A62S7308BX-70S [AMICC]
128K X 8 BIT LOW VOLTAGE CMOS SRAM; 128K ×8位的低电压CMOS SRAM型号: | A62S7308BX-70S |
厂家: | AMIC TECHNOLOGY |
描述: | 128K X 8 BIT LOW VOLTAGE CMOS SRAM |
文件: | 总17页 (文件大小:264K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
A62S7308B Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Document Title
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No. History
Issue Date
Remark
0.0
0.1
Initial issue
September 5, 2000
October 12, 2000
Preliminary
Change max. power supply voltage from 3.3V to 3.6V
Change min. VIH from 2.2V to 2.4V
Add feature “Interfaces directly with 3.3V typ. logic chip”
Remove A62S7308B-10S/SI part
0.2
Add A62S7308B-55S/SI part
March 9, 2001
Change Input Pulse Levels from 0.4V~2.4V to 0V~3.0V in AC Test
Conditions table
PRELIMINARY
(March, 2001, Version 0.2)
AMIC Technology, Inc.
A62S7308B Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Features
n Power supply range: 2.7V to 3.6V
n Access times: 55ns (max.): for VCC = 3.0V to 3.6V
70ns (max.): for VCC = 2.7V to 3.6V
n Current:
n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL compatible
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy
application
A62S7308B-S series: Operating: 30mA (max.)
n Data retention voltage: 2V (min.)
Standby: 5mA (max.)
n Available in 32-pin SOP, TSOP, sTSOP (8X
13.4mm) forward type and 36-ball Mini BGA (6X8)
A62S7308B-SI series: Operating: 30mA (max.)
Standby: 10mA (max.)
n Extended operating temperature range: -25°C to 85°C
for -SI series
packages
n Interfaces directly with 3.3V typ. logic chip
General Description
The A62S7308B is a low operating current 1048,576-bit
static random access memory organized as 131,072
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for power down and
a device enable and an output enable input are included
for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
n SOP
n TSOP/(sTSOP)
n Mini BGA (6X8) Top View
(forward type)
NC
1
VCC
A15
CE2
32
31
30
1
2
3
4
5
6
A16
A14
A12
A7
2
3
A11
A9
A8
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
A
B
C
D
E
F
A0
A1 CE2 A3
A6
A8
WE
A13
A8
4
29
28
27
26
I/O4 A2
A4
A7 I/O0
WE
7
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
I/O
5
6
6
I/O
A6
5
1
5
I/O
NC A5
I/O
I/O
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
A5
A4
A3
A2
A9
7
A62S7308BV
(A62S7308BX)
VSS
VCC
VCC
VSS
8
A11
OE
25
24
23
22
9
10
11
12
13
14
15
16
9
A10
10
11
12
13
14
15
16
6
2
I/O
NC NC
I/O
CE1
A1
A0
A6
A5
A4
I/O7
21
20
19
18
17
G
H
I/O7
A16 A15 I/O3
OE
CE1
I/O 0
I/O 1
I/O 2
GND
I/O6
I/O5
I/O4
I/O3
A9 A10 A11 A12 A13 A14
PRELIMINARY
(March, 2001, Version 0.2)
1
AMIC Technology, Inc.
A62S7308B Series
Block Diagram
A0
VCC
GND
ROW
512 X 2048
A14
A15
A16
DECODER
MEMORY ARRAY
I/O0
COLUMN I/O
INPUT DATA
CIRCUIT
I/O7
CE2
CE1
OE
CONTROL
CIRCUIT
WE
Pin Descriptions - SOP
Pin Description - TSOP/sTSOP
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1
NC
No Connection
1 - 4, 7,
10 - 20, 31
A0 - A16
Address Inputs
Write Enable
2 - 12, 23,
25 - 28, 31
A0 - A16
Address Inputs
5
WE
CE2
VCC
NC
13 - 15,
17 - 21
6
8
9
Chip Enable 2
Power Supply
No Connection
I/O0 - I/O7
Data Inputs/Outputs
16
22
GND
CE1
OE
Ground
Chip Enable 1
21 - 23,
25 - 29
I/O0 - I/O7
Data Inputs/Outputs
24
29
Output Enable
Write Enable
24
30
GND
CE1
OE
Ground
WE
CE2
VCC
Chip Enable 1
30
32
Chip Enable 2
Power Supply
32
Output Enable
PRELIMINARY
(March, 2001, Version 0.2)
2
AMIC Technology, Inc.
