AME8865ADT120 [AME]
1.5A CMOS LDO; 1.5A CMOS LDO
| 型号： | AME8865ADT120 |
| 厂家： | 
ANALOG MICROELECTRONICS |
| 描述： | 1.5A CMOS LDO |
| 文件： | 总25页 (文件大小：471K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AME
1.5A CMOS LDO
AME8865
¢ General Description
¢ TypicalApplication
TheAME8865 family of positive, CMOS linear regula-
tors, provide low dropout voltage (400mV @ 1.5A) and
excellent PSRR, thus making them ideal for power-sav-
ing systems. These rugged devices have both Thermal
Shutdown, and Current limit to prevent device failure un-
der the "Worst" of operating conditions.
IN
OUT
OUT
IN
AME8865
GND
C1
4.7µF
C2
4.7µF
The AME8865 is stable with an output capacitance of
4.7µF or larger.
¢ Features
( Fixed Version )
ò 400mVDropout @1.5A
ò Excellent Line and Load Regulation
ò Guaranteed 1.5AOutput Current
OUT
IN
IN
OUT
ADJ
AME8865
ò Fixed Output Voltage: 1V to 3.3V
ò Adjustable Output Voltage from 0.8V to 4.5V
ò Over Temperature/Over Current Protection
ò RoHS Compliant and 100%Lead (Pb)-Free
R1
R2
EN
GND
C1
4.7µF
C2
4.7µF
¢Applications
(Adjustable Version)
ò Motherboard,Desktop and Computer Perip-
herals
ò LCD Monitor
ò HandheldDevice
ò Data-Communication
Rev.A.04
1
AME
AME8865
1.5A CMOS LDO
¢ Functional Block Diagram
OUT
4
IN
2
1
EN
EN
R1
REF
AMP
R2
OCP/OTP
GND
3
(Fixed Version)
OUT
IN
2
1
4
EN
EN
R1
REF
AMP
ADJ
5
R2
OCP/OTP
GND
3
(Adjustable Version)
2
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Pin Configuration
3 Pin
SOT-223
Top View
SOT-223
Top View
AME 8865-AGTxxx
1. IN
AME 8865-BGTxxx
1. GND
2. GND(TAB)
3. OUT
2. OUT(TAB)
3. IN
AME8865
AME8865
1
2
3
1
2
3
* Die Attach:
* Die Attach:
Conductive Epoxy
Non-Conductive Epoxy
TO-252-2
Top View
TO-252-2
Top View
AME 8865-ACSxxx
1. IN
AME 8865-BCSxxx
1. GND
AME8865
AME8865
2. GND(TAB)
3. OUT
2. OUT(TAB)
3. IN
* Die Attach:
Conductive Epoxy
* Die Attach:
Non-Conductive Epoxy
1
2
3
1
2
3
TO-220-3
Top View
TO-220-3
Top View
AME 8865-BBTxxx
1. GND
AME 8865-ABTxxx
1. IN
2. OUT(TAB)
3. IN
2. GND(TAB)
3. OUT
AME8865
AME8865
* Die Attach:
* Die Attach:
Non-Conductive Epoxy
Conductive Epoxy
1
2
3
1
2
3
Rev.A.04
3
AME
AME8865
1.5A CMOS LDO
¢ Pin Configuration (Contd.)
