AS1371-BTDT-30
更新时间:2024-09-18 08:13:17
品牌:AMSCO
描述:400mA, Low Input Voltage, Low Quiescent Current LDO
AS1371-BTDT-30 概述
400mA, Low Input Voltage, Low Quiescent Current LDO 400毫安,低输入电压,低静态电流LDO 线性稳压器IC
AS1371-BTDT-30 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | DFN |
包装说明: | HVSON, | 针数: | 6 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.82 |
Is Samacsys: | N | 最大回动电压 1: | 0.05 V |
最大输入电压: | 3.6 V | 最小输入电压: | 1.2 V |
JESD-30 代码: | S-PDSO-N6 | JESD-609代码: | e3 |
长度: | 2 mm | 功能数量: | 1 |
端子数量: | 6 | 工作温度TJ-Max: | 150 °C |
最大输出电流 1: | 0.4 A | 最大输出电压 1: | 3.105 V |
最小输出电压 1: | 2.895 V | 标称输出电压 1: | 3 V |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
调节器类型: | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | 座面最大高度: | 0.6 mm |
表面贴装: | YES | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 2 mm | Base Number Matches: | 1 |
AS1371-BTDT-30 数据手册
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PDF下载Datasheet
AS1371
400mA, Low Input Voltage, Low Quiescent Current LDO
1 General Description
2 Key Features
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Ultra-Low Dropout Voltage: 20mV @ 100mA load
Operating Input Voltage Range: 1.2V to 3.6V
Output Voltages: 0.6V to 3.3V in 50mV steps
Max. Output Current: 400mA
The AS1371 low input voltage, positive voltage regulator
is designed to deliver up to 400mA while consuming
typically only 15µA of quiescent current. The device
operates from input voltages of 1.2V to 3.6V, and is
available in fixed output voltages between 0.6V and
3.3V (programmable in 50mV steps).
Output Voltage Accuracy: ±1%
Operation at the full 400mA load current is dependent
upon the maximum power dissipation available from
package and environment.
Low Shutdown Current: 10nA
Low Quiescent Current: 50µA @ max load
Integrated Overtemperature/Overcurrent Protection
Under-Voltage Lockout Feature
The low input voltage and ultra-low dropout voltage
(20mV @ 100mA load and 80mV @ 400mA load)
supports single primary cell operation in small
applications, when operated with minimum input-to-
output voltage differentials. In addition, the regulator
Chip Enable Input
Power-OK and Low Battery Detection
Sense Input Option
provides
a power management life extension by
operating from pre-existing 1.8V and 2.5V outputs to
provide low output voltages for new generation portable
processor cores.
Minimal External Components Required
Operating Temperature Range: -40°C to +85°C
6-pin 2x2 TDFN Package
The device features stable output voltage with ceramic
capacitors down to a value of 1µF, strict output voltage
regulation tolerances (±1%), and good line- and load-
regulation.
3 Applications
The devices are ideal for powering cordless and mobile
phones, MP3 players, CD and DVD players, PDAs,
hand-held computers, digital cameras, and any other
hand-held and/or battery-powered device.
The AS1371 is available in a 6-pin 2x2 TDFN package
and is qualified for -40°C to +85°C operation.
Figure 1. AS1371 - Typical Application Diagram
Input
1.2V to 3.6V
Output
0.6V to 3.3V
OUT
IN
C
C
IN
OUT
1µF
1µF
100kΩ
AS1371
ON
OFF
EN
POK
GND
SENSE
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AS1371
Datasheet - Pin Assignments
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
IN
POK
EN
OUT
1
2
3
6
5
4
SENSE
GND
AS1371
Exposed
Pad
Pin Descriptions
Table 1. Pin Descriptions
Pin Name
Pin Number
Description
1
LDO Input. Input voltage range: 1.2V to 3.6V. Bypass with 1µF to GND.
IN
Power-OK Output. Active-low, open-drain output indicates an out-of-
regulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic
levels. Leave this pin unconnected if the Power-OK feature is not used.
Active-High Enable Input. A logic low reduces the supply current to < 1µA.
Connect to pin IN for normal operation.
Ground. This pin also functions as a heat sink. Solder it to a large pad or to
the circuit-board ground plane to maximize power dissipation.
Sense Input. Represents the input for the Power-OK behaviour. If
connected to GND the POK output is related to OUT.
2
POK
3
4
EN
GND
5
6
SENSE
OUT
LDO Output. Bypass with 1µF to GND.
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad
Exposed Pad or to the circuit-board ground plane to maximize power dissipation. Internally
it is connected GND.
