A19570LUBBTN-FSNBH-A
更新时间:2024-09-18 23:14:05
品牌:ALLEGRO
描述:Large Air Gap, Vibration-Immune, GMR Transmission Speed and Direction Sensor IC
A19570LUBBTN-FSNBH-A 概述
Large Air Gap, Vibration-Immune, GMR Transmission Speed and Direction Sensor IC
A19570LUBBTN-FSNBH-A 数据手册
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Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
FEATURES AND BENEFITS
DESCRIPTION
• GMR technology integrates high sensitivity MR
(magnetoresistive) sensor elements and high precision
BiCMOS circuits on a single silicon integrated circuit
offering high accuracy, low magnetic field operation
• Integrated capacitor in a single overmolded miniature
package provides greater EMC robustness
• SolidSpeed Digital Architecture supports advanced
algorithms, maintaining performance in the presence of
extreme system-level disturbances, including vibration
immunity capability over the full target pitch
• Flexible orientation for xMR or Hall replacement and
application installation flexibility
• ASIL B rating based on integrated diagnostics and
certified safety design process
• Two-wire current source output pulse-width protocol
supporting speed, direction, and ASIL
• EEPROM offers device traceability throughout the
production process
The A19570 is a giant magnetoresistance (GMR) integrated
circuit (IC) that provides a user-friendly two-wire solution
for applications where speed and direction information is
required. The small integrated package includes an integrated
capacitor and GMR IC in a single overmolded design with an
additional molded lead stabilizing bar for robust shipping and
ease of assembly.
The GMR-based IC is designed for use in conjunction with
front-biased ring magnet encoders. State-of-the-art GMR
technologywithindustry-leadingsignalprocessingalgorithms
accuratelyswitchinresponsetolow-leveldifferentialmagnetic
signals.ThehighsensitivityofGMRcombinedwithdifferential
sensing offers inherent rejection of interfering common-mode
magnetic fields and valid speed and direction sensing over
largerairgaps,commonlyrequiredintransmissionapplications.
Patented GMR technology allows the same IC orientation as
other MR technologies or the IC can be rotated for Hall-effect
compatibility as a drop-in solution in the application.
2
IntegrateddiagnosticsareusedtodetectanICfailurethatwould
impact the output protocol’s accuracy, providing coverage
compatiblewithASILBcompliance.Built-inEEPROMscratch
memory offers traceability of the device throughout the IC’s
production process.
-
SOLIDSPEED
DIGITAL ARCHITECTURE
PACKAGE:
2-Pin SIP
(suffix UB)
The IC is offered in the UB package, which integrates the IC
andahightemperatureceramiccapacitorinasingleovermolded
SIP package for enhanced EMC performance. The 2-pin SIP
package is lead (Pb) free, with tin leadframe plating.
Not to scale
VCC
+
ADC
Output
–
Current
Generator
ESD
Analog-to-Digital
Front End
Amplification
Digital
Controller
GMR
Elements
and
Signal Conditioning
+
–
ADC
GND
EEPROM
Oscillator
Diagnostics
Regulator
Figure 1: Functional Block Diagram
A19570-DS
November 14, 2018
MCO-0000525
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
SELECTION GUIDE
Configuration Options
A19570 L UBB TN-
-
ASIL Protocol:
A – ASIL Protocol enabled
[blanked] – ASIL Protocol disabled
Vibration Immunity/Direction Change:
L – No vibration immunity with immediate direction-change detection
H – High vibration immunity
Non-Direction Pulses:
B – Blanked, no output during calibration or vibration
P – Pulses during calibration or vibration
Reverse Pulse Width:
N – 90 µs (narrow)
W – 180 µs (wide)
Number of Pulses:
S – Single, one pulse per pole-pair
D – Dual, one pulse per each N and S pole of a pole-pair
Rotation Direction:
F – Forward rotation, pin 1 to pin 2
R – Forward rotation, pin 2 to pin 1
Instructions (Packing)
Package Designation
Operating Temperature Range
Allegro Identifier and Device Type
SELECTION GUIDE*
Part Number
Packing
Tape and Reel, 4000 pieces per reel
A19570LUBBTN-FSWPH
A19570LUBBTN-RSWPH
* Not all combinations are available. Contact Allegro sales for availability and pricing of
custom programming options.