3 Pin
TO-263-3
Top View
TO-263-3
Top View
AME 8865-ADTxxx
1. IN
AME 8865-BDTxxx
1. GND
AME8865
AME8865
2. GND(TAB)
3. OUT
2. OUT(TAB)
3. IN
* Die Attach:
* Die Attach:
1
2
3
1
2
3
Conductive Epoxy
Non-Conductive Epoxy
TO-263-2
Top View
TO-263-2
Top View
AME 8865-ADSxxx
1. IN
AME 8865-BDSxxx
1. GND
AME8865
AME8865
2. GND(TAB)
3. OUT
2. OUT(TAB)
3. IN
* Die Attach:
* Die Attach:
1
2
3
1
2
3
Conductive Epoxy
Non-Conductive Epoxy
5 Pin
TO-263-5
Top View
TO-263-5
Top View
AME 8865-ADVxxx
1. EN
AME 8865-BDVADJ
1. EN
2. IN
2. IN
AME8865
AME8865
3. GND(TAB)
4. OUT
3. GND(TAB)
4. OUT
5. NC
5. ADJ
1
2
3
4
5
1 2 3 4 5
* Die Attach:
* Die Attach:
Conductive Epoxy
Conductive Epoxy
4
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Pin Configuration (Contd.)
8 Pin
SOP-8/PP
Top View
SOP-8/PP
Top View
AME 8865-AZAADJ
1. ADJ
AME 8865-BZAADJ
1. EN
8
7
6
5
8
7
6
5
2. GND
3. GND
4. EN
2. IN
3. OUT
AME8865
AME8865
4. ADJ
5. IN
5. GND
6. GND
7. GND
8. GND
6. GND
7. GND
8. OUT
1
2
3
4
1
2
3
4
* Die Attach:
* Die Attach:
Conductive Epoxy
Conductive Epoxy
SOP-8/PP
Top View
SOP-8
Top View
AME 8865-CZAxxx
1. NC
AME 8865-AHAxxx
1. EN
8
7
6
5
8
7
6
5
2. GND
3. GND
4. EN
2. IN
3. OUT
AME8865
AME8865
4. ADJ
5. IN
5. GND
6. GND
7. GND
8. GND
6. GND
7. GND
8. OUT
2
3
4
1
2
3
4
1
* Die Attach:
* Die Attach:
Conductive Epoxy
Conductive Epoxy
Note:
Connect exposed pad (heat sink on the back) to GND.
Rev.A.04
5
AME
AME8865
1.5A CMOS LDO
¢ Pin Configuration
3 Pin
Pin Number
SOT-223 TO-252-2 TO-220-3 TO-263
Pin Name
Pin Description
A
B
A
B
A
B
A
B
Input voltage pin; should be decoupled
with 4.7ꢀF or greater capacitor.
1
3
1
3
1
3
1
3
IN
2
3
1
2
2
3
1
2
2
3
1
2
2
3
1
2
GND
Ground connection pin.
LDO voltage regulator output pin; should
be decoupled with a 4.7ꢀF or greater
value low ESR ceramic capacitor.
OUT
5 Pin
Pin Number
TO-263-5
Pin Name
Pin Description
A
B
2
2
IN
Input voltage pin; should be decoupled with 4.7ꢀF or greater capacitor.
Enable pin, Active “high". When pulled “low”, the PMOS pass transistor turns
off, current consuming less than 1ꢀA. When EN pin float outside, it’s weakly
pulled high form internal MOS.
1
1
EN
3
4
3
4
GND
OUT
Ground connection pin.
LDO voltage regulator output pin; should be decoupled with a 4.7ꢀF or greater
value low ESR ceramic capacitor.
5
N/A
5
NC
No connection.
N/A
ADJ
Feedback output voltage for adjustable device.
6
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Pin Configuration (Contd.)
8 Pin
Pin Number
Pin Name
Pin Description
SOP-8/PP
SOP-8
A
A
B
C
Input voltage pin; should be decoupled with 4.7ꢀF or greater
capacitor.
5
4
2
5
4
2
IN
Enable pin, Active “high". When pulled “low”, the PMOS pass
transistor turns off, current consuming less than 1ꢀA. When EN
pin float outside, it’s weakly pulled high form internal MOS.
1
1
EN
2
3
6
7
5
6
7
8
2
3
6
7
5
6
7
8
GND
Ground connection pin.
LDO voltage regulator output pin; should be decoupled with a 4.7ꢀ
F or greater value low ESR ceramic capacitor.
