EP4SE820F43I4N [ALTERA]
Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1760, FBGA-1760;
| 型号： | EP4SE820F43I4N |
| 厂家： | 
ALTERA CORPORATION |
| 描述： | Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1760, FBGA-1760 时钟 栅 可编程逻辑 |
| 文件： | 总22页 (文件大小：496K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1. Overview for the Stratix IV Device
Family
January 2016
SIV51001-3.5
SIV51001-3.5
Altera® Stratix® IV FPGAs deliver a breakthrough level of system bandwidth and
power efficiency for high-end applications, allowing you to innovate without
compromise. Stratix IV FPGAs are based on the Taiwan Semiconductor
Manufacturing Company (TSMC) 40-nm process technology and surpass all other
high-end FPGAs, with the highest logic density, most transceivers, and lowest power
requirements.
The Stratix IV device family contains three optimized variants to meet different
application requirements:
■
Stratix IV E (Enhanced) FPGAs—up to 813,050 logic elements (LEs), 33,294 kilobits
(Kb) RAM, and 1,288 18 x 18 bit multipliers
■
Stratix IV GX transceiver FPGAs—up to 531,200 LEs, 27,376 Kb RAM, 1,288
18 x 18-bit multipliers, and 48 full-duplex clock data recovery (CDR)-based
transceivers at up to 8.5 Gbps
■
Stratix IV GT—up to 531,200 LEs, 27,376 Kb RAM, 1,288 18 x 18-bit multipliers,
and 48 full-duplex CDR-based transceivers at up to 11.3 Gbps
The complete Altera high-end solution includes the lowest risk, lowest total cost path
to volume using HardCopy® IV ASICs for all the family variants, a comprehensive
portfolio of application solutions customized for end-markets, and the industry
leading Quartus® II software to increase productivity and performance.
f
f
For information about upcoming Stratix IV device features, refer to the Upcoming
Stratix IV Device Features document.
For information about changes to the currently published Stratix IV Device Handbook,
refer to the Addendum to the Stratix IV Device Handbook chapter.
This chapter contains the following sections:
■
■
■
■
“Feature Summary” on page 1–2
“Architecture Features” on page 1–6
“Integrated Software Platform” on page 1–19
“Ordering Information” on page 1–19
© 2016 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos
are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as
trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance of its
semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and
services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service
described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying
on any published information and before placing orders for products or services.
ISO
9001:2008
Registered
Stratix IV Device Handbook
Volume 1
January 2016
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1–2
Chapter 1: Overview for the Stratix IV Device Family
Feature Summary
Feature Summary
The following list summarizes the Stratix IV device family features:
■
Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devices
supporting data rates up to 8.5 Gbps and 11.3 Gbps, respectively
■
Dedicated circuitry to support physical layer functionality for popular serial
protocols, such as PCI Express (PCIe) (PIPE) Gen1 and Gen2, Gbps Ethernet (GbE),
Serial RapidIO, SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI, Fibre
Channel, SFI-5, and Interlaken
■
Complete PCIe protocol solution with embedded PCIe hard IP blocks that
implement PHY-MAC layer, Data Link layer, and Transaction layer functionality
f For more information, refer to the IP Compiler for PCI Express User Guide.
■
■
Programmable transmitter pre-emphasis and receiver equalization circuitry to
compensate for frequency-dependent losses in the physical medium
Typical physical medium attachment (PMA) power consumption of 100 mW at
3.125 Gbps and 135 mW at 6.375 Gbps per channel
■
■
72,600 to 813,050 equivalent LEs per device
7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM block
sizes to implement true dual-port memory and FIFO buffers
■
■
■
■
■
High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit,
12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers at up to 600 MHz
Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 periphery
clocks (PCLK) per device
Programmable power technology that minimizes power while maximizing device
performance
Up to 1,120 user I/O pins arranged in 24 modular I/O banks that support a wide
range of single-ended and differential I/O standards
Support for high-speed external memory interfaces including DDR, DDR2,
DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular
I/O banks
■
■
■
High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamic
phase alignment (DPA), and soft-CDR circuitry at data rates up to 1.6 Gbps
Support for source-synchronous bus standards, including SGMII, GbE, SPI-4
Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1
Pinouts for Stratix IV E devices designed to allow migration of designs from
Stratix III to Stratix IV E with minimal PCB impact
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–3
Feature Summary
Stratix IV GX Devices
Stratix IV GX devices provide up to 48 full-duplex CDR-based transceiver channels
per device:
■
Thirty-two out of the 48 transceiver channels have dedicated physical coding
sublayer (PCS) and physical medium attachment (PMA) circuitry and support
data rates between 600 Mbps and 8.5 Gbps
■
The remaining 16 transceiver channels have dedicated PMA-only circuitry and
support data rates between 600 Mbps and 6.5 Gbps
1
1
The actual number of transceiver channels per device varies with device selection. For
more information about the exact transceiver count in each device, refer to Table 1–1
on page 1–11.
For more information about transceiver architecture, refer to the Transceiver
Architecture in Stratix IV Devices chapter.
Figure 1–1 shows a high-level Stratix IV GX chip view.