A62S7308B Series
Recommended DC Operating Conditions
(TA = 0°C to + 70°C or -25°C to 85°C)
Symbol
VCC
GND
VIH
Parameter
Supply Voltage
Min.
2.7
0
Typ.
Max.
3.6
0
Unit
V
3.0
Ground
0
-
V
Input High Voltage
Input Low Voltage
Output Load
2.4
-0.3
-
VCC + 0.3
V
V
VIL
-
+0.6
30
1
CL
-
pF
-
TTL
Output Load
-
-
Absolute Maximum Ratings*
*Comments
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)
A62S7308B-55S/70S
A62S7308B-55SI/70SI
Symbol
Parameter
Unit
Conditions
Min.
Max.
Min.
Max.
Input Leakage
Current
-
1
-
1
VIN = GND to VCC
çILIú
mA
mA
CE1 = VIH or CE2 = VIL or
Output Leakage
Current
-
-
-
1
3
-
-
-
1
3
çILOú
OE = VIH or WE = VIL
VI/O = GND to VCC
Active Power Supply
Current
CE1 = VIL, CE2 = VIH
II/O = 0mA
ICC
mA
mA
Min. Cycle, Duty = 100%
Dynamic Operating
Current
ICC1
30
30
CE1 = VIL, CE2 = VIH
II/O = 0mA
CE1 = VIL, CE2 = VIH
VIH = VCC , VIL = 0V
F = 1MHz, II/O = 0mA
Dynamic Operating
Current
ICC2
-
3
-
3
mA
PRELIMINARY
(March, 2001, Version 0.2)
3
AMIC Technology, Inc.
A62S7308B Series
DC Electrical Characteristics (continued)
A62S7308B-55S/70S A62S7308B-55SI/70SI
Symbol
Parameter
Unit
Conditions
Min.
Max.
Min.
Max.
CE1 = VIH or
CE2 = VIL
ISB
-
0.3
-
0.3
mA
Standby Power
Supply Current
CE2 £ 0.2V,
or
³ VCC - 0.2V
ISB1
-
5
-
10
CE1
mA
CE2 ³ VCC - 0.2V
VOL
VOH
Output Low Voltage
Output High Voltage
-
0.4
-
-
0.4
-
V
V
IOL = 2.1mA
2.4
2.4
IOH = -1.0mA
Truth Table
Mode
CE2
X
I/O Operation
High Z
High Z
High Z
DOUT
Supply Current
ISB, ISB1
CE1
H
OE
X
WE
X
Standby
X
L
X
X
ISB, ISB1
Output Disable
Read
L
L
L
H
H
L
H
ICC, ICC1, ICC2
ICC, ICC1, ICC2
ICC, ICC1, ICC2
H
H
Write
H
X
L
DIN
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
CIN*
Parameter
Min.
Max.
Unit
pF
Conditions
VIN = 0V
Input Capacitance
6
8
CI/O*
Input/Output Capacitance
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
PRELIMINARY
(March, 2001, Version 0.2)
4
AMIC Technology, Inc.
A62S7308B Series
AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)
A62S7308B-55S/SI
A62S7308B-70S/SI
Unit
Symbol
Parameter
(VCC = 3.0V to 3.6V) (VCC = 2.7V to 3.6V)
Min.
Max.
Min.
Max.
Read Cycle
tRC
Read Cycle Time
55
-
-
70
-
-
ns
ns
ns
tAA
Address Access Time
55
55
70
70
tACE1
-
-
CE1
CE2
Chip Enable Access Time
tACE2
tOE
-
-
55
30
-
-
-
70
35
-
ns
ns
ns
Output Enable to Output Valid
Chip Enable to Output in Low Z
tCLZ1
10
10
CE1
CE2
tCLZ2
tOLZ
10
10
0
-
-
10
5
-
-
ns
ns
ns
Output Enable to Output in Low Z
Chip Disable to Output in High Z
tCHZ1
20
0
25
CE1
CE2
tCHZ2
tOHZ
tOH
0
0
5
20
20
-
0
0
25
25
-
ns
ns
ns
Output Disable to Output in High Z
Output Hold from Address Change
10
Write Cycle
tWC
Write Cycle Time
55
50
0
-
-
70
60
0
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCW
Chip Enable to End of Write
Address Setup Time
tAS
-
-
tAW
Address Valid to End of Write
Write Pulse Width
50
40
0
-
60
50
0
-
tWP
-
-
tWR
Write Recovery Time
-
-
tWHZ
tDW
Write to Output in High Z
Data to Write Time Overlap
Data Hold from Write Time
Output Active from End of Write
0
25
-
0
30
-
25
0
30
0
tDH
-
-
tOW
5
-
5
-
Notes: tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
PRELIMINARY
(March, 2001, Version 0.2)
5
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms
Read Cycle 1(1)
tRC
Address
tAA
OE
tOE
tOH
5
tOLZ
CE1
tACE1
5
5
tCHZ1
tCLZ1
CE2
5
tACE2
tOHZ
5
tCHZ2
5
tCLZ2
DOUT
Read Cycle 2 (1, 2, 4)
tRC
Address
tAA
tOH
tOH
DOUT
PRELIMINARY
(March, 2001, Version 0.2)
6
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms (continued)
Read Cycle 3 (1, 3, 4, 6)
CE1
tACE1
5
tCLZ1
5
tCHZ1
DOUT
Read Cycle 4 (1, 4, 7, 8)
CE2
tACE2
5
tCHZ2
5
tCLZ2
DOUT
Notes: 1. WE is high for Read Cycle.
