1. All tests guaranteed per test figure 6.
2. Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance.
3. Pass/fail criteria per the test method described in MIL-HDBK-1553 Appendix A, RT Validation Test Plan, Section 5.1.2.2, Common Mode Rejection.
4. Guaranteed by design.
5. Guaranteed to the limits specified if not tested.
Appendix 2 - 10
1
TRANSMITTER ELECTRICAL CHARACTERISTICS
= 5.0V ±10%
V
CC
-55°C < T < +125°C
C
SYMBOL
PARAMETER
MINIMUM MAXIMUM
UNIT
CONDITION
V
Output voltage swing per
18
6.0
6.0
27
V
Transformer-coupled stub, Figure 8,
O
PP,L-L
3, 5
Point A; input ƒ = 1MHz,
MIL-STD-1553B
(see figure 9)
R = 70 ohms
L
9.0
V
V
Direct-coupled stub, Figure 8, Point
per MIL-STD-1553B
(see figure 9)
PP,L-L
PP,L-L
A; input ƒ = 1MHz,
R = 35 ohms
L
5
20
14
5
per MIL-STD-1553A
Figure 7, Point A; input
(see figure 9)
ƒ = 1MHz, R = 35 ohms
L
2
NS
Output noise voltage
differential (see figure 9)
mV-RMS
mV-RMS
Transformer-coupled stub, Figure 8,
V
V
L-L
L-L
Point A; input ƒ = DC to 10MHz, R
L
= 70 ohms
Direct-coupled stub, Figure 8, Point
A; input ƒ = DC to 10MHz,
R = 35 ohms
L
4
OS
Output symmetry
-250
-90
+250
+90
mV
mV
Transformer-coupled stub, Figure 8,
PP,L-L
Point A; R = 140 ohms,
L
measurement taken 2.5µs after end
of transmission
PP,L-L
Direct-coupled stub, Figure 8, Point
A; R = 35 ohms, measurement
L
taken 2.5µs after end of transmission
V
Output voltage
distortion (overshoot or
ring) (see figure 9)
-900
-300
+900
+300
15
mV
mV
Transformer-coupled stub, Figure 8,
DIS
peak,L-L
peak,L-L
pF
Point A; R = 70 ohms
L
Direct-coupled stub, Figure 8, Point
A; R = 35 ohms
L
2
Input capacitance
RXEN, TXIHB, TXIN, TXIN; input
ƒ = 1MHz @ 0V
C
T
IN
5
Terminal input
impedance
1
2
Kohm
Kohm
Transformer-coupled stub, Figure 7,
Point A; input ƒ = 75KHz to 1MHZ
(power on or power off; non-
IZ
transmitting, R removed from
L
circuit).
Direct-coupled stub, Figure 6, Point
A;inputƒ=75KHzto1MHZ(power
on or power off; non-transmitting,
R removed from circuit).
L
Notes:
1. All tests guaranteed per test figure 6.
2. Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect
input or output capacitance.
3. For MIL-STD-1760, 22 Vp-p, L-L min.
4. Test in accordance with the method described in MIL-STD-1553B output symmetry, section 4.5.2.1.1.4.
5. Guaranteed to the limits specified if not tested.
Appendix 2 - 11
1
AC ELECTRICAL CHARACTERISTICS
= 5.0V ±10%
V
CC
-55°C < T < +125°C
C
SYMBOL
PARAMETER
MINIMUM MAXIMUM
UNIT
CONDITION
t
t
Transmitter output rise/
fall time (see figure 10)
100
300
ns
Input ƒ = 1MHz 50% duty cycle:
R, F
direct-coupled R = 35 ohms output
L
at 10% through 90% points TXOUT,
TXOUT. Figure 10.
t
RXOUT delay
TXIN skew
-200
-25
200
25
ns
ns
RXOUT to RXOUT, Figure 4.
TXIN to TXIN, Figure 3.
RXDD
3
t
t
TXDD
RZCD
Zerocrossingdistortion
(see figure 11)
-150
150
ns
Direct-coupled stub; input ƒ = 1MHz,
3V (skewINPUT±150ns),rise/fall
PP
time 200ns.
Zero crossing stability
(see figure 11)
-25
25
ns
Input TXIN and TXIN should create
Transmitter output zero crossings at
500ns, 1000ns, 1500ns, and 2000ns.
These zero crossings should not
deviate more than ±25ns.
t
TZCS
3,4
RDXOFF
Transmitter off; delay
from inhibit active
100
150
ns
ns
TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic zero to
one, see figure 12.
t
t
3,5
Transmitter on; delay
from inhibit inactive
TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic one to
zero, see figure 13.
DXON
3
Receiver off
50
50
ns
ns
ns
Receiver turn off time, see figure 13.
Receiver turn on time, see figure 13.
t
t
t
RCVOFF
3
Receiver on
RCVON
RCVPD
3
Receiver propagation
450
Receiver propagation delay, see
figure 13.