Figure 1–1. Stratix IV GX Chip View (1)
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
FPGA Fabric
PLL
PLL
PLL
PLL
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
Transceiver Block
600 Mbps-8.5 Gbps CDR-based Transceiver
General Purpose I/O and
High-Speed LVDS I/O
with DPA and Soft CDR
General Purpose I/O and 150 Mbps-1.6 Gbps
LVDS interface with DPA and Soft-CDR
Note to Figure 1–1:
(1) Resource counts vary with device selection, package selection, or both.
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–4
Chapter 1: Overview for the Stratix IV Device Family
Feature Summary
Stratix IV E Device
Stratix IV E devices provide an excellent solution for applications that do not require
high-speed CDR-based transceivers, but are logic, user I/O, or memory intensive.
Figure 1–2 shows a high-level Stratix IV E chip view.
Figure 1–2. Stratix IV E Chip View (1)
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
General
Purpose
General
Purpose
I/O and
I/O and
High-Speed
LVDS I/O
with DPA
High-Speed
LVDS I/O
with DPA
and Soft-CDR
and Soft-CDR
FPGA Fabric
PLL
PLL
PLL
PLL
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
General
Purpose
General
Purpose
I/O and
I/O and
High-Speed
LVDS I/O
with DPA
High-Speed
LVDS I/O
with DPA
and Soft-CDR
and Soft-CDR
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
General Purpose I/O and
High-Speed LVDS I/O with DPA
and Soft-CDR
General Purpose I/O and
150 Mbps-1.6 Gbps
LVDS interface with DPA and Soft-CDR
Note to Figure 1–2:
(1) Resource counts vary with device selection, package selection, or both.
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–5
Feature Summary
Stratix IV GT Devices
Stratix IV GT devices provide up to 48 CDR-based transceiver channels per device:
■
Thirty-two out of the 48 transceiver channels have dedicated PCS and PMA
circuitry and support data rates between 600 Mbps and 11.3 Gbps
■
The remaining 16 transceiver channels have dedicated PMA-only circuitry and
support data rates between 600 Mbps and 6.5 Gbps
1
1
The actual number of transceiver channels per device varies with device selection. For
more information about the exact transceiver count in each device, refer to Table 1–7
on page 1–16.
For more information about Stratix IV GT devices and transceiver architecture, refer
to the Transceiver Architecture in Stratix IV Devices chapter.
Figure 1–3 shows a high-level Stratix IV GT chip view.
(1)
Figure 1–3. Stratix IV GT Chip View
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
PLL
PLL
FPGA Fabric
PLL
PLL
PLL
PLL
(Logic Elements, DSP,
Embedded Memory,
Clock Networks)
PLL
PLL
General Purpose
I/O and Memory
Interface
General Purpose
I/O and Memory
Interface
PLL PLL
Transceiver Block
600 Mbps-11.3 Gbps CDR-based Transceiver
General Purpose I/O and
High-Speed LVDS I/O
with DPA and Soft CDR
General Purpose I/O and up to 1.6 Gbps
LVDS interface with DPA and Soft-CDR
Note to Figure 1–3:
(1) Resource counts vary with device selection, package selection, or both.
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–6
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
Architecture Features
The Stratix IV device family features are divided into high-speed transceiver features
and FPGA fabric and I/O features.
1
The high-speed transceiver features apply only to Stratix IV GX and Stratix IV GT
devices.
High-Speed Transceiver Features
The following sections describe high-speed transceiver features for Stratix IV GX and
GT devices.
Highest Aggregate Data Bandwidth
Up to 48 full-duplex transceiver channels supporting data rates up to 8.5 Gbps in
Stratix IV GX devices and up to 11.3 Gbps in Stratix IV GT devices.
Wide Range of Protocol Support
Physical layer support for the following serial protocols:
■
Stratix IV GX—PCIe Gen1 and Gen2, GbE, Serial RapidIO, SONET/SDH,
XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI, Fibre Channel, SFI-5, GPON,
SAS/SATA, HyperTransport 1.0 and 3.0, and Interlaken
■
■
■
Stratix IV GT—40G/100G Ethernet, SFI-S, Interlaken, SFI-5.1, Serial RapidIO,
SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, 3G-SDI, and Fibre Channel
Extremely flexible and easy-to-configure transceiver data path to implement
proprietary protocols
PCIe Support
■
Complete PCIe Gen1 and Gen2 protocol stack solution compliant to PCI
Express base specification 2.0 that includes PHY-MAC, Data Link, and
transaction layer circuitry embedded in PCI Express hard IP blocks
f For more information, refer to the PCI Express Compiler User Guide.
