AS7C33128PFD32B-200TQIN [ALSC]
3.3V 128K X 32/36 pipeline burst synchronous SRAM; 3.3V 128K X 32/36管道爆裂的同步SRAM
| 型号： | AS7C33128PFD32B-200TQIN |
| 厂家： | 
ALLIANCE SEMICONDUCTOR CORPORATION |
| 描述： | 3.3V 128K X 32/36 pipeline burst synchronous SRAM |
| 文件： | 总19页 (文件大小：553K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
February 2005
AS7C33128PFD32B
AS7C33128PFD36B
®
3.3V 128K X 32/36 pipeline burst synchronous SRAM
Features
• Organization: 131,072 words × 32 or 36 bits
• Fast clock speeds to 200 MHz
• Fast clock to data access: 3.0/3.5/4.0 ns
• Fast OE access time: 3.0/3.5/4.0 ns
• Fully synchronous register-to-register operation
• Double-cycle deselect
• Individual byte write and global write
• Multiple chip enables for easy expansion
• 3.3V core power supply
• 2.5V or 3.3V I/O operation with separate V
• Linear or interleaved burst control
• Snooze mode for reduced power-standby
• Common data inputs and data outputs
DDQ
• Asynchronous output enable control
• Available in 100-pin TQFP package
Logic block diagram
LBO
Burst logic
CLK
ADV
ADSC
ADSP
CLK
CE
CLR
128K × 32/36
Memory
array
17
15
17
17
D
CE
CLK
Q
A[16:0]
Address
register
36/32
36/32
GWE
BWE
d
D
Q
Q
Q
Q
DQ
d
Byte write
BW
registers
CLK
D
DQ
c
BW
c
Byte write
registers
CLK
D
DQ
b
BW
b
Byte write
registers
CLK
D
DQ
a
4
BW
a
Byte write
registers
CLK
D
CE0
CE1
CE2
OE
Output
registers
CLK
Q
Q
Input
registers
CLK
Enable
register
CE
CLK
D
Enable
delay
register
CLK
Power
down
ZZ
36/32
DQ [a:d]
OE
Selection guide
–200
–166
–133
7.5
133
4
Units
Minimum cycle time
5
6
ns
MHz
ns
Maximum clock frequency
Maximum clock access time
Maximum operating current
Maximum standby current
200
3.0
375
130
30
166
3.5
350
100
30
325
90
mA
mA
mA
Maximum CMOS standby current (DC)
30
1/31/05; v.1.1
Alliance Semiconductor
P. 1 of 19
Copyright © Alliance Semiconductor. All rights reserved.
AS7C33128PFD32B
AS7C33128PFD36B
®
4 Mb Synchronous SRAM products list1,2
Org
Part Number
Mode
PL-SCD
PL-SCD
PL-SCD
PL-DCD
PL-DCD
PL-DCD
FT
Speed
256KX18
128KX32
128KX36
256KX18
128KX32
128KX36
256KX18
128KX32
128KX36
256KX18
128KX32
128KX36
256KX18
128KX32
128KX36
AS7C33256PFS18B
AS7C33128PFS32B
AS7C33128PFS36B
AS7C33256PFD18B
AS7C33128PFD32B
AS7C33128PFD36B
AS7C33256FT18B
AS7C33128FT32B
AS7C33128FT36B
AS7C33256NTD18B
AS7C33128NTD32B
AS7C33128NTD36B
AS7C33256NTF18B
AS7C33128NTF32B
AS7C33128NTF36B
200/166/133 MHz
200/166/133 MHz
200/166/133 MHz
200/166/133 MHz
200/166/133 MHz
200/166/133 MHz
6.5/7.5/8.0/10 ns
6.5/7.5/8.0/10 ns
6.5/7.5/8.0/10 ns
200/166/133 MHz
200/166/133 MHz
200/166/133 MHz
6.5/7.5/8.0/10 ns
6.5/7.5/8.0/10 ns
6.5/7.5/8.0/10 ns
FT
FT
NTD-PL
NTD-PL
NTD-PL
NTD-FT
NTD-FT
NTD-FT
1 Core Power Supply: VDD = 3.3V + 0.165V
2 I/O Supply Voltage: VDDQ = 3.3V + 0.165V for 3.3V I/O
VDDQ = 2.5V + 0.125V for 2.5V I/O
PL-SCD
PL-DCD
FT
:
:
:
Pipelined Burst Synchronous SRAM - Single Cycle Deselect
Pipelined Burst Synchronous SRAM - Double Cycle Deselect
Flow-through Burst Synchronous SRAM
1
TM
NTD -PL
:
:
Pipelined Burst Synchronous SRAM with NTD
TM
NTD-FT
Flow-through Burst Synchronous SRAM with NTD
1NTD: No Turnaround Delay. NTDTM is a trademark of Alliance Semiconductor Corporation. All trademarks mentioned in this document are the property of
their respective owners.
