AM29F010B120DWC1 [AMD]

1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1; 1兆位（ 128千×8位） CMOS 5.0伏只，统一部门闪存裸片修订版1


型号：	AM29F010B120DWC1
厂家：	AMD
描述：	1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1 1兆位（ 128千×8位） CMOS 5.0伏只，统一部门闪存裸片修订版1 闪存
文件：	总14页 (文件大小：330K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Am29F010B KGD

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number 23479 Revision A Amendment 0 Issue Date October 23, 2003

THIS PAGE LEFT INTENTIONALLY BLANK.

SUPPLEMENT

Am29F010B Known Good Die

1 Megabit (128 K x 8-Bit)

CMOS 5.0 Volt-only, Uniform Sector Flash Memory—Die Revision 1

DISTINCTIVE CHARACTERISTICS

■ Single power supply operation

■ Embedded Algorithms

— 5.0 V ꢀ0% for read, erase, and program operations

— Simplifies system-level power requirements

— Embedded Erase algorithm automatically

pre-programs and erases the chip or any

combination of designated sector

■ Manufactured on 0.32 µm process technology

— Embedded Program algorithm automatically

programs and verifies data at specified address

— Compatible with Am29F0ꢀ0 and Am29F0ꢀ0A

device

■ Erase Suspend/Resume

■ High performance

— Supports reading data from a sector not

being erased

— 90 or ꢀ20 ns maximum access time

■ Low power consumption

■ Minimum 1,000,000 program/erase cycles

— ꢀ2 mA typical active read current

— 30 mA typical program/erase current

— <ꢀ µA typical standby current

guaranteed

■ 20-year data retention at 125°C

— Reliable operation for the life of the system

■ Flexible sector architecture

— Eight uniform sectors

■ Compatible with JEDEC standards

— Pinout and software compatible with

single-power-supply flash

— Any combination of sectors can be erased

— Supports full chip erase

— Superior inadvertent write protection

■ Sector protection

■ Data# Polling and Toggle Bits

— Hardware-based feature that disables/re-enables

program and erase operations in any

combination of sectors

— Provides a software method of detecting program

or erase cycle completion

■ Tested to datasheet specifications at

— Sector protection/unprotection can be

implemented using standard PROM

programming equipment

temperature

■ Quality and reliability levels equivalent to

standard packaged components

Publication# 23479 Rev: A Amendment/0

Issue Date: October 23, 2003

S U P P L E M E N T

GENERAL DESCRIPTION

The Am29F0ꢀ0B in Known Good Die (KGD) form is a

ꢀ Mbit, 5.0 Volt-only Flash memory. AMD defines KGD

as standard product in die form, tested for functionality

and speed. AMD KGD products have the same reli-

ability and quality as AMD products in packaged form.

automatically times the program pulse widths and

verifies proper cell margin.

Device erasure occurs by executing the erase com-

mand sequence. This invokes the Embedded Erase

algorithm—an internal algorithm that automatically

preprograms the array (if it is not already programmed)

before executing the erase operation. During erase, the

device automatically times the erase pulse widths and

verifies proper cell margin.

The Am29F0ꢀ0B is a ꢀ Mbit, 5.0 Volt-only Flash

memory organized as ꢀ3ꢀ,072 bytes. The Am29F0ꢀ0B

is offered in 32-pin PDIP, PLCC and TSOP packages.

The byte-wide data appears on DQ0-DQ7. The de-

vice is designed to be programmed in-system with the

standard system 5.0 Volt V_CCsupply. A ꢀ2.0 volt V_PPis not

required for program or erase operations. The device can

also be programmed or erased in standard EPROM

programmers.

The host system can detect whether a program or

erase operation is complete by reading the DQ7 (Data#

Polling) and DQ6 (toggle) status bits. After a program

or erase cycle has been completed, the device is ready

to read array data or accept another command.

This device is manufactured using AMD’s 0.32 µm pro-

cess technology, and offers all the features and benefits

of the Am29F0ꢀ0 and Am29F0ꢀ0A.

The sector erase architecture allows memory sectors

to be erased and reprogrammed without affecting the

data contents of other sectors. The device is erased

when shipped from the factory.

