HSDL3208
更新时间：2024-09-18 02:07:14
品牌：AGILENT
描述：Ultra Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver
概述
数据手册HSDL3208 概述
Ultra Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver 超小的外形封装IrDA数据标准低功率115.2 kbit / s的红外收发器
HSDL3208 数据手册
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PDF下载Agilent HSDL-3208
Ultra Small Profile Package
®
IrDA Data Compliant Low Power
115.2 kbit/s Infrared Transceiver
Data Sheet
Features
• Fully compliant to IrDA 1.4 low power
specification from 9.6 kbit/s to
115.2 kbit/s
• Miniature package
– Height: 1.60 mm
– Width: 7.00 mm
– Depth: 2.8 mm
• Guaranteed temperature performance,
-25 to +85°C
– Critical parameters are
guaranteed over temperature
and supply voltage
• Low power consumption
– Low shutdown current (1 nA typical)
– Complete shutdown of TXD, RXD,
and PIN diode
• Withstands >100 mVp-p power supply
ripple typically
• Excellent EMI performance without
shield
Description
The HSDL-3208 is an ultra-small
low cost infrared transceiver
The HSDL-3208 can be shut
down completely to achieve very
low power consumption. In the
shutdown mode, the PIN diode
will be inactive and thus produc-
ing very little photocurrent even
under very bright ambient light.
Such features are ideal for bat-
tery operated handheld products.
module that provides the interface
between logic and infrared (IR)
signals for through air, serial, half-
duplex IR data link. The module is
compliant to IrDA Physical Layer
Specifications version 1.4 Low
Power from 9.6 kbit/s to 115.2
kbit/s with extended link distance
and it is IEC 825-Class 1 eye safe.
• V supply 2.7 to 3.6 volts
CC
• LED stuck-high protection
• Designed to accommodate light loss
with cosmetic windows
V
• IEC 825-class 1 eye safe
CC
CX2
CX1
Applications
• IRFM
• Mobile telecom
– Cellular phones
– Pagers
V
(6)
GND (7)
CC
– Smart phones
SD (5)
• Data communication
– PDAs
RXD (4)
– Portable printers
• Digital imaging
HSDL-3208
– Digital cameras
– Photo-imaging printers
TXD (3)
LED C (2)
TRANSMITTER
R1
V
CC
LED A (1)
7
6
5
4
3
2
1
Figure 1. Functional block diagram of HSDL-3208.
Figure 2. Rear view diagram with pinout.
Application Support Information
associated with HSDL-3208
infrared transceiver module. You
can contact them through your
local Agilent sales representatives
for additional details.
The Application Engineering
group in Agilent Technologies is
available to assist you with the
technical understanding
Order Information
Part Number
Packaging Type
Tape and Reel
Package
Quantity
HSDL-3208-021
Front View
2500
I/O Pins Configuration Table
Pin
Symbol
LED A
LED C
TXD
Description
I/O Type
Notes
1
LED Anode
Input
1
2
3
4
5
6
7
2
LED Cathode
Transmit Data
Receive Data
Shutdown
Input
3
Input, Active High
Output, Active Low
Input, Active High
Supply Voltage
Ground
4
RXD
5
SD/Mode
6
V
CC
Supply Voltage
Ground
7
GND
Notes:
1. This pin can be connected directly to V (i.e. without series resistor) at less than 3 V.
CC
2. Internally connected to the LED driver.
3. This pin is used to transmit serial data when SD pin is low. Do not float the pin.
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state
mode when the transceiver is in shutdown mode.
5. The transceiver is in shutdown mode if this pin is high. Do not float the pin.
6. Regulated, 2.7 to 3.6 volts.
7. Connect to system ground.
Recommended Application Circuit Components
Component
R1
Recommended Value
Notes
2.7 Ω ± 5%, 0.25 Watt for 2.7 <= V <= 3.6 V
CC
CX1
0.47 µF ± 20%, X7R Ceramic
6.8 µF ± 20%, Tantalum
8
9
CX2
Notes:
8. CX1 must be placed within 0.7 cm of the HSDL-3208 to obtain optimum noise immunity.
9. In environments with noisy power supplies, supply rejection performance can be enhanced
by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1.
2
CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s
susceptibility to damage from the electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or degradation
which may be induced by ESD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ _50°C/W.
Parameter
Symbol
Min.
-40
-25
0
Max.
