AS1116 [AMSCO]

64 LED Driver with Detailed Error Detection; 64 LED驱动器,详细的错误检测
AS1116
型号: AS1116
厂家: AMS(艾迈斯)    AMS(艾迈斯)
描述:

64 LED Driver with Detailed Error Detection
64 LED驱动器,详细的错误检测

驱动器
文件: 总20页 (文件大小:1018K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
AS1116  
64 LED Driver with Detailed Error Detection  
1 General Description  
2 Key Features  
10MHz SPI-Compatible Interface  
Open and Shorted LED Error Detection  
- Global or Individual Error Detection  
The AS1116 is a compact LED driver for 64 single LEDs  
or 8 digits of 7-segments. The devices can be pro-  
grammed via an SPI compatible 3-wire interface.  
Hexadecimal- or BCD-Code for 7-Segment Displays  
200nA Low-Power Shutdown Current (typ; data  
retained)  
Individual Digit Brightness Control  
Digital and Analog Brightness Control  
Display Blanked on Power-Up  
Drive Common-Cathode LED Displays  
Supply Voltage Range: 2.7 to 5.5V  
Software Reset  
Every segment can be individually addressed and  
updated separately. Only one external resistor (RSET) is  
required to set the current. LED brightness can be con-  
trolled by analog or digital means.  
The devices include an integrated BCD code-B/HEX  
decoder, multiplex scan circuitry, segment and display  
drivers, and a 64-bit memory. Internal memory stores  
the shift register settings, eliminating the need for contin-  
uous device reprogramming.  
Optional External Clock  
Package:  
Additionally the AS1116 offers a diagnostic mode for  
easy and fast production testing and allows the use of  
the AS1116 for critical applications. The diagnostic  
allows to detect individual open or shorted LEDs.  
- QSOP-24 and TQFN(4x4)-24  
3 Applications  
The AS1116 is ideal for seven-segment or dot matrix dis-  
plays in public information displays at subway, train or  
bus stations, at airports and also at displays in public  
The AS1116 features a low shutdown current of typically  
200nA, and an operational current of typically 350µA.  
The number of digits can be programmed, the devices  
can be reset by software, and an external clock is also  
supported.  
,
transportation like buses or trains mobile phones, per-  
The device is available in a QSOP-24 and TQFN(4x4)-  
24 package.  
sonal electronic and toys.  
Figure 1. Typical Application Diagram  
8
DIG0 to  
DIG7  
AS1116  
LD  
SEGA-DP  
VDD  
8
8
8
8
2.7V to 5.5V  
9.53kΩ  
GND  
ISET  
SDI  
AS1116  
AS1116  
SDO  
SDO  
SDO  
SDI  
SDI  
I/O  
LD  
LD  
SCL  
SCL  
SCL  
I/O  
I/O  
µP  
I/O  
Diagnostic readback: open & shorted LEDs  
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AS1116  
Datasheet - Pinout  
4 Pinout  
Pin Assignments  
Figure 2. Pin Assignments (Top View)  
24 23 22 21 20 19  
DIG2  
DIG3  
GND  
DIG4  
DIG5  
N/C  
1
2
3
4
5
6
18 SEG E  
17 SEGC  
16 VDD  
AS1116  
AS1116  
15 SEGG  
14 SEGB  
13 SEGF  
7
8
9
10 11 12  
Pin Descriptions  
Table 1. Pin Descriptions  
Pin  
QSOP-24 TQFN(4x4)-24  
Name  
Description  
Serial-Data Input. Data is loaded into the internal 16-bit shift register  
on the rising edge of pin SCL.  
1
22  
SDI  
Digit Drive Lines. Eight digit drive lines that sink current from the  
display cathode.  
1, 2, 4, 5, 7, 8,  
23, 24  
2-5, 7-10  
DIG0:DIG7  
GND  
6
3
9
6
Ground.  
Load. Serial Data is loaded into the shift register while this pin is low.  
The last 16 bits of serial data are latched on the rising edge of this pin.  
11  
12  
LD  
Not Connected.  
N/C  
Set Segment Current. Connect to VDD or a reference voltage through  
RSET to set the peak segment current (see Selecting RSET Resistor  
Value and Using External Drivers on page 15).  
Serial-Clock Input. 10MHz maximum rate. Data is shifted into the  
internal shift register on the rising edge of this pin. Data is clocked out of  
pin SDO on the rising edge of this pin.  
13  
14  
10  
11  
ISET  
SCL  
Seven Segment and Decimal Point Drive Lines. 8 seven-segment  
drives and decimal point drive that source current to the display.  
SEGA:SEG  
G, SEGDP  
15-18,  
20-23  
12-15,  
17-20  
19  
16  
Positive Supply Voltage. Connect to +2.7 to +5.5V supply.  
VDD  
Serial-Data Output. The data into pin SDI is valid at pin SDO 16 clock  
cycles later. This pin is used to daisy-chain several devices and is never  
high-impedance.  
24  
21  
SDO  
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AS1116  
Datasheet - Absolute Maximum Ratings  
5 Absolute Maximum Ratings  
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical  
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may  
affect device reliability.  
