HSMR-C1XX [AGILENT]
Agilent HSMx-C1xx High Performance Chip LED; 安捷伦HSMx - C1XX高性能LED芯片
| 型号： | HSMR-C1XX |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Agilent HSMx-C1xx High Performance Chip LED |
| 文件： | 总12页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HSMx-C1xx
High Performance Chip LED
Data Sheet
Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Compatible with IR soldering
• Compatible for use with light
piping
• Available in 8 mm tape on
7" diameter reel
HSMQ-C110/120/150/170/177/190/191/197/265,
HSMR-C110/120/130/150/170/177/190/191/197/265
• Reel sealed in zip locked moisture
barrier bags
Description
emitting package is especially
Applications
suitable for LCD backlighting
application. The top emitting
packages, with their wide viewing
angle, are suitable for direct
These small chip-type LEDs utilize
high efficient and high brightness
InGaN material to deliver
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
competitively priced high
backlighting application or being
used with light pipes. In order to
facilitate pick and place operation,
these ChipLEDs are shipped in
tape and reel with 4000 units per
reel for HSMx-C120, C130, C170,
C177, C190, C191 and C197
packages, and 3000 units per reel
for HSMx-C110, C150 and C265
packages. All packages are
performance blue and green. These
520 nm green and 470 nm blue are
unique hues which provide color
differentiation to a product.
• Microdisplays
• Small message panel signage
These ChipLEDs come in either top
emitting packages (HSMx-C130,
C150, C170, C177, C190, C191,
C197), in side emitting packages
(HSMx-C110, C120) or in a reverse
mount package (C265). The side
compatible with IR soldering and
binned by both color and intensity.
CAUTION: HSMQ-C1xx and HSMR-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe
appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note
AN-1142 for additional details.
Package Dimensions
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
3.2 (0.126 )
0.62 (0.024)
2.0 (0.079 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
POLARITY
DIFFUSED
EPOXY
1.5 (0.059)
0.3 (0.012)
PC BOARD
PC BOARD
0.8 (0.031)
0.5 (0.020)
0.3 (0.012)
1.6 (0.063 )
CATHODE LINE
0.4 ± 0.15
3.2 (0.126 )
0.4 ± 0.15
(0.016 ± 0.006)
(0.016 ± 0.006)
0.8 (0.031)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C110
HSMx-C170
CATHODE
MARK
CATHODE
MARK
LED DIE
LED DIE
0.8 (0.031)
0.4 (0.016)
0.8 (0.031)
0.4 (0.016)
1.6
1.6
(0.063 )
(0.063 )
1.0
(0.039)
1.0
(0.039)
POLARITY
POLARITY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
DIFFUSED EPOXY
PC BOARD
0.8 (0.031)
0.3 (0.012)
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
(0.012 ± 0.006)
0.7 (0.028) MIN.
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
HSMx-C191
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
Package Dimensions, continued
CATHODE MARK
LED DIE
CATHODE
MARK
LED DIE
1.25
(0.049)
1.6 (0.063)
0.8 (0.031)
0.62
(0.025)
2.00 (0.079)
3.2 (0.126 )
POLARITY
DIFFUSED EPOXY
0.40 (0.016)
DIFFUSED
2.0 (0.079)
POLARITY
EPOXY
0.6 (0.024)
PC BOARD
1.1 (0.043)
0.16 (0.006)
PC BOARD
CATHODE LINE
CATHODE LINE
0.5 (0.020)
0.50 ± 0.20
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
0.50 ± 0.20
(0.020 ± 0.008)
(0.020 ± 0.008)
1.10 (0.043) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C150
HSMx-C177
CATHODE MARK
LED DIE
CATHODE MARK
LED DIE
0.3 (0.012)
0.6 (0.024)
0.40
(0.016)
1.6 (0.063)
0.80
1.60
(0.031)