+100
+85
6.5
Units
°C
°C
V
Notes
Storage Temperature
Operating Temperature
LED Anode Voltage
T
T
S
A
V
V
V
V
LEDA
Supply Voltage
0
6.5
V
CC
I
Input Voltage: TXD, SD/Mode
Output Voltage: RXD
DC LED Transmit Current
Peak LED Transmit Current
0
6.5
V
0
6.5
V
O
I
I
(DC)
50
mA
mA
LED
LED
(PK)
250
10
Note:
10. ≤ 20% duty cycle, ≤ 90 µs pulse width.
Recommended Operating Conditions
Parameter
Symbol Min.
Typ. Max.
Units
Conditions
Operating Temperature
Supply Voltage
T
-25
2.7
2/3 V
0
+85
3.6
°C
V
A
V
CC
IH
IL
Logic Input Voltage Logic High
V
V
V
CC
V
CC
for TXD, SD/Mode
Logic Low
1/3 V
500
1
V
CC
2
[11]
Receiver Input
Irradiance
Logic High EI
Logic Low EI
0.0081
mW/cm For in-band signals ≤ 115.2kbit/s
H
L
2
[11]
µW/cm
For in-band signals
LED (Logic High) Current
Pulse Amplitude
I
50
mA
LEDA
Receiver Data Rate
9.6
115.2
kbit/s
Note:
11. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 ≤ λp ≤ 900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4.
3
Electrical & Optical Specifications
Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25 °C with V set
CC
to 3.0 V unless otherwise noted.
Parameter
Symbol Min.
Typ. Max.
Units
Conditions
Receiver
Viewing Angle
Peak Sensitivity Wavelength
2θ
30
°
λ
V
V
880
nm
V
p
2
RXD Output
Voltage
Logic High
Logic Low
V -0.2
CC
V
I
I
= -200 µA, EI ≤ 1 µW/cm
OH
OL
PW
CC
OH
OL
2
0
0.4
4.0
V
= 200 µA, EI ≥ 8.1 µW/cm
°
RXD Pulse Width (SIR)
RXD Rise and Fall Times
Receiver Latency Time
Receiver Wake Up Time
Transmitter
t
(SIR) 1
µs
ns
µs
µs
θ ≤ 15 , C =12 pF
L
t , t
r
50
70
90
C =12 pF
L
f
t
t
L
W
°
Radiant Intensity
IE
4
8
mW/sr
I
= 50 mA, θ ≤ 15 , V
≥ V
IH
H
LEDA
TXD
T = 25°C
Viewing Angle
2θ
30
60
°
Peak Wavelength
Spectral Line Half Width
TXD Input Current High
Low
λ
875
35
nm
nm
µA
µA
mA
nA
µs
µs
ns
V
p
∆λ
I
I
I
I
t
t
0.02 10
-0.02 10
50
V ≥ V
I IH
H
L
-10
0 ≤ V _≤ V
I IL
LED Current
On
V (TXD) ≥ V , V (SD) ≤ V
I IH I IL
VLED
VLED
Shutdown
20
1.6
25
100
V (SD) ≥ V
I IH
Optical Pulse Width (SIR)
Maximum Optical PW
(SIR) 1.5
1.8
100
600
1.5
t
(TXD) = 1.6 µs at 115.2 kbit/s
PW
PW
PW(max.)
TXD Rise and Fall Time (Optical) t , t
tpw (TXD) = 1.6 µs
= 50 mA, V (TXD) ≥ V
IH
r
f
LED Anode on State Voltage
V
(LEDA)
I
LEDA
ON
I
Transceiver
Supply Current
Shutdown
Idle
I
I
0.001
100
1
µA
µA
V
≥ 2/3 IO V T = 25°C
CC1
CC2
SD CC, A
200
V (TXD) ≤ V , EI = 0
I IL
4
t
pw
t
pw
V
LED ON
OH
90%
50%
10%
90%
50%
10%
V
OL
LED OFF
t
t
r
f
t
t
f
r
Figure 3. RXD output waveform.
Figure 4. LED optical waveform.
SD
TXD
LED
RX
LIGHT
RXD
t
pw (MAX.)
t
RW
Figure 5. TXD "stuck on" protection waveform.
Figure 6. Receiver wakeup time waveform.
SD
TXD
TX
LIGHT
t
TW
Figure 7. TXD wakeup time waveform.