Table 2. Absolute Maximum Ratings  
Parameter  
Min  
Max  
Units  
Notes  
VDD to GND  
-0.3  
7
V
Input Voltage Range  
Current  
7 or  
All other pins to GND  
-0.3  
V
VDD + 0.3  
DIG0:DIG7 Sink Current  
SEGA:SEGG, SEGDP  
500  
100  
mA  
mA  
%
Humidity  
5
85  
Non-condensing  
Digital outputs  
All other pins  
1000  
1000  
V
Electrostatic Discharge  
Norm: MIL 833 E method 3015  
V
Latch-Up Immunity  
±100  
mA  
ºC/W  
EIA/JESD78  
88  
on PCB, QSOP-24 package  
Thermal Resistance ΘJA  
30.5  
+85  
150  
ºC/W on PCB, TQFN(4x4)-24 package  
Ambient Temperature  
Storage Temperature  
-40  
-55  
ºC  
ºC  
The reflow peak soldering  
temperature (body temperature)  
specified is in accordance with IPC/  
JEDEC J-STD-020D “Moisture/  
Reflow Sensitivity Classification for  
Non-Hermetic Solid State Surface  
Mount Devices”.  
Package Body Temperature  
+260  
ºC  
The lead finish for Pb-free leaded  
packages is matte tin (100% Sn).  
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AS1116  
Datasheet - Electrical Characteristics  
6 Electrical Characteristics  
VDD = 2.7 to 5.5V, RSET = 9.53kΩ, TAMB = -40 to +85°C, typ. values @ TAMB = +25ºC, VDD = 5.0V (unless otherwise  
specified).  
Table 3. Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ Max  
Unit  
2.7  
5.5  
V
VDD  
Operating Supply Voltage  
All digital inputs at VDD or  
GND, TAMB = +25ºC  
0.2  
0.35  
335  
0.8  
2
µA  
IDDSD  
Shutdown Supply Current  
RSET = open circuit.  
0.6  
IDD  
Operating Supply Current  
mA  
All segments and decimal  
point on; ISEG = -40mA.  
0.6  
320  
-37  
1.2  
-47  
47  
kHz  
mA  
mA  
%
fOSC  
IDIGIT  
ISEG  
Display Scan Rate  
8 digits scanned  
VOUT = 0.65V  
Digit Drive Sink Current  
-42  
3
Segment Drive Source Current  
Segment Drive Current Matching  
Segment Drive Source Current  
VDD = 5.0V, VOUT = (VDD -1V)  
Average Current  
ΔISEG  
ISEG  
mA  
Table 4. Logic Inputs/Outputs Characteristics  
Symbol  
Parameter  
Conditions  
VIN = 0V or VDD  
4.5V < VDD < 5.5V  
2.7V < VDD < 4.5V  
VDD = 5.0V  
Min  
-1  
Typ  
Max  
Unit  
µA  
V
IIH, IIL  
Input Current SDI, SCL, LD  
1
0.6 x VDD  
0.7 x VDD  
VIH  
VIL  
Logic High Input Voltage  
Logic Low Input Voltage  
V
0.8  
0.6  
V
V
VDD = 3.0V  
SDO, ISOURCE = -1mA,  
VDD = 5.0V  
VDD - 1  
VOH  
Output High Voltage  
SDO, ISOURCE = -1mA,  
VDD = 3.0V  
VDD - 0.5  
VOL  
Output Low Voltage  
Hysteresis Voltage  
0.4  
V
V
SDO, ISINK = 1mA  
SDI, SCL, LD  
ΔVI  
1
0.7x  
VDD  
0.75x 0.8x  
V
V
Open Detection Level Threshold  
Short Detection Level Threshold  
VDD  
VDD  
0.1x 0.15x  
0.05x VDD  
VDD  
VDD  
Table 5. SPI Timing Characteristics  
Symbol  
tCP  
Parameter  
Conditions  
Min  
100  
20  
20  
25  
10  
0
Typ  
Max  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
SCL Clock Period  
SCL Pulse Width High  
SCL Pulse Width Low  
LD to SCL Rise Setup Time  
tCH  
tCL  
tCSS  
tCSH  
tDS  
SCL Rise to LD Rise Hold Time  
SDI Setup Time  
tDH  
SDI Hold Time  
5
tDO  
Output Data Propagation Delay  
LD Rising Edge to SCL Rising Edge  
Minimum LD Pulse High  
Data-to-Segment Delay  
CLOAD = 50pF  
25  
tLDCK  
tCSW  
tDSPD  
20  
20  
2.25  
See Figure 18 on page 8 for more information.  
