A62S8308M-55S [AMICC]

256K X 8 BIT LOW VOLTAGE CMOS SRAM; 256K ×8位的低电压CMOS SRAM
A62S8308M-55S
型号: A62S8308M-55S
厂家: AMIC TECHNOLOGY    AMIC TECHNOLOGY
描述:

256K X 8 BIT LOW VOLTAGE CMOS SRAM
256K ×8位的低电压CMOS SRAM

静态存储器
文件: 总17页 (文件大小:266K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
A62S8308 Series  
Preliminary  
256K X 8 BIT LOW VOLTAGE CMOS SRAM  
Document Title  
256K X 8 BIT LOW VOLTAGE CMOS SRAM  
Revision History  
Rev. No. History  
Issue Date  
Remark  
0.0  
0.1  
0.2  
Initial issue  
December 6, 1999  
December 20, 2000  
March 23, 2001  
Preliminary  
Modify VCCmax from 3.3V to 3.6V  
Add 55ns grade spec. for VCC = 3.0V to 3.6V  
PRELIMINARY  
(March, 2001, Version 0.2)  
AMIC Technology, Inc.  
A62S8308 Series  
Preliminary  
256K X 8 BIT LOW VOLTAGE CMOS SRAM  
Features  
n Power supply range: 2.7V to 3.6V  
n Access times: 55ns (max.): for VCC = 3.0V to 3.6V  
70ns (max.): for VCC = 2.7V to 3.6V  
n Current:  
n Full static operation, no clock or refreshing required  
n All inputs and outputs are directly TTL compatible  
n Common I/O using three-state output  
n Output enable and two chip enable inputs for easy  
application  
n Data retention voltage: 2V (min.)  
n Available in 32-pin SOP, TSOP, sTSOP (8X  
13.4mm) forward type and 36-ball Mini BGA (6X8)  
A62S8308-S series:  
Operating: 40mA (max.)  
Standby: 10mA (max.)  
Operating: 40mA (max.)  
Standby: 15mA (max.)  
A62S8308-SI series:  
packages  
n Extended operating temperature range:-25°C to 85°C  
for –SI series  
General Description  
The A62S8308 is a low operating current 2,097,152-bit  
static random access memory organized as 262,144  
words by 8 bits and operates on a low power supply  
voltage from 2.7V to 3.6V.  
Inputs and three-state outputs are TTL compatible and  
allow for direct interfacing with common system bus  
structures.  
Two chip enable inputs are provided for power down and  
a device enable and an output enable input are included  
for easy interfacing.  
Data retention is guaranteed at a power supply voltage  
as low as 2V.  
Pin Configurations  
n SOP  
n TSOP/(sTSOP)  
n Mini BGA (6X8) Top View  
(forward type)  
A17  
1
VCC  
A15  
CE2  
32  
31  
30  
1
2
3
4
5
6
A16  
A14  
A12  
A7  
2
3
A11  
A9  
A8  
1
2
3
4
5
6
7
8
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
OE  
A10  
CE1  
A
B
C
D
E
F
A0  
A1 CE2 A3  
A6  
A8  
WE  
A13  
A8  
4
29  
28  
27  
26  
4
0
I/O  
A2  
A4  
A7 I/O  
WE  
7
A13  
WE  
CE2  
A15  
VCC  
A17  
A16  
A14  
A12  
A7  
I/O  
5
6
6
I/O  
A6  
5
I/O5  
VSS  
VCC  
I/O6  
NC A5  
I/O1  
VCC  
VSS  
I/O2  
3
I/O  
I/O4  
I/O3  
GND  
I/O2  
I/O1  
A5  
A4  
A3  
A2  
A9  
7
A62S8308V  
(A62S8308X)  
8
A11  
OE  
25  
24  
23  
22  
9
10  
11  
12  
13  
14  
15  
16  
9
A10  
10  
11  
12  
13  
14  
15  
16  
0
I/O  
NC A17  
A0  
A1  
A2  
A3  
CE1  
A1  
A0  
A6  
A5  
A4  
I/O7  
21  
20  
19  
18  
17  
7
G
H
I/O  
A16 A15 I/O  
OE  
CE1  
I/O0  
I/O1  
I/O6  
I/O5  
I/O4  
I/O3  
A9 A10 A11 A12 A13 A14  
I/O2  
GND  
PRELIMINARY  
(March, 2001, Version 0.2)  
1
AMIC Technology, Inc.  