The standard device offers access times of 45, 55, 70,

90, and ꢀ20 ns, allowing high-speed microprocessors

to operate without wait states. To eliminate bus conten-

tion the device has separate chip enable (CE#), write

enable (WE#) and output enable (OE#) controls.

The hardware data protection measures include a

low V_CCdetector automatically inhibits write operations

during power transitions. The hardware sector protec-

tion feature disables both program and erase operations

in any combination of the sectors of memory, and is im-

plemented using standard EPROM programmers.

The device requires only a single 5.0 volt power sup-

ply for both read and write functions. Internally

generated and regulated voltages are provided for the

program and erase operations.

The system can place the device into the standby mode.

Power consumption is greatly reduced in this mode.

The device is entirely command set compatible with the

JEDEC single-power-supply Flash standard. Com-

mands are written to the command register using

standard microprocessor write timings. Register con-

tents serve as input to an internal state machine that

controls the erase and programming circuitry. Write

cycles also internally latch addresses and data needed

for the programming and erase operations. Reading

data out of the device is similar to reading from other

Flash or EPROM devices.

AMD’s Flash technology combines years of Flash

memory manufacturing experience to produce the

highest levels of quality, reliability, and cost

effectiveness. The device electrically erases all bits

within a sector simultaneously via Fowler-Nordheim

tunneling. The bytes are programmed one byte at a

time using the EPROM programming mechanism of hot

electron injection.

Electrical Specifications

Device programming occurs by executing the program

command sequence. This invokes the Embedded Pro-

gram algorithm—an internal algorithm that

Refer to the Am29F0ꢀ0B data sheet, publication

number 22336, for full electrical specifications for the

Am29F0ꢀ0B in KGD form.

Am29F010B Known Good Die

S U P P L E M E N T

PRODUCT SELECTOR GUIDE

Family Part Number

Am29F010B KGD

Speed Option (V = 5.0 V ꢀ0%)

-90

-120

ꢀ20

Max Access Time, t

(ns)

ACC

Max CE# Access, t (ns)

Max OE# Access, t (ns)

DIE PHOTOGRAPH

DIE PAD LOCATIONS

30 29 28

27 26

AMD logo location

11 12 13 14 15 16 17 18 19 20 21 22

Am29F010B Known Good Die

S U P P L E M E N T

PAD DESCRIPTION

Pad Center (mils)

Pad Center (millimeters)

Pad

Signal

ꢀ

0.00

Aꢀ6

Aꢀ5

Aꢀ2

–6.78

–ꢀ2.20

–ꢀ8.03

–23.46

–29.29

–34.72

–4ꢀ.75

–4ꢀ.ꢀ4

–4ꢀ.30

–35.88

–30.04

–23.8ꢀ

–ꢀ7.89

–ꢀ2.06

–6.40

–0.59

5.25

0.00

–0.ꢀ7

–0.3ꢀ

–0.46

–0.60

–0.74

–0.88

–ꢀ.06

–ꢀ.04

–ꢀ.05

–0.9ꢀ

–0.76

–0.60

–0.45

–0.3ꢀ

–0.ꢀ6

–0.0ꢀ

0.ꢀ3

0.00

–5.0ꢀ

–0.ꢀ3

–2.97

–3.4ꢀ

–3.39

–3.4ꢀ

–2.97

–0.ꢀ3

–0.0ꢀ

0.00

–ꢀꢀ6.93

–ꢀ34.ꢀ3

–ꢀ33.3ꢀ

–ꢀ34.37

–ꢀ34.ꢀ3

–ꢀꢀ6.93

–5.0ꢀ

ꢀ0

ꢀꢀ

ꢀ2

ꢀ3

ꢀ4

ꢀ5

ꢀ6

ꢀ7

ꢀ8

ꢀ9

2ꢀ

Aꢀ

Dꢀ

ꢀꢀ.ꢀ6

ꢀ7.00

22.92

29.09

35.02

34.68

35.45

29.27

23.34

ꢀ7.92

ꢀ2.08

6.66

0.28

0.43

0.58

CE#

Aꢀ0

OE#

Aꢀꢀ

0.74

0.89

0.88

0.90

–0.25

0.74

0.00

0.59

Aꢀ3

Aꢀ4

WE#

0.00

0.46

0.00

0.3ꢀ

0.00

0.ꢀ7

0.00

Note: The coordinates above are relative to the center of pad ꢀ and can be used to operate wire bonding equipment.