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AS1116  
Datasheet - Typical Operating Characteristics  
7 Typical Operating Characteristics  
RSET = 9.53kΩ, VRset = VDD;  
Figure 3. Display Scan Rate vs. Supply Voltage;  
Figure 4. Display Scan Rate vs. Temperature;  
980  
980  
960  
940  
920  
900  
880  
860  
840  
960  
940  
920  
900  
880  
Vdd =2.7V  
Vdd =4V  
Vdd =5V  
Tamb =- 40°C  
Tamb = + 25°C  
860  
Vdd = 5.5V  
Tamb = + 85°C  
840  
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
5.5  
-40  
-15  
10  
35  
60  
85  
Vdd (V)  
Tamb (°C)  
Figure 5. Segment Current vs. Temperature;  
Figure 6. Segment Current vs. RSET;  
60  
50  
Vseg =4V; Vdd =5V  
Vseg =3V; Vdd =5V  
Vseg =2V; Vdd =5V  
Vseg = 1.7V; Vdd = 2.7V  
50  
40  
30  
20  
40  
30  
20  
10  
0
Vseg = 1.7V; Vdd = 2.7V  
Vseg = 1.7V; Vdd = 5V  
10  
V seg = 3V ; V dd = 5V  
V seg = 4V ; V dd = 5V  
0
-40  
-15  
10  
35  
60  
85  
0
10 20 30 40 50 60 70 80 90  
Rset (kOhm)  
Tamb (°C)  
Figure 7. Segment Current vs. Supply Voltage;  
Figure 8. Segment Current vs. VDD; VRset = 2.8V  
60  
50  
Vseg = 1.7V  
45  
Vseg =2V  
50  
40  
30  
20  
Vseg =2.3V  
40  
Vseg =3.1V  
35  
30  
25  
20  
15  
10  
5
Vseg = 1.7V  
Vseg =3V  
Vseg =4V  
10  
0
0
2.7  
3.1  
3.5  
3.9  
4.3  
4.7  
5.1  
5.5  
2.7  
3
3.3  
3.6  
3.9  
4.2  
Vdd (V)  
Vdd (V)  
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AS1116  
Datasheet - Typical Operating Characteristics  
Figure 9. VDIGIT vs. IDIGIT  
Figure 10. Input High Level vs. Supply Voltage  
0.4  
3.5  
3
2.5  
2
0.3  
0.2  
1.5  
1
Vdd =2.7V  
0.1  
0
Vdd = 3.3V  
Vdd =4V  
Vdd =5V  
0.5  
0
Vdd = 5.5V  
2.7  
3.1  
3.5  
3.9  
Vdd (V)  
4.3  
4.7  
5.1  
5.5  
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35  
Idig (A)  
Figure 11. ISEG vs. VSEG; VDD = 5V  
Figure 12. ISEG vs. VSEG; VDD = 4V  
50  
50  
Rext =10k  
Rext =13k  
Rext =18k  
Rext =30k  
Rext =56k  
Rext =8k2  
Rext =10k  
Rext =13k  
Rext =18k  
Rext =30k  
45  
40  
35  
30  
25  
20  
15  
10  
5
45  
40  
35  
30  
25  
20  
15  
10  
5
0
0
2
2.5  
3
3.5  
4
4.5  
5
1
1.5  
2
2.5  
3
3.5  
4
Vs eg (V)  
Vseg (V)  
Figure 13. ISEG vs. VSEG; VDD = 3.3V  
Figure 14. ISEG vs. VSEG; VDD = 2.7V  
50  
50  
Rext = 6k8  
Rext = 8k2  
Rext = 10k  
Rext = 13k  
Rext = 18k  
Rext = 4k7  
Rext = 5k6  
Rext = 6k8  
Rext = 10k  
Rext = 13k  
45  
40  
35  
30  
25  
20  
15  
10  
5
45  
40  
35  
30  
25  
20  
15  
10  
5
0
0
1
1.2 1.4 1.6 1.8  
2
2.2 2.4 2.6 2.8  
3
3.2  
1
1.2 1.4 1.6 1.8  
2
2.2 2.4 2.6  
Vseg (V)  
Vseg (V)  
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AS1116  
Datasheet - Detailed Description  
8 Detailed Description  
Block Diagram  
Figure 15. Block Diagram (QSOP-24 Package)  
Open/Short  
Detection  
VDD  
+
R
SET  
19  
+
VDD  
13  
Oszillator  
ISET  
8
15-18, 20-23  
SEGA-G,  
SEGDP  
Digital Control  
Logic  
8
2-5, 7-10  
DIG0 to DIG7  
(PWM, Debounce,....)  
11  
LD  
1
SDI  
14  
Registers  
SPI  
Interface  
6
Data - Registers  
Control - Registers  
Scan - Registers  
SCL  
GND  
24  
SDO  
AS1116  
Figure 16. ESD Structure  
valid for the pins:  
- SDI  
VDD  
VDD  
- SCL  
- SDO  
- LD  
- ISET  
valid for the pins:  
- DIG0 to DIG7  
- SEGA-G, SEGDP  
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AS1116  
Datasheet - Detailed Description  
Serial-Addressing Format  
The AS1116 contains a 16bit SPI interface to access the internal data and control registers of the device (see Digit-  
and Control-Registers on page 9). The SPI interface is driven with the rising edge of SCL. A falling edge on LD signal  
indicates the beginning of an access on the SPI interface, the rising edge on LD determines an access on SPI. An  
access must consist of exactly 16bits for write operation and 8bits for read operation. Timing restrictions on the SPI  
interface pins are defined in Figure 18.  
Table 6 shows the structure of the 16bit command word for writing data, Table 7 the 8bit command word for read oper-  
ation.  
D0 (write operation) / D8 (read operation) is the first bit to shift into the SPI interface after the falling edge of LD, is the  
last bit to write to SPI before rising edge of LD.  
At a read operation an 8bit operation is executed. At the first rising edge of SCL after the rising edge of LD D7 of  
addressed register is written to SDO pin. At the next rising edge of SCL D6 is written to SDO pin. LD must be kept high  
during reading data from a internal data or control register of AS1116.  