2
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Characteristic
Symbol
Notes
Refer to Power Derating section;
Potential between pin 1 and pin 2
Rating
Unit
Supply Voltage
VCC
28
V
Reverse Supply Voltage
VRCC
TA
–18
–40 to 150
165
V
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
°C
°C
°C
G
TJ(max)
Tstg
–65 to 170
500
Applied Magnetic Flux Density
B
In any direction
INTERNAL DISCRETE CAPACITOR RATINGS
Characteristic
Symbol
Test Conditions
Value
Unit
Nominal Capacitance
CSUPPLY
Connected between pin 1 and pin 2 (refer to Figure 2)
10
nF
PINOUT DIAGRAM AND TERMINAL LIST
VCC
1
A19570
IC
1
2
2
VOUT = ICC × RL
CL
RL
Package UB, 2-Pin SIP Pinout Diagram
Terminal List Table
GND
Pin Name
Pin Number
Function
Supply Voltage
Ground
VCC
GND
1
2
Figure 2: Application Circuit
3
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
OPERATING CHARACTERISTICS: Valid throughout full operating voltage and ambient temperature ranges,
unless otherwise specified
Characteristic
ELECTRICAL CHARACTERISTICS
Supply Voltage[2]
Symbol
Test Conditions
Min.
Typ. [1]
Max.
Unit
VCC
IRCC
Potential between pin 1 and pin 2
VCC = VRCC(MAX)
4
–
–
24
–
V
Reverse Supply Current[3]
–10
mA
ICC = ICC(MAX) + 3 mA, TA = 25°C;
Potential between pin 1 and pin 2
Supply Zener Clamp Voltage
Supply Current
VZsupply
28
–
–
V
ICC(LOW)
ICC(HIGH)
ICC(HIGH)
ICC(LOW)
Low-current state
High-current state
5.9
12
7
8.4
16
mA
mA
14
/
Measured as a ratio of high current to low
current (isothermal)
Supply Current Ratio [4]
ASIL Safe State Current
1.9
1.5
–
–
–
3.9
–
–
IRESET
Refer to Figure 12 (-xxxxx-A variant)
3.5
90
mA
μs
Refer to Figure 12 (-xxxxx-A variant) (Error
Protocol 1)
tRESET(EP1)
ASIL Safe State Current Time
Refer to Figure 12 (-xxxxx-A variant) (Error
Protocol 2)
tRESET(EP2)
3
–
–
2
6
4
ms
µs
Voltage measured at terminal 2 in Figure 2;
RL = 100 Ω, CL = 10 pF, measured between
10% and 90% of ICC(LOW) and ICC(HIGH)
Output Rise/Fall Time
tr, tf
POWER-ON CHARACTERISTICS
Power-On State
POS
tPO
V
CC > VCC(min), as connected in Figure 2
ICC(LOW)
–
mA
ms
Power-On Time
VCC > VCC(min), as connected in Figure 2 [5]
–
1
OUTPUT PULSE-WIDTH PROTOCOL [6]
Forward Pulse Width
tw(FWD)
-xxNxx variant and -xxWxx variant
-xxNxx variant
38
76
45
90
52
μs
μs
μs
μs
μs
104
207
207
414
Reverse Pulse Width
tw(REV)
-xxWxx variant
153
153
306
180
180
360
-xxNPx variant
Nondirection Pulse Width
tw(ND)
-xxWPx variant
[1] Typical values are at TA = 25°C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits.
[2] Maximum voltage must be adjusted for power dissipation and junction temperature; see representative Power Derating section.
[3] Negative current is defined as conventional current coming out of (sourced from) the specified device terminal.
