STR-X6768N_V [ALLEGRO]
Off-Line Quasi-Resonant Switching Regulators; 离线准谐振开关稳压器
| 型号： | STR-X6768N_V |
| 厂家： | 
ALLEGRO MICROSYSTEMS |
| 描述： | Off-Line Quasi-Resonant Switching Regulators |
| 文件： | 总9页 (文件大小：445K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STR-X6768N
Off-Line Quasi-Resonant Switching Regulators
Features and Benefits
Description
▪ Quasi-resonant topology IC Low EMI noise and soft
switching
TheSTR-X6768Nisaquasi-resonanttopologyICdesignedfor
SMPS applications. It shows lower EMI noise characteristics
than conventional PWM solutions, especially at greater than
2 MHz. It also provides a soft-switching mode to turn on the
internal MOSFET at close to zero voltage (VDS bottom point)
by use of the resonant characteristic of primary inductance
and a resonant capacitor.
▪ Bottom-skip mode Improved system efficiency over
the entire output load by avoiding increase of switching
frequency
▪ Standby mode Lowers input power at very light output
load condition
▪ Avalanche-guaranteed MOSFET Improves system-level
reliability and does not require VDSS derating
▪ 800 VDSS / 1.00 Ω RDS(on)
▪ Various protections Improved system-level reliability
▫ Pulse-by-pulse drain overcurrent limiting
▫ Overvoltage Protection (bias winding voltage sensing),
with latch
The package is a fully molded TO-3P, which contains the
controller chip (MIC) and MOSFET, enabling output power
up to 220 W at 230 VAC and 150 W at universal input. The
bottom-skipmodeskipsthefirstbottomofVDS andturnsonthe
MOSFET at the second bottom point, to minimize an increase
of operating frequency at light output load, improving system-
level efficiency over the entire load range.
▫ Overload Protection with latch
▫ Maximum on-time limit
Astandbymodeisexecutedbyclampingthesecondaryoutput.
In general applications, standby mode reduces input power.
Package: 7-Pin TO-3P
Thesoft-startmodeminimizessurgevoltageandreducespower
stress to the MOSFET and to the secondary rectifying diodes
during the start-up sequence.
Variousprotectionssuchasovervoltage,overload,overcurrent,
maximumon-timeprotectionsandavalanche-energyguaranteed
MOSFET secure good system-level reliability.
Continued on the next page…
Not to scale
Typical Application
STR-X6768N
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
Description (continued)
Applications include the following:
▪ Set Top Box
▪ LCD PC monitor, LCD TV
▪ Printer, Scanner
▪ SMPS power supplies
Selection Guide
Part Number
STR-X6768N
Package
TO-3P
Absolute Maximum Ratings at TA = 25°C
Parameter
Symbol
IDpeak Single pulse
Conditions
Rating
20
Unit
A
Drain Current1
Maximum Switching Current2
Single Pulse Avalanche Energy3
Input Voltage for Controller (MIC)
SS/OLP Terminal Voltage
FB Terminal Inflow Current
FB Terminal Voltage
IDmax
EAS
VCC
VSSOLP
IFB
VFB
TA = –20°C to 125°C
Single pulse, VDD = 30 V, L = 50 mH, ILpeak = 3.9 A
20
395
35
A
mJ
V
V
mA
V
–0.5 to 6.0
10
–0.5 to 9.0
–1.5 to 5.0
46
2.8
0.8
–20 to 125
–20 to 125
–40 to 125
150
IFB within the limits of IFB
OCP/BD Terminal Voltage
VOCPBD
V
With infinite heatsink
Without heatsink
VCC × ICC
W
W
W
°C
°C
°C
°C
MOSFET Power Dissipation4
PD1
Controller (MIC) Power Dissipation
Operating Internal Leadframe Temperature
Operating Ambient Temperature
Storage Temperature
Channel Temperature
1Refer to MOSFET ASO curve
2IDMAX is the drain current determined by the drive voltage of the IC and the threshold voltage, Vth, of the MOSFET
3Refer to Avalanche Energy Derating curve
4Refer to MOSFET Ta-PD1 curve
PD2
TF
TOP
Recommended operation temperature, see cautions
T
stg
T
ch
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
2
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
Functional
Block Diagram
Terminal List Table
Number
Name
Description
Functions
1
2
3
4
5
D
Drain
MOSFET drain
MOSFET source
Ground
S
Source
GND
VCC
SS/OLP
Ground terminal
Power supply terminal
Input of power supply for control circuit
Soft Start/Overload Protection terminal
Input to set delay for Overload Protection and Soft Start operation
