ASM3P5812A-ST [ALSC]

Clock Generator, 40MHz, CMOS, PDSO8, SOIC-8;
ASM3P5812A-ST
型号: ASM3P5812A-ST
厂家: ALLIANCE SEMICONDUCTOR CORPORATION    ALLIANCE SEMICONDUCTOR CORPORATION
描述:

Clock Generator, 40MHz, CMOS, PDSO8, SOIC-8

时钟 光电二极管 外围集成电路 晶体
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中文:  中文翻译
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October 2003  
rev 1.0  
ASM3P5812A  
The ASM3P5812A reduces electromagnetic interference  
(EMI) at the clock source, allowing system wide reduction  
of EMI of down stream clock and data dependent  
signals. The ASM3P5812A allows significant system cost  
savings by reducing the number of circuit board layers  
ferrite beads, shielding and other passive components  
that are traditionally required to pass EMI regulations.  
Features  
FCC approved method of EMI attenuation.  
Generates a 2X low EMI spread spectrum clock of  
the input frequency.  
Input frequency range: 10MHz – 20MHz  
Internal loop filter minimizes external components  
and board space.  
Frequency deviation: -1.5%  
The ASM3P5812A uses the most efficient and optimized  
modulation profile approved by the FCC and is  
implemented in a proprietary all digital method.  
Low inherent cycle-to-cycle jitter.  
3.3V operating voltage.  
TTL or CMOS compatible inputs and outputs.  
Ultra-low power CMOS design.  
The ASM3P5812A modulates the output of a single PLL  
in order to “spread” the bandwidth of a synthesized clock,  
and more importantly, decreases the peak amplitudes of  
its harmonics. This results in significantly lower system  
EMI compared to the typical narrow band signal produced  
by oscillators and most frequency generators. Lowering  
EMI by increasing a signal’s bandwidth is called ‘spread  
spectrum clock generation’.  
o
TBD mA @ 3.3V, 16.6MHz  
Pinout compatible with Cypress CY25811.  
Products are available for industrial temperature  
range.  
Available in 8-pin SOIC and TSSOP.  
Product Description  
The ASM3P5812A is  
a versatile spread spectrum  
frequency modulator designed specifically for input clock  
frequencies in the range of 10MHz – 20MHz. The  
ASM3P5812A can generate an EMI reduced clock from  
crystal, ceramic resonator, or system clock. The  
ASM3P5812A offers a percentage deviation of –1.5%.  
Applications  
The ASM3P5812A is targeted towards EMI management  
for high speed digital applications such as PC peripheral  
devices, consumer electronics and embedded controller  
systems.  
VDD  
Block Diagram  
PLL  
Modulation  
XIN  
Crystal  
Oscillator  
Frequency  
Divider  
Output  
Divider  
Phase  
Detector  
Loop  
Filter  
VCO  
XOUT  
Feedback  
Divider  
MODOUT  
VSS  
Alliance Semiconductor  
2575, Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855.4999 www.alsc.com  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev 1.0  
ASM3P5812A  
Pin Configuration  
1
2
3
4
XOUT  
VDD  
NC  
8
7
6
5
XIN  
VSS  
NC  
ASM3P5812B  
ModOUT  
NC  
Pin Description  
Pin#  
Pin Name  
Type  
Description  
Crystal connection or external reference frequency input. This pin has dual  
functions. It can be connected to either an external crystal or an external  
reference clock.  
1
XIN  
I
2
3
4
5
6
7
8
VSS  
NC  
P
Ground to entire chip.  
No Connect.  
NC  
No Connect.  
MODOUT  
NC  
O
Spread spectrum low EMI output.  
No Connect.  
VDD  
P
I
Power supply for the entire chip (3.3V).  
Crystal connection. If using an external reference clock, this pin must be left  
unconnected.  
XOUT  
Low Power EMI Reduction IC  
2 of 7  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev 1.0  
ASM3P5812A  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-0.5 to + 7.0  
-65 to +125  
0 to 70  
Unit  
V
VDD, VIN  
TSTG  
TA  
Voltage on any pin with respect to GND  
Storage temperature  
°C  
°C  
Operating temperature  
Note: These are stress ratings only and functional operation is not implied. Exposure to absolute maximum  
