AS1371-BTDT-30

更新时间:2024-09-18 08:13:17
品牌:AMSCO
描述:400mA, Low Input Voltage, Low Quiescent Current LDO

AS1371-BTDT-30 概述

400mA, Low Input Voltage, Low Quiescent Current LDO 400毫安,低输入电压,低静态电流LDO 线性稳压器IC

AS1371-BTDT-30 规格参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DFN
包装说明:HVSON,针数:6
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.82
Is Samacsys:N最大回动电压 1:0.05 V
最大输入电压:3.6 V最小输入电压:1.2 V
JESD-30 代码:S-PDSO-N6JESD-609代码:e3
长度:2 mm功能数量:1
端子数量:6工作温度TJ-Max:150 °C
最大输出电流 1:0.4 A最大输出电压 1:3.105 V
最小输出电压 1:2.895 V标称输出电压 1:3 V
封装主体材料:PLASTIC/EPOXY封装代码:HVSON
封装形状:SQUARE封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260认证状态:Not Qualified
调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR座面最大高度:0.6 mm
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:2 mmBase Number Matches:1

AS1371-BTDT-30 数据手册

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Datasheet  
AS1371  
400mA, Low Input Voltage, Low Quiescent Current LDO  
1 General Description  
2 Key Features  
Ultra-Low Dropout Voltage: 20mV @ 100mA load  
Operating Input Voltage Range: 1.2V to 3.6V  
Output Voltages: 0.6V to 3.3V in 50mV steps  
Max. Output Current: 400mA  
The AS1371 low input voltage, positive voltage regulator  
is designed to deliver up to 400mA while consuming  
typically only 15µA of quiescent current. The device  
operates from input voltages of 1.2V to 3.6V, and is  
available in fixed output voltages between 0.6V and  
3.3V (programmable in 50mV steps).  
Output Voltage Accuracy: ±1%  
Operation at the full 400mA load current is dependent  
upon the maximum power dissipation available from  
package and environment.  
Low Shutdown Current: 10nA  
Low Quiescent Current: 50µA @ max load  
Integrated Overtemperature/Overcurrent Protection  
Under-Voltage Lockout Feature  
The low input voltage and ultra-low dropout voltage  
(20mV @ 100mA load and 80mV @ 400mA load)  
supports single primary cell operation in small  
applications, when operated with minimum input-to-  
output voltage differentials. In addition, the regulator  
Chip Enable Input  
Power-OK and Low Battery Detection  
Sense Input Option  
provides  
a power management life extension by  
operating from pre-existing 1.8V and 2.5V outputs to  
provide low output voltages for new generation portable  
processor cores.  
Minimal External Components Required  
Operating Temperature Range: -40°C to +85°C  
6-pin 2x2 TDFN Package  
The device features stable output voltage with ceramic  
capacitors down to a value of 1µF, strict output voltage  
regulation tolerances (±1%), and good line- and load-  
regulation.  
3 Applications  
The devices are ideal for powering cordless and mobile  
phones, MP3 players, CD and DVD players, PDAs,  
hand-held computers, digital cameras, and any other  
hand-held and/or battery-powered device.  
The AS1371 is available in a 6-pin 2x2 TDFN package  
and is qualified for -40°C to +85°C operation.  
Figure 1. AS1371 - Typical Application Diagram  
Input  
1.2V to 3.6V  
Output  
0.6V to 3.3V  
OUT  
IN  
C
C
IN  
OUT  
1µF  
1µF  
100kΩ  
AS1371  
ON  
OFF  
EN  
POK  
GND  
SENSE  
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Revision 1.04  
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AS1371  
Datasheet - Pin Assignments  
4 Pin Assignments  
Figure 2. Pin Assignments (Top View)  
IN  
POK  
EN  
OUT  
1
2
3
6
5
4
SENSE  
GND  
AS1371  
Exposed  
Pad  
Pin Descriptions  
Table 1. Pin Descriptions  
Pin Name  
Pin Number  
Description  
1
LDO Input. Input voltage range: 1.2V to 3.6V. Bypass with 1µF to GND.  
IN  
Power-OK Output. Active-low, open-drain output indicates an out-of-  
regulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic  
levels. Leave this pin unconnected if the Power-OK feature is not used.  
Active-High Enable Input. A logic low reduces the supply current to < 1µA.  
Connect to pin IN for normal operation.  