GND
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AS1371
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
-0.3
Max
+5.0
Units
V
Notes
IN and EN to GND
POK and OUT to GND
Output Short-Circuit Duration
Thermal Resistance θJA
Junction Temperature TJ
Operating Temperature Range
Storage Temperature Range
-0.3
VIN + 0.3
V
Indefinite
V
+78.6
ºC/W
ºC
+150
Internally limited
-40
-65
+85
ºC
+150
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
Package Body Temperature
+260
ºC
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
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AS1371
Datasheet - Electrical Characteristics
6 Electrical Characteristics
VIN = VOUT (Nominal) + 0.5V, EN = IN, CIN = COUT = 1µF, TAMB = -40°C to +85ºC (unless otherwise specified). Typical
Values are at TAMB = +25ºC.
Table 3. Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VIN
Input Voltage
1.2
3.6
V
Available in 50mV steps, see
VOUT
Output Voltage
0.6
-1
3.3
+1
V
Ordering Information on page 13
TAMB = +25ºC, IOUT = 1mA,
VOUT > 1V
Output Voltage Accuracy
%
TAMB = -40 to +85ºC, IOUT = 1mA,
VOUT > 1V
-2.7
400
+2.7
IOUT
Maximum Output Current
Current Limit
mA
mA
ILIM
650
15
IOUT = 0mA
IOUT = 400mA
20
50
IQ
Quiescent Current
Dropout Voltage1
µA
50
IOUT = 100mA
20
VIN-VOUT
mV
IOUT = 400mA
80
ΔVLNR
ΔVLDR
Line Regulation
Load Regulation
IOUT = 1mA
-15
0
+15
mV
IOUT = 1mA to 400mA
f = 10Hz to 100kHz, IOUT = 10mA
0.003
100
%/mA
µVRMS
Output Voltage Noise
Output Voltage AC
Power-Supply Rejection Ratio
PSRR
f = 10kHz, IOUT = 10mA
50
dB
Shutdown2
Exit Delay from Shutdown3,4
Enable Supply Current
tON
90
150
1
µs
EN = GND, TAMB = +25ºC
EN = GND, TAMB = +85ºC
0.01
0.04
IOFF
µA
VIH
VIL
1.0
Enable Input Threshold
V
0.4
EN = IN or GND, TAMB = +25ºC
EN = IN or GND, TAMB = +85ºC
0.03
0.2
100
IEN
Enable Input Bias Current
nA
Power-OK Output
SENSE = GND, VPOKFALLING
SENSE = GND, Hysteresis
VOUT = 1.05V, VSENSE falling
Hysteresis
90
94
1
97
Power-OK Voltage Threshold5
VPOK
% VOUT
mV
650
800
50
950
Power-OK Sense Voltage
Threshold
VSENSE
VOL
POK Output Voltage Low
ISINK = 100µA
0.4
1
V
0 ≤ VPOK ≤ 3.6V, TAMB = +25ºC,
IPOK
POK Output Leakage Current
µA
VOUT in regulation
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AS1371
Datasheet - Electrical Characteristics
Table 3. Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Thermal Protection
Thermal Shutdown
Temperature
TSHDN
150
15
ºC
ºC
ΔTSHDN
Thermal Shutdown Hysteresis
1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) +0.5V (applies only to output
voltages ≥ 1.3V).
2. The rise and fall time of the shutdown signal must not exceed 1ms.
3. The delay time is defined as time required to set VOUT to 95% of its final nominal value.
4. Guaranteed by design.
5. The functionality is proven by production test, limits are guaranteed by design.
Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
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AS1371
Datasheet - Typical Operating Characteristics
7 Typical Operating Characteristics
VOUT = 1.8V, VIN = 2.3V, IOUT = 1mA, TAMB = +25°C (unless otherwise specified).
Figure 3. Output Voltage vs. Temperature
Figure 4. Line Regulation, VOUT vs. VIN;
1.9
1.9
1.875
1.85
1.825
1.8
1.875
1.85
1.825
1.8
1.775
1.75
1.775
1.75
1.725
1.7
- 40°C
+ 25°C
+ 85°C
no load
1.725
Iout = 10mA
1.7
-40
-20
0
20
40
60
80
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Temperature (°C)
Input Voltage (V)
Figure 5. Load Regulation, VOUT vs. IOUT;
Figure 6. Quiescent Current vs. Input Voltage
1.9
100
no load
90
1.875
1.85
Iout = 100mA
Iout = 400mA
80
70
60
50
40
30
20
10
0
1.825
1.8
1.775
1.75
- 40°C
+ 25°C
1.725
+ 85°C
1.7
0
50 100 150 200 250 300 350 400
Output Current (mA)
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Input Voltage (V)
Figure 7. POK Voltage Threshold vs. Temperature
Figure 8. Dropout Voltage vs. Output Current
100
100
99
98
97
96
95
94
93
90
80
70
60
50
40
30
20
10
0
- 40°C
+ 25°C
+ 85°C
92
POK rising
POK falling
91
90
-40
-20
0
20
40
60
80
0
50 100 150 200 250 300 350 400
Output Current (mA)
Temperature (°C)
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AS1371
Datasheet - Typical Operating Characteristics
Figure 9. Line Transient Response;
VIN = 2.3V to 2.8V, no load
Figure 10. Load Transient Response;
IOUT = 0mA to 100mA
100ms/Div
100ms/Div
Figure 11. Turn ON
Figure 12. Turn OFF
20µs/Div
20µs/Div
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AS1371
Datasheet - Detailed Description
8 Detailed Description
The AS1371 is a low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where
output current load requirements range from no load to 400mA. All devices come with fixed output voltage from 0.6V to
3.3V. (see Ordering Information on page 13).