Table 6. 16-Bit Serial Data Format  
D0  
D1  
D2  
D3  
Data  
D4  
D5  
D6  
D7  
D8  
D9  
D10  
D11  
D12 D13 D14 D15  
R/W  
LSB  
MSB  
Register Address (see Table 7)  
0
X
Figure 17. Read operation  
16  
1
8
9
10  
SCL  
LD  
SDO  
D7  
D6 D5 D4 D3 D2 D1 D0  
Figure 18. Interface Timing  
LD  
tCSW  
tCSH  
tCP  
tCSS  
tLDCK  
tCL  
tCH  
SCL  
SDI  
tDH  
tDS  
D0  
D1  
D14  
D15  
tDO  
SDO  
Initial Power-Up  
On initial power-up, the AS1116 registers are reset to their default values, the display is blanked, and the device goes  
into shutdown mode. At this time, all registers should be programmed for normal operation.  
Note: The default settings enable only scanning of one digit; the internal decoder is disabled and the Intensity Control  
Register (see page 13) is set to the minimum values.  
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AS1116  
Datasheet - Detailed Description  
Shutdown Mode  
The AS1116 devices feature a shutdown mode, where they consume only 200nA (typ) current. Shutdown mode is  
entered via a write to the Shutdown Register (see Table 8). For the AS1116, at that point, all segment current sources  
and digital drivers are switched off, so that all segments are blanked.  
Note: During shutdown mode the Digit-Registers maintain their data.  
Shutdown mode can either be used as a means to reduce power consumption or for generating a flashing display  
(repeatedly entering and leaving shutdown mode). For minimum supply current in shutdown mode, logic input should  
be at GND or VDD (CMOS logic level).  
When entering or leaving shutdown mode, the Feature Register is reset to its default values (all 0s) when Shutdown  
Register bit D7 (page 10) = 0.  
Note: When Shutdown Register bit D7 = 1, the Feature Register is left unchanged when entering or leaving shut-  
down mode. If the AS1116 is used with an external clock, Shutdown Register bit D7 should be set to 1 when  
writing to the Shutdown Register.  
Digit- and Control-Registers  
The AS1116 devices contain 8 Digit-Registers,11 control-registers and 8 diagnostic-registers, which are listed in Table  
7. All registers are selected using a 8-bit address word, and communication is done via the serial interface.  
Digit Registers – These registers are realized with an on-chip 64-bit memory. Each digit can be controlled directly  
without rewriting the whole register contents.  
Control Registers – These registers consist of decode mode, display intensity, number of scanned digits, shut-  
down, display test and features selection registers.  
Table 7. Register Address Map  
Address  
D15 D14 D13 D12 D11 D10 D9  
Register  
Page  
D8  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
D7:D0  
No-Op  
Digit 0  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
14  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
10  
Digit 1  
0
Digit 2  
0
(see Table 10 on page 11,  
Table 11 on page 11 and  
Table 12 on page 11)  
Digit 3  
0
Digit 4  
0
Digit 5  
0
Digit 6  
0
Digit 7  
0
Decode-Mode  
Global Intensity  
Scan Limit  
Shutdown  
0
(see Table 9 on page 10)  
(see Table 16 on page 13)  
(see Table 18 on page 13)  
(see Table 8 on page 10)  
0
13  
0
13  
0
9
Not Used  
0
N/A  
14  
Feature  
0/1  
0
(see Table 19 on page 14)  
(see Table 13 on page 12)  
(see Table 17 on page 13)  
(see Table 17 on page 13)  
(see Table 17 on page 13)  
(see Table 17 on page 13)  
Display Test Mode  
DIG0:DIG1 Intensity  
DIG2:DIG3 Intensity  
DIG4:DIG5 Intensity  
DIG6:DIG7 Intensity  
10  
0
0
0
0
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AS1116  
Datasheet - Detailed Description  
Table 7. Register Address Map  
Address  
D15 D14 D13 D12 D11 D10 D9  
Register  
Page  
D8  
0
D7:D0  
Diagnostic Digit 0  
Diagnostic Digit 1  
Diagnostic Digit 2  
Diagnostic Digit 3  
Diagnostic Digit 4  
Diagnostic Digit 5  
Diagnostic Digit 6  
Diagnostic Digit 7  
X
X
X
X
X
X
X
X
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
0
0
1
1
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
1
0
1
0
1
0
1
Note: Write operation: D14=0; Read operation: D14=1.  
The Shutdown Register controls AS1116 shutdown mode.  
Table 8. Shutdown Register Format (Address (HEX) = 0x0C))  
Register Data  
HEX  
Code  
Mode  
D7 D6 D5 D4 D3 D2 D1 D0  
Shutdown Mode, Reset Feature Register to Default Settings  
Shutdown Mode, Feature Register Unchanged  
0x00  
0x80  
0x01  
0x81  
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
1
Normal Operation, Reset Feature Register to Default Settings  
Normal Operation, Feature Register Unchanged  
Decode Enable Register (0x09)  
The Decode Enable Register sets the decode mode. BCD/HEX decoding (either BCD code – characters 0:9, E, H, L,  
P, and -, or HEX code – characters 0:9 and A:F) is selected by bit D2 (page 14) of the Feature Register. The Decode  
Enable Register is used to select the decode mode or no-decode for each digit. Each bit in the Decode Enable Regis-  
ter corresponds to its respective display digit (i.e., bit D0 corresponds to digit 0, bit D1 corresponds to digit 1 and so  
on). Table 10 lists some examples of the possible settings for the Decode Enable Register bits.  
