ARS19200LUBATN-H [ALLEGRO]

ASIL-Compliant Wheel Speed Sensor IC;
ARS19200LUBATN-H
型号: ARS19200LUBATN-H
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

ASIL-Compliant Wheel Speed Sensor IC

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中文:  中文翻译
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ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
DESCRIPTION  
2
-
FEATURES AND BENEFITS  
• Integrated diagnostics and certified safety design process  
The ARS19200 is a Hall-effect-based integrated circuit (IC)  
thatprovidesauser-friendlysolutionfortruezero-speeddigital  
ring magnet sensing in two-wire applications. TheARS19200  
is offered in the UB package, which integrates the IC and a  
hightemperatureceramiccapacitorinasingleovermoldedSIP  
package. The integrated capacitor provides enhanced EMC  
performance with reduced external components.  
for ASIL B compliance  
• Integrated capacitor reduces need for external EMI  
protection components  
• True zero-speed operation  
• Single chip sensing IC for high reliability  
• Fully synchronous digital logic with Scan and IDDQ  
testing  
• Application-proven algorithms for robust operation in  
wheel speed environments  
TheICisideallysuitedforobtainingspeedinformationinwheel  
speed applications. The Hall element spacing is optimized for  
high resolution, small diameter targets. The package is lead  
(Pb) free, with tin leadframe plating.  
PACKAGE: 2-pin SIP (suffix UB)  
Not to scale  
Functional Block Diagram  
VCC  
Internal Regulator  
Analog to  
Offset  
Adjust  
Output  
Control  
Digital  
Controller  
Amp  
AGC  
Digital  
Converter  
GND  
ARS19200-DS, Rev. 3  
MCO-0000375  
May 18, 2018  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
SELECTION GUIDE  
Part Number  
Packing  
Power-On State  
ICC(LOW)  
ARS19200LUBATN-L  
ARS19200LUBATN-H  
4000 pieces per 13-in. reel  
4000 pieces per 13-in. reel  
ICC(HIGH)  
ABSOLUTE MAXIMUM RATINGS  
Characteristic  
Symbol  
VCC  
Notes  
Rating  
28  
Unit  
V
Supply Voltage  
Reverse Supply Voltage  
Operating Ambient Temperature  
Maximum Junction Temperature  
Storage Temperature  
VRCC  
TA  
–18  
V
L temperature range  
–40 to 150  
165  
°C  
°C  
°C  
TJ(max)  
Tstg  
–65 to 170  
INTERNAL DISCRETE CAPACITOR RATINGS  
Characteristic  
Symbol  
Test Conditions  
Value (Typ.)  
Unit  
Nominal Capacitance  
CSUPPLY  
Connected between VCC and GND  
2200  
pF  
Terminal List Table  
Name  
Number  
Function  
1
2
VCC  
1
Supply Voltage  
Ground  
GND  
2
UB Package, 2-Pin SIP Pinout Diagram  
2
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
OPERATING CHARACTERISTICS: Valid throughout full operating and temperature ranges, unless otherwise specified  
Characteristic  
ELECTRICAL CHARACTERISTICS  
Supply Voltage [2]  
Symbol  
Test Conditions  
Min.  
Typ. [1]  
Max.  
Unit  
VCC  
VCC(UV)  
IRCC  
Operating, TJ < TJ(max)  
4.0  
3.6  
24  
3.95  
–10  
V
V
Undervoltage Lockout  
Reverse Supply Current [3]  
Supply Zener Clamp Voltage  
Supply Zener Current  
VCC 0 → 5 V or 5 → 0 V  
VCC = VRCC(max)  
mA  
V
VZSUPPLY ICC = ICC(max) + 3 mA, TA = 25°C  
IZSUPPLY TA = 25°C, VCC = 28 V  
28  
19  
mA  
OUTPUT  
-H variant  
POS  
ICC(HIGH)  
Power-On State  
Supply Current  
-L variant  
ICC(LOW)  
ICC(LOW) Low-current state  
ICC(HIGH) High-current state  
5.9  
12  
8.4  
16  
mA  
mA  
ICC(HIGH) / Measured as ratio of high current to low current  
ICC(LOW) (isothermal)  
Supply Current Ratio  
ASIL Safety Current  
Output Rise, Fall Time  
1.9  
1.0  
0
IRESET  
3.3  
1.5  
mA  
μs  
Corresponds to measured output slew rate with  
CSUPPLY; RLOAD = 100 Ω, CL = 10 pF  
tr, tf  
OPERATING CHARACTERISTICS  
Operate Point  
BOP  
BRP  
fFWD  
% of peak-to-peak IC-processed magnetic signal  
% of peak-to-peak IC-processed magnetic signal  
0
60  
40  
5
%
%
Release Point  
Operating Frequency  
kHz  
Continued on the next page…  
CC  
1
ꢀCC  
ARS19200  
ꢁNꢂ  
R
100 Ω  
L
C
L
Figure 1: Typical Application Circuit  
3
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise  
specified  
Characteristic  
Symbol  
Test Conditions  
Min.  
