HLMP-E400 [AGILENT]
Visible LED, Clear;型号: | HLMP-E400 |
厂家: | AGILENT TECHNOLOGIES, LTD. |
描述: | Visible LED, Clear 光电 |
文件: | 总8页 (文件大小:209K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
T-1 (3 mm) Auto Insertable
LED Lamps
Technical Data
HLMP-E100
HLMP-E200
HLMP-E300
HLMP-E400
HLMP-E500
HLMP-E150
HLMP-E250
HLMP-E350
HLMP-E450
HLMP-E550
Features
• T-1 Auto Insertable
• High Light Output
• Tinted Diffused and Tinted
Non-Diffused Lens Options
Description
This family of 3 mm LED Lamps is
specially designed for automatic
insertion and wave soldering
processes.
• Wide Viewing Angle
• Variety of Colors
• Available with Straight
Lead Tape and Reel Options
or in Bulk
Designed with a thick epoxy
flange, it is ideal for flush mount
auto insertion.
Applications
• General Purpose
• High Volume Manufacturing
Device Selection Guides
Part Number
Color
Package
Luminous Intensity
Typical Viewing Angle
[1]
1
Diff. Tint Iv (mcd @ 20 mA) Typ.
(Degrees) 2θ
/
2
HLMP-E100
HLMP-E150
HLMP-E200
HLMP-E250
AS AlGaAs Red
Orange
X
X
X
X
X
X
X
X
X
42
110
22
28
60
45
60
45
HLMP-E300
HLMP-E350
HLMP-E400
HLMP-E450
HLMP-E500
HLMP-E550
High Efficiency Red
(HER)
X
X
X
X
X
X
12
38
15
27
28
48
60
45
60
45
60
45
Yellow
High Performance
Green
Note:
1. 2θ
1
2 is the off axis angle where the luminous intensity is 1/2 the on axis intensity.
/
2
Package Dimensions
1.0 MIN.
5.85 ± 0.5
23.0 MIN.
3.5 ± 0.3
CATHODE MARKS
0.65 MAX.
0.44 ± 0.2
4.4 ± 0.3
2.54 ± 0.3
3.1 ± 0.2
+ 0.1
– 0.04
0.45
+ 0.1
– 0
0.4
2.0
3.4 ± 0.2
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. ALL EPOXY MENISCUS MAY EXTEND ABOUT 0.8 mm (0.030 in.)
DOWN THE LEADS.
Absolute Maximum Ratings at TA = 25 ºC
High
Efficiency Red
and Orange
High
Performance
Green
Parameter
Yellow
AS AlGaAs
Red
Units
DC Forward Current
Reverse Voltage
30
20
30
30
mA
V
5
(Ir = 100 µA)
Junction Temperature,
Tjmax
110
°C
°C
°C
Storage Temperature
Range
Operating Temperature
Range
-40 to +85
-20 to +85
-40 to +85
Lead Soldering
A) DIP/DRAG Soldering: 260 °C for 5 seconds
Temperature
B) Wave Solder Temperature: 245 °C for 3 seconds
[1.6 mm (0.063 in.)
from seating plane]
Notes:
1. See Figure 4 for maximum current derating vs. ambient temperature.
2. Suggested minimum DC current: 10 mA
3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.
3
Electrical Characteristics at TA = 25 ºC
Forward
Voltage
Vf (Volts)
Capacitance
Thermal
Resistance RθJ-PIN
(°C/W)
Speed of Response
τs (ns)
C (pF)
Vf = 0,
f = 1 MHz
Typ.
Part Number
Time Constant
e-t/τs
Typ.
1.80
1.90
1.90
2.00
2.10
Max. If (mA)
Typ.
HLMP-E1XX
HLMP-E2XX
HLMP-E3XX
HLMP-E4XX
HLMP-E5XX
2.2
2.4
2.4
2.4
2.7
20
10
10
10
10
30
4
11
15
18
290
290
290
290
290
30
280
90
90
500
Optical Characteristics at TA = 25 ºC
Luminous
Intensity
lv (mcd)[1]
Peak
Color
Dominant
Wavelength
λd[2] (nm)
Typ.
Spectral
Half
Width
Typ.
Luminous
Wavelength
λ peak (nm)
Typ.
Efficacy
[3]
Part Number
ηv
(lm/W)
Min.
13.8
35.2
5.4
Typ. If (mA)
HLMP-E100
HLMP-E150
HLMP-E200
HLMP-E250
HLMP-E300
HLMP-E350
HLMP-E400
HLMP-E450
HLMP-E500
HLMP-E550
42
110
22
28
12
38
15
27
28
48
20
20
10
10
10
10
10
10
10
10
645
600
635
583
565
637
604
626
585
570
27
37
40
36
28
80
380
145
500
595
13.8
8.6
13.8
9.2
14.7
10.6
17
Notes:
1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern
may not be aligned with this axis.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.
3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/ηv, where lv is the luminous intensity in
candelas and ηv is the luminous efficacy in lumens/watt.