Note: A logic high enables decoding and a logic low bypasses the decoder altogether.  
When decode mode is used, the decoder looks only at the lower-nibble (bits D3:D0) of the data in the Digit-Registers,  
disregarding bits D6:D4. Bit D7 sets the decimal point (SEG DP) independent of the decoder and is positive logic (bit  
D7 = 1 turns the decimal point on). Table 10 lists the code-B font; Table 11 lists the HEX font.  
When no-decode mode is selected, data bits D7:D0 of the Digit-Registers correspond to the segment lines of the  
AS1116. Table 12 shows the 1:1 pairing of each data bit to the appropriate segment line.  
Table 9. Decode Enable Register Format Examples  
Register Data  
HEX  
Code  
Decode Mode  
D7 D6 D5 D4 D3 D2 D1 D0  
No decode for digits 7:0  
0x00  
0x01  
0x07  
0x3F  
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
1
0
0
0
0
1
0
0
0
1
1
1
0
0
1
1
0
0
1
1
1
1
Code-B/HEX decode for digit 0. No decode for digits 7:1  
Code-B/HEX decode for digit 0:2. No decode for digits 7:3  
Code-B/HEX decode for digits 0:5. No decode for digits 7:6  
Code-B/HEX decode for digits 0,2,5. No decode for digits 1, 3, 4, 6, 7 0x25  
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AS1116  
Datasheet - Detailed Description  
Table 10. Code-B Font  
Register Data  
Char-  
Register Data  
Register Data  
Char-  
acter  
Char-  
acter  
acter  
D7  
D7  
D7  
D6:D4 D3 D2 D1 D0  
D6:D4 D3 D2 D1 D0  
D6:D4 D3 D2 D1 D0  
X
X
X
X
X
X
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
X
X
X
X
X
X
0
0
1
1
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
X
X
X
X
X
1
1
1
1
X
1
1
1
1
X
0
0
1
1
X
0
1
0
1
X
1*  
* The decimal point can be enabled with every character by setting bit D7 = 1.  
Table 11. HEX Font  
Register Data  
Register Data  
Register Data  
D6:D4 D3 D2 D1 D0  
Char-  
acter  
Char-  
acter  
Char-  
acter  
D7  
D7  
D7  
D6:D4 D3 D2 D1 D0  
D6:D4 D3 D2 D1 D0  
X
X
X
X
X
X
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
X
X
X
X
X
X
0
0
1
1
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
X
X
X
X
X
1
1
1
1
X
1
1
1
1
X
0
0
1
1
X
0
1
0
1
X
1*  
* The decimal point can be enabled with every character by setting bit D7 = 1.  
Table 12. No-Decode Mode Data Bits and Corresponding Segment Lines  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Corresponding Segment Line  
DP  
A
B
C
D
E
F
G
Figure 19. Standard 7-Segment LED  
F
A
G
B
E
C
D
DP  
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AS1116  
Datasheet - Detailed Description  
Display-Test Mode  
The AS1116 can detect open or shorted LEDs. Readout of either open LEDs (D2=1) or short LEDs (D1=1) is possible,  
as well as a OR relation of open and short (D1=D2=1). After a dignostic run bit D4 can be read to clearify if an error  
occurred before reading out detailed diagnostic data.  
Note: All settings of the digit- and control-registers are maintained.  
Table 13. Testmode Register Summary  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
X
REXT_short REXT_open  
LED_global  
LED_test  
LED_open  
LED_short  
DISP_test  
Table 14. Testmode Register Bit Description (Address (HEX) = 0x0F))  
Addr: 0x0F  
Address  
Bit  
Bit Name  
Default Access  
D7:D0  
Optical display test. (Testmode for external visual test.)  
0: Normal operation; 1: Run display test (All digits are tested  
independently from scan limit & shutdown register.)  
D0  
DISP_test  
0
W
Starts a test for shorted LEDs. (Can be set together with D2)  
0: Normal operation; 1: Activate testmode  
D1  
D2  
D3  
D4  
D5  
LED_short  
LED_open  
LED_test  
0
0
0
0
0
W
W
R
Starts a test for open LEDs. (Can be set together with D1)  
0: Normal operation; 1: Activate testmode  
Indicates an ongoing open/short LED test  
0: No ongoing LED test; 1: LED test in progress  
Indicates that the last open/short LED test has detected an error  
0: No error detected; 1: Error detected  
LED_global  
REXT_open  
REXT_short  
R
Checks if external resistor REXT is open  
0: REXT correct; 1: REXT is open  
R
Checks if external resistor REXT is shorted  
0: REXT correct; 1: REXT is shorted  
D6  
D7  
0
0
R
-
Not used  
LED Diagnostic Registers  
These eight registers contain the result of the LED open/short test for the individual LED of each digit.  
