HSMY-H770 [AGILENT]

Visible LED, Diffused;
HSMY-H770
型号: HSMY-H770
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

Visible LED, Diffused

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中文:  中文翻译
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Surface Mount Flip Chip LEDs  
Technical Data  
HSMx-H670/H770Series  
HSMx-H690/H790Series  
Features  
Description  
• Improved Reliability  
Through Elimination of  
Internal Wire Bond  
• -40 to 85°C Operating  
Temperature Range  
• Small Size  
• Industry Standard Footprint  
• Diffused Optics  
• Compatible with IR  
Solder Process  
The HSMX-H670/H770 and  
HSMX-H690/H790 introduce a  
revolutionary concept to the  
world of LEDs. The internal flip  
chip construction eliminates the  
wire bond between the chip and  
printed circuit board.  
Consequently as a result of the  
robust construction, product  
reliability is greatly improved.  
• Four Colors Available  
The HSMX-H670/H770 and  
HSMX-H690/H790 are available in  
four colors. The HSMX-H670/  
H770 adheres to the industry  
standard 2.0 x 1.25 mm footprint  
and is intended for designs where  
space is limited. The small size,  
low 1.1 mm profile and wide  
viewing angle make these LEDs  
excellent for backlighting  
• Available in 8 mm Tape on 7"  
(178 mm) or 13" (330 mm)  
Diameter Reels  
H790 adheres to the 1.6 x 0.8  
mm industry standard footprint.  
The low 0.6 mm profile make this  
excellent for designs where space  
is limited.  
Applications  
• Keypad Backlighting  
• LCD Backlighting  
• Symbol Backlighting  
• Front Panel Indicator  
Both packages are compatible  
with IR/convective reflow as well  
as through the wave reflow  
soldering processes.  
applications and front panel  
illumination. The HSMX-H690/  
Device Selection Guide  
High  
Efficiency  
Red  
Footprint  
(mm)[1][2]  
Orange  
Yellow  
Green  
1.6 x 0.8 x 0.6  
HSMS-H690/H790 HSMD-H690/H790 HSMY-H690/H790 HSMG-H690/H790  
2.0 x 1.25 x 1.1  
HSMS-H670/H770 HSMD-H670/H770 HSMY-H670/H770 HSMG-H670/H770  
Notes:  
1. Dimensions in mm.  
2. Tolerance ± 0.1 mm unless otherwise noted.  
2
Package Dimensions  
HSMx-H670/H770 Series  
HSMx-H690/H790 Series  
STRIP MARKING  
POLARITY  
POLARITY  
2.00  
(0.079)  
0.60  
1.00  
1.25  
(0.049)  
1.10  
(0.043)  
1.27  
(0.050)  
0.30  
0.50 (0.020)  
0.45  
0.80  
TOPSIDE  
CATHODE  
MARK  
0.40  
(0.016)  
0.40 (0.016)  
1.60  
0.48 (0.019)  
BOTTOMSIDE CATHODE MARK  
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).  
2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).  
3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05  
MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.  
Absolute Maximum Ratings at TA = 25°C  
Parameter  
HSMx-H670/H770  
HSMx-H690/H790  
Units  
DC Forward Current[1]  
20  
50  
20  
mA  
Power Dissipation  
50  
mW  
V
Reverse Voltage (IR = 100 µA)  
Operating Temperature Range  
Storage Temperature Range[2]  
5
5
-40 to +85  
-40 to +85  
-40 to +85  
-40 to +85  
°C  
°C  
Notes:  
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.  
2. Maximum temperature for tape and reel packaging is 60°C.  
3
OpticalCharacteristicsatTA=25°C  
Luminous  
Intensity  
IV (mcd)  
Color,  
Dominant  
Wavelength  
λd[2] (nm)  
Typ.  
Viewing  
Angle  
Luminous  
Efficacy  
ηv  
Peak  
Wavelength  
2θ1/2  
Part  
Number  
@ IF = 20 mA[1] λpeak(nm)  
Degrees[3]  
Typ.  
(lm/W)  
Color  
Min.  
Typ.  
Typ.  
639  
606  
584  
566  
HSMS-H6X0  
HSMS-H7X0  
High  
Efficiency  
Red  
1.6  
5.0  
626  
604  
586  
571  
165  
165  
165  
165  
145  
380  
500  
595  
HSMD-H6X0  
HSMD-H7X0  
Orange  
Yellow  
Green  
1.6  
4.0  
HSMY-H6X0  
HSMY-H7X0  
1.6  
5.0  
HSMG-H6X0  
HSMG-H7X0  
4.0  
9.0  
Notes:  
1.TheluminousintensityIV ismeasuredatthepeakofthespatialradiationpatternwhichmaynotbealignedwiththe  
mechanicalaxisofthelamppackage.  
