HFBR-1115T

更新时间:2024-09-18 02:10:02
品牌:AGILENT
描述:Fiber Optic Transmitter and Receiver Data Links for 125 MBd

HFBR-1115T 概述

Fiber Optic Transmitter and Receiver Data Links for 125 MBd 光纤发射器和接收数据的125 MBd的相关链接 光纤发送器

HFBR-1115T 规格参数

生命周期:Transferred包装说明:DIP
Reach Compliance Code:unknown风险等级:5.27
Is Samacsys:N主体宽度:12.19 mm
主体高度:9.8 mm通信标准:ATM, FDDI
连接类型:ST CONNECTOR发射极/检测器类型:LED
光纤设备类型:TRANSMITTER光纤类型:MMF
安装特点:THROUGH HOLE MOUNT最高工作温度:70 °C
最低工作温度:最大工作波长:1380 nm
最小工作波长:1270 nm标称工作波长:1308 nm
标称光功率输出:0.009 mW封装形式:DIP
子类别:Fiber Optic Emitters最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:NO传输类型:DIGITAL
Base Number Matches:1

HFBR-1115T 数据手册

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Technical Data  
The HFBR-1115/-2115 series of  
data links are high-performance,  
cost-efficient, transmitter and  
receiver modules for serial  
optical data communication  
applications specified at 100  
Mbps for FDDI PMD or 100 Base-  
FX Fast Ethernet applications.  
These modules are designed for  
50 or 62.5 µm core multi-mode  
optical fiber and operate at a  
nominal wavelength of 1300 nm.  
They incorporate our high-  
performance, reliable, long-  
wavelength, optical devices and  
proven circuit technology to give  
long life and consistent  
preamplifier IC. The PIN-  
preamplifier combination is ac-  
coupled to a custom quantizer IC  
which provides the final pulse  
shaping for the logic output and  
the Signal Detect function. Both  
the Data and Signal Detect  
Outputs are differential. Also,  
both Data and Signal Detect  
Outputs are PECL compatible,  
ECL-referenced (shifted) to a  
+5 V power supply.  
performance.  
The transmitter utilizes a  
1300 nm surface-emitting  
InGaAsP LED, packaged in an  
optical subassembly. The LED is  
dc-coupled to a custom IC which  
converts differential-input, PECL  
logic signals, ECL-referenced  
(shifted) to a +5 V power supply,  
into an analog LED drive current.  
The overall package concept for  
the Data Links consists of the  
following basic elements: two  
optical subassemblies, two  
electrical subassemblies, and the  
outer housings as illustrated in  
Figure 1.  
The receiver utilizes an InGaAs  
PIN photodiode coupled to a  
custom silicon transimpedance  
*ST is a registered trademark of AT&T Lightguide Cable Connectors.  
5965-3481E (8/96)  
177  
The package outline drawing and  
pinout are shown in Figures 2  
and 3. The details of this package  
outline and pinout are compatible  
with other data-link modules from  
other vendors.  
RECEIVER  
PIN PHOTODIODE  
DIFFERENTIAL  
DATA IN  
QUANTIZER  
IC  
DIFFERENTIAL  
SIGNAL  
DETECT OUT  
PREAMP IC  
®
SIMPLEX ST  
ELECTRICAL  
SUBASSEMBLIES  
OPTICAL  
SUBASSEMBLIES RECEPTACLE  
TRANSMITTER  
DIFFERENTIAL  
DATA IN  
DRIVER IC  
V
BB  
LED  
TOP VIEW  
THREADS  
3/8 – 32 UNEF-2A  
HFBR-111X/211XT  
DATE CODE (YYWW)  
SINGAPORE  
12.19  
MAX.  
8.31  
41 MAX.  
5.05  
0.9  
7.01  
3
9.8 MAX.  
5.0  
2.45  
19.72  
17.78  
(7 x 2.54)  
12  
NOTES:  
1. MATERIAL ALLOY 194 1/2H – 0.38 THK  
FINISH MATTE TIN PLATE 7.6 µm MIN.  
2. MATERIAL PHOSPHOR BRONZE WITH  
120 MICROINCHES TIN LEAD (90/10)  
OVER 50 MICROINCHES NICKEL.  
8 x 7.62  
3. UNITS = mm  
HOUSING PINS 0.38 x 0.5 mm  
NOTE 1  
PCB PINS  
DIA. 0.46 mm  
NOTE 2  
178  
Figure 4 illustrates the predicted  
OPB associated with the trans-  
mitter and receiver specified in this  
data sheet at the Beginning of Life  
(BOL). This curve represents the  
attenuation and chromatic plus  
modal dispersion losses associated  
with 62.5/125 µm and 50/125 µm  
fiber cables only. The area under  
the curve represents the remaining  
OPB at any link length, which is  
available for overcoming non-fiber  
cable related losses.  
