AM29LV320MB110RE_技术文档

DATASHEET

Am29LV320MT/B

32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit

3.0 Volt-only Boot Sector Flash Memory

DISTINCTIVE CHARACTERISTICS

ARCHITECTURAL ADVANTAGES

■ Low power consumption (typical values at 3.0 V, 5

MHz)

■ Single power supply operation

— 3 V for read, erase, and program operations

— 13 mA typical active read current

— 50 mA typical erase/program current

— 1 µA typical standby mode current

■ Manufactured on 0.23 µm MirrorBit process

technology

■ Package options

— 48-pin TSOP

■ SecSi (Secured Silicon) Sector region

— 128-word/256-byte sector for permanent, secure

identification through an 8-word/16-byte random

Electronic Serial Number, accessible through a

command sequence

— 48-ball Fine-pitch BGA

— 64-ball Fortified BGA

SOFTWARE & HARDWARE FEATURES

— May be programmed and locked at the factory or by

the customer

■ Software features

— Program Suspend & Resume: read other sectors

before programming operation is completed

■ Flexible sector architecture

— Sixty-three 32 Kword/64-Kbyte sectors

— Eight 4 Kword/8 Kbyte boot sectors

— Erase Suspend & Resume: read/program other

sectors before an erase operation is completed

■ Compatibility with JEDEC standards

— Data# polling & toggle bits provide status

— Provides pinout and software compatibility for

single-power supply flash, and superior inadvertent

write protection

— Unlock Bypass Program command reduces overall

multiple-word programming time

— CFI (Common Flash Interface) compliant: allows host

system to identify and accommodate multiple flash

devices

■ Minimum 100,000 erase cycle guarantee per sector

■ 20-year data retention at 125°C

■ Hardware features

PERFORMANCE CHARACTERISTICS

■ High performance

— Sector Group Protection: hardware-level method of

preventing write operations within a sector group

— Temporary Sector Unprotect: V_ID-level method of

changing code in locked sectors

— 90 ns access time

— 25 ns page read times

— WP#/ACC input:

— 0.5 s typical sector erase time

Write Protect input (WP#) protects top or bottom two

sectors regardless of sector protection settings

ACC (high voltage) accelerates programming time for

higher throughput during system production

— 15 µs typical effective write buffer word programming

time: 16-word/32-byte write buffer reduces overall

programming time for multiple-word/byte updates

— 4-word/8-byte page read buffer

— 16-word/32-byte write buffer

— Hardware reset input (RESET#) resets device

— Ready/Busy# output (RY/BY#) indicates program or

erase cycle completion

This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data

Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.

Publication# 26518 Rev: B Amendment/0

Issue Date: May 16, 2003

Refer to AMD’s Website (www.amd.com) for the latest information.

D A T A S H E E T

GENERAL DESCRIPTION

The Am29LV320M/TB is a 32 Mbit, 3.0 volt single

power supply flash memory device organized as

2,097,152 words or 4,194,304 bytes. The device has

an 8-bit/16-bit bus and can be programmed either in

the host system or in standard EPROM programmers.

Hardware data protection measures include a low

V_CCdetector that automatically inhibits write opera-

tions during power transitions. The hardware sector

protection feature disables both program and erase

operations in any combination of sectors of memory.

This can be achieved in-system or via programming

equipment.

An access time of 90, 100, 110, or 120 ns is available.

Note that each access time has a specific operating

voltage range (V_CC) and an I/O voltage range (V_IO), as

specified in the Product Selector Guide and the Order-

ing Information sections. The device is offered in a

48-pin TSOP, 48-ball Fine-pitch BGA or 64-ball Forti-

fied BGA package. Each device has separate chip en-

able (CE#), write enable (WE#) and output enable

(OE#) controls.

The Erase Suspend/Erase Resume feature allows

the host system to pause an erase operation in a

given sector to read or program any other sector and

then complete the erase operation. The Program

Suspend/Program Resume feature enables the host

system to pause a program operation in a given sector

to read any other sector and then complete the pro-

gram operation.

Each device requires only a single 3.0 volt power

supply for both read and write functions. In addition to

a V_CCinput, a high-voltage accelerated program

(ACC) function provides shorter programming times

through increased current on the WP#/ACC input. This

feature is intended to facilitate factory throughput dur-

ing system production, but may also be used in the

field if desired.

The hardware RESET# pin terminates any operation

in progress and resets the device, after which it is then

ready for a new operation. The RESET# pin may be

tied to the system reset circuitry. A system reset would

thus also reset the device, enabling the host system to

read boot-up firmware from the Flash memory device.

The device reduces power consumption in the

standby mode when it detects specific voltage levels

on CE# and RESET#, or when addresses have been

stable for a specified period of time.

The device is entirely command set compatible with

the JEDEC single-power-supply Flash standard.

Commands are written to the device using standard

microprocessor write timing. Write cycles also inter-

nally latch addresses and data needed for the pro-

gramming and erase operations.

The Write Protect (WP#) feature protects the top or

bottom two sectors by asserting a logic low on the

WP#/ACC pin. The protected sector will still be pro-

tected even during accelerated programming.

The sector erase architecture allows memory sec-

tors to be erased and reprogrammed without affecting

the data contents of other sectors. The device is fully

erased when shipped from the factory.

The SecSi (Secured Silicon) Sector provides a

128-word/256-byte area for code or data that can be

permanently protected. Once this sector is protected,

no further changes within the sector can occur.

Device programming and erasure are initiated through

command sequences. Once a program or erase oper-

ation has begun, the host system need only poll the

DQ7 (Data# Polling) or DQ6 (toggle) status bits or

monitor the Ready/Busy# (RY/BY#) output to deter-

mine whether the operation is complete. To facilitate

programming, an Unlock Bypass mode reduces com-

mand sequence overhead by requiring only two write

cycles to program data instead of four.

AMD MirrorBit flash technology combines years of

Flash memory manufacturing experience to produce

the highest levels of quality, reliability and cost effec-

tiveness. The device electrically erases all bits within a

sector simultaneously via hot-hole assisted erase. The

data is programmed using hot electron injection.

2

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

MIRRORBIT 32 MBIT DEVICE FAMILY

Device

Bus

Sector Architecture

Packages

V_IO

RY/BY#

WP#, ACC

WP# Protection

40-pin TSOP (std. & rev. pinout),

48-ball FBGA

LV033MU

x8

Uniform (64 Kbyte)

Yes

ACC only

No WP#

Boot (8 x 8 Kbyte

at top & bottom)

48-pin TSOP, 48-ball Fine-pitch BGA,

64-ball Fortified BGA

2 x 8 Kbyte

top or bottom

LV320MT/B

LV320MH/L

x8/x16

No

Yes

WP#/ACC pin

56-pin TSOP (std. & rev. pinout),

64-ball Fortified BGA

1 x 64 Kbyte

high or low

Uniform (64 Kbyte)

Yes

RELATED DOCUMENTS

To download related documents, click on the following

links or go to www.amd.com→Flash Memory→Prod-

uct Information→MirrorBit→Flash Information→Tech-

nical Documentation.

Implementing a Common Layout for AMD MirrorBit

and Intel StrataFlash Memory Devices

Migrating from Single-byte to Three-byte Device IDs

AMD MirrorBit™ White Paper

MirrorBit™ Flash Memory Write Buffer Programming

and Page Buffer Read

May 16, 2003

Am29LV320MT/B

3

D A T A S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6

Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10

Table 1. Device Bus Operations .....................................................10

Requirements for Reading Array Data ...................................10

Writing Commands/Command Sequences ............................11

Automatic Sleep Mode ...........................................................12

RESET#: Hardware Reset Pin ...............................................12

Output Disable Mode .............................................................. 12

Table 2. Am29LV320MT Top Boot Sector Architecture ..................12

Table 3. Am29LV320MB Bottom Boot Sector Architecture .............14

Table 4. Autoselect Codes, (High Voltage Method) .......................16

Sector Group Protection and Unprotection ............................. 17

Table 5. Am29LV320MT Top Boot Sector Protection .....................17

Table 6. Am29LV320MB Bottom Boot Sector Protection ................17

Write Protect (WP#) ................................................................17

Temporary Sector Group Unprotect ....................................... 18

Figure 1. Temporary Sector Group Unprotect Operation................ 18

Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 19

SecSi (Secured Silicon) Sector Flash Memory Region .......... 20

Table 7. SecSi Sector Contents ......................................................20

Figure 3. SecSi Sector Protect Verify.............................................. 21

Hardware Data Protection ......................................................21

Common Flash Memory Interface (CFI). . . . . . . 21

Command Definitions . . . . . . . . . . . . . . . . . . . . . 24

Reading Array Data ................................................................24

Reset Command .....................................................................25

Autoselect Command Sequence ............................................25

Enter SecSi Sector/Exit SecSi Sector Command Sequence ..25

Word/Byte Program Command Sequence ............................. 25

Figure 4. Write Buffer Programming Operation............................... 28

Figure 5. Program Operation .......................................................... 29

Program Suspend/Program Resume Command Sequence ... 29

Figure 6. Program Suspend/Program Resume............................... 30

Chip Erase Command Sequence ........................................... 30

Sector Erase Command Sequence ........................................30

Figure 7. Erase Operation............................................................... 31

Erase Suspend/Erase Resume Commands ........................... 31

Write Operation Status . . . . . . . . . . . . . . . . . . . . 34

DQ7: Data# Polling ................................................................. 34

Figure 8. Data# Polling Algorithm ................................................... 34

DQ6: Toggle Bit I ....................................................................35

Figure 9. Toggle Bit Algorithm......................................................... 36

DQ2: Toggle Bit II ................................................................... 36

Reading Toggle Bits DQ6/DQ2 .............................................. 36

DQ5: Exceeded Timing Limits ................................................ 37

DQ3: Sector Erase Timer ....................................................... 37

DQ1: Write-to-Buffer Abort .....................................................37

Table 14. Write Operation Status ................................................... 37

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 38

Figure 10. Maximum Negative Overshoot Waveform ................... 38

Figure 11. Maximum Positive Overshoot Waveform..................... 38

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 12. Test Setup.................................................................... 40

Table 15. Test Specifications ......................................................... 40

Key to Switching Waveforms. . . . . . . . . . . . . . . . 40

Figure 13. Input Waveforms and

Measurement Levels...................................................................... 40

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 41

Read-Only Operations ...........................................................41

Figure 14. Read Operation Timings ............................................... 41

Figure 15. Page Read Timings ...................................................... 42

Hardware Reset (RESET#) .................................................... 43

Figure 16. Reset Timings ............................................................... 43

Erase and Program Operations ..............................................44

Figure 17. Program Operation Timings.......................................... 45

Figure 18. Accelerated Program Timing Diagram.......................... 45

Figure 19. Chip/Sector Erase Operation Timings .......................... 46

Figure 20. Data# Polling Timings (During Embedded Algorithms). 47

Figure 21. Toggle Bit Timings (During Embedded Algorithms)...... 48

Figure 22. DQ2 vs. DQ6................................................................. 48

Temporary Sector Unprotect .................................................. 49

Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 49

Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 50

Alternate CE# Controlled Erase and Program Operations ..... 51

Figure 25. Alternate CE# Controlled Write (Erase/Program)

Operation Timings.......................................................................... 52

Erase And Programming Performance. . . . . . . . 53

Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 53

TSOP Pin and BGA Package Capacitance . . . . . 54

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 55

TS 048—48-Pin Standard Pinout Thin Small Outline Package

(TSOP) ................................................................................... 55

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 56

TS 048—48-Pin Standard Pinout Thin Small Outline Package

(TSOP) ................................................................................... 56

FBC048—48-Ball Fine-pitch Ball Grid Array (fBGA)

9 x 8 mm Package ..................................................................57

Physical Dimensions

LAA064—64-Ball Fortified Ball Grid Array (FBGA)

13 x 11 mm Package. . . . . . . . . . . . . . . . . . . . . . . 58

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 60

4

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

PRODUCT SELECTOR GUIDE

Part Number

Am29LV320MT/B

V

_CC= 3.0–3.6 V

90R

100R

100

30

110R

120R

Speed

Option

V_CC= 2.7–3.6 V

110

120

Max. Access Time (ns)

90

25

110

120

Max. CE# Access Time (ns)

Max. Page access time (t_PACC

Max. OE# Access Time (ns)

)

30

40

30

40

30

Note: See “AC Characteristics” for full specifications.

BLOCK DIAGRAM

DQ0–DQ15 (A-1)

RY/BY#

V_CC

Sector Switches

V_SS

Erase Voltage

Generator

Input/Output

Buffers

RESET#

WE#

State

WP#/ACC

Control

BYTE#

Command

Register

PGM Voltage

Generator

Data

Latch

Chip Enable

Output Enable

Logic

STB

CE#

OE#

Y-Decoder

X-Decoder

Y-Gating

STB

V_CCDetector

Timer

Cell Matrix

A20–A0

May 16, 2003

Am29LV320MT/B

5

D A T A S H E E T

CONNECTION DIAGRAMS

A15

A14

A13

A12

A11

A10

A9

A8

A19

1

2

3

4

5

6

7

8

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

A16

BYTE#

V_SS

DQ15/A-1

DQ7

DQ14

DQ6

DQ13

DQ5

48-Pin Standard TSOP

9

A20

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

DQ12

DQ4

V_CC

WE#

RESET#

NC

WP#/ACC

RY/BY#

A18

DQ11

DQ3

DQ10

DQ2

DQ9

DQ1

DQ8

DQ0

OE#

V_SS

CE#

A0

A17

A7

A6

A5

A4

A3

A2

A1

48-ball Fine-pitch BGA

Top View, Balls Facing Down

A6

B6

C6

D6

E6

F6

G6

H6

V_SS

A13

A12

A14

A15

A16

BYTE# DQ15/A-1

A5

A9

B5

A8

C5

D5

E5

F5

G5

H5

A10

A11

DQ7

DQ14

DQ13

DQ6

A4

B4

C4

D4

E4

F4

G4

H4

V_CC

WE# RESET#

NC

A19

DQ5

DQ12

DQ4

A3 B3

C3

D3

E3

F3

G3

H3

RY/BY# WP#/ACC A18

A20

DQ2

DQ10

DQ11

DQ3

A2

A7

B2

C2

A6

D2

A5

E2

F2

G2

H2

A17

DQ0

DQ8

DQ9

DQ1

A1

A3

B1

A4

C1

A2

D1

A1

E1

A0

F1

G1

H1

V_SS

CE#

OE#

6

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

CONNECTION DIAGRAMS

64-Ball Fortified BGA

Top View, Balls Facing Down

A8

B8

C8

D8

E8

F8

G8

NC

H8

NC

V_SS

NC

A7

B7

C7

D7

E7

F7

G7

H7

A13

A12

A14

A15

A16

BYTE# DQ15/A-1 V_SS

A6

A9

B6

A8

C6

D6

E6

F6

G6

H6

DQ6

A10

A11

DQ7

DQ14

DQ13

A5

B5

C5

D5

E5

F5

G5

H5

WE# RESET#

NC

A19

DQ5

DQ12

V_CC

DQ4

A4 B4

C4

D4

E4

F4

G4

H4

RY/BY# WP#/ACC A18

A20

DQ2

DQ10

DQ11

DQ3

A3

A7

B3

C3

A6

D3

A5

E3

F3

G3

H3

A17

DQ0

DQ8

DQ9

DQ1

A2

A3

B2

A4

C2

A2

D2

A1

E2

A0

F2

G2

H2

CE#

OE#

V_SS

A1

B1

C1

D1

E1

F1

G1

NC

H1

NC

and/or data integrity may be compromised if the

package body is exposed to temperatures above 150°C

for prolonged periods of time.