8
1
3
4
8
1
3
4
OUT
ADJ
Feedback output voltage for adjustable device.
Rev.A.04
7
AME
AME8865
1.5A CMOS LDO
¢ Ordering Information
AME8865 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configuration
Package Type
Number of Pins
Output Voltage
100: 1.0V
120: 1.2V
150: 1.5V
180: 1.8V
250: 2.5V
300: 3.0V
330: 3.3V
ADJ: Adjustable
A
1. IN
2. GND
3. OUT
B: TO-220
C: TO-252
D: TO-263
G: SOT-223
H: SOP-8
A: 8
S: 2
T: 3
V: 5
(SOT-223)
(TO-252-2)
(TO-220-3)
(TO-263-3)
(TO263-2)
B
1. GND
2. OUT
3. IN
(SOT-223)
(TO-252-2)
(TO-220-3)
(TO-263-3)
(TO-263-2)
A
1. EN
2. IN
(TO-263-5)
3. GND
4. OUT
5. NC
B
1. EN
2. IN
(TO-263-5)
3. GND
4. OUT
5. ADJ
A
(SOP-8)
1. EN
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
8
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Ordering Information (Contd.)
AME8865 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configuration
Package Type
Number of Pins
A: 8
Output Voltage
A
1. NC
Z: SOP-8/PP
100: 1.0V
120: 1.2V
150: 1.5V
180: 1.8V
250: 2.5V
300: 3.0V
330: 3.3V
ADJ: Adjustable
(SOP-8/PP)
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
B
1. EN
2. IN
(SOP-8/PP)
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
C
1. NC
(SOP-8/PP)
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
Rev.A.04
9
AME
AME8865
1.5A CMOS LDO
¢ Absolute Maximum Ratings
Parameter
Input Voltage
Maximum
Unit
V
-0.3 to 6
GND - 0.3 to VIN + 0.3
Output Voltage
V
Electrostatic Discharge (HBM)
Electrostatic Discharge (MM)
Electrostatic Discharge (CDM)
Junction Temperature
2
kV
200
1000
150
V
oC
Storage Temperature Range
200
¢ Recommended Operating Conditions
Parameter
Symbol
Rating
2.5 to 5.5
Unit
VIN
TA
TJ
Power Input Voltage
V
oC
oC
Ambient Temperature Range
Junction Temperaturen Range
- 40 to +85
- 40 to +125
10
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Thermal Information
Parameter
Package
Die Attach
Symbol Maximum
Unit
Conductive Epoxy
25
31
5
SOT-223
TO-252-2
TO-220-3
Non-Conductive Epoxy
Conductive Epoxy
Non-Conductive Epoxy
Conductive Epoxy
30
6
Thermal Resistance*
(Junction to Case)
Non-Conductive Epoxy
24
oC / W
θJC
TO-263-2
TO-263-3
TO-263-5
Conductive Epoxy
5
TO-263-2
TO-263-3
Non-Conductive Epoxy
27
SOP-8/PP
SOP-8
Conductive Epoxy
Conductive Epoxy
19
60
Conductive Epoxy
120
135
90
SOT-223
TO-252-2
TO-220-3
Non-Conductive Epoxy
Conductive Epoxy
Non-Conductive Epoxy
Conductive Epoxy
140
55
Thermal Resistance
(Junction to Ambient)
Non-Conductive Epoxy
80
oC / W
θJA
TO-263-2
TO-263-3
TO-263-5
Conductive Epoxy
80
TO-263-2
TO-263-3
Non-Conductive Epoxy
100
SOP-8/PP
SOP-8
Conductive Epoxy
Conductive Epoxy
84
150
Rev.A.04
11
AME
AME8865
1.5A CMOS LDO
¢ Thermal Information (Contd.)