OPTICAL PORT  
OPTICAL PORT  
NC  
9
NC  
NC  
NO PIN  
GND  
9
NC  
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
GND  
10  
11  
12  
13  
14  
15  
16  
NO PIN  
GND  
GND  
GND  
GND  
10  
11  
12  
13  
14  
15  
16  
GND  
V
V
CC  
CC  
V
GND  
V
CC  
CC  
GND  
DATA  
DATA  
NC  
GND  
V
CC  
SD  
DATA  
DATA  
NC  
V
SD  
BB  
NC  
NO PIN  
14  
12  
TRANSMITTER  
RECEIVER  
62.5/125 µm  
10  
8
The optical subassemblies consist  
of a transmitter subassembly in  
which the LED resides and a  
receiver subassembly housing the  
PIN-preamplifier combination.  
6
The Applications Engineering  
group of the Optical Communi-  
cation Division is available to assist  
you with the technical understand-  
ing and design tradeoffs associated  
with these transmitter and receiver  
modules. You can contact them  
through your Hewlett-Packard  
sales representative.  
50/125 µm  
4
2
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
FIBER OPTIC CABLE LENGTH – km  
The electrical subassemblies con-  
sist of a multi-layer printed circuit  
board on which the IC chips and  
various sufrace-mounted, passive  
circuit elements are attached.  
The following information is  
provided to answer some of the  
most common questions about the  
use of these parts.  
Each transmitter and receiver  
Hewlett-Packard LED technology  
has produced 1300 nm LED  
devices with lower aging  
characteristics than normally asso-  
ciated with these technologies in  
the industry. The industry  
convention is 1.5 dB aging for  
1300 nm LEDs; however, HP 1300  
nm LEDs will experience less than  
1 dB of aging over normal  
commercial equipment mission-life  
periods. Contact your Hewlett-  
Packard sales representative for  
additional details.  
package includes an internal shield  
for the electrical subassembly to  
ensure low EMI emissions and high  
immunity to external EMI fields.  
The outer housing, including the  
ST* port, is molded of filled, non-  
conductive plastic to provide  
mechanical strength and electrical  
isolation. For other port styles,  
please contact your Hewlett-  
Packard Sales Representative.  
The Optical Power Budget (OPB)  
is the available optical power for a  
fiber-optic link to accommodate  
fiber cable losses plus losses due to  
in-line connectors, splices, optical  
switches, and to provide margin for  
link aging and unplanned losses  
due to cable plant reconfiguration  
or repair.  
Each data-link module is attached  
to a printed circuit board via the  
16-pin DIP interface. Pins 8 and 9  
provide mechanical strength for  
these plastic-port devices and will  
provide port-ground for forthcom-  
ing metal-port modules.  
Figure 4 was generated with a  
Hewlett-Packard fiber-optic link  
model containing the current  
industry conventions for fiber  
179  
cable specifications and the FDDI  
PMD optical parameters. These  
parameters are reflected in the  
guaranteed performance of the  
transmitter and receiver specifica-  
tions in this data sheet. This same  
model has been used extensively in  
the ANSI and IEEE committees,  
including the ANSI X3T9.5  
3.0  
2.5  
The Hewlett-Packard 1300 nm data  
link modules are designed to  
operate per the system jitter  
allocations stated in Table E1 of  
Annex E of the FDDI PMD  
standard.  
2.0  
1.5  
1.0  
0.5  
0
committee, to establish the optical  
performance requirements for  
various fiber-optic interface  
The 1300 nm transmitter will  
tolerate the worst-case input  
electrical jitter allowed in the table  
without violating the worst-case  
output jitter requirements of  
Section 8.1 Active Output Interface  
of the FDDI PMD standard.  
0
25 50 75 100 125 150 175 200  
SIGNAL RATE (MBd)  
standards. The cable parameters  
used come from the ISO/IEC JTC1/  
SC 25/WG3 Generic Cabling for  
Customer Premises per DIS 11801  
document and the EIA/TIA-568-A  
Commercial Building Telecom-  
munications Cabling Standard per  
SP-2840.  
CONDITIONS:  
1. PRBS 2 -1  
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.  
3. BER = 10  
7
-6  
4. T = 25° C  
A
5. V  
= 5 Vdc  
CC  
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.  
The 1300 nm receiver will tolerate  
the worst-case input optical jitter  
allowed in Section 8.2 Active Input  
Interface of the FDDI PMD  
standard without violating the  
worst-case output electrical jitter  
allowed in the Table E1 of the  
Annex E.  
These data link modules can also  
be used for applications which  
require different bit-error-ratio  
(BER) performance. Figure 6  
illustrates the typical trade-off  
between link BER and the receiver  
input optical power level.  
For purposes of definition, the  
symbol rate (Baud), also called  
signaling rate, is the reciprocal of  
the symbol time. Data rate (bits/  
sec) is the symbol rate divided by  
the encoding factor used to encode  
the data (symbols/bit).  
