A80606KEVJSR-1 [ALLEGRO]

High Power LED Driver with Pre-Emptive Boost;
A80606KEVJSR-1
型号: A80606KEVJSR-1
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

High Power LED Driver with Pre-Emptive Boost

文件: 总41页 (文件大小:5340K)
中文:  中文翻译
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A80606 and A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
FEATURES AND BENEFITS  
DESCRIPTION  
The A80606 is a multi-output LED driver for automotive  
applicationssuchasexteriorlighting,heads-updisplay,andmid-  
size LCD backlighting. It implements a current-mode boost/  
SEPICconverterwithgatedriverforexternalN-MOSFET.This  
allows greater output power even at minimum supply voltage.  
• Automotive AEC-Q100 qualified  
• Enhanced fault handling for ASIL B system compliance  
• Wide input voltage range of 4.5 to 40 V for start/stop,  
cold crank, and load dump requirements  
• Operate in Boost or SEPIC mode for flexible output  
• Gate driver for external NMOS to deliver higher output power  
• Six integrated LED current sinks, up to 180 mA each  
• Boost switching frequency synced externally or  
programmed from 200 kHz to 2.3 MHz  
• Programmable boost frequency dithering to reduce EMI  
• Advanced control allows minimum PWM on-time down  
to 0.3 µs, and avoids MLCC audible noises  
• LED contrast ratio: 15,000:1 at 200 Hz using PWM  
dimming alone, 150,000:1 when combining PWM and  
analog dimming  
The A80606 provides six integrated current sinks driving up  
to 180 mAper string. Multiple sinks can be paralleled together  
to achieve higher LED currents up to 1.08 A. The IC operates  
from single power supply from 4.5 to 40 V; once started, it can  
continue to operate down to 4 V. This allows it to withstand  
stop/start, cold crank, and load dump conditions encountered  
in automotive systems.  
TheA80606cancontrolLEDbrightnessthroughexternalPWM  
signal.ByusingthepatentedPre-EmptiveBoostcontrol,anLED  
brightnesscontrastratioof15,000:1canbeachievedusingPWM  
dimmingat200Hz.Ahigherratioof150,000:1ispossiblewhen  
using a combination of PWM and analog dimming.  
• Excellent input voltage transient response even at lowest  
PWM duty cycle  
• Gate driver for optional PMOS input disconnect switch  
• Extensive fault protection features  
Continued on next page...  
PACKAGE:  
APPLICATIONS  
• Automotive infotainment backlighting  
48-Pin 7 mm × 7 mm  
QFN with Wettable Flank  
• Automotive heads-up display  
• Automotive interior and exterior lighting  
Not to scale  
VIN = 8-16 V  
VOUT ≤ 40 V  
optional input overcurrent disconnect  
L1  
RSENSE  
RADJ  
D1  
CIN2  
Q1  
D2  
Cin  
ROVP  
RCS  
CDRV  
RGDRV  
COUT  
CS  
GATE  
VDRV GDRV  
PGND  
OVP  
Vsense  
VIN  
V
c
CVDD  
VDD  
RPU  
LED1  
FAULT  
A80606  
Up to 11 WLEDs in series  
Up to 180 mA/channel  
Combine to drive up to 1.08 A total  
LED2  
LED3  
EN  
Enable  
PWM  
ADIM  
PWM tON ≥ 0.3 µs  
LED6  
CLKOUT  
AGND  
iLED  
COMP  
PEB  
100%  
FSET  
ISET  
DITH  
RZ  
ADIM  
CP  
RM  
PEB = Pre-Emptive Boost  
(RD controls the delay time)  
DITH = Dithering Control  
RISET  
RFSET  
RD  
CM  
CZ  
APWM 100 kHz 0-90%  
(Modulation frequency and range)  
Figure 1: A80606 in typical Boost configuration where VOUT is higher than VIN  
A80606-DS  
August 27, 2020  
MCO-0000926  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
DESCRIPTION (continued)  
Switchingfrequencycanbeexternallysynchronizedorprogrammed  
between 200 kHz and 2.3 MHz. This allows operation either above  
or below the AM band. A programmable dithering feature further  
reduces EMI. A clock-out is provided for other converters to sync  
to the A80606.  
The A80606 provides protection against output short, overvoltage,  
open- or shorted-LED pin, and overtemperature. A cycle-by-cycle  
current limit protects the external boost switch against high current  
overloads. An external P-MOSFET can optionally be used to  
disconnect input supply in case of output to ground short fault. The  
A80606-1 is similar toA80606 except it adopts ‘One-Out-All-Out’  
fault handling (See Fault Table section for details).  
SELECTION GUIDE [1]  
Part Number  
A80606KEVJSR  
A80606KEVJSR-1  
Fault Handling  
One-Out-Continue  
One-Out-All-Out  
LED Driver  
Package  
Packing  
48-pin 7 mm × 7 mm wettable flank QFN  
with exposed thermal pad and sidewall plating  
4000 pieces  
per 13-inch reel  
6 × 180 mA  
[1] Contact Allegro for additional packing options.  
ABSOLUTE MAXIMUM RATINGS [2]  
Characteristic  
Symbol  
Notes  
Rating  
Unit  
LEDx Pin  
OVP pin  
VIN  
VLEDx  
VOVP  
VIN  
x = 1..6  
–0.3 to 40  
–0.3 to 40  
V
V
V
–0.3 to 40  
Higher of –0.3  
and (VIN – 7.4) to  
VIN +0.4  
VSENSE  
VGATE  
,
VSENSE, GATE  
V
VDRV, GDRV  
CS  
VDRV, VGDRV  
VCS  
–1.0 to 7.5  
–0.3 to 7  
V
V
EN, PWM, FAULT, ADIM, COMP,  
DITH, PEB, FSET, ISET, VDD  
External input signals must not be higher than VIN + 0.4 V  
–0.3 to 5.5  
V
Maximum Junction Temperature  
Storage Temperature  
TJ(max)  
Tstg  
150  
°C  
°C  
–55 to 150  
[2] Stresses beyond those listed in this table may cause permanent damage to the device. The absolute maximum ratings are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated in the Electrical Characteristics table is not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information  
Characteristic  
Symbol  
Test Conditions [4]  
Value  
Unit  
Package Thermal Resistance  
RθJA  
EV package measured on 4-layer PCB based on JEDEC standard  
24  
°C/W  
[4] Additional thermal information available on the Allegro website.  
2
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Table of Contents  
LED Current Setting ........................................................ 18  
PWM Dimming ............................................................... 18  
Pre-Emptive Boost (PEB)................................................. 19  
Analog Dimming ............................................................. 20  
ADIM Mode ................................................................ 20  
APWM Mode .............................................................. 21  
Extending LED Dimming Ratio.......................................... 22  
Analog Dimming with External Voltage............................... 23  
VDD.............................................................................. 24  
VDRV............................................................................ 24  
Shutdown....................................................................... 24  
Fault Detection and Protection............................................. 25  
FAULT Status ................................................................. 25  
LED String Partial-Short Detect ........................................ 27  
Overvoltage Protection .................................................... 28  
Boost Switch Overcurrent Protection ................................. 29  
Input Overcurrent Protection and Disconnect Switch ........... 30  
Setting the Input Current Sense Resistor ........................... 31  
Input UVLO.................................................................... 31  
Fault Protection During Operation ..................................... 31  
Package Outline Drawing.................................................... 34  
Appendix A: Design Example............................................... 35  
Appendix B: External MOSFET Selection Guide .................... 39  
Features and Benefits........................................................... 1  
Description.......................................................................... 1  
Applications......................................................................... 1  
Package ............................................................................. 1  
Selection Guide ................................................................... 2  
Absolute Maximum Ratings................................................... 2  
Thermal Characteristics ........................................................ 2  
Typical Application – SEPIC .................................................. 3  
Functional Block Diagram ..................................................... 4  
Pinout Diagram and Terminal List........................................... 5  
Electrical Characteristics....................................................... 6  
Application Example........................................................... 10  
Functional Description .........................................................11  
Enabling the IC................................................................11  
Powering Up: LED Detection Phase.................................. 12  
Powering Up: Boost Output Undervoltage.......................... 14  
Soft Start Function .......................................................... 14  
Frequency Selection........................................................ 15  
Synchronization.............................................................. 15  
Loss of External Sync Signal............................................ 16  
Switching Frequency Dithering ......................................... 17  
Clock Out Function.......................................................... 17  
ꢇꢋ  
ꢇ1  
ꢎreaꢏdown ꢐoltage oꢑ ꢒ1 and  
ꢃ1 mꢓst ꢔeꢂN ꢖ ꢁꢀUꢅ  
ꢂN ꢌ ꢍ-1ꢈ ꢁ  
ꢃ1  
ꢀUꢅ ≤ 40 V  
ꢊ  
ꢂN  
ꢒ1  
RꢀꢁP  
ꢀUꢅ1  
ꢀUꢅꢋ  
ꢃRꢁ  
ꢄAꢅꢆ  
ꢁsense  
ꢁꢃRꢁ ꢄꢃRꢁ ꢊS  
PꢄNꢃ  
ꢀꢁP  
ꢊ  
ꢁꢂN  
ꢃꢃ  
ꢁꢃꢃ  
RPU  
ꢇꢆꢃ1  
ꢇꢆꢃꢋ  
ꢇꢆꢃ3  
A80606  
ꢉAUꢇꢅ  
ꢆN  
Uꢗ to 11 ꢘꢇꢆꢃs in series  
Uꢗ to 1ꢍ0 mAꢙch. ꢊomꢔine  
to driꢐe ꢓꢗ to 1.0ꢍ A total  
ꢆnaꢔle  
PꢘM  
AꢃꢂM  
ꢇꢆꢃꢈ  
PꢘM t  
0.3 ꢚs  
on  
iꢇꢆꢃ  
ꢊꢇꢞꢀUꢅ  
AꢄNꢃ  
ꢊꢀMP  
Pꢆꢎ  
100ꢝ  
ꢉSꢆꢅ  
ꢂSꢆꢅ  
ꢃꢂꢅH  
AꢃꢂM  
Rꢛ  
ꢛ  
P  
RꢃꢂꢅH  
ꢃꢂꢅH  
RꢂSꢆꢅ  
RPꢆꢎ  
RꢉSꢆꢅ  
APꢘM 100ꢏHꢜ 0-90ꢝ  
Figure 2: A80606 in typical SEPIC configuration where VOUT can be either higher or lower than VIN  
3
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢍꢄUꢊ  
SꢉNSꢉ  
ꢍꢅRꢍ  
Sꢘ  
ꢉꢚternal  
SꢗNꢇ  
ꢅꢎꢊH  
RꢀSꢉꢊ  
RꢅꢎꢊH  
ꢈ1  
ꢏAꢊꢉ  
ꢅRꢍ  
ꢅꢎꢊH  
ꢀSꢉꢊꢌSꢗNꢇ  
ꢍꢎN  
ꢄscillator  
ꢏate ꢅriꢆer  
ꢈꢅꢄ ꢑꢞ.5 ꢍꢓ  
ꢇꢈꢝꢄUꢊ actiꢆe as  
long as ꢉNꢠH  
ꢀreꢟꢁency  
dithering  
ꢇꢈꢝꢄUꢊ  
ꢇlocꢃ ꢄꢁt  
ꢂꢁꢔꢔer  
ꢏꢅRꢍ  
NMꢄS  
ꢏate  
ꢅriꢆe  
ꢉnaꢙle  
Sꢘ  
ꢂoost  
ꢉnaꢙle  
ꢇS  
ꢇꢄMP  
ꢇomꢋarator  
RꢇS  
PꢏNꢅ  
ꢇꢄMP  
PꢏNꢅ  
ꢇꢁrrent  
sense  
Soꢔt Start  
Ramꢋ  
ꢇꢄMP  
ꢈꢉꢅ  
reꢔ  
1ꢞ msꢓ  
1 MHꢛ  
ꢡꢒ  
ꢈꢉꢅ1  
ꢒ MHꢛ  
.
.
Mꢁlti-inꢋꢁt  
ꢉrror Amꢋ  
ꢄꢇPꢐ  
ꢊSꢅ  
System  
ꢍꢄUꢊ  
oscillator  
ꢀSꢉꢊ or ꢎSꢉꢊ  
ꢋin ꢄꢋenꢌShort  
ꢍꢅꢅ  
ꢎnternal ꢍꢅꢅ  
ꢑꢒ.ꢐ5 ꢍꢓ  
ꢍꢅꢅ  
RꢄꢍP  
ꢍꢎN  
ꢄꢍP  
sense  
Regꢁlator  
Uꢍꢈꢄ ꢂlocꢃ  
1.ꢐ35 ꢍ  
Rꢉꢀ  
ꢄꢍP  
ꢍreꢔ  
ꢀaꢁlt ꢂlocꢃ  
ꢄꢋenꢌShort  
ꢈꢉꢅ ꢅetect  
AꢏNꢅ  
RSꢉNSꢉ  
ꢉnaꢙle  
ꢈꢉꢅ1  
ꢈꢉꢅꢐ  
ꢈꢉꢅ3  
ꢎnꢋꢁt cꢁrrent  
sense amꢋ  
SꢉNSꢉ  
ꢈꢉꢅ  
ꢅriꢆer  
ꢂlocꢃ  
ꢇhoꢋꢋing  
ꢔreꢟ ꢠ ꢒ MHꢛ  
iAꢅꢖ  
ꢍꢎN  
ꢈꢉꢅꢒ  
ꢈꢉꢅ5  
ꢄnꢌꢄꢔꢔ  
ꢏAꢊꢉ  
ꢄꢀꢀ  
ꢂoost  
ꢉnaꢙle  
ꢏAꢊꢉ  
ꢉN  
ꢇꢁrrent  
leꢆel  
ꢈꢉꢅꢞ  
AꢅꢎM  
PMꢄS  
ꢅriꢆer  
AꢏNꢅ  
ꢇlocꢃ  
detector  
ꢉnaꢙle  
ꢍreꢔ  
100kΩ  
ꢎnt ꢍꢅꢅ  
ꢎSꢉꢊ  
ꢝeeꢋ-Aliꢆe  
ꢊimer  
ꢎSꢉꢊ  
ꢂlocꢃ  
100 kΩ  
1 MHꢛ  
RꢎSꢉꢊ  
ꢉꢚternal PꢘM  
100 Hꢛ ꢜ ꢐ0 ꢝHꢛ  
PꢘM  
ꢍꢅꢅ  
ꢉꢚternal  
ꢀAUꢈꢊ  
ꢈꢉꢅ ꢉnaꢙle  
RPU  
start  
Pre-ꢉmꢋtiꢆe  
ꢂoost  
100 kΩ  
Pꢉꢂ  
ꢀAUꢈꢊ  
ꢎnternal ꢀAUꢈꢊ  
delay  
RPꢉꢂ  
A80606  
AꢏNꢅ  
Figure 3: Functional Block Diagram  
4
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
PINOUT DIAGRAM AND TERMINAL LIST  
Nꢅ  
Nꢅ  
Nꢅ  
3ꢀ  
35  
3ꢁ  
33  
3ꢂ  
31  
30  
ꢂ9  
ꢂꢃ  
ꢂꢄ  
ꢂꢀ  
ꢂ5  
1
Nꢅ  
PꢌNꢍ  
ꢐꢉP  
ꢇꢋꢍ1  
ꢇꢋꢍꢂ  
ꢇꢋꢍ3  
ꢇꢋꢍꢁ  
ꢇꢋꢍ5  
ꢇꢋꢍꢀ  
Nꢅ  
Nꢅ  
3
Nꢅ  
ꢉꢍꢍ  
Nꢅ  
5
PAꢍ  
AꢌNꢍ  
ꢅꢐMP  
ꢊSꢋꢈ  
Pꢋꢑ  
ꢍꢊꢈH  
Nꢅ  
9
10  
11  
1ꢂ  
Nꢅ  
Package EV, 48-Pin QFN Pinouts  
Subject to Change (contact factory before using)  
Terminal List Table  
Number  
Name  
Function  
1-4, 6, 12-14,  
20-26, 35-39,  
47-48  
NC  
Pins marked "NC" may be connected to GND to improve thermal performance.  
