HSMS-8102-TR1G [AGILENT]
Mixer Diode,;
| 型号： | HSMS-8102-TR1G |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Mixer Diode, |
| 文件： | 总6页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HSMS-8101, 8202, 8207,
8209 Surface Mount Microwave
Schottky Mixer Diodes
Data Sheet
Features
• Optimized for use at
10-14 GHz
• Low Capacitance
• Low Conversion Loss
Plastic SOT-23 Package
Description/Applications
These low cost microwave
Schottky diodes are specifically
designed for use at X/Ku-bands
and are ideal for DBS and VSAT
downconverter applications. They
are available in SOT-23 and
SOT-143 standard package
configurations.
• Low RD
• Low Cost Surface Mount
Plastic Package
• Lead-free Option Available
Package Lead Code
Identification
(Top View)
Note that Agilent's manufacturing
techniques assure that dice found in
pairs and quads are taken from
adjacent sites on the wafer, assur-
ing the highest degree of match.
Plastic SOT-143 Package
SINGLE
3
SERIES
3
1
2
1
2
#1
#2
RING
QUAD
CROSS-OVER
QUAD
Absolute Maximum Ratings[1], TA = +25°C
3
4
3
4
Symbol Parameter
Unit
Min.
Max.
PT
PIV
TJ
Total Device Dissipation[2]
mW
V
—
—
75
4
1
2
1
2
Peak Inverse Voltage
Junction Temperature
#7
#9
°C
°C
—
+150
+150
TSTG, Top Storage and Operating
Temperature
-65
Attention:
Notes:
Observe precautions for
handling electrostatic
sensitive devices.
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to
zero at 150°C per diode.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
2
DC Electrical Specifications, TA = 25°C
HSMS-8101
HSMS-8202
HSMS-8207
HSMS-8209
Symbol Parameters and Test Conditions
Units Min. Max. Min. Max. Min. Max. Min. Max.
VBR
CT
Breakdown Voltage
IR = 10 µA
V
pF
pF
Ω
4
4
4
4
Total Capacitance
VR = 0 V, f = 1 MHz
0.26
—
0.26
0.04
14
0.26
0.04
14
0.26
0.04
14
∆CT
RD
Capacitance Difference
VR = 0 V, f = 1 MHz
Dynamic Resistance
IF = 5 mA
14
∆RD
VF
Dynamic Resistance Difference
IF = 5 mA
Ω
—
2
2
2
Forward Voltage
IF = 1 mA
mV
mV
250
350
—
250
350
20
250
350
20
250
350
20
∆VF
Forward Voltage Difference
IF = 1 mA
Lead Code
1
2
7
9
Package Marking Code
where x is date code
R1x
2Rx
R7x
R9x
RF Electrical Parameters, TA = 25°C
Symbol
Parameter
Units
dB
Typical
6.3
Lc
Conversion Loss at 12 GHz
IF Impedance
ZIF
Ω
150
SWR
SWR at 12 GHz
1.2
Note:
DC Load Resistance = 0 Ω; LO Power = 1 mW.
SPICE Parameters
Linear Equivalent Circuit
0.08 pF
IS = 4.6 E-8
RS = 6
EG = 0.69
CJO = 0.18 E-12
PB (VJ) = 0.5
M = 0.5
TT = 0
N = 1.09
BV = 7.3
0.17 pF
1.0 nH
1.3 nH 6 Ω
IBV = 10E-5
FC = 0.5
R
j
Self Bias
1 mA
256
2.5 mA
142
R
j
3
Typical Performance, TC = 25°C
100
30
30
10
9
8
7
6
I
(Left Scale)
F
10
10
1
∆V (Right Scale)
F
TA = +125°C
1
1
0.1
0.01
T
T
A = +25°C
A = –55°C
0.3
0.3
0
0.2
0.4
0.6
0.8
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55
–7 –5 –3 –1
1
3
5
7
9
11 13
FORWARD VOLTAGE (V)
V - FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current
vs. Forward Voltage at Three
Temperatures.
Figure 2. Typical VF Match, HSMS-
820X Pairs and Quads.
Figure 3. Typical Conversion Loss
vs. Local Oscillator Power.
Ordering Information
Specify part number followed by option. For example:
Profile Option
Descriptions
-BLK = Bulk
HSMS - 8101 - XXX
-TR1 = 3K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Bulk or Tape and Reel Option
Part Number
-TR2 = 10K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Surface Mount Schottky
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
Device Orientation
REEL
For lead-free option, the part
number will have the character "G"
at the end, eg. -TR2G for a 10K pc
lead-free reel.
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
8 mm
A B C
A B C
A B C
A B C
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.
4
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish................................... Tin-Lead 85-15% (Non lead-free option)
or Tin 100% (Lead-free option)
Maximum Soldering Temperature.............................. 260°C for 5 seconds
Minimum Lead Strength.......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance ..............................0.08 pF (opposite leads)
Recommended PCB Pad Layout for
Agilent’s SOT-23 Products
Package Dimensions
Outline 23 (SOT-23)
e2
0.039
1
e1
0.039
1
E1
E
XXX
0.079
2.0
e
L
B
0.035
0.9
C
DIMENSIONS (mm)
D
SYMBOL
MIN.
0.79
0.000
0.37
0.086
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.152
3.13
1.50
1.02
2.04
0.60
2.70
0.69
0.031
0.8
A
A1
B
A
inches
Dimensions in
mm
C
D
A1
E1
e
e1
e2
E
Notes:
XXX-package marking
Drawings are not to scale
L
Outline 143 (SOT-143)
Recommended PCB Pad Layout
for Agilent’s SOT-143 Products
e2
e1
0.112
2.85
B1
0.079
2
E
E1
XXX
0.033
0.85
L
0.114
2.9
0.081
2.05
0.048
1.2
0.071
1.8
B
C
e
DIMENSIONS (mm)
0.033
0.85
D
SYMBOL
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
A
A1
B
A
0.047
1.2
0.031 0.033
B1
C
0.8
0.85
A1
D
e
E1
e
inches
mm
Dimensions in
e1
e2
E
Notes:
XXX-package marking
L
Drawings are not to scale
5
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.15 0.10
2.77 0.10
1.22 0.10
4.00 0.10
1.00 + 0.05
0.124 0.004
0.109 0.004
0.048 0.004
0.157 0.004
0.039 0.002
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
WIDTH
W
8.00+0.30–0.10 0.315+0.012–0.004
THICKNESS
t1
0.229 0.013
0.009 0.0005
DISTANCE
BETWEEN
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CENTERLINE
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
Tape Dimensions and Product Orientation
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
9° MAX
9° MAX
0
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.19 0.10
2.80 0.10
1.31 0.10
4.00 0.10
1.00 + 0.25
0.126 0.004
0.110 0.004
0.052 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30–0.10 0.315+0.012–0.004
0.254 0.013
0.0100 0.0005
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
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Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
Obsoletes 5989-2496EN
September 26, 2005
5989-4024EN
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