The jitter specifications stated in  
the following transmitter and  
receiver specification table are  
derived from the values in Table  
E1 of Annex E. They represent the  
worst-case jitter contribution that  
the transmitter and receiver are  
allowed to make to the overall  
system jitter without violating the  
Annex E allocation example. In  
practice, the typical jitter  
When used in FDDI, ATM 100  
Mbps, and Fast Ethernet  
-2  
1 x 10  
applications, the performance of  
Hewlett-Packard’s 1300 nm HFBR-  
1115/-2115 data link modules is  
guaranteed over the signaling rate  
of 10 MBd to 125 MBd to the full  
conditions listed in the individual  
product specification tables.  
-3  
1 x 10  
CENTER OF  
SYMBOL  
-4  
1 x 10  
-5  
1 x 10  
contribution of the Hewlett-  
Packard data link modules is well  
below the maximum amounts.  
-6  
1 x 10  
-7  
1 x 10  
1 x 10  
-8  
-10  
2.5 x 10  
1 x 10  
1 x 10  
-11  
-12  
The data link modules can be used  
for other applications at signaling  
rates outside of the 10 MBd to 125  
MBd range with some penalty in  
the link optical power budget  
primarily caused by a reduction of  
receiver sensitivity. Figure 5 gives  
an indication of the typical  
-6  
-4  
-2  
0
2
4
It is advised that normal static  
precautions be taken in the  
handling and assembly of these  
data link modules to prevent  
damage which may be induced by  
electrostatic discharge (ESD). The  
HFBR-1115/-2115 series meets  
MIL-STD-883C Method 3015.4  
Class 2.  
RELATIVE INPUT OPTICAL POWER – dB  
CONDITIONS:  
1. 125 MBd  
2. PRBS 2 -1  
7
3. T = 25° C  
A
4. V  
= 5 Vdc  
CC  
5. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.  
performance of these 1300 nm  
products at different rates.  
180  
These data link modules are  
compatible with either industry  
standard wave- or hand-solder  
processes.  
Care should be taken to avoid  
shorting the receiver Data or  
Signal Detect Outputs directly to  
ground without proper current-  
limiting impedance.  
It is important to take care in the  
layout of your circuit board to  
achieve optimum performance  
from these data link modules.  
Figure 7 provides a good example  
of a power supply filter circuit that  
works well with these parts. Also,  
suggested signal terminations for  
the Data, Data-bar, Signal Detect  
and Signal Detect-bar lines are  
shown. Use of a multilayer,  
The data link modules are  
packaged in a shipping container  
designed to protect it from  
mechanical and ESD damage  
during shipment or storage.  
The transmitter and receiver are  
delivered with protective process  
caps covering the individual ST*  
ports. These process caps protect  
the optical subassemblies during  
wave solder and aqueous wash  
processing and act as dust covers  
during shipping.  
ground-plane printed circuit board  
will provide good high-frequency  
Rx  
Tx  
*
*
*
*
9
NC  
NO  
NC  
8
7
6
5
4
3
2
1
9
NC  
NC  
8
7
6
5
4
3
2
1
A
NO  
PIN  
10  
GND  
10 GND  
PIN  
L1  
1
L2  
1
11 GND  
12 GND  
13 GND  
14 SD  
V
11  
12  
V
V
GND  
GND  
GND  
GND  
CC  
CC  
A
+5 Vdc  
GND  
C1  
0.1  
C7  
C3  
0.1  
C4  
10  
V
C2  
0.1  
CC  
CC  
10  
V
(OPTIONAL)  
13 GND  
CC  
D
D
DATA  
DATA  
14  
15  
D
D
DATA  
DATA  
15 SD  
V
BB  
NO  
16  
R3  
82  
R2  
82  
R4  
R1  
NC  
16 NC  
NC  
R7  
82  
R5  
R8  
R6  
PIN  
130 130  
82 130 130  
C6  
0.1  
R9  
82  
C5  
0.1  
R11  
82  
SD  
SD  
TERMINATE D, D  
AT Tx INPUTS  
R10  
130  
R12  
130  
TOP VIEWS  
TERMINATE D, D, SD, SD AT  
INPUTS OF FOLLOW-ON DEVICES  
NOTES:  
1. RESISTANCE IS IN OHMS. CAPACITANCE IS IN MICROFARADS. INDUCTANCE IS IN MICROHENRIES.  
2. TERMINATE TRANSMITTER INPUT DATA AND DATA-BAR AT THE TRANSMITTER INPUT PINS. TERMINATE THE RECEIVER OUTPUT DATA, DATA-BAR, AND SIGNAL DETECT-  
BAR AT THE FOLLOW-ON DEVICE INPUT PINS. FOR LOWER POWER DISSIPATION IN THE SIGNAL DETECT TERMINATION CIRCUITRY WITH SMALL COMPROMISE TO THE  
SIGNAL QUALITY, EACH SIGNAL DETECT OUTPUT CAN BE LOADED WITH 510 OHMS TO GROUND INSTEAD OF THE TWO RESISTOR, SPLIT-LOAD PECL TERMINATION  
SHOWN IN THIS SCHEMATIC.  