Special Package Handling Instructions

Special handling is required for Flash Memory products

in molded packages (TSOP and BGA). The package

May 16, 2003

Am29LV320MT/B

7

D A T A S H E E T

PIN DESCRIPTION

LOGIC SYMBOL

A20–A0

= 21 Address inputs

21

DQ14–DQ0 = 15 Data inputs/outputs

A20–A0

16 or 8

DQ15/A-1

= DQ15 (Data input/output, word mode),

DQ15–DQ0

(A-1)

CE#

OE#

WE#

A-1 (LSB Address input, byte mode)

CE#

OE#

WE#

= Chip Enable input

= Output Enable input

WP#/ACC

RESET#

BYTE#

= Write Enable input

WP#/ACC = Hardware Write Protect input/Pro-

gramming Acceleration input

RY/BY#

RESET#

RY/BY#

BYTE#

V_CC

= Hardware Reset Pin input

= Ready/Busy output

= Selects 8-bit or 16-bit mode

= 3.0 volt-only single power supply

(see Product Selector Guide for

speed options and voltage

supply tolerances)

V_SS

NC

= Device Ground

= Pin Not Connected Internally

8

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

ORDERING INFORMATION

Standard Products

AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is

formed by a combination of the following:

Am29LV320M

T

120R

PC

I

TEMPERATURE RANGE

Industrial (–40°C to +85°C)

I

=

PACKAGE TYPE

E

=

48-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 048)

PC

64-Ball Fortified Ball Grid Array (FBGA),

1.0 mm pitch, 13 x 11 mm package (LAA064)

WC

=

48-Ball Fine Pitch Ball Grid Array (FBGA),

0.80 mm pitch, 9 x 8 mm package (FBC048)

SPEED OPTION

See Product Selector Guide and Valid Combinations

SECTOR ARCHITECTURE AND WP# PROTECTION (WP# = V_IL)

T

B

=

Top boot sector device, top two address sectors protected

Bottom boot sector device, bottom two address sectors protected

DEVICE NUMBER/DESCRIPTION

Am29LV320MT/B

32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit Boot Sector Flash Memory

3.0 Volt-only Read, Program, and Erase

Valid Combinations for

TSOP Package

Speed

(ns)

V_CC

Range

Valid Combinations for

BGA Packages

Speed

(ns)

V_CC

Range

Am29LV320MT90R,

Am29LV320MB90R

Order Number

Package Marking

WCI L320MT90QI

90

3.0–3.6 V

Am29LV320MT90R

Am29LV320MB90R

Am29LV320MT100

Am29LV320MB100

Am29LV320MT110

Am29LV320MB110

Am29LV320MT120

Am29LV320MB120

Am29LV320MT100R

Am29LV320MB100R

Am29LV320MT110R

Am29LV320MB110R

Am29LV320MT120R

Am29LV320MB120R

Am29LV320MT100,

Am29LV320MB100

PCI L320MT90NI

WCI L320MB90QI

PCI L320MB10NI

WCI L320MT10UI

PCI L320MT10PI

WCI L320MB10UI

PCI L320MB10PI

WCI L320MT11UI

PCI L320MT11PI

WCI L320MB11UI

PCI L320MB11PI

WCI L320MT12UI

PCI L320MT12PI

WCI L320MB12UI

PCI L320MB12PI

WCI L320MT10QI

PCI L320MT10NI

WCI L320MB10QI

PCI L320MB10NI

WCI L320MT11QI

PCI L320MT11NI

WCI L320MB11QI

PCI L320MB11NI

WCI L320MT12QI

PCI L320MT12NI

WCI L320MB12QI

PCI L320MB12NI

100

110

120

100

110

120

3.0–

3.6 V

90

Am29LV320MT110,

Am29LV320MB110

2.7–3.6 V

Am29LV320MT120,

Am29LV320MB120

EI

100

110

120

100

110

120

Am29LV320MT100R,

Am29LV320MB100R

Am29LV320MT110R,

Am29LV320MB110R

3.0–3.6 V

2.7–

3.6 V

Am29LV320MT120R,

Am29LV320MB120R

Valid Combinations

Valid Combinations list configurations planned to be supported in vol-

ume for this device. Consult the local AMD sales office to confirm

availability of specific valid combinations and to check on newly re-

leased combinations.

3.0–

3.6 V

3.0–

3.6 V

May 16, 2003

Am29LV320MT/B

9

D A T A S H E E T

DEVICE BUS OPERATIONS

This section describes the requirements and use of

the device bus operations, which are initiated through

the internal command register. The command register

itself does not occupy any addressable memory loca-

tion. The register is a latch used to store the com-

mands, along with the address and data information

needed to execute the command. The contents of the

register serve as inputs to the internal state machine.

The state machine outputs dictate the function of the

device. Table 1 lists the device bus operations, the in-

puts and control levels they require, and the resulting

output. The following subsections describe each of

these operations in further detail.

Table 1. Device Bus Operations

DQ8–DQ15

DQ0–

DQ7

BYTE#

= V_IH

BYTE#

= V_IL

Addresses

(Note 2)

Operation

CE# OE# WE# RESET#

WP#

X

ACC

X

Read

L

H

L

H

A_IN

D_OUT

DQ8–DQ14

= High-Z,

DQ15 = A-1

Write (Program/Erase)

Accelerated Program

(Note 3)

X

(Note 4) (Note 4)

L

H

V_HH

V_CC

0.3 V

±

V_CC±

0.3 V

Standby

X

H

X

High-Z High-Z

High-Z

Output Disable

Reset

L

H

X

H

X

H

L

X

High-Z High-Z

High-Z

X

SA, A6 =L,

A3=L, A2=L, (Note 4)

A1=H, A0=L

Sector Group Protect

(Note 2)

L

H

L

V_ID

H

X

SA, A6=H,

A3=L, A2=L, (Note 4)

A1=H, A0=L

Sector Group Unprotect

(Note 2)

L

H

X

L

V_ID

H

X

Temporary Sector Group

Unprotect

X

A_IN

(Note 4) (Note 4)

High-Z

Legend: L = Logic Low = V_IL, H = Logic High = V_IH, V_ID= 11.5–12.5 V, V_HH= 11.5–12.5 V, X = Don’t Care, SA = Sector Address,

A_IN= Address In, D_IN= Data In, D_OUT= Data Out

Notes:

1. Addresses are A20:A0 in word mode; A20:A-1 in byte mode. Sector addresses are A20:A12 in both modes.

2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector Group

Protection and Unprotection” section.

3. If WP# = V_IL, the first or last sector remains protected. If WP# = V_IH, the top two or bottom two sectors will be protected or

unprotected as determined by the method described in “Sector Group Protection and Unprotection”. All sectors are unprotected

when shipped from the factory (The SecSi Sector may be factory protected depending on version ordered.)

4. D_INor D_OUTas required by command sequence, data polling, or sector protect algorithm (see Figure 2).

pins DQ8–DQ14 are tri-stated, and the DQ15 pin is

used as an input for the LSB (A-1) address function.

Word/Byte Configuration

The BYTE# pin controls whether the device data I/O

pins operate in the byte or word configuration. If the

Requirements for Reading Array Data

BYTE# pin is set at logic ‘1’, the device is in word con-

To read array data from the outputs, the system must

drive the CE# and OE# pins to V_IL. CE# is the power

control and selects the device. OE# is the output con-

trol and gates array data to the output pins. WE#

should remain at V_IH.

figuration, DQ0–DQ15 are active and controlled by

CE# and OE#.

If the BYTE# pin is set at logic ‘0’, the device is in byte

configuration, and only data I/O pins DQ0–DQ7 are

active and controlled by CE# and OE#. The data I/O

10

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

The internal state machine is set for reading array data

acteristics section contains timing specification tables

and timing diagrams for write operations.

upon device power-up, or after a hardware reset. This

ensures that no spurious alteration of the memory

content occurs during the power transition. No com-

mand is necessary in this mode to obtain array data.

Standard microprocessor read cycles that assert valid

addresses on the device address inputs produce valid

data on the device data outputs. The device remains

enabled for read access until the command register

contents are altered.

Write Buffer

Write Buffer Programming allows the system to write a

maximum of 16 words/32 bytes in one programming

operation. This results in faster effective programming

time than the standard programming algorithms. See

“Write Buffer” for more information.

Accelerated Program Operation

See “Reading Array Data” for more information. Refer

to the AC Read-Only Operations table for timing spec-

ifications and to Figure 14 for the timing diagram.

Refer to the DC Characteristics table for the active

current specification on reading array data.

The device offers accelerated program operations

through the ACC function. This is one of two functions

provided by the WP#/ACC pin. This function is prima-

rily intended to allow faster manufacturing throughput

at the factory.

Page Mode Read

If the system asserts V_HHon this pin, the device auto-

matically enters the aforementioned Unlock Bypass

mode, temporarily unprotects any protected sectors,

and uses the higher voltage on the pin to reduce the

time required for program operations. The system

would use a two-cycle program command sequence

as required by the Unlock Bypass mode. Removing

V_HHfrom the WP#/ACC pin returns the device to nor-

mal operation. Note that the WP#/ACC pin must not

be at V_HHfor operations other than accelerated pro-

gramming, or device damage may result. In addition,

no external pullup is necessary since the WP#/ACC

The device is capable of fast page mode read and is

compatible with the page mode Mask ROM read oper-

ation. This mode provides faster read access speed

for random locations within a page. The page size of

the device is 4 words/8 bytes. The appropriate page is

selected by the higher address bits A(max)–A2. Ad-

dress bits A1–A0 in word mode (A1–A-1 in byte mode)

determine the specific word within a page. This is an

asynchronous operation; the microprocessor supplies

the specific word location.

The random or initial page access is equal to t_ACCor

t_CEand subsequent page read accesses (as long as

the locations specified by the microprocessor falls

within that page) is equivalent to t_PACC. When CE# is

deasserted and reasserted for a subsequent access,

the access time is t_ACCor t_CE. Fast page mode ac-

cesses are obtained by keeping the “read-page ad-

dresses” constant and changing the “intra-read page”

addresses.

pin has internal pullup to V_CC

.

Autoselect Functions

If the system writes the autoselect command se-

quence, the device enters the autoselect mode. The

system can then read autoselect codes from the inter-

nal register (which is separate from the memory array)

on DQ7–DQ0. Standard read cycle timings apply in

this mode. Refer to the Autoselect Mode and Autose-

lect Command Sequence sections for more informa-

tion.

Writing Commands/Command Sequences

To write a command or command sequence (which in-

cludes programming data to the device and erasing

sectors of memory), the system must drive WE# and

CE# to V_IL, and OE# to V_IH.

Standby Mode

When the system is not reading or writing to the de-

vice, it can place the device in the standby mode. In

this mode, current consumption is greatly reduced,

and the outputs are placed in the high impedance

state, independent of the OE# input.

The device features an Unlock Bypass mode to facil-

itate faster programming. Once the device enters the

Unlock Bypass mode, only two write cycles are re-

quired to program a word or byte, instead of four. The

“Word/Byte Program Command Sequence” section

has details on programming data to the device using

both standard and Unlock Bypass command se-

quences.

The device enters the CMOS standby mode when the

CE# and RESET# pins are both held at V_CC± 0.3 V.

(Note that this is a more restricted voltage range than

V_IH.) If CE# and RESET# are held at V_IH, but not within

V_CC± 0.3 V, the device will be in the standby mode,

but the standby current will be greater. The device re-

quires standard access time (t_CE) for read access

when the device is in either of these standby modes,

before it is ready to read data.

An erase operation can erase one sector, multiple sec-

tors, or the entire device. Tables 3 and 2 indicates the

address space that each sector occupies.

Refer to the DC Characteristics table for the active

current specification for the write mode. The AC Char-

May 16, 2003

Am29LV320MT/B

11

D A T A S H E E T

If the device is deselected during erasure or program-

read/write commands for the duration of the RESET#

pulse. The device also resets the internal state ma-

chine to reading array data. The operation that was in-

terrupted should be reinitiated once the device is

ready to accept another command sequence, to en-

sure data integrity.

ming, the device draws active current until the

operation is completed.

Refer to the DC Characteristics table for the standby

current specification.

Automatic Sleep Mode

Current is reduced for the duration of the RESET#

pulse. When RESET# is held at V_SS±0.3 V, the device

draws CMOS standby current (I_CC4). If RESET# is held

at V_ILbut not within V_SS±0.3 V, the standby current will

be greater.

The automatic sleep mode minimizes Flash device en-

ergy consumption. The device automatically enables

this mode when addresses remain stable for t_ACC

30 ns. The automatic sleep mode is independent of

the CE#, WE#, and OE# control signals. Standard ad-

dress access timings provide new data when ad-

dresses are changed. While in sleep mode, output

data is latched and always available to the system.

Refer to the DC Characteristics table for the automatic

sleep mode current specification.

+

The RESET# pin may be tied to the system reset cir-

cuitry. A system reset would thus also reset the Flash

memory, enabling the system to read the boot-up firm-

ware from the Flash memory.

Refer to the AC Characteristics tables for RESET# pa-

rameters and to Figure 16 for the timing diagram.

RESET#: Hardware Reset Pin

Output Disable Mode

The RESET# pin provides a hardware method of re-

setting the device to reading array data. When the RE-

SET# pin is driven low for at least a period of t_RP, the

device immediately terminates any operation in

progress, tristates all output pins, and ignores all

When the OE# input is at V_IH, output from the device is

disabled. The output pins are placed in the high

impedance state.

Table 2. Am29LV320MT Top Boot Sector Architecture

Sector Address

Sector Size

(Kbytes/Kwords)

(x8)

Address Range

(x16)

Address Range

Sector

A20–A12

000000xxx

000001xxx

000010xxx

000011xxx

000100xxx

000101xxx

000110xxx

000111xxx

001000xxx

001001xxx

001010xxx

001011xxx

001100xxx

001101xxx

001111xxx

010000xxx

010001xxx

010010xxx

010011xxx

010100xxx

010101xxx

010110xxx

010111xxx

011000xxx

011001xxx

011010xxx

011011xxx

SA0

SA1

64/32

000000h–00FFFFh

010000h–01FFFFh

020000h–02FFFFh

030000h–03FFFFh

040000h–04FFFFh

050000h–05FFFFh

060000h–06FFFFh

070000h–07FFFFh

080000h–08FFFFh

090000h–09FFFFh

0A0000h–0AFFFFh

0B0000h–0BFFFFh

0C0000h–0CFFFFh

0D0000h–0DFFFFh

0E0000h–0EFFFFh

0F0000h–0FFFFFh

100000h–00FFFFh

110000h–11FFFFh

120000h–12FFFFh

130000h–13FFFFh

140000h–14FFFFh

150000h–15FFFFh

160000h–16FFFFh

170000h–17FFFFh

180000h–18FFFFh

190000h–19FFFFh

1A0000h–1AFFFFh

1B0000h–1BFFFFh

00000h–07FFFh

08000h–0FFFFh

10000h–17FFFh

18000h–1FFFFh

20000h–27FFFh

28000h–2FFFFh

30000h–37FFFh

38000h–3FFFFh

40000h–47FFFh

48000h–4FFFFh

50000h–57FFFh

58000h–5FFFFh

60000h–67FFFh

68000h–6FFFFh

70000h–77FFFh

78000h–7FFFFh

80000h–87FFFh

88000h–8FFFFh

90000h–97FFFh

98000h–9FFFFh

A0000h–A7FFFh

A8000h–AFFFFh

B0000h–B7FFFh

B8000h–BFFFFh

C0000h–C7FFFh

C8000h–CFFFFh

D0000h–D7FFFh

D8000h–DFFFFh

SA2

SA3

SA4

SA5

SA6

SA7

SA8

SA9

SA10

SA11

SA12

SA13

SA14

SA15

SA16

SA17

SA18

SA19

SA20

SA21

SA22

SA23

SA24

SA25

SA26

SA27

12

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

Table 2. Am29LV320MT Top Boot Sector Architecture (Continued)

Sector Address

A20–A12

Sector Size

(Kbytes/Kwords)

(x8)

(x16)

Address Range

Sector

Address Range

SA28

SA29

SA30

SA31

SA32

SA33

SA34

SA35

SA36

SA37

SA38

SA39

SA40

SA41

SA42

SA43

SA44

SA45

SA46

SA47

SA48

SA49

SA50

SA51

SA52

SA53

SA54

SA55

SA56

SA57

SA58

SA59

SA60

SA61

SA62

SA63

SA64

SA65

SA66

SA67

SA68

SA69

SA70

011000xxx

011101xxx

011110xxx

011111xxx

100000xxx

100001xxx

100010xxx

101011xxx

100100xxx

100101xxx

100110xxx

100111xxx

101000xxx

101001xxx

101010xxx

101011xxx

101100xxx

101101xxx

101110xxx

101111xxx

110000xxx

110001xxx

110010xxx

110011xxx

100100xxx

110101xxx

110110xxx

110111xxx

111000xxx

111001xxx

111010xxx

111011xxx

111100xxx

111101xxx

111110xxx

111111000

111111001

111111010

111111011

111111100

111111101

111111110

111111111

64/32

8/4

1C0000h–1CFFFFh

1D0000h–1DFFFFh

1E0000h–1EFFFFh

1F0000h–1FFFFFh

200000h–20FFFFh

210000h–21FFFFh

220000h–22FFFFh

230000h–23FFFFh

240000h–24FFFFh

250000h–25FFFFh

260000h–26FFFFh

270000h–27FFFFh

280000h–28FFFFh

290000h–29FFFFh

2A0000h–2AFFFFh

2B0000h–2BFFFFh

2C0000h–2CFFFFh

2D0000h–2DFFFFh

2E0000h–2EFFFFh

2F0000h–2FFFFFh

300000h–30FFFFh

310000h–31FFFFh

320000h–32FFFFh

330000h–33FFFFh

340000h–34FFFFh

350000h–35FFFFh

360000h–36FFFFh

370000h–37FFFFh

380000h–38FFFFh

390000h–39FFFFh

3A0000h–3AFFFFh

3B0000h–3BFFFFh

3C0000h–3CFFFFh

3D0000h–3DFFFFh

3E0000h–3EFFFFh

3F0000h–3F1FFFh

3F2000h–3F3FFFh

3F4000h–3F5FFFh

3F6000h–3F7FFFh

3F8000h–3F9FFFh

3FA000h–3FBFFFh

3FC000h–3FDFFFh

3FE000h–3FFFFFh

E0000h–E7FFFh

E8000h–EFFFFh

F0000h–F7FFFh

F8000h–FFFFFh

F9000h–107FFFh

108000h–10FFFFh

110000h–117FFFh

118000h–11FFFFh

120000h–127FFFh

128000h–12FFFFh

130000h–137FFFh

138000h–13FFFFh

140000h–147FFFh

148000h–14FFFFh

150000h–157FFFh

158000h–15FFFFh

160000h–167FFFh

168000h–16FFFFh

170000h–177FFFh

178000h–17FFFFh

180000h–187FFFh

188000h–18FFFFh

190000h–197FFFh

198000h–19FFFFh

1A0000h–1A7FFFh

1A8000h–1AFFFFh

1B0000h–1B7FFFh

1B8000h–1BFFFFh

1C0000h–1C7FFFh

1C8000h–1CFFFFh

1D0000h–1D7FFFh

1D8000h–1DFFFFh

1E0000h–1E7FFFh

1E8000h–1EFFFFh

1F0000h–1F7FFFh

1F8000h–1F8FFFh

1F9000h–1F9FFFh

1FA000h–1FAFFFh

1FB000h–1FBFFFh

1FC000h–1FCFFFh

1FD000h–1FDFFFh

1FE000h–1FEFFFh

1FF000h–1FFFFFh

8/4

May 16, 2003

Am29LV320MT/B

13

D A T A S H E E T

Table 3. Am29LV320MB Bottom Boot Sector Architecture

Sector Address

A20–A12

Sector Size

(Kbytes/Kwords)