1/31/05; v.1.1
Alliance Semiconductor
P. 2 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Pin arrangement
DQP /NC
DQP /NC
1
80
b
c
DQ
DQ
DQ
V
2
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
b7
b6
DDQ
SSQ
c0
c1
DDQ
SSQ
DQ
3
V
4
V
V
5
DQ
DQ
DQ
DQ
V
DQ
6
b5
b4
b3
b2
c2
c3
c4
c5
DQ
7
DQ
8
DQ
9
V
V
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
SSQ
SSQ
DDQ
c6
c7
NC
DD
NC
SS
d0
d1
DDQ
SSQ
d2
V
DDQ
DQ
DQ
V
DQ
DQ
b1
b0
SS
NC
V
TQFP 14 × 20 mm
VDD
ZZ
V
DQ
DQ
a7
a6
DQ
DQ
V
V
DDQ
SSQ
V
V
DQ
DQ
a5
a4
a3
a2
DQ
DQ
d3
d4
d5
SSQ
DQ
DQ
DQ
DQ
V
V
V
SSQ
DDQ
V
DDQ
DQ
DQ
DQ
DQ
a1
a0
a
d6
d7
DQP /NC
DQP /NC
d
Note: Pins 1,30,51,80 are NC for ×32
1/31/05; v.1.1
Alliance Semiconductor
P. 3 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Functional description
The AS7C33128PFD32B and AS7C33128PFD36B are high-performance CMOS 4-Mbit synchronous Static Random Access
Memory (SRAM) devices organized as 131,072 words × 32 or 36 bits, and incorporate a two-stage register-register pipeline
for highest frequency on any given technology.
®
Timing for these devices is compatible with existing Pentium synchronous cache specifications. This architecture is suited
™1
for ASIC, DSP and PowerPC -based systems in computing, datacom, instrumentation, and telecommunications systems.
Fast cycle times of 5.0/6.0/7.5 ns with clock access times (t ) of 3.0/3.5/4.0 ns enable 200, 166 and 133 MHz bus
CD
frequencies. Three chip enable (CE) inputs permit easy memory expansion. Burst operation is initiated in one of two ways: the
controller address strobe (ADSC), or the processor address strobe (ADSP). The burst advance pin (ADV) allows subsequent
internally generated burst addresses.
Read cycles are initiated with ADSP (regardless of WE and ADSC) using the new external address clocked into the on-chip
address register when ADSP is sampled Low, the chip enables are sampled active, and the output buffer is enabled with OE. In
a read operation the data accessed by the current address, registered in the address registers by the positive edge of CLK, are
carried to the data-out registers and driven on the output pins on the next positive edge of CLK. ADV is ignored on the clock
edge that samples ADSP asserted, but is sampled on all subsequent clock edges. Address is incremented internally for the next
access of the burst when ADV is sampled Low, and both address strobes are High. Burst mode is selectable with the LBO
®
input. With LBO unconnected or driven High, burst operations use a Pentium count sequence. With LBO driven LOW, the
™
device uses a linear count sequence suitable for PowerPC and many other applications.
Write cycles are performed by disabling the output buffers with OE and asserting a write command. A global write enable
GWE writes all 32/36 bits regardless of the state of individual BW[a:d] inputs. Alternately, when GWE is High, one or more
bytes may be written by asserting BWE and the appropriate individual byte BWn signal(s).
