ASM3P2185B-08ST [ALSC]

Clock Generator;
ASM3P2185B-08ST
型号: ASM3P2185B-08ST
厂家: ALLIANCE SEMICONDUCTOR CORPORATION    ALLIANCE SEMICONDUCTOR CORPORATION
描述:

Clock Generator

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November 2003  
rev 1.1  
ASM3P2185B  
EMI Reduction IC  
Features  
The ASM3P2185B reduces electromagnetic interference  
(EMI) at the clock source, allowing system wide EMI  
reduction for all the down stream clocks and data  
dependent signals. The ASM3P2185B allows significant  
system cost savings by reducing the number of circuit  
board layers, ferrite beads, shielding, and other passive  
components that are traditionally required to pass EMI  
regulations.  
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FCC approved method of EMI attenuation.  
Provides up to 15dB EMI reduction.  
Generates a 1X low EMI spread spectrum clock of  
the input frequency.  
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Input frequency range: 25MHz to 50 MHz.  
Internal loop filter minimizes external components  
and board space.  
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Down Spread and Center Spread.  
2 spread frequency deviation selections: -1.25%  
and ± 0.8%.  
The ASM3P2185B uses the most efficient and optimized  
modulation profile approved by the FCC and is  
implemented in a proprietary all digital method.  
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Low inherent cycle-to-cycle jitter.  
3.3V operating voltage range.  
TTL or CMOS compatible inputs and outputs.  
Low power CMOS design.  
Supports notebook VGA and other LCD timing  
controller applications.  
The ASM3P2185B modulates the output of a single PLL  
in order to “spread” the bandwidth of a synthesized clock,  
and more importantly, decreases the peak amplitudes of  
its harmonics. This results in significantly lower system  
EMI compared to the typical narrow band signal produced  
by oscillators and most frequency generators. Lowering  
EMI by increasing a signal’s bandwidth is called ‘spread  
spectrum clock generation’.  
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Products are available for industrial temperature  
range.  
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Available in 8-pin SOIC and TSSOP.  
Product Description  
The ASM3P2185B is  
frequency modulator designed specifically for a wide  
range of input clock frequencies from 25MHz to 50MHz.  
The ASM3P2185B can generate an EMI reduced clock  
from an OSC or a system generated clock.  
a versatile spread spectrum  
Applications  
The ASM3P2185B is targeted towards EMI management  
for memory and LVDS interfaces in mobile graphic  
chipsets and high-speed digital applications such as PC  
peripheral devices, consumer electronics, and embedded  
controller systems.  
Block Diagram  
SS%  
VDD  
PLL  
Modulation  
XIN  
Crystal  
Frequenc  
y
Oscillator  
Output  
Phase  
Loop  
Filter  
VCO  
XOUT  
Divider  
Detector  
Feedback  
Divider  
ModOUT  
VSS  
Alliance Semiconductor  
2575, Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855.4999 www.alsc.com  
Notice: The information in this document is subject to change without notice.  
November 2003  
rev 1.1  
ASM3P2185B  
Pin Configuration  
1
2
3
4
8
7
6
5
NC  
XIN  
XOUT  
GND  
NC  
ASM3P2185B  
VDD  
ModOUT  
SS%  
Pin Description  
Pin#  
Pin Name  
Type  
Description  
Crystal connection or external reference frequency input. This pin has dual  
functions. It can be connected to either an external crystal or an external  
reference clock.  
1
XIN  
I
Crystal connection. Input connection for an external crystal. If using an  
2
3
4
XOUT  
GND  
SS%  
I
P
I
external reference, this pin must be left unconnected.  
Ground to entire chip.  
Spread range select. Digital logic input used to select frequency deviation  
(Refer Spread Deviation Table). This pin has an internal pull-up resistor.  
5
6
7
8
ModOUT  
VDD  
NC  
O
P
Spread spectrum low EMI output.  
Power supply for the entire chip (3.3V).  
No Connect.  
NC  
No Connect.  
Spread Deviation Selection Table  
SS% (pin 4)  
Spread Deviation (%)  
0
1
- 1.25  
± 0.8%  
EMI Reduction IC  
2 of 7  
Notice: The information in this document is subject to change without notice.  
November 2003  
rev 1.1  
ASM3P2185B  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-0.5 to + 7.0  
-65 to +125  
0 to 70  
Unit  
V
°C  
°C  
VDD, VIN  
TSTG  
