MLPC15N6-3R3M-RC [ALLIED]
Multilayer Power Chip Inductor;型号: | MLPC15N6-3R3M-RC |
厂家: | ALLIED COMPONENTS INTERNATIONAL |
描述: | Multilayer Power Chip Inductor |
文件: | 总1页 (文件大小:8944K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
Multilayer Power Chip Inductor MLPC15N6
Inches
Dimensions:
(mm)
FERRITE
TERMINAL
ELECTRODE
0.024±0.008
(0.6±0.2)
0.0394 MAX
(1.0 MAX)
0.099±0.008
(2.5±0.2)
0.079±0.008
(2.0±0.20)
Features
Test
Freq.
MHz, 200mV
Isat
(mA)
Max
Irms
(mA)
Max
Allied
Part
Number
Inductance Tolerance
DCR
(Ω ±25%)
(µH)
(%)
• 1008 EIA Size
• High Current Capacity
• Low DCR
20
20
20
20
20
1800
1600
1300
1200
1100
MLPC15N6-R47M-RC
MLPC15N6-1R0M-RC
MLPC15N6-2R2M-RC
MLPC15N6-3R3M-RC
MLPC15N6-4R7M-RC
0.04
0.055
0.08
0.10
0.11
1500
900
500
400
300
0.47
1.0
2.2
3.3
4.7
3
3
3
3
3
• Multilayer Ferrite Construction
• Excellent Solderability Characteristics
All specifications subject to change without notice.
Electrical
Inductance Range: 0.47µH ~ 4.7µH
Tolerance: 20% across entire range
Also available in 30%
Test Frequency: 3MHZ, 200mV
Operating Temp: -55ºC to +125ºC
Isat Current: Based on a 30% Inductance
drop from its original value without current.
Recommended Pad Layout
Irms Current: Based on a 40ºC
0.122±0.016
(2.7~3.5)
temperature rise from 25ºC ambient without
current.
Resistance to Soldering Heat
Pre-heating: 150ºC, 1min
0.063±0.012
(1.3~1.9)
0.09±0.012
(2.0~2.6)
Solder Composition: Sn/Ag3.0/Cu0.5
Solder Temperature: 260 ± 5ºC
Immersion Time: 10 ± 1sec
No Damage with more than 75% coverage
Inductance within 20 of initial value.
(1.25±0.20)
Test Equipment
(L): Agilent HP4287A + 16197A, 3MHz, 200mV
DCR: HP 4338B, or equivalent
Physical
Packaging: 3000 pieces per 7 inch reel.
Marking: None
www.alliedcomponents.com
949-356-1780
ALLIED COMPONENTS INTERNATIONAL
06/07/2016
15
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