BWn is ignored on the clock edge that samples ADSP Low, but is sampled on all subsequent clock edges. Output buffers are
disabled when BWn is sampled LOW (regardless of OE). Data is clocked into the data input register when BWn is sampled
Low. Address is incremented internally to the next burst address if BWn and ADV are sampled Low. This device operates in
double-cycle deselect feature during read cycles.
Read or write cycles may also be initiated with ADSC instead of ADSP. The differences between cycles initiated with ADSC
and ADSP are as follows:
• ADSP must be sampled HIGH when ADSC is sampled LOW to initiate a cycle with ADSC.
• WE signals are sampled on the clock edge that samples ADSC LOW (and ADSP High).
• Master chip enable CE0 blocks ADSP, but not ADSC.
AS7C33128PFD32B and AS7C33128PFD36B family operates from a core 3.3V power supply. I/Os use a separate power
supply that can operate at 2.5V or 3.3V. These devices are available in a 100-pin 14 × 20 mm TQFP package
TQFP capacitance
Parameter
Symbol
Test conditions
VIN = 0V
Min
Max
Unit
pF
*
Input capacitance
CIN
-
-
5
7
*
I/O capacitance
CI/O
VOUT = 0V
pF
* Guaranteed not tested
TQFP thermal resistance
Description
Conditions
Symbol
Typical
40
Units
°C/W
°C/W
1–layer
4–layer
θJA
θJA
Thermal resistance
(junction to ambient)1
Test conditions follow standard test methods and
procedures for measuring thermal impedance,
per EIA/JESD51
22
Thermal resistance
θJC
8
°C/W
(junction to top of case)1
1 This parameter is sampled
1 PowerPC™ is a trademark International Business Machines Corporation.
1/31/05; v.1.1
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P. 4 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Signal descriptions
Signal
CLK
A,A0,A1
I/O Properties
Description
I
I
CLOCK Clock. All inputs except OE, ZZ, LBO are synchronous to this clock.
SYNC
SYNC
Address. Sampled when all chip enables are active and ADSC or ADSP are asserted.
Data. Driven as output when the chip is enabled and OE is active.
DQ[a,b,c,d] I/O
Master chip enable. Sampled on clock edges when ADSP or ADSC is active. When CE0
is inactive, ADSP is blocked. Refer to the Synchronous Truth Table for more information.
CE0
I
I
I
SYNC
SYNC
SYNC
Synchronous chip enables. Active HIGH and active Low, respectively. Sampled on clock
edges when ADSC is active or when CE0 and ADSP are active.
CE1, CE2
ADSP
Address strobe processor. Asserted LOW to load a new bus address or to enter standby
mode.
ADSC
ADV
I
I
SYNC
SYNC
Address strobe controller. Asserted LOW to load a new address or to enter standby mode.
Advance. Asserted LOW to continue burst read/write.
Global write enable. Asserted LOW to write all 32/36 bits. When High, BWE and
BW[a:d] control write enable.
GWE
BWE
I
I
SYNC
SYNC
Byte write enable. Asserted LOW with GWE = HIGH to enable effect of BW[a:d] inputs.
Write enables. Used to control write of individual bytes when GWE = HIGH and BWE
Low. If any of BW[a:d] is active with GWE = HIGH and BWE = LOW the cycle is a
write cycle. If all BW[a:d] are inactive the cycle is a read cycle.
=
BW[a,b,c,d]
OE
I
I
I
SYNC
ASYNC
STATIC
Asynchronous output enable. I/O pins are driven when OE is active and the chip is in read
mode.
Selects Burst mode. When tied to V or left floating, device follows Interleaved Burst
DD
LBO
order. When driven Low, device follows linear Burst order. This signal is internally
pulled High.
ZZ
I
-
ASYNC Snooze. Places device in low power mode; data is retained. Connect to GND if unused.
No connect
NC
-
Snooze Mode
SNOOZE MODE is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of
SNOOZE MODE is dictated by the length of time the ZZ is in a High state.
The ZZ pin is an asynchronous, active high input that causes the device to enter SNOOZE MODE.
When the ZZ pin becomes a logic High, ISB2 is guaranteed after the time tZZI is met. After entering SNOOZE MODE, all inputs except ZZ is
disabled and all outputs go to High-Z. Any operation pending when entering SNOOZE MODE is not guaranteed to successfully complete.