Am29F010B Known Good Die

S U P P L E M E N T

ORDERING INFORMATION

Standard Products

AMD KGD products are available in several packages and operating ranges. The order number (Valid Combination) is formed

by a combination of the following:

Am29F010B

-90

DIE REVISION

This number refers to the specific AMD manufacturing process and

product technology reflected in this document. It is entered in the

revision field of AMD standard product nomenclature.

TEMPERATURE RANGE

=Commercial (0°C to +70°C)

= Industrial (–40°C to +85°C)

=Extended (–55°C to +ꢀ25°C)

PACKAGE TYPE AND MINIMUM ORDER QUANTITY

DP =Waffle Pack

400 die per 5 tray stack

DG =Gel-Pak® Die Tray

648 die per 6 tray stack

DT =Surftape™ (Tape and Reel)

2500 per 7-inch reel

DW = Gel-Pak® Wafer Tray (sawn wafer on frame)

Call AMD sales office for minimum order quantity

SPEED OPTION

See Product Selector Guide and Valid Combinations

DEVICE NUMBER/DESCRIPTION

Am29F0ꢀ0B Known Good Die

ꢀ Megabit (ꢀ28 K x 8-Bit) CMOS Flash Memory—Die Revision ꢀ

5.0 Volt-only Program and Erase

Valid Combinations

Valid Combinations list configurations planned to be sup-

ported in volume for this device. Consult the local AMD sales

office to confirm availability of specific valid combinations and

to check on newly released combinations.

AM29F0ꢀ0B-90

AM29F0ꢀ0B-ꢀ20

DPC ꢀ, DPI ꢀ, DPE ꢀ,

DGC ꢀ, DGI ꢀ, DGE ꢀ,

DTC ꢀ, DTI ꢀ, DTE ꢀ,

DWC ꢀ, DWI ꢀ, DWE ꢀ

Am29F010B Known Good Die

S U P P L E M E N T

PACKAGING INFORMATION

Surftape Packaging

Direction of Feed

AMD logo location

Orientation relative to

leading edge of tape

and reel

Gel-Pak and Waffle Pack Packaging

Orientation relative to

top left corner of

Gel-Pak

AMD logo location

and Waffle Pack

cavity plate

Am29F010B Known Good Die

S U P P L E M E N T

PRODUCT TEST FLOW

Figure ꢀ provides an overview of AMD’s Known Good

Die test flow. For more detailed information, refer to the

Am29F0ꢀ0B product qualification database supple-

ment for KGD. AMD implements quality assurance pro-

cedures throughout the product test flow. In addition,

an off-line quality monitoring program (QMP) further

guarantees AMD quality standards are met on Known

Good Die products. These QA procedures also allow

AMD to produce KGD products without requiring or

implementing burn-in.

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 1

Data Retention

Bake

24 hours at 250°C

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 2

DC Parameters

Functionality

Programmability

Erasability

Wafer Sort 3

High Temperature

Speed

Incoming Inspection

Wafer Saw

Die Separation

ꢀ00% Visual Inspection

Die Pack

Packaging for Shipment

Shipment

Figure 1. AMD KGD Product Test Flow

Am29F010B Known Good Die

S U P P L E M E N T

PHYSICAL SPECIFICATIONS

MANUFACTURING INFORMATION

Die dimensions . . . . . . . . . . . . . . . 90 mils x ꢀ59 mils

2.28 mm x 4.04 mm

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Wafer Sort Test . . . . . . . . . . . . . .Sunnyvale, CA, USA

. . . . . . . . . . . . . . . . . . . . . . . . .and Penang, Malaysia

Die Thickness. . . . . . . . . . . . . . . ~20 mils or ~500 µm

Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils

ꢀꢀ5.9 µm x ꢀꢀ5.9 µm

Manufacturing ID. . . . . . . . . . . . . . . . . . . . . . . . 98A0ꢀ

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ꢀ

Pad Area Free of Passivation . . . . . . . . . .ꢀ3.96 mils²

9,025 µm²

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu

SPECIAL HANDLING INSTRUCTIONS

Processing

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation. . . . . . . . . . . . . . . . . . . . . . . SiN/SOG/SiN

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class ꢀ0K

clean room with 30% to 60% relative humidity.