The AS1371 also features a Power-OK output to indicate when the output is within 10% (max) of final value, and also
an Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit
and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying
(e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches
150°C. This is a useful protection when the device is under sustained short circuit conditions.
As illustrated in Figure 13, the devices comprise voltage reference, error amplifier, P-channel MOSFET pass transistor,
Power-OK detect logic, internal voltage divider, current limiter, thermal sensor and shutdown logic.
The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this
reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference
voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the
output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to
the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT.
Figure 13. AS1371 - Block Diagram
AS1371
IN
Shutdown/
Power-On
EN
Control Logic
Thermal
Overload
Protection
-
Error
Amplifier
+
OUT
Trimmable
Reference
Voltage
Bandgap Voltage
&
Current Reference
SENSE
POK
Power-OK
Compare
Logic
NMOS
GND
Output Voltages
Standard products are factory-set with output voltages from 0.6V to 3.3V. A two-digit suffix of the part number identifies
the nominal output (see Ordering Information on page 13). Non-standard devices are available.
For more information contact: http://www.austriamicrosystems.com/contact-us
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AS1371
Datasheet - Detailed Description
Power-OK and Low-Battery-Detect Functionality
The AS1371’s power-ok or low-battery-detect circuitry is built around an N-channel MOSFET. The circuitry monitors
the voltage on pin SENSE and if the voltage goes out of regulation (e.g. during dropout, current limit or thermal
shutdown) the pin POK goes low. The pin SENSE can be connected to a resistive-divider to monitor a particular
definable voltage and compare it with an internal voltage reference. If the SENSE pin is connected to GND an internal
resistive-divider is activated and connected to the output. Therefore, the Power-OK functionality can be realised with
no additional external components.
The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to
VIN = 1.2V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output,
connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current
consumption; a 100kΩ resistor is perfect for most applications (see Figure 1 on page 1).
For the circuit shown in the left of Figure 14 on page 11, the input bias current into SENSE is very low, permitting large-
value resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as
possible. Use a defined resistor for R2 and then calculate R1 as:
VIN
⎛
⎝
⎞
– 1
------------------
R1 = R2 ×
(EQ 1)
⎠
VSENSE
Where:
VSENSE .... Is the internal sense reference voltage. For values see Table 3 on page 4.
R2 .... Is the predefined resistor in the resistor divider.
In case of the SENSE pin is connected to GND, an internal resistor-divider network is activated and compares the out-
put voltage with a 94% (typ.) voltage threshold. For this particular Power-OK application, no external resistive compo-
nents are necessary.
Current Limiting
The AS1371 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and
controls the gate voltage of the P-channel MOSFET, limiting the output current to 400mA. The P-channel MOSFET
output can be shorted to ground for an indefinite period of time without damaging the device.
Thermal-Overload Protection
The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal
shutdown is an effective instrument to prevent die overheating since the power transistor is the principle heat source in
the device.
If the junction temperature exceeds 150ºC with 15ºC hysteresis, the thermal sensor starts the shutdown logic, at which
point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 15ºC, the
thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under
continuous thermal-overload conditions.
Note: The absolute maximum junction-temperature of +150ºC should not be exceeding during continual operation.
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AS1371
Datasheet - Detailed Description
Operating Region and Power Dissipation
Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature
difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is
calculated by:
P = IOUT × (VIN – VOUT
)
(EQ 2)
Maximum power dissipation is calculated by:
TJ – TAMB
------------------------
=
PMAX
(EQ 3)
θ
JB + θJA
Where:
TJ - TAMB is the temperature difference between the device die junction and the surrounding air.
JB is the thermal resistance of the package.
JA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.
θ
θ
Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin
should be connected to the system ground using a large pad or a ground plane.