Ground. This pin also functions as a heat sink. Solder it to a large pad or to  
the circuit-board ground plane to maximize power dissipation.  
Sense Input. Represents the input for the Power-OK behaviour. If  
connected to GND the POK output is related to OUT.  
2
POK  
3
4
EN  
GND  
5
6
SENSE  
OUT  
LDO Output. Bypass with 1µF to GND.  
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad  
Exposed Pad or to the circuit-board ground plane to maximize power dissipation. Internally  
it is connected GND.  
GND  
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AS1371  
Datasheet - Absolute Maximum Ratings  
5 Absolute Maximum Ratings  
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical  
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may  
affect device reliability.  
Table 2. Absolute Maximum Ratings  
Parameter  
Min  
-0.3  
Max  
+5.0  
Units  
V
Notes  
IN and EN to GND  
POK and OUT to GND  
Output Short-Circuit Duration  
Thermal Resistance θJA  
Junction Temperature TJ  
Operating Temperature Range  
Storage Temperature Range  
-0.3  
VIN + 0.3  
V
Indefinite  
V
+78.6  
ºC/W  
ºC  
+150  
Internally limited  
-40  
-65  
+85  
ºC  
+150  
ºC  
The reflow peak soldering temperature  
(body temperature) specified is in  
accordance with IPC/JEDEC J-STD-  
020D “Moisture/Reflow Sensitivity  
Classification for Non-Hermetic Solid  
State Surface Mount Devices”.  
Package Body Temperature  
+260  
ºC  
The lead finish for Pb-free leaded  
packages is matte tin (100% Sn).  
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Revision 1.04  
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AS1371  
Datasheet - Electrical Characteristics  
6 Electrical Characteristics  
VIN = VOUT (Nominal) + 0.5V, EN = IN, CIN = COUT = 1µF, TAMB = -40°C to +85ºC (unless otherwise specified). Typical  
Values are at TAMB = +25ºC.  
Table 3. Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
VIN  
Input Voltage  
1.2  
3.6  
V
Available in 50mV steps, see  
VOUT  
Output Voltage  
0.6  
-1  
3.3  
+1  
V
Ordering Information on page 13  
TAMB = +25ºC, IOUT = 1mA,  
VOUT > 1V  
Output Voltage Accuracy  
%
TAMB = -40 to +85ºC, IOUT = 1mA,  
VOUT > 1V  
-2.7  
400  
+2.7  
IOUT  
Maximum Output Current  
Current Limit  
mA  
mA  
ILIM  
650  
15  
IOUT = 0mA  
IOUT = 400mA  
20  
50  
IQ  
Quiescent Current  
Dropout Voltage1  
µA  
50  
IOUT = 100mA  
20  
VIN-VOUT  
mV  
IOUT = 400mA  
80  
ΔVLNR  
ΔVLDR  
Line Regulation  
Load Regulation  
IOUT = 1mA  
-15  
0
+15  
mV  
IOUT = 1mA to 400mA  
f = 10Hz to 100kHz, IOUT = 10mA  
0.003  
100  
%/mA  
µVRMS  
Output Voltage Noise  
Output Voltage AC  
Power-Supply Rejection Ratio  
PSRR  
f = 10kHz, IOUT = 10mA  
50  
dB  
Shutdown2  
Exit Delay from Shutdown3,4  
Enable Supply Current  
tON  
90  
150  
1
µs  
EN = GND, TAMB = +25ºC  
EN = GND, TAMB = +85ºC  
0.01  
0.04  
IOFF  
µA  
VIH  
VIL  
1.0  
Enable Input Threshold  
V
0.4  
EN = IN or GND, TAMB = +25ºC  
EN = IN or GND, TAMB = +85ºC  
0.03  
0.2  
100  
IEN  
Enable Input Bias Current  
nA  
Power-OK Output  
SENSE = GND, VPOKFALLING  
SENSE = GND, Hysteresis  
VOUT = 1.05V, VSENSE falling  
Hysteresis  
90  
94  
1
97  
Power-OK Voltage Threshold5  
VPOK  
% VOUT  
mV  
650  
800  
50  
950  
Power-OK Sense Voltage  
Threshold  
VSENSE  
VOL  
POK Output Voltage Low  
ISINK = 100µA  
0.4  
1
V
0 VPOK 3.6V, TAMB = +25ºC,  
IPOK  
POK Output Leakage Current  
µA  
VOUT in regulation  
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Revision 1.04  
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AS1371  
Datasheet - Electrical Characteristics  
Table 3. Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Thermal Protection  
Thermal Shutdown  
Temperature  
TSHDN  
150  
15  
ºC  
ºC  
ΔTSHDN  
Thermal Shutdown Hysteresis  
1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) +0.5V (applies only to output  
voltages 1.3V).  