ratings for extended periods may affect device reliability.  
DC Electrical Characteristics  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
VIL  
Input low voltage  
Input high voltage  
Input low current  
Input high current  
GND – 0.3  
TBD  
-
TBD  
V
V
VIH  
IIL  
-
VDD + 0.3  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
3.3  
µA  
µA  
mA  
mA  
V
IIH  
IXOL  
IXOH  
VOL  
VOH  
ICC  
XOUT Output Low Current (@0.4V, VDD=3.3V)  
XOUT Output High Current (@ 2.5V, VDD=3.3V)  
Output low voltage (VDD = 3.3V, IOL = 4mA)  
Output high voltage (VDD = 3.3V, IOH = 4mA)  
V
Dynamic supply current normal mode (3.3V and 10pF  
loading)  
mA  
µA  
V
IDD  
Static supply current standby mode  
Operating voltage  
VDD  
tON  
TBD  
TBD  
Power up time (first locked clock cycle after power up)  
Clock out impedance  
-
-
TBD  
TBD  
-
-
mS  
ZOUT  
Low Power EMI Reduction IC  
3 of 7  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev 1.0  
ASM3P5812A  
AC Electrical Characteristics  
Symbol  
Parameter  
Min  
Typ Max Unit  
XIN  
Input frequency  
10  
20  
16.6  
33.2  
TBD  
TBD  
-
20  
40  
MHz  
MHz  
ns  
MODOUT  
Output frequency  
tLH*  
tHL*  
tJC  
Output rise time (measured at 0.8V to 2.0V)  
Output fall time (measured at 2.0V to 0.8V)  
Jitter (cycle to cycle)  
ns  
-
-
TBD  
-
ps  
tD  
Output duty cycle  
TBD  
%
tLH and tHL are measured into a capacitive load of 15pF  
Low Power EMI Reduction IC  
4 of 7  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev 1.0  
ASM3P5812A  
Package Information  
8-Pin SOIC  
H
E
D
A2  
A
C
θ
e
A1  
D
L
B
Symbol Dimensions in inches Dimensions in millimeters  
Min  
Max  
0.071  
0.010  
0.069  
0.020  
0.01  
Min  
1.45  
0.10  
1.35  
0.31  
0.10  
4.72  
3.75  
Max  
1.80  
0.25  
1.75  
0.51  
0.25  
5.12  
4.15  
A
A1  
A2  
B
0.057  
0.004  
0.053  
0.012  
0.004  
0.186  
0.148  
C
D
E
0.202  
0.164  
e
0.050 BSC  
1.27 BSC  
H
L
0.224  
0.012  
0°  
0.248  
0.028  
8°  
5.70  
0.30  
0°  
6.30  
0.70  
8°  
θ
Low Power EMI Reduction IC  
5 of 7  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev 1.0  
ASM3P5812A  
8-Pin TSSOP  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
in millimeters  
Dimensions  
in inches  
Symbol  
Min  
Max  
Min  
Max  
1.10  
0.15  
1.05  
0.30  
0.20  
3.10  
4.50  
A
A1  
A2  
B
0.047  
0.002  
0.031  
0.007  
0.004  
0.114  
0.169  
0.006  
0.041  
0.012  
0.008  
0.122  
0.177  
0.05  
0.80  
0.19  
0.09  
2.90  
4.30  
C
D
E
e
0.026 BSC  
0.65 BSC  
H
L
0.244  
0.018  
0°  
0.260  
0.030  
8°  
6.20  
0.45  
0°  
6.60  
0.75  
8°  
θ
Low Power EMI Reduction IC  
6 of 7  
Notice: The information in this document is subject to change without notice.  
October 2003  
rev 1.0  
ASM3P5812A  
Alliance Semiconductor Corporation  
2595, Augustine Drive,  
Santa Clara, CA 95054  
Tel# 408-855-4900  
Copyright © Alliance Semiconductor  
All Rights Reserved  
Preliminary Information  
Part Number: ASM3P5812A  
Document Version: v1.0  
Fax: 408-855-4999  
www.alsc.com  
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are  
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their  
respective companies. Alliance reserves the right to make changes to this document and its products at any time without  
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this  
data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance).  
All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of  
products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any  
other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical  
components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant  
injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer  
assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.  
Low Power EMI Reduction IC  
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Notice: The information in this document is subject to change without notice.  

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