Parameter
Package
Die Attach
Symbol Maximum
Unit
Conductive Epoxy
900
800
SOT-223
Non-Conductive Epoxy
Conductive Epoxy
1200
1000
2200
1600
TO-252-2
TO-220-3
Non-Conductive Epoxy
Conductive Epoxy
Non-Conductive Epoxy
PD
Internal Power Dissipation
mW
TO-263-2
TO-263-3
TO-263-5
Conductive Epoxy
1700
1400
TO-263-2
TO-263-3
Non-Conductive Epoxy
SOP-8/PP
SOP-8
Conductive Epoxy
Conductive Epoxy
1450
810
oC
Lead Temperature (soldering 10 sec)**
260
* Measure θJC on backside center of tab
** MIL-STD-202G210F
12
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Electrical Specifications
Typical values VIN=VOUT+1V( for VOUT< 2V VIN=2.5V) with typical TA=25oC, unless otherwise specified.
Test Condition
Parameter
Input Voltage
Symbol
Min Typ Max Units
VIN
2.5
-2
5.5
2
V
Output Accuracy
(For Fixed Version)
VOUT,ACC
%
VADJ
IADJ
ADJ Reference Voltage
ADJ Input Bias Current
0.784 0.8 0.816
1
V
VIN=5V, VADJ=1.0V
µA
Output Voltage Range
(For ADJ Version)
VOUT
0.8
4.5
V
IOUT=1.5A, 1.2V!VOUT(NOM) !1.8V
IOUT=1.5A, 1.8V< VOUT(NOM) !2.5V
IOUT=1.5A, 2.5V<VOUT(NOM)
600 Note2
500
Dropout Voltage
(Note1)
VDROP
mV
400
IOUT
IQ
Output Current
1.5
A
Quiescent Current
(For Fixed Version)
I
OUT=0mA
500
µA
REGLINE
REGLOAD
V
IN,MIN!VIN!VIN,MIN+0.7V 10mA
Line Regulation
0.25
%/V
%/A
VIN=VOUT+1V
10mA ! IOUT ! 1.5A
Load Regulation
0.8
60
2
F=120Hz, IOUT=100mA, COUT=4.7uF
VOUT = 0.9 x VOUT(NOM)
Power Supply Rejection Ratio
Output Current Limit
PSRR
ILIM
dB
A
1.6
1.4
VIN= VOUT(NOM)+1V, VOUT < 0.4V
Shutdown, temperature increasing
Restore, temperature decreasing
ISC
Short Circuit Current
900
150
130
mA
oC
TSHDN
Thermal Shutdown Temperature
VEH,HI
VEN,LO
V
IN(MIN) ! VIN ! 5.5V
IN(MIN) ! VIN ! 5.5V
VEN = VIN
VIN
EN Pin Voltage High
EN Pin Voltage Low
V
V
V
0.4
1.0
1.0
1.5
0.1
0.1
IEN
Enable Input Bias Current
Shutdown Current
µA
µA
VEN = 0V
VEN=0V
ISHDN
Note 1. Dropout Voltage is measured at VOUT = VOUT(NOM) x 98%
Note 2. VIN(MIN) = VDROP + VOUT(NOM) or VIN(MIN) = 2.5V whichever is greater
Rev.A.04
13
AME
AME8865
1.5A CMOS LDO
Calculating the Maximum Output Power
¢ Detailed Description
The maximum output power of theAME8865 is limited
by the maximum power dissipation of the package. By
calculation the power dissipation of the package as a
function of the input voltage, output voltage and output
current, the maximum input voltage can be obtained. The
maximum power dissipation should not exceed the
package's maximum power rating.
The AME8865 is low-dropout; low quiescent current
linear regulator designed for motherboard, notebook and
LCDmonitor applications. The output voltage range from
0.8V to 4.5V, and can drive 1.5Aloading current.
Capacitor Selection and Regulator Stability
PMAX = (VIN(MAX)-VOUT) x IOUT
Use 4.7µF for input capacitor and 4.7µF or greater for
output capacitor on theAME8865. Larger input capacitor
value and low ESR provide better supply noise rejection
and improve line transient response. To reduce output
noise and load transient response, use output capacitor
greater than 4.7uF. In addition, AME8865 can prevent
output voltage overshoot at power-on or enabled through
the EN/ENB pin.