■
■
■
■
■
Root complex and end-point applications
x1, x4, and x8 lane configurations
PIPE 2.0-compliant interface
Embedded circuitry to switch between Gen1 and Gen2 data rates
Built-in circuitry for electrical idle generation and detection, receiver detect,
power state transitions, lane reversal, and polarity inversion
■
■
8B/10B encoder and decoder, receiver synchronization state machine, and
300 parts per million (ppm) clock compensation circuitry
Transaction layer support for up to two virtual channels (VCs)
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–7
Architecture Features
■
XAUI/HiGig Support
■
Compliant to IEEE802.3ae specification
■
Embedded state machine circuitry to convert XGMII idle code groups (||I||)
to and from idle ordered sets (||A||, ||K||, ||R||) at the transmitter and
receiver, respectively
■
8B/10B encoder and decoder, receiver synchronization state machine, lane
deskew, and 100 ppm clock compensation circuitry
■
GbE Support
■
Compliant to IEEE802.3-2005 specification
■
Automatic idle ordered set (/I1/, /I2/) generation at the transmitter,
depending on the current running disparity
■
8B/10B encoder and decoder, receiver synchronization state machine, and
100 ppm clock compensation circuitry
■
Support for other protocol features such as MSB-to-LSB transmission in
SONET/SDH configuration and spread-spectrum clocking in PCIe configurations
Diagnostic Features
■
■
■
Serial loopback from the transmitter serializer to the receiver CDR for transceiver
PCS and PMA diagnostics
Reverse serial loopback pre- and post-CDR to transmitter buffer for physical link
diagnostics
Loopback master and slave capability in PCI Express hard IP blocks
f
For more information, refer to the PCI Express Compiler User Guide.
Signal Integrity
Stratix IV devices simplify the challenge of signal integrity through a number of chip,
package, and board-level enhancements to enable efficient high-speed data transfer
into and out of the device. These enhancements include:
■
Programmable 3-tap transmitter pre-emphasis with up to 8,192 pre-emphasis
levels to compensate for pre-cursor and post-cursor inter-symbol interference (ISI)
■
■
Up to 900% boost capability on the first pre-emphasis post-tap
User-controlled and adaptive 4-stage receiver equalization with up to 16 dB of
high-frequency gain
■
■
■
On-die power supply regulators for transmitter and receiver phase-locked loop
(PLL) charge pump and voltage controlled oscillator (VCO) for superior noise
immunity
On-package and on-chip power supply decoupling to satisfy transient current
requirements at higher frequencies, thereby reducing the need for on-board
decoupling capacitors
Calibration circuitry for transmitter and receiver on-chip termination (OCT)
resistors
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–8
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
FPGA Fabric and I/O Features
The following sections describe the Stratix IV FPGA fabric and I/O features.
Device Core Features
■
Up to 531,200 LEs in Stratix IV GX and GT devices and up to 813,050 LEs in
Stratix IV E devices, efficiently packed in unique and innovative adaptive logic
modules (ALMs)
■
■
■
Ten ALMs per logic array block (LAB) deliver faster performance, improved logic
utilization, and optimized routing
Programmable power technology, including a variety of process, circuit, and
architecture optimizations and innovations
Programmable power technology available to select power-driven compilation
options for reduced static power consumption
Embedded Memory
■
TriMatrix embedded memory architecture provides three different memory block
sizes to efficiently address the needs of diversified FPGA designs:
■
■
■
640-bit MLAB
9-Kb M9K
144-Kb M144K
■
■
Up to 33,294 Kb of embedded memory operating at up to 600 MHz
Each memory block is independently configurable to be a single- or dual-port
RAM, FIFO, ROM, or shift register
Digital Signal Processing (DSP) Blocks
■
Flexible DSP blocks configurable as 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit
full-precision multipliers at up to 600 MHz with rounding and saturation
capabilities
■
■
Faster operation due to fully pipelined architecture and built-in addition,
subtraction, and accumulation units to combine multiplication results
Optimally designed to support advanced features such as adaptive filtering, barrel
shifters, and finite and infinite impulse response (FIR and IIR) filters
Clock Networks
■
■
■
■
Up to 16 global clocks and 88 regional clocks optimally routed to meet the
maximum performance of 800 MHz
Up to 112 and 132 periphery clocks in Stratix IV GX and Stratix IV E devices,
respectively
Up to 66 (16 GCLK + 22 RCLK + 28 PCLK) clock networks per device quadrant in
Stratix IV GX and Stratix IV GT devices
Up to 71 (16 GCLK + 22 RCLK + 33 PCLK) clock networks per device quadrant in
Stratix IV E devices
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–9
Architecture Features
PLLs
■
Three to 12 PLLs per device supporting spread-spectrum input tracking,
programmable bandwidth, clock switchover, dynamic reconfiguration, and delay