5
7
8
9
VDD  
AGND  
COMP  
ISET  
Output of internal LDO (bias regulator). Connect a 1 µF decoupling capacitor between this pin and AGND. VDD is regulated at ~4.25 V.  
LED current Ground. Also serves as ‘quiet’ ground for analog signals.  
Output of the error amplifier and compensation node. Connect a series RZ-CZ network from this pin to AGND for control loop compensation.  
Connect RISET resistor between this pin and AGND to set the 100% LED current.  
Pre-Emptive Boost control: Connect resistor from PEB pin to AGND to fine-tune the delay between boost switch and LED current sinks. Leave pin open for minimum  
PEB delay of 1 μs.  
10  
11  
15  
16  
PEB  
DITH  
FSET  
ADIM  
Dithering control: connect a capacitor to AGND to set the dithering modulation frequency (1 to 22 kHz). Connect a resistor between DITH and FSET pins to set the  
dithering range (such as ±5% of fSW).  
Frequency/Synchronization pin. A resistor RFSET from this pin to AGND sets the switching frequency fSW (with dithering superimposed) between 200 kHz and  
2.3 MHz. It can also be used to synchronize fSW to an external frequency between 260 kHz and 2.3 MHz (frequency dithering is disabled in this case).  
Analog dimming. Apply a PWM clock (40 to 1000 kHz) to pin and the duty cycle of this clock determines the LED current. Alternatively, apply DC level between 0.2  
and 2 V to vary LED current between 10% and 100%. If unused, pull pin above 2 V for 100%.  
Controls the on/off state of LED current sinks to reduce the light intensity by using pulse-width modulation. Typical PWM dimming frequency is in the range of 200 Hz  
to 2 kHz. EN and PWM pins may be tied together to allow single-wire dimming control.  
17  
18  
19  
PWM  
EN  
Enables the IC when this pin is pulled high. If EN goes low, the IC remains in standby mode for up to 16 ms, then shuts down completely.  
Logic output representing the switching frequency of internal boost oscillator. This allows other converters to be synchronized to the same fSW with the same dithering  
modulation, if applicable. Output is active as long as IC is enabled.  
CLKOUT  
33  
34  
40  
41  
42  
43  
OVP  
PGND  
VDRV  
CS  
Overvoltage Protection. Connect external resistor from VOUT to this pin to adjust the overvoltage protection threshold.  
Power Ground for internal Gate Driver. Connect pin to external power GND with shortest path.  
Gate driver supply voltage (~6.5 V). Connect a 2.2 µF MLCC to PGND for buffer.  
Current Sense for peak current control of power switch. Connect to sense resistor at the Source terminal of external power MOSFET.  
Gate driver for power switch. Connect to Gate of external power MOSFET. (External FET must be fully enhanced at VGS = 5 V).  
Output gate driver pin for external P-channel MOSFET (input disconnect switch).  
GDRV  
GATE  
Connect this pin to the negative sense side of the input current sense resistor RSC. The threshold voltage is measured as VIN – VSENSE. There is also fixed iADJ  
current sink to allow for trip threshold adjustment.  
44  
VSENSE  
45  
46  
VIN  
Input power to the IC as well as the positive side of input current sense resistor.  
FAULT  
This pin is an open drain type configuration that will be pulled low when a fault occurs. Connect a pull-up resistor between this pin and desired logic level voltage.  
LED current sinks #6 to #1. Connect the cathode of each LED string to pin. Unused LED pin must be terminated to AGND through a resistor (4.75 kΩ for LEDs 1, 3,  
4 and 6, 2.37 kΩ for LEDs 2 and 5).  
27-32  
LED6..LED1  
PAD  
Exposed pad of the package providing enhanced thermal dissipation. Must be connected to the ground plane(s) of the PCB with at least 8 vias, directly in the pad.  
5
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1]: Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indicates specifica-  
tions guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
INPUT VOLTAGE SPECIFICATIONS  
Operating Input Voltage Range [3]  
VIN UVLO Start Threshold  
VIN UVLO Stop Threshold  
UVLO Hysteresis [2]  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VIN  
4.5  
40  
V
V
VUVLO(rise)  
VUVLO(fall)  
VUVLO_HYS  
VIN rising  
VIN falling  
4.45  
4.05  
500  
V
300  
400  
mV  
INPUT CURRENTS  
EN and PWM = H, CGATE = 1 nF from GDRV to  
PGND, fSW = 2 MHz  
VIN Pin Operating Current  
IOP  
22  
32  
mA  
VIN Pin Quiescent Current  
VIN Pin Sleep Current  
IQ  
EN = H and PWM = L, fCLKOUT = 2 MHz  
VIN = 16 V, VEN / VPWM = VSYNC = 0 V  
4
1
6
5
mA  
µA  
ISLEEP  
INPUT LOGIC LEVELS (EN, PWM, ADIM)  
Input Logic Level-Low  
Input Logic Level-High  
VIL  
VIH  
REN, RPWM Input = 5 V  
0.4  
V
V
1.5  
60  
60  
100  
100  
140  
140  
kΩ  
kΩ  
Input Pull-Down Resistor  
RADIM  
Input = 5 V  
OUTPUT LOGIC LEVELS (CLKOUT)  
Output Logic Level-Low  
VOL  
VOH  
5 V < VIN < 40 V, iLOAD = 1 mA  
5 V < VIN < 40 V, iLOAD = 1 mA  
fSW = 2 MHz, no external sync  
External sync = 260 kHz to 2.3 MHz  
1.8  
33  
0.3  
V
V
Output Logic Level-High  
CLKOUT Duty Cycle  
DCLKOUT  
tCLKNPW  
50  
200  
67  
%
ns  
CLKOUT Negative Pulse Width  
ANALOG DIMMING (ADIM)  
iADIM50  
iADIM25  
fAPWM  
DC 1.0 V applied to ADIM pin  
DC 0.5 V applied to ADIM pin  
Clock signal applied to ADIM pin  
Clock signal applied to ADIM pin  
23  
40  
0
50  
25  
27  
%
%
Analog Dimming Current Level  
(shown as % of full-scale current)  
APWM Frequency Range [2]  
APWM Duty Cycle Range [2]  
VDD REGULATOR  
1000  
90  
kHz  
%
DAPWM  
Regulator Output Voltage  
VDD UVLO Start Threshold  
VDD UVLO Stop Threshold  
ERROR AMPLIFIER  
VDD  
VIN > 6 V, iLOAD < 1 mA  
4.05  
4.25  
3.2  
4.45  
V
V
V
VDDUVLOrise VDD rising, no external load  
VDDUVLOfall VDD falling, no external load  
2.65  
Amplifier Gain [2]  
gm  
VCOMP = 1.5 V  
900  
–500  
–700  
+500  
1.4  
μA/V  
μA  
VCOMP = 1.5 V, A80606 (symm COMP)  
VCOMP = 1.5 V, A80606-1 (asymm COMP)  
VCOMP = 1.5 V  
Source Current  
IEA(SRC)  
μA  
Sink Current  
IEA(SINK)  
RCOMP  
μA  
COMP Pin Pull Down Resistance  
FAULT = 0, VCOMP = 1.5 V  
kΩ  
Continued on the next page…  
6
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indi-  
cates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
OVERVOLTAGE PROTECTION  
OVP Pin Voltage Threshold  
VOVP(th)  
iOVP(th)  
OVP pin connected to VOUT  
Current into OVP pin at 125°C  
Measured over temperature  
2.2  
140  
140  
2.5  
146.5  
150  
2.8  
153  
160  
V
µA  
µA  
OVP Pin Sense Current Threshold  
OVP Sense Current Temperature  
Coefficient [2]  
∆iOVP  
Current into OVP pin  
VOUT = 16 V, EN = L  
−36  
nA/°C  
OVP Pin Leakage Current  
IOVPLKG  
0.1  
1
4
µA  
%
%
V
OVP Variation at Output  
ΔOVP  
Measured at VOUT when ROVP = 188 kΩ  
7
Measured at VOUT when ROVP = 188 kΩ [2]  
Measured at VOUT when ROVP = 0 Ω  
2.4  
0.13  
2.55  
0.20  
2.7  
0.25  
Undervoltage Detection Threshold  
VUVP(th)  
V
BOOST SWITCH GATE DRIVER  
Gate Driver Supply Voltage  
Gate Driver Pull-Up and Pull-Down  
Gate Pull-Down When Disabled  
Peak Sink Current [2]  
VDRV  
Measured at VIN > 7.5 V  
6.5  
2.5  
100  
2
V
Ω
RGDRV  
Measured at iGDRV = 100 mA  
RGDRV_OFF EN = L, VIN = 0 V  
kΩ  
A
iSINK  
Measured at VGDRV = VDRV  
Peak Source Current [2]  
iSOURCE  
Measured at VGDRV = 0 V  
2
A
Measured with CLOAD = 1.5 nF;  
VGDRV between 10% and 90% of VDRV  
Gate Rise / Fall Time [2]  
tRISE, tFALL  
7
ns  
Minimum Gate Driver On-Time  
Minimum Gate Driver Off-Time  
BOOST SWITCH CURRENT SENSE  
tSW(ON)  
100  
100  
ns  
ns  
tSW(OFF)  
Exceeding iCS(LIM1) causes gate driver to  
truncate existing cycle, but does not shut down  
Primary Current Sense Limit  
iCS(LIM1)  
iCS(LIM2)  
tCSDELAY  
175  
210  
300  
32  
245  
mV  
mV  
ns  
Exceeding iCS(LIM2) causes gate driver to shut  
down and latch off  
Secondary Current Sense Limit [2]  
Secondary Current Sense Limit  
Propagation Delay  
Overdrive CS threshold by 10%, excluding  
leading edge blanking  
OSCILLATOR FREQUENCY  
RFSET = 10 kΩ  
RFSET = 110 kΩ  
RFSET = 10 kΩ  
1.95  
2.15  
200  
2.35  
MHz  
kHz  
V
Oscillator Frequency  
fSW  
FSET Pin Voltage  
VFSET  
1.00  
SYNCHRONIZATION  
VSYNCL  
VSYNCH  
FSET/SYNC pin logic Low  
FSET/SYNC pin logic High  
0.4  
V
V
Sync Input Logic Level  
1.5  
260  
150  
150  
Synchronized PWM Frequency  
Synchronization Input Min Off-Time  
Synchronization Input Min On-Time  
fSWSYNC  
2300  
kHz  
ns  
ns  
tPWSYNCOFF  
tPWSYNCON  
Continued on the next page…  
7
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indi-  
cates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
LED CURRENT SINKS  
LEDx Accuracy [4]  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
ErrLED  
iISET = 120 µA (RISET = 8.33 kΩ)  
0.7  
0.8  
3
2
%
%
LEDx Matching  
ΔLEDx  
iISET = 120 µA  
Measured individually with all  
other LED pins tied to ≥1 V,  
iISET = 120 µA, VADIM > 2.1 V  
A80606  
850  
950  
1050  
mV  
LEDx Regulation Voltage  
VLED  
A80606-1  
960  
955  
1060  
978  
0.985  
1160  
1000  
1.015  
185  
mV  
A/A  
V
IISET to ILEDx Current Gain  
ISET Pin Voltage  
AISET  
VISET  
iISET  
iISET = 120 µA  
VADIM > 2.1 V  
VADIM > 2.1 V  
0.955  
20  
Allowable ISET Current  
µA  
Sensed from each LED pin to GND while its current  
sink is in regulation; all other LED pins tied to 1 V  
LED String Partial-Short Detect  
VLEDSD  
tLEDSTG  
4.85  
5.5  
1.5  
6.1  
V
LED Pin Shorted-to-GND Test  
Duration [2]  
Wait time before proceeding with Soft-Start (if  
no LED pin is shorted to GND)  
ms  
Maximum time duration before all LED  
channels come into regulation, or OVP is  
tripped, whichever comes first  
Soft-Start Ramp-Up Time [2]  
tSSRU  
12.4  
16.4  
20.5  
ms  
EN goes from High to Low; exceeding tEN(OFF)  
results in IC shutdown  
Enable Pin Shut Down Delay  
Minimum PWM On-Time  
tEN(OFF)  
tPWMH  
10  
16  
0.3  
22  
0.4  
315  
ms  
µs  
ns  
First and subsequent PWM pulses  
Minimum PWM Off-Time  
(for PWM ≠ 100%)  
Externally pulsing PWM pin (guaranteed by  
design)  
tPWMLOW  
INPUT DISCONNECT GATE PIN  
Gate Pin Sink Current  
IGSINK  
VGS = VIN, no input OCP fault  
−113  
µA  
Gate Pin Source Current  
IGSOURCE  
VGS = VIN – 6 V, input OCP fault tripped  
6
mA  
Gate Shutdown Delay When Over-  
Current Fault Is Tripped [2]  
tGATEFAULT  
VGS  
VIN – VSENSE = 200 mV; monitored at FAULT pin  
3
µs  
V
PMOS Gate to source voltage measured when  
gate is on  
Gate Voltage  
−6.7  
VSENSE PIN  
VSENSE Pin Sink Current  
VSENSE Trip Point  
PEB PIN  
iADJ  
16  
88  
20  
98  
24  
µA  
VSENSETRIP Measured between VIN and VSENSE, RADJ = 0 Ω  
108  
mV  
iPEB = 60 µA  
3.2  
5.6  
4.6  
8.1  
6.0  
µs  
µs  
PEB Delay Time  
tPEB  
iPEB = 100 µA  
10.5  
FAULT PIN  
FAULT Output Pull-Down Voltage  
FAULT Pin Leakage Current  
External FAULT Input Low  
External FAULT Input High  
VFAULT  
IFAULT-LKG  
VFIL  
iFAULT = 1 mA  
0.5  
1
V
µA  
V
VFAULT = 5 V  
No internal faults; FAULT pin externally pulled down  
No internal faults  
0.8  
VFIH  
1.5  
V
No internal faults; delay (in fSW cycles) from  
FAULT pin externally pulled L to LED off;  
ignored if FAULT returns to H before that  
External FAULT Deglitch Timer  
tFIL  
8
cycles  
Continued on the next page…  
8
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indi-  
cates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
THERMAL PROTECTION (TSD)  
Thermal Shutdown Threshold [2]  
Thermal Shutdown Hysteresis [2]  
TSD  
Temperature rising  
155  
170  
20  
°C  
°C  
TSDHYS  
[1] For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing);  
positive current is defined as going into the node or pin (sinking).  
