概述
数据手册CABGA 概述
ChipArray㈢ Packages ChipArray㈢包
CABGA 数据手册
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PDF下载LAMINATE
data sheet
CABGA/CTBGA/CVBGA
Cutting edge technology and expanding
package offerings provide a platform from
prototype-to-production.
Features:
• Full, in-house design
• Square or rectangle packages available
• 4 mm to 21 mm body size available
• 8 to 449 ball counts
• 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available
• JEDEC MO-216 compliant for 0.8 mm and
1.0 mm ball pitch
• JEDEC MO-195 compliant for 0.5 mm & 0.65 mm
ball pitch
• PB free and Green package available
• Daisy Chain packages available
• Short traces for excellent electrical inductance
• Low inductance (modeled data)
1.4nH (1.0 mm trace length)
®
ChipArray Packages:
®
Amkor’s ChipArray packages are laminate-
based Ball Grid Array (BGA) packages that are
compatible with established SMT mounting
processes. The near-chip-size standard outlines
offer a broad selection of ball array pitch, count,
and body sizes. (See table on back.) In addition
to the standard core ChipArray package (CABGA),
Amkor offers thin core ball grid array packages
(CTBGA and CVBGA) which, coupled with a thin
mold cap, achieve package thicknesses down to
1.0 mm max. By utilizing a thin core laminate,
much denser routing can be achieved, thereby
enabling more I/Os in a given footprint. Amkor
ChipArray packages, regardless of body size and
thickness, utilize the same, flexible capacity which
assures economical packaging solutions. Further,
high volume processes and innovative design
assure high quality and cutting edge technology.
Due to their small size and I/O density, Amkor’s
ChipArray product family is an excellent choice for
new devices requiring a small footprint size and
low mounted height.
4.1nH (5.0 mm trace length)
Thermal Resistance:
Theta JA at 1.0 Watt and 0 airflow (°C/Watt)
CABGA CTBGA CVBGA
8 x 8
37.28
19.86
29
20.1
17.04
36.45
29.04
N/A
37.52
26.7
N/A
10 x 10
11 x 11
15 x 15
19 x 19
N/A
N/A
N/A
N/A
Amkor assures reliable performance by
continuously monitoring key indices:
Reliability:
• Moisture sensitivity JEDEC Level 2 @ 240 °C
characterization
JEDEC Level 3 @ 260 °C
85 °C/85% RH, 168 hours
85 °C/85%, 1000 hours
• Temp/humidity
• High temp storage 150 °C, 1000 hours
• HAST
130 °C/85% RH, 96 hours
• Temp cycle
-55/+125 °C, 1000 cycles
Applications:
The ChipArray package family is applicable for
semiconductors such as memory, analog, ASICs,
RF devices and simple PLDs requiring a smaller
package size than conventional PBGAs.
ChipArray packages fill the need for low cost,
minimum space and high speed requirements
of mobile phones and pagers, notebook and
subnotebook personal computers, PDAs and
other wireless systems.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
DS550N
Rev Date: 01’07
www.amkor.com
LAMINATE
data sheet
CABGA/CTBGA/CVBGA
Process Highlights
Die thickness (max)
Bond pad pitch (min)
Marking
Ball inspection
Pack options
Wafer backgrinding
0.27 mm (10.5 mils)
50 µm (2 mils)
Laser
Optical
Dry pack
Available
Standard Materials
Package substrate
-Conductor
-Dielectric
Copper
SIDE VIEW
TOP VIEW
Epoxy polyimide blend
Low stress elastomer
Epoxy mold compound
Eutectic SnPb/Pbfree
Die attach adhesive
Encapsulant
Solder ball
Test Services
Program Generation/Conversion
Product Engineering
Wafer sort
BOTTOM VIEW
256 Pin x 20 MHz test system available
-55 °C to +165 °C Test available
Burn-in
Shipping
JEDEC trays
Tape and Reel services
CABGA/CTBGA/CVBGA Standard Package Offering
Ball Pitch 1.0 0.80 0.75 0.65 0.50 Ball Pitch 1.0 0.80 0.65 0.50 Ball Pitch 1.0 0.80 0.65 0.50
Body Ball Ball Ball Ball Ball
Size Count Count Count Count Count
Body Ball Ball
Size Count Count Count Count
Ball
Ball
Body
Size
15
15
15
15
16
16
17
17
17
17
17
17
19
19
19
21
21
21
21
21
Ball Ball Ball Ball
Count Count Count Count
4
4
5
5
6
6
6
6
7
7
7
7
7
8
8
8
8
9
9
9
9
16
49
40
40
57
48
56
64
84
10
10
10
10
10
10
11
11
11
12
12
12
13
13
13
14
14
81
100
96
120
121
144
97
192
241
181
277
160 208
176 273
196 324
144
256
25
36
49
280 324
285
176 256
208 272
224 280
228 292
252 316
256
280 288
289
324
256 449
272
316
336
400
100 109
97
200
208
277
300
223
128
169
48
49
64
44
46
48
64
81 104
108
112 144
121 160
196
108 200
144 224
225
228
288
64
84
96
289
320
417
287
42 64
48
105 108
111 132
113 144
96
72
81
94
192
220
64 100 48
124
72
80
81
64
180 180
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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