Typ. [1]  
Max.  
Unit  
OPERATING CHARACTERISTICS (continued)  
Input Signal  
BSIG  
BSIGEXT  
TC  
Differential signal, measured peak-to-peak  
20  
1200  
300  
G
G
Allowable User-Induced Differential  
Offset  
External differential signal bias (DC), operating  
within specification  
–300  
Sensitivity Temperature Coefficient [4]  
Total Pitch Deviation  
+0.2  
%/°C  
%
For constant BSIG, sine wave  
±2  
No missed output edge. Instantaneous  
Maximum Sudden Signal Amplitude  
Change  
BSEQ(n+1) symmetric magnetic signal amplitude change,  
/ BSEQ(n) measured as a percentage of peak-to-peak BSIG  
(see Figure 2)  
0.6  
0.2  
Overall symmetric magnetic signal amplitude  
change, measured as a percentage of peak-to-  
Maximum Total Signal Amplitude  
Change  
BSEQ(max)  
/BSEQ(min)  
peak BSIG  
[1] Typical values are at TA = 25°C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits.  
[2] Maximum voltage must be adjusted for power dissipation and junction temperature; see representative discussions in Power Derating section.  
[3] Negative current is defined as conventional current coming out of (sourced from) the specified device terminal.  
[4] Ring magnets decrease strength with rising temperature. Device compensates. Note that BSIG requirement is not influenced by this.  
B
SEQ(n)  
B
SEQ(n+1)  
Figure 2: Differential Signal Variation  
4
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Test Conditions*  
Value  
Unit  
Package Thermal Resistance  
RθJA  
Single-layer PCB with copper limited to solder pads  
213  
°C/W  
*Additional thermal information is available on the Allegro website.  
Power Derating Curve  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
VCC(max)  
8
7
6
5
4
VCC(min)  
3
2
20  
40  
60  
80  
100  
120  
140  
160  
180  
Temperature (ºC)  
Power Dissipation versus Ambient Temperature  
1900  
1800  
1700  
1600  
1500  
1400  
1300  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
Temperature (ºC)  
5
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
FUNCTIONAL DESCRIPTION  
Determining Output Signal Polarity  
Hall Technology  
In Figure 5, the top panel, labeled Mechanical Position, repre-  
sents the mechanical features of the ring magnet or gear target  
and orientation to the device. The bottom panel, labeled Device  
Output Signal, displays the square waveform corresponding  
to the digital output signal that results from a rotating target  
configured as shown in Figure 4. That direction of rotation (of  
the target side adjacent to the package face) is: perpendicular to  
the leads, across the face of the device, from the pin 1 side to the  
pin 2 side. This results in the device output switching from high  
to low output state as a north magnetic pole passes the device  
face. In this configuration, the device output voltage switches to  
its high polarity when a south pole is the target feature nearest to  
the device. If the direction of rotation is reversed or if a part of  
type ARS19200LUBx-L is used, then the output polarity inverts  
(see Table 1).  
This single-chip differential Hall-effect sensor IC contains two  
Hall elements as shown in Figure 3, which simultaneously sense  
the magnetic profile of the ring magnet or gear target. The mag-  
netic fields are sensed at different points (spaced at a 1.75 mm  
pitch), generating a differential internal analog voltage, VPROC  
,
that is processed for precise switching of the digital output signal.  
The Hall IC is self-calibrating and also possesses a temperature-  
compensated amplifier and offset cancellation circuitry. Its  
voltage regulator provides supply noise rejection throughout the  
operating voltage range. Changes in temperature do not greatly  
affect this device due to the stable amplifier design and the offset  
rejection circuitry. The Hall transducers and signal processing  
electronics are integrated on the same silicon substrate, using a  
proprietary BiCMOS process.  
Target Profiling During Operation  
An operating device is capable of providing digital information  
that is representative of the mechanical features of a rotating  
gear or ring magnet. The waveform diagram in Figure 5 presents  
the automatic translation of the mechanical profile, through the  
magnetic profile that it induces, to the digital output signal of the  
ARS19200. No additional optimization is needed and minimal  
processing circuitry is required. This ease of use reduces design  
time and incremental assembly costs for most applications.  
