AM29F010-90DGC1 [AMD]

1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1; 1兆位（ 128千×8位） CMOS 5.0伏只，统一部门闪存裸片修订版1


型号：	AM29F010-90DGC1
厂家：	AMD
描述：	1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1 1兆位（ 128千×8位） CMOS 5.0伏只，统一部门闪存裸片修订版1 闪存
文件：	总8页 (文件大小：59K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SUPPLEMENT

Am29F010 Known Good Die

1 Megabit (128 K x 8-Bit)

CMOS 5.0 Volt-only, Uniform Sector Flash Memory—Die Revision 1

■ Embedded Algorithms

DISTINCTIVE CHARACTERISTICS

— Embedded Erase algorithm automatically

pre-programs and erases the chip or any

combination of designated sector

■ Single power supply operation

— 5.0 V ± 10% for read, erase, and program

operations

— Embedded Program algorithm automatically

programs and verifies data at specified address

— Simplifies system-level power requirements

■ High performance

■ Minimum 100,000 program/erase cycles

— 90 or 120 ns maximum access time

guaranteed

■ Low power consumption

■ Compatible with JEDEC standards

— 30 mA max active read current

— 50 mA max program/erase current

— <25 µA typical standby current

— Pinout and software compatible with

single-power-supply flash

— Superior inadvertent write protection

■ Flexible sector architecture

— Eight uniform sectors

■ Data Polling and Toggle Bits

— Provides a software method of detecting

program or erase cycle completion

— Any combination of sectors can be erased

— Supports full chip erase

■ Tested to datasheet specifications at

temperature

■ Sector protection

■ Quality and reliability levels equivalent to

— Hardware-based feature that disables/re-

enables program and erase operations in any

combination of sectors

standard packaged components

— Sector protection/unprotection can be

implemented using standard PROM

programming equipment

1/13/98

Publication# 21116 Rev: B Amendment/0

Issue Date: January 1998

S U P P L E M E N T

Program algorithm—an internal algorithm that auto-

GENERAL DESCRIPTION

matically times the program pulse widths and verifies

proper cell margin.

The Am29F010 in Known Good Die (KGD) form is a 1

Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as

standard product in die form, tested for functionality

and speed. AMD KGD products have the same reli-

ability and quality as AMD products in packaged form.

Device erasure occurs by executing the erase com-

mand sequence. This invokes the Embedded Erase

algorithm—an internal algorithm that automatically pre-

programs the array (if it is not already programmed) be-

fore executing the erase operation. During erase, the

device automatically times the erase pulse widths and

verifies proper cell margin.

Am29F010 Features

The Am29F010 device is organized as eight uniform

sectors of 16 Kbytes each for flexible erase capability.

This device is designed to be programmed in-system

The host system can detect whether a program or

erase operation is complete by reading the DQ7 (Data#

Polling) and DQ6 (toggle) status bits. After a program

or erase cycle has been completed, the device is ready

to read array data or accept another command.

with the standard system 5.0 Volt V supply. A power

supply providing 12.0 Volt V

program or erase operations.

is not required for

The Am29F010 in KGD form offers access times of 90

ns and 120 ns, allowing high speed microprocessors to

operate without wait states. To eliminate bus conten-

tion the device has separate chip enable (CE#), write

enable (WE#) and output enable (OE) controls.

The sector erase architecture allows memory sectors

to be erased and reprogrammed without affecting the

data contents of other sectors. The device is erased

when shipped from the factory.

The device requires only a single 5.0 volt power sup-

ply for both read and write functions. Internally gener-

ated and regulated voltages are provided for the

program and erase operations.

The hardware data protection measures include a

low V detector automatically inhibits write operations

during power transitions. The hardware sector pro-

tection feature disables both program and erase oper-

ations in any combination of the sectors of memory,

and is implemented using standard EPROM program-

mers.

The device is entirely command set compatible with the

JEDEC single-power-supply Flash standard. Com-

mands are written to the command register using stan-

dard microprocessor write timings. Register contents

serve as input to an internal state machine that controls

the erase and programming circuitry. Write cycles also

internally latch addresses and data needed for the pro-

gramming and erase operations. Reading data out of

the device is similar to reading from other Flash or

EPROM devices.

The system can place the device into the standby mode.

Power consumption is greatly reduced in this mode.

ELECTRICAL SPECIFICATIONS

Refer to the Am29F010 data sheet, publication number

16736, for full electrical specifications for the

Am29F010 in KGD form.