A62S8308 Series  
Block Diagram  
A0  
VCC  
GND  
ROW  
1024 X 2048  
A15  
A16  
A17  
DECODER  
MEMORY ARRAY  
I/O0  
COLUMN I/O  
INPUT DATA  
CIRCUIT  
I/O7  
CE2  
CE1  
OE  
CONTROL  
CIRCUIT  
WE  
Pin Descriptions - SOP  
Pin Description - TSOP/sTSOP  
Pin No.  
Symbol  
Description  
Pin No.  
Symbol  
Description  
1 - 12, 23,  
25 - 28, 31  
1 - 4, 7,  
9 - 20, 31  
A0 - A17  
Address Inputs  
A0 - A17  
Address Inputs  
Write Enable  
13 - 15,  
17 - 21  
5
WE  
CE2  
VCC  
I/O0 - I/O7  
Data Inputs/Outputs  
6
8
Chip Enable 2  
Power Supply  
16  
22  
GND  
CE1  
OE  
Ground  
Chip Enable 1  
21 - 23,  
25 - 29  
I/O0 - I/O7  
Data Inputs/Outputs  
24  
29  
Output Enable  
Write Enable  
24  
30  
GND  
CE1  
OE  
Ground  
WE  
CE2  
VCC  
Chip Enable 1  
30  
32  
Chip Enable 2  
Power Supply  
32  
Output Enable  
PRELIMINARY  
(March, 2001, Version 0.2)  
2
AMIC Technology, Inc.  
A62S8308 Series  
Recommended DC Operating Conditions  
(TA = 0°C to + 70°C or -25°C to 85°C)  
Symbol  
VCC  
GND  
VIH  
Parameter  
Supply Voltage  
Min.  
2.7  
0
Typ.  
Max.  
Unit  
V
3.0  
3.6  
Ground  
0
-
0
V
Input High Voltage  
Input Low Voltage  
Output Load  
2.4  
-0.3  
-
VCC + 0.3  
V
VIL  
-
+0.6  
30  
1
V
CL  
-
pF  
-
TTL  
Output Load  
-
-
Absolute Maximum Ratings*  
*Comments  
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V  
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V  
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C  
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C  
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W  
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec  
Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to this device.  
These are stress ratings only. Functional operation of  
this device at these or any other conditions above those  
indicated in the operational sections of this specification  
is not implied or intended. Exposure to the absolute  
maximum rating conditions for extended periods may  
affect device reliability.  
DC Electrical Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)  
A62S8308-55S/70S  
A62S8308-55SI/70SI  
Symbol  
Parameter  
Unit  
Conditions  
Min.  
Max.  
Min.  
Max.  
Input Leakage  
Current  
-
1
-
1
VIN = GND to VCC  
çILIú  
mA  
mA  
CE1 = VIH or CE2 = VIL or  
Output Leakage  
Current  
-
-
-
1
3
-
-
-
1
3
çILOú  
OE = VIH or WE = VIL  
VI/O = GND to VCC  
Active Power  
Supply Current  
CE1 = VIL, CE2 = VIH  
II/O = 0mA  
ICC  
mA  
mA  
Min. Cycle, Duty = 100%  
ICC1  
40  
40  
CE1 = VIL, CE2 = VIH  
II/O = 0mA  
Dynamic Operating  
Current  
CE1 = VIL, CE2 = VIH  
VIH = VCC, VIL = 0V,  
f = 1MHz, II/O = 0mA  
ICC2  
-
10  
-
10  
mA  
PRELIMINARY  
(March, 2001, Version 0.2)  
3
AMIC Technology, Inc.  