[2] Ensured by design and characterization; not production tested.  
[3] Minimum VIN = 4.5 V is only required at startup. After startup is completed, IC can continue to operate down to VIN = 4 V.  
[4] LED current is trimmed to cancel variations in both Gain and ISET voltage.  
9
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
APPLICATION EXAMPLE  
ꢂN  
ꢃ1  
ꢀUꢅ ꢊ0 ꢁ  
ꢇ1  
ꢓ1  
ꢂN  
ꢀUꢅ  
RꢀꢁP1  
RꢀꢁPꢋ  
ꢁꢃRꢁ  
ꢁꢂN  
ꢄꢃRꢁ  
ꢁꢃRꢁ  
ꢄAꢅꢆ  
PꢄNꢃ  
ꢄꢃRꢁ  
ꢁꢃRꢁ  
ꢄAꢅꢆ  
PꢄNꢃ  
ꢀꢁP  
ꢉS  
ꢉS  
ꢁSꢆNSꢆ  
ꢁꢂN  
ꢁSꢆNSꢆ  
ꢀꢁP  
ꢉ  
ꢁꢃꢃ  
ꢁꢂN  
ꢁꢃRꢁ  
ꢁꢃꢃ  
ꢁꢃꢃ  
RPU  
ꢇꢆꢃ1  
ꢇꢆꢃ1  
A80606-1  
ꢀꢁAꢂꢃERꢄ  
A80606-1  
ꢀꢂLAꢅEꢄ  
ꢇꢆꢃꢋ  
ꢇꢆꢃ3  
ꢇꢆꢃꢋ  
ꢇꢆꢃ3  
ꢈAUꢇꢅ  
ꢆN  
ꢈAUꢇꢅ  
ꢆN  
PꢍM  
PꢍM  
Uꢐ to 1ꢑ0 mA ꢒ  
Uꢐ to 1ꢑ0 mA ꢒ  
AꢃꢂM  
AꢃꢂM  
ꢉꢀMP  
Pꢆꢎ  
ꢉꢀMP  
Pꢆꢎ  
ꢉꢇꢏꢀUꢅ  
AꢄNꢃ  
ꢉꢇꢏꢀUꢅ  
AꢄNꢃ  
ꢈSꢆꢅ  
ꢂSꢆꢅ  
ꢃꢂꢅH  
ꢈSꢆꢅ  
ꢂSꢆꢅ  
ꢃꢂꢅH  
Rꢌ  
P  
RꢃꢂꢅH  
ꢃꢂꢅH  
RPꢆꢎ  
RꢂSꢆꢅ  
RꢈSꢆꢅ  
RPꢆꢎ1  
RꢂSꢆꢅ  
RꢈSꢆꢅ  
ꢌ  
Figure 4: Two A80606-1 connected in Master/Slave Configuration to drive 180 mA × 12 LED strings  
Remarks on Master-Slave configuration:  
• Only one Slave to a Master.  
• Master-Slave operation requires asymmetrical COMP (for example: source = –700 µA and  
sink = 500 µA). This is available in A80606-1 only.  
• Also requires bidirectional FAULT pin of A80606-1, so that the slave can halt the switching of master.  
10  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
FUNCTIONAL DESCRIPTION  
The A80606 is a multi-string LED regulator with six preci-  
sion current sinks and a gate driver for external boost MOSFET  
switch. It incorporates a patented Pre-Emptive Boost (PEB)  
control algorithm to achieve PWM dimming ratio over 15,000:1  
at 200 Hz. PEB control also minimizes output ripple to avoid  
audible noise from output ceramic capacitors.  
Only if no faults were detected, then the IC can proceed to start  
switching.  
As long as EN = H, the PWM pin can be toggled to control the  
brightness of LED channels by using PWM dimming. Alterna-  
tively, EN and PWM can be tied together to allow single-wire  
control for both power on/off and PWM dimming. If EN is pulled  
low for longer than 16 ms, the IC shuts off.  
The switching frequency can be either synchronized to an  
external clock or generated internally. Spread-spectrum tech-  
nique (with user-programmable dithering range and modulation  
frequency) is provided to reduce EMI. A clock-out signal (CLK-  
OUT) allows other converters to be synchronized to the switching  
frequency of A80606.  
Enabling the IC  
The A80606 wakes up when EN pin is pulled above logic high  
level, provided that VIN pin voltage is over the VIN_UVLO  
threshold. The boost stage and LED channels are enabled sepa-  
rately by PWM = H signal after the IC powers up.  
The IC performs a series of safety checks at power up, to deter-  
mine if there are possible fault conditions that might prevent the  
system from functioning correctly. Power-up checks include:  
• VOUT shorted to GND  
Figure 5: Startup showing EN, VDD, CLKOUT, and ISET (PWM = L).  
Note that CLKOUT is available as soon as VDD ramps up, even  
though Boost stage and LED drivers are not yet enabled.  
• LED pin shorted to GND  
• FSET pin open/shorted  
• ISET pin open/shorted to GND, etc.  
11  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Unused LED pin should be terminated with a resistor to GND.  
Powering Up: LED Detection Phase  
The value of this termination resistor is 4.75 kΩ for channels 1,  
3, 4 and 6 or 2.37 kΩ for channels 2 and 5. At the end of LED  
detection phase, any channel with pull down resistor is then dis-  
abled and will not contribute to the boost regulation loop.  
The VIN pin has an undervoltage lockout (UVLO) function that  
prevents the A80606 from powering up until the UVLO threshold is  
reached. Once the VIN pin goes above UVLO and a high signal is  
present on the EN pin, the IC proceeds to power up. At this point, the  
A80606 is going to enable the disconnect switch and will try to check  
if any LED pins are shorted to GND and/or are not used. The LED  
detection phase starts when PWM = H and the GATE voltage of the  
input disconnect PMOS switch is pulled down to 3.3 V below VIN.  
ꢅꢆUꢇ  
Using  
ꢌhannels 1-ꢈ  
ꢀꢁꢂ1  
ꢀꢁꢂꢋ  
ꢀꢁꢂ3  
ꢀꢁꢂꢈ  
ꢀꢁꢂ5  
ꢌhannels 5-ꢃ  
are disaꢍled  
ꢀꢁꢂꢃ  
ꢄNꢂ  
ꢈ.ꢉ5 ꢊΩ  
ꢋ.3ꢉ ꢊΩ  
Figure 7: How to signal an unused LED channel  
during startup LED detection phase  
Table 1: LED Detection phase voltage threshold levels  
LED Pin  
Interpretation  
Outcome  
Voltage Measured  
Cannot proceed with  
soft-start unless fault  
is removed  
Figure 6: Startup showing EN+PWM, GATE, LED1, and ISET. Note  
that LED Detection Phase starts as soon as GATE pin is pulled  
down to 3.3 V below VIN (provided that PWM = H).  
LED pin shorted to  
GND fault  
< 120 mV  
LED channel is  
removed from  
operation  
LED channel not in  
use  
Once the voltage threshold on VLED pins exceeds ~120 mV, a  
delay of approximately 1.5 ms is used to determine the status of  
the pins.  
~230 mV  
> 340 mV  
LED channel in use  
Proceed with soft-start  
12  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
If an LED pin is shorted to ground, the A80606 will not proceed  
with soft start until the short is removed from the LED pin. This  
prevents the A80606 from ramping up the output voltage and put-  
ting an uncontrolled amount of current through the LEDs.  
The FAULT pin is pulled low in case of LED pin shorted-to-GND  
fault, but the IC continues to retry. Once the fault is removed, the  
soft-start process will continue. The same applies in case of FSET  
or ISET pin is shorted to GND.  
Figure 8: Normal startup showing all channels passed LED Detec-  
tion phase (only LED1 and LED2 pin voltages are shown). Total  
LED current = 100 mA × 4.  
Figure 10: LED1 is shorted-to-GND initially, then released. After the  
fault is removed, the IC auto-recovers and proceeds with soft-start.  
FAULT is released at the end of LED detection phase.  
Figure 9: Normal startup showing LED1 channel is disabled with a  
4.75 kΩ resistor to GND. Total LED current = 100 mA × 3  
13  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
This is illustrated by the following startup timing diagram (not to  
scale):  
Power Up: Boost Output Undervoltage  
During startup, after the input disconnect switch has been  
enabled, the output voltage is checked through the OVP (over-  
voltage protection) pin. If the sensed voltage does not rise above  
VUVP(th), the output is assumed to be at fault and the IC will not  
proceed with soft start. Output UVP level is linked to the OVP  
level programmed according to the equation:  
Eꢀ  
Pꢁꢂ  
ꢀꢁN  
3.3 ꢀ  
ꢂ.ꢃ ꢀ  
ꢃAꢄE  
0
VUVP = VOVP / 12  
1 ꢀ  
LEDꢆ  
0
Undervoltage protection may be caused by one of the following  
faults:  
ꢆꢇꢈ detection  
ꢉhase  
ꢌ1  
ꢌꢍ  
ꢄꢀP  
93ꢅ ꢄꢀP  
1.5 ms  
• Output capacitor shorted to GND  
• Boost inductor or diode open  
• OVP sense resistor open  
ꢅOUꢄ  
ꢀꢁN  
0
After an UVP (undervoltage protection) fault, the A80606 is  
immediately shutdown and latched off. To enable the IC again,  
the latched fault must be cleared. This can be achieved by  
powering-cycling the IC, which means either:  
tSSRU  
iLED  
0
Soꢊt-Start  
Regꢋlation  
A
B
D
E
• VIN falls below falling UVLO threshold, or  
• EN = L for >16 ms.  
Figure 11: Complete startup process of A80606  
Explanation of Events:  
Alternatively, latched fault can be cleared by keeping EN = H but  
pulling PWM = L for >16 ms. This method has the advantage that  
it does not interrupt the CLKOUT signal.  
A: EN = H wakes up the IC. VDD ramps up and CLKOUT  
becomes available. IC starts to pull down GATE slowly.  
Soft Start Function  
B: When GATE is pulled down to 3.3 V below VIN, ISET becomes  
enabled. IC is now waiting for PWM = H to startup.  
During startup, the A80606 ramps up its boost output voltage  
following a fixed slope, as determined by OVP set point and Soft-  
Start Timer. This technique limits the input inrush current, and  
ensures consistent startup time regardless of the PWM dimming  
duty cycle.  
C: Once PWM = H, the IC checks each LEDx pins to determine  
if it is in use, disabled, or shorted to GND.  
D: Soft-Start begins at the completion of LED pin short-detect  
phase of ~1.5 ms. VOUT ramps up following a fixed slope set by  
OVP and soft-start timer of ~16 ms.  
The soft-start process is completed when any one of the follow-  
ing conditions is met:  
E: Soft-start terminates when all LED currents reached regula-  
• All enabled LED channels have reached their regulation  
current,  
• Output voltage has reached 93% of its OVP threshold, or  
• Soft-start ramp time (tSS) has expired.  
tion, VOUT reached 93% OVP, or soft-start timer expired.  
Note when PWM pulse is significant small (depending on the  
operating conditions), A80606 is in open loop regulation and the  
output voltage will be regulated to OVP level in the steady state  
as shown in curve C1; otherwise A80606 will regulate the output  
voltage to the expected LED load voltage in the closed loop regu-  
lation (as shown in curve C2).  
To summarize, the complete startup process of A80606 consists  
of:  
• Power-up error checking  
• Enabling input disconnect switch  
• LED pin open/short detection  
• Soft-start ramp  
14  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Frequency Selection  
t PꢂSꢃNꢄꢅN  
15ꢁ ns  
The switching frequency of the boost regulator is programmed  
by a resistor connected to FSET pin. The switching frequency  
can be selected anywhere from 200 kHz to 2.3 MHz. The chart  
below shows the typical switching frequency verses FSET resis-  
tor value.  
150 ns  
150 ns  
tPꢂSꢃNꢄꢅꢆꢆ  
t ꢀ ꢁ5ꢁ ns  
Figure 13: Pulse width requirements  
for an External Sync clock at 2.2 MHz  
Based on the above, any clock with a duty cycle between 33%  
and 66% at 2.2 MHz can be used. The table below summarizes  
the allowable duty cycle range at various synchronization fre-  
quencies.  
Table 2: Acceptable Duty Cycle range for External Sync  
clock at various frequencies  
Sync. Pulse Frequency  
2.2 MHz  
Duty Cycle Range  
33% to 66%  
2 MHz  
30% to 70%  
1 MHz  
15% to 85%  
600 kHz  
9% to 91%  
Figure 12: Switching Frequency  
as a function of FSET Resistance  
300 kHz  
4.5% to 95.5%  
Alternatively, the following empirical formula can be used:  
If it is necessary to switch over between internal oscillator and  
external sync during operation, ensure the transition takes place  
at least 500 ns after the previous PWM = H rising edge. Alterna-  
tively, execute the switchover during PWM = L only. This restric-  
tion does not apply if PWM dimming is not being used.  