Where: VIN(MAX) = maximum input voltage
PMAX = maximum power dissipation of the package
Adjustable Version
The adjustable version uses external feedback resis-
tors to generate an output voltage anywhere from 1.0V to
5.0V. By the equation:
R1
R2
VOUT =VADJ (1+
)
Feedback resistors R1 and R2 should be high enough
to keep quiescent current low, but increasing R1 + R2
will reduce stability. In general, R1 and R2 in the 10‘ s of
KΩ will produce adequate stability, given reasonable lay-
out precautions. To improve stability characteristics, keep
parasites on theADJ pin to a minimum, and lower R1 and
R2 values.
14
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Characterization Curve
Load Transient Response
Load Transient Response
VIN=5V, IOUT=10mA~1A, VOUT=2.5V
VIN=5V, IOUT=10mA~1.5A, VOUT=2.5V
VOUT
VOUT
(200mV/div) C2
(200mV/div)C2
IOUT
(1A/div)
I
(1A/dOivUT)
C4
C4
Time(50µs/div)
Time(50µs/div)
Power On from VIN
Power Off from VIN
VIN=5V, IOUT=1.5A,
VOUT=2.5V
VIN=5V, IOUT=1.5A, VOUT=2.5V
VIN
VIN
(2V/div)
VOUT
(2V/div)
C1
(2V/div)C1
VOUT
C2
(2V/div) C2
I
I
IN
C4
(1A/div) C4
IN
(1A/div)
Time(5ms/div)
Time(5ms/div)
Line Transient Response
VIN=3.5~4.5V, IOUT=10mA, VOUT=2.5V
VIN
(1V/div)
C1
C2
VOUT
(20mV/div)
Time(500µs/div)
Rev.A.04
15
AME
AME8865
1.5A CMOS LDO
¢ Characterization Curve
Output Voltage vs. Temperature
Quiescent Current vs. Temperature
3.43
3.39
3.35
3.31
3.27
3.23
0.7
0.65
0.6
0.55
0.5
0.45
0.4
0.35
0.3
-40 -25 -10
5
20 35
50
65 80
95 110 125
-40 -25 -10
5
20
35 50
65
80
95 110 125
Temperature (oC)
Temperature (oC)
Dropout Voltage vs. Temperature
Line Regulation vs. Temperature
0.6
1.4
1.2
1
0.55
0.5
0.45
0.8
0.6
0.4
0.2
0
0.4
0.35
0.3
0.25
0.2
-40 -25 -10
5
20 35
50
65
80
95 110 125
-40 -25 -10
5
20
35
50
65
80
95 110 125
Temperature (oC)
Temperature (oC)
Short Circuit Current vs. Input Voltage
1.8
1.7
1.6
1.5
1.4
1.3
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
16
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Date Code Rule
Month Code
1: January 7: July
2: February 8: August
3: March
4: April
5: May
9: September
A: October
B: November
C: December
6: June
¢ Tape and Reel Dimension
SOT-223
P
W
AME
AME
PIN 1
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOT-223
12.0 0.1 mm
4.0 0.1 mm
2500pcs
330 1 mm
Rev.A.04
17
AME
AME8865
1.5A CMOS LDO
¢ Tape and Reel Dimension (Contd.)
TO-252-2
P
W
PIN 1
E M A
E M A
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-252-2
16.0 0.1 mm
4.0 0.1 mm
2500pcs
330 1 mm
TO-263-3
P
W
PIN 1
E M A
E M A
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-3
24.0 0.1 mm
4.0 0.1 mm
800pcs
330 1 mm
18
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Tape and Reel Dimension (Contd.)
