HSMD-T625 [AGILENT]
Surface Mount High Performance AlInGaP LED Indicators; 表面贴装高性能的AlInGaP LED指示灯
| 型号： | HSMD-T625 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Surface Mount High Performance AlInGaP LED Indicators |
| 文件： | 总5页 (文件大小：158K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
H
Surface Mount High
Performance AlInGaP LED
Indicators
SunPower Series
HSMA-TX25
HSMD-TX25
HSMJ-TX25
Technical Data
Features
• Outstanding LED Material
Efficiency
• Exceptional Light Output
Over a Wide Range of Drive
Currents
• Colors: 590 nm Amber, 603
nm Orange, and 615 nm
Reddish-Orange
Description
The LED material used in these
devices is the very efficient
absorbing Substrate aluminum
indium gallium phosphide (AS
AlInGaP), capable of producing
high light output over a wide
range of drive currents.
• Compatible with Automatic
Placement Equipment
• Compatible with Convective
IR, Vapor Phase Reflow, and
TTW Solder Processes
• Packaged in 12 mm or 8 mm
Tape on 7" or 13" Diameter
Reels
• EIA Standard Package
• Low Package Profile
These solid state surface mount
indicators are designed with a flat
top and sides to be easily handled
by automatic placement equip-
ment. A glue pad is provided for
adhesive mounting processes.
They are compatible with
convective IR and vapor phase
reflow soldering, through the
wave (TTW) soldering, and
conductive epoxy attachment
processes.
BAAC standard specification for
case size 3528 tantalum
capacitors. The folded leads
permit dense placement and
provide an external solder joint
for ease of inspection.
These devices are non-diffused,
providing high intensity for
applications such as backlighting,
light pipe illumination, and front
panel indication.
• Non-diffused Package
Excellent for Backlighting
and Coupling to Light Pipes
The package size and configura-
tion conform to the EIA-535
Device Selection Guide
Amber
Orange
Reddish-Orange
λd = 590 nm
λd = 603 nm
λd = 615 nm
Description
HSMA-T425
HSMA-T525
HSMA-T625
HSMA-T725
HSMD-T425
HSMD-T525
HSMD-T625
HSMD-T725
HSMJ-T425
HSMJ-T525
HSMJ-T625
HSMJ-T725
12 mm Tape, 7" Reel, 2000 Devices
12 mm Tape, 13" Reel, 8000 Devices
8 mm Tape, 7" Reel, 2000 Devices
8 mm Tape, 13" Reel, 8000 Devices
5964-9352E
1-199
Package Dimensions
3.5 ± 0.2
(0.138 ± 0.008)
2.8 ± 0.2
(0.110 ± 0.008)
2.7
(0.106)
2.2
(0.087)
NOM.
NOM.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.
CATHODE NOTCH
3.1
(0.122)
NOM.
1.9 ± 0.2
(0.075 ± 0.008)
0.7
(0.028)
MIN.
0.1
(0.004)
NOM.
2.2 ± 0.1
(0.087 ± 0.004)
0.8 ± 0.3
(0.031 ± 0.012)
(2 PLACES)
1.3
(0.050)
MIN.
Tape and Reel
Specifications
Hewlett Packard surface mount
LEDs are packaged tape and reel
in accordance with EIA-481A,
Taping of Surface Mount
Components for Automatic
Placement. This packaging
system is compatible with tape-
fed automatic pick and place
systems. Each reel is sealed in a
vapor barrier bag for added
protection. Bulk packaging in
vapor barrier bags is available
upon special request.
USER FEED
DIRECTION
CATHODE
PITCH: 4 mm (0.157 IN.)
HEWLETT
PACKARD
hp
REEL DIAMETER:
178 mm (7 IN.) OR 330 mm (13 IN.)
CARRIER TAPE WIDTH:
12 mm (0.472 IN.) OR 8 mm (0.315 IN.)