compensation
■
On-chip PLL power supply regulators to minimize noise coupling
I/O Features
■
Sixteen to 24 modular I/O banks per device with 24 to 48 I/Os per bank designed
and packaged for optimal simultaneous switching noise (SSN) performance and
migration capability
■
Support for a wide range of industry I/O standards, including single-ended
(LVTTL/CMOS/PCI/PCIX), differential (LVDS/mini-LVDS/RSDS),
voltage-referenced single-ended and differential (SSTL/HSTL Class I/II) I/O
standards
■
■
■
■
On-chip series (RS) and on-chip parallel (RT) termination with auto-calibration for
single-ended I/Os and on-chip differential (RD) termination for differential I/Os
Programmable output drive strength, slew rate control, bus hold, and weak
pull-up capability for single-ended I/Os
User I/O:GND:VCC ratio of 8:1:1 to reduce loop inductance in the package—PCB
interface
Programmable transmitter differential output voltage (VOD) and pre-emphasis for
high-speed LVDS I/O
High-Speed Differential I/O with DPA and Soft-CDR
■
Dedicated circuitry on the left and right sides of the device to support differential
links at data rates from 150 Mbps to 1.6 Gbps
■
Up to 98 differential SERDES in Stratix IV GX devices, up to 132 differential
SERDES in Stratix IV E devices, and up to 47 differential SERDES in Stratix IV GT
devices
■
■
DPA circuitry at the receiver automatically compensates for channel-to-channel
and channel-to-clock skew in source synchronous interfaces
Soft-CDR circuitry at the receiver allows implementation of asynchronous serial
interfaces with embedded clocks at up to 1.6 Gbps data rate (SGMII and GbE)
External Memory Interfaces
■
Support for existing and emerging memory interface standards such as DDR
SDRAM, DDR2 SDRAM, DDR3 SDRAM, QDRII SRAM, QDRII+ SRAM, and
RLDRAM II
■
■
■
DDR3 up to 1,067 Mbps/533 MHz
Programmable DQ group widths of 4 to 36 bits (includes parity bits)
Dynamic OCT, trace mismatch compensation, read-write leveling, and half-rate
register capabilities provide a robust external memory interface solution
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–10
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
System Integration
■
All Stratix IV devices support hot socketing
■
Four configuration modes:
■
■
■
■
Passive Serial (PS)
Fast Passive Parallel (FPP)
Fast Active Serial (FAS)
JTAG configuration
■
■
Ability to perform remote system upgrades
256-bit advanced encryption standard (AES) encryption of configuration bits
protects your design against copying, reverse engineering, and tampering
■
Built-in soft error detection for configuration RAM cells
f
For more information about how to connect the PLL, external memory interfaces, I/O,
high-speed differential I/O, power, and the JTAG pins to PCB, refer to the
Stratix IV GX and Stratix IV E Device Family Pin Connection Guidelines and the
Stratix IV GT Device Family Pin Connection Guidelines.
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Table 1–1 lists the Stratix IV GX device features.
Table 1–1. Stratix IV GX Device Features (Part 1 of 2)
Feature
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Package
Option
ALMs
29,040
72,600
42,240
70,300
91,200
116,480
291,200
141,440
353,600
212,480
531,200
LEs
105,600
175,750
228,000
0.6 Gbps-
8.5 Gbps
Transceivers
—
8
16
—
—
—
16
—
16
—
8
—
16
—
16 24
—
8
—
16
—
16 24
—
16
—
—
16
—
16 24 24 32
—
16
—
—
16
—
16 24 24
32
—
24
32
—
16
(PMA + PCS)
(1)
0.6 Gbps-
6.5 Gbps
Transceivers
8
—
8
—
—
12
—
—
12
—
—
—
—
—
—
—
—
12
(PMA + PCS)
(1)
PMA-only
CMU
Channels
(0.6 Gbps-
6.5 Gbps)
—
1
8
2
—
1
—
1
8
2
—
1
8
2
8
2
12 12 16
8
2
12 12
16
4
PCI Express
hard IP
Blocks
2
4
4
4
High-Speed
LVDS
SERDES (up
28
56
28
28 56 28
44
2
88 28
44
2
88
4
—
—
44
2
88 88 98
—
—
44
2
88 88
98
88
98
to 1.6 Gbps)
(4)
SPI-4.2 Links
1
1
1
4
1
4
4
Table 1–1. Stratix IV GX Device Features (Part 2 of 2)
Feature
EP4SGX70
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Package
Option
M9K Blocks
462
16
660
16
950
20
1,235
22
936
36
1,248
48
1,280
64
(256 x
36 bits)
M144K
Blocks
(2048 x
72 bits)
TotalMemory
(MLAB+M9K
+M144K) Kb
7,370
384
9,564
512
13,627
17,133
17,248
832
22,564
1,040
27,376
1,024
Embedded
Multipliers
1,02
4
920
6
1,288
6
(2)
18 x 18
PLLs
3
4
3
4
3
8
3
8
4
6
8
12 12
4
6
8
12
12
12
12
48
8
56 56 74
56 74
56 74 88 92
56 74 88
(3)
User I/Os
372 488 372 372
372
372 564
289 564
289 564
920
880
920
4
4
4
4
4
4
4
0
0
4
4
0
–2
,
–3 –3,
–2 –2
–2 –2
,
–3, –3,
–4 –4
–2 –2
–2 –2
–2 –2
Speed Grade –2, –2,
–2,
–3,
–4
–2,
–2, –2,
–3, –3,
–4 –4
–2, –2, –2, –2,
–3, –3, –3, –3,
–4 –4 –4 –4
–2, –2, –2, –2,
–3, –3, –3, –3,
,
,
,
,
,
,
,
,
,
–2, –3,
–4
–2, –3,
–4
(fastest to
–3,
–4
–3,
–4
–3, –3,
–4 –4
–3, –3,
–4 –4
–3, –3,
–4 –4
–3, –3,
–4 –4
(5)
slowest)
,
–4
–4 –4 –4
–4
–4
Notes to Table 1–1:
(1) The total number of transceivers is divided equally between the left and right side of each device, except for the devices in the F780 package. These devices have eight transceiver channels located only
on the right side of the device.
(2) Four multiplier adder mode.