Therefore, SNOOZE MODE (READ or WRITE) must not be initiated until valid pending operations are completed. Similarly, when exiting
SNOOZE MODE during tPUS, only a DESELECT or READ cycle should be given while the SRAM is transitioning out of SNOOZE
MODE.
1/31/05; v.1.1
Alliance Semiconductor
P. 5 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Write enable truth table (per byte)
Function
GWE BWE
BWa
X
BWb
X
BWc
BWd
X
L
H
H
H
H
H
X
L
L
L
H
L
X
L
Write All Bytes
L
L
L
Write Byte a
L
H
H
L
H
Write Byte c and d
H
H
L
X
X
X
H
X
Read
H
H
H
Key: X = don’t care, L = low, H = high, n = a, b, c, d; BWE, BWn = internal write signal.
Asynchronous Truth Table
Operation
Snooze mode
ZZ
H
L
OE
X
I/O Status
High-Z
L
Dout
Read
L
H
High-Z
Write
L
X
Din, High-Z
High-Z
Deselected
L
X
Notes:
1. X means “Don’t Care”
2. ZZ pin is pulled down internally
3. For write cycles that follows read cycles, the output buffers must be disabled with OE, otherwise data bus contention will occur.
4. Snooze mode means power down state of which stand-by current does not depend on cycle times
5. Deselected means power down state of which stand-by current depends on cycle times
Burst sequence table
Interleaved burst address (LBO = 1)
A1 A0 A1 A0 A1 A0 A1 A0
Linear burst address (LBO = 0)
A1 A0 A1 A0 A1 A0 A1 A0
1st Address
2nd Address
3rd Address
4th Address
1st Address
2nd Address
3rd Address
4th Address
0 0
0 1
1 0
1 1
0 1
0 0
1 1
1 0
1 0
1 1
0 0
0 1
1 1
1 0
0 1
0 0
0 0
0 1
1 0
1 1
0 1
1 0
1 1
1 0
1 0
1 1
0 0
0 1
1 1
0 0
0 1
1 0
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P. 6 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Synchronous truth table[4]
[2]
CE01
H
L
CE1
X
L
CE2
X
X
X
H
H
L
ADSP ADSC ADV WRITE
OE
X
X
X
X
X
L
Address accessed
NA
CLK
Operation
Deselect
DQ
Hi−Z
Hi−Z
Hi−Z
Hi−Z
Hi−Z
Q
X
L
L
X
L
X
X
X
X
X
X
X
X
X
L
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
L
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
NA
Deselect
L
L
H
L
NA
Deselect
L
X
X
H
H
H
H
X
X
X
X
X
X
X
X
H
X
X
X
X
X
L
NA
Deselect
L
H
L
NA
Deselect
L
X
X
L
External
External
External
External
Next
Begin read
L
L
L
H
L
Begin read
Hi−Z
Q
L
L
H
H
H
H
H
H
X
X
X
X
H
H
X
H
X
Begin read
L
L
L
H
L
Begin read
Hi−Z
Q
X
X
X
X
H
H
H
H
L
X
X
X
X
X
X
X
X
L
H
H
H
H
H
H
H
H
L
Continue read
Continue read
Suspend read
Suspend read
Continue read
Continue read
Suspend read
Suspend read
Begin write
Continue write
Continue write
Suspend write
Suspend write
L
H
L
Next
Hi−Z
Q
H
H
L
Current
Current
Next
H
L
Hi−Z
Q
L
H
L
Next
Hi−Z
Q
H
H
X
L
Current
Current
External
Next
H
X
X
X
X
X
Hi−Z
3
D
X
H
X
H
X
X
X
X
H
H
H
H
L
D
D
D
D
L
L
Next
H
H
L
Current
Current
L
1 X = don’t care, L = low, H = high
2 For WRITE, L means any one or more byte write enable signals (BWa, BWb, BWc or BWd) and BWE are LOW or GWE is LOW. WRITE = HIGH for all
BWx, BWE, GWE HIGH. See "Write enable truth table (per byte)," on page 6 for more information.