(x8)

(x16)

Address Range

Sector

Address Range

SA0

SA1

000000000

000000001

000000010

000000011

000000100

000000101

000000110

000000111

000001xxx

000010xxx

000011xxx

000100xxx

000101xxx

000110xxx

000111xxx

001000xxx

001001xxx

001010xxx

001011xxx

001100xxx

001101xxx

001111xxx

010000xxx

010001xxx

010010xxx

010011xxx

010100xxx

010101xxx

010110xxx

010111xxx

011000xxx

011001xxx

011010xxx

011011xxx

011000xxx

011101xxx

011110xxx

011111xxx

100000xxx

100001xxx

100010xxx

101011xxx

100100xxx

100101xxx

100110xxx

100111xxx

101000xxx

101001xxx

101010xxx

101011xxx

101100xxx

101101xxx

101110xxx

8/4

000000h–001FFFh

002000h–003FFFh

004000h–005FFFh

006000h–007FFFh

008000h–009FFFh

00A000h–00BFFFh

00C000h–00DFFFh

00E000h–00FFFFFh

010000h–01FFFFh

020000h–02FFFFh

030000h–03FFFFh

040000h–04FFFFh

050000h–05FFFFh

060000h–06FFFFh

070000h–07FFFFh

080000h–08FFFFh

090000h–09FFFFh

0A0000h–0AFFFFh

0B0000h–0BFFFFh

0C0000h–0CFFFFh

0D0000h–0DFFFFh

0E0000h–0EFFFFh

0F0000h–0FFFFFh

100000h–00FFFFh

110000h–11FFFFh

120000h–12FFFFh

130000h–13FFFFh

140000h–14FFFFh

150000h–15FFFFh

160000h–16FFFFh

170000h–17FFFFh

180000h–18FFFFh

190000h–19FFFFh

1A0000h–1AFFFFh

1B0000h–1BFFFFh

1C0000h–1CFFFFh

1D0000h–1DFFFFh

1E0000h–1EFFFFh

1F0000h–1FFFFFh

200000h–20FFFFh

210000h–21FFFFh

220000h–22FFFFh

230000h–23FFFFh

240000h–24FFFFh

250000h–25FFFFh

260000h–26FFFFh

270000h–27FFFFh

280000h–28FFFFh

290000h–29FFFFh

2A0000h–2AFFFFh

2B0000h–2BFFFFh

2C0000h–2CFFFFh

2D0000h–2DFFFFh

2E0000h–2EFFFFh

00000h–00FFFh

01000h–01FFFh

02000h–02FFFh

03000h–03FFFh

04000h–04FFFh

05000h–05FFFh

06000h–06FFFh

07000h–07FFFh

08000h–0FFFFh

10000h–17FFFh

18000h–1FFFFh

20000h–27FFFh

28000h–2FFFFh

30000h–37FFFh

38000h–3FFFFh

40000h–47FFFh

48000h–4FFFFh

50000h–57FFFh

58000h–5FFFFh

60000h–67FFFh

68000h–6FFFFh

70000h–77FFFh

78000h–7FFFFh

80000h–87FFFh

88000h–8FFFFh

90000h–97FFFh

98000h–9FFFFh

A0000h–A7FFFh

A8000h–AFFFFh

B0000h–B7FFFh

B8000h–BFFFFh

C0000h–C7FFFh

C8000h–CFFFFh

D0000h–D7FFFh

D8000h–DFFFFh

E0000h–E7FFFh

E8000h–EFFFFh

F0000h–F7FFFh

F8000h–FFFFFh

F9000h–107FFFh

108000h–10FFFFh

110000h–117FFFh

118000h–11FFFFh

120000h–127FFFh

128000h–12FFFFh

130000h–137FFFh

138000h–13FFFFh

140000h–147FFFh

148000h–14FFFFh

150000h–157FFFh

158000h–15FFFFh

160000h–167FFFh

168000h–16FFFFh

170000h–177FFFh

8/4

SA2

8/4

SA3

8/4

SA4

8/4

SA5

8/4

SA6

8/4

SA7

8/4

SA8

64/32

SA9

SA10

SA11

SA12

SA13

SA14

SA15

SA16

SA17

SA18

SA19

SA20

SA21

SA22

SA23

SA24

SA25

SA26

SA27

SA28

SA29

SA30

SA31

SA32

SA33

SA34

SA35

SA36

SA37

SA38

SA39

SA40

SA41

SA42

SA43

SA44

SA45

SA46

SA47

SA48

SA49

SA50

SA51

SA52

SA53

14

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

Table 3. Am29LV320MB Bottom Boot Sector Architecture (Continued)

Sector Address

A20–A12

Sector Size

(Kbytes/Kwords)

(x8)

(x16)

Address Range

Sector

Address Range

SA54

SA55

SA56

SA57

SA58

SA59

SA60

SA61

SA62

SA63

SA64

SA65

SA66

SA67

SA68

SA69

SA70

101111xxx

110000xxx

110001xxx

110010xxx

110011xxx

100100xxx

110101xxx

110110xxx

110111xxx

111000xxx

111001xxx

111010xxx

111011xxx

111100xxx

111101xxx

111110xxx

111111xxx

64/32

2F0000h–2FFFFFh

300000h–30FFFFh

310000h–31FFFFh

320000h–32FFFFh

330000h–33FFFFh

340000h–34FFFFh

350000h–35FFFFh

360000h–36FFFFh

370000h–37FFFFh

380000h–38FFFFh

390000h–39FFFFh

3A0000h–3AFFFFh

3B0000h–3BFFFFh

3C0000h–3CFFFFh

3D0000h–3DFFFFh

3E0000h–3EFFFFh

3F0000h–3FFFFFh

178000h–17FFFFh

180000h–187FFFh

188000h–18FFFFh

190000h–197FFFh

198000h–19FFFFh

1A0000h–1A7FFFh

1A8000h–1AFFFFh

1B0000h–1B7FFFh

1B8000h–1BFFFFh

1C0000h–1C7FFFh

1C8000h–1CFFFFh

1D0000h–1D7FFFh

1D8000h–1DFFFFh

1E0000h–1E7FFFh

1E8000h–1EFFFFh

1F0000h–1F7FFFh

1F8000h–1FFFFFh

Note: The address range is A20:A-1 in byte mode (BYTE# = V_IL) or A20:A0 in word mode (BYTE# = V_IH)

May 16, 2003

Am29LV320MT/B

15

D A T A S H E E T

In addition, when verifying sector protection, the sector

Autoselect Mode

address must appear on the appropriate highest order

address bits (see Tables 2 and 3). Table 4 shows the

remaining address bits that are don’t care. When all

necessary bits have been set as required, the pro-

gramming equipment may then read the correspond-

ing identifier code on DQ7–DQ0.

The autoselect mode provides manufacturer and de-

vice identification, and sector protection verification,

through identifier codes output on DQ7–DQ0. This

mode is primarily intended for programming equip-

ment to automatically match a device to be pro-

grammed with its corresponding programming

algorithm. However, the autoselect codes can also be

accessed in-system through the command register.

To access the autoselect codes in-system, the host

system can issue the autoselect command via the

command register, as shown in Tables 12 and 13. This

method does not require V_ID. Refer to the Autoselect

Command Sequence section for more information.

When using programming equipment, the autoselect

mode requires V_IDon address pin A9. Address pins

A6, A3, A2, A1, and A0 must be as shown in Table 4.

Table 4. Autoselect Codes, (High Voltage Method)

DQ8 to DQ15

A21 A14

A8

A9 to A6

A7

A5 A3

to to

A4 A2

Description

CE# OE# WE# to

to

A1 A0

DQ7 to DQ0

BYTE# BYTE#

A15 A10

= V_IH

= V_IL

V_ID

Manufacturer ID: AMD

Cycle 1

L

H

X

L

X

L

H

L

00

X

01h

7Eh

1Ah

22

X

Cycle 2

H

22

X

V_ID

X

L

X

00 (bottom boot)

01h (top boot)

Cycle 3

H

L

H

L

22

X

Sector Protection

Verification

01h (protected),

00h (unprotected)

V_ID

L

H

SA

X

L

X

SecSi Sector Indicator

Bit (DQ7), WP#

protects top two

address sector

98h (factory locked),

18h (not factory locked)

V_ID

L

H

X

SecSi Sector Indicator

Bit (DQ7), WP#

protects bottom two

address sector

88h (factory locked),

08h (not factory locked)

V_ID

L

H

X

L

X

Legend: L = Logic Low = V_IL, H = Logic High = V_IH, SA = Sector Address, X = Don’t care.

16

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

Sector Group Protection and

Unprotection

Sector/

Sector Block Size

Sector

A20–A12

111111011h

111111100h

111111101h

111111110h

111111111h

SA66

SA67

SA68

SA69

SA70

8 Kbytes

The hardware sector group protection feature disables

both program and erase operations in any sector

group. In this device, a sector group consists of four

adjacent sectors that are protected or unprotected at

the same time (see Tables 5 and 6). The hardware

sector group unprotection feature re-enables both pro-

gram and erase operations in previously protected

sector groups. Sector group protection/unprotection

can be implemented via two methods.

Table 6. Am29LV320MB Bottom Boot

Sector Protection

Sector/

Sector Block Size

Sector protection/unprotection requires V_IDon the RE-

SET# pin only, and can be implemented either in-sys-

tem or via programming equipment. Figure 2 shows

the algorithms and Figure 24 shows the timing dia-

gram. This method uses standard microprocessor bus

cycle timing. For sector group unprotect, all unpro-

tected sector groups must first be protected prior to

the first sector group unprotect write cycle.

Sector

SA0

SA1

SA2

SA3

SA4

SA5

SA6

SA7

A20–A12

000000000h

000000001h

000000010h

000000011h

000000100h

000000101h

000000110h

000000111h

8 Kbytes

The device is shipped with all sector groups unpro-

tected. AMD offers the option of programming and

protecting sector groups at its factory prior to shipping

the device through AMD’s ExpressFlash™ Service.

Contact an AMD representative for details.

8 Kbytes

000001XXXh,

000010XXXh,

000011XXXh,

SA8–SA10

192 (3x64) Kbytes

SA11–SA14

SA15–SA18

SA19–SA22

SA23–SA26

SA27-SA30

SA31-SA34

SA35-SA38

SA39-SA42

SA43-SA46

SA47-SA50

SA51-SA54

SA55–SA58

SA59–SA62

SA63–SA66

SA67–SA70

0001XXXXXh

0010XXXXXh

0011XXXXXh

0100XXXXXh

0101XXXXXh

0110XXXXXh

0111XXXXXh

1000XXXXXh

1001XXXXXh

1010XXXXXh

1011XXXXXh

1100XXXXXh

1101XXXXXh

1110XXXXXh

1111XXXXXh

256 (4x64) Kbytes

It is possible to determine whether a sector group is

protected or unprotected. See the Autoselect Mode

section for details.

Table 5. Am29LV320MT Top Boot

Sector Protection

Sector/

Sector

A20–A12

Sector Block Size

256 (4x64) Kbytes

SA0-SA3

0000XXXXXh

0001XXXXXh

0010XXXXXh

0011XXXXXh

0100XXXXXh

0101XXXXXh

0110XXXXXh

0111XXXXXh

1000XXXXXh,

1001XXXXXh

1010XXXXXh

1011XXXXXh

1100XXXXXh

1101XXXXXh

1110XXXXXh

SA4-SA7

SA8-SA11

SA12-SA15

SA16-SA19

SA20-SA23

SA24-SA27

SA28-SA31

SA32–SA35

SA36–SA39

SA40–SA43

SA44–SA47

SA48–SA51

SA52-SA55

SA56-SA59

Write Protect (WP#)

The Write Protect function provides a hardware

method of protecting the top two or bottom two sectors

without using V_ID. WP# is one of two functions pro-

vided by the WP#/ACC input.

If the system asserts V_ILon the WP#/ACC pin, the de-

vice disables program and erase functions in the first

or last sector independently of whether those sectors

were protected or unprotected using the method de-

scribed in “Sector Group Protection and Unprotection”.

Note that if WP#/ACC is at V_ILwhen the device is in

the standby mode, the maximum input load current is

increased. See the table in “DC Characteristics”.

111100XXXh

111101XXXh

111110XXXh

SA60-SA62

192 (3x64) Kbytes

SA63

SA64

SA65

111111000h

111111001h

111111010h

8 Kbytes

May 16, 2003

Am29LV320MT/B

17

D A T A S H E E T

If the system asserts V_IHon the WP#/ACC pin, the de-

vice reverts to whether the top or bottom two sectors

were previously set to be protected or unprotected

using the method described in “Sector Group Protec-

tion and Unprotection”. Note: No external pullup is

necessary since the WP#/ACC pin has internal pullup

to V_CC

START

RESET# = V_ID

(Note 1)

Temporary Sector Group Unprotect

Perform Erase or

Program Operations

(Note: In this device, a sector group consists of four adjacent

sectors that are protected or unprotected at the same time

(see Table 6).

RESET# = V_IH

This feature allows temporary unprotection of previ-

ously protected sector groups to change data in-sys-

tem. The Sector Group Unprotect mode is activated by

setting the RESET# pin to V_ID. During this mode, for-

merly protected sector groups can be programmed or

erased by selecting the sector group addresses. Once

V_IDis removed from the RESET# pin, all the previ-

ously protected sector groups are protected again.

Figure 1 shows the algorithm, and Figure 23 shows

the timing diagrams, for this feature.

Temporary Sector

Group Unprotect

Completed (Note 2)

Notes:

1. All protected sector groups unprotected (If WP# = V_IL,

the first or last sector will remain protected).

2. All previously protected sector groups are protected

once again.

Figure 1. Temporary Sector Group

Unprotect Operation

18

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

START

PLSCNT = 1

RESET# = V_ID

Protect all sector

groups: The indicated

portion of the sector

group protect algorithm

must be performed for all

unprotected sector

groups prior to issuing

the first sector group

unprotect address

RESET# = V_ID

Wait 1 µs

Temporary Sector

Group Unprotect

Mode

Temporary Sector

Group Unprotect

Mode

No

First Write

Cycle = 60h?

First Write

Cycle = 60h?

Yes

Set up sector

group address

All sector

groups

No

protected?

Yes

Sector Group Protect:

Write 60h to sector

group address with

A6–A0 = 0xx0010

Set up first sector

group address

Sector Group

Unprotect:

Wait 150 µs

Write 60h to sector

group address with

A6–A0 = 1xx0010

Verify Sector Group

Protect: Write 40h

to sector group

address with

A6–A0 = 0xx0010

Reset

PLSCNT = 1

Increment

PLSCNT

Wait 15 ms

Verify Sector Group

Unprotect: Write

40h to sector group

address with

Read from

sector group address

with A6–A0

= 0xx0010

Increment

PLSCNT

A6–A0 = 1xx0010

No

PLSCNT

= 25?

Read from

sector group

address with

Data = 01h?

Yes

A6–A0 = 1xx0010

No

Yes

Set up

next sector group

address

Protect

another

sector group?

Yes

No

PLSCNT

= 1000?

Data = 00h?

Yes

Device failed

No

Yes

Remove V_ID

from RESET#

Last sector

group

verified?

No

Device failed

Write reset

command

Yes

Remove V_ID

from RESET#

Sector Group

Unprotect

Sector Group

Protect

Sector Group

Protect complete

Write reset

command

Algorithm

Sector Group

Unprotect complete

Figure 2. In-System Sector Group Protect/Unprotect Algorithms

Am29LV320MT/B

May 16, 2003

19

D A T A S H E E T

Customer Lockable: SecSi Sector NOT

SecSi (Secured Silicon) Sector Flash

Memory Region

Programmed or Protected At the Factory

Unless otherwise specified, the device is shipped such

that the customer may program and protect the

256-byte SecSi sector.