[4] Supply current ratio is taken as a mean value of ICC(HIGH) / ICC(LOW)
.
[5] Time between power-on to ICC stabilizing. Transitions prior to tPO should be ignored.
[6] Pulse width measured at threshold of (ICC(HIGH) + ICC(LOW)) / 2. ASIL Safe State Current Time is measured at the threshold of (IRESET + ICC(LOW)) / 2.
Continued on the next page…
4
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
OPERATING CHARACTERISTICS (continued): Valid throughout full operating voltage and ambient temperature ranges,
unless otherwise specified
Characteristic
Symbol
Test Conditions
Min.
Typ. [1]
Max.
Unit
INPUT CHARACTERISTICS AND PERFORMANCE
Operating Frequency, Forward
Rotation [7]
fFWD
-xSxxx variant
0
–
12
kHz
-xSNxx variant
-xSWxx variant
-xSNPx variant
-xSWPx variant
0
0
0
0
–
–
–
–
7
4
kHz
kHz
kHz
kHz
Operating Frequency, Reverse
Rotation [7]
fREV
4
Operating Frequency, Nondirection
Pulses [7]
fND
2.2
Minimum allowable for switching in Parallel
Orientation (refer to Figure 8)
5
–
–
G
Operating Differential Magnetic Input [8] BDIFF(pk-pk)
Minimum allowable for switching in
Perpendicular Orientation (refer to Figure 9)
11
–50
60
–
–
–
–
G
G
%
Operating Differential Magnetic Range [8]
BDIFF
Refer to Figure 6
50
BSEQ(n+1)
BSEQ(n)
/
Signal period-to-period variation (refer to Figure 3)
200
Allowable Differential Sequential
Signal Variation
BSEQ(n+i)
BSEQ(n)
/
Overall signal variation (run-out) (refer to Figure 3)
40
–
200
%
Operate Point
Release Point
Target Pitch
BOP
BRP
% of peak-to-peak IC-processed signal
% of peak-to-peak IC-processed signal
Arc length of each pole-pair (at 0 mm air gap)
Required amount of amplitude separated
–
–
70
30
–
–
–
8
%
%
TPITCH
1.4
mm
Switch Point Separation
BDIFF(SP-SEP) between channels at each BOP and BRP
occurrence. (refer to Figure 5)
20
–
–
%pk-pk
THERMAL CHARACTERISTICS
Magnetic Temperature Coefficient[9]
Package Thermal Resistance
TC
Valid for full temperature range based on ferrite
Single-layer PCB with copper limited to solder pads
–
–
0.2
–
–
%/°C
°C/W
RθJA
213
[7] Maximum Operating Frequency is determined by satisfactory separation of output pulses: ICC(LOW) of tw(FWD)(min). If the customer can resolve shorter low-state durations, maximum fREV
and fND may be increased.
[8] Differential magnetic field is measured for the Channel A (E1-E3) and Channel B (E2-E4). Each channel’s differential magnetic field is measured between two GMR elements spaced by
1.4 mm. Magnetic field is measured in the By direction (Refer to Figure 7). To maintain optimal performance, it is recommended that the |Bx| field be less than 80 G.
[9] Ring magnet decreases strength with rising temperature, and the device compensates. Note that BDIFF(pk-pk) requirement is not influenced by this.
Continued on the next page…
5
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
OPERATING CHARACTERISTICS (continued): Valid throughout full operating voltage and ambient temperature ranges,
unless otherwise specified
Characteristic
Symbol
Test Conditions
Min.
Typ. [1]
Max.