(3) The user I/Os count from pin-out files includes all general purpose I/O, dedicated clock pins, and dual purpose configuration pins. Transceiver pins and dedicated configuration pins are not included in
the pin count.
(4) Total pairs of high-speed LVDS SERDES take the lowest channel count of RX/TX.
(5) The difference between the Stratix IV GX devices in the –2 and –2x speed grades is the number of available transceiver channels. The –2 device allows you to use the transceiver CMU blocks as
transceiver channels. The –2x device does NOT allow you to use the CMU blocks as transceiver channels. In addition to the reduction of available transceiver channels in the Stratix IV GX –2x device,
the data rates in the –2x device are limited to 6.5 Gbps.
Table 1–2 lists the Stratix IV GX device package options.
(1) (2)
Table 1–2. Stratix IV GX Device Package Options
,
F1152
F1517
F1760
F1932
F780
(29 mm x 29 mm)
F1152
(35 mm x 35 mm)
Device
(35 mm x 35 mm)
(40 mm x 40 mm)
(42.5 mm x 42.5 mm)
(45 mm x 45 mm)
(6)
(5) (7)
,
(6)
(5) (7)
(7)
(7)
,
EP4SGX70
DF29
DF29
DF29
DF29
—
—
—
HF35
HF35
—
—
—
—
—
—
—
EP4SGX110
EP4SGX180
EP4SGX230
EP4SGX290
EP4SGX360
EP4SGX530
Notes to Table 1–2:
—
FF35
FF35
FF35
FF35
FF35
—
—
—
—
—
—
—
—
—
HF35
HF35
KF40
KF40
KF40
KF40
—
—
—
—
(3)
(3)
FH29
FH29
—
HF35
HF35
KF43
KF43
KF43
NF45
NF45
NF45
—
(4)
(4)
—
HH35
KH40
(1) Device packages in the same column and marked under the same arrow sign have vertical migration capability.
(2) Use the Pin Migration Viewer in the Pin Planner to verify the pin migration compatibility when migrating devices. For more information, refer to I/O Management in the Quartus II Handbook, Volume 2.
(3) The 780-pin EP4SGX290 and EP4SGX360 devices are available only in 33 mm x 33 mm Hybrid flip chip package.
(4) The 1152-pin and 1517-pin EP4SGX530 devices are available only in 42.5 mm x 42.5 mm Hybrid flip chip packages.
(5) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information, refer to the Package Information Datasheet for Altera Devices.
(6) Devices listed in this column are available in –2x, –3, and –4 speed grades. These devices do not have on-package decoupling capacitors.
(7) Devices listed in this column are available in –2, –3, and –4 speed grades. These devices have on-package decoupling capacitors. For more information about on-package decoupling capacitor value
in each device, refer to Table 1–3.
1
On-package decoupling reduces the need for on-board or PCB decoupling capacitors by satisfying the transient current
requirements at higher frequencies. The Power Delivery Network design tool for Stratix IV devices accounts for the on-package
decoupling and reflects the reduced requirements for PCB decoupling capacitors.
Table 1–3 lists the Stratix IV GX device on-package decoupling information.
Table 1–3. Stratix IV GX Device On-Package Decoupling Information (1)
Ordering Information
VCC
VCCIO
VCCL_GXB
VCCA_L/R
100nF
100nF
VCCT and VCCR (Shared)
1470nF + 147nF per side
1470nF + 147nF per side
(2)
(2)
EP4SGX70
HF35
HF35
HF35
KF40
HF35
KF40
HF35
KF40
KF43
NF45
HF35
KF40
KF43
NF45
HH35
KH40
KF43
NF45
21uF + 2470nF
21uF + 2470nF
10nF per bank
10nF per bank
100nF per transceiver block
100nF per transceiver block
EP4SGX110
(2)
(2)
EP4SGX180
EP4SGX230
21uF + 2470nF
21 uF + 2470 nF
10nF per bank
10 nF per bank
100nF per transceiver block
100 nF per transceiver block
100nF
100 nF
1470nF + 147nF per side
1470 nF + 147 nF
per side
1470 nF + 147 nF
(2)
(2)
(2)
EP4SGX290
EP4SGX360
41 uF + 4470 nF
41 uF + 4470 nF
41 uF + 4470 nF
10 nF per bank
10 nF per bank
10 nF per bank
100 nF per transceiver block
100 nF per transceiver block
100 nF per transceiver block
100nF
100 nF
100 nF
per side
1470 nF + 147 nF
per side
1470 nF + 147 nF
EP4SGX530
per side
Notes to Table 1–3:
(1) Table 1–3 refers to production devices on-package decoupling. For more information about decoupling design of engineering sample (ES) devices, contact Altera Technical Support.
(2) For I/O banks 3(*), 4(*), 7(*), and 8(*) only. There is no OPD for I/O bank 1(*), 2(*), 5(*), and 6(*).
Table 1–4 lists the Stratix IV E device features.