2. The rise and fall time of the shutdown signal must not exceed 1ms.  
3. The delay time is defined as time required to set VOUT to 95% of its final nominal value.  
4. Guaranteed by design.  
5. The functionality is proven by production test, limits are guaranteed by design.  
Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or  
SQC (Statistical Quality Control) methods.  
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AS1371  
Datasheet - Typical Operating Characteristics  
7 Typical Operating Characteristics  
VOUT = 1.8V, VIN = 2.3V, IOUT = 1mA, TAMB = +25°C (unless otherwise specified).  
Figure 3. Output Voltage vs. Temperature  
Figure 4. Line Regulation, VOUT vs. VIN;  
1.9  
1.9  
1.875  
1.85  
1.825  
1.8  
1.875  
1.85  
1.825  
1.8  
1.775  
1.75  
1.775  
1.75  
1.725  
1.7  
- 40°C  
+ 25°C  
+ 85°C  
no load  
1.725  
Iout = 10mA  
1.7  
-40  
-20  
0
20  
40  
60  
80  
2.2  
2.4  
2.6  
2.8  
3
3.2  
3.4  
3.6  
Temperature (°C)  
Input Voltage (V)  
Figure 5. Load Regulation, VOUT vs. IOUT;  
Figure 6. Quiescent Current vs. Input Voltage  
1.9  
100  
no load  
90  
1.875  
1.85  
Iout = 100mA  
Iout = 400mA  
80  
70  
60  
50  
40  
30  
20  
10  
0
1.825  
1.8  
1.775  
1.75  
- 40°C  
+ 25°C  
1.725  
+ 85°C  
1.7  
0
50 100 150 200 250 300 350 400  
Output Current (mA)  
2.2  
2.4  
2.6  
2.8  
3
3.2  
3.4  
3.6  
Input Voltage (V)  
Figure 7. POK Voltage Threshold vs. Temperature  
Figure 8. Dropout Voltage vs. Output Current  
100  
100  
99  
98  
97  
96  
95  
94  
93  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
- 40°C  
+ 25°C  
+ 85°C  
92  
POK rising  
POK falling  
91  
90  
-40  
-20  
0
20  
40  
60  
80  
0
50 100 150 200 250 300 350 400  
Output Current (mA)  
Temperature (°C)  
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AS1371  
Datasheet - Typical Operating Characteristics  
Figure 9. Line Transient Response;  
VIN = 2.3V to 2.8V, no load  
Figure 10. Load Transient Response;  
IOUT = 0mA to 100mA  
100ms/Div  
100ms/Div  
Figure 11. Turn ON  
Figure 12. Turn OFF  
20µs/Div  
20µs/Div  
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AS1371  
Datasheet - Detailed Description  
8 Detailed Description  
The AS1371 is a low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where  
output current load requirements range from no load to 400mA. All devices come with fixed output voltage from 0.6V to  
3.3V. (see Ordering Information on page 13).  
The AS1371 also features a Power-OK output to indicate when the output is within 10% (max) of final value, and also  
an Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit  
and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying  
(e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches  
150°C. This is a useful protection when the device is under sustained short circuit conditions.  
As illustrated in Figure 13, the devices comprise voltage reference, error amplifier, P-channel MOSFET pass transistor,  
Power-OK detect logic, internal voltage divider, current limiter, thermal sensor and shutdown logic.  
The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this  
reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference  
voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the  
output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to  
the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT.  
Figure 13. AS1371 - Block Diagram  
AS1371  
IN  
Shutdown/  
Power-On  
EN  
Control Logic  
Thermal  
Overload  
Protection  
-
Error  
Amplifier  
+
OUT  
Trimmable  
Reference  
Voltage  
Bandgap Voltage  
&
Current Reference  
SENSE  
POK  
Power-OK  
Compare  
Logic  
NMOS  
GND  
Output Voltages  
Standard products are factory-set with output voltages from 0.6V to 3.3V. A two-digit suffix of the part number identifies  
the nominal output (see Ordering Information on page 13). Non-standard devices are available.  