1-200
Absolute Maximum Ratings at TA = 25°C
DC Forward Current[1,4,5] ............................................................ 50 mA
Peak Forward Current[2] ........................................................... 200 mA
Average Forward Current ........................................................... 45 mA
(at IPEAK = 200 mA, f ≥ 1 KHz)[2]
Transient Forward Current (10 µs Pulse)[3] .............................. 500 mA
Reverse Voltage (IR = 100 µA)......................................................... 5 V
LED Junction Temperature............................................................ 95°C
Operating Temperature Range....................................... -40°C to +85°C
Storage Temperature Range .......................................... -40°C to +85°C
Reflow Soldering Temperatures
Convective IR ...................... 235°C Peak, above 183°C for 90 seconds
Vapor Phase ........................................................ 215°C for 3 minutes
Notes:
1. Derate linerally as shown in Figure 4.
2. Refer to Figure 5 to establish pulsed operating conditions.
3. The transient peak current is the maximum non-recurring peak current the device can
withstand without damaging the LED die and wire bonds.
4. Drive currents between 5 mA and 30 mA are recommended for best long term
performance.
5. Operation at currents below 5 mA is not recommended, please contact your Hewlett-
Packard sales representative.
Optical Characteristics at TA = 25°C
Luminous
Intensity
IV (mcd)
Color,
Dominant
Wavelength
λd[1] (nm)
Typ.
Viewing
Angle
Peak
Wavelength
λPEAK (nm)
Typ.
Luminous
Efficacy
ηv
2 θ1/2
Part
Number
@ 10 mA
Degrees[2]
Typ.
Min.
Typ.
(lm/w)
HSMA-TX25
HSMD-TX25
HSMJ-TX25
10
10
10
25
592
607
621
590
603
615
120
120
120
480
370
263
25
25
Notes:
1. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25°C
Speed of
Response
τs (ns)
Forward
Voltage
VF (Volts)
Reverse
Breakdown
VR (Volts)
Capacitance
C (pF)
VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ-PIN (°C/W)
Time Constant
Part
Number
@ IF = 10 mA @ IR = 100 µA
e-t/τ
s
Typ.
Max.
Min.
Typ.
Typ.
HSMA-TX25
HSMD-TX25
HSMJ-TX25
1.9
2.4
5
5
5
25
40
40
40
180
180
180
13
1.9
2.4
25
13
1.9
2.4
25
13
1-201
200
1.0
AMBER
ORANGE
180
160
140
120
100
REDDISH
ORANGE
0.5
80
60
40
20
0
0
550
594 600 607
621
650
700
1.0
1.5
2.0
2.5
3.0
WAVELENGTH – nm
V
– FORWARD VOLTAGE – V
F
Figure 1. Relative Intensity vs. Wavelength.
Figure 2. Forward Current vs.
Forward Voltage.
55
5.0
4.0
3.0
2.0
60
50
45
f > 1 KHz
50
40
40
35
f > 300 Hz
f > 100 Hz
Rθ
Rθ
= 439° C/W
J-A
J-A
30
25
= 244° C/W
30
20
10
0
20
15
1.0
0
10
5
0
0
10 20 30 40 50 60 70 80 90 100 110
– AMBIENT TEMPERATURE – °C
0
10
20
30
40
50
50
100
150
200
I
– DC FORWARD CURRENT – mA
T
I
– PEAK FORWARD CURRENT – mA
PEAK
F
A
Figure 3. Relative Luminous Intensity
vs. Forward Current.
Figure 4. Maximum Forward Current
vs. Ambient Temperature. Derating
Based on TJ Max = 95°C.
Figure 5. Maximum Average Current
vs. Peak Forward Current.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100 90 80 70 60 50 40 30 20 10
0
10 20 30 40 50 60 70 80 90 100
θ – ANGULAR DISPLACEMENT – DEGREES
Figure 6. Relative Intensity vs.
Angular Displacement.
1-202
Recommended Printed Circuit Board Attachment Pad Geometries
INFRARED/VAPOR PHASE
REFLOW SOLDERING
COMPONENT LOCATION
ON PAD
4.45
(0.175)
2.41
(0.095)
1.65
(0.065)
COMPONENT LOCATION
ON PAD
CONDUCTIVE ATTACHMENT
4.45
(0.175)
2.41
(0.095)
1.65
(0.065)
0.64 (0.025) SQ.
CENTERED HOLE
NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Convective IR Reflow
Soldering
For information on convective IR
reflow soldering, refer to the
Supplement to Application Note
1060, Surface Mounting SMT
LED Components.
1-203
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