AVE. TXD RADIANT INTENSITY vs. AVE. TXD ILED_A,
AVE. TXD ILED_A vs. AVE. TXD VLED_A,
TEMPERATURE = 25°C
100.0E-3
TEMPERATURE = 25°C
21
19
17
90.0E-3
80.0E-3
70.0E-3
60.0E-3
50.0E-3
15
13
11
9
7
40.0E-3
45.0E-3
65.0E-3
85.0E-3
105.0E-3
1.44 1.46 1.48 1.50 1.52 1.54 1.56 1.58 1.60
AVE. TXD ILED_A (A)
AVE. TXD VLED_A (V)
Figure 8. LOP vs. I
.
Figure 9. V
vs. I
.
LED
LED
LED
5
Package Dimensions
7.00 ± 0.10
1.60 ± 0.10
0.80
0.95
5.10
0.95
R 1.10
R 1.10
2.80
1.60
0.80
LED A LED C TXD RXD SD
V
GND
CC
0.95 (6X)
0.60 (7X)
0.34 (5X)
0.40 (2X)
Figure 10. Package outline dimensions.
6
Tape and Reel Dimensions
4.0 ± 0.1
+ 0.1
UNIT: mm
1.75 ± 0.1
1.5
2.0 ± 0.1
0
POLARITY
PIN 7: GND
7.5 ± 0.1
16.0 ± 0.2
7.35 ± 0.1
2.93 ± 0.1
PIN 1: LED A
0.3 ± 0.05
1.78 ± 0.1
4.0 ± 0.1
PROGRESSIVE DIRECTION
EMPTY
PARTS MOUNTED
LEADER
(400 mm MIN.)
(40 mm MIN.)
EMPTY
(40 mm MIN.)
OPTION # "B" "C" QUANTITY
021
178 60
2500
UNIT: mm
DETAIL A
2.0 ± 0.5
B
C
13.0 ± 0.5
R 1.0
LABEL
21 ± 0.8
DETAIL A
+ 2
0
16.4
2.0 ± 0.5
Figure 11. Tape and reel dimensions.
7
Moisture Proof Packaging
Baking Conditions
All HSDL-3208 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 4.
Package
In reels
In bulk
Temp.
60°C
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
100°C
125°C
150°C
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Baking should only be done once.
Recommended Storage Conditions
PACKAGE IS
OPENED (UNSEALED)
Storage
10°C to 30°C
Temperature
Relative
Humidity
below 60% RH
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
Time from Unsealing to Soldering
YES
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO BAKING
IS NECESSARY
YES
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
NO
Figure 12. Baking conditions chart.
8
Reflow Profile
MAX. 245°C
R3 R4
230
200
183
170
R2
150
90 sec.
MAX.
ABOVE
183°C
125
100
R1
R5
50
25
0
50
100
150
200
250
300
t-TIME (SECONDS)
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
Figure 13. Reflow graph.
Process Zone
Heat Up
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
∆T
Maximum ∆T/∆time
4°C/s
25°C to 125°C
125°C to 170°C
Solder Paste Dry
Solder Reflow
0.5°C/s
170°C to 230°C (245°C at 10 seconds max.)
230°C to 170°C
4°C/s
–4°C/s
Cool Down
170°C to 25°C
–3°C/s
The reflow profile is a straight-
line representation of a nominal
temperature profile for a
Process zone P2 should be of
sufficient time duration (>60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170°C
(338°F).
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170°C (338°F), to allow
the solder within the connections
to freeze solid.
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different ∆T/∆time tempera-
ture change rates. The ∆T/∆time
rates are detailed in the above
table. The temperatures are
measured at the component to
printed circuit board connections.
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230°C (446°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25°C (77°F) should not exceed
-3°C per second maximum. This
limitation is necessary to allow
the PC board and transceiver’s
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the
In process zone P1, the PC
board and transceiver’s castella-
tion I/O pins are heated to a
temperature of 125°C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4°C per second to allow
for even heating of both the PC
board and transceiver’s
transceiver.
castellation I/O pins.
9
Appendix A : SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal
Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND
PATTERN
SOLDER
MASK
PCBA
Figure 14. Stencil and PCBA.
1.1 Recommended Land Pattern
C
L
MOUNTING
CENTER
0.10
0.775
1.75
FIDUCIAL
0.60
0.95
1.9
UNIT: mm
2.85
Figure 15. Stencil and PCBA.
10
APERTURES AS PER
LAND DIMENSIONS
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
t
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
w
l
thickness that should be used.
Figure 16. Solder stencil aperture.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
Aperture size(mm)
Stencil thickness, t (mm)
0.152 mm
length, l
width, w
2.60 ± 0.05
3.00 ± 0.05
0.55 ± 0.05
0.55 ± 0.05
0.127 mm
7.2
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
0.2
2.6
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
SOLDER MASK
3.0
UNITS: mm
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 17. Adjacent land keepout and solder mask areas.