Equation 1:  
RFSET = (21.5 / fSW) – 0.2  
where fSW is in MHz and RFSET is in kΩ.  
If a fault occurs during operation that will increase the switch-  
ing frequency, the internal oscillator frequency is clamped to a  
maximum of 3.5 MHz. If the FSET pin is shorted to GND, the  
part will shut down. For more details, refer to the Fault Mode  
Table section.  
Eꢌ  
Pꢀꢁ  
500 ns  
Synchronization  
Eꢂtꢃꢄꢅnꢆ  
ꢇ ꢈꢄEꢉ  
1 ꢀ  
The A80606 can also be synchronized using an external clock.  
At power up, if the FSET pin is held low, the IC will not start.  
Only when the FSET pin is tristated to allow for the pin to rise to  
about 1 V, or when a sync clock is detected, the A80606 will then  
try to power up.  
ꢊLꢋOUꢉ  
ꢁnternal oscillator  
ꢂꢃternal Sync  
Figure 14: Avoid switching over between Internal  
Oscillator and External Sync in highlighted region  
The basic requirement of the external sync signal is 150 ns  
minimum on-time and 150 ns minimum off time. The diagram  
below shows the timing restrictions for a synchronization clock at  
2.2 MHz.  
15  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢁꢆternal  
Loss of External Sync Signal  
Sychroniꢇation  
ꢋꢋ0ꢀ  
Signal  
Suppose the A80606 started up with a valid external SYNC sig-  
nal, but the SYNC signal is lost during normal operation. In that  
case, one of the following happens:  
ꢀSꢁꢂꢃSꢄNꢅ  
RꢀSꢁꢂ  
10kΩ  
Schottꢈy  
ꢉarrier  
ꢊiode  
• If the external SYNC signal is high impedance (open), the  
IC continues normal operation after approximately 5 μs, at  
the switching frequency set by RFSET. No FAULT flag is  
generated.  
Figure 15: Countermeasure for  
External Sync Stuck-at-Low Fault  
• If the external SYNC signal is stuck low (shorted to ground),  
the IC will detect an FSET-shorted-to-GND fault. FAULT  
pin is pulled low after approximately 10 μs, and switching is  
disabled. Once the FSET pin is released or SYNC signal is  
detected again, the IC will proceed to soft-start.  
It is important to use a small capacitance for the AC-coupling  
capacitor (220 pF in the above example). If the capacitance is too  
large, the IC may incorrectly declare a FSET-shorted-to-GND  
fault and restart.  
To prevent generating a fault when the external SYNC signal  
is stuck at low, the circuit shown below can be used. When the  
external SYNC signal goes low, the IC will continue to operate  
normally at the switching frequency set by the RFSET. No FAULT  
flag is generated.  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
3 kHz. In practice, using a larger dithering range and/or higher  
modulation frequency do not generate any noticeable benefits.  
Switching Frequency Dithering  
To minimize the peak EMI spikes at switching frequency har-  
monics, the A80606 offers the option of frequency dithering, or  
spread-spectrum clocking. This feature simplifies the input filters  
needed to meet the automotive CISPR 25 conducted and radiated  
emission limits.  
If dithering function is not desired, it can be disabled by discon-  
necting the RDITH between DITH and FSET pins. Connect DITH  
pin to VDD if CDITH is not populated. Dithering is always dis-  
abled when fSW is controlled by external sync. RDITH and CDITH  
have no effects in this case even if they were populated.  
For maximum flexibility, the A80606 allows both dithering range  
and modulation frequency to be independently programmable  
using two external components.  
Clock Out Function  
The A80606 allows other ICs to be synchronized to its internal  
switching frequency through the CLKOUT pin.  
The Dithering Modulation Frequency capacitor value is deter-  
mined by using the approximate equation:  
The CLKOUT signal is available as soon as the IC is enabled  
(EN = H), even when the boost stage is not active (PWM = L).  
Its frequency is the same as that of the internal oscillator. Its  
duty cycle; however, depends on how the switching frequency is  
generated:  
Equation 2:  
CDITH (nF) = 25 / fDM (kHz)  
where CDITH is the value of capacitor connected from DITH  
pin to GND.  
The resistor that sets the dithering range is calculated using the  
approximate equation:  
• If fSW is programmed by FSET resistor, the CLKOUT duty  
cycles is approximately 50%.  
Equation 3:  
RDITH = (20 × RFSET) / Range (±%)  
• If fSW is controlled by external sync, the output signal has a  
fixed 200 ns negative pulse width (CLKOUT = L), regardless  
of the external sync frequency.  
where RFSET is the resistor from FSET pin to GND, RDITH is  
the resistor between DITH and FSET pins.  
This is illustrated by the following waveforms:  
As an example, by using RFSET = 10 kΩ, RDITH = 40.1 kΩ,  
and CDITH = 22 nF, the resulted switching frequency is fSW  
=
2.15 MHz ±5% modulated at 1.1 kHz. This is illustrated by the  
following diagram.  
DꢃꢂH  
i
ꢀꢁEꢉ 100 ꢋA  
ꢊ5 ꢋA  
ꢀꢁEꢂ  
DꢃꢂH  
1.ꢆ ꢍ  
1.0 ꢍ  
0.ꢌ ꢍ  
iDꢃꢂH ꢉ ꢊꢆ0 ꢋA  
ꢇSꢂ  
RꢀꢁꢂH  
ꢃ0.1 ꢄΩ  
RꢇSꢂ  
10 ꢄΩ  
ꢀꢁꢂH  
ꢆꢆ nꢇ  
iDꢃꢂH  
ꢆ0 ꢋA  
0
ꢀithering Range ꢉ  
ꢊ5ꢗ  
ꢎꢆ0 ꢋA  
Modꢓlation  
ꢔreꢓency  
ꢉ 1.1 ꢄHꢖ  
Period ꢉ 0.ꢌ ꢏ ꢅ ꢐ i  
ꢑ0.ꢌꢌ ms when ꢅ ꢉ ꢆꢆ nꢇꢒ  
fꢁꢅ ꢆꢇHꢈꢉ  
ꢆ.ꢆ5  
ꢆ.15  
ꢆ.05  
ꢂime ꢑmsꢒ  
0
0.ꢌꢌ  
Figure 17: Without external sync, the CLKOUT signal has a fixed  
duty cycle of 50%. Delay from CLKOUT falling edge to SW falling  
edge is approximately 50 ns.  
Figure 16: How to Program Switching Frequency  
Dithering Range and Modulation Frequency  
There are no hard limits on dithering range and modulation  
frequency. As a general guideline, pick a dithering range between  
±5% and 10%, with the modulation frequency between 1 kHz and  
17  
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A80606 and  
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High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
PWM Dimming  
When both EN and PWM pins are pulled high, the A80606 turns  
on all enabled LED current sinks. When either EN or PWM is  
pulled low, all LED current sinks are turned off but critical inter-  
nal circuits remain active.  
Figure 18: With external sync, the CLKOUT signal has a fixed  
negative pulse width of 200 ns. Delay from SYNC rising edge to  
CLKOUT falling edge is approximately 60 ns.  
LED Current Setting  
The maximum LED current can be up to 140 mA per channel,  
and is set through the ISET pin. Connect a resistor RISET between  
this pin and GND. The relation between ILED and RISET is given  
below:  
Figure 19: PWM dimming operation at 20% 1 kHz. CH1 = PWM (5 V/  
div), CH2 = SW (20 V/div), CH3 = VOUT, CH4 = iLED (200 mA/div).  
By using the patented Pre-Emptive Boost (PEB) control algo-  
rithm, the A80606 is able to achieve minimum PWM dimming  
on-time down to 300 ns. This translates to PWM dimming ratio  
up to 15,000:1 at the PWM dimming frequency of 200 Hz. Tech-  
nical details on PEB will be explained in the next section.  
Equation 4:  
ILED = ISET × AISET  
ISET = VISET / RISET  
Note that when PWM pulse duration is decreased to below 500 ns,  
the output of the converter may ramp up to the output OV thresh-  
old and hysteretically regulate around this threshold. This is accept-  
able operation; however, this will cause the fault flag to repeatedly  
assert low. Fault must be ignored when operating in this mode.  
Therefore RISET = (VISET × AISET ) / ILED  
= 963 / ILED  
where ILED current is in mA and RISET is in kΩ.  
This sets the maximum current through the LEDs, referred to  
as the ‘100% current’. The average LED current can be reduced  
from the 100% current level by using either PWM dimming or  
analog dimming.  
Table 3: ISET resistor values vs. LED current. Resistances  
are rounded to the nearest E-96 (1%) resistor value.  
Standard Closest RISET  
LED current per channel  
Resistor Value  
5.36 kΩ  
6.49 kΩ  
9.53 kΩ  
12 kΩ  
180 mA  
150 mA  
100 mA  
80 mA  
60 mA  
40 mA  
16 kΩ  
24 kΩ  
Figure 20: Zoom in view for PWM on-time = 10 µs. Notice that the  
LED current is shifted with respect to PWM signal. Ripple at VOUT  
is ~0.2 V when using 2 × 4.7 µF MLCC as output capacitors.  
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A80606 and  
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High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Common scope settings:  
CH1 (Yellow) = PWM (5 V/div); CH2 (Red) = Inductor current  
(500 mA/div); CH3 (Blue) = VOUT (1 V/div); CH4 (Green) =  
LED current (200 mA/div); time scale = 2 µs/div.  
Figure 21: Zoom-in view showing A80606 is able to regulate LED  
current at PWM on-time down to 300 ns.  
The typical PWM dimming frequencies fall between 200 Hz and  
1 kHz. There is no hard limit on the highest PWM dimming fre-  
quency that can be used. However at higher PWM frequency, the  
maximum PWM dimming ratio will be reduced. This is shown in  
the following table:  
Figure 22: Traditional PWM Dimming operation where boost switch  
and LED current are enabled at the same time. Note that VOUT  
shows overall ripple of ~0.5 V  
Table 4: Maximum PWM Dimming Ratio that can be achieved  
when operating at different PWM Dimming Frequency  
When PWM signal goes high, a conventional LED driver turns  
on its boost switching at the time with LED current sinks. The  
problem is that the inductor current takes several switching cycles  
to ramp up to its steady-state value before it can deliver full  
power to the output load. During the first few cycles, energy to  
the LED load is mainly supplied by the output capacitor, which  
results in noticeable dip in output voltage.  
Maximum PWM  
PWM Frequency  
PWM Period  
Dimming Ratio  
15,000:1  
3,000:1  
200 Hz  
1 kHz  
5 ms  
1 ms  
3.3 kHz  
20 kHz  
300 µs  
50 µs  
1,000:1  
150:1  
While it is possible to operate with very high PWM duty cycle for  
subtle dimming, it is important to avoid PWM pulse low periods  
that are shorter than the Minimum PWM Off-Time (tPWMLOW),  
which is 315 ns. Driving PWM at 100% is acceptable.  
Pre-Emptive Boost  
The basic principle of pre-emptive boost (PEB) can be best  
explained by the following two waveforms. The first one shows  
how a conventional LED driver operates during PWM dimming  
operation. The second one shows that of the A80606.  
Common test conditions for both cases:  
PWM = 1% at 1 kHz (on-time = 10 µs), fSW = 2.15 MHz,  
L = 10 µH, VIN = 12 V, LED load = 8 series (VOUT = ~25 V)  
at 100 mA × 4. COUT = 2 × 4.7 µF 50 V 1210 MLCC.  
COMP: RZ = 280 Ω, CZ = 68 nF.  
Figure 23: A80606 PWM dimming operation with PEB delay set to  
3 µs. Note that VOUT ripple is reduced to ~0.2 V.  
19  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
In the A80606, the boost switch is also enabled when PWM goes  
high. However, the LED current is not turned on until after a  
short delay of tPEB. This allows the inductor current to build up  
before it starts to deliver the full power to LED load. During the  
pre-boost period, VOUT actually bumps up very slightly, while  
the following dip is essentially eliminated. When PWM goes low,  
both boost switching and LED remains active for the same delay  
of tPEB. Therefore the PWM on-time is preserved in LED current.  
can significantly reduce the output ripple voltage compared to a  
conventional LED driver.  
A80606  
ꢂN  
Pꢀꢁ  
Pꢀꢁ  
RPꢄ  
PEB delay can be programmed using an external resistor, RPEB  
,
from PEB pin to GND. Their relationship is shown in the follow-  
ing chart:  
RPꢁ  
13.0  
12.0  
11.0  
10.0  
9.0  
Figure 25: PEB delay setup circuit with connection to VIN  
12.0  
11.0  
10.0  
9.0  
8.0  
7.0  
6.0  
8.0  
5.0  
7.0  
4.0  
6.0  
3.0  
2.0  
5.0  
1.0  
4.0  
0.0  
3.0  
6
8
10  
12  
14  
RPEB (k)  
16  
18  
20  
22  
24  
VIN = 18 V  
VIN = 12 V  
VIN = 6 V  
2.0  
1.0  
0.0  
Figure 24: How PEB delay time varies with value of PEB pin resis-  
tor to GND.  
Ideally, tPEB is equal to the inductor current ramp up time.  
But the latter is affected by many external parameters, such  
as switching frequency, inductance, VIN and VOUT ratio, etc.  
Therefore, some experimentation is required to optimize the  
PEB delay time. A simple guideline is to set PEB delay at  
nominal VIN equal to 3 switching cycles (longer at lower VIN).  
In general for switching frequency at 500 kHz, tPEB = 6 to 12 µs  
is a good starting point.  
20  
30  
40  
50  
60  
70  
IPEB (µA)  
80  
90  
100 110 120  
Figure 26: PEB delay tPEB vs. PEB pin current  
Analog Dimming  
The peak (100%) level of LED current is set by the RISET resistor.  
The actual peak LED current may also be adjusted continuously  
from approximately 10% up to 100%, by using the ADIM pin.  
There are two methods to do so:  
Additionally, adding a resistor from PEB to VIN (as shown  
below) can extend PEB delay when VIN becomes lower. Refer  
to the PEB delay versus PEB pin current below; for example,  
at switching frequency 400 kHz, set IPEB = 80 μA to obtain  
~5.88 μs PEB delay at VIN = 12 V by choosing RPB = 8.45 kΩ  
and RPT = 604 kΩ (PEB voltage is fixed). When VIN lowers to  
6 V, PEB delay becomes longer at 6.8 μs with IPEB = 90 μA. If  
VIN increases to 18 V, PEB delay will be 5.2 μs.  