2.ThedominantwavelengthλdisderivedfromtheCIEChromaticityDiagramandrepresentstheperceivedcolorofthedevice.  
3. θ1/2istheoff-axisanglewheretheluminousintensityis1/2thepeakintensity.  
ElectricalCharacteristicsatTA =25°C  
Forward  
Voltage  
VF (Volts)  
Reverse  
Breakdown  
VR(Volts)  
Capacitance  
C (pF),  
VF = 0,  
f = 1 MHz  
Typ.  
Thermal  
Resistance  
RθJ-PIN(°C/W)  
Part  
Number  
@ IF = 20 mA @ IR = 100 µA  
Color  
Typ.  
Max.  
Min.  
HSMS-H670  
HSMS-H770  
HSMS-H690  
HSMS-H790  
HighEfficiency  
Red  
2.0  
2.6  
5
6
5
5
5
250  
250  
250  
250  
HSMD-H670  
HSMD-H770  
HSMD-H690  
HSMD-H790  
Orange  
Yellow  
Green  
2.0  
2.1  
2.3  
2.6  
2.6  
2.6  
5
5
5
HSMY-H670  
HSMY-H770  
HSMY-H690  
HSMY-H790  
HSMG-H670  
HSMG-H770  
HSMG-H690  
HSMG-H790  
4
Green Color Bins[1]  
Bin ID  
Minimum (nm)  
561.0  
Maximum (nm)  
565.0  
Notes  
A
B
C
D
E
F
G
H
J
564.0  
568.0  
567.0  
571.0  
570.0  
574.0  
573.0  
577.0  
561.0  
568.0  
Bin A & Bin B  
Bin B & Bin C  
Bin C & Bin D  
Bin D & Bin E  
564.0  
571.0  
567.0  
574.0  
570.0  
577.0  
Yellow Color Bins[1]  
Bin ID  
Minimum (nm)  
581.5  
Maximum (nm)  
585.0  
Notes  
A
B
C
D
E
F
G
H
J
584.0  
587.5  
586.5  
590.0  
589.0  
592.5  
581.5  
587.5  
Bin A & Bin B  
Bin B & Bin C  
Bin C & Bin D  
584.0  
590.0  
586.5  
592.5  
591.5  
595.0  
594.0  
597.5  
Luminous Intensity Bin Limits[1]  
Bin ID  
Minimum (med)  
Maximum (med)  
A
B
C
D
E
F
G
H
J
K
L
0.10  
0.20  
0.16  
0.32  
0.25  
0.50  
0.40  
0.80  
0.63  
1.25  
1.00  
2.00  
1.60  
3.20  
2.50  
5.00  
4.00  
8.00  
6.30  
12.50  
20.00  
32.00  
50.00  
80.00  
125.00  
200.00  
320.00  
500.00  
800.00  
1250.00  
2000.00  
3200.00  
5000.00  
10.00  
16.00  
25.00  
40.00  
63.00  
100.00  
160.00  
250.00  
400.00  
630.00  
1000.00  
1600.00  
2500.00  
M
N
P
Q
R
S
T
U
V
W
X
Y
Note:  
1. Bin categories are established for classification of products. Products may not be available in all bin categories.  
Please contact your Agilent representative for information on currently available bins.  
5
1.0  
ORANGE  
GREEN  
HIGH EFFICIENCY RED  
0.5  
YELLOW  
0
500  
550  
600  
650  
700  
750  
WAVELENGTH – nm  
Figure1.RelativeIntensityvs.Wavelength.  
1.2  
20  
YELLOW  
ORANGE  
1.0  
0.8  
15  
HER  
GREEN  
10  
0.6  
0.4  
0.2  
0
5
0
1.0  
1.5  
2.0  
2.5  
3.0  
0
5
10  
15  
20  
V
– FORWARD VOLTAGE – V  
I
– DC FORWARD CURRENT – mA  
F
DC  
Figure2.ForwardCurrentvs.ForwardVoltage.  
Figure3.RelativeLuminousIntensityvs.DCForward  
Current.  
0°  
1.0  
10°  
40  
35  
20°  
30°  
.8  
40°  
30  
50°  
25  
20  
.6  
.4  
.2  
60°  
70°  
Rθ  
=
JA  
800° C/W  
15  
10  
5
80°  
0
90°  
10° 20° 30° 40° 50° 60° 70° 80° 90°100°  
ANGLE  
0
20  
40  
60  
80  
100  
T
– AMBIENT TEMPERATURE – °C  
A
Figure4.MaximumDCCurrentvs.Ambient  
Temperature.  
Figure5.Intensityvs.Angle.  
6
10 SEC. MAX.  
250°C MAX.  