Table 1–4. Stratix IV E Device Features
Feature
Package Pin Count
ALMs
EP4SE230
780
EP4SE360
1152
EP4SE530
1517
EP4SE820
1517
780
1152
1760
112
1152
1760
91,200
228,000
141,440
353,600
212,480
531,200
325,220
813,050
LEs
High-Speed LVDS
SERDES (up to
56
56
3
88
4
88
4
112
88
4
112
132
6
(1)
1.6 Gbps)
SPI-4.2 Links
3
6
6
M9K Blocks
(256 x 36 bits)
1,235
1,248
48
1,280
64
1610
M144K Blocks
(2048 x 72 bits)
22
60
Total Memory
(MLAB+M9K+
M144K) Kb
17,133
1,288
22,564
1,040
27,376
1,024
33,294
Embedded Multipliers
960
12
(2)
(18 x 18)
PLLs
4
4
8
8
12
12
8
12
(3)
(4)
(4)
(4)
User I/Os
488
488
744
744
976
976
744
976
1120
Speed Grade
(fastest to slowest)
–2, –3, –4 –2, –3, –4 –2, –3, –4 –2, –3, –4 –2, –3, –4 –2, –3, –4
–3, –4
–3, –4
–3, –4
Notes to Table 1–4:
(1) The user I/O count from the pin-out files include all general purpose I/Os, dedicated clock pins, and dual purpose configuration pins. Transceiver pins
and dedicated configuration pins are not included in the pin count.
(2) Four multiplier adder mode.
(3) Total pairs of high-speed LVDS SERDES take the lowest channel count of RX/TX.
(4) This data is preliminary.
1–16
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
Table 1–5 summarizes the Stratix IV E device package options.
(2)
Table 1–5. Stratix IV E Device Package Options (1)
F780
,
F1152
(35 mm x 35 mm)
F1517
(40 mm x 40 mm)
F1760
(42.5 mm x 42.5 mm)
Device
(5) (6)
(5) (7)
(7)
(7)
(29 mm x 29 mm)
,
,
EP4SE230
EP4SE360
EP4SE530
EP4SE820
F29
—
—
—
—
—
(3)
H29
F35
(4)
(4)
—
—
H35
H40
F43
F43
(4)
(4)
H35
H40
Notes to Table 1–5:
(1) Device packages in the same column and marked under the same arrow sign have vertical migration capability.
(2) Use the Pin Migration Viewer in the Pin Planner to verify the pin migration compatibility when migrating devices. For more information, refer to
I/O Management in the Quartus II Handbook, Volume 2.
(3) The 780-pin EP4SE360 device is available only in the 33 mm x 33 mm Hybrid flip chip package.
(4) The 1152-pin and 1517-pin for EP4SE530 and EP4SE820 devices are available only in the 42.5 mm x 42.5 mm Hybrid flip chip package.
(5) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information, refer to the Package
Information Datasheet for Altera Devices.
(6) Devices listed in this column do not have on-package decoupling capacitors.
(7) Devices listed in this column have on-package decoupling capacitors. For more information about on-package decoupling capacitor value for
each device, refer to Table 1–6.
Table 1–6 lists the Stratix IV E on-package decoupling information.
Table 1–6. Stratix IV E Device On-Package Decoupling Information (1)
Ordering Information
VCC
VCCIO
EP4SE360
F35
H35
H40
F43
H35
H40
F43
41 uF + 4470 nF
10 nF per bank
EP4SE530
41 uF + 4470 nF
41 uF + 4470 nF
10 nF per bank
10 nF per bank
EP4SE820
Note to Table 1–6:
(1) Table 1–6 refers to production devices on-package decoupling. For more information about decoupling design of engineering sample (ES)
devices, contact Altera Technical Support.
Table 1–7 lists the Stratix IV GT device features.
Table 1–7. Stratix IV GT Device Features (Part 1 of 2)
Feature
EP4S40G2
1517
EP4S40G5 EP4S100G2 EP4S100G3 EP4S100G4
EP4S100G5
1517 1932
Package Pin Count
ALMs
1517
1517
91,200
228,000
1932
1932
91,200
212,480
531,200
116,480
291,200
141,440
353,600
212,480
531,200
LEs
228,000
Total Transceiver
Channels
36
36
36
48
48
36
48
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–17
Architecture Features
Table 1–7. Stratix IV GT Device Features (Part 2 of 2)
Feature
EP4S40G2
EP4S40G5 EP4S100G2 EP4S100G3 EP4S100G4
EP4S100G5
10G Transceiver
Channels
(600 Mbps - 11.3 Gbps
with PMA + PCS)
12
12
12
24
0
24
8
24
8
24
32
0
8G Transceiver
Channels
(600 Mbps - 8.5 Gbps
12
0
(1)
with PMA + PCS)
PMA-only CMU
Channels
(600 Mbps- 6.5 Gbps)
12
2
12
2
12
2
16
4
16
4
12
2
16
4
PCIe hard IP Blocks
High-Speed LVDS
SERDES
(up to 1.6 Gbps)
46
46
46
47
47
46
2
47
2
(2)
SP1-4.2 Links
2
2
2
2
2
M9K Blocks
(256 x 36 bits)
1,235
1,280
1,235
936
1,248
1,280
64
M144K Blocks
(2048 x 72 bits)
22
64
22
36
17,248
832
48
Total Memory (MLAB +
M9K + M144K) Kb
17,133
1,288
27,376
1,024
17,133
1,288
22,564
1,024
27,376
1,024
Embedded Multipliers
(3)
18 x 18
PLLs
8
8
8
12
12
8
12
(4) (5)
User I/Os
,
654
654
654
781
781
654
781
Speed Grade
(fastest to slowest)
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3 –1, –2, –3 –1, –2, –3
Notes to Table 1–7:
(1) You can configure all 10G transceiver channels as 8G transceiver channels. For example, the EP4S40G2F40 device has twenty-four 8G
transceiver channels and the EP4S100G5F45 device has thirty-two 8G transceiver channels.