3. MAKE DIFFERENTIAL SIGNAL PATHS SHORT AND OF SAME LENGTH WITH EQUAL TERMINATION IMPEDANCE.  
4. SIGNAL TRACES SHOULD BE 50 OHMS MICROSTRIP OR STRIPLINE TRANSMISSION LINES. USE MULTILAYER, GROUND-PLANE PRINTED CIRCUIT BOARD FOR BEST HIGH-  
FREQUENCY PERFORMANCE.  
5. USE HIGH-FREQUENCY, MONOLITHIC CERAMIC BYPASS CAPACITORS AND LOW SERIES DC RESISTANCE INDUCTORS. RECOMMEND USE OF SURFACE-MOUNT COIL  
INDUCTORS AND CAPACITORS. IN LOW NOISE POWER SUPPLY SYSTEMS, FERRITE BEAD INDUCTORS CAN BE SUBSTITUTED FOR COIL INDUCTORS. LOCATE POWER  
SUPPLY FILTER COMPONENTS CLOSE TO THEIR RESPECTIVE POWER SUPPLY PINS. C7 IS AN OPTIONAL BYPASS CAPACITOR FOR IMPROVED, LOW-FREQUENCY NOISE  
POWER SUPPLY FILTER PERFORMANCE.  
6. DEVICE GROUND PINS SHOULD BE DIRECTLY AND INDIVIDUALLY CONNECTED TO GROUND.  
7. CAUTION: DO NOT DIRECTLY CONNECT THE FIBER-OPTIC MODULE PECL OUTPUTS (DATA, DATA-BAR, SIGNAL DETECT, SIGNAL DETECT-BAR, V ) TO GROUND WITHOUT  
BB  
PROPER CURRENT LIMITING IMPEDANCE.  
8. (*) OPTIONAL METAL ST OPTICAL PORT TRANSMITTER AND RECEIVER MODULES WILL HAVE PINS 8 AND 9 ELECTRICALLY CONNECTED TO THE METAL PORT ONLY AND  
NOT CONNECTED TO THE INTERNAL SIGNAL GROUND.  
181  
circuit performance with a low  
inductance ground return path. See  
additional recommendations noted  
in the interface schematic shown in  
Figure 7.  
into effect on January 1, 1997. AEL  
Class 1 LED devices are consid-  
ered eye safe. See Application Note  
1094, LED Device Classifications  
with Respect to AEL Values as  
Defined in the IEC 825-1  
These data link modules are  
intended to enable commercial  
system designers to develop  
equipment that complies with the  
various international regulations  
governing certification of Infor-  
mation Technology Equipment.  
Additional information is available  
from your Hewlett-Packard sales  
representative.  
Standard and the European  
EN60825-1 Directive.  
The Hewlett-Packard transmitter  
and receiver hole pattern is  
The material used for the housing  
in the HFBR-1115/-2115 series is  
Ultem 2100 (GE). Ultem 2100 is  
recognized for a UL flammability  
rating of 94V-0 (UL File Number  
E121562) and the CSA (Canadian  
Standards Association) equivalent  
(File Number LS88480).  
compatible with other data link  
modules from other vendors. The  
drawing shown in Figure 8 can be  
used as a guide in the mechanical  
layout of your circuit board.  
All HFBR-1115T LED transmitters  
are classified as IEC-825-1  
Accessible Emission Limit (AEL)  
Class 1 based upon the current  
proposed draft scheduled to go  
0.8 ± 0.1  
ø
(16X)  
–A–  
.032 ± .004  
Ø 0.000 M  
A
17.78  
.700  
2.54  
.100  
(7X)  
7.62  
.300  
TOP VIEW  
UNITS = mm/INCH  
182  
200  
180  
160  
140  
120  
100  
4.40  
1.975  
1.25  
3.0  
4.850  
1.5  
1.525  
0.525  
10.0  
5.6  
1.025  
1.00  
2.0  
2.5  
3.5  
0.075  
0.975  
0.90  
t
– TRANSMITTER  
OUTPUT OPTICAL  
RISE/FALL TIMES – ns  
r/f  
100% TIME  
INTERVAL  
3.0  
3.5  
40 ± 0.7  
1280 1300 1320 1340 1360 1380  
0.50  
0.10  
± 0.725  
± 0.725  
λ
– TRANSMITTER OUTPUT OPTICAL  
CENTER WAVELENGTH –nm  
C
HFBR-1115T FDDI TRANSMITTER TEST RESULTS  
OF λ , ∆λ AND t ARE CORRELATED AND  
0% TIME  
INTERVAL  
C
r/f  
COMPLY WITH THE ALLOWED SPECTRAL WIDTH  
AS A FUNCTION OF CENTER WAVELENGTH FOR  
VARIOUS RISE AND FALL TIMES.  
0.025  
0.0  
0.075  
-0.025  
-0.05  
1.525  
0.525  
4.850  
5.6  
1.975  
4.40  
10.0  
80 ± 500 ppm  
TIME – ns  
THE HFBR-1115T OUTPUT OPTICAL PULSE SHAPE FITS WITHIN THE BOUNDARIES  
OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTS.  