TO-263-2
P
W
PIN 1
E M A
E M A
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-2
24.0 0.1 mm
4.0 0.1 mm
800pcs
330 1 mm
TO-263-5
P
W
PIN 1
E M A
E M A
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-5
24.0 0.1 mm
4.0 0.1 mm
800pcs
330 1 mm
Rev.A.04
19
AME
AME8865
1.5A CMOS LDO
¢ Tape and Reel Dimension (Contd.)
SOP-8/PP
P
PIN 1
W
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOP-8/PP
12.0 0.1 mm
4.0 0.1 mm
2500pcs
330 1 mm
SOP-8
P
PIN 1
W
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOP-8
12.0 0.1 mm
4.0 0.1 mm
2500pcs
330 1 mm
20
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Package Dimension
SOT-223
TopView
SideView
MILLIMETERS
INCHES
SYMBOLS
D
MIN
0.01
0.60
2.90
0.24
6.20
3.30
MAX
0.10
0.84
3.15
0.38
6.71
3.71
MIN
MAX
0.0039
0.0330
0.1240
0.0150
0.2640
0.1460
B1
Ĉ
C
0.0004
0.0236
0.1140
0.0094
0.2441
0.1299
A1
B
B1
C
D
E
13 o(4X)
H
E
PIN1
2.30 BSC
0.0906 BSC
e
e
1.40
6.70
0o
1.80
7.30
10o
0.0551
0.2638
0o
0.0709
0.2874
10o
F
Front View
13o(4X)
H
F
ꢀ
A1
B
TO-252-2
MILLIMETERS
INCHES
MIN
SYMBOLS
MIN
0.43
1.60
0.51
0.43
6.35
5.36
2.20
-
MAX
0.89
1.95
1.78
0.60
6.80
6.22
3.00
* 2.30
0.97
5.50
1.65
MAX
0.0350
0.0768
0.0701
0.0236
0.2677
0.2450
0.1181
*0.0906
0.0380
0.2165
0.0650
Top View
Side View
0.0169
0.0630
0.0200
0.0169
0.2500
0.2110
0.0866
-
A
B
E
K
B
A
C
D
L
E
F
F
G
H
E1
0.50
4.95
0.90
0.0197
0.1950
0.0354
J
G
PIN 1
J
C
K
D
H
L
3.80 REF
0.1496 REF
D1
E1
3.81
5.10
0.1500
0.2008
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Mini-
mum lead thickness is the minimum thickness of base material.
Rev.A.04
21
AME
AME8865
1.5A CMOS LDO
¢ Package Dimension (Contd.)
TO-220-3
MILLIMETERS
INCHES
MIN
Top View
Side View
Bottom View
SYMBOLS
G
C
MIN
5.58
2.03
0.50
0.30
9.65
3.53
0.50
1.14
2.28
12.70
14.22
5.00
7.30
MAX
7.49
4.83
1.45
1.15
10.67
4.09
1.15
1.78
2.80
14.74
16.51
5.70
8.05
MAX
0.2949
0.1902
0.0571
0.0453
0.4201
0.1610
0.0453
0.0701
0.1102
0.5803
0.6500
0.2244
0.3169
D
A
C
D
E
G
I
0.2197
0.0799
0.0197
0.0118
0.3799
0.1390
0.0197
0.0449
0.0898
0.5000
0.5598
0.1969
0.2874
A
I
P
P1
G1
PIN 1
M
K
M
N
O
P
O
E
N
K
P1
G1
MILLIMETERS
INCHES
TO-263-3
SYMBOLS
MIN
9.65
8.28
4.06
0.50
1.14
MAX
10.67
9.66
MIN
MAX
0.420
0.380
0.190
0.054
0.057
Side View
Top View
Bottom View
0.380
0.326
0.160
0.020
0.045
A
B
C
D
E
G
H
K
N
P
R
A
K
B
E
4.83
1.36
B1
A2
1.45
H
*2.54
*0.100
14.60
0.99
15.875
2.93
0.5748
0.625
PIN 1
0.03898 0.11535
0.012
P
D
G
0.31
N
R
2.28
0o
2.80
8o
0.08976 0.11024
0o
8o
Front View
5.00
7.30
5.70
8.05
0.197
0.287
0.224
0.317
B1
A2
C
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Mini-
mum lead thickness is the minimum thickness of base material.