11
Appendix B: PCB Layout Suggestion
Refer to the diagram below for
an example of a 4-layer board.
The HSDL-3208 is a shieldless part
and hence does not contain a shield
trace, unlike the other transceivers.
The following PCB layout guide-
lines should be followed to obtain a
good PSRR and EM immunity,
resulting in good electrical
The area underneath the module at
the second layer, and 3 cm in all
directions around the module, is
defined as the critical ground plane
zone. The ground plane should be
maximized in this zone. Refer to
application note AN1114 or the
Agilent IrDA Data Link Design
Guide for details. The layout below
is based on a 2-layer PCB.
performance. Things to note:
1. The AGND pin should be
connected to the ground plane.
2. C1 and C2 are optional supply
filter capacitors; they may be left
out if a clean power supply is
used.
TOP LAYER
CONNECT THE METAL SHIELD AND MODULE
GROUND PIN TO BOTTOM GROUND LAYER.
3. VLED can be connected to either
unfiltered or unregulated power
LAYER 2
supply. If VLED and V share
CC
CRITICAL GROUND PLANE ZONE. DO NOT
CONNECT DIRECTLY TO THE MODULE
GROUND PIN.
the same power supply and C1 is
used, the connection should be
before the current limiting
LAYER 3
KEEP DATA BUS AWAY FROM CRITICAL
GROUND PLANE ZONE.
resistor R2. In a noisy environ-
ment, including capacitor C2 can
enhance supply rejection. C1 is
generally a ceramic capacitor of
low inductance providing a wide
frequency response while C2 is a
tantalum capacitor of big volume
and fast frequency response. The
use of a tantalum capacitor is
BOTTOM LAYER (GND)
more critical on the V
line,
LED
which carries a high current.
4. Preferably a multi-layered board
should be used to provide
sufficient ground plane. Use the
layer underneath and near the
transceiver module as V , and
CC
sandwich that layer between
ground connected board layers.
Top View
Bottom View
Figure 18. PCB layout suggestion.
12
Appendix C : General Application
Guide for the HSDL-3208 Infrared
IrDA Compliant 115.2 kb/s
power specification from 9.6 kb/s
to 115.2 kb/s, and supports HP-
SIR and TV Remote modes. The
design of the HSDL-3208 also
includes the following unique
features:
Interface to Recommended I/O Chips
The HSDL-3208’s TXD data input
is buffered to allow for CMOS
drive levels. No peaking circuit or
capacitor is required.
®
Transceiver
Description
Data rate from 9.6 kb/s up to
115.2 kb/s is available at the RXD
pin.
The HSDL-3208 is an ultra-small
low-cost infrared transceiver
module that provides the interface • Shutdown mode for low power
• Low passive component count
between logic and infrared (IR)
signals for through air, serial,
half-duplex IR data link. The
device is designed to address the
mobile computing market such as
PDAs, as well as small embedded
mobile products such as digital
cameras and cellular phones. It is
fully compliant to IrDA 1.4 low
consumption requirement
The diagram below shows how
the IR port fits into the mobile
phone platform and PDA
platform.
Selection of Resistor R1
Resistor R1 should be selected to
provide the appropriate peak
pulse LED current over different
ranges of V as shown in the
CC
table below.
Minimum Peak Pulse
LED Current
Recommended R1
V
Intensity
9 mW/Sr
CC
2.7 Ω
3.3 V
50 mA
SPEAKER
AUDIO INTERFACE
DSP CORE
MICROPHONE
ASIC
CONTROLLER
RF INTERFACE
TRANSCEIVER
MOD/
DE-MODULATOR
IR
MICROCONTROLLER
USER INTERFACE
HSDL-3208
Figure 19: IR layout in mobile phone platform.
13
LCD
PANEL
RAM
ROM
IR
HSDL-3208
CPU
FOR EMBEDDED
APPLICATION
PCMCIA
CONTROLLER
TOUCH
PANEL
RS232C
DRIVER
COM
PORT
Figure 20: IR layout in PDA platform.
The link distance testing is done
using typical HSDL-3208 units
with National Semiconductor’s
PC87109 3V Super I/O Controller
and SMC’s FDC37C669 and
FDC37N769 Super I/O
controllers. An 115.2 kb/s
datarate IR link distance of up to
40 cm has been demonstrated.