Table 15. LED Diagnostic Register Address  
Register  
HEX  
Address  
Segment  
Register  
HEX  
Address  
Segment  
Digit D7 D6 D5 D4 D3 D2 D1 D0  
Digit D7 D6 D5 D4 D3 D2 D1 D0  
DIG0  
DIG1  
DIG2  
DIG3  
DIG4  
DIG5  
DIG6  
DIG7  
0x14  
0x15  
0x16  
0x17  
0x18  
0x19  
0x1A  
0x1B  
DP  
A
B
C
D
E
F
G
DP  
A
B
C
D
E
F
G
Note: If more than 2 shorts occure in the LED array, detection of individual LED fault could become limited to blocs.  
Intensity Control Register (0x0A)  
The brightness of the display can be controlled by digital means using the Intensity Control Registers and by analog  
means using RSET (see Selecting RSET Resistor Value and Using External Drivers on page 15). The intensity can be  
controlled globally for all digits, or for each digit individually. The global intensity command will write intensity data to all  
four individual brightness registers, while the individual intesity command will only write to the associated individual  
intensity register.  
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AS1116  
Datasheet - Detailed Description  
Display brightness is controlled by an integrated pulse-width modulator which is controlled by the lower-nibble of the  
Intensity Control Register. The modulator scales the average segment-current in 16 steps from a maximum of 15/16  
down to 1/16 of the peak current set by RSET.  
Table 16. Intensity Register Format  
Register Data  
MSB D2 D1 LSB  
Register Data  
MSB D2 D1 LSB  
Duty Cycle  
HEX Code  
Duty Cycle  
HEX Code  
1/16 (min on)  
2/16  
0xX0  
0xX1  
0xX2  
0xX3  
0xX4  
0xX5  
0xX6  
0xX7  
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
9/16  
10/16  
11/16  
12/16  
13/16  
0xX8  
0xX9  
0xXA  
0xXB  
0xXC  
0xXD  
0xXE  
0xXF  
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
3/16  
4/16  
5/16  
6/16  
7/16  
8/16  
14/16  
15/16  
15/16 (max on)  
Table 17. Intensity Register Address  
Register Data  
Register HEX Address  
Type  
Global  
Digit  
Digit  
Digit  
D7:D4  
X
Digit 1 Intensity  
Digit 3 Intensity  
Digit 5 Intensity  
Digit 7 Intensity  
D3:D0  
0x0A  
0x10  
0x11  
0x12  
0x13  
Global Intensity  
Digit 0 Intensity  
Digit 2 Intensity  
Digit 4 Intensity  
Digit 6 Intensity  
Digit  
Scan-Limit Register (0x0B)  
The Scan-Limit Register controls which of the digits are to be displayed. When all 8 digits are to be displayed, the  
update frequency is typically 0.8kHz. If the number of digits displayed is reduced, the update frequency is increased.  
The frequency can be calculated using 8fOSC/N, where N is the number of digits. Since the number of displayed digits  
influences the brightness, RSET should be adjusted accordingly.  
Note: To avoid differences in brightness this register should not be used to blank parts of the display (leading zeros).  
Table 18. Scan-Limit Register Format (Address (HEX) = 0x0B))  
Register Data  
Register Data  
HEX  
Code  
HEX  
Code  
Scan Limit  
Scan Limit  
D7:D3 D2 D1 D0  
D7:D3 D2 D1 D0  
Display digit 0 only  
Display digits 0:1  
Display digits 0:2  
Display digits 0:3  
0xX0  
0xX1  
0xX2  
0xX3  
X
X
X
X
0
0
0
0
0
0
1
1
0
1
0
1
Display digits 0:4  
Display digits 0:5  
Display digits 0:6  
Display digits 0:7  
0xX4  
0xX5  
0xX6  
0xX7  
X
X
X
X
1
1
1
1
0
0
1
1
0
1
0
1
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AS1116  
Datasheet - Detailed Description  
Feature Register (0x0E)  
The Feature Register is used for enabling various features including switching the device into external clock mode,  
applying an external reset, selecting code-B or HEX decoding, enabling or disabling blinking, enabling or disabling the  
SPI-compatible interface, setting the blinking rate, and resetting the blink timing.  
Note: At power-up the Feature Register is initialized to 0.  
Table 19. Feature Register Summary  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
blink_  
start  
blink_  
freq_sel  
sync  
blink_en  
NU  
decode_sel  
reg_res  
clk_en  
Table 20. Feature Register Bit Descriptions (Address (HEX) = 0xXE)  
Feature Register  
Addr: 0xXE  
Enables and disables various device features.  
Bit  
Bit Name  
Default  
Access  
Bit Description  
External clock active.  
0 = Internal oscillator is used for system clock.  
D0  
clk_en  
0
R/W  
1 = Pin CLK of the serial interface operates as system clock input.  
Resets all control registers except the Feature Register.  
0 = Reset Disabled. Normal operation.  
D1  
reg_res  
0
0
R/W  
R/W  
1 = All control registers are reset to default state (except the Feature  
Register) identically after power-up.  
Note: The Digit Registers maintain their data.  
Selects display decoding for the selected digits (Table 9 on page 10).  
0 = Enable Code-B decoding (see Table 10 on page 11).  
1 = Enable HEX decoding (see Table 11 on page 11).  
Not used  
Enables blinking.  
0 = Disable blinking. 1 = Enable blinking.  
Sets blink with low frequency (with the internal oscillator enabled):  
0 = Blink period typically is 1 second (0.5s on, 0.5s off).  