Table 1: Output Polarity when a South Pole Passes the  
Package Face in the Indicated Rotation Direction  
Part Type  
Rotation Direction  
ARS19200LUBx-H  
ICC(HIGH)  
ARS19200LUBx-L  
ICC(LOW)  
Pin 1 → Pin 2  
Pin 2 → Pin 1  
ICC(LOW)  
ICC(HIGH)  
Branded Face  
of Package  
Rotating Target  
(Ring magnet or  
ferromagnetic)  
Ring Magnet  
S
N
S
N
N
S
S
N
Target  
N
S
S
N
Ferromagnetic  
Target  
Tooth  
Valley  
Pin 1  
Pin 2  
Element Pitch  
Hall Element 1  
Rotation from pin 1 to pin 2  
Hall Element 2  
Package Case Branded Face  
(Top View of  
Package Case)  
Pin 2  
Side  
Pin 1  
Side  
IC  
Branded Face  
of Package  
Rotating Target  
(Ring magnet or  
ferromagnetic)  
South Pole  
North Pole  
Back-Biasing Magnet  
(Externally applied for  
ferromagnetic target)  
N
S
S
N
N
S
S
N
Pin 1  
Pin 2  
Rotation from pin 2 to pin 1  
Figure 3: Relative Motion of the Target  
Figure 4: Target Orientation Relative to Device  
(ring magnet shown).  
Relative Motion of the Target is detected by the dual Hall elements  
mounted on the Hall IC.  
6
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
Element Pitch  
Package Case Branded Face  
Package Case  
Branded Face  
Device Orientation to Target  
Device Orientation to Target  
(Top View of  
Package Case)  
(Top View of  
Package Case)  
(Pin 1 Side)  
(Pin 2 Side)  
E2  
(Pin 1 Side)  
Element Pitch  
IC  
(Pin 2 Side)  
E2  
E1  
IC  
E1  
South Pole  
North Pole  
External  
Back-Biasing Magnet  
Mechanical Position (Target moves past device pin 1 to pin 2)  
Mechanical Position (Target moves past device pin 1 to pin 2)  
Target  
This pole  
sensed later  
This pole  
sensed earlier  
(Radial Ring Magnet)  
Target  
(Ferromagnetic)  
This tooth  
sensed earlier  
This tooth  
sensed later  
N
S
N
Target Magnetic Profile  
Target Magnetic Profile  
+B  
Speed Channel  
Element Pitch  
Element Pitch  
+B  
–B  
IC Internal Differential Analog Signals, VPROC  
IC Internal Differential Analog Signals, VPROC  
BOP(#1)  
BOP(#2)  
BOP(#1)  
BOP(#2)  
Speed  
Channel  
BRP(#1)  
BRP(#1)  
Device Output Signal,IOUT  
Device Output Signal,IOUT  
+t  
+t  
Figure 5: Basic Operation  
7
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
Magnetic  
ꢂncoder  
S
S
S
CCꢆHꢅꢇHꢈ  
CCꢆLꢀꢉꢈ  
Normal  
ꢀꢁeration  
CCꢆHꢅꢇHꢈ  
ꢂrror  
ꢂrror  
ꢂꢃamꢁle 1  
CCꢆLꢀꢉꢈ  
RꢂSꢂꢊ  
CCꢆHꢅꢇHꢈ  
ꢂrror  
ꢂrror  
ꢂꢃamꢁle ꢄ  
CCꢆLꢀꢉꢈ  
RꢂSꢂꢊ  
Figure 6: Output Protocol with ASIL Safety Current  
8
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
POWER DERATING  
The device must be operated below the maximum junction  
temperature of the device, TJ(max). Under certain combinations of  
peak conditions, reliable operation may require derating supplied  
power or improving the heat dissipation properties of the appli-  
cation. This section presents a procedure for correlating factors  
affecting operating TJ. (Thermal data is also available on the  
Allegro MicroSystems website.)  
A worst-case estimate, PD(max), represents the maximum allow-  
able power level (VCC(max), ICC(max)), without exceeding TJ(max)  
at a selected RθJA and TA.  
,
Example: Reliability for VCC at TA=150°C, package UB, using  
minimum-K PCB.  
Observe the worst-case ratings for the device, specifically:  
RθJA=213°C/W, TJ(max) =165°C, VCC(max)= 24 V, and  
ICC(max) = 16 mA.  
