MCMPBGA [AMKOR]
Innovative designs and expanding package offerings provide a platform from prototype-to-production; 创新的设计和扩展包的产品提供了一个平台，从原型到生产
| 型号： | MCMPBGA |
| 厂家： | 
AMKOR TECHNOLOGY |
| 描述： | Innovative designs and expanding package offerings provide a platform from prototype-to-production |
| 文件： | 总2页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LAMINATE
data sheet
MCM-PBGA
Innovative designs and expanding package offerings provide
a platform from prototype-to-production.
Features:
Ball counts up to 1156
13.0 mm to 40.0 mm body sizes
1.00, 1.27 & 1.50 mm ball pitch available
Perimeter, stagger and full ball arrays
Special packaging for memory available
2, 4, or 6 layer construction, ground / power
Full in-house design capability
JEDEC MS-034 standard outlines
MCM under high volume manufacturing in all sites
•
•
•
•
•
•
•
•
•
•
Enhanced electrical performance, shorter signal paths
and reduced package parasitics
MCM-PBGA Packages:
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid
Array) by Amkor incorporates the latest technology
in high-density plastic IC packaging. The high-speed
performance and thermal advantages of the PBGA
package provide the platform to mix semiconductor
technologies such as analog, digital, bipolar, CMOS,
ASIC, memory, etc., in a single IC package.
• 2-8 active devices
• 200-600 wire bonds
• Passives can be added by utilizing the SMT
equipment located in the SiP line
Thermal Performance:
Multi layer PCB, 0 air flow
PCB
Cu
Theta JA
(°C/W)
Pkg Body Size Layer Thickness
272
388
27.0 x 27.0
35.0 x 35.0
4
4
36 µm
36 µm
19
16
The affordability of our MCM-PBGAs enable systems
designers to realize their vision of new, advanced
or improved applications. Our designs are optimized
to use standard PBGA package outline tooling to save
you costs and utilize a proven BGA infrastructure.
Additionally, we work with you to produce the most
efficient substrate circuit design that will enhance
the operation and performance of your IC chips.
Our advanced in-house design center and electrical
test support services complete the turn-key solution.
Amkor assures you reliable performance by continuously
monitoring key indices:
Reliability:
•
Moisture sensitivity
characterization
JEDEC Level 3
30 °C/60% RH/192 hours
125 °C, 6V, 1000 hours
150 °C, 1000 hours
High temp op life
•
•
•
•
High temp storage
Autoclave or unbiased hast 130 °C/85% RH/96 hours
Temp cycle
Applications:
Amkor’s MCM-PBGA is an excellent platform for reducing
form factor and size while combining semiconductor
technologies. MCM-PBGAs are perfect for any application
where size, weight, electrical performance, board density
and SMT yields are important considerations, such as
ASICs, cable and DSL modems, wireless telecommunica-
tions and electronic automotive components.
-55/+125 °C, 1000 cycles
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
DS 540G
Rev Date: 05 ‘07
www.amkor.com
LAMINATE
data sheet
MCM-PBGA
Process Highlights
MCM-PBGA Cross Section
Die Thickness (max)
Bond Pad Pitch (min)
Marking
13 mils
2.4 mils
Laser
Ball Inspection
Optical
Pack/Ship Options
Wafer Backgrinding
Dry Pack
Available
Standard Materials
Package substrate
Die attach
Au wire
CCL-HL832
Ablestik 2300
25 m or 30 µm
µ
Mold compound
Solder Balls
Nitto GE 100L
63 Sn / 37 Pb
PBGA Standard Package Offering (mm)
BODY
SIZE
BALL
BALL
PITCH
BALL
MATRIX
BALL
DIAM.
PCB THICKNESS
MOLD
CAP
TOTAL PACKAGE
THICKNESS
COUNT
2 LYR
4 LYR
THK
0.80
0.90
0.90
1.17
0.80
0.80
0.80
0.80
0.80
0.80
0.80
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
2 LYR
1.56
2.06
2.06
2.13
1.56
1.56
1.56
1.56
1.56
1.56
1.56
2.13
2.13
2.13
2.13
2.03
2.03
2.13
2.13
2.13
N/A
2.13
2.03
2.03
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
N/A
4LYR
1.76
2.06
2.06
2.33
1.76
1.76
1.76
1.76
1.76
1.76
1.76
2.33
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.38
2.33
2.23
2.23
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.38
2.33
2.23
2.23
2.23
2.33
2.33
2.33
2.33
Test Services
Program Generation/Conversion
Product Engineering
Wafer sort
13.0 x 13.0
14.0 x 22.0
144
119
1.0
12 x 12 F
7 x 17 F
9 x 17 F
11 x 11 F
14 x 14 P 0.51
14 x 14 F 0.51
16 x 16 P 0.51
16 x 16 F 0.51
18 x 18 P 0.51
17 x 17 P 0.51
18 x 18 P 0.51
13 x 13 F
17 x 17 P 0.76
17 x 17 P 0.76
17 x 17 F
22 x 22 P 0.63
22 x 22 F
15 x 15 F
20 x 20 P 0.76
20 x 20 P 0.76
20 x 20 P 0.76
20 x 20 F
26 x 26 P 0.63
26 x 26 F 0.63
23 x 23 P 0.76
23 x 23 P 0.76
23 x 23 F
30 x 30 P 0.63
30 x 30 F
25 x 25 S
26 x 26 P 0.76
26 x 26 P 0.76
26 x 26 P 0.76
26 x 26 F
34 x 34 P 0.63
34 x 34 P 0.63
0.51
0.76
0.76
0.76
0.36
0.56
0.56
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
N/A
0.36
0.36
0.36
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
N/A
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.61
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.61
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
1.27
1.27
1.27
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.50
1.27
1.27
1.27
1.00
1.00
1.50
1.27
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.27
1.27
1.00
1.00
1.00
1.27
1.27
1.27
1.27
153
15.0 x 15.0
121
156/160
196
256 Pin x 20 mhz Test System available
-55 °C to + 125 °C Test available
Tape and Reel Services
17.0 x 17.0 192/208
256
19.0 x 19.0
240
289
324
169
208/217
240/249
289
288/324
484
225
Burn-in
23.0 x 23.0
0.76
0.76
Shipping
Low Profile Tray (JEDEC Outline CO-029)
0.63
0.76
27.0 x 27.0
256/272
300/316
356
400
0.76
416
NOTE: All measurements in mm.
676
P = Perimeter
F = Full Array
S = Stagger
31.0 x 31.0 304/329
360/385
529
516
900
= Maximum possible ball count (may not be
tooled). Additional depopulated options
are available. Contact account manager
for additional tooling.
0.76
0.63
0.76
35.0 x 35.0
313
352/388
420/456
452
676
0.76
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
2.33
2.23
2.23
2.23
2.33
2.33
2.33
2.33
580
680
1,156
524
34 x 34 F
28 x 28 P 0.76
28 x 28 F 0.76
30 x 30 P 0.76
30 x 30 F 0.76
0.63
37.5 x 37.5
40.0 x 40.0
784
564
900
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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