3 For write operation following a READ, OE must be high before the input data set up time and held high throughout the input hold time
4 ZZ pin is always Low.
1/31/05; v.1.1
Alliance Semiconductor
P. 7 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Absolute maximum ratings
Parameter
Power supply voltage relative to GND
Input voltage relative to GND (input pins)
Input voltage relative to GND (I/O pins)
Power dissipation
Symbol
DD, VDDQ
VIN
Min
–0.5
–0.5
–0.5
–
Max
+4.6
Unit
V
V
VDD + 0.5
VDDQ + 0.5
1.8
V
VIN
V
Pd
W
Short circuit output current
IOUT
Tstg
–
20
mA
oC
oC
Storage temperature
–65
–65
+150
Temperature under bias
Tbias
+135
Stresses greater than those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to abso-
lute maximum rating conditions may affect reliability.
Recommended operating conditions at 3.3V I/O
Parameter
Supply voltage for inputs
Supply voltage for I/O
Ground supply
Symbol
VDD
Min
3.135
3.135
0
Nominal
Max
3.465
3.465
0
Unit
V
3.3
3.3
0
VDDQ
Vss
V
V
Recommended operating conditions at 2.5V I/O
Parameter
Supply voltage for inputs
Supply voltage for I/O
Ground supply
Symbol
VDD
Min
3.135
2.375
0
Nominal
Max
3.465
2.625
0
Unit
V
3.3
2.5
0
VDDQ
Vss
V
V
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P. 8 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
DC electrical characteristics for 3.3V I/O operation
Parameter
Input leakage current†
Output leakage current
Sym
Conditions
VDD = Max, 0V < VIN < VDD
OE ≥ VIH, VDD = Max, 0V < VOUT < VDDQ
Address and control pins
I/O pins
Min
-2
Max
Unit
µA
|ILI|
2
2
|ILO
|
-2
µA
2*
VDD+0.3
Input high (logic 1) voltage
Input low (logic 0) voltage
VIH
VIL
V
V
2*
V
DDQ+0.3
Address and control pins
I/O pins
-0.3**
-0.5**
2.4
0.8
0.8
–
Output high voltage
Output low voltage
VOH
VOL
IOH = –4 mA, VDDQ = 3.135V
IOL = 8 mA, VDDQ = 3.465V
V
V
–
0.4
DC electrical characteristics for 2.5V I/O operation
Parameter
Input leakage current†
Output leakage current
Sym
Conditions
Min
-2
Max
Unit
µA
µA
V
|ILI|
VDD = Max, 0V < VIN < VDD
2
2
|ILO
|
OE ≥ VIH, VDD = Max, 0V < VOUT < VDDQ
Address and control pins
I/O pins
-2
1.7*
1.7*
-0.3**
-0.3**
1.7
VDD+0.3
Input high (logic 1) voltage
Input low (logic 0) voltage
VIH
VIL
V
DDQ+0.3
V
Address and control pins
I/O pins
0.7
0.7
–
V
V
Output high voltage
Output low voltage
VOH
VOL
IOH = –4 mA, VDDQ = 2.375V
IOL = 8 mA, VDDQ = 2.625V
V
–
0.7
V
† LBO and ZZ pins have an internal pull-up or pull-down, and input leakage = ±10 µA.
