AS3933-BSWB [AMSCO]
3D Low Frequency Wake-Up Receiver;型号: | AS3933-BSWB |
厂家: | AMS(艾迈斯) |
描述: | 3D Low Frequency Wake-Up Receiver |
文件: | 总64页 (文件大小:1207K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This product, formerly sold by ams AG, and before that optionally by either
Applied Sensors GmbH, acam-messelectronic GmbH or Cambridge CMOS Sensors,
is now owned and sold by
ScioSense
The technical content of this document under ams / Applied Sensors / acam-
messelectronic / Cambridge CMOS Sensors is still valid.
Contact information
Headquarters:
ScioSense B.V.
High Tech Campus 10
5656 AE Eindhoven
The Netherlands
info@sciosense.com
www.sciosense.com
AS3933
3D Low Frequency Wake-Up Receiver
The AS3933 is a 3-channel low power ASK receiver that is able
to generate a wake-up upon detection of a data signal which
uses a LF carrier frequency between 15-150 kHz. The integrated
correlator can be used for detection of a programmable 16-bit
or 32-bit Manchester wake-up pattern. The device can operate
using one, two, or three active channels.
General Description
The AS3933 provides a digital RSSI value for each active
channel, it supports a programmable data rate and Manchester
decoding with clock recovery. The AS3933 offers an internal
Clock Generator, which is either derived from a crystal oscillator
or the internal RC oscillator. The user can decide to use the
external clock generator instead.
The programmable features of AS3933 enable to optimize its
settings for achieving a longer distance while retaining a
reliable wake-up generation. The sensitivity level of AS3933 can
be adjusted in presence of a strong field or in noisy
environments.
Antenna tuning is greatly simplified, as the automatic tuning
feature ensures perfect matching to the desired carrier
frequency.
The device is available in 16-pin TSSOP and 16-LD QFN (4x4mm)
packages, and DoW (dice on wafer).
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS3933, 3D Low Frequency
Wake-Up Receiver are listed below:
Figure 1:
Added Value of Using AS3933
Benefits
Features
• Enables low power active tags
• Selectable carrier frequency
• 3-channel ASK wake-up receiver
• Carrier frequency range 15 – 150 kHz
• 1-D, 2-D, or 3-D wake-up pattern detection
• 32-bit programmable wake-up pattern
• Supporting doubling of wake-up pattern
• Wake-up without pattern detection selectable
• One, two, or three channel operation
• Highly resistant to false wake-ups
• Improved immunity to false wake-ups
• Allows frequency only detection
• Improved range with best-in-class
sensitivity
• Wake-up sensitivity 80μVRMS (typ.)
ams Datasheet
Page 1
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AS3933 − General Description
Benefits
Features
• Adjustable range
• Sensitivity level adjustable
• False wake-up counter
• Provides tracking of false wake-ups
• Ensures wake-up in a noise environment
• Periodical forced wake-up supported (1s – 2h)
• Current consumption in 3-channel listening mode
2.3 μA (typ.)
• Extended battery life
• Flexible clock configuration
• Operates from a 3V battery
• Industrial temperature range
• RTC based 32 kHz XTAL, RC-OSC, or external clock
• Operating supply range 2.4V – 3.6V (TA = 25°C)
• Operation temperature range -40°C to 85°C
Applications
The AS3933, 3D Low Frequency Wake-Up Receiver is ideal for
Active RFID tags, Real-time location systems, Operator
identification, Access control, and Wireless sensors.