Input for Constant Voltage Control and Burst (intermittent) Mode
oscillation control signals
6
7
FB
Feedback terminal
OCP/BD
Overcurrent Protection/Bottom Detection
Input for Overcurrent Detection and Bottom Detection signals
3
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
STR-X6768N
A.S.O. temperature derating coefficient
curve
STR-X6768N
MOS FET A.S.O. Curve
Ta=25℃
Single pulse
100
80
60
40
20
0
100
10
1
0.1ms
Determined by
On-Resistance
1 ms
Apply A.S.O temperature
coefficient from the left graph
to this curve for evaluating
actual operations' safety
0
20 40 60 80 100 120
TF [℃]
0.1
Internal frame temperature
10
100
VDS[V]
1000
Drain-to-Source Voltage
STR-X6768N
Avalanche energy derating curve
100
80
60
40
20
0
25
50
75
100
125
150
Tch [℃]
Channel temperature
4
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
STR-X6768N
MOSFET Ta-PD1 Curve
STR-X6768N
MIC TF-PD2 Curve
60
50
40
30
20
10
0
1
0.8
0.6
0.4
0.2
0
PD1=46[W]
With infinite heatsink
Without heatsink
PD1=2.8[W]
0
20 40 60 80 100 120 140
0
20
40
60
80 100 120 140
TF〔℃〕
Ta〔℃〕
Internal frame temperature
Ambient temperature
STR-X6768N
Transient thermal resistance curve
1
0.1
0.01
0.001
ｔ〔sec〕
Time
1μ
100 m
5
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Units
ELECTRICAL CHARACTERISTICS for Controller (MIC)1, valid at TA = 25°C, VCC = 20 V, unless otherwise specified
Power Supply Start-up Operation
VCC = 0→20 V
Operation Start Voltage
VCC(ON)
VCC(OFF)
ICC(ON)
16.3
8.8
–
18.2
9.7
–
19.9
10.6
6
V
V
VCC = 20→8.8 V
Operation Stop Voltage
Circuit Current In Operation
mA
μA
kHz
V
VCC = 15 V
Circuit Current In Non-Operation
Oscillation Frequency
ICC(OFF)
fosc
VSSOLP(SS)
ISSOLP(SS)
–
–
100
25
19
22
VSS/OLP increasing
VSS/OLP = 0 V
Soft Start Operation Stop Voltage
Soft Start Operation Charging Current
Normal Operation
1.1
–710
1.2
–550
1.4
–390
μA
Bottom-Skip Operation Threshold Voltage 1
Bottom-Skip Operation Threshold Voltage 2
Overcurrent Detection Threshold Voltage
OCP/BD Terminal Outflow Current
Quasi-Resonant Operation Threshold Voltage 1
Quasi-Resonant Operation Threshold Voltage 2
FB Terminal Threshold Voltage
VOCPBD(BS1)
VOCPBD(BS2)
VOCPBD(LIM)
IOCPBD
–0.720 –0.665 –0.605
–0.485 –0.435 –0.385
–0.995 –0.940 –0.895
V
V
VOCP/BD falling
VOCP/BD = –0.95 V
VOCP/BD falling
VOCP/BD rising
VFB rising
V
–250
0.28
0.67
1.32
600
–100
0.40
0.80
1.45
1000
–40
0.52
0.93
1.58
1400
μA
V
VOCPBD(TH1)
VOCPBD(TH2)
VFB(OFF)
V
V
VFB = 1.6 V
FB Terminal Inflow Current (Normal Operation)
Standby Operation
IFB(ON)
μA
VCC = 0→15 V, VFB = 1.6 V
VCC(SK) = VCC(S) – VCC(OFF)
VCC = 10.2 V, VFB = 1.6 V
VCC = 10.2 V, VFB = 1.6 V
VCC = 15 V, VFB rising
Standby Operation Start Voltage
Standby Operation Start Voltage Interval
Standby Non-Operation Circuit Current
FB Terminal Inflow Current, Standby Operation
FB Terminal Threshold Voltage, Standby Operation
Minimum On Time
VCC(S)
VCC(SK)
ICC(S)
10.3
1.10
–
11.2
1.35
20
12.1
1.65
56
V
V
μA
μA
V
IFB(S)
–
4
14
VFB(S)
tON(MIN)
0.55
0.5
1.10
0.95
1.50
1.40
μs
Protection Operation
Maximum On Time
tON(MAX)
VSSOLP(OLP)
ISSOLP(OLP)
VCC(OVP)
ICC(H)
27.5
4.0
–16
25.5
–
32.5
4.9
39.0
5.8
μs
V
Overload Protection Operation Threshold Voltage
Overload Protection Operation Charging Current
Overvoltage Protection Operation Voltage
Latch Circuit Holding Current2
VSS/OLP = 2.5 V
–11
27.7
45
–6
μA
V
VCC = 0→30 V
29.9
140
8.5
VCC(OFF)– 0.3 V
μA
V
Latch Circuit Release Voltage2
VCC(La.OFF)
6.0
7.2
VCC = 30→6 V, OVP operating
ELECTRICAL CHARACTERISTICS for MOSFET, valid at TA = 25°C, unless otherwise specified
Drain-to-Source Breakdown Voltage
Drain Leakage Current
On Resistance
VDSS
IDSS
RDS(on)
tf
IDSS = 300 μA
VDSSS = 800 V
IDS = 2.5 A
800
–
–
–
–
–
–
–
V
μA
300
1.0
–
Ω
Switching Time
–
450
0.99
ns
Thermal Resistance
Rθch-F
Channel to internal frame
–
°C/W
1Current polarity with respect to the IC: positive current indicates current sink at the terminal named, negative current indicates source at the
terminal named.