-31.0 dBm  
5
4
3
MIN (P + 4.0 dB OR -31.0 dBm)  
O
P
(P + 1.5 dB  
O
A
< P < -31.0 dBm)  
A
P
= MAX (P OR -45.0 dBm)  
S
O
2
(P = INPUT POWER FOR BER < 10 )  
S
-10  
2.5 x 10 BER  
INPUT OPTICAL POWER  
INPUT OPTICAL POWER  
>
4.0 dB STEP DECREASE)  
>
(
1.5 dB STEP INCREASE)  
(
2
-12  
1.0 x 10 BER  
-45.0 dBm  
1
0
ANS MAX  
AS MAX  
SIGNAL DETECT (ON)  
-4 -3 -2 -1  
0
1
2
3
4
SIGNAL DETECT (OFF)  
EYE SAMPLING TIME POSITION (ns)  
CONDITIONS:  
1.T = 25° C  
A
TIME  
AS MAX — MAXIMUM ACQUISITION TIME (SIGNAL).  
2. V  
= 5 Vdc  
CC  
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.  
4. INPUT OPTICAL POWER IS NORMALIZED TO  
CENTER OF DATA SYMBOL.  
AS MAX IS THE MAXIMUM SIGNAL DETECT ASSERTION TIME FOR THE STATION.  
AS MAX SHALL NOT EXCEED 100.0 µs. THE DEFAULT VALUE OF AS MAX IS 100.0 µs.  
5. NOTE 21 AND 22 APPLY.  
ANS MAX — MAXIMUM ACQUISITION TIME (NO SIGNAL).  
ANS MAX IS THE MAXIMUM SIGNAL DETECT DEASSERTION TIME FOR THE STATION.  
ANS MAX SHALL NOT EXCEED 350 µs. THE DEFAULT VALUE OF AS MAX IS 350 µs.  
183  
1
2
NC  
V
BB  
No internal connect, used for mechanical strength only  
V Bias output  
BB  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
GND  
GND  
GND  
GND  
OMIT  
NC  
Ground  
Ground  
Ground  
Ground  
Note 3  
Note 3  
Note 3  
Note 3  
No pin  
No internal connect, used for mechanical strength only  
No internal connect, used for mechanical strength only  
Ground  
Common supply voltage  
Common supply voltage  
Ground  
Data input  
Inverted Data input  
Note 5  
Note 5  
Note 3  
Note 1  
Note 1  
Note 3  
Note 4  
Note 4  
NC  
GND  
V
CC  
V
CC  
GND  
DATA  
DATA  
NC  
No internal connect, used for mechanical strength only  
1
2
3
4
5
6
7
8
9
NC  
DATA  
DATA  
No internal connect, used for mechanical strength only  
Inverted Data input  
Data input  
Common supply voltage  
Common supply voltage  
Common supply voltage  
Ground  
Note 4  
Note 4  
Note 1  
Note 1  
Note 1  
Note 3  
Note 5  
Note 5  
V
CC  
V
CC  
V
CC  
GND  
NC  
NC  
No internal connect, used for mechanical strength only  
No internal connect, used for mechanical strength only  
10  
11  
12  
13  
14  
15  
16  
OMIT  
GND  
GND  
GND  
SD  
No pin  
Ground  
Ground  
Ground  
Signal Detect  
Inverted Signal Detect  
No pin  
Note 3  
Note 3  
Note 3  
Note 2, 4  
Note 2, 4  
SD  
OMIT  
1. Voltages on V must be from the same power supply (they are connected together internally).  
CC  
2. Signal Detect is a logic signal that indicates the presence or absence of an input optical signal. A logic-high, V , on Signal Detect  
OH  
indicates presence of an input optical signal. A logic-low, V , on Signal Detect indicates an absence of input optical signal.  
OL  
3. All GNDs are connected together internally and to the internal shield.  
4. DATA, DATA, SD, SD are open-emitter output circuits.  
5. On metal-port modules, these pins are redefined as “Port Connection.”  
184  
Storage Temperature  
Lead Soldering Temperature  
Lead Soldering Time  
Supply Voltage  
T
-40  
100  
260  
10  
7.0  
V
CC  
°C  
°C  
sec.  