1. In ADIM mode: apply a DC voltage between 0.2 V and 2 V  
at the pin.  
2. In APWM mode: apply a clock signal with duty cycle be-  
tween 90% and 0% at the pin.  
ADIM MODE  
An analog voltage is applied at the ADIM/APMW pin. This DC  
The advantage of PEB is that even a non-optimized delay time  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
voltage linearly controls the peak LED current, as illustrated by  
the chart below:  
Normalized LED Current vs. APWM Duty Cycle  
100ꢀ  
80ꢀ  
60ꢀ  
40ꢀ  
20ꢀ  
0ꢀ  
Nꢊꢅꢎꢌꢋꢏꢐꢆꢑ ꢁEꢂ ꢃꢄꢅꢅꢆꢇt ꢒs. ꢈꢂIꢉ Vꢊꢋtꢌꢍꢆ  
100ꢀ  
ꢊꢆꢎsꢄꢅꢆꢏ  
90ꢀ  
80ꢀ  
70ꢀ  
60ꢀ  
50ꢀ  
ꢐꢑꢆꢒꢅꢆꢌꢎꢍ  
ꢈꢂIꢉ ꢂꢆꢓꢅꢆꢌsꢏꢇꢍ  
40ꢀ  
ꢈꢂIꢉ Iꢇꢓꢅꢆꢌsꢏꢇꢍ  
30ꢀ  
0ꢀ  
20ꢀ  
40ꢀ  
60ꢀ  
80ꢀ  
100ꢀ  
ꢈPꢉꢊ ꢂꢄtꢋ ꢃꢋꢌꢍꢆ  
20ꢀ  
10ꢀ  
0ꢀ  
Figure 28: Showing LED current is inversely proportional to the  
APWM duty cycle. Test conditions: VIN = 12 V, VOUT = 25 V (8 ×  
WLED), total LED current = 100 mA × 4, APWM frequency = 100 kHz  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
2.2  
ꢈꢂIꢉ Vꢊꢋtꢌꢍꢆ (V)  
As an example, a system that delivers a full LED current of  
100 mA per channel would deliver 75 mA when an APWM signal  
with a duty-cycle of 25% is applied (because analog dimming  
level is 100% – 25% = 75%). This is demonstrated by the fol-  
lowing waveforms (only LED channels 1 to 4 are enabled).  
Figure 27: In analog dimming mode, the LED current is linearly pro-  
portional to ADIM voltage between 0.2 V and 2 V approximately  
There is an internal pull-down resistor (100 kΩ typical) from  
ADIM pin to GND. When this pin is left floating, LED current  
is actually being dimmed down to ~10%. Therefore, if analog  
dimming is not required, the ADIM pin should be pulled to over  
2 V (but below VDD) to ensure 100% LED current. One simple  
technique is to pull up ADIM to VDD through a 30 kΩ resistor.  
APWM MODE  
When a clock signal is detected at ADIM pin, the A80606 goes  
into APWM mode. The typical APWM signal frequency is  
between 40 kHz and 1 MHz. The duty cycle of this signal is  
inversely proportional to the percentage of current delivered to  
the LED. The relationship is shown below:  
Figure 29: PWM = H. Total LED current drops from 400 mA (4 ×  
100 mA/ch) to 300 mA when APWM of 25% duty cycle is applied.  
Note that LED current takes ~1 ms to settle after change in APWM.  
21  
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955 Perimeter Road  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
and analog dimming method.  
For example, the following approach can be used to achieve a  
100,000:1 dimming ratio at 200 Hz:  
Vary PWM duty cycle from 100% down to 0.01% to give  
10,000:1 dimming. This requires PWM dimming on-time be  
reduced down to 0.5 µs.  
• With PWM dimming on-time fixed at 0.5µs, vary APWM duty  
from 0% to 90% to reduce peak LED current from 100% down  
to 10%. This gives a net effect of 100,000:1 dimming.  
Average LED Current vs. PWM Dimming Duty Cycle  
100  
10  
Figure 30: PWM = 10% at 1 kHz. Peak LED current drops from  
400 mA (4 × 100 mA/ch) to 300 mA when APWM of 25% duty cycle  
is applied  
1
0.1  
One popular application of analog dimming is for LED brightness  
calibration, commonly known as ‘LED Binning’. LEDs from  
the same manufacturer and series are often grouped into differ-  
ent ‘bins’ according to their light efficacy (lumens per watt). It is  
therefore necessary to calibrate the ‘100% current’ for each LED  
bin, in order to achieve uniform luminosity.  
Pꢏꢐ ꢊꢅꢂꢂꢅꢍꢑ  
ꢔPꢏꢐ ꢕ Pꢏꢐ  
Iꢈꢇꢃꢄ  
0.01  
0.001  
To use ADIM pin as a trim function, the user should first set the  
100% current based on efficacy of LED from the lowest bin.  
When using LED with higher efficacy, the required current is then  
trimmed down to the appropriate level using APWM duty cycle.  
0.001  
0.01  
0.1  
1
10  
100  
Pꢏꢐ ꢊꢅꢂꢂꢅꢍꢑ ꢊꢌtꢒ ꢋꢒꢓꢄꢇ (ꢎ)  
As an example, assume that:  
Figure 31: How to achieve 100,000:1 dimming ratio by using both  
PWM and APWM. Test conditions: VIN = 12 V, VOUT = 25 V (8 ×  
WLED), total LED current = 400 mA, PWM frequency = 200 Hz,  
APWM frequency = 100 kHz.  
• LED from lowest bin has an efficacy of 80 lm/W  
• LED highest bin has an efficacy of 120 lm/W  
Suppose the maximum LED current was set at 100 mA based  
on LEDs from lowest bin. When using LEDs from highest bin,  
the current should then be reduces to 67% (80/120). This can be  
achieved by sending APWM clock with 33% duty cycle.  
Note that the A80606 is capable of providing analog dimming  
range greater than 10:1. By applying APWM with 96% duty  
cycle, for example, an analog dimming range of 25:1 can be  
achieved. However, this requires the external APWM signal  
source to have very fine pulse-width resolution. At 200 kHz  
APWM frequency, a resolution of 50 ns is required to adjust its  
duty cycle by 1%.  
Extending LED Dimming Ratio  
The dynamic range of LED brightness can be further extended,  
by using a combination of PWM duty cycle, APWM duty cycle,  
22  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
In the following application example, the thermistor used is NTC-  
Analog Dimming with External Voltage  
S0805E3684JXT (680 kΩ @ 25°C). R1 = 336 kΩ, R2 = 20 kΩ,  
and R3 = 8.45 kΩ. The LED current per channel is reduced from  
97 mA at 25°C to 34 mA at 125°C.  
Besides using ADIM pin, the LED current can also be reduced  
by using an external voltage source applied through a resistor  
to the ISET pin. The dynamic range of this type of dimming is  
dependent on the ISET pin current. The recommended iSET range  
is from 20 µA to 144 µA for the A80606. Note that the IC will  
continue to work at iSET below 20 µA, but the relative error in  
LED current becomes larger at lower dimming level.  
ꢀꢁꢁ  
ꢂꢃ.ꢄ5 ꢀꢅ  
Aꢉ0ꢊ0ꢊ  
Nꢀꢁ  
Rꢄ  
ꢆSꢇꢈ  
ꢂ1.0 ꢀꢅ  
Below is a typical application circuit using a DAC (digital-analog  
converter) to control the LED current. The ISET current (which  
R1  
directly controls the LED current) is normally set as VISET/RISET  
.
ꢋNꢁ  
R3  
The DAC voltage can be higher or lower than VISET, thus adjust-  
ing the LED current to a lower or higher value.  
Figure 33: Thermal foldback of  
LED current using NTC thermistor  
Aꢃ0ꢄ0ꢄ  
Rꢅ  
ꢈꢇAꢉ  
ꢀSꢁꢂ  
RꢀSꢁꢂ  
ꢆNꢇ  
Figure 32: Adjusting LED current  
with an external voltage source  
Equation 5:  
VISET  
RISET  
VDAC V  
R2  
ISET  
iISET  
=
where VISET is the ISET pin voltage (typically 1.0 V), and  
VDAC is the DAC output voltage.  
Figure 34: LED current varies with temperature  
when using thermistor NTCS0805E3684JXT  
for thermal foldback  
When VDAC is higher than 1.00 V, the LED current is reduced.  
When VDAC is lower than 1.00 V, the LED current is increased.  
Some common applications for the above scheme include:  
• LED binning  
• Thermal fold-back using external NTC (negative temperature  
coefficient) thermistor  
23  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
There is an alternative way to reset the internal fault status reg-  
isters. By keeping EN = H and PWM = L for longer than 16 ms,  
the A80606 clears all internal fault registers but does not go into  
sleep mode. The next time PWM pin goes high, the IC will still  
go through soft start process. The difference is that VDD voltage  
and CLKOUT signal are always available as long as EN = H.  
VDD  
The VDD pin provides regulated bias supply for internal circuits.  
Connect a CVDD capacitor with a value of 1 μF or greater to this  
pin. The internal LDO can deliver up to 2 mA of current with a  
typical VDD voltage of about 4.25 V. This allows it to serve as  
the pull up voltage for FAULT pin.  
VDRV  
The VDRV pin provides a regulated gate driver supply for  
external boost power MOSFET. Connect a CVDRV capacitor with  
a typical value of 2.2 μF to this pin. The gate driver can deliver  
up to 2 A of peak sink and source current, with a typical VDRV  
voltage of 6.5 V. However, its average output current is limited to  
approximately 36 mA. Note that average gate driver current is:  
Equation 6:  
iVDRV = fSW × QG  
where fSW is the switching frequency and QG is the total gate  
charge of the power MOSFET for VGS = 0 to 6.5 V.  
At higher switching frequency, it is important to select a power  
MOSFET with low QG to limit the average gate driver current.  
Refer to the appendix section for details on MOSFET selection.  
Figure 36: As long as EN = H, the IC does not shut down VDD and  
CLKOUT. But internal latched faults are cleared by PWM = L for  
~16 ms.  
Shutdown  
If the EN pin is pulled low for longer than tEN(OFF) (~16 ms), the  
A80606 enters shutdown (sleep mode). The next time the EN pin  
goes high, all internal fault registers are cleared. The IC needs to  
go through a complete soft start process after PWM goes high.  
Figure 35: After EN = L for ~16 ms, the IC completely shuts down  
so VDD (Blue).  
24  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
FAULT DETECTION AND PROTECTION  
FAULT Status  
ꢃꢄ ꢅꢆꢆ  
The FAULT pin is an open-drain output that will be pulled low  
when a fault occurs. A pull-up resistor (typically around 10 kΩ) is  
required between this pin and desired logic level voltage (typi-  
cally 3.3 to 5 V). Multiple devices with open-drain FAULT pins  
can be connected in parallel to form a wired-AND configuration.  
This way, when any device reports a fault, the system FAULT  
signal is pulled low.  
ꢎNꢕH ꢖ  
ꢉꢃNꢗUꢉꢏꢅ  
Power ꢁꢇ  
ꢈꢉꢄꢄ, ꢊꢋ readyꢌ ꢋAꢍꢎ  
ꢇꢁlled ꢏꢌ ꢀaꢁlt checꢐingꢑ  
ꢎNꢕꢏ  
ꢀAUꢏꢍ State  
ꢀAUꢏꢍ ꢇꢁlled ꢑ  
Any ꢀaꢁlt  
detectedꢂ  
The A80606-1 (One-Out-All-Out option) has a bidirectional  
FAULT pin. This means the same pin also serves as an input to  
monitor the status of system FAULT signal. When the FAULT  
pin is pulled low externally for >8 fSW cycles by another device,  
the A80606-1 disables its own boost switch and all LED current  
sinks in response. This feature is required in Master/Slave con-  
figuration, for example.  
es  
No  
ꢎNꢕH ꢖ  
PꢙMꢕꢏ  
ꢃꢄ Ready  
ꢈꢄꢏꢓꢅUꢍ actiꢔe,  
ꢀAUꢏꢍ ꢇꢁlled ꢑ  
ꢎNꢕꢏ  
ꢎNꢕH ꢖ PꢙMꢕH  
The following two simplified flow charts demonstrate the differ-  
ence between A80606 (unidirectional FAULT pin) and A80606-1  
(bidirectional FAULT pin).  
Pin shorted  
to ꢋNꢚ ꢆaꢁlt  
ꢀAUꢏꢍꢕꢏ  
ꢏꢎꢚ Pin hecꢐ  
ꢈꢃn Use, ꢚisaꢘled, or  
Shorted to ꢋNꢚꢑ  
ꢍime-oꢁt withoꢁt ꢆaꢁlts  
ꢀAUꢏꢍ released  
Soꢆt Start  
ꢈenaꢘle ꢘoost Sꢙ and  
ꢏꢎꢚ cꢁrrent sinꢐsꢑ  
Any ꢀaꢁlt  
detectedꢂ  
es  
No  
PꢙM ꢚimming  
ꢏꢎꢚꢕon  
ꢄlear 1ꢛ ms timer  
ꢎN ꢖ PꢙM ꢕ H  
ꢎN ꢖ PꢙM ꢕ ꢏ  
ꢏꢎꢚꢕoꢆꢆ  
Start 1ꢛms timer  
ꢍimer eꢜꢇired  
Figure 37: Simplified A80606 Startup Flowchart  
25  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢀꢄ ꢅꢆꢆ  
ꢎNꢕH ꢖ  
ꢉꢀNꢗUꢉꢏꢅ  
Power ꢂꢇ  
ꢈꢉꢄꢄ, ꢊꢋ readyꢌ ꢋAꢍꢎ  
ꢇꢂlled ꢏꢌ ꢁaꢂlt checꢐingꢑ  
ꢎNꢕꢏ  
ꢁAUꢏꢍ State  
ꢁAUꢏꢍ ꢇꢂlled ꢑ  
Any ꢀnternal  
ꢁaꢂlt detectedꢃ  
es  
No  
ꢎNꢕH ꢖ  
PꢙMꢕꢏ  
ꢀꢄ Ready  
ꢈꢄꢏꢓꢅUꢍ actiꢔe,  
ꢁAUꢏꢍ ꢇꢂlled ꢑ  
ꢎNꢕꢏ  
ꢎNꢕH ꢖ PꢙMꢕH  
Pin shorted  
to ꢋNꢚ ꢆaꢂlt  
ꢁAUꢏꢍꢕꢏ  
ꢏꢎꢚ Pin ꢄhecꢐ  
ꢈꢀn Use, ꢚisaꢘled, or  
Shorted to ꢋNꢚꢑ  
ꢍime-oꢂt withoꢂt ꢆaꢂlts  
ꢁAUꢏꢍ released  
Any ꢎꢜternal  
ꢁaꢂlt detectedꢃ  
ꢀes  
ꢈꢁAUꢏꢍ ꢇꢂlled ꢏ  
eꢜternallyꢑ  
No  
ꢁAUꢏꢍꢕHꢑ  
Soꢆt Start  
ꢈenaꢘle ꢘoost Sꢙ and  
ꢏꢎꢚ cꢂrrent sinꢐsꢑ  
Any ꢀnternal  
ꢁaꢂlt detectedꢃ  
es  
No  
Any ꢎꢜternal  
ꢀes  
ꢁaꢂlt detectedꢃ  
ꢈꢁAUꢏꢍ ꢇꢂlled ꢏ  
eꢜternallyꢑ  
No  
PꢙM ꢚimming  
ꢏꢎꢚꢕon  
ꢄlear 1ꢛ ms timer  
ꢎN ꢖ PꢙM ꢕ ꢏ  
ꢎN ꢖ PꢙM ꢕ H  
ꢏꢎꢚꢕoꢆꢆ  
Start 1ꢛms timer  
ꢍimer eꢜꢇired  
Figure 38: Simplified startup flow chart for A80606-1, showing responses to both Internal  
and External FAULT signals  
26  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
For A80606, the FAULT pin is pulled low in case any LED  
LED String Partial-Short Detect  
string is directly or partially shorted. The suspect LED string is  
disabled, while the rest of the LED strings continue to operate.  
