PG169TW1F [AMPHENOL]
IC Socket, PGA169, 169 Contact(s);
| 型号： | PG169TW1F |
| 厂家： | 
Amphenol |
| 描述： | IC Socket, PGA169, 169 Contact(s) |
| 文件： | 总2页 (文件大小：725K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BURNDY
LIF PGA Series
Description
•This highly accommodating socket is
designed with many valuable features. It is
constructed of high temperature, glass-filled
Thermoplastic so it will withstand both I.R.
and vapor phase solder reflow temperatures
and it has a UL rating of 94-VO.
Applications
PGA socket for all purposes
in electronic area
•To provide low insertion force with high
normal force characteristics this socket is
designed with. 012” (0,3) staggered contact
configuration. A typical 169 position seating
force is less than 40 pounds.
Standards
•To accommodate Intel based microproces-
sors the sockets are available in 168, 169,
208, 237, 238 and 273 positions.
Finish
Characteristics
Electrical
• Voltage Rating :
28 VAC at .5 amps max
• Current Rating :
2 ampere with 30° rise over ambient
• Contact Resistance :
•The socket’s industry-standard housing
configuration includes convenient installation
features :
- it occupies the same PCB area as the
Microprocessor
- installed socket height equals .280” (7.1)
maximum which allows .500” (12.7) of
spacing between PCBs
- a 75° conical lead-in assures superior micro-
processor pin guidance.
- the preloaded phosphor bronze contact
accepts .016 - .020” (0.41 - 0.51) diameter pins
- 60° tapered solder tail facilitates a smooth
entry into the PCB
- .120” (3.0) solder tail length accommodates
industry standard .0625” (1.59) thick PCBs
- the socket enlists dual beam contact
geometry by providing two large gold plated
surfaces for maximum contact wipe
• Contact Plating :
- Underplate :
50 microinches (1.27 microns) min nickel
- Mating area variations :
15 microinches (0.38 microns) min gold
10 microinches (0.25 microns) min
palladium/nickel with gold flash
25 microinches (0.63 microns) min
palladium/nickel with gold flash
(see plating type designation below)
- Solder Tail Area :
- Initial
10 milliohms max
- Post Test
• Capacitance :
20 milliohms max
2.0 pf max at 10 MgHz
100 microinches (2.54 microns) min tin/lead
Material
• Housing :
- Glass filled,
High Temperature Thermoplastic
- UL Rating : UL94-VO
- Color : Black
Environmental
• Operating Temperature :
-40°F (-40°C) to +203°F (+95°C)
• Contacts : Copper Alloy
• The #1 pin locator is provided by a 45° outer
polarization chamfer while the 45° inner
polarization chamfer makes the socket
compatible with robotic assembly. Burndy tube
packaging also contributes to automatic
handling while providing superior pin protection.
Mechanical
• Durability : 25 cycles
• Insertion Force :
3.0 oz (0.83N) Max Avg (.020 (0.51) Dia Pin)
• Extraction Force :
0.53 oz (0.15N) Min Avg (.020 (0.51) Dia Pin)
• The socket’s dimensions provide for optimal
microprocessor operation :
- .047” (1.19) Microprocessor standoffs and
the open bottom housing permit improved
air flow and cooling of microprocessors
- .032” (0.81) PCB standoff ensures proper
solder joint inspection along with easy
repairs and cleaning.
Ordering information
PGA socket
PG
--
--
-
1
-
N. of contacts positions
- 168, 169, 208, 237, 238, 273
- N-R-T (see page 511)
housing size
solder tail lenght
design variations
plating type
W = .12 (3.0)
A - 15 microinches (0.38 microns) min gold,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
E - 10 microinches (0.25 microns) min palladium/nickel with gold flash,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
F - 25 microinches (0.63 microns) min palladium/nickel with gold flash,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
510
BURNDY
LIF PGA Series
LIF PGA Socket
45 degree outer polarization chamfer
1.19 (.047’’) microprocessor standoffs
75 degree conical lead-in
Installed socket
height equals 7.1
(.280’’) Max.
Dual beam contact geometry
0.30 (.012’’)
45 degree inner
polarization
staggered contact
height configuration
0.81 (.032’’)
PCB standoff
3.0 (.120’’) solder tail
length
High temperature, glass-filled,
thermoplastic housing
Industry standard housing
configuration
Open bottom housing
0.81 (.032’’) PCB standoff
Preloaded phosphor bronze contact
60 degree
tapered
solder tail
PC Board drilling dimensions
catalog letter
housing size
actual size
array
A
B
C
44.45
1.750
40.64
1.600
40.64
1.600
N
R
T
17 x 17
49.53
1.950
45.72
1.800
45.72
1.800
19 x 19
21 x 21
54.61
2.150
50.80
2.000
50.80
2.000
35.6
1.40
35.6
1.40
35.6
1.40
2.54
2.54
.100
.100
35.6
1.40
35.6
1.40
33.0
1.30
37.6
1.09
27.6
1.09
35.6
1.40
33.0
1.30
33.0
1.30
22.6
.89
169
Position
208
Position
168
Position
27.9
1.10
33.0
1.30
27.9
1.10
33.0
1.30
22.9
.90
33.0
1.30
45.4
1.80
40.6
1.60
40.6
1.60
45.4
1.80
43.2 32.7
1.70 1.29
27.6
1.09
238
Position
273
Position
237
Position
38.1
1.50
40.6
1.60
40.6
1.60
27.6
1.09
38.1
1.50
27.9
1.10
38.1
27.9
1.10
38.1
33.0
1.30
43.2
1.50
1.50
1.70
A
SEE TABLE
C
0.30
.012
Full stagger for reduced insertion force
Pin
SEE TABLE
0.54
.100
TYP
A
SEE TABLE
2.54
.100
TYP
C
0.1
SEE TABLE
2.54
0.81
.032
min. Pin
min. Wipe
TYP PC BOARD PATTERN FOR STANDOFF AREA
511
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