(0.063)
POLARITY
POLARITY
1.2 (0.047)
CLEAR EPOXY
PC BOARD
DIFFUSED EPOXY
0.40 (0.016)
1.0 (0.039)
PC BOARD
0.16 (0.006)
0.5 (0.020)
CATHODE LINE
3 – 0.3 (0.012)
0.30 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.70 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C197
HSMx-C120
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
Package Dimensions, continued
3.4 (0.134)
CATHODE
MARK (ETCHED)
CATHODE
MARK
LED DIE
LED DIE
0.8 (0.031)
(0.625)
1.25 (0.049)
1.6
(0.063)
GREEN SOLDER MASK
POLARITY
POLARITY
1.15
(0.045)
1.2
UNDIFFUSED
(0.047)
EPOXY
0.23 (0.009)
0.35 (0.014)
0.12 (0.005)
DIFFUSED EPOXY
PCB BOARD
1.1 (0.043)
1.1 (0.043)
PC BOARD
0.3 (0.012)
CATHODE LINE
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C265
HSMx-C130
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Device Selection Guide
[1], [2]
PackageDimension(mm)
InGaN Green
InGaN Blue
Package Description
3.2(L) x 1.0(W) x 1.5(H)
1.6(L) x 0.6(W) x 1.0(H)
1.6(L) x 0.8(W) x 0.35(H)
3.2(L) x 1.6(W) x 1.1(H)
2.0(L) x 1.25(W) x 0.8(H)
2.0(L) x 1.25(W) x 0.4(H)
1.6(L) x 0.8(W) x 0.8(H)
1.6(L) x 0.8(W) x 0.6(H)
1.6(L) x 0.8(W) x 0.4(H)
3.4(L) x 1.25(W) x 1.1(H)
HSMQ-C110
HSMQ-C120
–
HSMR-C110
HSMR-C120
HSMR-C130
HSMR-C150
HSMR-C170
HSMR-C177
HSMR-C190
HSMR-C191
HSMR-C197
HSMR-C265
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-diffused
HSMQ-C150
HSMQ-C170
HSMQ-C177
HSMQ-C190
HSMQ-C191
HSMQ-C197
HSMQ-C265
Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at T = 25˚C
A
HSMQ-Cxxx
HSMR-Cxxx
Parameter
Units
mA
mW
V
[1]
DC Forward Current
20
Power Dissipation
78
Reverse Voltage (I = 100 µA)
5
R
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
95
˚C
–30 to +85
–40 to +85
˚C
˚C
See reflow soldering profile (Figures 11 & 12)
Note: 1. Derate linearly as shown in Figure 4.
4
Electrical Characteristics at T = 25˚C
A
Forward Voltage
V (Volts)
Reverse Breakdown
Capacitance C
Thermal
Resistance
Rθ (˚C/W)
J–PIN
V (Volts)
(pF),V =0,
F
R
F
@ I = 20 mA
@ I = 100 µA
f = 1 MHz
F
R
Part Number
Typ.
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
Max.
Min.
Typ.
Typ.
450
450
450
450
300
300
350
350
300
300
HSMQ-C110/C150
HSMR-C110/C150
HSMQ-C120
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
5
5
5
5
5
5
5
5
5
5
140
140
100
100
110
110
110
110
65
HSMR-C120/C130
HSMQ-C170/C190/C191
HSMR-C170/C190/C191
HSMQ-C177/C197
HSMR-C177/C197
HSMQ-C265
HSMR-C265
65
V Tolerance: ±0.1 V
F
Optical Characteristics at T = 25˚C
A
Luminous
Intensity
Color,
Dominant
Viewing
Angle
Luminous
Efficacy
Peak
I (mcd)
@ 20 mA
Min.
Wavelength Wavelength
2θ
Degrees
Typ.
η
V
(lm/w)
Typ.
V
1/2
[1]
[2]
[3]
λ
(nm)
λ
(nm)
peak
d
Part Number
HSMQ-C110
HSMQ-C120
Color
Green
Green
Typ.
Typ.
Typ.
45
45
45
45
45
18
18
18
18
18
18
150
145
145
145
140
60
520
520
520
520
520
469
469
469
469
469
469
527
527
527
527
527
473
473
473
473
473
473
130
155
140
130
150
130
155
145
140
130
150
500
500
500
500
500
88
HSMQ-C150/170/190/191 Green
HSMQ-C177/197
HSMQ-C265
HSMR-C110
HSMR-C120
HSMR-C130
Green
Green
Blue
Blue
55
88
Blue
55
88
HSMR-C150/170/190/191 Blue
55
88
HSMR-C177/197
HSMR-C265
Blue
Blue
55
88
45
88
Notes:
1. The luminous intensity, I , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
V
2. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
d
3. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
[1]
Color Bin Limits
[1]
[1]
Blue Color Bins
InGaN Green Color Bins
Dom. Wavelength (nm)
Dom. Wavelength (nm)
Bin ID
Min.