FAULT pin is latched at low until it is reset by either EN = L or  
PWM = L for >16 ms  
All LED current sink pins (LED1 to LED6) are designed to with-  
stand the maximum output voltage, as specified in the Absolute  
Maximum Ratings table. This prevents the IC from being dam-  
aged if VOUT is directly applied to an LED pin due to an output  
connector short.  
For A80606-1, all LED strings are turned off in case any LED  
string has detected a partial short. FAULT pin is latched at low  
until the IC is reset.  
In case of direct-short or partial-shorted fault in any LED string dur-  
ing operation, the LED pin with voltage exceeding VLEDSD will be  
removed from regulation. This prevents the IC from dissipating too  
much power due to large voltage drop across the LED current sink.  
Figure 41: A80606-1 startup sequence when LED string#2 has a  
partial-short fault (6 × WLED instead of 8). As soon as LED2 pin rises  
above VLEDSD (~5 V), the channel is disabled but FAULT remains High.  
Figure 39: A80606 Normal startup sequence showing voltage at LED1 and  
At least one LED pin must be at regulation voltage (below  
~1.2 V) for the LED string partial-short detection to activate.  
In case all of the LED pins are above regulation voltage (this  
could happen when the input voltage rises too high for the LED  
strings), they will continue to operate normally.  
LED2 pins. VIN = 6 V, output = 8 × WLED in series, current = 4 × 100 mA  
Figure 40: A80606 startup sequence when LED string#2 has a partial-  
short fault (6 × WLED instead of 8). As soon as LED2 pin rises above  
VLEDSC (~5 V), the channel is disabled and FAULT = Low.  
27  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Overvoltage Protection  
The A80606 offers a programmable output overvoltage protection  
(OVP). The OVP pin has a threshold level of 2.5 V typical. Overvolt-  
age protection is tripped when current into this pin exceeds ~150 µA.  
A resistor can be used to set the OVP threshold up to 40 V approxi-  
mately. This is sufficient for driving 11 white LEDs in series.  
The formula for calculating the OVP resistor is shown below:  
Equation 7:  
ROVP = (VOVP – VOVP(th)) / iOVP(th)  
where VOVP is the desired OVP threshold, VOVP(th) = 2.5 V  
typical, iOVP(th) = 150 µA typical.  
To determine the desired OVP threshold, take the maximum LED  
string voltage at cold and add ~10% margin on top of it.  
Figure 42: A80606 startup with LED2 string open. VOUT hits OVP at  
~28 V and LED2 is removed from regulation. FAULT pin goes Low  
but remaining LED strings continue to operate.  
The OVP event is not a latched fault and, by itself, does not pull  
the FAULT pin to low. If the OVP condition occurs during a load  
dump, for example, the IC will stop switching but not shut down.  
For A80606-1, all LED strings are disabled in case any string is  
not in regulation when VOUT hits OVP. FAULT pin is pulled low  
and switching is stopped. The IC remains in latched off state until  
it is reset.  
OVP condition is typically caused by an open LED fault, or dis-  
connected output connector. It may be detected either at startup or  
during normal operation. This is explained separately below.  
CASE 1: OVP AT STARTUP  
During soft start period, the A80606 tries to boost VOUT until it  
becomes high enough for all LED string to come into regulation.  
But if any LED string is open, VOUT will eventually hit OVP. At  
this point, the A80606 will disable any LED string that is still not  
in regulation. The FAULT pin is pulled low and boost switching  
is stopped to allow VOUT to fall. Once VOUT decreases by approx-  
imately VOVP(th), switching resumes to power the remaining LED  
strings.  
Figure 43: A80606-1 startup with LED2 string open. VOUT hits  
OVP and all LED string are disabled. FAULT pin goes Low and IC  
remains latched off until reset.  
28  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
CASE 2: OVP DURING NORMAL OPERATION  
Boost Switch Overcurrent Protection  
When one LED string becomes open during operation, current  
through its LED driver drops to zero. The A80606 responds by  
boosting the output voltage higher. When output reaches OVP  
threshold, the LED string without current is removed from regu-  
lation. The rest of LED strings continue to draw current and drain  
The external boost switch is protected with a cycle-by-cycle  
primary current limit. When the voltage sensed at CS pin exceeds  
VCS(LIM1) (typically 210 mV), the existing switching cycle is  
truncated. That means the peak switching current is limited to:  
Equation 8:  
iSW(LIM1) = VCS(LIM1) / RCS  
down VOUT. Once VOUT decreases by approximately VOVP(th)  
,
boost will resume switching to power the remaining LED strings.  
where RCS is the sense resistor connected from source of boost  
MOSFET to power ground.  
As an example, if RCS = 39 mΩ, then iSW(LIM1) = 5.4 A approxi-  
mately.  
The waveform below shows normal switching at VIN = 6 V, VOUT  
= ~26 V and total LED current 800 mA. Average input current is  
around 4.5 A.  
Figure 44: An open-LED string faults causes VOUT to ramp up  
and trip OVP. The A80606 then disables the open LED string and  
continues with remaining strings.  
The A80606-1, in contrast, will disable all LED strings in case  
any LED string becomes open. The IC remains in latched off  
state until it is reset.  
Figure 46: Normal 400 kHz switching waveform at VIN = 6 V. Red  
trace is the SW node voltage at 10 V/div. Green trace is the induc-  
tor current at 1 A/div.  
When the input voltage is reduced further to 5.6 V, input current  
increases and peak switch current reaches 5.4 A. Overcurrent  
protection is tripped to limit the peak SW current.  
Figure 45: An open-LED string faults causes VOUT to ramp up and  
trip OVP. The A80606-1 then disables all LED string and remains in  
latched off state until reset.  
29  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
If the input current level goes above the preset threshold, the part  
will be shut down in less than 3 µs. The FAULT pin is pulled  
Low and the IC remains in latched off state until it is reset. This  
feature prevents catastrophic failure in the system when there is  
a direct short from VOUT to GND (caused by a shorted output  
connector or cable, for example).  
The waveform below illustrates the input overcurrent fault condi-  
tion during startup. As soon as input OCP limit is reached, the  
part disables the gate of the disconnect switch Q1 and latches off.  
Figure 47: When peak current through the inductor reaches ~5.4 A,  
overcurrent protection kicks in to truncate the present switching cycle.  
There is also a secondary current sense limit VCS(LIM2), set at  
about 40% higher than the cycle-by-cycle current limit. It is to  
protect the external MOSFET from destructive current spikes in  
case the boost inductor or boost diode is shorted. Once this limit  
is tripped, the A80606 will immediately shut down and latch off.  
Input Overcurrent Protection and  
Disconnect Switch  
Figure 49: Startup into an output shorted-to-GND fault. Input OCP  
is tripped when current (Green trace) exceeds ~6.5 A. PMOS Gate  
(Red) is turned off immediately and IC latches off.  
iSNSꢆ  
ꢇꢈN  
ꢅo ꢌ1  
RSꢆNSꢆ  
During startup when Q1 first turns on, an inrush current flows  
through Q1 into the output capacitance. If Q1 turns on too fast  
(due to its low gate capacitance), the inrush current may trip  
input OCP limit. In this case, an external gate capacitance CG is  
added to slow down the turn-on transition. Typical value for CG is  
around 4.7 to 22 nF. Do not make CG too large, since it also slows  
down the turn-off transient during a real input OCP fault.  
ꢀ1  
ꢁPMꢂSꢃ  
RAꢉꢊ  
ꢄ  
iAꢉꢊ  
ꢄAꢅꢆ  
SNSꢆ  
ꢈN  
A80606  
ꢈN ꢍ ꢇSꢆNSꢆ ꢎ RSꢆNSꢆ ꢏ iSꢆNSꢆ ꢐ RAꢉꢊ ꢏ iAꢉꢊ  
Figure 48: Optional input disconnect switch using a PMOSFET  
The primary function of the input disconnect switch is to protect  
the system and the device from excessive input currents during a  
fault condition.  
30  
Allegro MicroSystems  
955 Perimeter Road  
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www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Setting the Input Current Sense Resistor  
Fault Protection During Operation  
The input disconnect switch threshold is typically 98 mV, mea-  
sured between VIN and VSENSE pins when RADJ is 0 Ω. This  
threshold can be trimmed slightly using the RADJ resistor.  
The A80606 constantly monitors the state of the system to deter-  
mine if any fault conditions occur during normal operation. The  
response to a triggered fault condition is summarized in the table  
below. It is important to note that there are several points at which  
the A80606 monitors for faults during operation. The locations are  
input current, switch current, output voltage, switch voltage, and  
LED pins. Some of the protection features might not be active dur-  
ing startup to prevent false triggering of fault conditions.  
To avoid false tripping, the input disconnect switch overcurrent  
limit should be set higher than the boost switch cycle-by-cycle cur-  
rent limit. For example, the boost switch OCP is set at 5.4 A, so the  
input disconnect switch OCP may be set 25% higher at 6.75 A. The  
input current sense resistor is then calculated as below.  
The possible fault conditions that the part can detect include:  
When RADJ is not used:  
• Open LED Pin or open LED string  
• Shorted or partially shorted LED string  
• LED pin shorted to GND  
• Open or shorted boost diode  
• Open or shorted boost inductor  
• VOUT short to GND  
VIN – VSENSE = RSENSE × iSENSE = 98 mV  
The desired sense resistor is RSENSE = 98 mV / 6.75 A =  
14.5 mΩ. But this is not a standard E-24 resistor value. Pick the  
closest lower value which is 13 mΩ.  
When RADJ is used:  
• SW shorted to GND  
VIN – VSENSE = RSENSE × iSENSE + RADJ × iADJ  
Therefore  
• ISET shorted to GND  
• FSET shorted to GND  
• Input disconnect switch drain shorted to GND  
RADJ = [(VIN – VSENSE) – (RSENSE × iSENSE)] / iADJ  
= [98 mV – 88 mV] / 20 µA = 500 Ω  
Pick the closest E-96 resistor value of 499 Ω.  
Note that some of these faults will not be protected if the input  
disconnect switch is not being used. An example of this is VOUT  
short to GND fault.  
Input UVLO  
When VIN rises above VUVLOrise threshold, the A80606 is  
enabled. The IC is disabled when VIN falls below VUVLOfall  
threshold for more than 50 μs. This small delay is used to avoid  
shutting down because of momentary glitches in the input power  
supply.  
31  
Allegro MicroSystems  
955 Perimeter Road  
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www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Table 5: A80606 Fault Mode Table  
Fault Flag  
Set  
Disconnect  
Switch  
Fault Name  
Type  
Active  
Description  
Boost Switch  
LED Sink drivers  
This fault condition is triggered when the SW current exceeds the  
cycle-by-cycle current limit, ISW(LIM).The present SW on-time is  
truncated immediately to limit the current. Next switching cycle starts  
normally.  
Primary Switch Overcurrent  
Protection (Cycle-By-Cycle Auto-restart  
Current Limit)  
Off for a single  
cycle  
Always  
NO  
ON  
ON  
When current through boost switch exceeds secondary SW current  
limit (iSW(LIM2)) the device immediately shuts down the disconnect  
switch, LED drivers and boost. The Fault flag is set. To reset the fault  
the EN or PWM pin needs to be pulled low for ~16 ms.  
Secondary Switch Current  
Limit  
Latched  
Off  
Always  
YES  
OFF  
OFF  
OFF  
The device is immediately shut off if the voltage across the input  
sense resistor is above the VSENSEtrip threshold. To reset the fault the  
EN or PWM pin must be pulled low for ~16 ms.  
Input Disconnect Current  
Limit  
Latched  
Off  
Always  
Startup  
YES  
YES  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
If any of the LED pins is determined to be shorted to GND when PWM  
first goes high, soft-start process is halted. Only when the short is  
removed, then soft-start is allowed to proceed.  
LEDx Pin Shorted to GND  
Auto-restart  
Auto-restart  
If an LED string is not getting enough current, the device will first  
respond by increasing the output voltage until OVP is reached. Any  
LED string that is still not in regulation will be disabled. The device will  
then go back to normal operation by reducing the output voltage to  
the appropriate voltage level.  
LEDx Pin Open  
(One-Out-Continue option)  
Normal  
operation  
OFF for open pins.  
ON for all others.  
YES  
YES  
ON  
ON  
If an LED string is not getting enough current, the device will first  
respond by increasing the output voltage until OVP is reached. If any  
LED string is still not in regulation, all LED strings will be disabled and  
the device latched off. To reset the fault the EN or PWM pin must be  
pulled low for ~16 ms.  
LEDx Pin Open  
(One-Out-All-Out option)  
Normal  
operation  
Latched  
OFF  
OFF  
OFF  
Fault occurs when the ISET current goes above 150% of max current.  
The boost will stop switching and the IC will disable the LED sinks  
until the fault is removed. When the fault is removed, the IC will try to  
regulate to the preset LED current.  