3
Transmitter
propagation
200
ns
Transmitter propagation delay, see
figure 12.
t
XMITPD
Notes:
1. All tests guaranteed per test figure 6.
2. Guaranteed by device characterization.
3. Supplied as a design limit but not guaranteed or tested.
4. Delay time from transmit inhibit (1.5V) rising to transmit off (280mV).
5. Delay time from not transmit inhibit (1.5V) falling to transmit off (1.2V).
Table 2. Transformer Requirements
COUPLING TECHNIQUE
± 5VDC
DIRECT-COUPLED:
Isolation Transformer Ratio
2.5:1
1.79:1
1:1.4
TRANSFORMER-COUPLED:
Isolation Transformer Ratio
Coupling Transformer Ratio
Appendix 2 - 12
V
DIS (Overshoot)
VDIS (Ring)
0 Volts
0 Volts
VO
V
NS
Figure 9. Transmitter Output Characteristics (V , V , V )
DIS
NS
O
tR
90%
90%
VO
tTZCS
10%
10%
tF
Figure 10. Transmitter Output Zero Crossing Stability, Rise Time, Fall Time (t
, t , t )
R F
TZCS
VIN
tRZCD
Figure 11. Receiver Input Zero Crossing Distortion (t
)
RZCD
Appendix 2 - 13
10%
TX OUTPUT
zero crossing
10%
tDXON
tDXOFF
50%
tXMITPD
INHIBIT
50%
TX IN
and
50%
TX IN
Figure 12. Transmitter Timing
RX INPUT
RXEN
zero crossing
tRCVPD
50%
50%
RXEN
tRCVON
tRCVOFF
RX OUT
and
50%
50%
50%
RX OUT
Figure 13. Receiving Timing
Appendix 2 - 14
0.001 MIN.
.023 MAX.
.014 MIN.
LEAD 1
INDICATOR
1.89 MAX.
0.100
0.150
MIN.
0.155
MAX.
.610 MAX.
.570 MIN.
0.005 MIN.
Notes:
1. Package material: opaque ceramic.
2. All package finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material should
be used.
.015 MAX.
.008 MIN.
.620 MAX.
.590 MIN.
(AT SEATING PLANE)
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity
LEAD 1 INDICATOR
0.016 ±.002
.810 MAX.
.050
.600 MAX.
.400 MIN.
.010 + .002 - .001
0.130 MAX.
0.070 ±0.010
(AT CERAMIC BODY)
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material should be used.
Figure 15. 24-Lead Flatpack, Dual Cavity
(50-mil lead spacing)
Appendix 2 - 16
LEAD 1 INDICATOR
0.016 ±.002
.810 MAX.
.050
.600 MAX.
.400 MIN.
.010 + .002 - .001
0.130 MAX.
0.070 ±0.010
(AT CERAMIC BODY)
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material should be used.
Figure 15. 24-Lead Flatpack, Dual Cavity
(50-mil lead spacing)
16
ORDERING INFORMATION
UT63M14x Monolithic Transceiver, 5V Operation: SMD
5962
*
93226 *
*
*
*
Lead Finish:
(A)
(C)
(X)
=
=
=
Solder
Gold
Optional
Case Outline:
(X)
(Z)
=
=
36 pin DIP
24 pin FP
Class Designator:
(Q)
(V)
=
=
Class Q
Class V
Device Type
(03) = Idle low
Drawing Number: 93226
Total Dose:
(H)
(G)
(F)
(R)
(-)
=
=
1E6 rads(Si)
5E5 ads(Si)
3E5 rads(Si)
1E5rads(Si)
None
=
=
=
Federal Stock Class Designator: No options
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Total dose must be specified for all QML Q and QML V devices.
4. Neutron irradiation limits will be added when available.
17
UT63M14x Monolithic Transceiver, 5V Operation
UT63M-
*
*
*
*
Total Dose:
() None
=
Lead Finish:
(A)
(C)
(X)
=
=
=
Solder
Gold
Optional
Screening:
(C)
(P)
=
=
Military Temperature
Prototype
Package Type:
(B)
(C)
=
=
36-pin DIP
24-pin FP
Device Type Modifier:
147 Idle Low Transceiver
=
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Military Temperature range devices are burned-in and tested at -55°C, room temperature, and 125°C. Radiation characteristics are neither tested nor
guaranteed and may not be specified.
4. Devices have prototype assembly and are tested at 25°C only. Radiation characteristics are neither tested nor guaranteed and may not be specified.
Lead finish is GOLD only.
18
COLORADO
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INTERNATIONAL
Tel: 805-778-9229
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Fax: 719-594-8468
Fax: 805-778-1980
Fax: 603-888-4585
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Tel: 321-951-4164
WEST COAST
Tel: 949-362-2260
CENTRAL
Tel: 719-594-8017
Fax: 321-951-4254
Fax: 949-362-2266
Fax: 719-594-8468
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changes to any products and services herein at any time
without notice. Consult Aeroflex or an authorized sales
representative to verify that the information in this data sheet
iscurrentbeforeusingthisproduct. Aeroflexdoesnotassume
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