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AS1371
Datasheet - Application Information
9 Application Information
Capacitor Selection and Regulator Stability
Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum
electrolytic components. For stable operation with load currents up to 400mA over the entire device temperature
range, use a 1µF (min) ceramic output capacitor with an ESR <0.2Ω. Use large output capacitor values (e.g. 10µF) to
reduce noise and improve load transient-response, stability and power-supply rejection.
Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature.
Power Supply Rejection Ratio
The AS1371 is designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is typically
50dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the input and
output bypass capacitors, which are shown in Figure 14.
The Section 6 Electrical Characteristics on page 4 show also the device line- and load-transient responses.
Dropout Voltage
For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage
differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life
battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source on-
resistance multiplied by the load current, and is calculated by:
VDROPOUT = VIN – VOUT = RDS(ON) × IOUT
(EQ 4)
Where:
RDS(ON) is the drain-to-source on -resistance.
IOUT is the output current.
Figure 14. Application Diagrams
External Voltage Level Detection
(Input Monitoring)
Internal Voltage Level Detection
(Output Monitoring)
Input
1.2V to 3.6V
Input
1.2V to 3.6V
Output
0.6V to 3.3V
Output
0.6V to 3.3V
OUT
IN
OUT
IN
C
1µF
ON /
OFF
C
IN
1µF
C
C
IN
OUT
OUT
R
PU
R
1µF
1µF
PU
AS1371
AS1371
100kΩ
100kΩ
ON /
OFF
EN
POK
EN
POK
GND
SENSE
GND
SENSE
R
R
1
2
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AS1371
Datasheet - Package Drawings and Markings
10 Package Drawings and Markings
The device is available in a 6-pin 2x2 TDFN package.
Figure 15. 6-pin 2x2 TDFN package Diagram
D
D2
Terminal Tip
e
A
INDEX AREA
(D/2 x E/2)
D/2
B
PIN#1 ID
INDEX AREA
D/2 x E/2
b
EXPOSED PAD
aaa C
TOP VIEW
bbb
C A B
BOTTOM VIEW
ccc C
B
SEATING
PLANE
0.08 C
SIDE VIEW
Table 4. 6-pin 2x2 TDFN package Dimensions
Symbol
A
Min
0.51
0.00
Typ
0.55
0.02
0.15 ref
0.15
0.10
0.10
2.00
2.00
Max
0.60
0.05
Symbol
Min
Typ
1.45
1.00
0.25
6
3
3
0.50
0.25
Max
1.55
1.10
0.35
1.30
0.85
0.15
D2
E2
L
A1
A3
aaa
bbb
ccc
D
N
ND
NE
e
1.95
1.95
2.05
2.05
E
b
0.20
0.32
Note:
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters, angle is in degrees.
3. N is the total number of terminal.
4. ND and NE refers to the number of terminals on each side respectively.
5. Terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of ter-
minal #1 identifier are optional, but must be located within the area indicated. The terminal #1 identifier may be
either a mold, embedded metal or mark feature.
6. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip.
7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
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AS1371
Datasheet - Ordering Information
11 Ordering Information
The device is available as the standard products listed in Table 5.
Table 5. Ordering Information
Ordering Code
Marking
Output
Description
Delivery Form
Package
400mA, Low Input Voltage, Low
Quiescent Current LDO
AS1371-BTDT-105
Tape and Reel 6-pin 2x2 TDFN
Tape and Reel 6-pin 2x2 TDFN
Tape and Reel 6-pin 2x2 TDFN
Tape and Reel 6-pin 2x2 TDFN
Tape and Reel 6-pin 2x2 TDFN
Tape and Reel 6-pin 2x2 TDFN
Tape and Reel 6-pin 2x2 TDFN
AT
1.05V
400mA, Low Input Voltage, Low
Quiescent Current LDO
AS1371-BTDT-12*
AS1371-BTDT-15*
AS1371-BTDT-18*
AS1371-BTDT-20*
AS1371-BTDT-25*
AS1371-BTDT-30*
*) on request
AM
AN
AO
AP
AQ
AR
1.2V
1.5V
1.8V
2.0V
2.5V
3.0V
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
400mA, Low Input Voltage, Low
Quiescent Current LDO
Non-standard devices from 0.6V to 3.3V are available in 50mV steps. For more information and inquiries contact
http://www.austriamicrosystems.com/contact
Note: All products are RoHS compliant and Pb-free.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
For further information and requests, please contact us mailto:sales@austriamicrosystems.com
or find your local distributor at http://www.austriamicrosystems.com/distributor
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AS1371
Datasheet
Copyrights
Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement.
austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring
extended temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional processing by
austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show
deviations from the standard production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the tech-
nical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact
www.austriamicrosystems.com
Revision 1.04
14 - 14
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