Unit
PERFORMANCE CHARACTERISTICS
2 ×
TCYCLE
-xSxxH variant
-xSxxL variant
-xSxxH variant
-xSxxL variant
-xSxxH variant
-xSxxL variant
-xSxxH variant
-xSxxL variant
-xSxxH variant
-xSxxL variant
-xSxxH variant
-xSxxL variant
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Vibration Immunity Startup
ErrVIB(SU)
0.06 ×
TCYCLE
2 ×
TCYCLE
Vibration Immunity Running Mode
First Direction Output Pulse [10]
ErrVIB
0.03 ×
TCYCLE
4 ×
TCYCLE
–
–
–
–
–
–
–
–
4 ×
TCYCLE
4 ×
TCYCLE
First Direction-Pulse Output Following
Direction Change [10]
1.75 ×
TCYCLE
4.25 ×
TCYCLE
First Direction-Pulse Output Following
Startup Mode Vibration [10]
3.75 ×
TCYCLE
4.25 ×
TCYCLE
First Direction-Pulse Output Following
Running Mode Vibration [10]
3.75 ×
TCYCLE
[10] Power-up frequencies ≤ 1 kHz. Rotational frequencies above 1 kHz may require more input magnetic cycles until output edges are achieved.
Target
S
N
S
N
B SEQ(n)
B SEQ(n + 1)
TCYCLE
B SEQ(n+i) , i ≥ 2
BDIFF
TCYCLE = Target Cycle; the amount of rotation that
moves one north pole and one south pole
across the sensor
BDIFF = Differential Input Signal; the differential magnetic
flux density sensed by the sensor
Figure 3: Differential Signal Variation
Figure 4: Definition of TCYCLE
6
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
S
N
S
N
TCYCLE
BDIFF(SP)
BDIFF(BOP)
(BOP
)
Channel B
BDIFF(pk-pk)
(BRP
)
BDIFF(BRP)
BDIFF(SP)
Channel A
BDIFF(SP)
BDIFF(pk-pk)
BDIFF(SP-SEP)
=
Figure 5: Definition of Switch Point Separation
ꢁꢂꢃꢄꢄꢅMAꢊꢆ
Aꢈꢈlied ꢁꢂꢃꢄꢄ
ꢁꢂꢃꢄꢄꢅꢈꢉ-ꢈꢉꢆ
0 ꢀ
ꢁꢂꢃꢄꢄꢅMꢃNꢆ
ꢇime
Figure 6: Input Signal Definition
7
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
FUNCTIONAL DESCRIPTION
The A19570 sensor IC contains a single-chip GMR circuit that
uses spaced elements. These elements are used in differential
pairs to provide electrical signals containing information regard-
ing speed and direction of target rotation. The A19570 is intended
for use with ring magnet targets.
Installation Orientation Flexibility
The A19570 can be installed in a parallel, perpendicular, or any
orientation in between with respect to the ring magnet. Refer to
Figure 7, Figure 8, and Figure 9 for parallel and perpendicular
orientations of the sensor.
The IC detects the peaks of the magnetic signals and sets
dynamic thresholds based on these detected signals.
ꢀꢁ
ꢀy
ꢀꢂ
Pin 1
Figure 7: Package Orientation
Pin 1
Rotation
Rotation
Pin 1
Figure 9: Perpendicular Orientation
Figure 8: Parallel Orientation
8
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
Forward Rotation. For the -Fxxxx variant, when the target is
rotating such that a target feature passes from pin 1 to pin 2, this
Data Protocol Description
When a target passes in front of the device (opposite the branded
face of the package case), the A19570 generates an output pulse
for each magnetic pole-pair (-xSxxx variant) of the target. Speed
information is provided by the output pulse rate, while direction
of target rotation is provided by the duration of the output pulses.
The sensor IC can sense target movement in both the forward and
reverse directions.
is referred to as forward rotation. This direction of rotation is
indicated on the output by a tW(FWD) pulse width. For the -Rxxxx
variant, forward direction is indicated for target rotation from pin
2 to 1.
Reverse Rotation. For the -Fxxxx variant, when the target
is rotating such that a target feature passes from pin 2 to pin 1,
this is referred to as reverse rotation. This direction of rotation is
indicated on the output by a tW(REV) pulse width. For the -Rxxxx
variant, reverse direction is indicated for target rotation from pin
1 to 2.