The SecSi (Secured Silicon) Sector feature provides a

Flash memory region that enables permanent part

identification through an Electronic Serial Number

(ESN). The SecSi Sector is 256 bytes in length, and

uses a SecSi Sector Indicator Bit (DQ7) to indicate

whether or not the SecSi Sector is locked when

shipped from the factory. This bit is permanently set at

the factory and cannot be changed, which prevents

cloning of a factory locked part. This ensures the secu-

rity of the ESN once the product is shipped to the field.

The system may program the SecSi Sector using the

write-buffer, accelerated and/or unlock bypass meth-

ods, in addition to the standard programming com-

mand sequence. See Command Definitions.

Programming and protecting the SecSi Sector must be

used with caution since, once protected, there is no

procedure available for unprotecting the SecSi Sector

area and none of the bits in the SecSi Sector memory

space can be modified in any way.

AMD offers the device with the SecSi Sector either

customer lockable (standard shipping option) or fac-

tory locked (contact an AMD sales representative for

ordering information). The customer-lockable version

is shipped with the SecSi Sector unprotected, allowing

customers to program the sector after receiving the

device. The customer-lockable version also has the

SecSi Sector Indicator Bit permanently set to a “0.”

The factory-locked version is always protected when

shipped from the factory, and has the SecSi (Secured

Silicon) Sector Indicator Bit permanently set to a “1.”

Thus, the SecSi Sector Indicator Bit prevents cus-

tomer-lockable devices from being used to replace de-

vices that are factory locked. Note that the ACC

function and unlock bypass modes are not available

when the SecSi Sector is enabled.

The SecSi Sector area can be protected using one of

the following procedures:

■ Write the three-cycle Enter SecSi Sector Region

command sequence, and then follow the in-system

sector protect algorithm as shown in Figure 2, ex-

cept that RESET# may be at either V_IHor V_ID. This

allows in-system protection of the SecSi Sector

without raising any device pin to a high voltage.

Note that this method is only applicable to the SecSi

Sector.

■ To verify the protect/unprotect status of the SecSi

Sector, follow the algorithm shown in Figure 3.

Once the SecSi Sector is programmed, locked and

verified, the system must write the Exit SecSi Sector

Region command sequence to return to reading and

writing within the remainder of the array.

The SecSi sector address space in this device is allo-

cated as follows:

Table 7. SecSi Sector Contents

SecSi Sector

Address Range

Customer

Lockable

ESN Factory

Locked

ExpressFlash

Factory Locked

Factory Locked: SecSi Sector Programmed and

Protected At the Factory

ESN or

determined by

customer

000000h–000007h

000008h–00007Fh

ESN

Determined by

customer

In devices with an ESN, the SecSi Sector is protected

when the device is shipped from the factory. The SecSi

Sector cannot be modified in any way. An ESN Factory

Locked device has an 16-byte random ESN at ad-

dresses 000000h–000007h. Please contact your local

AMD sales representative for details on ordering ESN

Factory Locked devices.

Determined by

customer

Unavailable

The system accesses the SecSi Sector through a

command sequence (see “Enter SecSi Sector/Exit

SecSi Sector Command Sequence”). After the system

has written the Enter SecSi Sector command se-

quence, it may read the SecSi Sector by using the ad-

dresses normally occupied by the first sector (SA0).

This mode of operation continues until the system is-

sues the Exit SecSi Sector command sequence, or

until power is removed from the device. On power-up,

or following a hardware reset, the device reverts to

sending commands to sector SA0.

Customers may opt to have their code programmed by

AMD through the AMD ExpressFlash service (Express

Flash Factory Locked). The devices are then shipped

from AMD’s factory with the SecSi Sector permanently

locked. Contact an AMD representative for details on

using AMD’s ExpressFlash service.

20

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

hardware data protection measures prevent accidental

erasure or programming, which might otherwise be

caused by spurious system level signals during V_CC

power-up and power-down transitions, or from system

noise.

START

If data = 00h,

SecSi Sector is

unprotected.

If data = 01h,

SecSi Sector is

protected.

RESET# =

V_IHor V_ID

Low V_CCWrite Inhibit

When V_CCis less than V_LKO, the device does not ac-

cept any write cycles. This protects data during V_CC

power-up and power-down. The command register

and all internal program/erase circuits are disabled,

and the device resets to the read mode. Subsequent

writes are ignored until V_CCis greater than V_LKO. The

system must provide the proper signals to the control

pins to prevent unintentional writes when V_CCis

Wait 1 µs

Write 60h to

any address

Remove V_IHor V_ID

from RESET#

Write 40h to SecSi

Sector address

with A6 = 0,

Write reset

command

greater than V_LKO

.

A1 = 1, A0 = 0

Write Pulse “Glitch” Protection

SecSi Sector

Protect Verify

complete

Read from SecSi

Sector address

with A6 = 0,

Noise pulses of less than 5 ns (typical) on OE#, CE#

or WE# do not initiate a write cycle.

A1 = 1, A0 = 0

Logical Inhibit

Write cycles are inhibited by holding any one of OE# =

V_IL, CE# = V_IHor WE# = V_IH. To initiate a write cycle,

CE# and WE# must be a logical zero while OE# is a

logical one.

Figure 3. SecSi Sector Protect Verify

Power-Up Write Inhibit

Hardware Data Protection

If WE# = CE# = V_ILand OE# = V_IHduring power up,

the device does not accept commands on the rising

edge of WE#. The internal state machine is automati-

cally reset to the read mode on power-up.

The command sequence requirement of unlock cycles

for programming or erasing provides data protection

against inadvertent writes (refer to Tables 12 and 13

for command definitions). In addition, the following

COMMON FLASH MEMORY INTERFACE (CFI)

The Common Flash Interface (CFI) specification out-

lines device and host system software interrogation

handshake, which allows specific vendor-specified

software algorithms to be used for entire families of

devices. Software support can then be device-inde-

pendent, JEDEC ID-independent, and forward- and

backward-compatible for the specified flash device

families. Flash vendors can standardize their existing

interfaces for long-term compatibility.

given in Tables 8–11. To terminate reading CFI data,

the system must write the reset command.

The system can also write the CFI query command

when the device is in the autoselect mode. The device

enters the CFI query mode, and the system can read

CFI data at the addresses given in Tables 8–11. The

system must write the reset command to return the de-

vice to reading array data.

For further information, please refer to the CFI Specifi-

cation and CFI Publication 100, available via the

World Wide Web at http://www.amd.com/flash/cfi. Al-

ternatively, contact an AMD representative for copies

of these documents.

This device enters the CFI Query mode when the sys-

tem writes the CFI Query command, 98h, to address

55h, any time the device is ready to read array data.

The system can read CFI information at the addresses

May 16, 2003

Am29LV320MT/B

21

D A T A S H E E T

Table 8. CFI Query Identification String

Addresses

(x16)

Addresses

(x8)

Data

Description

10h

11h

12h

20h

22h

24h

0051h

0052h

0059h

Query Unique ASCII string “QRY”

13h

14h

26h

28h

0002h

0000h

Primary OEM Command Set

15h

16h

2Ah

2Ch

0040h

0000h

Address for Primary Extended Table

17h

18h

2Eh

30h

0000h

Alternate OEM Command Set (00h = none exists)

Address for Alternate OEM Extended Table (00h = none exists)

19h

1Ah

32h

34h

0000h

Table 9. System Interface String

Addresses

(x16)

Addresses

(x8)

Data

Description

V_CCMin. (write/erase)

D7–D4: volt, D3–D0: 100 millivolt

1Bh

1Ch

36h

38h

0027h

V_CCMax. (write/erase)

D7–D4: volt, D3–D0: 100 millivolt

0036h

1Dh

1Eh

1Fh

20h

21h

22h

23h

24h

25h

26h

3Ah

3Ch

3Eh

40h

42h

44h

46h

48h

4Ah

4Ch

0000h

0007h

000Ah

0000h

0001h

0005h

0004h

0000h

V_PPMin. voltage (00h = no V_PPpin present)

V

_PPMax. voltage (00h = no V_PPpin present)

Typical timeout per single byte/word write 2^Nµs

Typical timeout for Min. size buffer write 2^Nµs (00h = not supported)

Typical timeout per individual block erase 2^Nms

Typical timeout for full chip erase 2^Nms (00h = not supported)

Max. timeout for byte/word write 2^Ntimes typical

Max. timeout for buffer write 2^Ntimes typical

Max. timeout per individual block erase 2^Ntimes typical

Max. timeout for full chip erase 2^Ntimes typical (00h = not supported)

22

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

Table 10. Device Geometry Definition

Addresses Addresses

(x16)

(x8)

Data

Description

27h

4Eh

0016h

Device Size = 2^Nbyte

28h

29h

50h

52h

0002h

0000h

Flash Device Interface description (refer to CFI publication 100)

2Ah

2Bh

54h

56h

0005h

0000h

Max. number of byte in multi-byte write = 2^N

(00h = not supported)

Number of Erase Block Regions within device (01h = uniform device, 02h = boot

device)

2Ch

58h

0002h

2Dh

2Eh

2Fh

30h

5Ah

5Ch

5Eh

60h

007Fh

0000h

0020h

0000h

Erase Block Region 1 Information

(refer to the CFI specification or CFI publication 100)

31h

32h

33h

34h

62h

64h

66h

68h

003Eh

0000h

0001h

Erase Block Region 2 Information (refer to CFI publication 100)

Erase Block Region 3 Information (refer to CFI publication 100)

Erase Block Region 4 Information (refer to CFI publication 100)

35h

36h

37h

38h

6Ah

6Ch

6Eh

70h

0000h

39h

3Ah

3Bh

3Ch

72h

74h

76h

78h

0000h

May 16, 2003

Am29LV320MT/B

23

D A T A S H E E T

Table 11. Primary Vendor-Specific Extended Query

Addresses Addresses

(x16)

(x8)

Data

Description

40h

41h

42h

80h

82h

84h

0050h

0052h

0049h

Query-unique ASCII string “PRI”

43h

44h

86h

88h

0031h

0033h

Major version number, ASCII

Minor version number, ASCII

Address Sensitive Unlock (Bits 1-0)

0 = Required, 1 = Not Required

45h

8Ah

0008h

Process Technology (Bits 7-2) 0010b = 0.23 µm MirrorBit

Erase Suspend

0 = Not Supported, 1 = To Read Only, 2 = To Read & Write

46h

47h

48h

49h

4Ah

4Bh

4Ch

8Ch

8Eh

90h

92h

94h

96h

98h

0002h

0001h

0004h

0000h

0001h

Sector Protect

0 = Not Supported, X = Number of sectors in per group

Sector Temporary Unprotect

00 = Not Supported, 01 = Supported

Sector Protect/Unprotect scheme

04 = 29LV800 mode

Simultaneous Operation

00 = Not Supported, X = Number of Sectors in Bank

Burst Mode Type

00 = Not Supported, 01 = Supported

Page Mode Type

00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page

ACC (Acceleration) Supply Minimum

4Dh

4Eh

9Ah

9Ch

00B5h

00C5h

00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV

ACC (Acceleration) Supply Maximum

00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV

Top/Bottom Boot Sector Flag

0002h/

0003h

00h = Uniform Device without WP# protect, 02h = Bottom Boot Device, 03h = Top

Boot Device, 04h = Uniform sectors bottom WP# protect, 05h = Uniform sectors top

WP# protect

4Fh

50h

9Eh

A0h

Program Suspend

0001h

00h = Not Supported, 01h = Supported

COMMAND DEFINITIONS

Writing specific address and data commands or se-

quences into the command register initiates device op-

erations. Tables 12 and 13 define the valid register

command sequences. Writing incorrect address and

data values or writing them in the improper se-

quence may place the device in an unknown state. A

reset command is then required to return the device to

reading array data.

first. Refer to the AC Characteristics section for timing

diagrams.

Reading Array Data

The device is automatically set to reading array data

after device power-up. No commands are required to

retrieve data. The device is ready to read array data

after completing an Embedded Program or Embedded

Erase algorithm.

All addresses are latched on the falling edge of WE#

or CE#, whichever happens later. All data is latched on

the rising edge of WE# or CE#, whichever happens

After the device accepts an Erase Suspend command,

the device enters the erase-suspend-read mode, after

24

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

which the system can read data from any

Autoselect Command Sequence

non-erase-suspended sector. After completing a pro-

gramming operation in the Erase Suspend mode, the

system may once again read array data with the same

exception. See the Erase Suspend/Erase Resume

Commands section for more information.

The autoselect command sequence allows the host

system to read several identifier codes at specific ad-

dresses:

A7:A0

(x16)

A6:A-1

(x8)

Identifier Code

The system must issue the reset command to return

the device to the read (or erase-suspend-read) mode

if DQ5 goes high during an active program or erase

operation, or if the device is in the autoselect mode.

See the next section, Reset Command, for more infor-

mation.

Manufacturer ID

Device ID, Cycle 1

00h

01h

00h

02h

Device ID, Cycle 2

0Eh

1Ch

Device ID, Cycle 3

0Fh

1Eh

SecSi Sector Factory Protect

Sector Protect Verify

03h

06h

(SA)02h

(SA)04h

See also Requirements for Reading Array Data in the

Device Bus Operations section for more information.

The Read-Only Operations table provides the read pa-

rameters, and Figure 14 shows the timing diagram.

Note: The device ID is read over three cycles. SA = Sector

Address

Tables 12 and 13 show the address and data require-

ments. This method is an alternative to that shown in

Table 4, which is intended for PROM programmers

and requires V_IDon address pin A9. The autoselect

command sequence may be written to an address that

is either in the read or erase-suspend-read mode. The

autoselect command may not be written while the de-

vice is actively programming or erasing.

Reset Command

Writing the reset command resets the device to the

read or erase-suspend-read mode. Address bits are

don’t cares for this command.

The reset command may be written between the se-

quence cycles in an erase command sequence before

erasing begins. This resets the device to the read

mode. Once erasure begins, however, the device ig-

nores reset commands until the operation is complete.

The autoselect command sequence is initiated by first

writing two unlock cycles. This is followed by a third

write cycle that contains the autoselect command. The

device then enters the autoselect mode. The system

may read at any address any number of times without

initiating another autoselect command sequence.

The reset command may be written between the

sequence cycles in a program command sequence

before programming begins. This resets the device to

the read mode. If the program command sequence is

written while the device is in the Erase Suspend mode,

writing the reset command returns the device to the

erase-suspend-read mode. Once programming be-

gins, however, the device ignores reset commands

until the operation is complete.

The system must write the reset command to return to

the read mode (or erase-suspend-read mode if the de-

vice was previously in Erase Suspend).

Enter SecSi Sector/Exit SecSi Sector

Command Sequence

The SecSi Sector region provides a secured data area

containing an 8-word/16-byte random Electronic Serial

Number (ESN). The system can access the SecSi

Sector region by issuing the three-cycle Enter SecSi

Sector command sequence. The device continues to

access the SecSi Sector region until the system is-

sues the four-cycle Exit SecSi Sector command se-

quence. The Exit SecSi Sector command sequence

returns the device to normal operation. Tables 12 and

13 show the address and data requirements for both

command sequences. See also “SecSi (Secured Sili-

con) Sector Flash Memory Region” for further informa-

tion. Note that the ACC function and unlock bypass

modes are not available when the SecSi Sector is en-

abled.

The reset command may be written between the se-

quence cycles in an autoselect command sequence.

Once in the autoselect mode, the reset command

must be written to return to the read mode. If the de-

vice entered the autoselect mode while in the Erase

Suspend mode, writing the reset command returns the

device to the erase-suspend-read mode.

If DQ5 goes high during a program or erase operation,

writing the reset command returns the device to the

read mode (or erase-suspend-read mode if the device

was in Erase Suspend).

Note that if DQ1 goes high during a Write Buffer Pro-

gramming operation, the system must write the

Write-to-Buffer-Abort Reset command sequence to

reset the device for the next operation.

Word/Byte Program Command Sequence

Programming is a four-bus-cycle operation. The pro-

gram command sequence is initiated by writing two

unlock write cycles, followed by the program set-up

command. The program address and data are written

May 16, 2003

Am29LV320MT/B

25

D A T A S H E E T

next, which in turn initiate the Embedded Program al-

Write Buffer Programming

gorithm. The system is not required to provide further

controls or timings. The device automatically provides

internally generated program pulses and verifies the

programmed cell margin. Tables 12 and 13 show the

address and data requirements for the word program

command sequence.

Write Buffer Programming allows the system write to a

maximum of 16 words/32 bytes in one programming

operation. This results in faster effective programming

time than the standard programming algorithms. The

Write Buffer Programming command sequence is initi-

ated by first writing two unlock cycles. This is followed

by a third write cycle containing the Write Buffer Load

command written at the Sector Address in which pro-

gramming will occur. The fourth cycle writes the sector

address and the number of word locations, minus one,

to be programmed. For example, if the system will pro-

gram 6 unique address locations, then 05h should be

written to the device. This tells the device how many

write buffer addresses will be loaded with data and

therefore when to expect the Program Buffer to Flash

command. The number of locations to program cannot

exceed the size of the write buffer or the operation will

abort.

When the Embedded Program algorithm is complete,

the device then returns to the read mode and ad-

dresses are no longer latched. The system can deter-

mine the status of the program operation by using

DQ7 or DQ6. Refer to the Write Operation Status sec-

tion for information on these status bits.