V
S
T
t
SOLD  
SOLD  
V
-0.5  
-0.5  
CC  
Data Input Voltage  
V
V
I
Differential Input Voltage  
Output Current  
V
1.4  
50  
V
mA  
Note 1  
D
I
O
Ambient Operating Temperature  
Supply Voltage  
T
V
CC  
0
4.5  
70  
5.5  
°C  
V
A
Data Input Voltage–Low  
Data Input Voltage–High  
Data and Signal Detect Output Load  
Signaling Rate  
V - V  
-1.810  
-1.165  
-1.475  
-0.880  
V
V
IL  
CC  
V
IH  
- V  
CC  
R
50  
125  
Note 2  
Note 3  
L
f
10  
MBd  
S
Figure 5  
(T = 0°C to 70°C, V = 4.5 V to 5.5 V)  
A
CC  
Supply Current  
Power Dissipation  
Threshold Voltage  
Data Input Current–Low  
Data Input Current–High  
I
145  
0.76  
-1.3  
0
185  
1.1  
-1.24  
mA  
W
V
µA  
µA  
Note 4  
Note 7  
Note 5  
CC  
P
DISS  
V
- V  
-1.42  
-350  
BB  
CC  
I
I
IL  
14  
350  
IH  
(T = 0°C to 70°C, V = 4.5 V to 5.5 V)  
A
CC  
Supply Current  
Power Dissipation  
Data Output Voltage–Low  
Data Output Voltage–High  
Data Output Rise Time  
Data Output Fall Time  
I
82  
0.3  
145  
0.5  
-1.620  
-0.880  
2.2  
mA  
W
V
Note 6  
Note 7  
Note 8  
Note 8  
Note 9  
Note 9  
Note 8  
CC  
P
DISS  
V
V
- V  
- V  
-1.840  
-1.045  
0.35  
0.35  
-1.840  
OL  
CC  
V
OH  
CC  
t
r
ns  
ns  
V
t
2.2  
-1.620  
f
Signal Detect Output  
V
- V  
OL  
CC  
Voltage–Low (De-asserted)  
Signal Detect Output  
V
OH  
- V  
-1.045  
-0.880  
V
Note 8  
CC  
Voltage–High (Asserted)  
Signal Detect Output Rise Time  
Signal Detect Output Fall Time  
t
t
0.35  
0.35  
2.2  
2.2  
ns  
ns  
Note 9  
Note 9  
r
f
185  
(T = 0°C to 70°C, V = 4.5 V to 5.5 V)  
A
CC  
Output Optical Power  
62.5/125 µm, NA = 0.275 Fiber  
Output Optical Power  
50/125 µm, NA = 0.20 Fiber  
Optical Extinction Ratio  
Output Optical Power at Logic “0” State  
Center Wavelength  
P , BOL  
-19  
-20  
-22.5  
-23.5  
-16.8  
-20.3  
-14  
-14  
-14  
-14  
0.03  
-35  
-45  
1380  
170  
3.0  
dBm  
avg.  
dBm  
avg.  
%
dB  
dBm  
avg.  
nm  
Note 13  
Note 13  
Note 14  
Note 15  
O
P , EOL  
O
P , BOL  
O
P , EOL  
O
0.001  
-50  
P (“0”)  
O
λ
1270  
1308  
137  
1.0  
Note 16  
Figure 9  
Note 16  
Figure 9  
Note 16, 17  
Figure 9, 10  
Note 16, 17  
Figure 9, 10  
C
Spectral Width–FWHM  
Optical Rise Time  
∆λ  
nm  
t
0.6  
0.6  
ns  
r
Optical Fall Time  
t
2.1  
3.0  
ns  
f
Duty Cycle Distortion Contributed by  
the Transmitter  
Data Dependent Jitter Contributed by  
the Transmitter  
Random Jitter Contributed by the  
Transmitter  
DCD  
DDJ  
RJ  
0.02  
0.02  
0
0.6  
ns p-p  
ns p-p  
ns p-p  
Note 18  
Figure 10  
Note 19  
Note 20  
0.6  
0.69  
(T = 0°C to 70°C, V = 4.5 V to 5.5 V)  
A
CC  
Input Optical Power  
Minimum at Window Edge  
P
(W)  
-33.5  
-34.5  
-11.8  
-31  
dBm  
avg.  
Note 21,  
Figure 11  
IN Min.  
Input Optical Power  
Minimum at Eye Center  
P
(C)  
-31.8  
dBm  
avg.  
Note 22,  
Figure 8  
IN Min.  
Input Optical Power Maximum  
Operating Wavelength  
P
-14  
1270  
dBm  
avg.  
Note 21  
IN Max.  
λ
1380  
0.4  
nm  
Duty Cycle Distortion  
Contributed by the Receiver  
DCD  
0.02  
0.35  
1.0  
ns p-p  
Note 10  
Note 11  
Note 12  
Data Dependent Jitter  
Contributed by the Receiver  
DDJ  
RJ  
1.0  
2.14  
-33  
ns p-p  
ns p-p  
Random Jitter Contributed by the  
Receiver  
Signal Detect–Asserted  
Signal Detect–De-asserted  
Signal Detect–Hysteresis  
P
A
P +1.5 dB  
dBm  
avg.  
Note 23, 24  
Figure 9  
D
P
D
-45  
dBm  
avg.  
Note 25, 26  
Figure 12  
P -P  
A
1.5  
0
2.4  
55  
dB  
Figure 9  
D
Signal Detect Assert Time  
(off to on)  
AS_Max  
100  
350  
µs  
Note 23, 24  
Figure 12  
Signal Detect De-assert Time  
(on to off)  
ANS_Max  
0
110  
µs  
Note 25, 26  
Figure 12  
186  
level is -20 dBm average. See  
Application Information–Data Link  
Jitter Section for further information.  