Output edges are triggered by BDIFF transitions through the
switchpoints. On a crossing, the output pulse of ICC(HIGH) is pres-
S
N
N
Pacꢇage Case ꢀranded ꢈace
Device Orientation to Target
ent for tw(FWD) or tw(REV)
.
ꢀꢁ
ꢅPin ꢄ Sideꢆ
Channel ꢀ
ꢂꢃ ꢂ3 ꢂꢄ ꢂ1
ꢅPin 1 Sideꢆ
The IC is always capable of properly detecting input signals up to
the defined operating frequency. At frequencies beyond the oper-
ational frequency specifications (refer to Operational Frequency
specifications noted on page 5), the ICC(HIGH) pulse duration will
collide with subsequent pulses.
ꢅꢋoꢌ ꢍiew oꢎ
Pacꢇage Caseꢆ ꢂlement Pitch
Channel A
ꢂlement Pitch
Mechanical Position (Target moves past device pin 1 to pin 2)
ꢋarget
ꢋhis ꢌole
sensed later
ꢋhis ꢌole
sensed earlier
ꢅRadial Ring Magnetꢆ
ꢂ
ꢃ
ꢃ
Target Magnetic Profile
Channel
ꢂlement Pitch
ꢉꢀ
N
S
N
S
ꢊꢀ
ICC(HIGH)
tW(FWD)
tW(FWD)
IC Internal Differential Analog Signals, BDIFF
ꢀꢁP
ꢀꢁP
ICC(LOW)
Channel A
ꢀRP
ꢀꢁP
Channel ꢀ
Figure 11: Output Timing Example (-xSxxx variant)
ꢀRP
Detected Channel Switching
Channel A
Channel ꢀ
Device Output Signal
ꢏCCꢅHꢏꢐHꢆ
ꢏCCꢅLꢁꢑꢆ
Figure 10: Basic Operation
9
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
ASIL Safe State Output Protocol
The A19570 sensor IC contains diagnostic circuitry that will
continuously monitor occurrences of failure defects within the IC.
Refer to Figure 12 for the output protocol of the ASIL safe state
after an internal defect has been detected. Error Protocol 1 will
result from faults due to overfrequency conditions from the input
signal. Error Protocol 2 will result from hard failures detected
within the A19570 such as a regulator and front end fault.
Note: If a fault exists continuously, the device will stay in perma-
nent safe state. Refer to the A19570 Safety Manual for additional
details on the ASIL Safe State Output Protocol.
Magnetic
ꢀncoder
ꢀ
ꢁ
ꢀ
ꢁ
ꢀ
ꢁCCꢂHꢁꢃHꢄ
Normal
ꢅꢋeration
ꢁCCꢂLꢅꢆꢄ
ꢁCCꢂHꢁꢃHꢄ
ꢀrror
ꢀrror
Protocol 1
ꢁCCꢂLꢅꢆꢄ
ꢁRꢀSꢀꢇ
ꢈirst ꢉirection ꢅꢊtꢋꢊt Pꢊlse
tRꢀSꢀꢇꢂꢀP1ꢄ
ꢁCCꢂHꢁꢃHꢄ
ꢀrror
ꢀrror
Protocol ꢌ
ꢁCCꢂLꢅꢆꢄ
ꢁRꢀSꢀꢇ
ꢈirst ꢉirection Pꢊlse ꢅꢊtꢋꢊt
tRꢀSꢀꢇꢂꢀPꢌꢄ
Figure 12: Output Protocol of the -xxxBx-A Variant (ASIL Safe State)
10
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
Calibration and Direction Validation
When power is applied to the A19570, the built-in algorithm per-
forms an initialization routine. For a short period after power-on,
the device calibrates itself and determines the direction of target
rotation. For the -xxxPx variant, the output transmits nondirection
pulses during calibration (Figure 13). For the -xxxBx variant, the
output does not transmit any pulses during calibration.
Once the calibration routine is complete, the A19570 will trans-
mit accurate speed and direction information.