For more information contact: http://www.austriamicrosystems.com/contact-us  
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AS1371  
Datasheet - Detailed Description  
Power-OK and Low-Battery-Detect Functionality  
The AS1371’s power-ok or low-battery-detect circuitry is built around an N-channel MOSFET. The circuitry monitors  
the voltage on pin SENSE and if the voltage goes out of regulation (e.g. during dropout, current limit or thermal  
shutdown) the pin POK goes low. The pin SENSE can be connected to a resistive-divider to monitor a particular  
definable voltage and compare it with an internal voltage reference. If the SENSE pin is connected to GND an internal  
resistive-divider is activated and connected to the output. Therefore, the Power-OK functionality can be realised with  
no additional external components.  
The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to  
VIN = 1.2V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output,  
connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current  
consumption; a 100kΩ resistor is perfect for most applications (see Figure 1 on page 1).  
For the circuit shown in the left of Figure 14 on page 11, the input bias current into SENSE is very low, permitting large-  
value resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as  
possible. Use a defined resistor for R2 and then calculate R1 as:  
VIN  
– 1  
------------------  
R1 = R2 ×  
(EQ 1)  
VSENSE  
Where:  
VSENSE .... Is the internal sense reference voltage. For values see Table 3 on page 4.  
R2 .... Is the predefined resistor in the resistor divider.  
In case of the SENSE pin is connected to GND, an internal resistor-divider network is activated and compares the out-  
put voltage with a 94% (typ.) voltage threshold. For this particular Power-OK application, no external resistive compo-  
nents are necessary.  
Current Limiting  
The AS1371 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and  
controls the gate voltage of the P-channel MOSFET, limiting the output current to 400mA. The P-channel MOSFET  
output can be shorted to ground for an indefinite period of time without damaging the device.  
Thermal-Overload Protection  
The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal  
shutdown is an effective instrument to prevent die overheating since the power transistor is the principle heat source in  
the device.  
If the junction temperature exceeds 150ºC with 15ºC hysteresis, the thermal sensor starts the shutdown logic, at which  
point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 15ºC, the  
thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under  
continuous thermal-overload conditions.  
Note: The absolute maximum junction-temperature of +150ºC should not be exceeding during continual operation.  
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AS1371  
Datasheet - Detailed Description  
Operating Region and Power Dissipation  
Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature  
difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is  
calculated by:  
P = IOUT × (VIN VOUT  
)
(EQ 2)  
Maximum power dissipation is calculated by:  
TJ TAMB  
------------------------  
=
PMAX  
(EQ 3)  
θ
JB + θJA  
Where:  
TJ - TAMB is the temperature difference between the device die junction and the surrounding air.  
JB is the thermal resistance of the package.  
JA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.  
θ
θ
Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin  
should be connected to the system ground using a large pad or a ground plane.  
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AS1371  
Datasheet - Application Information  
9 Application Information  
Capacitor Selection and Regulator Stability  
Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum  
electrolytic components. For stable operation with load currents up to 400mA over the entire device temperature  
range, use a 1µF (min) ceramic output capacitor with an ESR <0.2Ω. Use large output capacitor values (e.g. 10µF) to  
reduce noise and improve load transient-response, stability and power-supply rejection.  
Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature.  
Power Supply Rejection Ratio  
The AS1371 is designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is typically  
50dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the input and  
output bypass capacitors, which are shown in Figure 14.  
The Section 6 Electrical Characteristics on page 4 show also the device line- and load-transient responses.  
Dropout Voltage  
For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage  
differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life  
battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source on-  
resistance multiplied by the load current, and is calculated by:  
VDROPOUT = VIN VOUT = RDS(ON) × IOUT  
(EQ 4)  
Where:  
RDS(ON) is the drain-to-source on -resistance.  
IOUT is the output current.  
Figure 14. Application Diagrams  
External Voltage Level Detection  
(Input Monitoring)  
Internal Voltage Level Detection  
(Output Monitoring)  
Input  
1.2V to 3.6V  
Input  
1.2V to 3.6V  
Output  
0.6V to 3.3V  
Output  
0.6V to 3.3V  
OUT  
IN  
OUT  
IN  
C
1µF  
ON /  
OFF  
C
IN  
1µF  
C
C
IN  
OUT  
OUT  
R
PU  
R
1µF  
1µF  
PU  
AS1371  
AS1371  
100kΩ  
100kΩ  
ON /  
OFF  
EN  
POK  
EN  
POK  
GND  
SENSE  
GND  
SENSE  
R
R
1
2
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AS1371  
Datasheet - Package Drawings and Markings  
10 Package Drawings and Markings  
The device is available in a 6-pin 2x2 TDFN package.  