Device programming occurs by executing the program

command sequence. This invokes the Embedded

Am29F010 Known Good Die

1/13/98

S U P P L E M E N T

PRODUCT SELECTOR GUIDE

Family Part Number

Am29F010 KGD

Speed Option (V = 5.0 V ± 10%)

-90

-120

120

Max Access Time, t

(ns)

ACC

Max CE# Access, t (ns)

Max OE# Access, t (ns)

DIE PHOTOGRAPH

Orientation relative to

top left corner of

Gel-Pak

Orientation relative to

leading edge of tape

and reel

DIE PAD LOCATIONS

30 29 28 27 26

AMD logo location

10 11 12 13 14 15 16 17 18 19 20 21 22 23

Am29F010 Known Good Die

1/13/98

S U P P L E M E N T

PAD DESCRIPTION

Pad Center (mils)

Pad Center (millimeters)

Pad

Signal

0.00

A16

A15

A12

–33.20

–41.60

–49.90

–58.30

–66.60

–75.00

–74.40

–75.60

–69.40

–56.10

–46.10

–36.30

–25.90

–13.30

–4.30

4.70

–1.30

–0.84

–1.06

–1.27

–1.48

–1.69

–1.91

–1.89

–1.92

–1.76

–1.42

–1.17

–0.92

–0.66

–0.34

–0.11

0.12

–0.03

–0.27

–4.02

–4.24

–4.02

–0.26

–0.03

–1.30

–10.50

–158.20

–166.80

–166.90

–166.80

–158.20

–10.40

–1.30

17.30

27.60

40.20

50.60

60.60

74.00

81.40

80.20

80.80

72.40

64.10

55.70

47.40

0.44

0.70

1.02

1.29

CE#

A10

OE#

A11

1.54

1.88

2.07

2.04

2.05

–1.30

1.84

A13

A14

WE#

–1.30

1.63

–1.30

1.41

–1.30

1.20

Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.

Am29F010 Known Good Die

1/13/98

S U P P L E M E N T

ORDERING INFORMATION

Standard Products

AMD KGD products are available in several packages and operating ranges. The order number (Valid Combination) is formed

by a combination of the following:

-90

Am29F010

DIE REVISION

This number refers to the specific AMD manufacturing

process and product technology reflected in this

document. It is entered in the revision field of AMD

standard product nomenclature.

TEMPERATURE RANGE

C = Commercial (0°C to +70°C)

= Industrial (–40°C to +85°C)

E = Extended (–55°C to +125°C)

PACKAGE TYPE AND MINIMUM ORDER QUANTITY

Waffle Pack

245 die per 5 tray stack

DG = Gel-Pak Die Tray

486 die per 6 tray stack

Surftape™ (Tape and Reel)

2500 per 7-inch reel

DW = Gel-Pak Wafer Tray (sawn wafer on frame)

Call AMD sales office for minimum order quantity

SPEED OPTION

See Valid Combinations

DEVICE NUMBER/DESCRIPTION

Am29F010 Known Good Die

1 Megabit (128 K x 8-Bit) CMOS Flash Memory—Die Revision 1

5.0 Volt-only Program and Erase

Valid Combinations

Valid Combinations list configurations planned to be sup-

ported in volume for this device. Consult the local AMD sales

office to confirm availability of specific valid combinations and

to check on newly released combinations.

Am29F010-90

Am29F010-120

DPC 1, DPI 1, DPE 1,

DGC 1, DGI 1, DGE 1,

DTC 1, DTI 1, DTE 1,

DWC 1, DWI 1, DWE 1

1/13/98

Am29F010 Known Good Die

S U P P L E M E N T

off-line quality monitoring program (QMP) further guar-

PRODUCT TEST FLOW

antees AMD quality standards are met on Known Good

Die products. These QA procedures also allow AMD to

produce KGD products without requiring or imple-

menting burn-in.

Figure 1 provides an overview of AMD’s Known Good

Die test flow. For more detailed information, refer to the

Am29F010 product qualification database supplement

for KGD. AMD implements quality assurance proce-

dures throughout the product test flow. In addition, an

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 1

Data Retention

Bake

24 hours at 250°C

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 2

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 3

High Temperature

Speed

Incoming Inspection

Wafer Saw

Die Separation

100% Visual Inspection

Die Pack

Packaging for Shipment

Shipment

Figure 1. AMD KGD Product Test Flow

Am29F010 Known Good Die

1/13/98

S U P P L E M E N T

PHYSICAL SPECIFICATIONS

MANUFACTURING INFORMATION

Die dimensions . . . . . . . . . . . . . . 174 mils x 189 mils

4.42 mm x 4.80 mm

Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX

Manufacturing ID. . . . . . . . . . . . . . . . . . . . . .98108AK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm

Bond Pad Size . . . . . . . . . . . . . . 4.47 mils x 4.47 mils

113.48 µm x 113.48 µm

Pad Area Free of Passivation . . . . . . . . . .19.98 mils

12,878 µm

SPECIAL HANDLING INSTRUCTIONS

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu

Processing

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

(Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V

Storage

Junction Temperature Under Bias . .T (max) = 130°C

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

For Read-only . . . . . . . . . . .T (max) = 140°C

Operating Temperature . . . Commercial 0°C to +70°C

Industrial –40°C to +85°C

Extended –55°C to +125°C

1/13/98

Am29F010 Known Good Die

S U P P L E M E N T

THIS WARRANTY IS EXPRESSED IN LIEU OF ALL

TERMS AND CONDITIONS OF SALE FOR

AMD NON-VOLATILE MEMORY DIE

OTHER WARRANTIES, EXPRESSED OR IMPLIED,

INCLUDING THE IMPLIED WARRANTY OF FITNESS

FOR A PARTICULAR PURPOSE, THE IMPLIED

WARRANTY OF MERCHANTABILITY AND OF ALL

OTHER OBLIGATIONS OR LIABILITIES ON AMD’S

PART, AND IT NEITHER ASSUMES NOR AUTHO-

RIZES ANY OTHER PERSON TO ASSUME FOR

AMD ANY OTHER LIABILITIES. THE FOREGOING

CONSTITUTES THE BUYERS SOLE AND EXCLU-

SIVE REMEDY FOR THE FURNISHING OF DEFEC-

TIVE OR NON CONFORMING ARTICLES AND AMD

SHALL NOT IN ANY EVENT BE LIABLE FOR

DAMAGES BY REASON OF FAILURE OF ANY

PRODUCT TO FUNCTION PROPERLY OR FOR ANY

SPECIAL, INDIRECT, CONSEQUENTIAL, INCI-

DENTAL OR EXEMPLARY DAMAGES, INCLUDING

BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS

OF USE OR COST OF LABOR BY REASON OF THE

FACT THAT SUCH ARTICLES SHALL HAVE BEEN

DEFECTIVE OR NON CONFORMING.

All transactions relating to AMD Products under this

agreement shall be subject to AMD’s standard terms

and conditions of sale, or any revisions thereof, which

revisions AMD reserves the right to make at any time

and from time to time. In the event of conflict between

the provisions of AMD’s standard terms and conditions

of sale and this agreement, the terms of this agreement

shall be controlling.

AMD warrants articles of its manufacture against

defective materials or workmanship for a period of

ninety (90) days from date of shipment. This warranty

does not extend beyond AMD’s customer, and does

not extend to die which has been affixed onto a board

or substrate of any kind. The liability of AMD under this

warranty is limited, at AMD’s option, solely to repair or

to replacement with equivalent articles, or to make an

appropriate credit adjustment not to exceed the original

sales price, for articles returned to AMD, provided that:

(a) The Buyer promptly notifies AMD in writing of each

and every defect or nonconformity in any article for

which Buyer wishes to make a warranty claim against

AMD; (b) Buyer obtains authorization from AMD to

return the article; (c) the article is returned to AMD,

transportation charges paid by AMD, F.O.B. AMD’s fac-

tory; and (d) AMD’s examination of such article dis-

closes to its satisfaction that such alleged defect or

nonconformity actually exists and was not caused by

negligence, misuse, improper installation, accident or

unauthorized repair or alteration by an entity other than

AMD. The aforementioned provisions do not extend

the original warranty period of any article which has

either been repaired or replaced by AMD.

Buyer agrees that it will make no warranty representa-

tions to its customers which exceed those given by

AMD to Buyer unless and until Buyer shall agree to

indemnify AMD in writing for any claims which exceed

AMD’s warranty. Buyer assumes all responsibility for

successful die prep, die attach and wire bonding pro-

cesses. Due to the unprotected nature of the AMD

Products which are the subject hereof, AMD assumes

no responsibility for environmental effects on die.

AMD products are not designed or authorized for use

as components in life support appliances, devices or

systems where malfunction of a product can reason-

ably be expected to result in a personal injury. Buyer’s

use of AMD products for use in life support applications

is at Buyer’s own risk and Buyer agrees to fully indem-

nify AMD for any damages resulting in such use or

sale.

REVISION SUMMARY FOR AM29F010

KNOWN GOOD DIE

Formatted to match current template. Updated Distinc-

tive Characteristics and General Description sections

using the current main data sheet.

Trademarks

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Am29F010 Known Good Die

1/13/98

AM29F010-90DGC1 [AMD]

相关型号：

AM29F010-90DGE1

AM29F010-90DGI1

AM29F010-90DPC1

AM29F010-90DPE1

AM29F010-90DPI1

AM29F010-90DTC1

AM29F010-90DTE1

AM29F010-90DTI1

AM29F010-90DWC1

AM29F010-90DWE1

AM29F010-90DWI1

AM29F010-90EC