Any commands written to the device during the Em-

bedded Program Algorithm are ignored. Note that a

hardware reset immediately terminates the program

operation. Note that the SecSi Sector, autoselect, and

CFI functions are unavailable when a program opera-

tion is in progress. The program command sequence

should be reinitiated once the device has returned to

the read mode, to ensure data integrity.

The fifth cycle writes the first address location and

data to be programmed. The write-buffer-page is se-

lected by address bits A_MAX–A₄. All subsequent ad-

dress/data pairs must fall within the

selected-write-buffer-page. The system then writes the

remaining address/data pairs into the write buffer.

Write buffer locations may be loaded in any order.

Programming is allowed in any sequence and across

sector boundaries. A bit cannot be programmed

from “0” back to a “1.” Attempting to do so may

cause the device to set DQ5 = 1, or cause the DQ7

and DQ6 status bits to indicate the operation was suc-

cessful. However, a succeeding read will show that the

data is still “0.” Only erase operations can convert a

“0” to a “1.”

The write-buffer-page address must be the same for

all address/data pairs loaded into the write buffer.

(This means Write Buffer Programming cannot be per-

formed across multiple write-buffer pages. This also

means that Write Buffer Programming cannot be per-

formed across multiple sectors. If the system attempts

to load programming data outside of the selected

write-buffer page, the operation will abort.

Unlock Bypass Command Sequence

The unlock bypass feature allows the system to pro-

gram words to the device faster than using the stan-

dard program command sequence. The unlock

bypass command sequence is initiated by first writing

two unlock cycles. This is followed by a third write

cycle containing the unlock bypass command, 20h.

The device then enters the unlock bypass mode. A

two-cycle unlock bypass program command sequence

is all that is required to program in this mode. The first

cycle in this sequence contains the unlock bypass pro-

gram command, A0h; the second cycle contains the

program address and data. Additional data is pro-

grammed in the same manner. This mode dispenses

with the initial two unlock cycles required in the stan-

dard program command sequence, resulting in faster

total programming time. Tables 12 and 13 show the re-

quirements for the command sequence.

Note that if a Write Buffer address location is loaded

multiple times, the address/data pair counter will be

decremented for every data load operation. The host

system must therefore account for loading a

write-buffer location more than once. The counter

decrements for each data load operation, not for each

unique write-buffer-address location. Note also that if

an address location is loaded more than once into the

buffer, the final data loaded for that address will be

programmed.

Once the specified number of write buffer locations

have been loaded, the system must then write the Pro-

gram Buffer to Flash command at the sector address.

Any other address and data combination aborts the

Write Buffer Programming operation. The device then

begins programming. Data polling should be used

while monitoring the last address location loaded into

the write buffer. DQ7, DQ6, DQ5, and DQ1 should be

monitored to determine the device status during Write

Buffer Programming.

During the unlock bypass mode, only the Unlock By-

pass Program and Unlock Bypass Reset commands

are valid. To exit the unlock bypass mode, the system

must issue the two-cycle unlock bypass reset com-

mand sequence. The first cycle must contain the data

90h. The second cycle must contain the data 00h. The

device then returns to the read mode.

26

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

The write-buffer programming operation can be sus-

command sequence must be written to reset the de-

vice for the next operation. Note that the full 3-cycle

Write-to-Buffer-Abort Reset command sequence is re-

quired when using Write-Buffer-Programming features

in Unlock Bypass mode.

pended using the standard program suspend/resume

commands. Upon successful completion of the Write

Buffer Programming operation, the device is ready to

execute the next command.

The Write Buffer Programming Sequence can be

aborted in the following ways:

Accelerated Program

The device offers accelerated program operations

through the WP#/ACC pin. When the system asserts

V_HHon the WP#/ACC pin, the device automatically en-

ters the Unlock Bypass mode. The system may then

write the two-cycle Unlock Bypass program command

sequence. The device uses the higher voltage on the

WP#/ACC pin to accelerate the operation. Note that

the WP#/ACC pin must not be at V_HHfor operations

other than accelerated programming, or device dam-

age may result. In addition, no external pullup is nec-

essary since the WP#/ACC pin has internal pullup to

■ Load a value that is greater than the page buffer

size during the Number of Locations to Program

step.

■ Write to an address in a sector different than the

one specified during the Write-Buffer-Load com-

mand.

■ Write an Address/Data pair to

a

different

write-buffer-page than the one selected by the

Starting Address during the write buffer data load-

ing stage of the operation.

V_CC

.

■ Write data other than the Confirm Command after

Figure 5 illustrates the algorithm for the program oper-

ation. Refer to the Erase and Program Operations

table in the AC Characteristics section for parameters,

and Figure 17 for timing diagrams.

the specified number of data load cycles.

The abort condition is indicated by DQ1 = 1, DQ7 =

DATA# (for the last address location loaded), DQ6 =

toggle, and DQ5=0. A Write-to-Buffer-Abort Reset

May 16, 2003

Am29LV320MT/B

27

D A T A S H E E T

Write “Write to Buffer”

command and

Sector Address

Part of “Write to Buffer”

Command Sequence

Write number of addresses

to program minus 1(WC)

and Sector Address

Write first address/data

Yes

WC = 0 ?

No

Write to a different

sector address

Abort Write to

Yes

Buffer Operation?

Write to buffer ABORTED.

Must write “Write-to-buffer

Abort Reset” command

sequence to return

No

(Note 1)

Write next address/data pair

to read mode.

WC = WC - 1

Write program buffer to

flash sector address

Notes:

1. When Sector Address is specified, any address in

the selected sector is acceptable. However, when

loading Write-Buffer address locations with data, all

addresses must fall within the selected Write-Buffer

Page.

Read DQ7 - DQ0 at

Last Loaded Address

2. DQ7 may change simultaneously with DQ5.

Therefore, DQ7 should be verified.

3. If this flowchart location was reached because

DQ5= “1”, then the device FAILED. If this

flowchart location was reached because DQ1=

“1”, then the Write to Buffer operation was

ABORTED. In either case, the proper reset

command must be written before the device can

begin another operation. If DQ1=1, write the

Write-Buffer-Programming-Abort-Reset

Yes

DQ7 = Data?

No

command. if DQ5=1, write the Reset command.

No

DQ1 = 1?

Yes

DQ5 = 1?

Yes

4. See Tables 12 and 13 for command sequences

required for write buffer programming.

Read DQ7 - DQ0 with

address = Last Loaded

Address

Yes

(Note 2)

DQ7 = Data?

No

(Note 3)

FAIL or ABORT

PASS

Figure 4. Write Buffer Programming Operation

Am29LV320MT/B

28

May 16, 2003

D A T A S H E E T

Program Suspend/Program Resume

Command Sequence

The Program Suspend command allows the system to

interrupt a programming operation or a Write to Buffer

programming operation so that data can be read from

any non-suspended sector. When the Program Sus-

pend command is written during a programming pro-

cess, the device halts the program operation within 15

µs maximum (5 µs typical) and updates the status bits.

Addresses are not required when writing the Program

Suspend command.

START

Write Program

Command Sequence

Data Poll

from System

Embedded

Program

algorithm

in progress

After the programming operation has been sus-

pended, the system can read array data from any

non-suspended sector. The Program Suspend com-

mand may also be issued during a programming oper-

ation while an erase is suspended. In this case, data

may be read from any addresses not in Erase Sus-

pend or Program Suspend. If a read is needed from

the SecSi Sector area (One-time Program area), then

user must use the proper command sequences to

enter and exit this region.

Verify Data?

Yes

No

Increment Address

Last Address?

Yes

The system may also write the autoselect command

sequence when the device is in the Program Suspend

mode. The system can read as many autoselect

codes as required. When the device exits the autose-

lect mode, the device reverts to the Program Suspend

mode, and is ready for another valid operation. See

Autoselect Command Sequence for more information.

Programming

Completed

Note: See Tables 12 and 13 for program command

sequence.

After the Program Resume command is written, the

device reverts to programming. The system can de-

termine the status of the program operation using the

DQ7 or DQ6 status bits, just as in the standard pro-

gram operation. See Write Operation Status for more

information.

Figure 5. Program Operation

The system must write the Program Resume com-

mand (address bits are don’t care) to exit the Program

Suspend mode and continue the programming opera-

tion. Further writes of the Resume command are ig-

nored. Another Program Suspend command can be

written after the device has resume programming.

May 16, 2003

Am29LV320MT/B

29

D A T A S H E E T

When the Embedded Erase algorithm is complete, the

device returns to the read mode and addresses are no

longer latched. The system can determine the status

of the erase operation by using DQ7, DQ6, or DQ2.

Refer to the Write Operation Status section for infor-

mation on these status bits.

Program Operation

or Write-to-Buffer

Sequence in Progress

Write Program Suspend

Command Sequence

Write address/data

XXXh/B0h

Any commands written during the chip erase operation

are ignored. However, note that a hardware reset im-

mediately terminates the erase operation. If that oc-

curs, the chip erase command sequence should be

reinitiated once the device has returned to reading

array data, to ensure data integrity.

Command is also valid for

Erase-suspended-program

operations

Wait 15 µs

Autoselect operations are also allowed

Read data as

required

Data cannot be read from erase- or

program-suspended sectors

Figure 7 illustrates the algorithm for the erase opera-

tion. Refer to the Erase and Program Operations ta-

bles in the AC Characteristics section for parameters,

and Figure 19 section for timing diagrams.

Done

No

reading?

Sector Erase Command Sequence

Sector erase is a six bus cycle operation. The sector

erase command sequence is initiated by writing two

unlock cycles, followed by a set-up command. Two ad-

ditional unlock cycles are written, and are then fol-

lowed by the address of the sector to be erased, and

the sector erase command. Tables 12 and 13 shows

the address and data requirements for the sector

erase command sequence. Note that the SecSi Sec-

tor, autoselect, and CFI functions are unavailable

when a program operation is in progress.

Yes

Write Program Resume

Command Sequence

Write address/data

XXXh/30h

Device reverts to

operation prior to

Program Suspend

Figure 6. Program Suspend/Program Resume

The device does not require the system to preprogram

prior to erase. The Embedded Erase algorithm auto-

matically programs and verifies the entire memory for

an all zero data pattern prior to electrical erase. The

system is not required to provide any controls or tim-

ings during these operations.

Chip Erase Command Sequence

Chip erase is a six bus cycle operation. The chip erase

command sequence is initiated by writing two unlock

cycles, followed by a set-up command. Two additional

unlock write cycles are then followed by the chip erase

command, which in turn invokes the Embedded Erase

algorithm. The device does not require the system to

preprogram prior to erase. The Embedded Erase algo-

rithm automatically preprograms and verifies the entire

memory for an all zero data pattern prior to electrical

erase. The system is not required to provide any con-

trols or timings during these operations. Tables 12 and

13 shows the address and data requirements for the

chip erase command sequence. Note that the SecSi

Sector, autoselect, and CFI functions are unavailable

when a program operation is in progress.

After the command sequence is written, a sector erase

time-out of 50 µs occurs. During the time-out period,

additional sector addresses and sector erase com-

mands may be written. Loading the sector erase buffer

may be done in any sequence, and the number of sec-

tors may be from one sector to all sectors. The time

between these additional cycles must be less than 50

µs, otherwise erasure may begin. Any sector erase

address and command following the exceeded

time-out may or may not be accepted. It is recom-

mended that processor interrupts be disabled during

this time to ensure all commands are accepted. The

interrupts can be re-enabled after the last Sector

Erase command is written. Any command other than

Sector Erase or Erase Suspend during the

time-out period resets the device to the read

mode. The system must rewrite the command se-

quence and any additional addresses and commands.

The system can monitor DQ3 to determine if the sec-

tor erase timer has timed out (See the section on DQ3:

Sector Erase Timer.). The time-out begins from the ris-

30

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

ing edge of the final WE# pulse in the command

sequence.

Erase Suspend/Erase Resume

Commands

When the Embedded Erase algorithm is complete, the

device returns to reading array data and addresses

are no longer latched. The system can determine the

status of the erase operation by reading DQ7, DQ6, or

DQ2 in the erasing sector. Refer to the Write Opera-

tion Status section for information on these status bits.

The Erase Suspend command, B0h, allows the sys-

tem to interrupt a sector erase operation and then read

data from, or program data to, any sector not selected

for erasure. This command is valid only during the

sector erase operation, including the 50 µs time-out

period during the sector erase command sequence.

The Erase Suspend command is ignored if written dur-

ing the chip erase operation or Embedded Program

algorithm.

Once the sector erase operation has begun, only the

Erase Suspend command is valid. All other com-

mands are ignored. However, note that a hardware

reset immediately terminates the erase operation. If

that occurs, the sector erase command sequence

should be reinitiated once the device has returned to

reading array data, to ensure data integrity.

When the Erase Suspend command is written during

the sector erase operation, the device requires a typi-

cal of 5 µs (maximum of 20 µs) to suspend the erase

operation. However, when the Erase Suspend com-

mand is written during the sector erase time-out, the

device immediately terminates the time-out period and

suspends the erase operation.

Figure 7 illustrates the algorithm for the erase opera-

tion. Refer to the Erase and Program Operations ta-

bles in the AC Characteristics section for parameters,

and Figure 19 section for timing diagrams.

After the erase operation has been suspended, the

device enters the erase-suspend-read mode. The sys-

tem can read data from or program data to any sector

not selected for erasure. (The device “erase sus-

pends” all sectors selected for erasure.) Reading at

any address within erase-suspended sectors pro-

duces status information on DQ7–DQ0. The system

can use DQ7, or DQ6 and DQ2 together, to determine

if a sector is actively erasing or is erase-suspended.

Refer to the Write Operation Status section for infor-

mation on these status bits.

START

Write Erase

Command Sequence

(Notes 1, 2)

After an erase-suspended program operation is com-

plete, the device returns to the erase-suspend-read

mode. The system can determine the status of the

program operation using the DQ7 or DQ6 status bits,

just as in the standard word program operation.

Refer to the Write Operation Status section for more

information.

Data Poll to Erasing

Bank from System

Embedded

Erase

algorithm

in progress

No

Data = FFh?

In the erase-suspend-read mode, the system can also

issue the autoselect command sequence. Refer to the

Autoselect Mode and Autoselect Command Sequence

sections for details.

Yes

Erasure Completed

To resume the sector erase operation, the system

must write the Erase Resume command. The address

of the erase-suspended sector is required when writ-

ing this command. Further writes of the Resume com-

mand are ignored. Another Erase Suspend command

can be written after the chip has resumed erasing.

Notes:

1. See Tables 12 and 13 for erase command sequence.

2. See the section on DQ3 for information on the sector

erase timer.

Figure 7. Erase Operation

May 16, 2003

Am29LV320MT/B

31

D A T A S H E E T

Command Definitions

Table 12. Command Definitions (x16 Mode, BYTE# = V_IH)

Bus Cycles (Notes 1–4)

First

Second

Third

Fourth

Fifth

Sixth

Command Sequence

(Notes)

Addr Data

Addr

Data

Addr

Data

Addr Data Addr Data

Read (Note 5)

Reset (Note 6)

Manufacturer ID

1

4

RA

XXX

555

RD

F0

AA

2AA

55

555

90

X00

X01

0001

227E

2200/

X0E 221A X0F

2201

Device ID (Note 8)

6

4

555

AA

SecSi Sector Factory Protect

(Note 9)

2AA

55

555

90

X03

(Note 9)

00/01

Sector Group Protect Verify

(Note 10)

(SA)X02

Enter SecSi Sector Region

Exit SecSi Sector Region

Program

3

4

6

1

3

2

6

1

555

SA

AA

29

2AA

55

555

SA

88

90

A0

25

XXX

PA

00

PD

WC

Write to Buffer (Note 11)

Program Buffer to Flash

Write to Buffer Abort Reset (Note 12)

Unlock Bypass

SA

PA

PD

WBL

PD

555

XXX

555

BA

AA

A0

90

2AA

PA

55

PD

00

55

555

F0

20

Unlock Bypass Program (Note 13)

Unlock Bypass Reset (Note 14)

Chip Erase

XXX

2AA

AA

B0

30

555

80

555

AA

2AA

55

555

SA

10

30

Sector Erase

Program/Erase Suspend (Note 15)

Program/Erase Resume (Note 16)

CFI Query (Note 17)

BA

55

98

Legend:

X = Don’t care

SA = Sector Address of sector to be verified (in autoselect mode) or

erased. Address bits A20–A15 uniquely select any sector.

WBL = Write Buffer Location. Address must be within the same write

buffer page as PA.

RA = Read Address of the memory location to be read.

RD = Read Data read from location RA during read operation.

PA = Program Address . Addresses latch on the falling edge of the

WE# or CE# pulse, whichever happens later.

WC = Word Count. Number of write buffer locations to load minus 1.

PD = Program Data for location PA. Data latches on the rising edge of

WE# or CE# pulse, whichever happens first.

Notes:

1. See Table 1 for description of bus operations.

bottom two address sectors, the data is 88h for factory locked and

08h for not factor locked.

2. All values are in hexadecimal.

10. The data is 00h for an unprotected sector group and 01h for a

protected sector group.

3. Except for the read cycle and the fourth cycle of the autoselect

command sequence, all bus cycles are write cycles.