ISET Short Protection  
Auto-restart  
Auto-restart  
Always  
Always  
YES  
YES  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
Fault occurs when the FSET current goes above 150% of max  
current. The boost will stop switching, Disconnect switch will turn off  
and the IC will disable the LED sinks until the fault is removed. When  
the fault is removed, the IC will try to restart with soft-start.  
FSET/SYNC Short  
Protection  
Fault occurs when current into OVP pin exceeds iOVP(th) (typically  
150 µA). The IC will immediately stop switching but keep the LED  
drivers active, to drain down the output voltage. Once the output  
voltage decreases by approximately VOVP(th), the IC will restart  
switching to regulate the output current.  
STOP during  
OVP event.  
Overvoltage Protection  
Undervoltage Protection  
Auto-restart  
Auto-restart  
Always  
Always  
NO  
ON  
ON  
ON  
Device immediately shuts off boost and current sinks if the voltage at  
VOUT is below VUVP(th). This may happen if VOUT is shorted to GND,  
or boost diode is open before startup. It will auto-restart once the fault  
is removed.  
YES  
OFF  
OFF  
Fault occurs if an LED pin voltage exceeds VLEDSC with its current  
sink in regulation, while at least one other LED pin is below ~1.2 V.  
This may happen when two or more LEDs are shorted within a string.  
The LED string exceeding the threshold will be disabled and removed  
from operation. Device will re-enable the LED string when its pin  
voltage falls below threshold, or at the next PWM = H.  
LED String Partial Short  
Detection (One-Out-  
Continue option)  
OFF for shorted  
string, ON for all  
others.  
Auto-restart  
Latched  
Always  
Always  
YES  
YES  
ON  
ON  
LED String Partial Short  
Detection (One-Out-All-Out  
option)  
If two or more LEDs are shorted within a string, all LED strings will be  
disabled and the device latched off. To reset the fault, EN or PWM pin  
must be pulled low for ~16 ms.  
OFF  
OFF  
OFF  
Fault occurs when the die temperature exceeds the over-temperature  
threshold, typically 170°C. IC will restart after temperatures drops  
lower by TSDHYS  
Overtemperature Protection Auto-restart  
Always  
Always  
YES  
NO  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
Fault occurs when VIN drops below VUVLO(fall). This fault resets all  
latched faults.  
VIN UVLO  
Auto-restart  
Continued on next page...  
32  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Table 5: A80606 Fault Mode Table (continued)  
Fault Flag  
Set  
Disconnect  
Switch  
Fault Name  
Type  
Active  
Description  
Boost Switch  
LED Sink drivers  
FAULT pin pulled Low  
Externally (One-Out-  
Continue option)  
Always  
ignored  
In One-Out-Continue mode (with unidirectional FAULT pin), external  
status of FAULT pin does not affect the operation of the IC in any way.  
Always ignored  
No change  
No change  
No change  
No change  
No change  
In One-Out-All-Out mode (with bidirectional FAULT pin), if FAULT pin  
is externally pulled Low, the IC immediately shuts off its boost and  
LED current sinks. IC can only restart when external fault status is  
cleared AND there is no internal fault status pending. That means  
local latching faults cannot be cleared by externally forcing FAULT  
pin to High.  
FAULT pin pulled Low  
Externally (One-Out-All-Out Auto-restart  
option)  
Always  
OFF  
ON  
OFF  
LED ꢀtring Partial-ꢀhort Deteꢁtion in One-Out-ꢂontinue modeA80606ꢄ  
ꢄaꢅlt Remoꢆed  
No ꢄaꢅlts  
ꢀꢁꢂꢃ String Partial-Short  
ꢄaꢅlt asserted  
Pꢋꢌ  
ꢀꢁꢂꢃ  
ꢀꢁꢂ1  
LED1ꢇ  
LEDꢈ  
ꢀꢁꢂSꢂ  
0
ꢃ00 mA  
iꢍLED 100 mA  
0
ꢅAULꢆ  
D
H
A
E
B
Eꢊplanation of events ꢇ  
Aꢇ PꢈM goes High and all ꢀꢁꢂ driꢆers oꢉerate normally. ꢄor simꢉlicity, assꢅme only ꢀꢁꢂ 1  
and ꢀꢁare in ꢅse, each sinꢋing 100 mA.ꢌ  
Bꢇ A ꢉartial-short ꢍaꢅlt is asserted to ꢀꢁꢂ ꢃ string. Nothing haꢉꢉens yet since PꢈM ꢎ ꢀ.  
ꢇ At the neꢏt PꢈM ꢎ H, ꢀꢁꢂꢃ ꢉin ꢆoltage stays aꢐoꢆe ꢑꢀꢁꢂSꢂ while ꢀꢁ1 in is at regꢅlation  
ꢆoltage.  
Dꢇ Aꢍter ꢉartial-short detection time ꢊꢒꢃ ꢓsꢌ, ꢀꢁꢂꢃ string is disaꢐled and ꢄAUꢀꢔ ꢉin ꢉꢅlled  
ꢀow. ꢀꢁꢂ1 string continꢅes to oꢉerate.  
Eꢇ At sꢅꢐseꢕꢅent PꢈM ꢎ H, ꢖꢗ retries ꢀꢁ1 ꢅt shꢅts it oꢍꢍ again since the ꢍaꢅlt is still  
ꢉresent. ꢄAUꢀꢔ ꢍlag remains ꢀow.  
ꢇ Partial Short ꢍaꢅlt is remoꢆed ꢍrom ꢀꢁꢂ ꢃ string. Nothing haꢉꢉens yet since PꢈM ꢎ ꢀ.  
ꢇ At the neꢏt PꢈM ꢎ H, ꢖꢗ retries ꢀꢁ1 and it ꢉasses. ꢅt ꢄAUꢀꢔ ꢍlag is not cleared  
Hꢇ ꢄAUꢀꢔ ꢍlag is cleared at the second PꢈM ꢎ H aꢍter Partial Short ꢍaꢅlt was remoꢆed.  
33  
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955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
PACKAGE OUTLINE DRAWING  
For Reꢀerence ꢁnly ꢂ Not ꢀor Tooling ꢃse  
(Reference DWG-2867)  
Dimensions in millimeters  
NOT TO SCALE  
Exact case and lead configuration at supplier discretion within limits shown  
0.30  
0.50  
7.00 BSC  
ꢃ0.0  
-0.05  
0.05  
48  
0.10 REF  
48  
4ꢀ0.20 MIN  
1
2
1
2
A
5.15  
7.00 BSC  
7.0  
1.00  
5.15  
C
D
49ꢀ  
7.0  
0.08  
C
0.90 NOM  
SEATING  
PLANE  
C
PCB Layout Reference View  
0.25 ꢁ0.05  
0.50 BSC  
0.05 REF  
0.05 REF  
0.40 NOM  
Terminal ꢂ1 mark area  
A
B
B
Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion)  
5.15 ꢁ0.10  
Reference land pattern layout (reference IPC7351 QFN50P700X700X100-49M);  
all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to  
meet application process requirements and PCB layout tolerances; when mounting  
on a multilayer PCB, thermal vias at the exposed thermal pad land can improve  
thermal dissipation (reference EIA/JEDEC Standard JESD51-5)  
C
2
1
48  
5.15 ꢁ0.10  
Coplanarity includes exposed thermal pad and terminals  
D
Figure 50: Package EV, 48-Pin 7 mm × 7 mm QFN with Exposed Thermal Pad and Wettable Flank  
34  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
APPENDIX A: DESIGN EXAMPLE  
This section provides step-by-step instructions to select compo-  
nent values for an A80606 application.  
Step 3: Determine the OVP resistor according to Equation 6:  
ROVP = (VOVP – VOVP(th)) / iOVP(th)  
For the purposes of this example, the following operating condi-  
tions are assumed:  
The nominal output voltage is:  
VOUT_nom = n × Vf + VREG  
• VIN = 12 V nominal (6 V min, 18 V max)  
• Number of LED channels, nc = 6  
where VREG is the LED pin regulation voltage. Substitute n = 7,  
Vf = 3.2 V and VREG = 0.85 V to get VOUT_nom = 23.25 V.  
• Number of series LEDs per channel, n = 7  
• LED current per channel, ILED = 150 mA  
• LED forward drop, Vf = 3.2 V max at cold  
• Switching frequency, fSW = 2.15 MHz  
Set the OVP threshold voltage approximately 10% higher, to  
account for error margin and component tolerances:  
VOVP = VOUT_nom × 1.1 = 25.6 V  
The OVP resistor is therefore:  
• Dithering modulation frequency, fDM = 1 kHz  
Dithering frequency range, ∆fSW = ±5%  
• Max ambient temperature, TA(max) = 65°C  
• PWM dimming frequency, fPWM = 200 Hz  
Step 1: Program the Switching Frequency from Equation 1:  
ROVP = (25.6 V – 2.5 V) / 150 µA  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀ=ꢀ154ꢀkΩ  
Step 3a: Check to ensure the maximum boost duty cycle is suf-  
ficient to achieve the required conversion ratio.  
DMAX(boost) = 1 – tSW(off) × fSW(max)  
where tSW(off) is the worst-case minimum SW on-time, and  
fSW(max) is the maximum switching frequency with dithering.  
RFSET = (21.5 / fSW ) – 0.2  
where fSW is in MHz and RFSET is in kΩ.  
Substitute tSW(off) = 100 ns and fSW(max) = 2.26 MHz to get  
DMAX(boost) = 0.774.  
Substitute fSW = 2.15 MHz to get RFSET = 9.8 kΩ (pick 10 kΩ).  
Step 1a: Program the Dithering Modulation Frequency from  
Equation 2:  
Theoretical maximum output voltage at the lowest input voltage is:  
VOUT(max) = VIN(min) / (1 – DMAX(boost)) – VD  
CDITH (nF) = 25 / fDM (kHz)  
Substitute fDM = 1 kHz to get CDITH = 25 nF (pick 22 nF).  
Step 1b: Select Dithering Range from Equation 3:  
∆fSW Range (±%) = 20 × RFSET / RDITH  
where VD is the forward drop of boost Schottky diode.  
Substitute VIN(min) = 6 V, DMAX(boost) = 0.774, and VD = 0.4 V to  
get VOUT(max) = 26.15 V.  
Theoretical VOUT(max) has to be greater than VOVP. If this is not  
the case, then switching frequency of the boost converter must be  
reduced to meet the maximum duty cycle requirement.  
Substitute Range = 5 and RFSET = 10 kΩ to get RDITH = 40 kΩ  
(pick 40.2 kΩ). The switching frequency now linearly sweeps  
between 2.04 and 2.26 MHz.  
Step 4 – Inductor selection: The inductor must be chosen  
based on ripple current requirement. In most applications due to  
stringent EMI requirements, the system also needs to operate in  
continuous conduction mode (CCM) throughout the whole input  
voltage range. A simple guideline is to start with 30% peak-to-  
peak ripple current at nominal input and output voltages.  
Step 2: Determine the LED current set Resistor RISET from  
Equation 4:  
RISET = (VISET × AISET) / ILED  
Substitute VISET = 0.985 V, AISET = 978, and iLED = 150 mA to  
get RISET = 6.42 kΩ.  
Step 4a: Determine the Boost Duty Cycle:  
D = 1 – VIN / (VOUT + VD)  
35  
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955 Perimeter Road  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
For nominal operation, substitute VIN_nom = 12 V, VOUT_nom  
23.25 V and VD = 0.4 V to get Dnom = 0.493.  
=
Step 5: To verify that there is sufficient slope compensation for  
the inductor chosen. The A80606 generates a variable internal  
Slope Comp according to fSW and VIN.  
Step 4b: Calculate the nominal Input Current based on esti-  
mated efficiency:  
• If VIN is between 9 V and 15 V:  
SC = 3 × fSW × VIN / 12  
iIN = VOUT × iOUT / (VINꢀ×ꢀη)  
• If VIN < 9 V:  
where η = efficiency of the converter (typically in the 85% to  
90% range).  
SC = 3 × fSW × 9 / 12  
• If VIN > 15 V:  
For nominal operation, substitute VOUT = 23.25 V, iOUT = 0.9 A,  
VIN = 12 V, and η = 0.9 to get iIN = 1.94 A.  
SC = 3 × fSW × 15 / 12  
where fSW is in MHz and SC is in A/µs.  
Step 4c: Select Boost Inductance based on 30% Ripple Current.  
For nominal operation, ∆iL = 0.3 × iIN = 0.58 A.  
∆iL = tON × VIN / L = D × VIN / (fSW × L)  
For example, at fSW = 2.15 MHz and VIN = 6 V, SC = 4.84 A/µs  
The falling slope of inductor current is given as:  
diL/dtꢀ=ꢀ–∆iL / tOFFꢀ=ꢀꢀ–∆iL × fSW /(1 – D)  
Therefore:  
Based on equations from previous section, at VIN = 6 V and  
VOUT(OVP) = 25.6 V, D = 0.749 and ∆iL = 0.442 A. Therefore  
|diL/dt| = 4.11 A/µs, which is slower than the internal slope. That  
means there is sufficient slope compensation.  
L = D × VIN / (fSWꢀ×ꢀ∆iL)  
Substitute Dnom = 0.493, VIN_nom = 12 V, and fSW = 2.15 MHz to  
get L = 4.7 µH.  
STEP 4d: Determine the maximum and minimum input current  
to the system. The maximum current determines the inductor’s  
saturation current rating. The minimum current determines its  
critical inductance.  
In case the negative slope of inductor current is faster than the  
internal slope comp, a higher inductance value must be used.  
Step 6: Select External Boost Switch MOSFET.  
Refer to Appendix B for more details on how to select the exter-  
nal boost MOSFET. For this example, the MOSFET picked is  
SVD5867NL with the following key parameters:  
Maximum input current occurs at minimum VIN and maximum  
VOUT (OVP).  
iIN_max = VOVP × iOUT / (VIN_minꢀ×ꢀη)  
• Breakdown voltage V(BD)DSS = 60 V min  
Substitute VOVP = 25.6 V, VIN_min = 6 V, and η = 0.85 to get  
iIN_max = 4.52 A.  
• On-resistance RDS(on) = 50 mΩ max at VGS = 4.5 V  
• Total Gate Charge QG = 10 nC for VGS = 0 to 6.5 V  
Step 7: Select boost switch current sense resistor.  