2. Device is continuously enabled CE1 = VIL and CE2 = VIH.
3. Address valid prior to or coincident with CE1 transition low.
4. OE = VIL.
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
6. CE2 is high.
7. CE1 is low.
8. Address valid prior to or coincident with CE2 transition high.
PRELIMINARY
(March, 2001, Version 0.2)
7
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms (continued)
Write Cycle 1(6)
(Write Enable Controlled)
WC
t
Address
3
AW
t
WR
t
5
CW
t
(4)
(4)
CE1
CE2
1
2
WP
AS
t
t
WE
DW
DH
t
t
IN
D
WHZ
t
OW
t
OUT
D
PRELIMINARY
(March, 2001, Version 0.2)
8
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms (continued)
Write Cycle 2(6)
(Chip Enable Controlled)
tWC
Address
3
tAW
tWR
5
tCW
CE1
CE2
(4)
(4)
1
tAS
5
tCW
2
tWP
WE
tDW
tDH
DIN
7
tWHZ
DOUT
Notes: 1. tAS is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .
3. tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
PRELIMINARY
(March, 2001, Version 0.2)
9
AMIC Technology, Inc.
A62S7308B Series
AC Test Conditions
Input Pulse Levels
0V to 3V
5 ns
Input Rise and Fall Time
Input and Output Timing Reference Levels
Output Load
1.5V
See Figures 1 and 2
TTL
TTL
CL
CL
30pF
5pF
* Including scope and jig.
* Including scope and jig.
Figure 1. Output Load
Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
Data Retention Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)
Symbol
Parameter
Min.
Max.
Unit
Conditions
CE2 £ 0.2V,
VDR
VCC for Data Retention
2.0
3.6
V
or CE1 ³ VCC - 0.2V,
CE2 ³ VCC - 0.2V
S-Version
SI-Version
-
-
2*
VCC = 2.0V, CE2 £ 0.2V,
ICCDR
Data Retention Current
mA
or CE1 ³ VCC - 0.2V
CE2 ³ VCC - 0.2V
5**
tCDR
tR
Chip Disable to Data Retention Time
Operation Recovery Time
0
-
-
ns
ns
See Retention Waveform
tRC
* A62S7308B-55S/70S ICCDR: Max. 1mA at TA = 0°C to + 40°C
** A62S7308B-55SI/70SI ICCDR: Max. 1mA at TA = 0°C to + 40°C
PRELIMINARY
(March, 2001, Version 0.2)
10
AMIC Technology, Inc.
A62S7308B Series
Low VCC Data Retention Waveform (1) (CE1 Controlled)
DATA RETENTION MODE
VCC
CE1
2.7V
2.7V
tCDR
tR
VDR
³ 2V
VIH
VIH
CE1
³ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
CE2
2.7V
2.7V
tCDR
tR
VDR
³ 2V
VIL
VIL
CE2
£ 0.2V
PRELIMINARY
(March, 2001, Version 0.2)
11
AMIC Technology, Inc.
A62S7308B Series
Ordering Information
Part No.