10 SEC. MAX.  
235°C MAX.  
PRE-HEAT 140-160°C  
90 SEC. MAX.  
ABOVE 183°C  
4°C/SEC. MAX.  
140-160°C  
4°C/SEC. MAX.  
3°C/SEC. MAX.  
3°C/SEC. MAX.  
OVER 2 MIN.  
TIME  
TIME  
Figure6.RecommendedReflowSolderingProfile.  
Figure7.RecommendedWaveSolderProfile.  
0.8 (0.031)  
0.80  
0.80  
USER FEED DIRECTION  
0.85  
HSMX-H690/H790 SERIES  
1.1 (0.043)  
CATHODE SIDE  
1.25  
(0.049)  
1.25  
(0.049)  
1.1  
(0.043)  
PRINTED LABEL  
HSMX-H670/H770 SERIES  
Figure8.RecommendedSolderPatterns.  
Figure9.ReelingOrientation.  
180  
(7.08)  
Ø
21.0  
(0.83)  
2.0  
(0.08)  
60.0  
(2.36)  
Ø
13.0  
Ø
(0.51)  
LABEL  
1.5  
(0.06)  
TYP.  
13.0  
(0.51)  
10.0  
(0.39)  
Figure10.ReelDimensions.  
NOTE:  
ALL DIMENSIONS IN MILLIMETERS (INCHES).  
7
1.50 + 0.10  
0
(0.059 + 0.004)  
0
1.30 ± 0.10  
(0.051 ± 0.004)  
4.00 ± 0.10  
(0.157 ± 0.004)  
Ø
CATHODE  
0.20 ± 0.05  
(0.008 ± 0.002)  
1.75 ± 0.10  
(0.069 ± 0.004)  
3.50 ± 0.05  
(0.138 ± 0.002)  
2.44 ± 0.10  
(0.096 ± 0.004)  
8.00 ± 0.30  
(0.315 ± 0.012)  
1.68 ± 0.10  
(0.066 ± 0.004)  
CARRIER TAPE  
COVER TAPE  
USER FEED  
DIRECTION  
2.00 ± 0.05  
(0.079 ± 0.002)  
4.00 ± 0.10  
(0.157 ± 0.004)  
Figure11.TapeDimensions,HSMx-H670/H770Series.  
END  
START  
THERE SHALL BE A  
MINIMUM OF 40 mm  
(1.57 INCH) OF EMPTY  
COMPONENT POCKETS  
SEALED WITH COVER  
TAPE.  
MOUNTED WITH THERE SHALL BE A  
150 mm-360 mm  
(5.9 - 14.2 INCH)  
MAY CONSIST  
COMPONENTS  
MINIMUM OF 40 mm  
(1.57 INCH) OF EMPTY  
COMPONENT POCKETS OF CARRIER  
SEALED WITH COVER  
TAPE.  
AND/OR  
COVER TAPE.  
Figure12.TapeLeaderandTrailerDimensionsforHSMx-H670/H770Series.  
1.50 + 0.10  
0
(0.059 + 0.004)  
0
0.74 ± 0.10  
(0.029 ± 0.004)  
Ø
4.00 ± 0.10  
(0.157 ± 0.004)  
CATHODE  
0.20 ± 0.05  
(0.008 ± 0.002)  
1.75 ± 0.10  
(0.069 ± 0.004)  
3.50 ± 0.05  
(0.138 ± 0.002)  
1.87 ± 0.10  
(0.074 ± 0.004)  
8.00 ± 0.30  
(0.315 ± 0.012)  
1.07 ± 0.10  
(0.040 ± 0.004)  
CARRIER TAPE  
COVER TAPE  
USER FEED  
DIRECTION  
2.00 ± 0.05  
(0.079 ± 0.002)  
Figure13.TapeDimensions,HSMx-H690/H790Series.  
END  
START  
THERE SHALL BE A  
MINIMUM OF 40 mm  
(1.57 INCH) OF EMPTY  
COMPONENT POCKETS  
SEALED WITH COVER  
TAPE.  
MOUNTED WITH  
COMPONENTS  
150 mm-360 mm  
(5.9 - 14.2 INCH)  
MAY CONSIST  
OF CARRIER  
AND/OR  
COVER TAPE.  
Figure14.TapeLeaderandTrailerDimensionsforHSMx-H690/H790Series.  
ConvectiveIRReflow  
Soldering  
ForinformationonIRreflow  
soldering,refertoApplication  
Note 1060, Surface Mounting  
SMI LED Indicator Components.  
www.semiconductor.agilent.com  
Data subject to change.  
Copyright © 1999 Agilent Technologies, Inc.  
Obsoletes 5966-4910E (7/98)  
5968-3196E (11/99)  

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