(2) Total pairs of high-speed LVDS SERDES take the lowest channel count of RX/TX.
(3) Four multiplier adder mode.
(4) The user I/O count from the pin-out files include all general purpose I/Os, dedicated clock pins, and dual purpose configuration pins. Transceiver
pins and dedicated configuration pins are not included in the pin count.
(5) This data is preliminary.
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–18
Chapter 1: Overview for the Stratix IV Device Family
Architecture Features
Table 1–8 lists the resource counts for the Stratix IV GT devices.
(1) (2)
Table 1–8. Stratix IV GT Device Package Options
,
1517 Pin
(40 mm x 40 mm)
1932 Pin
(45 mm x 45 mm)
Device
(3)
Stratix IV GT 40 G Devices
EP4S40G2
F40
—
—
(4) (5)
EP4S40G5
H40
,
Stratix IV GT 100 G Devices
EP4S100G2
F40
—
EP4S100G3
—
—
F45
F45
F45
EP4S100G4
(4) (5)
EP4S100G5
H40
,
Notes to Table 1–8:
(1) This table represents pin compatability; however, it does not include hard IP block placement compatability.
(2) Devices under the same arrow sign have vertical migration capability.
(3) When migrating between hybrid and flip chip packages, there is an additional keep-out area. For more information,
refer to the Altera Device Package Information Data Sheet.
(4) EP4S40G5 and EP4S100G5 devices with 1517 pin-count are only available in 42.5-mm x 42.5-mm Hybrid flip chip
packages.
(5) If you are using the hard IP block, migration is not possible.
Table 1–9 lists the Stratix IV GT on-package decoupling information.
Table 1–9. Stratix IV GT Device On-Package Decoupling Information (1)
Ordering
VCC
VCCIO
VCCL_GXB
VCCA_L/R
VCCT_L/R
VCCR_L/R
Information
EP4S40G2F40
EP4S100G2F40
EP4S100G3F45
EP4S100G4F45
EP4S40G5H40
EP4S100G5H40
EP4S100G5F45
Notes to Table 1–9:
100 nF per
transceiver block
(2)
21 uF + 2470 nF 10 nF per bank
100 nF
100 nF
100 nF
100 nF per
transceiver block
(2)
41 uF + 4470 nF 10 nF per bank
100 nF
100 nF
100 nF
(1) Table 1–9 refers to production devices on-package decoupling. For more information about decoupling design of engineering sample (ES)
devices, contact Altera Technical Support.
(2) For I/O banks 3(*), 4(*), 7(*), and 8(*) only. There is no OPD for I/O bank 1(*), 2(*), 5(*), and 6(*).
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–19
Integrated Software Platform
Integrated Software Platform
The Quartus II software provides an integrated environment for HDL and schematic
design entry, compilation and logic synthesis, full simulation and advanced timing
analysis, SignalTap II Logic Analyzer, and device configuration of Stratix IV designs.
The Quartus II software provides the MegaWizard Plug-In Manager user interface to
generate different functional blocks, such as memory, PLL, and digital signal
processing logic. For transceivers, the Quartus II software provides the ALTGX
MegaWizard Plug-In Manager interface that guides you through configuration of the
transceiver based on your application requirements.
The Stratix IV GX and GT transceivers allow you to implement low-power and
reliable high-speed serial interface applications with its fully reconfigurable
hardware, optimal signal integrity, and integrated Quartus II software platform.
f
For more information about the QuarJanuary2016tus II software features, refer to the
Quartus II Handbook.
Ordering Information
This section describes the Stratix IV E, GT, and GX devices ordering information.
Figure 1–4 shows the ordering codes for Stratix IV GX and E devices.
Figure 1–4. Stratix IV GX and E Device Packaging Ordering Information
EP4SGX
230
K
F
40
C
2
G
ES
Family Signature
Optional Suffix
Indicates specific device
options or shipment method
ES:Engineering sample
EP4SGX: Stratix IV Transceiver
EP4SE: Stratix IV Logic/Memory
RoHS
N: RoHS5
G: RoHS6
Leaded
Device Density
Contact Altera for availability
70
110
180
230
290
360
530
820
Transceiver Count
Speed Grade
D: 8
F: 16
H: 24
K: 36
N: 48
2, 2x, 3, or 4, with 2 being the fastest
Operating Temperature
C: Commercial Temperature (t =0° C to 85° C)
Package Type
J
Ball Array Dimension
I: Industrial Temperature (t =–40° C to 100° C)
J
M: Military Temperature (t =–55° C to 125° C)
J
F: FineLine BGA (FBGA)
H: Hybrid FineLine BGA
Corresponds to pin count
29 = 780 pins
35 = 1152 pins
40 = 1517 pins
43 = 1760 pins
45 = 1932 pins
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–20
Chapter 1: Overview for the Stratix IV Device Family
Ordering Information
Figure 1–5 shows the ordering codes for Stratix IV GT devices.