DC OPERATING CONDITIONS

V_CC(Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V

Junction Temperature Under Bias . .T_J(max) = ꢀ30°C

For Read-only . . . . . . . . . . .T_J(max) = ꢀ40°C

Storage

Operating Temperature . . . Commercial 0°C to +70°C

Industrial –40°C to +85°C

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

Extended –55°C to +ꢀ25°C

Am29F010B Known Good Die

S U P P L E M E N T

WITHOUT LIMITING THE FOREGOING, EXCEPT TO

TERMS AND CONDITIONS OF SALE FOR

AMD NON-VOLATILE MEMORY DIE

THE EXTENT THAT AMD EXPRESSLY WARRANTS

TO BUYER IN A SEPARATE AGREEMENT SIGNED

BY AMD, AMD MAKES NO WARRANTY WITH

RESPECT TO THE DIE’S PROCESSING OF DATE

DATA, AND SHALL HAVE NO LIABILITY FOR

DAMAGES OF ANY KIND, UNDER EQUITY, LAW, OR

ANY OTHER THEORY, DUE TO THE FAILURE OF

SUCH KNOWN GOOD DIE TO PROCESS ANY PAR-

TICULAR DATA CONTAINING DATES, INCLUDING

DATES IN AND AFTER THE YEAR 2000, WHETHER

OR NOT AMD RECEIVED NOTICE OF THE POSSI-

BILITY OF SUCH DAMAGES.

All transactions relating to unpackaged die under this

agreement shall be subject to AMD’s standard terms

and conditions of sale, or any revisions thereof, which

revisions AMD reserves the right to make at any time

and from time to time. In the event of conflict between

the provisions of AMD’s standard terms and conditions

of sale and this agreement, the terms of this agreement

shall be controlling.

AMD warrants unpackaged die of its manufacture

(“Known Good Die” or “Die”) against defective mate-

rials or workmanship for a period of one (ꢀ) year from

date of shipment. This warranty does not extend

beyond the first purchaser of said Die. Buyer assumes

full responsibility to ensure compliance with the

appropriate handling, assembly and processing of

Known Good Die (including but not limited to proper

Die preparation, Die attach, wire bonding and related

assembly and test activities), and compliance with all

guidelines set forth in AMD’s specifications for Known

Good Die, and AMD assumes no responsibility for envi-

ronmental effects on Known Good Die or for any

activity of Buyer or a third party that damages the Die

due to improper use, abuse, negligence, improper

installation, accident, loss, damage in transit, or unau-

thorized repair or alteration by a person or entity other

than AMD (“Warranty Exclusions”).