*
V
max < VDD +1.5V for pulse width less than 0.2 X t
CYC
IH
**
V
min = -1.5 for pulse width less than 0.2 X t
CYC
IL
IDD operating conditions and maximum limits
Parameter
Sym
Conditions
-200
-166
-133
Unit
CE0 < VIL, CE1 > VIH, CE2 < VIL, f = fMax
,
Operating power supply current1
ICC
375
350
325
90
mA
IOUT = 0 mA, ZZ < VIL
All VIN ≤ 0.2V or >
V
– 0.2V, Deselected,
DD
ISB
130
100
f = fMax, ZZ < VIL
Deselected, f = 0, ZZ < 0.2V,
all VIN ≤ 0.2V or ≥ VDD – 0.2V
Standby power supply current
mA
ISB1
ISB2
30
30
30
30
30
30
Deselected, f = f , ZZ
≥
V
– 0.2V,
Max
DD
all VIN ≤ VIL or ≥ VIH
1 I given with no output loading. I increases with faster cycle times and greater output loading.
CC
CC
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Alliance Semiconductor
P. 9 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Timing characteristics over operating range
–200
–166
Max
–133
1
Parameter
Clock frequency
Sym
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes
Min
–
Max
200
–
Min
–
Min
–
Max
133
–
f
166
–
Max
5
Cycle time
t
6
7.5
–
CYC
–
3.0
3.0
–
Clock access time
t
–
3.5
3.5
–
4.0
4.0
–
CD
Output enable LOW to data valid
Clock HIGH to output Low Z
Data output invalid from clock HIGH
Output enable LOW to output Low Z
Output enable HIGH to output High Z
Clock HIGH to output High Z
Output enable HIGH to invalid output
Clock HIGH pulse width
t
–
–
–
OE
0
t
0
0
2,3,4
2
LZC
1.5
0
–
t
1.5
0
–
1.5
0
–
OH
–
t
–
–
2,3,4
2,3,4
2,3,4
LZOE
HZOE
–
3.0
3.0
–
t
–
3.5
3.5
–
–
4.0
4.0
–
–
t
–
–
HZC
0
t
0
0
OHOE
2.0
2.3
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
1.4
1.4
1.4
0.4
0.4
0.4
–
t
2.4
2.4
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
1.5
1.5
1.5
0.5
0.5
0.5
–
2.5
2.5
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
1.5
1.5
1.5
0.5
0.5
0.5
–
5
5
CH
–
Clock LOW pulse width
t
t
t
–
–
CL
AS
DS
–
Address setup to clock HIGH
Data setup to clock HIGH
–
–
6
–
–
–
6
–
Write setup to clock HIGH
Chip select setup to clock HIGH
Address hold from clock HIGH
Data hold from clock HIGH
Write hold from clock HIGH
Chip select hold from clock HIGH
ADV setup to clock HIGH
ADSP setup to clock HIGH
ADSC setup to clock HIGH
ADV hold from clock HIGH
ADSP hold from clock HIGH
ADSC hold from clock HIGH
1 See “Notes” on page 16.
t
–
–
6,7
6,8
6
WS
–
t
–
–
CSS
t
–
–
–
AH
DH
WH
–
t
–
–
6
–
t
–
–
6,7
6,8
6
t
–
–
–
CSH
–
t
–
–
ADVS
–
t
–
–
6
ADSPS
ADSCS
t
–
–
–
6
–
t
–
–
6
ADVH
ADSPH
ADSCH
–
t
–
–
6
t
–
–
–
6
Snooze Mode Electrical Characteristics
Description
Conditions
Symbol
Min
Max
Units
Current during Snooze Mode
ZZ active to input ignored
ZZ > V
I
30
mA
IH
SB2
PDS
PUS
t
t
2
2
cycle
cycle
cycle
ZZ inactive to input sampled
ZZ active to SNOOZE current
ZZ inactive to exit SNOOZE current
t
2
ZZI
t
0
RZZI
1/31/05; v.1.1
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AS7C33128PFD32B
AS7C33128PFD36B
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Key to switching waveforms
Rising input
Falling input
don’t care
Undefined
Timing waveform of read cycle
tCYC
tCL
tCH
CLK
tADSPS
tADSPH
ADSP
tADSCS
tADSCH
ADSC
LOAD NEW ADDRESS
A3
tAH
tAS
A1
A2
Address
tWS
tWH
GWE, BWE
tCSS
tCSH
CE0, CE2
CE1
tADVS
tADVH
ADV
OE
ADV inserts wait states
t
OE
tCD
tHZC
tHZOE
tOH
tLZOE
Q(A2)
Q(A2Ý01)
Q(A2Ý10)
Q(A2Ý11)
Q(A3)
Q(A3Ý01) Q(A3Ý10)
Q(A1)
Dout
Read Suspend Read
Burst
Read
Burst
Read
Suspend
Read
2Ý10
Burst
Read
Read
Q(A3)
Burst
Read
3Ý01
Burst
Read
3Ý10
Burst
Read
3Ý11
) Q(A )
Q(A1)
Read
Q(A2)
DSEL*
Q(A1)
2Ý01
2Ý10
2Ý11
Q(A
) Q(A
) Q(A
) Q(A
)
Q(A
) Q(A
Note: Ý = XOR when LBO = high/no connect; Ý = ADD when LBO = low. BW[a:d] is don’t care.