Target Rotation
N
S
N
S
N
S
N
S
N
Target
Differential
Magnetic
Profile
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(ND)
tW(ND)
tW(ND)
tW(ND)
Opposite
north pole
tW(ND)
tW(ND)
Opposite
N→S boundary
I
CC
Opposite
south pole
tW(ND)
Opposite
t
S→N boundary
Device Location at Power-On
Figure 13: Calibration Behavior of the -xSxPH Variant
11
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
Direction Changes, Vibrations, and
Anomalous Events
During normal operation, the A19570 will be exposed to changes The -xxxPx variant may transmit non-direction pulses during
in the direction of target rotation (Figure 14), vibrations of the
target (Figure 15), and anomalous events such as sudden air
gap changes. These events cause temporary uncertainty in the
A19570’s internal direction detection algorithm.
vibrations, and the -xxxBx variant will not transmit any pulses
during vibrations.
Direc�on
Change
Forward
Reverse
Rota�on
Rota�on
N
S
N
S
N
S
N
S
N
Target Differen�al
Magne�c Profile
tW(FWD)
tW(FWD)
tW(FWD)
tW(REV)
tW(REV)
ICC
-xSxBH variant
-xSxPH variant
tW(FWD)
tW(ND)
tW(ND)
Figure 14: Direction Change Behavior
Vibraꢀon
Target Rotaꢀon
Target Rotaꢀon
N
S
N
S
N
S
N
S
N
Target Differenꢀal
Magneꢀc Profile
tW(FWD)
[or tW(REV)
tW(FWD)
tW(FWD)
[or tW(REV)
tW(FWD)
tW(FWD)
[or tW(REV)
tW(FWD)
-xSxPH variant
-xSxBH variant
]
]
]
ICC
tW(ND)
[or tW(REV)
]
[or tW(REV)
]
[or tW(REV)]
Figure 15: Vibration Behavior
12
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
POWER DERATING
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max)
at a selected RθJA and TA.
,
Example: Reliability for VCC at TA = 150°C.
Observe the worst-case ratings for the device, specifically:
RθJA = 213°C/W (subject to change), TJ(max) = 165°C, VCC(max)
= 24 V, and ICC(AVG) = 15.4 mA. ICC(AVG) is computed using
ICC(HIGH)(max) and ICC(LOW)(max), with a duty cycle of 92%
computed from tw(ND)(max) on-time and tw(FWD)(min) off-time
(pulse-width protocol). This condition happens at a select limited
frequency.
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RθJC, is
a relatively small component of RθJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by
overmolding.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
ΔTmaxꢀ=ꢀTJ(max)ꢀ–ꢀTAꢀ=ꢀ165°Cꢀ–ꢀ150°Cꢀ=ꢀ15ꢀ°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
The effect of varying power levels (Power Dissipation, PD) can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
P
D(max)ꢀ=ꢀΔTmax ÷ RθJAꢀ=ꢀ15°Cꢀ÷ꢀ213°C/Wꢀ=ꢀ70.4ꢀmWꢀ
Finally, invert equation 1 with respect to voltage:
CC(est) = PD(max) ÷ ICC(max)ꢀ=ꢀ70.4ꢀmWꢀ÷ꢀ15.4ꢀmAꢀ=ꢀ4.6ꢀVꢀ
The result indicates that, at TA , the application and device can
dissipate adequate amounts of heat at voltages ≤ VCC(est)
PD = VIN × IIN
ΔTꢀ=ꢀPD × RθJA
TJꢀ=ꢀTAꢀ+ꢀΔTꢀꢀ
(1)
(2)
(3)
V
ꢀ
ꢀ
.