11. The total number of cycles in the command sequence is

determined by the number of words written to the write buffer. The

maximum number of cycles in the command sequence is 21.

4. During unlock cycles, when lower address bits are 555 or 2AAh

as shown in table, address bits higher than A11 (except where BA

is required) and data bits higher than DQ7 are don’t cares.

12. Command sequence resets device for next command after

aborted write-to-buffer operation.

5. No unlock or command cycles required when device is in read

mode.

13. The Unlock Bypass command is required prior to the Unlock

Bypass Program command.

6. The Reset command is required to return to the read mode (or to

the erase-suspend-read mode if previously in Erase Suspend)

when the device is in the autoselect mode, or if DQ5 goes high

while the device is providing status information.

14. The Unlock Bypass Reset command is required to return to the

read mode when the device is in the unlock bypass mode.

7. The fourth cycle of the autoselect command sequence is a read

cycle. Data bits DQ15–DQ8 are don’t care. See the Autoselect

Command Sequence section for more information.

15. The system may read and program in non-erasing sectors, or

enter the autoselect mode, when in the Erase Suspend mode.

The Erase Suspend command is valid only during a sector erase

operation.

8. The device ID must be read in three cycles. The data is 2201h for

top boot and 2200h for bottom boot.

16. The Erase Resume command is valid only during the Erase

Suspend mode.

9. If WP# protects the top two address sectors, the data is 98h for

factory locked and 18h for not factory locked. If WP# protects the

17. Command is valid when device is ready to read array data or when

device is in autoselect mode.

32

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

Table 13. Command Definitions (x8 Mode, BYTE# = V_IL)

Bus Cycles (Notes 1–4)

First

Second

Third

Fourth

Fifth

Sixth

Command Sequence

(Notes)

Addr Data

Addr

Data

Addr

Data

Addr Data Addr Data

Read (Note 5)

Reset (Note 6)

Manufacturer ID

1

4

6

RA

RD

F0

XXX

AAA

AA

555

55

AAA

90

X00

X02

01

7E

Device ID (Note 8)

X1C

1A

X1E 00/01

SecSi Sector Factory Protect

(Note 9)

4

AAA

AA

555

55

AAA

90

X06

(Note 9)

00/01

Sector Group Protect Verify

(Note 10)

(SA)X04

Enter SecSi Sector Region

Exit SecSi Sector Region

Program

3

4

6

1

3

2

6

1

AAA

SA

AA

29

555

55

AAA

SA

88

90

A0

25

XXX

PA

00

PD

BC

Write to Buffer (Note 11)

Program Buffer to Flash

Write to Buffer Abort Reset (Note 12)

Unlock Bypass

SA

PA

PD

WBL

PD

AAA

XXX

AAA

BA

AA

A0

90

555

PA

55

PD

00

55

AAA

F0

20

Unlock Bypass Program (Note 13)

Unlock Bypass Reset (Note 14)

Chip Erase

XXX

555

AA

B0

30

AAA

80

AAA

AA

555

55

AAA

SA

10

30

Sector Erase

Program/Erase Suspend (Note 15)

Program/Erase Resume (Note 16)

CFI Query (Note 17)

BA

AA

98

Legend:

X = Don’t care

SA = Sector Address of sector to be verified (in autoselect mode) or

erased. Address bits A20–A15 uniquely select any sector.

WBL = Write Buffer Location. Address must be within the same write

buffer page as PA.

RA = Read Address of the memory location to be read.

RD = Read Data read from location RA during read operation.

PA = Program Address . Addresses latch on the falling edge of the

WE# or CE# pulse, whichever happens later.

BC = Byte Count. Number of write buffer locations to load minus 1.

PD = Program Data for location PA. Data latches on the rising edge of

WE# or CE# pulse, whichever happens first.

Notes:

1. See Table 1 for description of bus operations.

bottom two address sectors, the data is 88h for factory locked and

08h for not factor locked.

2. All values are in hexadecimal.

10. The data is 00h for an unprotected sector group and 01h for a

protected sector group.

3. Except for the read cycle and the fourth cycle of the autoselect

command sequence, all bus cycles are write cycles.

11. The total number of cycles in the command sequence is

determined by the number of words written to the write buffer. The

maximum number of cycles in the command sequence is 37.

4. During unlock cycles, when lower address bits are 555 or AAAh

as shown in table, address bits higher than A11 (except where BA

is required) and data bits higher than DQ7 are don’t cares.

12. Command sequence resets device for next command after

aborted write-to-buffer operation.

5. No unlock or command cycles required when device is in read

mode.

13. The Unlock Bypass command is required prior to the Unlock

Bypass Program command.

6. The Reset command is required to return to the read mode (or to

the erase-suspend-read mode if previously in Erase Suspend)

when the device is in the autoselect mode, or if DQ5 goes high

while the device is providing status information.

14. The Unlock Bypass Reset command is required to return to the

read mode when the device is in the unlock bypass mode.

7. The fourth cycle of the autoselect command sequence is a read

cycle. Data bits DQ15–DQ8 are don’t care. See the Autoselect

Command Sequence section for more information.

15. The system may read and program in non-erasing sectors, or

enter the autoselect mode, when in the Erase Suspend mode.

The Erase Suspend command is valid only during a sector erase

operation.

8. The device ID must be read in three cycles. The data is 01h for

top boot and 00h for bottom boot

16. The Erase Resume command is valid only during the Erase

Suspend mode.

9. If WP# protects the top two address sectors, the data is 98h for

factory locked and 18h for not factory locked. If WP# protects the

17. Command is valid when device is ready to read array data or when

device is in autoselect mode.

May 16, 2003

Am29LV320MT/B

33

D A T A S H E E T

WRITE OPERATION STATUS

The device provides several bits to determine the status of

a program or erase operation: DQ2, DQ3, DQ5, DQ6, and

DQ7. Table 14 and the following subsections describe the

function of these bits. DQ7 and DQ6 each offer a method

for determining whether a program or erase operation is

complete or in progress. The device also provides a

hardware-based output signal, RY/BY#, to determine

whether an Embedded Program or Erase operation is

in progress or has been completed.

valid data, the data outputs on DQ0–DQ6 may be still

invalid. Valid data on DQ0–DQ7 will appear on suc-

cessive read cycles.

Table 14 shows the outputs for Data# Polling on DQ7.

Figure 8 shows the Data# Polling algorithm. Figure 20

in the AC Characteristics section shows the Data#

Polling timing diagram.

DQ7: Data# Polling

START

The Data# Polling bit, DQ7, indicates to the host system

whether an Embedded Program or Erase algorithm is in

progress or completed, or whether the device is in Erase

Suspend. Data# Polling is valid after the rising edge of the

final WE# pulse in the command sequence.

Read DQ7–DQ0

Addr = VA

During the Embedded Program algorithm, the device out-

puts on DQ7 the complement of the datum programmed to

DQ7. This DQ7 status also applies to programming during

Erase Suspend. When the Embedded Program algorithm is

complete, the device outputs the datum programmed to

DQ7. The system must provide the program address to

read valid status information on DQ7. If a program address

falls within a protected sector, Data# Polling on DQ7 is ac-

tive for approximately 1 µs, then the device returns to the

read mode.

Yes

DQ7 = Data?

No

DQ5 = 1?

During the Embedded Erase algorithm, Data# Polling

produces a “0” on DQ7. When the Embedded Erase

algorithm is complete, or if the device enters the Erase

Suspend mode, Data# Polling produces a “1” on DQ7.

The system must provide an address within any of the

sectors selected for erasure to read valid status infor-

mation on DQ7.

Yes

Read DQ7–DQ0

Addr = VA

After an erase command sequence is written, if all

sectors selected for erasing are protected, Data# Poll-

ing on DQ7 is active for approximately 100 µs, then

the device returns to the read mode. If not all selected

sectors are protected, the Embedded Erase algorithm

erases the unprotected sectors, and ignores the se-

lected sectors that are protected. However, if the sys-

tem reads DQ7 at an address within a protected

sector, the status may not be valid.

Yes

DQ7 = Data?

No

PASS

FAIL

Notes:

1. VA = Valid address for programming. During a sector

erase operation, a valid address is any sector address

within the sector being erased. During chip erase, a

valid address is any non-protected sector address.

Just prior to the completion of an Embedded Program

or Erase operation, DQ7 may change asynchronously

with DQ0–DQ6 while Output Enable (OE#) is asserted

low. That is, the device may change from providing

status information to valid data on DQ7. Depending on

when the system samples the DQ7 output, it may read

the status or valid data. Even if the device has com-

pleted the program or erase operation and DQ7 has

2. DQ7 should be rechecked even if DQ5 = “1” because

DQ7 may change simultaneously with DQ5.

Figure 8. Data# Polling Algorithm

34

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

After an erase command sequence is written, if all sectors

RY/BY#: Ready/Busy#

selected for erasing are protected, DQ6 toggles for approxi-

mately 100 µs, then returns to reading array data. If not all

selected sectors are protected, the Embedded Erase algo-

rithm erases the unprotected sectors, and ignores the se-

lected sectors that are protected.

The RY/BY# is a dedicated, open-drain output pin

which indicates whether an Embedded Algorithm is in

progress or complete. The RY/BY# status is valid after

the rising edge of the final WE# pulse in the command

sequence. Since RY/BY# is an open-drain output, sev-

eral RY/BY# pins can be tied together in parallel with a

The system can use DQ6 and DQ2 together to determine

whether a sector is actively erasing or is erase-suspended.

When the device is actively erasing (that is, the Embedded

Erase algorithm is in progress), DQ6 toggles. When the de-

vice enters the Erase Suspend mode, DQ6 stops toggling.

However, the system must also use DQ2 to determine

which sectors are erasing or erase-suspended. Alterna-

tively, the system can use DQ7 (see the subsection on

DQ7: Data# Polling).

pull-up resistor to V_CC

.

If the output is low (Busy), the device is actively eras-

ing or programming. (This includes programming in

the Erase Suspend mode.) If the output is high

(Ready), the device is in the read mode, the standby

mode, or in the erase-suspend-read mode. Table 14

shows the outputs for RY/BY#.

DQ6: Toggle Bit I

If a program address falls within a protected sector,

DQ6 toggles for approximately 1 µs after the program

command sequence is written, then returns to reading

array data.

Toggle Bit I on DQ6 indicates whether an Embedded

Program or Erase algorithm is in progress or com-

plete, or whether the device has entered the Erase

Suspend mode. Toggle Bit I may be read at any ad-

dress, and is valid after the rising edge of the final

WE# pulse in the command sequence (prior to the

program or erase operation), and during the sector

erase time-out.

DQ6 also toggles during the erase-suspend-program

mode, and stops toggling once the Embedded Pro-

gram algorithm is complete.

Table 14 shows the outputs for Toggle Bit I on DQ6.

Figure 9 shows the toggle bit algorithm. Figure 21 in

the “AC Characteristics” section shows the toggle bit

timing diagrams. Figure 22 shows the differences be-

tween DQ2 and DQ6 in graphical form. See also the

subsection on DQ2: Toggle Bit II.

During an Embedded Program or Erase algorithm op-

eration, successive read cycles to any address cause

DQ6 to toggle. The system may use either OE# or

CE# to control the read cycles. When the operation is

complete, DQ6 stops toggling.

May 16, 2003

Am29LV320MT/B

35

D A T A S H E E T

DQ2: Toggle Bit II

The “Toggle Bit II” on DQ2, when used with DQ6, indi-

cates whether a particular sector is actively erasing

(that is, the Embedded Erase algorithm is in progress),

or whether that sector is erase-suspended. Toggle Bit

II is valid after the rising edge of the final WE# pulse in

the command sequence.

START

Read DQ7–DQ0

DQ2 toggles when the system reads at addresses

within those sectors that have been selected for era-

sure. (The system may use either OE# or CE# to con-

trol the read cycles.) But DQ2 cannot distinguish

whether the sector is actively erasing or is erase-sus-

pended. DQ6, by comparison, indicates whether the

device is actively erasing, or is in Erase Suspend, but

cannot distinguish which sectors are selected for era-

sure. Thus, both status bits are required for sector and

mode information. Refer to Table 14 to compare out-

puts for DQ2 and DQ6.

Read DQ7–DQ0

No

Toggle Bit

= Toggle?

Yes

Figure 9 shows the toggle bit algorithm in flowchart

form, and the section “DQ2: Toggle Bit II” explains the

algorithm. See also the RY/BY#: Ready/Busy# sub-

section. Figure 21 shows the toggle bit timing diagram.

Figure 22 shows the differences between DQ2 and

DQ6 in graphical form.

No

DQ5 = 1?

Yes

Read DQ7–DQ0

Twice

Reading Toggle Bits DQ6/DQ2

Refer to Figure 9 for the following discussion. When-

ever the system initially begins reading toggle bit sta-

tus, it must read DQ7–DQ0 at least twice in a row to

determine whether a toggle bit is toggling. Typically,

the system would note and store the value of the tog-

gle bit after the first read. After the second read, the

system would compare the new value of the toggle bit

with the first. If the toggle bit is not toggling, the device

has completed the program or erase operation. The

system can read array data on DQ7–DQ0 on the fol-

lowing read cycle.

Toggle Bit

= Toggle?

No

Yes

Program/Erase

Operation Not

Complete, Write

Reset Command

Program/Erase

Operation Complete

However, if after the initial two read cycles, the system

determines that the toggle bit is still toggling, the sys-

tem also should note whether the value of DQ5 is high

(see the section on DQ5). If it is, the system should

then determine again whether the toggle bit is tog-

gling, since the toggle bit may have stopped toggling

just as DQ5 went high. If the toggle bit is no longer

toggling, the device has successfully completed the

program or erase operation. If it is still toggling, the de-

vice did not completed the operation successfully, and

the system must write the reset command to return to

reading array data.

Note: The system should recheck the toggle bit even if

DQ5 = “1” because the toggle bit may stop toggling as DQ5

changes to “1.” See the subsections on DQ6 and DQ2 for

more information.

Figure 9. Toggle Bit Algorithm

The remaining scenario is that the system initially de-

termines that the toggle bit is toggling and DQ5 has

not gone high. The system may continue to monitor

the toggle bit and DQ5 through successive read cy-

cles, determining the status as described in the previ-

ous paragraph. Alternatively, it may choose to perform

36

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

other system tasks. In this case, the system must start

mand. When the time-out period is complete, DQ3

switches from a “0” to a “1.” If the time between addi-

tional sector erase commands from the system can be

assumed to be less than 50 µs, the system need not

monitor DQ3. See also the Sector Erase Command

Sequence section.

at the beginning of the algorithm when it returns to de-

termine the status of the operation (top of Figure 9).

DQ5: Exceeded Timing Limits

DQ5 indicates whether the program, erase, or

write-to-buffer time has exceeded a specified internal

pulse count limit. Under these conditions DQ5 produces a

“1,” indicating that the program or erase cycle was not suc-

cessfully completed.

After the sector erase command is written, the system

should read the status of DQ7 (Data# Polling) or DQ6

(Toggle Bit I) to ensure that the device has accepted

the command sequence, and then read DQ3. If DQ3 is

“1,” the Embedded Erase algorithm has begun; all fur-

ther commands (except Erase Suspend) are ignored

until the erase operation is complete. If DQ3 is “0,” the

device will accept additional sector erase commands.

To ensure the command has been accepted, the sys-

tem software should check the status of DQ3 prior to

and following each subsequent sector erase com-

mand. If DQ3 is high on the second status check, the

last command might not have been accepted.

The device may output a “1” on DQ5 if the system tries

to program a “1” to a location that was previously pro-

grammed to “0.” Only an erase operation can

change a “0” back to a “1.” Under this condition, the

device halts the operation, and when the timing limit

has been exceeded, DQ5 produces a “1.”

In all these cases, the system must write the reset

command to return the device to the reading the array

(or to erase-suspend-read if the device was previously

in the erase-suspend-program mode).

Table 14 shows the status of DQ3 relative to the other

status bits.

DQ3: Sector Erase Timer

DQ1: Write-to-Buffer Abort

After writing a sector erase command sequence, the

system may read DQ3 to determine whether or not

erasure has begun. (The sector erase timer does not

apply to the chip erase command.) If additional

sectors are selected for erasure, the entire time-out

also applies after each additional sector erase com-

DQ1 indicates whether a Write-to-Buffer operation

was aborted. Under these conditions DQ1 produces a

“1”.

The

system

must

issue

the

Write-to-Buffer-Abort-Reset command sequence to re-

turn the device to reading array data. See Write Buffer

Table 14. Write Operation Status

DQ7

DQ5

DQ2

Status

(Note 2)

DQ6

(Note 1)

DQ3

N/A

1

(Note 2)

DQ1 RY/BY#

Embedded Program Algorithm

Embedded Erase Algorithm

Program-Suspended

DQ7#

0

Toggle

0

No toggle

Toggle

0

Standard

Mode

N/A

Invalid (not allowed)

Data

1

0

Program

Suspend

Mode

Program-

Sector

Suspend

Non-Program

Read

Suspended Sector

Erase-Suspended

1

No toggle

Toggle

0

N/A

Toggle

N/A

Erase-

Sector

Suspend

Erase

Suspend

Mode

Non-EraseSuspended

Read

Data

Sector

Erase-Suspend-Program

(Embedded Program)

DQ7#

0

N/A

Busy (Note 3)

Abort (Note 4)

DQ7#

Toggle

0

N/A

0

1

0

Write-to-

Buffer

Notes:

1. DQ5 switches to ‘1’ when an Embedded Program, Embedded Erase, or Write-to-Buffer operation has exceeded the

maximum timing limits. Refer to the section on DQ5 for more information.