Peak inductor current:  
iL_peak = iIN_maxꢀ+ꢀ∆iL / 2  
From Equation 8:  
At minimum VIN = 6 V, D = 0.746, ∆iL = 0.442 A, and so iL_peak  
= 4.52 + 0.442 / 2 = 4.74 A. Therefore, the inductor should have a  
saturation current of at least 5.7 A (20% higher than iL_peak).  
RCS = VCS(LIM1) / iSW(LIM1)  
From previous section, iL_peak = 4.74 A at min VIN and max  
VOUT. Set the cycle-by-cycle SW current limit at least 20%  
higher, which means ~5.7 A. Therefore:  
Minimum input current occurs at maximum VIN and nominal  
VOUT  
.
RCSꢀ=ꢀ210ꢀmVꢀ/ꢀ5.7ꢀAꢀ=ꢀ37ꢀmΩ  
iIN_min = VOUT_nom × iOUT / (VIN_maxꢀ×ꢀη)  
Pick a standard E-12 resistor value of 39 mΩ. This gives cycle-  
by-cycle current limit of iSW(LIM1) = 5.4 A.  
Substitute VOUT_nom = 23.25 V, VIN_max = 18 V, and η = 0.9 to get  
iIN_min = 1.29 A.  
Step 8: Choose the input disconnect switch components.  
At maximum VIN = 18 V, D = 0.239, ∆iL = 0.426 A, and so  
iL_valley = 1.29 – 0.426 / 2 = 1.08 A. Therefore the converter  
operates in CCM throughout the input voltage range.  
Set the input disconnect switch current limit at least 20% above  
the SW cycle-by-cycle current limit:  
36  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
iSENSE = 5.4 A × 1.2 = 6.48 A  
The biggest contributing factors for total output capacitance are  
PWM off-time and leakage current (iLK). This current is mainly  
due to the reverse current of switching diode, plus a small/negli-  
gible leakage current into the OVP pin.  
RSC = VSENSETRIP / iSENSEꢀ=ꢀ15.1ꢀmΩꢀwhereꢀVSENSETRIP = 98 mV.  
Pick the closest lower resistance value from E-24 series, which is  
15 mΩ.  
In this design example, the PWM dimming frequency is 200 Hz  
with minimum duty cycle of 0.01%. So the maximum PWM  
off-time is essentially tOFF = 5 ms. A typical goal is to keep the  
output voltage variation at 250 mV or less to avoid audible noise.  
∆VOUT = tOFF × iLK / COUT  
RADJ = [VSENSETRIP – (RSC × iSENSE)] / iADJꢀ=ꢀ40ꢀΩꢀwhereꢀiADJꢀ=ꢀ20ꢀμA.  
Select the input disconnect switch P-MOSFET based on its drain-  
source breakdown voltage and on-resistance.  
The SQJ459EP can be used in this case. It has VDS = –60 V and  
RDS(ON) = 24 mΩ at VGS = –4.5 V.  
Therefore:  
COUT = tOFF × iLKꢀ/ꢀ∆VOUT  
Step 9: Select the switching diode.  
Substitute tOFF = 5 ms, iLK = 110 µA, and ∆VOUT = 0.25 V to get  
COUT = 2.2 µF.  
A Schottky barrier diode (SBD) is typically selected based on its  
voltage and current ratings:  
A major problem with multilayer ceramic capacitor (MLCC)  
is that its actual capacitance drops with respect to DC bias. For  
example, the capacitance of a 4.7 µF, 50 V, 0805 MLCC may  
be derated by 80% when it is biased at 25 V. That means its real  
capacity is less than 1 µF in actual application.  
• The reverse voltage rating must be higher than the maximum  
voltage stress, which is equal to the OVP threshold in this  
case.  
• The average forward current rating must be higher than the  
total LED current. The peak current through diode is given as:  
iD_peak = iL_peak = iIN_maxꢀ+ꢀ∆iL / 2  
MLCC with larger physical size and higher voltage rating typi-  
cally suffers less derating problem. For example, a 4.7 µF, 50 V,  
1210 MLCC may retain 3.3 µF of capacitance at 25 V. This is  
shown in the table below:  
From previous calculation at minimum VIN, iL_peak = 4.74 A.  
However, during transient, this current could reach cycle-by-  
cycle SW current limit, iSW(LIM)  
.
Rated  
Capacitance  
at 0 V (µF)  
Actual  
Capacitance  
at 25 V (µF)  
Another critical parameter is the diode’s reverse leakage current  
at hot. This is especially important when using PWM dimming.  
During PWM off time, the boost converter is not switching, so  
voltage at output capacitor decays due to leakage current. This  
increases output ripple voltage, which may generate audible noise  
from ceramic capacitors.  
Derating at  
25 V  
Part Number  
Package  
GRM21BC71H475KE11  
GRM31CR71H475MA12  
GRM32ER71H475KA88  
0805  
1206  
1210  
4.7  
4.7  
4.7  
–80%  
–45%  
–30%  
0.94  
2.59  
3.29  
Make sure to verify the diode’s reverse current at hot (such as  
125°C) and at the nominal VOUT. As a general guideline, look  
for a diode with leakage of 100 µA or less. If necessary, consider  
using a diode with higher voltage rating (such as 100 V instead  
of 50 V). Doing so can significantly reduce the leakage current at  
Step 11: Selection of input capacitor.  
A combination of MLCC and electrolytic capacitor is recom-  
mended. The MLCC provides low ESR to reduce input switching  
ripple. The electrolytic capacitor provide larger capacitance to  
stabilize input voltage during PWM dimming operation.  
nominal VOUT  
.
A good rule of thumb is to set the input voltage ripple ΔVIN to be  
1% of the minimum input voltage. The minimum input capacitor  
requirements are as follows.  
For this design example, a 100 V, 3 A Schottky diode SS3H10 is  
selected. It has a very low iR = 50 µA at TJ = 125°C and VR = 30 V.  
Step 10: Selection of output capacitors.  
CINꢀ=ꢀ∆iL / (8 × fSWꢀ×ꢀΔVIN)  
The use of multilayer ceramic capacitor (MLCC) is recom-  
mended. MLCC capacitors have extremely low ESR, which is  
necessary to reduce the output switching ripple of the boost con-  
verter. In addition, the total output capacitance must be sufficient  
to reduce output droop during PWM dimming operation.  
Substitute ∆iL = 0.442 A at VIN = 6 V (from step 4d), ∆VIN  
=
0.06 V, and fSW = 2.15 MHz to get CIN = 0.43 µF. Due to the DC  
bias derating, the actual MLCC selected should be rated 1 µF or  
higher.  
37  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
A much larger input capacitance is required to provide the inrush  
current during PWM dimming operation. The exact requirement  
depends on many external factors, such as length of power cables  
and response time of the power supply. As a first-order estimate:  
assuming the power supply takes 25 µs to response, and the input  
capacitor must keep the VIN droop under 0.2 V while input cur-  
rent ramps up from zero to full load. The following is needed:  
CIN = iIN × tPSꢀ/ꢀ(8ꢀ×ꢀ∆VIN)  
Substitute iIN = 4.52 A at VIN = 6 V (from step 4d), ∆VIN = 0.2 V  
and tPS = 25 µs to get CIN = 71 µF. Use an electrolytic capacitor  
of 68 µF in parallel with the MLCC.  
The following schematic diagrams shows calculated component  
values from the design example:  
ꢑN ꢒ ꢈ ꢓ 1ꢉ ꢆ  
ꢎUꢔ ꢒ ꢕꢊ3 ꢆ  
SS3H10  
Sꢂꢃꢄ59ꢅP  
ꢄ.ꢐ ꢌH  
0.015 Ω  
ꢑNꢊ  
Nꢆꢖ5ꢉꢈꢐNꢍ  
ꢖꢊ  
1N4148  
ꢈꢉ ꢌꢁ  
ꢅꢍꢇꢎ  
ꢊ.ꢊ ꢌꢁ  
Mꢍꢇꢇ  
0.1 ꢌꢁ  
ꢄ0 Ω  
330 pF  
15ꢄ ꢋΩ  
2.49 Ω  
ꢊ.ꢊ ꢌꢁ  
ꢊ ꢏ ꢄ.ꢐ ꢌꢁ  
50 ꢆ 1ꢊ10  
0.039 Ω  
100 Ω  
ꢗAꢔꢅ  
ꢆꢖRꢆ ꢗꢖRꢆ ꢇS PꢗNꢖ  
ꢎꢆP  
ꢆsense  
ꢇꢇ  
ꢆin  
1 ꢌꢁ  
ꢖꢖ  
10 ꢋΩ  
ꢍꢅꢖ1  
Aꢉ0ꢈ0ꢈ  
ꢁAUꢍꢔ  
ꢅN  
ꢈ ꢍꢅꢖ strings with  
ꢐ ꢙꢍꢅꢖs in series  
at 150 mAꢘch.  
ꢍꢅꢖꢊ  
ꢍꢅꢖ3  
ꢍꢅꢖꢈ  
PꢙM  
AꢖꢑMAPꢙM  
ꢇꢎMP  
ꢇꢍꢚꢎUꢔ  
AꢗNꢖ  
ꢑSꢅꢔ  
ꢁSꢅꢔ  
ꢖꢑꢔH  
Pꢅꢛ  
100 ꢀꢁ  
ꢊꢉ0 Ω  
ꢄ0.ꢊ ꢋΩ  
ꢊꢊ nꢁ  
6.42 kΩ  
11.3 ꢋΩ  
10 ꢋΩ  
ꢈꢉ nꢁ  
Figure 51: A80606 2.15 MHz Boost schematic for design example  
38  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
APPENDIX B: EXTERNAL MOSFET SELECTION GUIDE  
The A80606 drives an external MOSFET for the boost stage. This  
solution provides maximum flexibility in delivering a wide range  
of output voltage and current for different LED panels, compared  
to controllers with built-in boost switches. On the other hand,  
care must be taken in selection of external MOSFET, to ensure  
optimal tradeoff between component size, efficiency, and cost.  
Primary Parameters to consider include the following.  
ON-RESISTANCE  
Device with lower RDSON can directly reduce the conduction loss  
of the boost converter. This is especially important when the out-  
put power is high and input supply voltage is low. Note that most  
datasheets typically highlight this parameter at VGS = 10 V and  
TJ = 25°C. It is important to examine how RDSON varies with gate  
voltage and temperature, as shown in the following charts:  
BREAKDOWN VOLTAGE  
Pick the device with “Drain to Source Breakdown Voltage” at  
least 20% higher than the maximum possible SW voltage.  
• For boost configuration, VSW = VOUT + VF; where VF = boost  
diode forward drop.  
The A80606 has a maximum VOUT of 40 V. Therefore, the  
MOSFET should be rated 50 V or higher.  
• For SEPIC configuration, VSW = VIN + VOUT + VF.  
Note that VIN can be as high as 40 V during load-dump  
conditions. The breakdown voltage needs to be increased  
accordingly.  
GATE THRESHOLD VOLTAGE  
The device must be fully enhanced by the time VGS = 5 V. Note  
that this is not the same as “Gate to Source Threshold Voltage”  
in most MOSFET datasheets, which is typically specified at very  
small current such as 250 µA. A more reliable way is to consult  
the “Gate Charge Characteristics” chart of the device, and make  
sure that the ‘plateau’ occurs well before VGS reaches 5 V. See  
example from datasheet of one potential candidate:  
Figure 53: Chart showing On-Resistance varies with Darin  
Current and Gate Voltage.  
Figure 54: Nominalized On-Resistance vs. Junction Tem-  
perature at VGS = 10 V. Note that resistance increases by  
100% when temperature rises from 25°C to 150°C.  
Figure 52: Gate Charge vs. Gate-Source Voltage for an ex-  
ample MOSFET. Note plateau at VGS = 4.2 V approximately.  
39  
Allegro MicroSystems  
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A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
On the other hand, selecting a device with very low QG may  
cause excessive voltage spikes at SW node due to high dV/dt. In  
this case, a snubber circuit can be added to dampen the ringing.  
The switching speed can be slowed down by adding a series gate  
resistance (such as 1-5 ohm) between the driver and the device.  
The downside of doing this is higher switching losses.  
THERMAL RATING  
The thermal resistance (RθJA) is primarily determined by the  
device’s physical size. If the thermal resistance of the device is  
too high, or if there is insufficient heat dissipation on the PCB,  
the device may enter thermal run-away situation and burn itself  
out. For most medium-power (10-30 W) applications, a DPAK  
device is generally sufficient. For high-power (>50 W) applica-  
tions, a D2PAK device may be required. Depending on power  
loss, additional heat sink can be mounted to improve the heat  
dissipation from the PCB.  
GATE CHARGE  
As mentioned earlier, lower RDSON is desired to reduce conduc-  
tion loss. But devices with lower RDSON typically also have  
higher gate charge (QG), which can lead to higher switching loss.  
This is especially important when switching at high frequency  
(such as 2 MHz) and with high output voltage. Higher gate  
charge also results in higher gate driver current and hence higher  
power loss for the controller IC.  
The A80606 uses an LDO to supply the driver voltage (VDRV),  
which has a current limit of 36 mA typical. Average gate driver  
current is:  
Figure 56: Gate Charge vs. Gate-Source Voltage chart for  
a suitable MOSFET (SVD5867NL). Note that its plateau is  
at ~3.5 V, and its total gate charge is about 10 nC as VGS  
ramps up from 0 to 6.5 V.  
iVDRV = fSW × QG  
If the MOSFET selected has QG = 27 nC, for example, then the  
highest switching frequency is limited to 1.33 MHz. See the fol-  
lowing chart for relation between maximum switching frequency  
and MOSFET gate charge:  
ꢂꢆꢍ. ꢎꢁꢏtꢐꢉꢏꢌꢋ ꢑꢊꢇꢒꢓꢇꢌꢐꢔ ꢕs. ꢅꢆtꢇ ꢈꢉꢆꢊꢋꢇ  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
10  
15  
20  
25  
30  
35  
40  
ꢅꢆtꢇ ꢈꢉꢆꢊꢋꢇ (ꢌꢈ)  
Figure 55: Maximum Switching Frequency vs. Gate Charge  
(to keep average VDRV current under 36 mA).  
40  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80606 and  
A80606-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Revision History  
Number  
Date  
August 27, 2020  
Description  
Initial release  
Copyright 2020, Allegro MicroSystems.  
Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit  
improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the  
information being relied upon is current.  
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of  
Allegro’s product can reasonably be expected to cause bodily harm.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor  
for any infringement of patents or other rights of third parties which may result from its use.  
Copies of this document are considered uncontrolled documents.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
41  
Allegro MicroSystems  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  

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