*Outputs are disabled within two clk cycles after DSEL command
1/31/05; v.1.1
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Timing waveform of write cycle
tCYC
tCL
tCH
CLK
tADSPS
tADSPH
ADSP
tADSCS
tADSCH
ADSC
ADSC LOADS NEW ADDRESS
A3
tAS
tAH
A1
A2
Address
tWS
tWH
BWE
BW[a:d]
tCSS
tCSH
CE0, CE2
CE1
ADV SUSPENDS BURST
tADVH
tADVS
ADV
OE
tDS
tDH
D(A1)
D(A2)
D(A2Ý01)
D(A2Ý01) D(A2Ý10) D(A2Ý11)
D(A3)
D(A3Ý01) D(A3Ý10)
Din
Read
Q(A1)
ADV
Burst
Write
Sus-
pend
Write
D(A1)
Suspend
Write
ADV
Burst
Write
Read
Q(A2)
ADV
Burst
Write
ADV
Burst
Write
Burst
Write
Suspend
Write
Write
3
D(A )
2
D(A )
3Ý01
2Ý01
D(A
)
D(A
)
2Ý01
D(A
)
3Ý10
2Ý10
2Ý11
D(A
)
D(A
)
D(A
)
Note: Ý = XOR when LBO = high/no connect; Ý = ADD when LBO = low.
1/31/05; v.1.1
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AS7C33128PFD36B
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Timing waveform of read/write cycle (ADSP Controlled; ADSC High)
tCYC
tCH
tCL
CLK
tADSPS
tADSPH
ADSP
tAH
tAS
A2
A3
A1
Address
tWH
tWS
GWE
CE0, CE2
CE1
tADVH
tADVS
ADV
OE
tDH
tDS
Din
D(A2)
tOE
tCD
tLZC
tOH
tHZOE
tLZOE
Dout
Q(A1)
Q(A3)
Q(A3Ý01)
Q(A3Ý10)
Q(A3Ý11)
DSEL
Read
Q(A1)
Suspend
Read
Q(A1)
Read
Q(A2)
Suspend
Write
Read
Q(A3)
ADV
Burst
Read
ADV
Burst
Read
ADV
Burst
Read
2
D(A )
3Ý01
3Ý10
3Ý11
Q(A )
Q(A
)
Q(A
)
Note: Ý = XOR when LBO = high/no connect; Ý = ADD when LBO = low.
1/31/05; v.1.1
Alliance Semiconductor
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AS7C33128PFD32B
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Timing waveform of read/write cycle (ADSC controlled, ADSP = HIGH)
tCYC
tCH
tCL
CLK
tADSCS
tADSCH
ADSC
tAS
tAH
A9
A8
A5
A7
A1
A3
A4
A6
A2
ADDRESS
tWS
tWH
GWE
CE0,CE2
CE1
tCSS
tCSH
ADV
OE
tOE
tLZOE
tOH
tHZOE
tLZOE
Q(A2)
Q(A1)
Q(A3)
Q(A8)
Q(A4)
Q(A9)
Dout
Din
tDH
tDS
D(A5)
D(A6)
D(A7)
READ
Q(A9)
WRITE
D(A7)
READ READ READ
Q(A1) Q(A2) Q(A3)
WRITE
D(A6)
READ
Q(A8)
READ
Q(A4)
WRITE
D(A5)
1/31/05; v.1.1
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Timing waveform of power down cycle
tCYC
tCL
tCH
CLK
tADSPS
tADSPS
ADSP
ADSC
A2
A1
ADDRESS
GWE
tWS
tWH
tCSS
tCSH
CE0,CE2
CE1
ADV
OE
tOE
tLZOE
Din
D(A2)
tHZOE
D(A2(Ý01))
tHZC
Dout
Q(A1)
tPUS
tPDS
ZZ Recovery Cycle
Normal Operation Mode
ZZ
ZZ Setup Cycle
tZZI
tRZZI
ISB2
Isupply
Sleep
State
READ
Q(A2)
CON-
TINUE
SUSPEND
WRITE
D(A2)
SUSPEND
READ
Q(A1)
READ
Q(A1)
WRITE
Ý01)
D(A2
1/31/05; v.1.1
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AS7C33128PFD32B
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®
AC test conditions
• Output load: see Figure B, except for tLZC, tLZOE, tHZOE, tHZC, see Figure C.