Figure 2:
AS3933 Typical Application Diagram with Crystal Oscillator
VCC
VCC
CS
CL_DAT
DAT
CBAT
CL
CL
XIN
XTAL
XOUT
LF1P
LF2P
TRANSMITTER
TX
WAKE
SCL
AS3933
LF3P
LFN
SDO
SDI
GND
VSS
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[v1-08] 2015-Sep-02
AS3933 − General Description
Figure 3:
AS3933 Typical Application Diagram with RC Oscillator
VCC
VCC
CS
CL_DAT
DAT
CBAT
XIN
XOUT
LF1P
LF2P
TRANSMITTER
TX
WAKE
SCL
AS3933
LF3P
LFN
SDO
SDI
GND
VSS
Figure 4:
AS3933 Typical Application Diagram with Clock from External Source
VCC
VCC
CS
CL_DAT
DAT
CBAT
XIN
EXT. CLOCK
XOUT
TRANSMITTER
TX
LF1P
WAKE
SCL
AS3933
LF2P
LF3P
LFN
SDO
SDI
GND
VSS
ams Datasheet
[v1-08] 2015-Sep-02
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AS3933 − Pin Assignments
Pin Assignments
TSSOP-16 Package
Figure 5:
TSSOP Pin Assignment (Top View)
1
2
3
4
5
6
7
CS
16
15
CL_DAT
DAT
SCL
SDI
SDO
VCC
GND
LF3P
WAKE
14
13
12
VSS
AS3933
XOUT
11
10
9
XIN
LFN
LF2P
LF1P
8
Pin Description
Figure 6:
TSSOP-16 Pin Description
Pin
Number
Pin Name
Pin Type
Description
CS
SCL
SDI
1
2
3
Chip select
Digital input
SDI interface clock
SDI data input
Digital output /
tristate
SDO
4
SDI data output (tristate when CS is low)
V
5
6
Positive supply voltage
Negative supply voltage
CC
Supply pad
GND
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amsDatasheet
[v1-08] 2015-Sep-02
AS3933 − Pin Assignments
Pin
Number
Pin Name
Pin Type
Description
LF3P
LF2P
LF1P
LFN
7
Input antenna channel three
8
Input antenna channel two
Input antenna channel one
Common ground for antenna one, two and three
Crystal oscillator input
Crystal oscillator output
Substrate
9
Analog I/O
10
11
12
13
14
15
16
XIN
XOUT
V
Supply pad
SS
WAKE
DAT
Wake-up output IRQ
Digital output
Data output
CL_DAT
Manchester recovered clock
QFN-16 Package
Figure 7:
QFN Pin Assignment (Top View)
16
13
15
14
1
2
SCL
CS
LF3P
LF2P
12
11
AS3933
3
4
LF1P
LFN
10
9
CL_DAT
DAT
8
6
5
7
ams Datasheet
[v1-08] 2015-Sep-02
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AS3933 − Pin Assignments
Pin Description
Figure 8:
QFN-16 Pin Description
Pin
Number
Pin Name
Pin Type
Description
LF3P
LF2P
LF1P
LFN
1
2
Input antenna channel three
Input antenna channel two
Input antenna channel one
3
Analog I/O
4
Common ground for antenna one, two and three
Crystal oscillator input
Crystal oscillator output
Substrate
XIN
5
XOUT
6
V
7
Supply pad
SS
WAKE
DAT
8
Wake-up output IRQ
Data output
9
Digital output
CL_DAT
CS
10
11
12
13
Manchester recovered clock
Chip select
SCL
Digital input
SDI interface clock
SDI
SDI data input
Digital output /
tristate
SDO
14
SDI data output (tristate when CS is low)
V
15
16
Positive supply voltage
Negative supply voltage
CC
Supply pad
GND
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amsDatasheet
[v1-08] 2015-Sep-02
AS3933 − Pin Assignments
Dice On Wafer
DoW Attributes:
• Wafer Diameter: 8”
• Process: 0.35μm
• Wafer Thickness: 725μm 15μm
• Scribe line: 80μm
• Chip Size: 2.070 x 1.700 mm
• Pad Size: 85 x 85 μm
Figure 9:
DoW Pad Assignment
ams Datasheet
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AS3933 − Pin Assignments
Figure 10:
DoW Pad Description and Position
Position
Pad
1
Name
GND
GND
VCC
Center X (µm)
381.5
Center Y (µm)
1532.5
1532.5
1532.5
1532.5
1532.5
1532.5
257.5
2
634.5
3
817.5
Upper Side
4
SDO
SDI
1000.5
1230.5
1417.5
1902.5
1902.5
648.35
847.5
5
6
SCL
1
CL_DAT
CS
Right Side
2
1365.5
94.5
1
XIN
2
XOUT
VSS