THIS WARRANTY IS EXPRESSED IN LIEU OF ALL

OTHER WARRANTIES, EXPRESSED OR IMPLIED,

INCLUDING THE IMPLIED WARRANTY OF FITNESS

FOR A PARTICULAR PURPOSE, THE IMPLIED

WARRANTY OF MERCHANTABILITY AND OF ALL

OTHER OBLIGATIONS OR LIABILITIES ON AMD’s

PART, AND IT NEITHER ASSUMES NOR AUTHO-

RIZES ANY OTHER PERSON TO ASSUME FOR

AMD ANY OTHER LIABILITIES. THE FOREGOING

CONSTITUTES THE BUYER’S SOLE AND EXCLU-

SIVE REMEDY FOR THE FURNISHING OF DEFEC-

TIVE OR NON CONFORMING KNOWN GOOD DIE

AND AMD SHALL NOT IN ANY EVENT BE LIABLE

FOR INCREASED MANUFACTURING COSTS,

DOWNTIME COSTS, DAMAGES RELATING TO

BUYER’S PROCUREMENT OF SUBSTITUTE DIE

(i.e., “COST OF COVER”), LOSS OF PROFITS, REV-

ENUES OR GOODWILL, LOSS OF USE OF OR

DAMAGE TO ANY ASSOCIATED EQUIPMENT, OR

ANY OTHER INDIRECT, INCIDENTAL, SPECIAL

OR CONSEQUENTIAL DAMAGES BY REASON OF

THE FACT THAT SUCH KNOWN GOOD DIE SHALL

HAVE BEEN DETERMINED TO BE DEFECTIVE OR

NON CONFORMING.

The liability of AMD under this warranty is limited, at

AMD’s option, solely to repair the Die, to send replace-

ment Die, or to make an appropriate credit adjustment

or refund in an amount not to exceed the original pur-

chase price actually paid for the Die returned to AMD,

provided that: (a) AMD is promptly notified by Buyer in

writing during the applicable warranty period of any

defect or nonconformity in the Known Good Die; (b)

Buyer obtains authorization from AMD to return the

defective Die; (c) the defective Die is returned to AMD

by Buyer in accordance with AMD’s shipping instruc-

tions set forth below; and (d) Buyer shows to AMD’s

satisfaction that such alleged defect or nonconformity

actually exists and was not caused by any of the above-

referenced Warranty Exclusions. Buyer shall ship such

defective Die to AMD via AMD’s carrier, collect. Risk of

loss will transfer to AMD when the defective Die is pro-

vided to AMD’s carrier. If Buyer fails to adhere to these

warranty returns guidelines, Buyer shall assume all risk

of loss and shall pay for all freight to AMD’s specified

location. The aforementioned provisions do not extend

the original warranty period of any Known Good Die

that has either been repaired or replaced by AMD.

Buyer agrees that it will make no warranty representa-

tions to its customers which exceed those given by

AMD to Buyer unless and until Buyer shall agree to

indemnify AMD in writing for any claims which exceed

AMD’s warranty.

Known Good Die are not designed or authorized for

use as components in life support appliances, devices

or systems where malfunction of the Die can reason-

ably be expected to result in a personal injury. Buyer’s

use of Known Good Die for use in life support applica-

tions is at Buyer’s own risk and Buyer agrees to fully

indemnify AMD for any damages resulting in such use

or sale.

Am29F010B Known Good Die

S U P P L E M E N T

REVISION SUMMARY

Revision A+2 (June 27, 2001)

Added Penang, Malaysia, as a test facility (ACN 20ꢀ6).

Revision A+1 (August 4, 2000)

Physical Specifications

Publication Number 23479

Deleted Si from bond pad metalization specification.

Revision A (October 23, 2003)

Changed publication number for document.

Am29F010B Known Good Die

S U P P L E M E N T

Trademarks

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Am29F010B Known Good Die

Representatives in U.S. and Canada

Sales Offices and Representatives

ARIZONA,

North America

Tempe - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(480)839-2320

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Melbourne - Marathon Technical Sales . . . . . . . . . . . . . . . .(321)728-7706

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Cedar Rapids - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . (319)294-1000

KANSAS,

Lenexa - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 3 ) 4 69 - 1 3 1 2

MASSACHUSETTS,

Austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (512)346-7830

Dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(972)985-1344

Houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(281)376-8084

VIRGINIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(703)736-9568

Burlington - Synergy Associates . . . . . . . . . . . . . . . . . . . . .(781)238-0870

MICHIGAN,

Brighton - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(810)227-0007

MINNESOTA,

St. Paul - Cahill, Schmitz & Cahill, Inc. . . . . . . . . . . . . . . . . .(651)699-0200

MISSOURI,

St. Louis - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . . (314)997-4558

NEW JERSEY,

International

AUSTRALIA, North Ryde . . . . . . . . . . . . . . . . . . . . . . .TEL(61)2-88-777-222

BELGIUM,Antwerpen . . . . . . . . . . . . . . . . . . . . . . . .TEL(32)3-248-43-00