11. Data Dependent Jitter contributed by  
the receiver is specified with the  
FDDI DDJ test pattern described in  
the FDDI PMD Annex A.5. The input  
optical power level is -20 dBm  
decibels.  
1. This is the maximum voltage that can  
be applied across the Differential  
Transmitter Data Inputs to prevent  
damage to the input ESD protection  
circuit.  
15. The transmitter provides compliance  
with the need for Transmit_Disable  
commands from the FDDI SMT layer  
by providing an Output Optical  
Power level of <-45 dBm average in  
response to a logic “0” input. This  
specification applies to either 62.5/  
125 µm or 50/125 µm fiber cables.  
16. This parameter complies with the  
FDDI PMD requirements for the  
tradeoffs between center wavelength,  
spectral width, and rise/fall times  
shown in Figure 9.  
17. This parameter complies with the  
optical pulse envelope from the FDDI  
PMD shown in Figure 10. The optical  
rise and fall times are measured from  
10% to 90% when the transmitter is  
driven by the FDDI HALT Line State  
(12.5 MHz square-wave) input signal.  
18. Duty Cycle Distortion contributed by  
the transmitter is measured at a 50%  
threshold using an IDLE Line State,  
125 MBd (62.5 MHz square-wave),  
input signal. See Application  
2. The outputs are terminated with 50 Ω  
connected to V - 2 V.  
CC  
3. The specified signaling rate of  
10 MBd to 125 MBd guarantees  
operation of the transmitter and  
receiver link to the full conditions  
listed in the FDDI Physical Layer  
Medium Dependent standard.  
average. See Application  
Information–Data Link Jitter Section  
for further information.  
12. Random Jitter contributed by the  
receiver is specified with an IDLE  
Line State, 125 MBd (62.5 MHz  
square-wave), input signal. The input  
optical power level is at the maxi-  
Specifically, the link bit-error-ratio  
will be equal to or better than 2.5 x  
-10  
10 for any valid FDDI pattern. The  
mum of “P  
(W).” See Applica-  
IN Min.  
transmitter section of the link is  
capable of dc to 125 MBd. The  
receiver is internally ac-coupled  
which limits the lower signaling rate  
to 10 MBd. For purposes of  
tion Information–Data Link Jitter  
Section for further information.  
13. These optical power values are  
measured with the following  
conditions:  
definition, the symbol rate (Baud),  
also called signaling rate, fs, is the  
reciprocal of the symbol time. Data  
rate (bits/sec) is the symbol rate  
divided by the encoding factor used  
to encode the data (symbols/bit).  
4. The power supply current needed to  
operate the transmitter is provided to  
differential ECL circuitry. This  
circuitry maintains a nearly constant  
current flow from the power supply.  
Constant current operation helps to  
prevent unwanted electrical noise  
from being generated and conducted  
or emitted to neighboring circuitry.  
5. This value is measured with an output  
• The Beginning of Life (BOL) to the  
End of Life (EOL) optical power  
degradation is typically 1.5 dB per  
the industry convention for long  
wavelength LEDs. The actual  
degradation observed in Hewlett-  
Packard’s 1300 nm LED products  
is < 1dB, as specified in this data  
sheet.  
• Over the specified operating  
voltage and temperature ranges.  
• With HALT Line State, (12.5 MHz  
square-wave), input signal.  
• At the end of one meter of noted  
optical fiber with cladding modes  
removed.  
The average power value can be  
converted to a peak power value by  
adding 3 dB. Higher output optical  
power transmitters are available on  
special request.  
Information–Data Link Jitter Per-  
formance Section of this data sheet  
for further details.  
19. Data Dependent Jitter contributed by  
the transmitter is specified with the  
FDDI test pattern described in FDDI  
PMD Annex A.5. See Application  
Information–Data Link Jitter  
Performance Section of this data  
sheet for further details.  
20. Random Jitter contributed by the  
transmitter is specified with an IDLE  
Line State, 125 MBd (62.5 MHz  
square-wave), input signal. See  
Application Information–Data Link  
Jitter Performance Section of this  
data sheet for further details.  
21. This specification is intended to  
indicate the performance of the  
receiver when Input Optical Power  
signal characteristics are present per  
the following definitions. The Input  
Optical Power dynamic range from  
the minimum level (with a window  
time-width) to the maximum level is  
the range over which the receiver is  
guaranteed to provide output data  
load R = 10 k.  
L
6. This value is measured with the out-  
puts terminated into 50 connected  
to V - 2 V and an Input Optical  
CC  
Power level of -14 dBm average.  
7. The power dissipation value is the  
power dissipated in the transmitter  
and receiver itself. Power dissipation  
is calculated as the sum of the  
products of supply voltage and  
currents, minus the sum of the  
products of the output voltages and  
currents.  
