HSMB-HR00-R1T20 [AGILENT]
Single Color LED, Red, Clear, 2.4mm;
| 型号： | HSMB-HR00-R1T20 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Single Color LED, Red, Clear, 2.4mm 光电 |
| 文件： | 总8页 (文件大小：144K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High-Flux Surface Mount LED
Technical Data
HSMB-HR00-R1T20
HSMB-HA00-R1T2H
Features
• High-Flux Device
Description
The HSMB-HX00 device is
designed for applications
• Improved Reliability
Through Elimination of
Internal Wire Bond
requiring high-flux in surface
mount designs. The product is
ideal for telltale backlighting in
automotive instrument clusters,
LCD backlighting, or general
status indication. The high light
output lowers the cost of lighting
by reducing the number of LEDs
required for any application.
• -55°C to 110°C Operating
Temperature Range
• Compatible with IR and
Through-the-Wave Solder
Processes
• Available in 8 mm Tape on
178 mm (7”) Reels
The package is compatible with
IR and convective reflow
soldering processes. These parts
are also compatible with
through-the-wave soldering
processes.
The HSMB-HX00 combines high
reliability surface mount flip-chip
LED construction with the
world’s brightest red and amber
LED materials, HP’s TS AlInGaP
material.
Applications
• Telltale Backlighting in
Instrument Clusters
• LCD Backlighting
• General Status Indicators
Device Selection Guide
Part Number
Color
Luminous Intensity Luminous Intensity
Viewing
Angle
(2θ1/2 , Degrees)
Typical Dominant
Wavelength
(nm)
I (mcd)
V
I (mcd)
V
@ I = 20 mA
@ I = 20 mA
F
F
Min.
100
100
Typ.
160
200
HSMB-HR00-R1T20
HSMB-HA00-R1T2H
Notes:
Red 630
120
120
Amber 590
1. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
d
4. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
2
Package Dimensions
3.6
3.4
Ø 2.4
CATHODE MARK
3.1
3.0
2.15
1.75
3.28
3.18
2.8
2.6
0.98
0.68
METAL FOR
SOLDERING
CATHODE MARK
ALL DIMENSIONS IN MILLIMETERS
Absolute Maximum Ratings at T = 25°C for HSMB-HR00/HA00
A
Parameter
Max. Rating
Units
mA
mW
mA
°C
[1]
DC Forward Current
30
100
Power Dissipation (T ≤ 70°C)
A
Average Forward Current
Junction Temperature
30
120
Reverse Voltage (I = 100 µA)
5
V
R
Operating Temperature Range
Storage Temperature Range
-55 to 110
-55 to 110
°C
°C
Note:
1. Derate linearly as shown in Figure 6 for temperatures above 70°C.
3
Optical Characteristics at T = 25°C
A
Color,
Dominant
Luminous
Intensity
Luminous
Intensity
Peak
Wavelength
Wavelength
I (mcd)
I (mcd)
V
V
[2]
Part
λ
(nm)
λ
(nm)
@ I = 20 mA @ I = 20 mA
d
peak
F F
Number
Color
Typ.
Typ.
Min.
100
100
Typ.
160
200
HSMB-HR00-R1T20
Red
630
590
640
594
HSMB-HA00-R1T2H Amber
Note:
2. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the LED.
d
Optical Characteristics at T = 25°C, continued
A
[3]
[3]
Luminous Flux
Luminous Flux
Viewing Angle
(2θ /2, Degrees)
[3]
1
Part
@ 20 mA (mlum)
Min.
@ 20 mA (mlum)
Typ.
Number
Color
Red
Typ.
120
120
HSMB-HR00-R1T20
HSMB-HA00-R1T2H
250
250
400
500
Amber
Note:
3. Luminous flux values are not measured in production.
Electrical Characteristics at T = 25°C
A
Forward
Voltage
V (Volts)
F
Forward
Voltage
V (Volts)
Forward
Voltage
V (Volts)
F
Reverse
Breakdown V
(Volts)
R
F
Part
@ I = 20 mA @ I = 20 mA @ I = 20 mA @ I = 100 µA
F F F R
Number
Color
Red
Min.
1.70
1.90
Typ.
2.30
2.45
Max.
Min.
5.0
HSMB-HR00-R1T20
HSMB-HA00-R1T2H
3.00
3.20
Amber
5.0
Electrical Characteristics at T = 25°C, continued
A
Thermal Resistance
Capacitance C
(pF)
Thermal Resistance
of Device
on PC Board
2
Part
(≥ 4 mm Pad Size, FR4) V = 0, f = 1 MHz
F
Number
Color
Rθ
(°C/W)
Rθ
(°C/W)
Typ.
