HSMS-286R-BLK
更新时间：2024-09-18 13:00:59
品牌：AGILENT
描述：Mixer Diode, Ultra High Frequency to C Band, Silicon, SC-70, 6 PIN
概述
规格参数
数据手册HSMS-286R-BLK 概述
Mixer Diode, Ultra High Frequency to C Band, Silicon, SC-70, 6 PIN 微波混频二极管
HSMS-286R-BLK 规格参数
| 是否Rohs认证： | 不符合 | 生命周期： | Obsolete |
| 零件包装代码： | SC-70 | 包装说明： | R-PDSO-G6 |
| 针数： | 6 | Reach Compliance Code： | unknown |
| ECCN代码： | EAR99 | HTS代码： | 8541.10.00.60 |
| 风险等级： | 5.04 | Is Samacsys： | N |
| 配置： | 2 BANKS, SERIES CONNECTED, CENTRE TAP, 2 ELEMENTS | 二极管元件材料： | SILICON |
| 二极管类型： | MIXER DIODE | 最大正向电压 (VF)： | 0.35 V |
| 频带： | ULTRA HIGH FREQUENCY TO C BAND | JESD-30 代码： | R-PDSO-G6 |
| JESD-609代码： | e0 | 元件数量： | 4 |
| 端子数量： | 6 | 最高工作温度： | 150 °C |
| 最低工作温度： | -65 °C | 封装主体材料： | PLASTIC/EPOXY |
| 封装形状： | RECTANGULAR | 封装形式： | SMALL OUTLINE |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 认证状态： | Not Qualified |
| 最大反向电流： | 0.2 µA | 反向测试电压： | 50 V |
| 子类别： | Other Diodes | 表面贴装： | YES |
| 技术： | SCHOTTKY | 端子面层： | Tin/Lead (Sn/Pb) |
| 端子形式： | GULL WING | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | Base Number Matches： | 1 |
HSMS-286R-BLK 数据手册
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Absolute Maximum Ratings, Ta = +25°C, Single Diode
Symbol
Parameter
Absolute Maximum[1]
HSMS-285x
HSMS-286x
250 mW
4.0 V
PT
PIV
Total Device Dissipation[2]
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Operating Temperature
75 mW
2.0 V
TJ
150°C
150°C
TSTG
TOP
-65°C to 150°C -65°C to 150°C
-65°C to 150°C -65°C to 150°C
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. CW Power Dissipation at TLEAD = +25°C. Derate linearly to zero at
maximum rated temperature.
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Equivalent Circuit Model
SPICE Parameters
HSMS-2850, HSMS-2860;
Singles
Parameter Units
HSMS-285X HSMS-286X
BV
CJ0
V
pF
eV
A
3.8
0.18
7.0
0.18
0.08 pF
EG
0.69
0.69
IBV
3 x 10E-4
3 x 10E-6
1.06
10E-5
5.0 x 10E-8
1.08
R
IS
A
2 nH
j
N
R
S
RS
Ω
25
5.0
PB (VJ)
PT (XTI)
M
V
0.35
0.65
2
2
0.5
0.5
0.18 pF
RS = series resistance (see Table of SPICE parameters)
8.33 X 10-5 nT
Rj =
Ib + Is
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = identity factor (see table of SPICE parameters)
4
Typical Parameters, Single Diode
100
100
10
100
I
(left scale)
F
TA = +85°C
TA = +25°C
TA = –55°C
10
1
10
1
10
0.1
0.01
.1
∆V (right scale)
F
.01
1
0.05
1
0.25
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
– FORWARD VOLTAGE (V)
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0.10
0.15
0.20
V
FORWARD VOLTAGE (V)
FORWARD VOLTAGE (V)
F
Figure 1. Typical Forward Current vs.
Forward Voltage, HSMS-2850 Series.
Figure 2. Typical Forward Current vs.
Forward Voltage at Temperature,
HSMS-2860 Series.
Figure 3. Typical Forward Voltage
Match, HSMS-2860 Pairs.
10000
30
10,000
R
= 100 KΩ
L
R
= 100 KΩ
20 µA
5 µA
L
915 MHz
10 µA
1000
100
10
10
2.45 GHz
915 MHz
1000
100
2.45 GHz
Frequency = 2.45 GHz
Fixed-tuned FR4 circuit
5.8 GHz
1
10
1
5.8 GHz
R
= 100 KΩ
L
1
DIODES TESTED IN FIXED-TUNED
FR4 MICROSTRIP CIRCUITS.
DIODES TESTED IN FIXED-TUNED
FR4 MICROSTRIP CIRCUITS.
0.1
-50
0.3
-50
-40
-30
-20
-10
0
-40
-30
–40
–30
–20
–10
0
10
POWER IN (dBm)
POWER IN (dBm)
POWER IN (dBm)
Figure 4. +25°C Output Voltage vs.
Input Power, HSMS-2850 at Zero Bias,
HSMS-2860 at 3 µA Bias.
Figure 5. +25°C Expanded Output
Voltage vs. Input Power. See Figure 4.
Figure 6. Dynamic Transfer
Characteristic as a Function of DC Bias,
HSMS-2860.
3.1
40
35
FREQUENCY = 2.45 GHz
2.9
P
R
= -40 dBm
= 100 KΩ
IN
L
2.7
2.5
2.3
30
25
2.1
1.9
20
1.7
1.5
1.3
1.1
0.9
Input Power =
15
10
–30 dBm @ 2.45 GHz
Data taken in fixed-tuned
FR4 circuit
MEASUREMENTS MADE USING A
FR4 MICROSTRIP CIRCUIT.
R
= 100 KΩ
L
5
0
10 20 30 40 50 60 70 80 90 100
.1
1
10
100
TEMPERATURE (°C)
BIAS CURRENT (µA)
Figure 7. Voltage Sensitivity as a
Function of DC Bias Current,
HSMS-2860.
Figure 8. Output Voltage vs.
Temperature, HSMS-2850 Series.
Applications Information
See the HSMS-285A data sheet.
5
Ordering Information
Specify part number followed by option. For example:
Profile Option
Descriptions
#L30 = Bulk
H
SMS - 285X #X XX
#L31 = 3K pc. Tape and Reel,
Device Orientation
Figures 9, 10
Bulk or Tape and Reel Option
Profile: Low = L
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
Part Number
Surface Mount Schottky
Hewlett-Packard
Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
PACKAGE
MARKING
CODE
3
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
X X
2
1
0.50 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
0.92 (0.036)
0.78 (0.031)
PACKAGE
MARKING
CODE
E
C
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
XX
B
E
0.60 (0.024)
0.45 (0.018)
0.54 (0.021)
0.37 (0.015)
2.04 (0.080)
1.78 (0.070)
0.15 (0.006)
0.09 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)
0.69 (0.027)
0.45 (0.018)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material
Lead Finish
Alloy 42
Tin-Lead 85/15%
Max. Soldering Temp.
Min. Lead Strength
260°C for 5 sec.
2 pounds pull
Typical Package Inductance
Typical Package Capacitance
2 nH (opposite leads)
0.08 pF (opposite leads)
Device Orientation
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
END VIEW
4 mm
4 mm
8 mm
8 mm
Figure 9. Option L31 for SOT-23 Packages.
Figure 10. Option L31 for SOT-143 Packages.
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5966-0928E, 5966-2939E
Printed in U.S.A.
5966-4283E (3/98)
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