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CSOIC [AMKOR]

Ceramic Small Outline Integrated Circuit Package; 陶瓷小外形集成电路封装
CSOIC
型号: CSOIC
厂家: AMKOR TECHNOLOGY    AMKOR TECHNOLOGY
描述:

Ceramic Small Outline Integrated Circuit Package
陶瓷小外形集成电路封装

文件: 总1页 (文件大小:374K)
中文:  中文翻译
下载:  下载PDF数据表文档文件

相关型号:

CSOV3S3

SURFACE MOUNT 3.3V HCMOS STRATUM 3 OCXO

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CONNOR-WINFIE

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CONNOR-WINFIE

CSOV3S3-77.76M

SURFACE MOUNT 3.3V HCMOS STRATUM 3 OCXO

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CONNOR-WINFIE

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CONNOR-WINFIE

CSOV3S3-FREQ

HCMOS Output Clock Oscillator, 40MHz Min, 80MHz Max

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CONNOR-WINFIE

CSP

CLOCK OSCILLATOR, PECL, +3.3 VDC or +2.5VDC

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RALTRON

CSP-10-D-02-SP-A

Interconnection Device

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SAMTEC

CSP-10-D-02-SP-B

Interconnection Device

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SAMTEC

CSP-10-D-02-SP-R

Interconnection Device

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SAMTEC

CSP-10-D-02-SP-ST8

Interconnection Device

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SAMTEC

CSP-10-D-02-SP-V

Interconnection Device

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SAMTEC

CSP-10-D-X-SP-ST4

Interconnection Device

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SAMTEC

CSP-10-D-X-SP-ST8

Interconnection Device

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SAMTEC

CSP-10-S-02-SP-A

Interconnection Device

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SAMTEC

CSP-10-S-02-SP-P

Interconnection Device

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SAMTEC

CSP-10-S-X-SP-R

Interconnection Device

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SAMTEC

CSP-10-S-X-SP-ST4

Interconnection Device

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SAMTEC

CSP-10-S-X-SP-ST8

Interconnection Device

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SAMTEC

CSP-15-D-02-SP-R

Interconnection Device

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SAMTEC

CSP-15-D-02-SP-ST4

Interconnection Device

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SAMTEC