515.0
520.0
525.0
530.0
Max.
520.0
525.0
530.0
535.0
Bin ID
Min.
460.0
465.0
470.0
475.0
Max.
465.0
470.0
475.0
480.0
A
A
B
C
D
B
C
D
Tolerance: ±1 nm
Tolerance: ±1 nm
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent
representative for information on currently available bins.
5
[1]
Light Intensity (Iv) Bin Limits
Intensity(mcd)
Intensity(mcd)
Bin ID
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
Max.
Bin ID
Min.
Max.
A
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
N
P
Q
R
S
28.50
45.00
B
45.00
71.50
C
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
D
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
E
F
T
G
U
V
W
X
Y
H
J
K
L
M
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
100
90
BLUE
GREEN
80
70
60
50
40
30
20
10
0
400
500
600
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
25
20
15
10
1.2
100
10
1.0
0.8
0.6
0.4
0.2
0
Rθ
Rθ
= 500°C/W
= 600°C/W
J-A
J-A
BLUE
BLUE
GREEN
1
GREEN
10
5
0
0.1
0
10 20 30 40 50 60 70 80 90
– AMBIENT TEMPERATURE – °C
0
5
15
20
25
2.0
2.5
3.0
3.5
4.0
T
I
– FORWARD CURRENT – mA
V
– FORWARD VOLTAGE – V
A
F
F
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
6
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C120.
7
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative intensity vs. angle for HSMx-C130.
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 10. Relative intensity vs. angle for HSMx-C265.
8
10 to 20 SEC.
255 °C (+5/-0)
217 °C
3 °C/SEC. MAX.
100 - 150 °C
6 °C/SEC. MAX.
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
3°C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
140-160°C
4°C/SEC.
MAX.
TIME
OVER 2 MIN.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 11. Recommended reflow soldering profile.
Figure 12. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
1.2 (0.047)
0.2 (0.008)
1.2
(0.047)
1.2
(0.047)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.9
(0.035)
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.8
(0.031)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.7
(0.028)
Figure 15. Recommended soldering pattern
forHSMx-C130/190/191/197.
Figure 16. Recommended soldering pattern for HSMx-C150.
0.4 (0.016)
2.2 (0.087) DIA. PCB HOLE
0.4 (0.016)
0.7 (0.028)
1.25 (0.049)
0.15 (0.006)
CENTERING
BOARD
1.4
2.3
1.4
0.8
(0.031)
1.2
(0.047)
0.8
(0.031)
(0.055)
(0.091)
(0.055)
Figure 17. Recommended soldering pattern for HSMx-C120.
Figure 18. Recommended soldering pattern for HSMx-C265.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 19. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
6
PS
Figure 20. Reel dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10
DIM. C
(SEE TABLE 1)
4.00 (0.157)
CATHODE
1.50 (0.059)
0.20 ± 0.05
0.23 ± 0.05
(0.008 ± 0.002) (0.009 ± 0.002)
FOR HSMR-C130
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
CARRIER TAPE
COVER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
DIM. C
HSMx-C110/120
POSITION IN
PART NUMBER
3.40 (0.134) 1.70 (0.067)
1.90 (0.075) 1.15 (0.045)
3.50 (0.138) 1.88 (0.074)
2.30 (0.091) 1.45 (0.057)
2.25 (0.089) 1.32 (0.052)
1.80 (0.071) 0.95 (0.037)
1.85 (0.073) 0.88 (0.035)
1.75 (0.069) 0.95 (0.037)
1.20 (0.047)
0.80 (0.031)
1.27 (0.050)
0.95 (0.037)
0.70 (0.028)
0.87 (0.034)
0.85 (0.033)
0.60 (0.024)
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
CARRIER TAPE
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
FOR HSMx-C110
DIM. B
(SEE TABLE 1)
R 0.5 ± 0.05
(0.020 ± 0.002)
FOR HSMx-C120
DIM. C
(SEE TABLE 1)
4.00 (0.157)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
CARRIER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
DIM. C
PART NUMBER
Figure 21. Tape dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
11
END
START
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition:
THERE SHALL BE A
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
COVER TAPE.
a) the blue silica gel indicator
becoming white/transparent
color
Figure 22. Tape leader and trailer dimensions.
b) the pack has been open for
more than 1 week
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Baking recommended condition:
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
60 ± 5°C for 20 hours.
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-4832EN
April 22, 2004
5989-0493EN
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