Figure 1–5. Stratix IV GT Device Packaging Ordering Information
EP4S 40G
2
F
40
C
2
ES
Family Signature
Optional Suffix
Indicatesspecific device options
ES: Engineering sample
N: Lead-free devices
Aggregate Bandwidth
40G
100G
Device Density
Speed Grade
2 = 230k LEs
3 = 290k LEs
4 = 360k LEs
5 = 530k LEs
1, 2, 3 with 1 being the fastest
Operating Temperature
Package Type
C: Commercial temperature(t = 0 C to 85 C)
J
I:
Industrial temperature (t
= 0°C to 100°C)
J
F: FineLine BGA (FBGA)
H: Hybrid FineLine BGA
Ball Array Dimension
Corresponds to pin count
40 = 1517 pins
45 = 1932 pins
o
Document Revision History
Table 1–10 lists the revision history for this chapter.
Table 1–10. Document Revision History (Part 1 of 2)
Date
Version
Changes
■ Updated Figure 1–4 with new RoHS information
■ Updated Table 1–1 to close FB #30986.
January 2016
3.5
September 2012
June 2011
3.4
3.3
■ Updated Table 1–2 and Table 1–5 to close FB #31127.
■ Added military temperature to Figure 1–4.
■ Updated Table 1–7 and Table 1–8.
■ Applied new template.
February 2011
3.2
■ Minor text edits.
■ Updated Table 1–1, Table 1–2, and Table 1–7.
■ Updated Figure 1–3.
March 2010
3.1
■ Updated the “Stratix IV GT Devices” section.
■ Added two new references to the Introduction section.
■ Minor text edits.
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
Chapter 1: Overview for the Stratix IV Device Family
1–21
Ordering Information
Table 1–10. Document Revision History (Part 2 of 2)
Date
Version
Changes
■ Updated the “Stratix IV Device Family Overview”, “Feature Summary”, “Stratix IV GT
Devices”, “High-Speed Transceiver Features”, “FPGA Fabric and I/O Features”, “Highest
Aggregate Data Bandwidth”, “System Integration”, and “Integrated Software Platform”
sections.
November 2009
3.0
■ Added Table 1–3, Table 1–6, and Table 1–9.
■ Updated Table 1–1, Table 1–2, Table 1–4, Table 1–5, Table 1–7, and Table 1–8.
■ Updated Figure 1–3, Figure 1–4, and Figure 1–5.
■ Minor text edits.
■ Updated Table 1–1.
June 2009
April 2009
2.4
2.3
■ Minor text edits.
■ Added Table 1–5, Table 1–6, and Figure 1–3.
■ Updated Figure 1–5.
■ Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.
■ Updated “Introduction”, “Feature Summary”, “Stratix IV GX Devices”, “Stratix IV GT
Devices”, “Architecture Features”, and “FPGA Fabric and I/O Features”
■ Updated “Feature Summary”, “Stratix IV GX Devices”, “Stratix IV E Device”, “Stratix IV
GT Devices”, “Signal Integrity”
March 2009
2.2
2.1
■ Removed Tables 1-5 and 1-6
■ Updated Figure 1–4
■ Updated “Introduction”, “Feature Summary”, “Stratix IV Device Diagnostic Features”,
“Signal Integrity”, “Clock Networks”,“High-Speed Differential I/O with DPA and Soft-
CDR”, “System Integration”, and “Ordering Information” sections.
■ Added “Stratix IV GT 100G Devices” and “Stratix IV GT 100G Transceiver Bandwidth”
sections.
March 2009
■ Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.
■ Added Table 1–5 and Table 1–6.
■ Updated Figure 1–3 and Figure 1–4.
■ Added Figure 1–5.
■ Removed “Referenced Documents” section.
■ Updated “Feature Summary” on page 1–1.
■ Updated “Stratix IV Device Diagnostic Features” on page 1–7.
■ Updated “FPGA Fabric and I/O Features” on page 1–8.
■ Updated Table 1–1.
November 2008
2.0
■ Updated Table 1–2.
■ Updated “Table 1–5 shows the total number of transceivers available in the Stratix IV GT
Device.” on page 1–15.
July 2008
May 2008
1.1
1.0
Revised “Introduction”.
Initial release.
January 2016 Altera Corporation
Stratix IV Device Handbook
Volume 1
1–22
Chapter 1: Overview for the Stratix IV Device Family
Ordering Information
Stratix IV Device Handbook
Volume 1
January 2016 Altera Corporation
相关型号：
EP4SE820H35C3
Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1152, FBGA-1152
INTEL
EP4SE820H35C3N
Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1152, FBGA-1152
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EP4SE820H35C4
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EP4SE820H35I4N
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EP4SE820H40C3
Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1517, HBGA-1517
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EP4SE820H40C3N
Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1517, HBGA-1517
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EP4SE820H40C4N
Field Programmable Gate Array, 325220 CLBs, 717MHz, 813050-Cell, CMOS, PBGA1517, HBGA-1517
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