14. The Extinction Ratio is a measure of  
the modulation depth of the optical  
signal. The data “0” output optical  
power is compared to the data “1”  
peak output optical power and  
expressed as a percentage. With the  
transmitter driven by a HALT Line  
State (12.5 MHz square-wave) signal,  
the average optical power is  
8. This value is measured with respect to  
V
CC  
with the output terminated into  
measured. The data “1” peak power is  
then calculated by adding 3 dB to the  
measured average optical power. The  
data “0” output optical power is  
found by measuring the optical  
power when the transmitter is driven  
by a logic “0” input. The extinction  
ratio is the ratio of the optical power  
at the “0” level compared to the  
optical power at the “1” level  
expressed as a percentage or in  
50 connected to V - 2 V.  
with a Bit-Error-Ratio (BER) better  
than or equal to 2.5 x 10  
CC  
-10  
9. The output rise and fall times are  
measured between 20% and 80%  
levels with the output connected to  
.
• At the Beginning of Life (BOL).  
• Over the specified operating  
voltage and temperature ranges.  
• Input symbol pattern is the FDDI  
test pattern defined in FDDI PMD  
Annex A.5 with 4B/5B NRZI  
V
CC  
- 2 V through 50 .  
10. Duty Cycle Distortion contributed by  
the receiver is measured at the 50%  
threshold using an IDLE Line State,  
125 MBd (62.5 MHz square-wave),  
input signal. The input optical power  
encoded data that contains a duty-  
cycle base-line wander effect of  
187  
50 kHz. This sequence causes a near  
worst-case condition for inter-  
symbol interference.  
• Receiver data window time-width is  
2.13 ns or greater and centered at  
mid-symbol. This worst-case  
window time-width is the minimum  
allowed eye-opening presented to  
the FDDI PHY PM_Data indication  
input (PHY input) per the example  
in FDDI PMD Annex E. This  
minimum window time-width of  
2.13 ns is based upon the worst-  
case FDDI PMD Active Input  
Interface optical conditions for  
peak-to-peak DCD (1.0 ns), DDJ  
(1.2 ns) and RJ(0.76 ns) presented  
to the receiver.  
To test a receiver with the worst-case  
FDDI PMD Active Input jitter  
components through their  
superposition (DCD and DDJ are  
directly additive and RJ components  
are rms additive). Specifically, when  
a nearly ideal input optical test signal  
is used and the maximum receiver  
peak-to-peak jitter contributions of  
DCD (0.4 ns), DDJ (1.0 ns), and RJ  
(2.14 ns) exist, the minimum window  
time-width becomes 8.0 ns - 0.4 ns -  
1.0 ns - 2.14 ns = 4.46 ns, or  
conservatively 4.6 ns. This wider  
window time-width of 4.6 ns  
has been asserted. See Figure 12 for  
more information.  
25. This value is measured during the  
transition from high to low levels of  
input optical power. The maximum  
value will occur when the input  
optical power is either -45 dBm  
average or when the input optical  
-2  
power yields a BER of 10 or better,  
whichever power is higher.  
26. Signal Detect output shall be  
deasserted, logic-low (V ), within  
OL  
350 µs after a step decrease in the  
Input Optical power from a level  
which is the lower of -31 dBm or P  
guarantees the FDDI PMD Annex E  
minimum window time-width of 2.13  
ns under worst-case input jitter  
conditions to the Hewlett-Packard  
receiver.  
D
+ 4 dB (P is the power level at  
D
which Signal Detect was de-asserted),  
to a power level of -45 dBm or less.  
This step decrease will have occurred  
in less than 8 ns. The receiver output  
22. All conditions of Note 21 apply  
except that the measurement is made  
at the center of the symbol with no  
window time-width.  
23. This value is measured during the  
transition from low to high levels of  
input optical power.  
condition requires exacting control  
over DCD, DDJ, and RJ jitter  
-2  
will have a BER of 10 or better for a  
period of 12 µs or until signal detect  
is de-asserted. The input data stream  
is the Quiet Line State. Also, Signal  
Detect will be de-asserted within a  
maximum of 350 µs after the BER of  
the receiver output degrades above  
components that is difficult to  
implement with production test  
equipment. The receiver can be  
equivalently tested to the worst-case  
FDDI PMD input jitter conditions and  
meet the minimum output data  
window time-width of 2.13 ns. This is  
accomplished by using a nearly ideal  
input optical signal (no DCD,  
insignificant DDJ and RJ) and  
measuring for a wider window time-  
width of 4.6 ns. This is possible due  
to the cumulative effect of jitter  
24. The Signal Detect output shall be  
asserted, logic-high (V ), within  
OH  
100 µs after a step increase of the  
Input Optical Power. The step will be  
from a low Input Optical Power,  
-45 dBm, into the range between  
-2  
10 for an input optical data stream  
that decays with a negative ramp  
function instead of a step function.  
See Figure 12 for more information.  
greater than P , and -14 dBm. The  
A
BER of the receiver output will be  
-2  
10 or better during the time,  
LS_Max (15 µs) after Signal Detect  
188  

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