22
Rev.A.04
AME
1.5A CMOS LDO
AME8865
¢ Package Dimension (Contd.)
TO-263-2
MILLIMETERS
INCHES
SYMBOLS
MIN
9.65
8.28
4.06
0.50
1.14
MAX
10.42
9.66
MIN
0.380
0.326
0.160
0.020
0.045
MAX
0.410
0.380
0.190
0.054
0.057
TOPVIEW
A
SIDEVIEW
E
BOTTOMVIEW
A
B
C
D
E
G
H
K
N
P
R
K
B
4.83
1.36
B2
1.45
H
*2.54
*0.100
A2
14.60
0.99
15.80
2.93
0.575
0.039
0.622
0.115
PIN1
D
P
0.38 REF
0.015 REF
G
N
R
2.28
0o
2.80
8o
0.090
0.110
8o
0o
C
6.30
7.30
8.20
8.95
0.248
0.287
0.323
0.352
B2
A2
FRONTVIEW
*: Typical Value
Notes:
1. Controlling dimension: Millimeters
2. Maximum lead thickness includes lead finish thickness Minimum lead
thickness is the minimum thickness of base material.
TO-263-5
MILLIMETERS
INCHES
MIN
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A1
SYMBOLS
MIN
9.800
8.200
4.310
0.660
1.140
MAX
10.668
9.169
4.800
0.910
1.450
MAX
0.420
0.361
0.189
0.036
0.057
A
K
E
0.386
0.323
0.170
0.026
0.045
A
B
C
D
E
B1
B
H
1.70 REF
0.067 REF
G
H
K
N
P
PIN1
D
14.600
1.143
0.310
2.280
15.875
1.760
0.580
2.800
0.575
0.045
0.012
0.090
0.625
0.069
0.023
0.110
P
N
G
R
C
0o
8o
0o
8o
R
A1
FRONT VIEW
7.500
5.800
7.700
6.450
0.295
0.228
0.303
0.254
B1
Rev.A.04
23
AME
AME8865
1.5A CMOS LDO
¢ Package Dimension (Contd.)
SOP-8/PP
TOP VIEW
D1
SIDE VIEW
θ
MILLIMETERS
INCHES
SYMBOLS
MIN
1.350
0.000
1.250
0.100
3.750
5.700
0.300
0.310
4.720
MAX
1.750
0.250
1.650
0.250
4.150
6.300
1.270
0.510
5.120
MIN
0.053
0.000
0.049
0.004
0.148
0.224
0.012
0.012
0.186
MAX
0.069
0.010
0.065
0.010
0.163
0.248
0.050
0.020
0.202
A
A1
A2
C
E1
E2
E
L1
E
C
E1
L1
b
PIN 1
D
D
1.270 BSC
0.050 BSC
e
b
e
0o
8o
0o
8o
θ
2.050
2.090
2.600
3.500
0.081
0.082
0.102
0.138
E2
D1
FRONT VIEW
SOP-8
24
Rev.A.04
www.ame.com.tw
E-Mail: sales@ame.com.tw
Life Support Policy:
These products of AME, Inc. are not authorized for use as critical components in life-support
devices or systems, without the express written approval of the president
of AME, Inc.
AME, Inc. reserves the right to make changes in the circuitry and specifications of its devices and
advises its customers to obtain the latest version of relevant information.
AME, Inc. , September 2013
Document: A003B-DS8865-A.04
Corporate Headquarter
AME, Inc.
8F, 12 WenHu St., Nei-Hu
Taipei 114, Taiwan .
Tel: 886 2 2627-8687
Fax: 886 2 2659-2989
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