BRAZIL, San Paulo . . . . . . . . . . . . . . . . . . . . . . . . . . TEL(55)11-5501-2105

CHINA,

Beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(86)10-6510-2188

Shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(86)21-635-00838

Shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(86)755-246-1550

FINLAND, Helsinki . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 5 8 ) 8 8 1 - 3 1 1 7

FRANCE, Paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 3 ) - 1 - 4 975 1 0 1 0

GERMANY,

Bad Homburg . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(49)-6172-92670

Munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 8 9 - 4 5 0 5 3 0

HONG KONG, Causeway Bay . . . . . . . . . . . . . . . . . . .TEL(85)2-2956-0388

ITALY, Milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 9 ) - 0 2 - 3 8 1 9 6 1

INDIA, New Delhi . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 9 1 ) 1 1 - 62 3 - 8 62 0

JAPAN,

Mt. Laurel - SJ Associates . . . . . . . . . . . . . . . . . . . . . . . . .(856)866-1234

NEWYORK,

Buffalo - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 74 1 - 7 1 1 6

East Syracuse - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . (315)437-8343

Pittsford - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . (716)586-3660

Rockville Centre - SJ Associates . . . . . . . . . . . . . . . . . . . . (516)536-4242

NORTH CAROLINA,

Raleigh - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . .(919)846-5728

OHIO,

Middleburg Hts - Dolfuss Root & Co. . . . . . . . . . . . . . . . . (440)816-1660

Powell - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . . (614)781-0725

Vandalia - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . .(937)898-9610

Westerville - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . (614)523-1990

OREGON,

Lake Oswego - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . .(503)670-0557

UTAH,

Murray - Front Range Marketing . . . . . . . . . . . . . . . . . . . .(801)288-2500

VIRGINIA,

Osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(81)6-6243-3250

Tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(81)3-3346-7600

KOREA, Seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(82)2-3468-2600

RUSSIA, Moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(7)-095-795-06-22

SWEDEN, Stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(46)8-562-540-00

TAIWAN,Taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(886)2-8773-1555

UNITED KINGDOM,

Frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(44)1276-803100

Haydock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(44)1942-272888

Glen Burnie - Coherent Solution, Inc. . . . . . . . . . . . . . . . . ( 4 1 0 ) 76 1 - 2 2 5 5

WASHINGTON,

Kirkland - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . .(425)822-9220

WISCONSIN,

Pewaukee - Industrial Representatives . . . . . . . . . . . . . . . .(262)574-9393

Advanced Micro Devices reserves the right to make changes in its product without notice

in order to improve design or performance characteristics.The performance

characteristics listed in this document are guaranteed by specific tests, guard banding,

design and other practices common to the industry. For specific testing details, contact

your local AMD sales representative.The company assumes no responsibility for the use of

any circuits described herein.

Representatives in Latin America

ARGENTINA,

Capital Federal Argentina/WW Rep. . . . . . . . . . . . . . . . . . . .54-11)4373-0655

CHILE,

Santiago - LatinRep/WWRep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993

COLUMBIA,

Bogota - Dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 7 1 ) 4 1 0 - 4 1 8 2

MEXICO,

Guadalajara - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . .(523)817-3900

Mexico City - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . .(525)752-2727

Monterrey - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . .(528)369-6828

PUERTO RICO,

AMD, the AMD Arrow logo and combination thereof, are trademarks of

Advanced Micro Devices, Inc. Other product names are for informational purposes only

and may be trademarks of their respective companies.

Boqueron - Infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . .(787)851-6000

One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088-3453 408-732-2400

TWX 910-339-9280 TELEX 34-6306 800-538-8450 http://www.amd.com

01/03

Printed in USA

AM29F010B120DWC1 [AMD]

相关型号：

AM29F010B120DWE1

AM29F010B120DWI1

AM29F010B35DGC1

AM29F010B35DGE1

AM29F010B35DGI1

AM29F010B35DPC1

AM29F010B35DPE1

AM29F010B35DPI1

AM29F010B35DTC1

AM29F010B35DTE1

AM29F010B35DTI1

AM29F010B35DWC1