Voltage on any pin with respect to GND  
Storage temperature  
TA  
Operating temperature  
Note: These are stress ratings only and functional operation is not implied. Exposure to absolute maximum  
ratings for extended periods may affect device reliability.  
DC Electrical Characteristics  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
VIL  
Input low voltage  
Input high voltage  
Input low current  
Input high current  
GND – 0.3  
-
0.8  
V
V
VIH  
IIL  
2.0  
-
VDD + 0.3  
-
-
-35  
35  
-
µA  
µA  
mA  
mA  
V
IIH  
-
-
TBD  
TBD  
-
IXOL  
IXOH  
VOL  
VOH  
XOUT Output low current (@ 0.4V, VDD = 3.3V)  
XOUT Output high current (@ 2.5V, VDD = 3.3V)  
Output low voltage (VDD = 3.3V, IOL = 20mA)  
Output high voltage (VDD = 3.3V, IOH = 20mA)  
-
-
-
-
0.4  
-
2.5  
-
V
Dynamic supply current  
Normal mode (3.3V and 10pF loading)  
Static supply current  
ICC  
IDD  
8.46  
12  
17.78  
mA  
mA  
0.6  
Standby mode  
VDD  
tON  
Operating voltage  
2.7  
3.3  
0.18  
50  
3.7  
V
mS  
Power up time (first locked clock cycle after power up)  
Clock out impedance  
-
-
-
-
ZOUT  
EMI Reduction IC  
3 of 7  
Notice: The information in this document is subject to change without notice.  
November 2003  
rev 1.1  
ASM3P2185B  
AC Electrical Characteristics  
Symbol  
Parameter  
Min Typ Max Unit  
XIN  
ModOUT  
tLH*  
Input frequency  
25  
25  
-
-
50  
50  
MHz  
MHz  
ns  
Output frequency  
Output rise time (measured at 0.8V to 2.0V)  
Output fall time (measured at 2.0V to 0.8V)  
Jitter (cycle to cycle)  
1.2 1.32 1.4  
tHL*  
0.8  
-
0.9  
-
1.0  
360  
55  
ns  
tJC  
ps  
TD  
Output duty cycle  
45  
50  
%
tLH and tHL are measured into a capacitive load of 15pF  
EMI Reduction IC  
4 of 7  
Notice: The information in this document is subject to change without notice.  
November 2003  
rev 1.1  
ASM3P2185B  
Package Information  
8-Pin SOIC  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Symbol Dimensions in inches Dimensions in millimeters  
Min  
Max  
0.071  
0.010  
0.069  
0.020  
0.01  
Min  
1.45  
0.10  
1.35  
0.31  
0.10  
4.72  
3.75  
Max  
1.80  
0.25  
1.75  
0.51  
0.25  
5.12  
4.15  
A
A1  
A2  
B
0.057  
0.004  
0.053  
0.012  
0.004  
0.186  
0.148  
C
D
0.202  
0.164  
E
e
0.050 BSC  
1.27 BSC  
H
0.224  
0.012  
0°  
0.248  
0.028  
8°  
5.70  
0.30  
0°  
6.30  
0.70  
8°  
L
EMI Reduction IC  
5 of 7  
Notice: The information in this document is subject to change without notice.  
November 2003  
rev 1.1  
ASM3P2185B  
8-Pin TSSOP  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions in inches  
Dimensions in millimeters  
Symbol  
Min  
Max  
Min  
Max  
1.10  
0.15  
1.05  
0.30  
0.20  
3.10  
4.50  
A
A1  
A2  
B
0.047  
0.002  
0.031  
0.007  
0.004  
0.114  
0.169  
0.006  
0.041  
0.012  
0.008  
0.122  
0.177  
0.05  
0.80  
0.19  
0.09  
2.90  
4.30  
C
D
E
e
0.026 BSC  
0.65 BSC  
H
L
0.244  
0.018  
0°  
0.260  
0.030  
8°  
6.20  
0.45  
0°  
6.60  
0.75  
8°  
θ
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.  
EMI Reduction IC  
6 of 7  
Notice: The information in this document is subject to change without notice.  
November 2003  
rev 1.1  
ASM3P2185B  
Alliance Semiconductor Corporation  
2575, Augustine Drive,  
Santa Clara, CA 95054  
Tel# 408-855-4900  
Copyright © Alliance Semiconductor  
All Rights Reserved  
Preliminary Information  
Part Number: ASM3P2185B  
Document Version: v1.1  
Fax: 408-855-4999  
www.alsc.com  
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003  
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are  
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their  
respective companies. Alliance reserves the right to make changes to this document and its products at any time without  
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this  
data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance).  
All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of  
products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any  
other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical  
components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant  
injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer  
assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.  
EMI Reduction IC  
7 of 7  
Notice: The information in this document is subject to change without notice.  

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