• Input pulse level: GND to 3V. See Figure A.
Thevenin equivalent:
• Input rise and fall time (measured at 0.3V and 2.7V): 2 ns. See Figure A.
• Input and output timing reference levels: 1.5V.
+3.3V for 3.3V I/O;
/+2.5V for 2.5V I/O
319Ω / 1667Ω
Z0 = 50
Ω
50
Ω
DOUT
VL = 1.5V
for 3.3V I/O;
= VDDQ/2
+3.0V
DOUT
90%
10%
90%
10%
5 pF*
353Ω / 1538Ω
30 pF*
GND
*including scope
and jig capacitance
GND
for 2.5V I/O
Figure A: Input waveform
Figure B: Output load (A)
Figure C: Output load (B)
Notes
1
2
3
4
5
6
For test conditions, see AC Test Conditions, Figures A, B, C.
This parameter measured with output load condition in Figure C.
This parameter is sampled, but not 100% tested.
t
HZOE is less than tLZOE; and tHZC is less than tLZC at any given temperature and voltage.
tCH measured as HIGH above VIH and tCL measured as LOW below VIL.
This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK. All other synchronous inputs must
meet the setup and hold times for all rising edges of CLK when chip is enabled.
7
8
Write refers to GWE
,
BWE
,
BW[a:d]
.
Chip select refers to CE0
,
CE1
,
CE2.
1/31/05; v.1.1
Alliance Semiconductor
P. 16 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Package Dimensions
100-pin quad flat pack (TQFP)
TQFP
Hd
D
Min
Max
A1
A2
b
0.05
0.15
b
e
1.35
1.45
0.22
0.38
c
0.09
0.20
D
13.90
19.90
14.10
20.10
E
He
E
e
0.65 nominal
Hd
He
L
15.85
21.80
0.45
16.15
22.20
0.75
L1
α
1.00 nominal
0°
7°
Dimensions in millimeters
α
c
L1
L
A1 A2
1/31/05; v.1.1
Alliance Semiconductor
P. 17 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
Ordering information
Package Width
–200
AS7C33128PFD32B-200TQC AS7C33128PFD32B-166TQC
AS7C33128PFD32B-200TQI AS7C33128PFD32B-166TQI
AS7C33128PFD36B-200TQC AS7C33128PFD36B-166TQC
AS7C33128PFD36B-200TQI AS7C33128PFD36B-166TQI
–166
–133
TQFP
TQFP
TQFP
TQFP
x32
x32
x36
x36
AS7C33128PFD32B-133TQC
AS7C33128PFD32B-133TQI
AS7C33128PFD36B-133TQC
AS7C33128PFD36B-133TQI
Note
Add suffix ‘N’ to the above part numbers for lead free parts (Ex. AS7C33128PFD32B-166TQCN)
Part numbering guide
AS7C
33
128
PF
D
32/36
B
–XXX
TQ
C/I
X
1
2
3
4
5
6
7
8
9
10
11
1. Alliance Semiconductor SRAM prefix
2. Operating voltage: 33=3.3V
3. Organization: 128=128K
4. Pipeline mode
5. Deselect: D=Double cycle deselect
6. Organization: 32 = x32; 36 = x36
7. Production version: B= Product revision
8. Clock speed (MHz)
9. Package type: TQ=TQFP
10. Operating temperature: C=Commercial (
0°
C to 70
°
C); I=Industrial (-40
°
C to 85
°
C)
11. N=Lead Free Part
1/31/05; v.1.1
Alliance Semiconductor
P. 18 of 19
AS7C33128PFD32B
AS7C33128PFD36B
®
®
Alliance Semiconductor Corporation
2575, Augustine Drive,
Santa Clara, CA 95054
Tel: 408 - 855 - 4900
Copyright © Alliance Semiconductor
All Rights Reserved
Part Number: AS7C33128PFD32B-36B
Document Version: v.1.1
Fax: 408 - 855 - 4999
www.alsc.com
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered
trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make
changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document.
The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at
any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in
this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any
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