1 = Blink period is 2 seconds (1s on, 1s off).  
D2  
decode_sel  
D3  
D4  
NU  
blink_en  
0
0
R/W  
R/W  
D5 blink_freq_sel  
Synchronizes blinking on the rising edge of pin LD. The multiplex and  
blink timing counter is cleared on the rising edge of pin LD. By setting  
this bit in multiple devices, the blink timing can be synchronized across  
all the devices.  
Start Blinking with display enabled phase. When bit D4 (blink_en) is set,  
bit D7 determines how blinking starts.  
D6  
D7  
sync  
0
0
R/W  
R/W  
blink_start  
0 = Blinking starts with the display turned off.  
1 = Blinking starts with the display turned on.  
No-Op Register (0xX0)  
The No-Op Register is used when multiple AS1116 devices are cascaded in order to support displays with more than 8  
digits. The cascading must be done in such a way that all SDO pins are connected to SDI of the next AS1116 (see Fig-  
ure 20 on page 16). The LD and SCL signals are connected to all devices.  
For example, if five devices are cascaded, in order to perform a write operation to the fifth device, the write-command  
must be followed by four no-operation commands. When the LD signal goes high, all shift registers are latched. The  
first four devices will receive no-operation commands and only the fifth device will receive the intended operation com-  
mand, and subsequently update its register.  
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AS1116  
Datasheet - Typical Application  
9 Typical Application  
Selecting RSET Resistor Value and Using External Drivers  
Brightness of the display segments is controlled via RSET. The current that flows between VDD and ISET defines the  
current that flows through the LEDs.  
Segment current is about 200 times the current in ISET. Typical values for RSET for different segment currents, operat-  
ing voltages, and LED voltage drop (VLED) are given in Table 21 & Table 22. The maximum current the AS1116 can  
drive is 47mA. If higher currents are needed, external drivers must be used, in which case it is no longer necessary  
that the devices drive high currents.  
Note: The display brightness can also be logically controlled (see Intensity Control Register (0x0A) on page 12).  
Table 21. RSET vs. Segment Current and LED Forward Voltage, VDD = 2.7V & 3.3V & 3.6V  
VLED  
VLED  
2.0V  
VLED  
2.0V  
ISEG (mA)  
1.5V  
5kΩ  
2.0V  
4.4kΩ  
5.9kΩ  
9.6kΩ  
20.7kΩ  
1.5V  
2.5V  
5.7kΩ  
8.1kΩ  
12.6kΩ  
26kΩ  
1.5V  
2.5V  
6.6kΩ  
9.2kΩ  
14.3kΩ  
3.0V  
40  
30  
20  
10  
6.7kΩ  
9.1kΩ  
13.9kΩ  
28.8kΩ  
6.4kΩ  
8.8kΩ  
13.3kΩ  
27.7kΩ  
7.5kΩ  
7.2kΩ  
9.8kΩ  
15kΩ  
31kΩ  
5.5kΩ  
7.5kΩ  
13kΩ  
6.9kΩ  
10.7kΩ  
22.2kΩ  
10.18kΩ  
15.6kΩ  
31.9kΩ  
29.5kΩ 27.3kΩ  
Table 22. RSET vs. Segment Current and LED Forward Voltage, VDD = 4.0V & 5.0V  
VLED  
2.5V  
VLED  
2.5V  
ISEG  
(mA)  
1.5V  
2.0V  
3.0V  
3.5V  
1.5V  
2.0V  
3.0V  
3.5V  
4.0V  
40  
30  
20  
10  
8.6kΩ  
8.3kΩ  
7.9kΩ  
7.6kΩ 5.2kΩ  
11.35kΩ 11.12kΩ 10.84kΩ 10.49kΩ 10.2kΩ 9.9kΩ  
15.4kΩ 15.1kΩ 14.7kΩ 14.4kΩ 13.6kΩ 13.1kΩ  
11.6kΩ 11.2kΩ 10.8kΩ 9.9kΩ 7.8kΩ  
17.7kΩ 17.3kΩ 16.6kΩ 15.6kΩ 13.6kΩ  
36.89kΩ 35.7kΩ 34.5kΩ 32.5kΩ 29.1kΩ  
23.6kΩ 23.1kΩ 22.6kΩ  
22kΩ 21.1kΩ 20.2kΩ  
48.9kΩ 47.8kΩ 46.9kΩ 45.4kΩ 43.8kΩ 42kΩ  
Calculating Power Dissipation  
The upper limit for power dissipation (PD) for the AS1116 is determined from the following equation:  
PD = (VDD x 5mA) + (VDD - VLED)(DUTY x ISEG x N)  
(EQ 1)  
Where:  
VDD is the supply voltage.  
DUTY is the duty cycle set by intensity register (page 13).  
N is the number of segments driven (worst case is 8)  
VLED is the LED forward voltage  
ISEG = segment current set by RSET  
Dissipation Example:  
ISEG = 40mA, N = 8, DUTY = 15/16, VLED = 2.2V at 40mA, VDD = 5V  
PD = 5V(5mA) + (5V - 2.2V)(15/16 x 40mA x 8) = 0.865W  
(EQ 2)  
(EQ 3)  
Thus, for a QSOP-24 package ΘJA = +88°C/W, the maximum allowed TAMB is given by:  
TJ,MAX = TAMB + PD x ΘJA = 150°C = TAMB + 0.865W x 88°C/W  
(EQ 4)  
In this example the maximum ambient temperature must stay below 73.88°C.  