A62S8308 Series  
DC Electrical Characteristics (continued)  
A62S8308-55S/70S  
A62S8308-55SI/70SI  
Symbol  
Parameter  
Unit  
Conditions  
Min.  
Max.  
Min.  
Max.  
CE1 = VIH or  
CE2 = VIL  
ISB  
-
0.5  
-
0.5  
mA  
CE1 ³ VCC - 0.2V  
CE2 ³ VCC - 0.2V  
VIN ³ 0V  
Standby Power  
Supply Current  
ISB1  
ISB2  
-
-
10  
10  
-
-
15  
15  
mA  
mA  
CE2 £ 0.2V  
VIN ³ 0V  
VOL  
VOH  
Output Low Voltage  
Output High Voltage  
-
0.4  
-
-
0.4  
-
V
V
IOL = 2.1mA  
IOH = -1.0mA  
2.4  
2.4  
Truth Table  
Mode  
CE2  
X
I/O Operation  
High Z  
High Z  
High Z  
DOUT  
Supply Current  
ISB, ISB1  
CE1  
H
OE  
X
WE  
X
Standby  
X
L
X
X
ISB, ISB2  
Output Disable  
Read  
L
L
L
H
H
L
H
ICC, ICC1, ICC2  
ICC, ICC1, ICC2  
ICC, ICC1, ICC2  
H
H
Write  
H
X
L
DIN  
Note: X = H or L  
Capacitance (TA = 25°C, f = 1.0MHz)  
Symbol  
CIN*  
Parameter  
Min.  
Max.  
Unit  
pF  
Conditions  
VIN = 0V  
Input Capacitance  
6
8
CI/O*  
Input/Output Capacitance  
pF  
VI/O = 0V  
* These parameters are sampled and not 100% tested.  
PRELIMINARY  
(March, 2001, Version 0.2)  
4
AMIC Technology, Inc.  
A62S8308 Series  
AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V)  
Symbol  
Parameter  
A62S8308-55S/SI  
A62S8308-70S/SI  
Unit  
(VCC = 3.0V to 3.6V) (VCC = 2.7V to 3.6V)  
Min.  
Max.  
Min.  
Max.  
Read Cycle  
tRC  
Read Cycle Time  
55  
-
-
70  
-
-
ns  
ns  
ns  
tAA  
Address Access Time  
55  
55  
70  
70  
tACE1  
Chip Enable Access Time  
-
-
CE1  
CE2  
tACE2  
tOE  
55  
30  
-
-
-
70  
35  
-
ns  
ns  
ns  
-
-
Output Enable to Output Valid  
Chip Enable to Output in Low Z  
tCLZ1  
10  
10  
CE1  
CE2  
tCLZ2  
tOLZ  
10  
5
-
-
10  
5
-
-
ns  
ns  
ns  
Output Enable to Output in Low Z  
Chip Disable to Output in High Z  
tCHZ1  
0
20  
0
25  
CE1  
CE2  
tCHZ2  
tOHZ  
0
0
5
20  
20  
-
0
0
25  
25  
-
ns  
ns  
ns  
Output Disable to Output in High Z  
Output Hold from Address Change  
tOH  
10  
Read Cycle  
tWC  
Write Cycle Time  
55  
50  
0
-
-
70  
60  
0
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCW  
Chip Enable to End of Write  
Address Setup Time  
tAS  
-
-
tAW  
Address Valid to End of Write  
Write Pulse Width  
50  
40  
0
-
60  
50  
0
-
tWP  
-
-
tWR  
Write Recovery Time  
-
-
tWHZ  
tDW  
Write to Output in High Z  
Data to Write Time Overlap  
Data Hold from Write Time  
Output Active from End of Write  
0
25  
-
0
25  
-
25  
0
30  
0
tDH  
-
-
tOW  
5
-
5
-
Notes: tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are  
not referred to output voltage levels.  
PRELIMINARY  
(March, 2001, Version 0.2)  
5
AMIC Technology, Inc.  