2The latch circuit means a circuit operated OVP and OLP.
6
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
Package Outline Drawing, TO-3P
15.6 ±0.2
5.5±0.2
6
Gate Burr
3.45±0.2
Branding
Area
XXXXXXXX
XXXXXXXX
XXXXXXXX
3.35±0.1
+0.2
–0.1
0.55
View A
4.5 ±0.7
4.5 ±0.7
2X 2.54±0.1
4X 1.27±0.1
Terminal dimension at lead tip
Terminal dimension at lead tip
+0.2
–0.1
1
4
6
+0.2
–0.1
1.33
5X 0.75
3
5
7
+0.2
–0.1
+0.2
–0.1
5X 0.65
2X 0.83
+0.2
–0.1
1.89
2
Enlargement View A
0.7
0.7
0.7
0.7
Front View (Plan View)
Side View
Gate burr: 0.3 mm (max.)
Terminal core material: Cu
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 1902
Drawing for reference only
Branding codes (exact appearance at manufacturer discretion):
1st line, type: STR
2nd line, subtype: X6768
3rd line, lot: YM DD N
Where: Y is the last digit of the year of manufacture
Approximate weight: 6 g
Dimensions in millimeters
M is the month (1 to 9, O, N, D)
DD is the 2-digit date
N is the suffix of the subtype
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
7
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
Because reliability can be affected adversely by improper
storage environments and handling methods, please observe
the following cautions.
•
Please select suitable screws for the product shape. Do not
use a flat-head machine screw because of the stress to the
products. Self-tapping screws are not recommended. When
using self-tapping screws, the screw may enter the hole
diagonally, not vertically, depending on the conditions of hole
before threading or the work situation. That may stress the
products and may cause failures.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative
humidity (around 40% to 75%); avoid storage locations
that experience extreme changes in temperature or
humidity.
•
•
Recommended screw torque: 0.588 to 0.785 N●m (6 to 8
kgf●cm).
•
•
Avoid locations where dust or harmful gases are present
and avoid direct sunlight.
Reinspect for rust on leads and solderability of the
products that have been stored for a long time.
For tightening screws, if a tightening tool (such as a driver)
hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of
the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact.
In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an
electric driver is recommended.
When the package is tightened at two or more places, first
pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque
control is mandatory.
Cautions for Testing and Handling
When tests are carried out during inspection testing and
other standard test periods, protect the products from
power surges from the testing device, shorts between
the product pins, and wrong connections. Ensure all test
parameters are within the ratings specified by Sanken for
the products.
Remarks About Using Silicone Grease with a Heatsink
•
When silicone grease is used in mounting the products on
a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce
excess stress.
Soldering
•
When soldering the products, please be sure to minimize
the working time, within the following limits:
260±5°C 10±1 s (Flow, 2 times)
•
Volatile-type silicone greases may crack after long periods
of time, resulting in reduced heat radiation effect. Silicone
greases with low consistency (hard grease) may cause
cracks in the mold resin when screwing the products to a
heatsink.
Our recommended silicone greases for heat radiation
purposes, which will not cause any adverse effect on the
product life, are indicated below:
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
Soldering should be at a distance of at least 2.0 mm from
the body of the products.
•
Electrostatic Discharge
•
When handling the products, the operator must be
grounded. Grounded wrist straps worn should have at
least 1 Mꢀ of resistance from the operator to ground to
prevent shock hazard, and it should be placed near the
operator.
Type
G746
Suppliers
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer,
the equipment should be grounded.
When soldering the products, the head of soldering irons
or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the
products.
The products should always be stored and transported in
Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
Shin-Etsu Chemical Co., Ltd.
Momentive Performance Materials Inc.
Dow Corning Toray Co., Ltd.
YG6260
SC102
•
•
Cautions for Mounting to a Heatsink
•
When the flatness around the screw hole is insufficient, such
as when mounting the products to a heatsink that has an
extruded (burred) screw hole, the products can be damaged,
even with a lower than recommended screw torque. For
mounting the products, the mounting surface flatness should
be 0.05 mm or less.
•
8
STR-X6768N
SANKEN ELECTRIC CO., LTD.
Off-Line Quasi-Resonant Switching Regulators
STR-X6768N
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-
ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-
ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-
ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-
tion network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
9
STR-X6768N
SANKEN ELECTRIC CO., LTD.
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