The Package Thermal Resistance, RθJA, is a figure of merit sum-  
marizing the ability of the application and the device to dissipate  
heat from the junction (die), through all paths to the ambient air.  
Its primary component is the Effective Thermal Conductivity, K,  
of the printed circuit board, including adjacent devices and traces.  
Radiation from the die through the device case, RθJC, is relatively  
small component of RθJA. Ambient air temperature, TA, and air  
motion are significant external factors, damped by overmolding.  
Calculate the maximum allowable power level, PD(max). First,  
invert equation 3:  
ΔTmax = TJ(max) – TA = 165°C150°C = 15°C  
This provides the allowable increase to TJ resulting from internal  
power dissipation. Then, invert equation 2:  
The effect of varying power levels (Power Dissipation, PD), can  
be estimated. The following formulas represent the fundamental  
relationships used to estimate TJ, at PD.  
P
D(max) = ΔTmax ÷RθJA =1C÷213°C/W=70.4mW  
Finally, invert equation 1 with respect to voltage:  
CC(est) = PD(max) ÷ ICC(max) = 70.4mW÷16.0mA=4.4 V  
The result indicates that, at TA, the application and device can  
dissipate adequate amounts of heat at voltages ≤VCC(est)  
V
PD = VIN  
I
(1)  
(2)  
(3)  
×
IN  
ΔT = PD  
R
θJA  
×
.
TJ = TA + ΔT  
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-  
able operation between VCC(est) and VCC(max) requires enhanced  
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and  
VCC(max) is reliable under these conditions.  
For example, given common conditions such as: TA= 25°C,  
VCC = 12 V, ICC = 14 mA, and RθJA = 213 °C/W, then:  
PD = VCC  
I
= 12 V 14 mA = 168 mW  
CC  
×
×
ΔT = PD  
R
= 168 mW 213°C/W = 35.8°C  
θJA  
×
×
TJ = TA + ΔT = 25°C + 35.8°C = 60.8°C  
9
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
PACKAGE OUTLINE DRAWING  
For Reference Only – Not for Tooling Use  
(Reference DWG-0000408, Rev. 3)  
Dimensions in millimeters  
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
+0.06  
4.00  
–0.05  
B
4 × ꢀ0°  
E
1.75  
1.50 0.05  
E
1.125  
0.65 0.07  
C
E
1.54  
Mold Ejector  
Pin Indent  
+0.06  
4.00  
E
E1  
–0.07  
E2  
E
XXXXX  
Date Code  
Lot Number  
Branded  
45°  
Face  
A
0.85 0.05  
4 × 2.50 0.ꢀ0  
4 × 0.85 REF  
0.25 REF  
0.30 REF  
0.42 0.05  
D
Standard Branding Reference View  
2.54 REF  
Line 1 = Part Number (5 characters)  
Line 2 = Date Code (4 digits)  
Line 3 = Characters 5-8 of  
Assembly Lot Number  
2
18.00 0.10  
A
Dambar removal protrusion (8×)  
ꢀ.00 0.ꢀ0  
ꢀ2.20 0.ꢀ0  
4 × 7.37 REF  
B
C
D
E
F
Gate and tie bar burr area  
+0.07  
–0.03  
Active Area Depth, 0.38 0.03 mm  
0.25  
1.80  
0.10  
Branding scale and appearance at supplier discretion  
Hall elements (E1 and E2); not to scale  
Molded Lead Bar for preventing damage to leads during shipment  
0.38 REF  
0.25 REF  
4 × 0.85 REF  
0.85 0.05  
+0.06  
1.80  
–0.07  
F
+0.06  
1.50 0.05  
4.00  
–0.05  
Figure 7: Package UB, 2-Pin SIP  
10  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
ARS19200  
ASIL-Compliant Wheel Speed Sensor IC  
Revision History  
Number  
Date  
Description  
1
2
March 9, 2017  
May 19, 2017  
July 11, 2017  
Initial preliminary release  
Corrected part number (page 2)  
Removed Chopping references  
Status changed from Preliminary to Final, removed tRESET, updated Figure 6, updated Package  
Outline Drawing, and other editorial updates  
3
May 18, 2018  
Copyright ©2018, Allegro MicroSystems, LLC  
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to  
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that  
the information being relied upon is current.  
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of  
Allegro’s product can reasonably be expected to cause bodily harm.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its  
use; nor for any infringement of patents or other rights of third parties which may result from its use.  
Copies of this document are considered uncontrolled documents.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
11  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  

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