2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.

3. The Data# Polling algorithm should be used to monitor the last loaded write-buffer address location.

4. DQ1 switches to ‘1’ when the device has aborted the write-to-buffer operation.

May 16, 2003

Am29LV320MT/B

37

D A T A S H E E T

ABSOLUTE MAXIMUM RATINGS

Storage Temperature

Plastic Packages . . . . . . . . . . . . . . . –65°C to +150°C

20 ns

+0.8 V

Ambient Temperature

with Power Applied . . . . . . . . . . . . . –55°C to +125°C

–0.5 V

–2.0 V

Voltage with Respect to Ground

V_CC(Note 1) . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V

V_IO. . . . . . . . . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V

20 ns

A9, OE#, ACC, and RESET#

(Note 2). . . . . . . . . . . . . . . . . . . .–0.5 V to +12.5 V

Figure 10. Maximum Negative

Overshoot Waveform

All other pins (Note 1) . . . . . . –0.5 V to V_CC+0.5 V

Output Short Circuit Current (Note 3) . . . . . . 200 mA

Notes:

1. Minimum DC voltage on input or I/O pins is –0.5 V.

During voltage transitions, input or I/O pins may

overshoot V_SSto –2.0 V for periods of up to 20 ns.

Maximum DC voltage on input or I/O pins is V_CC+0.5 V.

See Figure 10. During voltage transitions, input or I/O

pins may overshoot to V_CC+2.0 V for periods up to 20

ns. See Figure 11.

20 ns

V_CC

+2.0 V

V_CC

+0.5 V

2. Minimum DC input voltage on pins A9, OE#, ACC, and

RESET# is –0.5 V. During voltage transitions, A9, OE#,

ACC, and RESET# may overshoot V_SSto –2.0 V for

periods of up to 20 ns. See Figure 10. Maximum DC

input voltage on pin A9, OE#, ACC, and RESET# is

+12.5 V which may overshoot to +14.0 V for periods up

to 20 ns.

2.0 V

20 ns

Figure 11. Maximum Positive

Overshoot Waveform

3. No more than one output may be shorted to ground at a

time. Duration of the short circuit should not be greater

than one second.

Stresses above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device. This

is a stress rating only; functional operation of the device at

these or any other conditions above those indicated in the

operational sections of this data sheet is not implied.

Exposure of the device to absolute maximum rating

conditions for extended periods may affect device reliability.

OPERATING RANGES

Industrial (I) Devices

Ambient Temperature (T_A) . . . . . . . . . –40°C to +85°C

Supply Voltages

V

_CCfor full voltage range . . . . . . . . . . . . . . . 2.7–3.6 V

V_CCfor regulated voltage range . . . . . . . . . . 3.0–3.6V

Note: Operating ranges define those limits between which

the functionality of the device is guaranteed.

38

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

DC CHARACTERISTICS

CMOS Compatible

Parameter

Symbol

Parameter Description

(Notes)

Test Conditions

Min

Typ

Max

Unit

V_IN= V_SSto V_CC

V_CC= V_{CC max}

,

I_LI

Input Load Current (1)

±1.0

µA

I_LIT

I_LR

A9, ACC Input Load Current

Reset Leakage Current

V_CC= V_{CC max}; A9 = 12.5 V

35

µA

V_CC= V_{CC max}; RESET# = 12.5 V

V_OUT= V_SSto V_CC

V_CC= V_{CC max}

,

I_LO

Output Leakage Current

±1.0

µA

5 MHz

1 MHz

3

13

4

34

43

50

80

20

40

60

V_CCActive Read Current

(2, 3)

I_CC1

CE# = V_IL,OE# = V_IH,

CE# = V_IL,OE# = V_IH

mA

1 MHz

I_CC2

V_CCInitial Page Read Current (2, 3)

V_CCIntra-Page Read Current (2, 3)

10 MHz

33 MHz

40

3

mA

I_CC3

CE# = V_IL,OE# = V_IH

6

mA

I_CC4

I_CC5

I_CC6

I_CC7

V_CCActive Write Current (3, 4)

V_CCStandby Current (3)

V_CCReset Current (3)

50

CE#, RESET# = V_CC± 0.3 V,

1

5

µA

WP# = V_IH

RESET# = V_SS± 0.3 V, WP# = V_IH

V_IH= V_CC± 0.3 V;

Automatic Sleep Mode (3, 5)

V_IL= V_SS± 0.3 V, WP# = V_IH

V_IL

V_IH

Input Low Voltage (5)

Input High Voltage (5)

– 0.5 V

1.9 V

0.8

V

V_CC+ 0.5

Voltage for Autoselect and Temporary

Sector Unprotect

V_ID

V_CC= 2.7 –3.6 V

11.5

12.5

V

V_OL

V_OH1

Output Low Voltage

I_OL= 4.0 mA, V_CC= V_{CC min}

I_OH= –2.0 mA, V_CC= V_{CC min}

I_OH= –100 µA, V_CC= V_{CC min}

0.15 x V_CC

V

0.85 V_CC

V_CC–0.4

2.3

Output High Voltage

V_OH2

V_LKO

Low V_CCLock-Out Voltage (6)

2.5

Notes:

1. On the WP#/ACC pin only, the maximum input load current when WP# = V_ILis ± 5.0 µA.

2. The I_CCcurrent listed is typically less than 2 mA/MHz, with OE# at V_IH.

3. Maximum I_CCspecifications are tested with V_CC= V_CCmax.

4. I_CCactive while Embedded Erase or Embedded Program is in progress.

5. Automatic sleep mode enables the low power mode when addresses remain stable for t_ACC+ 30 ns. V_CCvoltage requirements.

6. Not 100% tested.

May 16, 2003

Am29LV320MT/B

39

D A T A S H E E T

TEST CONDITIONS

Table 15. Test Specifications

Test Condition All Speeds

Output Load 1 TTL gate

3.3 V

Unit

2.7 kΩ

Device

Under

Test

Output Load Capacitance, C_L

(including jig capacitance)

30

pF

Input Rise and Fall Times

Input Pulse Levels

5

ns

V

C

L

6.2 kΩ

0.0–3.0

Input timing measurement

reference levels

1.5

V

Output timing measurement

reference levels

Note: Diodes are IN3064 or equivalent

Figure 12. Test Setup

KEY TO SWITCHING WAVEFORMS

WAVEFORM

INPUTS

OUTPUTS

Steady

Changing from H to L

Changing from L to H

Don’t Care, Any Change Permitted

Does Not Apply

Changing, State Unknown

Center Line is High Impedance State (High Z)

3.0 V

0.0 V

1.5 V

Input

Measurement Level

Output

Figure 13. Input Waveforms and

Measurement Levels

40

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

AC CHARACTERISTICS

Read-Only Operations

Parameter

Speed Options

JEDE

C

Std. Description

Test Setup

90R 100R 100 110R 110 120R 120 Unit

t_AVAVt_RCRead Cycle Time (Note 1)

t_AVQVt_ACCAddress to Output Delay

t_ELQVt_CEChip Enable to Output Delay

Min

90

100

30

110

120

ns

CE#,

OE# = V_IL

Max 90

OE# = V_ILMax 90

Max 25

t_PAC

Page Access Time

30

40

30

40

C

t_GLQVt_OEOutput Enable to Output Delay

Max 25

30

Chip Enable to Output High Z

t_EHQZt_DF

(Note 1)

Max

25

Output Enable to Output High Z

t_GHQZt_DF

(Note 1)

Max

Min

ns

Output Hold Time From

t_AXQXt_OHAddresses, CE# or OE#,

Whichever Occurs First

0

Read

Min

0

ns

Output Enable

t_OEHHold Time (Note

Toggle and

Data# Polling

10

1)

Notes:

1. Not 100% tested.

2. See Figure 12 and Table 15 for test specifications.

t_RC

Addresses Stable

Addresses

t_ACC

CE#

t_RH

t_DF

t_OE

OE#

t_OEH

WE#

t_CE

t_OH

Output Valid

HIGH Z

Outputs

RESET#

RY/BY#

0 V

Figure 14. Read Operation Timings

May 16, 2003

Am29LV320MT/B

41

D A T A S H E E T

AC CHARACTERISTICS

Same Page

A21

-

A2

A0

A1

Ad

Aa

t_ACC

Ab

t_PACC

Ac

t_PACC

Data Bus

Qa

Qb

Qc

Qd

CE#

OE#

* Figure shows word mode. Addresses are A1–A-1 for byte mode.

Figure 15. Page Read Timings

42

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

AC CHARACTERISTICS

Hardware Reset (RESET#)

Parameter

JEDEC

Std.

Description

All Speed Options

Unit

RESET# Pin Low (During Embedded Algorithms)

to Read Mode (See Note)

t_Ready

Max

20

µs

RESET# Pin Low (NOT During Embedded

Algorithms) to Read Mode (See Note)

t_Ready

500

ns

t_RP

t_RH

RESET# Pulse Width

Min

500

50

ns

µs

Reset High Time Before Read (See Note)

RESET# Low to Standby Mode

t_RPD

20

Note: Not 100% tested.

RY/BY#

CE#, OE#

RESET#

t_RH

t_RP

t_Ready

Reset Timings NOT during Embedded Algorithms

Reset Timings during Embedded Algorithms

t_Ready

RY/BY#

t_RB

CE#, OE#

RESET#

t_RP

Figure 16. Reset Timings

May 16, 2003

Am29LV320MT/B

43

D A T A S H E E T

AC CHARACTERISTICS

Erase and Program Operations

Parameter

Speed Options

100,

110,

120,

JEDEC

t_AVAV

Std.

t_WC

t_AS

Description

90R

100R

110R

120R Unit

Write Cycle Time (Note 1)

Address Setup Time

Min

90

100

110

120

ns

t_AVWL

0

15

45

0

Address Setup Time to OE# low during toggle bit

polling

t_ASO

t_AH

Min

ns

t_WLAX

Address Hold Time

Address Hold Time From CE# or OE# high

during toggle bit polling

t_AHT

t_DVWH

t_WHDX

t_DS

t_DH

Data Setup Time

Min

45

0

ns

Data Hold Time

t_OEPH

Output Enable High during toggle bit polling

20

Read Recovery Time Before Write

(OE# High to WE# Low)

t_GHWL

Min

0

ns

t_ELWL

t_WHEH

t_WLWH

t_WHDL

t_CS

t_CH

CE# Setup Time

Min

Typ

0

ns

µs

sec

ns

µs

ns

CE# Hold Time

t_WP

Write Pulse Width

35

30

240

7.5

15

t_WPH

Write Pulse Width High

Write Buffer Program Operation (Notes 2, 3)

Per Byte

Effective Write Buffer Program

Operation (Notes 2, 4)

Per Word

Per Byte

6.25

12.5

60

Accelerated Effective Write Buffer

Program Operation (Notes 2, 4)

t_WHWH1

Per Word

Byte

Single Word/Byte Program

Operation (Note 2, 5)

Typ

Word

60

Byte

54

Accelerated Single Word/Byte

Programming Operation (Note 2, 5)

Word

54

t_WHWH2

t_WHWH2Sector Erase Operation (Note 2)

Typ

Min

0.5

250

50

t_VHH

t_VCS

V_HHRise and Fall Time (Note 1)

V_CCSetup Time (Note 1)

WE# to RY/BY#

t_BUSY

90

100

110

120

Notes:

1. Not 100% tested.

2. See the “Erase And Programming Performance” section for more information.

3. For 1–16 words (or 1–32 bytes) programmed.

4. Effective write buffer specification is based upon a 16-word (or 32-byte) write buffer operation.

5. Word/Byte programming specification is based upon a single word/byte programming operation not utilizing the write buffer.

44

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

AC CHARACTERISTICS

Program Command Sequence (last two cycles)

Read Status Data (last two cycles)

t_AS

PA

t_WC

Addresses

555h

PA

t_AH

CE#

OE#

t_CH

t_WHWH1

t_WP

WE#

Data

t_WPH

t_CS

t_DS

t_DH

PD

D_OUT

A0h

Status

t_BUSY

t_RB

RY/BY#

V_CC

t_VCS

Notes:

1. PA = program address, PD = program data, D_OUTis the true data at the program address.

2. Illustration shows device in word mode.

Figure 17. Program Operation Timings

V_HH

V_ILor V_IH

ACC

t_VHH

Figure 18. Accelerated Program Timing Diagram

May 16, 2003

Am29LV320MT/B

45

D A T A S H E E T

AC CHARACTERISTICS

Erase Command Sequence (last two cycles)

Read Status Data

VA

t_AS

SA

t_WC

VA

Addresses

CE#

2AAh

555h for chip erase

t_AH

t_CH

OE#

t_WP

WE#

t_WPH

t_WHWH2

t_CS

t_DS

t_DH

In

Data

Complete

55h

30h

Progress

10 for Chip Erase

t_BUSY

t_RB

RY/BY#

V_CC

t_VCS

Notes:

1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”.

2. These waveforms are for the word mode.

Figure 19. Chip/Sector Erase Operation Timings

46

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

AC CHARACTERISTICS

t_RC

VA

Addresses

VA

t_ACC

t_CE

CE#

t_CH

t_OE

OE#

WE#

t_OEH

t_DF

t_OH

Complement

High Z

DQ7

Valid Data

Complement

Status Data

True

DQ0–DQ6

Status Data

True

Valid Data

t_BUSY

RY/BY#

Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data

read cycle.

Figure 20. Data# Polling Timings (During Embedded Algorithms)

May 16, 2003

Am29LV320MT/B

47

D A T A S H E E T

AC CHARACTERISTICS

t_AHT

t_AS

Addresses

t_AHT

t_ASO

CE#

t_OEH

WE#

t_CEPH

t_OEPH

OE#

t_DH

Valid Data

t_OE

Valid

Status

Valid

Status

Valid

Status

DQ6/DQ2

RY/BY#

Valid Data

(first read)

(second read)

(stops toggling)

Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status

read cycle, and array data read cycle

Figure 21. Toggle Bit Timings (During Embedded Algorithms)

Enter

Embedded

Erasing

Erase

Suspend

Enter Erase

Suspend Program

Erase

Resume

Erase

Erase Suspend

Read

Erase

Suspend

Program

Erase

Complete

WE#

Erase

Erase Suspend

Read

DQ6

DQ2

Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle

DQ2 and DQ6.

Figure 22. DQ2 vs. DQ6

48

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

AC CHARACTERISTICS

Temporary Sector Unprotect

Parameter

JEDEC

Std

Description

All Speed Options

Unit

t_VIDR

V_IDRise and Fall Time (See Note)

Min

500

ns

RESET# Setup Time for Temporary Sector

Unprotect

t_RSP

4

µs

Note: Not 100% tested.

V_ID

RESET#

V_SS, V_IL,

or V_IH

V_SS, V_IL,

or V_IH

t_VIDR

Program or Erase Command Sequence

CE#

WE#

t_RRB

t_RSP

RY/BY#

Figure 23. Temporary Sector Group Unprotect Timing Diagram

May 16, 2003

Am29LV320MT/B

49

D A T A S H E E T

AC CHARACTERISTICS

V

ID

IH

V

RESET#

SA, A6,

A1, A0

Valid*

Sector Group Protect or Unprotect

60h 60h

Valid*

Status

Verify

40h

Data

Sector Group Protect: 150 µs,

Sector Group Unprotect: 15 ms

1 µs

CE#

WE#

OE#

* For sector group protect, A6–A0 = 0xx0010. For sector group unprotect, A6–A0 = 1xx0010.

Figure 24. Sector Group Protect and Unprotect Timing Diagram

50

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

AC CHARACTERISTICS

Alternate CE# Controlled Erase and Program Operations

Parameter

Speed Options

100, 110,

120,

90R 100R 110R 120R Unit

JEDEC

t_AVAV

Std.

t_WC

t_AS

Description

Write Cycle Time (Note 1)

Address Setup Time

Address Hold Time

Data Setup Time

Data Hold Time

Min

90

100

110

120

ns

t_AVWL

t_ELAX

t_DVEH

t_EHDX

0

45

0

t_AH

t_DS

t_DH

Read Recovery Time Before Write

(OE# High to WE# Low)

t_GHEL

Min

0

ns

t_WLEL

t_EHWH

t_ELEH

t_EHEL

t_WS

t_WH

t_CP

WE# Setup Time

Min

Typ

0

ns

µs

sec

ns

WE# Hold Time

CE# Pulse Width

45

30

240

7.5

15

t_CPH

CE# Pulse Width High

Write Buffer Program Operation (Notes 2, 3)

Per Byte

Effective Write Buffer Program

Operation (Notes 2, 4)

Per Word

Per Byte

Per Word

Byte

6.25

12.5

60

Accelerated Effective Write Buffer

Program Operation (Notes 2, 4)

t_WHWH1

Single Word/Byte Program Operation

(Note 2, 5)

Typ

Word

60

Byte

54

Accelerated Single Word/Byte

Programming Operation (Note 2, 5)

Word

54

t_WHWH2

t_WHWH2Sector Erase Operation (Note 2)

t_RHRESET# High Time Before Write (Note 1)

Typ

Min

0.5

50

Notes:

1. Not 100% tested.

2. See the “Erase And Programming Performance” section for more information.

3. For 1–16 words (or 1–32 bytes in byte mode) programmed.

4. Effective write buffer specification is based upon a 16-word (or 32-byte) write buffer operation.

5. Word/Byte programming specification is based upon a single word/byte programming operation not utilizing the write buffer.