A62S8308 Series  
Timing Waveforms  
Read Cycle 1(1, 2, 4)  
tRC  
Address  
tAA  
tOH  
tOH  
DOUT  
Read Cycle 2 (1, 3, 4, 6)  
CE1  
tACE1  
5
tCLZ1  
5
tCHZ1  
DOUT  
Read Cycle 3 (1, 4, 7 ,8)  
CE2  
tACE2  
5
tCHZ2  
5
tCLZ2  
DOUT  
PRELIMINARY  
(March, 2001, Version 0.2)  
6
AMIC Technology, Inc.  
A62S8308 Series  
Timing Waveforms (continued)  
Read Cycle 4 (1)  
tRC  
Address  
tAA  
OE  
tOE  
tOH  
5
tOLZ  
CE1  
tACE1  
5
5
tCHZ1  
tCLZ1  
CE2  
5
tACE2  
tOHZ  
5
tCHZ2  
5
tCLZ2  
DOUT  
Notes: 1. WE is high for Read Cycle.  
2. Device is continuously enabled CE1 = VIL and CE2 = VIH.  
3. Address valid prior to or coincident with CE1 transition low.  
4. OE = VIL.  
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.  
6. CE2 is high.  
7. CE1 is low.  
8. Address valid prior to or coincident with CE2 transition high.  
PRELIMINARY  
(March, 2001, Version 0.2)  
7
AMIC Technology, Inc.  
A62S8308 Series  
Timing Waveforms (continued)  
Write Cycle 1(6)  
(Write Enable Controlled)  
tWC  
Address  
3
tAW  
tWR  
5
tCW  
(4)  
(4)  
CE1  
CE2  
1
2
tAS  
tWP  
WE  
tDW  
tDH  
DIN  
tWHZ  
tOW  
DOUT  
PRELIMINARY  
(March, 2001, Version 0.2)  
8
AMIC Technology, Inc.  
A62S8308 Series  
Timing Waveforms (continued)  
Write Cycle 2  
(Chip Enable Controlled)  
tWC  
Address  
3
tAW  
tWR  
5
tCW  
CE1  
CE2  
(4)  
(4)  
1
tAS  
5
tCW  
2
tWP  
WE  
tDW  
tDH  
DIN  
7
tWHZ  
DOUT  
Notes: 1. tAS is measured from the address valid to the beginning of Write.  
2. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .  
3. tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.  
4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after  
the WE transition, outputs remain in a high impedance state.  
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.  
6. OE is continuously low. ( OE = VIL)  
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.  
PRELIMINARY  
(March, 2001, Version 0.2)  
9
AMIC Technology, Inc.  
A62S8308 Series  
AC Test Conditions  
Input Pulse Levels  
0V to 3.0V  
5 ns  
Input Rise and Fall Time  
Input and Output Timing Reference Levels  
Output Load  
1.5V  
See Figures 1 and 2  
TTL  
TTL  
CL  
CL  
30pF  
5pF  
* Including scope and jig.  
* Including scope and jig.  
Figure 1. Output Load  
Figure 2. Output Load for tCLZ1,  
tCLZ2, tOHZ, tOLZ, tCHZ1,  
tCHZ2, tWHZ, and tOW  
Data Retention Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)  
Symbol  
Parameter  
Min.  
Max.  
Unit  
Conditions  
VDR1  
2.0  
3.6  
V
CE1 ³ VCC - 0.2V  
VCC for Data Retention  
CE2 £ 0.2V  
VDR2  
2.0  
3.6  
V
CE1 ³ VCC - 0.2V or  
CE1 £ 0.2V  
S-Version  
SI-Version  
S-Version  
SI-Version  
-
-
-
-
5*  
10**  
5*  
VCC = 2.0V  
ICCDR1  
mA  
CE1 ³ VCC - 0.2V  
CE2 ³ VCC - 0.2V  
VIN ³ 0V  
Data Retention Current  
VCC = 2.0V  
CE2 £ 0.2V  
ICCDR2  
mA  
VIN ³ 0V  
10**  
tCDR  
tR  
Chip Disable to Data Retention Time  
Operation Recovery Time  
0
-
-
ns  
ns  
See Retention Waveform  
tRC  
* A62S8308-55S/70S  
** A62S8308-55SI/70SI  
ICCDR: Max. 1mA at TA = 0°C + 40°C  
ICCDR: Max. 1mA at TA = 0°C + 40°C  
PRELIMINARY  
(March, 2001, Version 0.2)  
10  
AMIC Technology, Inc.  