J-PIN
J-AIR
HSMB-HR00-R1T20
Red
280
280
480
480
25
HSMB-HA00-R1T2H Amber
25
4
Intensity Bin Definitions, HSMB-HR00, HSMB-HA00
(check with HP Sales Engineer for availability of bin selections)
Bin ID
R1
Intensity (mcd)
100.0 – 165.0
130.0 – 200.0
160.0 – 260.0
205.0 – 320.0
250.0 – 410.0
320.0 – 500.0
R2
S1
S2
T1
T2
Color Bin Definitions, HSMB-HA00 only
Bin ID
Dominant Wavelength (nm)
584.0 – 587.5
B
C
D
F
586.5 – 590.0
589.0 – 592.5
Bins B and C
G
H
Bins C and D
Bins B, C and D
Color and Intensity Option Codes
(check with HP Sales Engineer for availability)
HSMB-HX00 XXXXX
Last digit identifies the color bin option
(use 0 for red as there are no red color bins)
First four digits identify the min and max of the
intensity bins
Examples: HSMB-HA00-R1T20
designates HSMB-HA00 with a
178 mm reel, no intensity or
color bin selection
HSMB-HA00-R1S2F
designates HSMB-HA00 with
178 mm reel, intensity bins R1
through S2, and color bin F
5
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
HSMB-HA00 AMBER
HSMB-HR00 RED
0.1
0
525
545
565
585
605
625
645
665
685
705
725
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
220
200
180
160
140
120
100
80
1.80
1.60
1.40
1.20
1.00
0.8
35
30
HSMB-HR00
RED
25
HSMB-HR00
RED
20
15
HSMB-HA00
AMBER
0.6
10
60
0.4
HSMB-HA00
AMBER
40
5
0
0.2
20
0
0
1.7 2.3 2.9 3.5
4.1 4.7 5.3
0
5
10 15 20 25 30 35
1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9
FORWARD VOLTAGE – V
FORWARD CURRENT – mA
FORWARD VOLTAGE – V
Figure 2. Forward Current vs.
Forward Voltage (0 – 30 mA).
Figure 3. Forward Current vs.
Forward Voltage (0 – 200 mA).
Figure 4. Relative I vs. DC Forward
Current (Normalized at 20 mA).
V
35
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
30
550 °C/W
25
650 °C/W
20
15
10
5
0
0
0
20
40
60
80
100
120
-100 -90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90 100
AMBIENT TEMPERATURE – °C
DEGREES
Figure 5. Maximum DC Current vs.
Ambient Temperature.
Figure 6. Relative Intensity vs. Angle.
6
230
R3
R4
200
183
170
R2
150
90 sec.
MAX.
ABOVE
183°C
125
100
R1
R5
50
25
0
15 30 45 60 75 90 105 120 135 150 165 180 195 210
t-TIME (SECONDS)
P1
HEAT
UP
P2
P3
SOLDER
REFLOW
P4
COOL
DOWN
SOLDER PASTE DRY
Figure 7. Recommended Infra-Red Reflow Soldering Profile.
300
250
200
150
100
50
10 s
SECOND WAVE
ca. 5 K/s
FULL LINE = TYPICAL
DASHED LINE = PROCESS
LIMITS
235°C – 260°C
FIRST WAVE
ca. 200 K/s
ca. 2 K/s
100°C – 130°C
FORCED
COOLING
2 K/s
0
0
50
100
150
200
250
TIME (s)
NOTE: ALL TEMPERATURES MEASURED ON BOTTOM OF PC BOARD.
Figure 8. Recommended Wave-Soldering Profile.
4.45
(0.175)
2.41
(0.095)
1.65
(0.065)
DIMENSIONS IN MILLIMETERS (INCHES)
Figure 9. Recommended Solder Pad Dimensions.
7
2 ± 0.5
Ø 21 ± 0.8
CATHODE SIDE
Ø 60 – 61
13 ± 0.2
11.4 ± 1.0
9 ± 0.3
177 – 180
ALL DIMENSIONS IN MILLIMETERS.
CATHODE
+ 0.1
4.00
Ø 1.50
0
1.75
CARRIER
TAPE
3.50 ± 0.05
8.00 ± 0.30
DIM A
COVER
TAPE
Ø1.1
4.00
DIM B
2.00 ± 0.05
END
START
USER FEED
DIRECTION
160 MIN.
L
160 MIN.
150 – 360
EMPTY POCKETS
SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS.
EMPTY POCKETS
SEALED WITH
COVER TAPE.
MAY CONSIST OF CARRIER
AND/OR COVER TAPE.
Figure 10. Tape and Reel Dimensions.
www.hp.com/go/led
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1999 Hewlett-Packard Co.
Obsoletes 5968-5087E
5968-6664E (8/99)
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