14
Appendix D: Window Designs for HSDL-3208
Optical port dimensions for
HSDL-3208:
from the HSDL-3208 to the back of
comparable, Z' replaces Z in the
above equation. Z' is defined as
the window. The distance from the
center of the LED lens to the
center of the photodiode lens, K, is
5.1 mm. The equations for
computing the window dimensions
are as follows:
To ensure IrDA compliance, some
constraints on the height and width
of the window exist. The minimum
dimensions ensure that the IrDA
cone angles are met without
Z' = Z + t/n
where ‘t’ is the thickness of the
window and ‘n’ is the refractive
index of the window material.
vignetting. The maximum
X = K + 2 (Z + D) tanA
*
*
dimensions minimize the effects of
stray light. The minimum size
corresponds to a cone angle of 30°
and the maximum size corresponds
to a cone angle of 60°.
The depth of the LED image inside
the HSDL-3208, D, is 3.17 mm.
‘A’ is the required half angle for
viewing. For IrDA compliance, the
minimum is 150 and the maximum
is 300. Assuming the thickness of
the window to be negligible, the
equations result in the following
tables and graphs:
Y = 2 (Z + D) tanA
*
*
The above equations assume that
the thickness of the window is
negligible compared to the
distance of the module from the
back of the window (Z). If they are
In the figure below, X is the width
of the window, Y is the height of
the window and Z is the distance
OPAQUE
IR TRANSPARENT WINDOW
MATERIAL
Y
X
K
IR TRANSPARENT
WINDOW
OPAQUE
MATERIAL
Z
A
D
Figure 21. Window design diagram.
15
Module Depth
Aperture Width (x, mm)
Aperture Height (y, mm)
(z) mm
Max.
8.76
Min.
6.80
Max.
3.66
Min.
1.70
2.33
2.77
3.31
3.84
4.38
4.91
5.45
5.99
6.52
0
1
2
3
4
5
6
7
8
9
9.92
7.33
4.82
11.07
12.22
13.38
14.53
15.69
16.84
18.00
19.15
7.87
5.97
8.41
7.12
8.94
8.28
9.48
9.43
10.01
10.55
11.09
11.62
10.59
11.74
12.90
14.05
APERTURE WIDTH (X) vs. MODULE DEPTH
25
APERTURE HEIGHT (Y) vs. MODULE DEPTH
16
14
12
10
8
20
15
10
6
4
X MAX.
X MIN.
5
Y MAX.
Y MIN.
2
0
0
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
MODULE DEPTH (Z) – mm
MODULE DEPTH (Z) – mm
Figure 22. Aperture width (X) vs. module depth.
Figure 23. Aperture height (Y) vs. module depth.
16
Window Material
Shape of the Window
radiation pattern is dependent
upon the material chosen for the
window, the radius of the front and
back curves, and the distance from
the back surface to the transceiver.
Once these items are known, a lens
design can be made which will
eliminate the effect of the front
surface curve.
Almost any plastic material will
work as a window material.
From an optics standpoint, the
window should be flat. This
ensures that the window will not
alter either the radiation pattern of
the LED, or the receive pattern of
the photodiode.
Polycarbonate is recommended.
The surface finish of the plastic
should be smooth, without any
texture. An IR filter dye may be
used in the window to make it look
black to the eye, but the total
optical loss of the window should
be 10% or less for best optical
performance. Light loss should be
measured at 875 nm.
If the window must be curved for
mechanical or industrial design
reasons, place the same curve on
the back side of the window that
has an identical radius as the front
side. While this will not completely
eliminate the lens effect of the
front curved surface, it will
The following drawings show the
effects of a curved window on the
radiation pattern. In all cases, the
center thickness of the window is
1.5 mm, the window is made of
polycarbonate plastic, and the
distance from the transceiver to
the back surface of the window is
3 mm.
The recommended plastic
materials for use as a cosmetic
window are available from General
Electric Plastics.
significantly reduce the effects.
The amount of change in the
Recommended Plastic Materials:
Material
Number
Light
Transmission
Haze
Refractive
Index
Lexan 141L
Lexan 920A
Lexan 940A
88%
85%
85%
1%
1%
1%
1.586
1.586
1.586
Note: 920A and 940A are more flame retardant than 141L.
Recommended Dye: Violet #21051 (IR transmissant above 625 nm).
Flat Window
(First Choice)
Curved Front and Back
(Second Choice)
Curved Front, Flat Back
(Do Not Use)
Figure 24. Shape of windows.
17
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/Interna-
tional), or 0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
October 9, 2002
5988-7857EN
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