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AS1116  
Datasheet - Typical Application  
8x8 Dot Matrix Mode  
The application example in Figure 20 shows the AS1116 in the 8x8 LED dot matrix mode.  
The LED columns have common cathodes and are connected to the DIG0:7 outputs. The rows are connected to the  
segment drivers. Each of the 64 LEDs can be addressed separately. The columns are selected via the digits as listed  
in Table 7 on page 9.  
The Decode Enable Register (see page 10) must be set to ‘00000000’ as described in Table 9 on page 10. Single  
LEDs in a column can be addressed as described in Table 12 on page 11, where bit D0 corresponds to segment G and  
bit D7 corresponds to segment DP.  
Note: For a multiple-digit dot matrix, multiple AS1116 devices can be cascaded easily.  
Figure 20. Application Example as LED Dot Matrix Driver  
DIG0 to  
DIG7  
VDD  
2.7 to 5V  
9.53kΩ  
SEG A to G  
SEP DP  
ISET  
SDI  
AS1116  
I/O  
SCL  
LD  
Diode Arrangement  
I/O  
I/O  
µP  
SDO  
I/O  
GND  
Diagnostic  
readback: open  
& shorted LEDs  
Supply Bypassing and Wiring  
In order to achieve optimal performance the AS1116 should be placed very close to the LED display to minimize effects  
of electromagnetic interference and wiring inductance.  
Furthermore, it is recommended to connect a 10µF electrolytic and a 0.1µF ceramic capacitor between pins VDD and  
GND to avoid power supply ripple (see Figure 20 on page 16).  
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AS1116  
Datasheet - Package Drawings and Markings  
10 Package Drawings and Markings  
The AS1116 is available in the QSOP-24 package.  
Figure 21. QSOP-24 Package  
Symbol  
Min  
1.35  
0.10  
1.37  
0.20  
0.19  
8.55  
5.79  
3.81  
Max  
1.75  
0.25  
1.57  
0.30  
0.25  
8.74  
6.20  
3.99  
A
A1  
A2  
b
C
D
E
E1  
e
0.635 BSC  
h
0.22  
0.40  
0º  
0.49  
1.27  
8º  
L
θ
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AS1116  
Datasheet - Package Drawings and Markings  
Figure 22. TQFN(4x4)-24 Package  
19  
20  
21  
22  
23  
24  
18  
17  
16  
15  
14  
13  
1
2
3
4
5
6
12  
11  
10  
9
8
7
m
m
Symbol  
Min  
0.50  
0.00  
Typ  
Max  
0.60  
0.05  
Symbol  
e
Min  
Typ  
Max  
A
A1  
A3  
b
0.55  
0.50BSC  
0.35  
L
0.30  
0.00  
0.40  
0.10  
0.152REF  
0.23  
L1  
0.18  
0.28  
aaa  
bbb  
ccc  
ddd  
eee  
0.10  
0.10  
0.10  
0.05  
0.08  
D
4.00BSC  
4.00BSC  
2.80  
E
D2  
E2  
2.70  
2.70  
2.90  
2.90  
2.80  
Notes:Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.  
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.  
2. All dimensions are in millimeters; angles in degrees.  
3. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip.  
Dimension L1 represents terminal full back from package edge up to 0.1mm is acceptable.  
4. Coplanarity applies to the exposed heat slug as well as the terminal.  
5. Radius on terminal is optional.  
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AS1116  
Datasheet - Ordering Information  
11 Ordering Information  
The devices are available as the standard products shown in Table 23.  
Table 23. Ordering Information  
Ordering Code  
Marking  
Desciption  
Delivery Form  
Package  
64 LED Driver with Detailed  
Error Detection  
AS1116-BSST  
AS1116  
Tape and Reel  
QSOP-24  
64 LED Driver with Detailed  
Error Detection  
AS1116-BQFT  
ASR9  
Tape and Reel  
TQFN(4x4)-24  
All devices are RoHS compliant and free of halogene substances.  
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AS1116  
Datasheet  
Copyrights  
Copyright © 1997-2009, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe.  
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,  
translated, stored, or used without the prior written consent of the copyright owner.  
All products and companies mentioned are trademarks or registered trademarks of their respective companies.  
Disclaimer  
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing  
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding  
the information set forth herein or regarding the freedom of the described devices from patent infringement.  
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.  
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for  
current information. This product is intended for use in normal commercial applications. Applications requiring  
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,  
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by  
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show  
deviations from the standard production flow, such as test flow or test location.  
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,  
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to  
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or  
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the  
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of  
austriamicrosystems AG rendering of technical or other services.  
Contact Information  
Headquarters  
austriamicrosystems AG  
Tobelbaderstrasse 30  
A-8141 Unterpremstaetten - Graz, Austria  
Tel: +43 (0) 3136 500 0  
Fax: +43 (0) 3136 525 01  
For Sales Offices, Distributors and Representatives, please visit:  
http://www.austriamicrosystems.com/contact-us  
www.austriamicrosystems.com  
Revision 1.04  
20 - 20  

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