4
HIGH BRIGHTNESS LAMPS
1.0
AlGaAs RED
0.5
0
550
600
650
700
WAVELENGTH – nm
HIGH EFFICIENCY LAMPS
ORANGE
1.0
HIGH
PERFORMANCE
GREEN
HIGH
EFFICIENCY
RED
0.5
YELLOW
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Peak Wavelength.
HIGH BRIGHTNESS LAMPS
70
HIGH EFFICIENCY LAMPS
GREEN
90
80
70
60
50
60
50
As AlGaAs RED
40
30
20
10
0
YELLOW
HIGH
40
30
20
10
0
EFFICIENCY
RED/ORANGE
1.0
1.5
2.0
2.5
3.0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
– FORWARD VOLTAGE – V
V
– FORWARD VOLTAGE – V
V
F
F
Figure 2. Forward Current vs. Forward Voltage.
5
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN
HIGH BRIGHTNESS LAMPS
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
2.0
1.5
1.0
As AlGaAs
0.5
0
0
5
10
15
20
25
30
0
10
20
30
40
I
– DC CURRENT PER LED – mA
I
– DC FORWARD CURRENT – mA
DC
F
Figure 3. Relative Luminous Intensity vs. Forward Current.
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN
As AlGaAs RED
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
HER, ORANGE,
GREEN
Rθ = 470° C/W
JA
Rθ = 300° C/W
JA
Rθ = 559° C/W
JA
YELLOW
Rθ = 689° C/W
JA
Rθ = 705° C/W
JA
0
0
0
20
40
60
80
0
20
40
60
80
T
– AMBIENT TEMPERATURE – °C
A
T
– AMBIENT TEMPERATURE – °C
A
Figure 4. Maximum Forward DC Current vs. Ambient Temperature.
6
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative Spatial Radiation Pattern for 45°Viewing Angle.
Taping Options
Straight Lead
Option
#002
#2CA
#2CD
Dimension “B”
Dimension “H”
–
–
–
20.5 ± 1.0
18.0 ± 1.0
20.5 ± 1.0
(0.81 ± 0.04)
(0.71 ± 0.04)
(0.81 ± 0.04)
Units: mm (inches)
Tape Outline Drawing
0.0 ± 1.0
(0.00 ± 0.04)
0.0 ± 1.0
(0.00 ± 0.04)
6.4 ± 1.3
(0.25 ± 0.05)
12.7 ± 1.0
(0.50 ± 0.04)
CATHODE
LEAD
5.1 ± 0.7
(0.20 ± 0.03)
1.5 (0.06) MAX.
DIMENSION "H"
(SEE TABLE)
2.5 (0.10) MAX.
11.0
(0.43)
MAX.
9.1 ± 0.6
(0.36 ± 0.03)
14.0 ± 1.7
(0.55 ± 0.07)
18.0 ± 1.0
(0.71 ± 0.04)
2.5 ± 0.3
(0.10 ± 0.01)
A
A
4.0 ± 0.2
(0.16 ± 0.01)
TYP.
12.7 ± 0.3
(0.50 ± 0.01)
VIEW A–A
0.7 ± 0.2
(0.03 ± 0.01)
STRAIGHT LEAD
7
Package Options
Lead Option Ammo Pack (1000 pcs.) Tape & Reel (2000 pcs.)
Recommended Assembly
Condition
• A single-sided phenolic printed
circuit board (PCB) is preferred.
Double-sided PCB and other
materials may cause greater
lead stress. Recommended
Straight Lead
#2C
#002
—
through-hole diameter is 0.9 to
2.0 mm. Leadlength below the
PCB should be 1.5 to 2.0 mm,
and the clinching angle (angle
between the lead and PCB)
should be 30 ± 10 degrees.
OPERATOR .........
HP PART # ...........
DATE CODE ........
TAPING DATE .....
BIN .......................
NO. OF GAPS .....
QUANTITY ..........
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE IS FACING
UPWARD.
• If SMT devices and an adhesive
are used on the same pcb as
these lamps, the adhesive should
be cured before the lamps are
auto-inserted. If curing must
be done after lamp insertion,
the cure temperature and time
should not exceed 140°C,
140 (5.51)
+
A
C
ANODE
LEDS
–
CATHODE
MADE IN MALAYSIA
ANODE LEAD LEAVES
THE BOX FIRST.
100 seconds. This is the
temperature of the surface
normal to the IR source.
336 (13.23)
52 (2.05)
Solder Condition:
DIMENSIONS IN MILLIMETERS (INCHES).
Preheat: Temperature ramp
rate of 2 to 4°C per second.
Do not exceed 150°C delta
temperature between preheat
and solder temperatures. The
maximum time at preheat
should not exceed 10 seconds.
AMMO PACK (for All options except #002)
REELING ORIENTATION
CLOCKWISE
ADHESIVE TAPE MUST BE
FACING TOWARDS THE
OUTSIDE OF THE REEL.
Solder: 245°C maximum,
3 seconds (1.6 mm below
seating plane).
ANODE LEAD LEAVES
THE REEL FIRST.
110 (4.33) DIA.
PROTECTIVE
CARDBOARD
336 (13.23) DIA.
DIMENSIONS IN MILLIMETERS (INCHES).
TAPE & REEL (for option #002 only)
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
June 29, 2001
5968-4402E
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