Operating Current
Max. (mA)
Standby Current
Access Time
(ns)
Package
Max. (mA)
A62S7308BM-55S
A62S7308BM-55SI
A62S7308BV-55S
A62S7308BV-55SI
A62S7308BX-55S
A62S7308BX-55SI
A62S7308BG-55S
A62S7308BG-55SI
A62S7308BM-70S
A62S7308BM-70SI
A62S7308BV-70S
A62S7308BV-70SI
A62S7308BX-70S
A62S7308BX-70SI
A62S7308BG-70S
A62S7308BG-70SI
5
10
5
32L SOP
32L SOP
32L TSOP
32L TSOP
32L sTSOP
32L sTSOP
36B Mini BGA
36B Mini BGA
32L SOP
10
5
55
30
10
5
10
5
10
5
32L SOP
32L TSOP
32L TSOP
32L sTSOP
32L sTSOP
36B Mini BGA
36B Mini BGA
10
5
70
30
10
5
10
PRELIMINARY
(March, 2001, Version 0.2)
12
AMIC Technology, Inc.
A62S7308B Series
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
32
17
q
L
16
1
b
Detail F
D
LE
e
S
y
See Detail F
Seating Plane
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
-
Max
0.118
-
Min
Nom
-
Max
A
A1
A2
b
-
-
3.00
-
0.004
0.101
0.014
0.006
-
-
0.10
2.57
0.36
0.15
-
-
0.106
0.016
0.008
0.805
0.445
0.050
0.556
0.031
0.055
-
0.111
0.020
0.012
0.817
0.450
0.056
0.566
0.039
0.063
0.036
0.004
10°
2.69
0.41
0.20
20.45
11.30
1.27
14.12
0.79
1.40
-
2.82
0.51
0.31
20.75
11.43
1.42
14.38
0.99
1.60
0.91
0.10
10°
c
D
E
0.440
0.044
0.546
0.023
0.047
-
11.18
1.12
13.87
0.58
1.19
-
e
HE
L
LE
S
y
-
-
-
-
0°
-
0°
-
q
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(March, 2001, Version 0.2)
13
AMIC Technology, Inc.
A62S7308B Series
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
D
q
L
LE
HD
Detail "A"
Detail "A"
y
S
b
Dimensions in inches
Dimensions in mm
Symbol
Min
-
Nom
Max
Min
Nom
Max
A
A1
A2
b
-
0.047
0.006
0.041
0.011
0.008
0.728
0.319
-
-
1.20
0.15
1.05
0.27
0.20
18.50
8.10
0.002
0.037
0.007
0.004
0.720
-
-
0.039
0.009
-
0.05
0.95
0.18
0.11
18.30
-
-
1.00
0.22
-
c
D
E
0.724
0.315
0.020 BSC
0.787
0.020
0.032
-
18.40
8.00
0.50 BSC
20.00
0.50
0.80
-
e
HD
L
0.779
0.795
0.024
-
19.80
20.20
0.60
-
0.016
0.40
LE
S
-
-
-
-
0.020
0.003
5°
0.50
0.08
5°
y
-
-
-
-
-
-
q
0°
0°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(March, 2001, Version 0.2)
14
AMIC Technology, Inc.
A62S7308B Series
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
unit: inches/mm
q
L
LE
D1
D
Detail "A"
Detail "A"
0.076MM
S
b
SEATING PLANE
Dimensions in inches
Dimensions in mm
Symbol
Min
-
Nom
-
Max
0.049
-
Min
Nom
-
Max
-
A
A1
A2
b
1.25
-
-
-
0.002
0.037
0.007
0.05
0.95
0.17
0.142
7.90
0.039
0.008
0.041
0.009
1.00
0.20
0.150
8.00
0.50 TYP
1.05
0.23
0.158
8.10
c
0.0056 0.0059 0.0062
E
0.311
0.315
0.020 TYP
0.528
0.319
e
D
D1
L
0.520
0.461
0.012
0.535
0.469
0.028
13.20
11.70
0.30
13.40
11.80
0.50
13.60
11.90
0.70
0.465
0.020
LE
S
0.0275 0.0315 0.0355
0.0109 TYP
0.700
0.800
0.278 TYP
3°
0.900
q
0°
3°
5°
0°
5°
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(March, 2001, Version 0.2)
15
AMIC Technology, Inc.
A62S7308B Series
Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions
unit : millimeter(mm)
Bottom View
Pin A1 Index
Top View
Pin A1 Index
6
5
4
3 2 1
A
B
C
D
E
F
G
H
A
B
Diameter D
Solder Ball
B1
D
Symbol
Min
Typ
0.75
6.00
3.75
8.00
5.25
0.35
1.10
0.36
0.22
Max
A
B
-
-
5.90
6.10
B1
C
-
-
7.90
8.10
C1
D
-
0.30
1.00
-
-
0.40
1.20
-
E
E1
E2
-
-
PRELIMINARY
(March, 2001, Version 0.2)
16
AMIC Technology, Inc.
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