A62S8308 Series  
Low VCC Data Retention Waveform (1) (CE1 Controlled)  
DATA RETENTION MODE  
VCC  
CE1  
2.7V  
2.7V  
tCDR  
tR  
VDR  
³ 2V  
VIH  
VIH  
CE1  
³ VDR - 0.2V  
Low VCC Data Retention Waveform (2) (CE2 Controlled)  
DATA RETENTION MODE  
VCC  
CE2  
2.7V  
2.7V  
tCDR  
tR  
VDR  
³ 2V  
VIL  
VIL  
CE2  
< 0.2V  
PRELIMINARY  
(March, 2001, Version 0.2)  
11  
AMIC Technology, Inc.  
A62S8308 Series  
Ordering Information  
Part No.  
Operating Current  
Max. (mA)  
Standby Current  
Access Time  
(ns)  
Package  
Max. (mA)  
A62S8308M-55S  
A62S8308M-55SI  
A62S8308V-55S  
A62S8308V-55SI  
A62S8308X-55S  
A62S8308X-55SI  
A62S8308G-55S  
A62S8308G-55SI  
A62S8308M-70S  
A62S8308M-70SI  
A62S8308V-70S  
A62S8308V-70SI  
A62S8308X-70S  
A62S8308X-70SI  
A62S8308G-70S  
A62S8308G-70SI  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
40  
10  
15  
10  
15  
10  
15  
10  
15  
10  
15  
10  
15  
10  
15  
10  
15  
32L SOP  
32L SOP  
32L TSOP  
32L TSOP  
32L sTSOP  
32L sTSOP  
36B Mini BGA  
36B Mini BGA  
32L SOP  
55  
32L SOP  
32L TSOP  
32L TSOP  
32L sTSOP  
32L sTSOP  
36B Mini BGA  
36B Mini BGA  
70  
PRELIMINARY  
(March, 2001, Version 0.2)  
12  
AMIC Technology, Inc.  
A62S8308 Series  
Package Information  
SOP (W.B.) 32L Outline Dimensions  
unit: inches/mm  
32  
17  
q
L
16  
1
b
Detail F  
D
LE  
e
S
y
See Detail F  
Seating Plane  
Dimensions in inches  
Dimensions in mm  
Symbol  
Min  
Nom  
-
Max  
0.118  
-
Min  
Nom  
-
Max  
A
A1  
A2  
b
-
-
3.00  
-
0.004  
0.101  
0.014  
0.006  
-
-
0.10  
2.57  
0.36  
0.15  
-
-
0.106  
0.016  
0.008  
0.805  
0.445  
0.050  
0.556  
0.031  
0.055  
-
0.111  
0.020  
0.012  
0.817  
0.450  
0.056  
0.566  
0.039  
0.063  
0.036  
0.004  
10°  
2.69  
0.41  
0.20  
20.45  
11.30  
1.27  
14.12  
0.79  
1.40  
-
2.82  
0.51  
0.31  
20.75  
11.43  
1.42  
14.38  
0.99  
1.60  
0.91  
0.10  
10°  
c
D
E
0.440  
0.044  
0.546  
0.023  
0.047  
-
11.18  
1.12  
13.87  
0.58  
1.19  
-
e
HE  
L
LE  
S
y
-
-
-
-
0°  
-
0°  
-
q
Notes:  
1. The maximum value of dimension D includes end flash.  
2. Dimension E does not include resin fins.  
3. Dimension S includes end flash.  
PRELIMINARY  
(March, 2001, Version 0.2)  
13  
AMIC Technology, Inc.  
