HSMC-H730 [AGILENT]
Visible LED, Diffused;
| 型号： | HSMC-H730 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Visible LED, Diffused |
| 文件： | 总8页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Performance Reverse
Mount Flip Chip LEDs
Technical Data
SunPower Series
HSMA-H630/H730
HSMC-H630/H730
HSML-H630/H730
Features
Applications
• High Brightness AlInGaP
Material
• Reverse Mountable Surface
Mount LED
• Breakthrough Reliability
through Elimination of
Internal Wire Bond
• -40°C to +85°C Operating
Temperature Range
• Small 3.2 x 1.25 mm
Footprint
• Low Profile
• Keypad Backlighting
• Symbol Backlighting
• Status Indication
• Front Panel Indicator
Description
The HSMx-H630/H730 is a
reverse mountable chip-type LED
for lighting the non-component
side of a PC board. In this reverse
mounting configuration, this LED
is designed to emit light through
a small hole in the PC board.
• Diffused Optics
This device is available in three
colors. The small size, narrow
footprint, and low profile make
these LEDs excellent for
backlighting, status indication,
and front panel illumination
applications.
• Compatible with Reflow or
Through-the-Wave Solder
Processes
• Available on 7” (178 mm) or
13” (330 mm) Diameter
Reels
The HSMx-H630/H730 uses a flip
chip construction that eliminates
the wire bond between the chip
and substrate. As a result of this
robust construction, product
reliability is greatly improved.
Part Number
Color
Amber 590 nm
Part/Reel
HSMA-H630
HSMA-H730
3000
12000
HSMC-H630
HSMC-H730
Red 626 nm
3000
12000
HSML-H630
HSML-H730
Orange 605 nm
3000
12000
2
Package Dimensions
CATHODE
ANODE
CATHODE
MARK
1.10
0.80
1.10
POLARITY MARK
R 0.25
1.25
3.20
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
3
Absolute Maximum Ratings at T = 25°C
A
Parameter
DC Forward Current
Power Dissipation
HSMx-H630/H730
Units
mA
mW
V
[1]
20
50
Reverse Voltage (I = 100 µA)
5
R
Operating Temperature Range
-40 to +85
-40 to +85
°C
[2]
Storage Temperature Range
°C
Notes:
1. Derate Linearly as shown in Figure 4.
2. Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at T = 25°C
A
Peak
Color, Dominant
Viewing
Wavelength
Wavelength
Angle 2θ
(degrees)
Typ.
Luminous
Efficacy η
v
(lm/W)
1/2
[4]
[3]
λ
(nm)
λ
(nm)
peak
d
[5]
Part No.
Color
Typ.
Typ.
HSMA-H630
HSMA-H730
Amber
592
607
638
590
605
626
165
165
165
480
HSML-H630
HSML-H730
Orange
Red
370
197
HSMC-H630
HSMC-H730
Notes:
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the perceived color of the device with
respect to standard illumination D56.
4. θ1/2 is the off-axis angle where the luminous intensity is / the peak intensity.
1
2
5. The luminous efficacy, η v is the ratio of luminous flux to radiant flux, φv /φe.
Optical Characteristics at T = 25°C (Continued)
A
Luminous
Intensity
Luminous
Intensity
Luminous
Intensity
I (mcd)
v
I (mcd)
v
I (mcd)
v
@I = 5 mA
@I = 20 mA
@I = 2 mA
F
F
F
Part No.
Color
Min.
Typ.
Typ.
Typ.
HSMA-H630
HSMA-H730
Amber
2.5
2.5
2.0
7.5
35
2.5
HSML-H630
HSML-H730
Orange
Red
7.5
6.5
35
30
2.5
2.0
HSMC-H630
HSMC-H730
4
Electrical Characteristics at T = 25°C (Continued)
A
Forward
Voltage
V (Volts)
F
Forward
Voltage
V (Volts
F
Reverse
Breakdown
(Volts)
Capacitance
C (pF)
Thermal
Resistance
V
V = 0
F
R
@ I = 5 mA @ I = 20 mA @ I = 100 µA f = 1 MHz
Rθ
F
F
R
J-PIN
Part No.
Color
Typ. Max.
Typ.
Max.
Min.
Typ.
(°C/W)
HSMA-H630
HSMA-H730
Amber
1.9
1.9
1.9
2.2
2.2
2.2
2.0
2.0
1.9
2.4
5.0
20
300
HSML-H630
HSML-H730
Orange
Red
2.4
2.4
5.0
5.0
20
20
300
300
HSMC-H630
HSMC-H730
1.0
ORANGE
RED
AMBER
0.5
0
550
594 600 607
630
650
700
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
5
5
4
3
2
1
0
100
50
20
10
5
2
1
0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
– FORWARD VOLTAGE – V
0
5
10
15
20
25
I
– FORWARD CURRENT – mA
V
F
F
Figure 2. Forward Current vs.
Forward Voltage.
Figure 3. Relative Iv vs. DC Forward
Current (operation below 1 mA not
recommended).
25
20
Rθ
= 300°C/W
J-PIN
15
10
5
0
0
20
40
60
80
100
T
– AMBIENT TEMPERATURE – °C
A
Figure 4. Maximum DC Current vs.
Ambient Temperature.
6
0°
1.0
10°
20°
30°
.8
.6
.4
.2
40°
50°
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
Figure 5. Intensity vs. Angle.
10 SEC. MAX.
235°C MAX.
PRE-HEAT 125-145°C
90 SEC. MAX.
ABOVE 183°C
3°C/SEC. MAX.
TIME
3°C/SEC. MAX.
Figure 6. Recommended Reflow Soldering Profile.
10 SEC. MAX.
250°C MAX.
PRE-HEAT 140-160°C
90 SEC. MAX.
ABOVE 183°C
3°C/SEC. MAX.
3°C/SEC. MAX.
TIME
Figure 7. Recommended Wave Solder Profile.
7
2.00 DIA. PCB HOLE
1.25 mm
1.15 mm
1.40 mm
Figure 8. Recommended Solder Pads.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 9. Reeling Orientation.
Ø DIM. A
21.0
(0.83)
2.0
(0.08)
60.0
(2.36)
Ø
13.0
Ø
(0.51)
LABEL
1.5
TYP.
(0.06)
60°
60°
13.0
(0.51)
10.0
(0.39)
Part Number
HSMx-H630
HSMx-H730
Dimension A
178 mm (7")
330 mm (13")
Figure 10. Reel Dimensions.
CATHODE
4.00
1.50 + 0.10
0
Ø
CARRIER TAPE
1.75
3.50 ± 0.05
DIM. A
8.00 ± 0.30
DIM. B
COVER TAPE
2.00 ± 0.05
4.00
DIM. A
3.48 mm (0.137')
DIM. B
1.57 mm (0.062')
Figure 11. Tape Dimensions.
END
START
USER FEED
DIRECTION
160 MIN.
L
160 MIN.
150 - 360
EMPTY POCKETS SEALED MOUNTED WITH EMPTY POCKETS SEALED
WITH COVER TAPE. COMPONENTS WITH COVER TAPE.
MAY CONSIST OF CARRIER
AND/OR COVER TAPE.
Figure 12. Tape Leader and Trailer Dimensions.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 1999 Agilent Technologies, Inc.
5968-2374E (11/99)
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