For example, given common conditions such as:
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
TA= 25°C, VCC = 12 V, RθJA = 213°C/W, and ICC = 7.15 mA,
then:
PD = VCC × ICC = 12 V × 7.15 mA = 85.8 mW
ΔTꢀ=ꢀPD × RθJAꢀ=ꢀ85.8ꢀmWꢀ×ꢀ213°C/Wꢀ=ꢀ18.3°C
TJꢀ=ꢀTAꢀ+ꢀΔTꢀ=ꢀ25°Cꢀ+ꢀ18.3°Cꢀ=ꢀ43.3°C
13
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
Power Derating Curve
ꢃ5
ꢃꢄ
ꢃ3
ꢍ
CCꢈmaꢋꢊ
ꢃꢃ
ꢃ1
ꢃ0
19
1ꢂ
1ꢁ
1ꢀ
15
1ꢄ
13
1ꢃ
11
10
9
1-layer PCꢒ, Pacꢓage Uꢒ
ꢈRθꢎA ꢏ ꢃ13ꢉCꢐꢑꢊ
ꢂ
ꢁ
ꢀ
5
ꢄ
3
ꢍ
CCꢈminꢊ
ꢃ
ꢃ0
ꢄ0
ꢀ0
ꢂ0
100
1ꢃ0
1ꢄ0
1ꢀ0
1ꢂ0
ꢅemꢆeratꢇre ꢈꢉCꢊ
Power Dissipation versus Ambient Temperature
1900
1ꢄ00
1ꢃ00
1ꢂ00
1500
1ꢁ00
1300
1ꢀ00
1100
1000
900
1-layer PCꢑ, Pacꢒage Uꢑ
ꢈRθꢍA ꢎ ꢀ13ꢏCꢐꢌꢊ
ꢄ00
ꢃ00
ꢂ00
500
ꢁ00
300
ꢀ00
100
0
ꢀ0
ꢁ0
ꢂ0
ꢄ0
100
1ꢀ0
1ꢁ0
1ꢂ0
1ꢄ0
ꢅemꢆeratꢇre ꢈꢉCꢊ
14
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
PACKAGE OUTLINE DRAWING
For Reference Only – Not for Tooling Use
(Reference DWG-0000408, Rev. 3)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.06
–0.05
4.00
B
4×10°
1.50 ±0.05
0.84
C
0.56
1.02
0.56
1.39
Mold Ejector
Pin Indent
XXXXX
Date Code
Lot Number
+0.06
4.00
–0.07
E
E1
E4
E3
E
E
E2
E
45°
Branded
Face
D
Standard Branding Reference View
A
0.42 ±0.05
0.85 ±0.05
Line 1ꢀ 5 characters
Lines ꢁ, 3ꢀ 5 characters
4 × 2.50 ±0.10
0.25 REF
0.30 REF
2.54 REF
Line 1ꢀ Part Nꢂmꢃer
Line ꢁꢀ ꢄ-digit date code
Line 3ꢀ Characters 5, ꢅ, ꢆ, ꢇ oꢈ
Assemꢃly Lot Nꢂmꢃer
ꢉꢊceꢋtion allowed ꢈor ꢋarts with
mꢂltiꢋle ꢋacꢌage ꢍariantsꢀ
Line 1ꢀ Last ꢄ digits oꢈ ꢋart nꢂmꢃer ꢋlꢂs
Pacꢌage ꢎariant
1
2
18.00 ±0.10
12.20 ±0.10
4 × 7.37 REF
1.00 ±0.05
+0.07
–0.03
0.25
1.80 ±0.10
A
B
C
D
E
F
Dambar removal protrusion (8×)
Gate and tie burr area
Active Area Depth, 0.38 ±0.03 mm
0.38 REF
0.25 REF
Branding scale and appearance at supplier discretion
GMR elements (E1, E2, E3, and E4); not to scale
Molded Lead Bar for preventing damage to leads during shipment
4 × 0.85 REF
0.85 ±0.05
+0.06
–0.07
1.80
F
+0.06
4.00
1.50 ±0.05
–0.05
Figure 16: Package UB, 2-Pin SIP
15
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Large Air Gap, Vibration-Immune,
GMR Transmission Speed and Direction Sensor IC
A19570
Revision History
Number
Date
Description
–
November 14, 2018
Initial release
Copyright ©2018, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.
For the latest version of this document, visit our website:
www.allegromicro.com
16
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
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