Figure 15. 6-pin 2x2 TDFN package Diagram  
D
D2  
Terminal Tip  
e
A
INDEX AREA  
(D/2 x E/2)  
D/2  
B
PIN#1 ID  
INDEX AREA  
D/2 x E/2  
b
EXPOSED PAD  
aaa C  
TOP VIEW  
bbb  
C A B  
BOTTOM VIEW  
ccc C  
B
SEATING  
PLANE  
0.08 C  
SIDE VIEW  
Table 4. 6-pin 2x2 TDFN package Dimensions  
Symbol  
A
Min  
0.51  
0.00  
Typ  
0.55  
0.02  
0.15 ref  
0.15  
0.10  
0.10  
2.00  
2.00  
Max  
0.60  
0.05  
Symbol  
Min  
Typ  
1.45  
1.00  
0.25  
6
3
3
0.50  
0.25  
Max  
1.55  
1.10  
0.35  
1.30  
0.85  
0.15  
D2  
E2  
L
A1  
A3  
aaa  
bbb  
ccc  
D
N
ND  
NE  
e
1.95  
1.95  
2.05  
2.05  
E
b
0.20  
0.32  
Note:  
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.  
2. All dimensions are in millimeters, angle is in degrees.  
3. N is the total number of terminal.  
4. ND and NE refers to the number of terminals on each side respectively.  
5. Terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of ter-  
minal #1 identifier are optional, but must be located within the area indicated. The terminal #1 identifier may be  
either a mold, embedded metal or mark feature.  
6. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip.  
7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.  
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AS1371  
Datasheet - Ordering Information  
11 Ordering Information  
The device is available as the standard products listed in Table 5.  
Table 5. Ordering Information  
Ordering Code  
Marking  
Output  
Description  
Delivery Form  
Package  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
AS1371-BTDT-105  
Tape and Reel 6-pin 2x2 TDFN  
Tape and Reel 6-pin 2x2 TDFN  
Tape and Reel 6-pin 2x2 TDFN  
Tape and Reel 6-pin 2x2 TDFN  
Tape and Reel 6-pin 2x2 TDFN  
Tape and Reel 6-pin 2x2 TDFN  
Tape and Reel 6-pin 2x2 TDFN  
AT  
1.05V  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
AS1371-BTDT-12*  
AS1371-BTDT-15*  
AS1371-BTDT-18*  
AS1371-BTDT-20*  
AS1371-BTDT-25*  
AS1371-BTDT-30*  
*) on request  
AM  
AN  
AO  
AP  
AQ  
AR  
1.2V  
1.5V  
1.8V  
2.0V  
2.5V  
3.0V  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
400mA, Low Input Voltage, Low  
Quiescent Current LDO  
Non-standard devices from 0.6V to 3.3V are available in 50mV steps. For more information and inquiries contact  
http://www.austriamicrosystems.com/contact  
Note: All products are RoHS compliant and Pb-free.  
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect  
For further information and requests, please contact us mailto:sales@austriamicrosystems.com  
or find your local distributor at http://www.austriamicrosystems.com/distributor  
www.austriamicrosystems.com  
Revision 1.04  
13 - 14  
AS1371  
Datasheet  
Copyrights  
Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe.  
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,  
translated, stored, or used without the prior written consent of the copyright owner.  
All products and companies mentioned are trademarks or registered trademarks of their respective companies.  
Disclaimer  
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing  
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding  
the information set forth herein or regarding the freedom of the described devices from patent infringement.  
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.  
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for  
current information. This product is intended for use in normal commercial applications. Applications requiring  
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,  
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by  
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show  
deviations from the standard production flow, such as test flow or test location.  
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,  
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to  
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or  
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the tech-  
nical data herein. No obligation or liability to recipient or any third party shall arise or flow out of  
austriamicrosystems AG rendering of technical or other services.  
Contact Information  
Headquarters  
austriamicrosystems AG  
Tobelbaderstrasse 30  
A-8141 Unterpremstaetten, Austria  
Tel: +43 (0) 3136 500 0  
Fax: +43 (0) 3136 525 01  
For Sales Offices, Distributors and Representatives, please visit:  
http://www.austriamicrosystems.com/contact  
www.austriamicrosystems.com  
Revision 1.04  
14 - 14  

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