A62S8308 Series  
Package Information  
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions  
unit: inches/mm  
D
q
L
LE  
HD  
Detail "A"  
Detail "A"  
y
S
b
Dimensions in inches  
Dimensions in mm  
Symbol  
Min  
-
Nom  
Max  
Min  
Nom  
Max  
A
A1  
A2  
b
-
0.047  
0.006  
0.041  
0.011  
0.008  
0.728  
0.319  
-
-
1.20  
0.15  
1.05  
0.27  
0.20  
18.50  
8.10  
0.002  
0.037  
0.007  
0.004  
0.720  
-
-
0.039  
0.009  
-
0.05  
0.95  
0.18  
0.11  
18.30  
-
-
1.00  
0.22  
-
c
D
E
0.724  
0.315  
0.020 BSC  
0.787  
0.020  
0.032  
-
18.40  
8.00  
0.50 BSC  
20.00  
0.50  
0.80  
-
e
HD  
L
0.779  
0.795  
0.024  
-
19.80  
20.20  
0.60  
-
0.016  
0.40  
LE  
S
-
-
-
-
0.020  
0.003  
5°  
0.50  
0.08  
5°  
y
-
-
-
-
-
-
q
0°  
0°  
Notes:  
1. The maximum value of dimension D includes end flash.  
2. Dimension E does not include resin fins.  
3. Dimension S includes end flash.  
PRELIMINARY  
(March, 2001, Version 0.2)  
14  
AMIC Technology, Inc.  
A62S8308 Series  
Package Information  
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions  
unit: inches/mm  
q
L
LE  
D1  
D
Detail "A"  
Detail "A"  
0.076MM  
S
b
SEATING PLANE  
Dimensions in inches  
Dimensions in mm  
Symbol  
Min  
-
Nom  
-
Max  
0.049  
-
Min  
Nom  
-
Max  
-
A
A1  
A2  
b
1.25  
-
-
-
0.002  
0.037  
0.007  
0.05  
0.95  
0.17  
0.142  
7.90  
0.039  
0.008  
0.041  
0.009  
1.00  
0.20  
0.150  
8.00  
0.50 TYP  
1.05  
0.23  
0.158  
8.10  
c
0.0056 0.0059 0.0062  
E
0.311  
0.315  
0.020 TYP  
0.528  
0.319  
e
D
D1  
L
0.520  
0.461  
0.012  
0.535  
0.469  
0.028  
13.20  
11.70  
0.30  
13.40  
11.80  
0.50  
13.60  
11.90  
0.70  
0.465  
0.020  
LE  
S
0.0275 0.0315 0.0355  
0.0109 TYP  
0.700  
0.800  
0.278 TYP  
3°  
0.900  
q
0°  
3°  
5°  
0°  
5°  
Notes:  
1. The maximum value of dimension D1 includes end flash.  
2. Dimension E does not include resin fins.  
3. Dimension S includes end flash.  
PRELIMINARY  
(March, 2001, Version 0.2)  
15  
AMIC Technology, Inc.  
A62S8308 Series  
Package Information  
Mini BGA 6X8 (36 BALLS) Outline Dimensions  
unit : millimeter(mm)  
Bottom View  
Pin A1 Index  
Top View  
Pin A1 Index  
6
5
4
3 2 1  
A
B
C
D
E
F
G
H
A
B
Diameter D  
Solder Ball  
B1  
D
Symbol  
Min  
Typ  
0.75  
6.00  
3.75  
8.00  
5.25  
0.35  
1.10  
0.36  
0.22  
Max  
A
B
-
-
5.90  
6.10  
B1  
C
-
-
7.90  
8.10  
C1  
D
-
0.30  
1.00  
-
-
0.40  
1.20  
-
E
E1  
E2  
-
-
PRELIMINARY  
(March, 2001, Version 0.2)  
16  
AMIC Technology, Inc.  

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