May 16, 2003

Am29LV320MT/B

51

D A T A S H E E T

AC CHARACTERISTICS

555 for program

PA for program

2AA for erase

SA for sector erase

555 for chip erase

Data# Polling

Addresses

PA

t_WC

t_WH

t_AS

t_AH

WE#

OE#

t_GHEL

t_{WHWH1 or 2}

t_CP

CE#

Data

t_WS

t_CPH

t_DS

t_BUSY

t_DH

DQ7#

D_OUT

t_RH

A0 for program

55 for erase

PD for program

30 for sector erase

10 for chip erase

RESET#

RY/BY#

Notes:

1. Figure indicates last two bus cycles of a program or erase operation.

2. PA = program address, SA = sector address, PD = program data.

3. DQ7# is the complement of the data written to the device. D_OUTis the data written to the device.

4. Waveforms are for the word mode.

Figure 25. Alternate CE# Controlled Write (Erase/Program)

Operation Timings

52

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

ERASE AND PROGRAMMING PERFORMANCE

Parameter

Typ (Note 1)

Max (Note 2)

Unit

sec

µs

Comments

Sector Erase Time

Chip Erase Time

0.5

32

3.5

64

Excludes 00h programming

prior to erasure (Note 6)

Byte

Word

Byte

60

600

540

1200

38

Single Word/Byte Program Time (Note 3)

60

µs

54

µs

Accelerated Single Word/Byte Program Time

(Note 3)

Word

54

µs

Total Write Buffer Program Time (Note 4)

Effective Write Buffer Program Time (Note 5)

240

7.5

15

µs

Excludes system level

overhead (Note 7)

Per Byte

Per Word

µs

75

µs

Total Accelerated Write Buffer Program Time (Note 4)

200

6.25

12.5

31.5

1040

33

µs

Per Byte

Per Word

µs

Effective Accelerated Write Buffer Program Time

(Note 5)

65

µs

Chip Program Time

73

sec

Notes:

1. Typical program and erase times assume the following conditions: 25°C, 3.0 V V_CC, Programming specification assume that

all bits are programmed to 00h.

2. Maximum values are measured at V_CC= 3.0, worst case temperature. Maximum values are valid up to and including 100,000

program/erase cycles.

3. Word/Byte programming specification is based upon a single word/byte programming operation not utilizing the write buffer.

4. For 1-16 words or 1-32 bytes programmed in a single write buffer programming operation.

5. Effective write buffer specification is calculated on a per-word/per-byte basis for a 16-word/32-byte write buffer operation.

6. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure.

7. System-level overhead is the time required to execute the command sequence (s) for the program command. See Tables 12 and

13 for further information on command definitions.

8. The device has a minimum erase and program cycle endurance of 100,000 cycles.

LATCHUP CHARACTERISTICS

Description

Min

Max

Input voltage with respect to V_SSon all pins except I/O pins

(including A9, OE#, and RESET#)

–1.0 V

12.5 V

Input voltage with respect to V_SSon all I/O pins

–1.0 V

V_CC+ 1.0 V

+100 mA

V

_CCCurrent

–100 mA

Note: Includes all pins except V_CC. Test conditions: V_CC= 3.0 V, one pin at a time.

May 16, 2003

Am29LV320MT/B

53

D A T A S H E E T

TSOP PIN AND BGA PACKAGE CAPACITANCE

Parameter Symbol

Parameter Description

Test Setup

Typ

6

Max

7.5

5.0

12

Unit

pF

TSOP

Fine-Pitch BGA

TSOP

C_IN

Input Capacitance

Output Capacitance

Control Pin Capacitance

V_IN= 0

V_OUT= 0

V_IN= 0

4.2

8.5

5.4

7.5

3.9

C_OUT

Fine-Pitch BGA

TSOP

6.5

9

C_IN2

Fine-Pitch BGA

4.7

Notes:

1. Sampled, not 100% tested.

2. Test conditions T_A= 25°C, f = 1.0 MHz.

DATA RETENTION

Parameter Description

Test Conditions

150°C

Min

Unit

Years

10

20

Minimum Pattern Data Retention Time

125°C

54

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

PHYSICAL DIMENSIONS

TS 048—48-Pin Standard Pinout Thin Small Outline Package (TSOP)

Dwg rev AA; 10/99

May 16, 2003

Am29LV320MT/B

55

D A T A S H E E T

PHYSICAL DIMENSIONS

TS 048—48-Pin Standard Pinout Thin Small Outline Package (TSOP)

Dwg rev AA; 10/99

56

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

PHYSICAL DIMENSIONS

FBC048—48-Ball Fine-pitch Ball Grid Array (fBGA) 9 x 8 mm Package

Dwg rev AF; 10/99

May 16, 2003

Am29LV320MT/B

57

D A T A S H E E T

PHYSICAL DIMENSIONS

LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm Package

58

Am29LV320MT/B

May 16, 2003

D A T A S H E E T

REVISION SUMMARY

Revision A (June 21, 2002)

Revision A+2 (September 19, 2002)

Initial release.

Distinctive Characteristics

Changed the flexible sector architecture from

Sixty-four 32 Kword/64-Kbyte sectors to Sixty-three 32

Kword/64-Kbyte sectors.

Revision A+1 (August 9, 2002)

MIRRORBIT 64 MBIT Device Family

Added 64 Fortified BGA to LV640MU device.

Revision A+3 (November 19, 2002)

Alternate CE# Controlled Erase and Program

Operations

Product Selector Guide and Read Only Operations

Changed the page access times and T_OE

Added t_RHparameter to table.

Moved the reverse speed options up into correct row.

Changed V_CCrange for full speed option to 2.7-3.6.

Erase and Program Operations

Added t_BUSYparameter to table.

Ordering Information and Physical Dimensions

CMOS Compatable

Removed FBD048 package.

Deleted the I_ACCspecification row in DC Characteris-

tics table.

Added FBC048 package.

Added TS048 package.

Figure 16. Program Operation Timings

Changed order numbers and package markings to re-

flect new package.

Added RY/BY# to waveform.

TSOP and BGA PIN Capacitance

Table 7. SecSi Sector Contents

Added the FBGA package.

Changed the x8 Secsi Sector Address range to

000010h–0000FFh.

Program Suspend/Program Resume Command

Sequence

Customer Lockable: SecSi Sector NOT

Programmed or Protected at the factory.

Changed 15 µs typical to maximum and added 5 µs

typical.

Added second bullet, SecSi sector-protect verify text

and figure 3.

Erase Suspend/Erase Resume Commands

Changed typical from 20 µs to 5 µs and added a maxi-

mum of 20 µs.

SecSi Sector Flash Memory Region, and Enter

SecSi Sector/Exit SecSi Sector Command

Sequence

Mirrorbit 32 Mbit Device Family

Noted that the ACC function and unlock bypass modes

are not available when the SecSi sector is enabled.

Changed 48-pin TSOP to 40-pin TSOP.

Byte/Word Program Command Sequence, Sector

Erase Command Sequence, and Chip Erase Com-

mand Sequence

Product Selector Guide, Valid Combinations Table,

Read-Only Operations, Erase and Program

Operations and Alternate CE# Controlled Erase

and Program Operations

Noted that the SecSi Sector, autoselect, and CFI

functions are unavailable when a program or erase

operation is in progress.”

Added regulated OPN to table.

Common Flash Memory Interface

Changed the text in the third paragraph to end with ”...

reading array data.”

Common Flash Memory Interface (CFI)

Changed wording in last sentence of third paragraph

from, “...the autoselect mode.” to “...reading array

data.”

Command Definitions

Modified the last sentences in the first paragraph.

Changed CFI website address.

May 16, 2003

Am29LV320MT/B

59

D A T A S H E E T

Erase and Programming Performance

Input values into table that were previously TBD.

Added note 3 and 4

Erase and Programming Performance

Changed the typicals and/or maximums of the Chip

Erase Time, Effective Write Buffer Program Time,

Byte/Word Program Time, and Accelerated Effective

Program Time to TBD.

Revision B (May 16, 2003)

Distinctive Characteristics

Revision A+4 (February 16, 2003)

Added typical active read current

Distinctive Characteristics

Global

Corrected performance characteristics.

Converted to full datasheet version.

Product Selector Guide

Modified SecSi Sector Flash Memory Region section

to include ESN references.

Added note 2.

CMOS Compatible

Ordering Information

Corrected Typ and Max values for the I_{CC 1, 2, and 3}

.

Corrected Valid Combinations table.

Added Note.

Erase and Program Operations and Alternate CE#

Controlled Erase and Program Operations

AC Characteristics

Changed Accelerated Effective Write Buffer Program

Operation value.

Input values in the t_WHWH1 and t_WHWH2 parameters in

the Erase and Program Options table that were previ-

ously TBD. Also, added note 5.

Erase and Programming Performance

Input values into table that were previously TBD.

Input values in the t_WHWH1 and t_WHWH2 parameters in

the Alternate CE# Controlled Erase and Program Op-

tions table that were previously TBD. Also, added note

5.

Modified notes.

Removed Word references.

Trademarks

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

60

Am29LV320MT/B

May 16, 2003

Representatives in U.S. and Canada

Sales Offices and Representatives

ARIZONA,

North America

Tempe - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(480)839-2320

CALIFORNIA,

ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(256)830-9192

ARIZONA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(602)242-4400

CALIFORNIA,

Calabasas - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(818)878-5800

Irvine - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (949)261-2123

San Diego - Centaur. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(858)278-4950

Santa Clara - Fourfront. . . . . . . . . . . . . . . . . . . . . . . . . . . .(408)350-4800

CANADA,

Burnaby, B.C. - Davetek Marketing. . . . . . . . . . . . . . . . . . . .(604)430-3680

Calgary,Alberta - Davetek Marketing. . . . . . . . . . . . . . . . .(403)283-3577

Kanata, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . . .(613)592-9540

Mississauga, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . .(905)672-2030

St Laurent, Quebec - J-Squared Tech. . . . . . . . . . . . . . . . ( 5 1 4 ) 74 7 - 1 2 1 1

COLORADO,

Irvine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(949)450-7500

Sunnyvale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(408)732-2400

COLORADO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(303)741-2900

CONNECTICUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(203)264-7800

FLORIDA,

Clearwater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(727)793-0055

Miami (Lakes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 5 ) 8 2 0 - 1 1 1 3

GEORGIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(770)814-0224

ILLINOIS,

Chicago . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(630)773-4422

MASSACHUSETTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (781)213-6400

MICHIGAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(248)471-6294

MINNESOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(612)745-0005

NEW JERSEY,

Chatham . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 97 3 ) 7 0 1 - 1 7 7 7

NEWYORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(716)425-8050

NORTH CAROLINA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(919)840-8080

OREGON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(503)245-0080

PENNSYLVANIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 1 5 ) 3 4 0 - 1 1 8 7

SOUTH DAKOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(605)692-5777

TEXAS,

Golden - Compass Marketing . . . . . . . . . . . . . . . . . . . . . .(303)277-0456

FLORIDA,

Melbourne - Marathon Technical Sales . . . . . . . . . . . . . . . .(321)728-7706

Ft. Lauderdale - Marathon Technical Sales . . . . . . . . . . . . . .(954)527-4949

Orlando - Marathon Technical Sales . . . . . . . . . . . . . . . . . .(407)872-5775

St. Petersburg - Marathon Technical Sales . . . . . . . . . . . . . .(727)894-3603

GEORGIA,

Duluth - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . (678)584-1128

ILLINOIS,

Skokie - Industrial Reps, Inc. . . . . . . . . . . . . . . . . . . . . . . . .(847)967-8430

INDIANA,

Kokomo - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (765)457-7241

IOWA,

Cedar Rapids - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . (319)294-1000

KANSAS,

Lenexa - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 3 ) 4 69 - 1 3 1 2

MASSACHUSETTS,

Austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (512)346-7830

Dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(972)985-1344

Houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(281)376-8084

VIRGINIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(703)736-9568

Burlington - Synergy Associates . . . . . . . . . . . . . . . . . . . . .(781)238-0870

MICHIGAN,

Brighton - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(810)227-0007

MINNESOTA,

St. Paul - Cahill, Schmitz & Cahill, Inc. . . . . . . . . . . . . . . . . .(651)699-0200

MISSOURI,

St. Louis - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . . (314)997-4558

NEW JERSEY,

International

AUSTRALIA, North Ryde . . . . . . . . . . . . . . . . . . . . . . .TEL(61)2-88-777-222

BELGIUM,Antwerpen . . . . . . . . . . . . . . . . . . . . . . . .TEL(32)3-248-43-00

BRAZIL, San Paulo . . . . . . . . . . . . . . . . . . . . . . . . . . TEL(55)11-5501-2105

CHINA,

Beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(86)10-6510-2188

Shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(86)21-635-00838

Shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(86)755-246-1550

FINLAND, Helsinki . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 5 8 ) 8 8 1 - 3 1 1 7

FRANCE, Paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 3 ) - 1 - 4 975 1 0 1 0

GERMANY,

Bad Homburg . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(49)-6172-92670

Munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 8 9 - 4 5 0 5 3 0

HONG KONG, Causeway Bay . . . . . . . . . . . . . . . . . . .TEL(85)2-2956-0388

ITALY, Milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 9 ) - 0 2 - 3 8 1 9 6 1

INDIA, New Delhi . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 9 1 ) 1 1 - 62 3 - 8 62 0

JAPAN,

es

Mt. Laurel - SJ Associates . . . . . . . . . . . . . . . . . . . . . . . . .(856)866-1234

NEWYORK,

Buffalo - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 74 1 - 7 1 1 6

East Syracuse - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . (315)437-8343

Pittsford - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . (716)586-3660

Rockville Centre - SJ Associates . . . . . . . . . . . . . . . . . . . . (516)536-4242

NORTH CAROLINA,

Raleigh - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . .(919)846-5728

OHIO,

Middleburg Hts - Dolfuss Root & Co. . . . . . . . . . . . . . . . . (440)816-1660

Powell - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . . (614)781-0725

Vandalia - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . .(937)898-9610

Westerville - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . (614)523-1990

OREGON,

Lake Oswego - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . .(503)670-0557

UTAH,

Murray - Front Range Marketing . . . . . . . . . . . . . . . . . . . .(801)288-2500

VIRGINIA,

Osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(81)6-6243-3250

Tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(81)3-3346-7600

KOREA, Seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(82)2-3468-2600

RUSSIA, Moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(7)-095-795-06-22

SWEDEN, Stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(46)8-562-540-00

TAIWAN,Taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(886)2-8773-1555

UNITED KINGDOM,

Frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(44)1276-803100

Haydock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(44)1942-272888

Glen Burnie - Coherent Solution, Inc. . . . . . . . . . . . . . . . . ( 4 1 0 ) 76 1 - 2 2 5 5

WASHINGTON,

Kirkland - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . .(425)822-9220

WISCONSIN,

Pewaukee - Industrial Representatives . . . . . . . . . . . . . . . .(262)574-9393

Advanced Micro Devices reserves the right to make changes in its product without notice

in order to improve design or performance characteristics.The performance

characteristics listed in this document are guaranteed by specific tests, guard banding,

design and other practices common to the industry. For specific testing details, contact

your local AMD sales representative.The company assumes no responsibility for the use of

any circuits described herein.

Representatives in Latin America

ARGENTINA,

Capital Federal Argentina/WW Rep. . . . . . . . . . . . . . . . . . . .54-11)4373-0655

CHILE,

Santiago - LatinRep/WWRep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993

COLUMBIA,

Bogota - Dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 7 1 ) 4 1 0 - 4 1 8 2

MEXICO,

Guadalajara - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . .(523)817-3900

Mexico City - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . .(525)752-2727

Monterrey - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . .(528)369-6828

PUERTO RICO,

AMD, the AMD Arrow logo and combination thereof, are trademarks of

Advanced Micro Devices, Inc. Other product names are for informational purposes only

and may be trademarks of their respective companies.

Boqueron - Infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . .(787)851-6000

One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088-3453 408-732-2400

TWX 910-339-9280 TELEX 34-6306 800-538-8450 http://www.amd.com

01/03

Printed in USA


型号：	AM29LV320MB110RE
厂家：	AMD
描述：	32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit 3.0 Volt-only Boot Sector Flash Memory 32兆位（2M ×16位/ 4米×8位）的MirrorBit 3.0伏只引导扇区闪存闪存
文件：	总61页 (文件大小：1335K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AM29LV320MB110RE [AMD]

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