94.5
Bottom Side
3
1203.5
1387.5
1569.5
87.5
87.5
4
WAKE
DAT
87.5
5
87.5
1
LFN
303.5
2
LF1P
LF2P
LF3P
87.5
669.5
Left Side
3
87.5
1103.5
1356.5
4
87.5
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amsDatasheet
[v1-08] 2015-Sep-02
AS3933 − Absolute Maximum Ratings
Stresses beyond those listed in Absolute Maximum Ratings may
cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other
conditions beyond those indicated in Operating Conditions is
not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Absolute Maximum Ratings
Figure 11:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Note
Electrical Parameters
V
DC supply voltage
Input pin voltage
-0.5
-0.5
5
5
V
V
DD
V
IN
Input current
(latch up immunity)
I
-100
100
mA
Norm: Jedec 78
SOURCE
Electrostatic Discharge
Norm: MIL 883 E method 3015
(HBM)
ESD
Electrostatic discharge
2
kV
Continuous Power Dissipation
Total power dissipation
P
0.07
mW
t
(all supplies and outputs)
Temperature Ranges and Storage Conditions
T
Storage temperature
-65
150
260
°C
°C
strg
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering
temperature (body temperature)
is specified according IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State Surface
Mount Devices”.
Package body
temperature
T
body
Relative Humidity
(non-condensing)
RH
5
85
%
NC
Represents a maximum floor life
time of 168h
MSL
Moisture Sensitivity Level
3
ams Datasheet
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AS3933 − Electrical Characteristics
Electrical Characteristics
Figure 12:
Operating Conditions
Symbol
Parameter
Conditions
Min
Typ Max Unit
V
Positive supply voltage
2.4
3
3.6
0
V
V
DD
Negative supply
voltage
V
0
SS
T
Ambient temperature
-40
85
°C
AMB
Figure 13:
DC/AC Characteristics for Digital Inputs and Outputs
Symbol
Parameter
Conditions
Min
Typ Max Unit
CMOS Input
0.6*
0.7*
0.8*
V
High level input voltage
V
IH
V
V
V
DD
DD
DD
0.12*
0.2*
0.3*
V
Low level input voltage
Input leakage current
V
IL
V
V
V
DD
DD
DD
I
100
nA
LEAK
CMOS Output
V
0.4
-
DD
V
High level output voltage
With a load current of 1mA
V
OH
V
0.4
+
SS
V
Low level output voltage
Capacitive load
With a load current of 1mA
V
OL
C
For a clock frequency of 1 MHz
400
pF
L
Tristate CMOS Output
V
0.4
-
DD
V
High level output voltage
With a load current of 1mA
V
OH
V
0.4
+
SS
V
Low level output voltage
Tristate leakage current
With a load current of 1mA
To V and V
V
OL
I
100
nA
OZ
DD
SS
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[v1-08] 2015-Sep-02
AS3933 − Electrical Characteristics
Figure 14:
Electrical System Specifications
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Input Characteristics
AC Input Impedance
at125kHz
In case no antenna
damper is set (R1<4>=0)
R
2
150
95
95
65
65
40
40
23
23
15
MΩ
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
IN
Maximum Input
Frequency Band1
F1max
F1min
F2max
F2min
F3max
F3min
F4max
F4min
F5max
F5min
Minimum Input
Frequency Band1
Maximum Input
Frequency Band2
Minimum Input
Frequency Band2
Maximum Input
Frequency Band3
Minimum Input
Frequency Band3
Maximum Input
Frequency Band4
Minimum Input
Frequency Band4
Maximum Input
Frequency Band5
Minimum Input
Frequency Band5
Current Consumption
Current Consumption in
standard listening mode
with one active channel
and RC-oscillator as
I1CHRC
I2CHRC
3.1
4.6
μA
μA
Clock Generator
Current Consumption in
standard listening mode
with two active channels
and RC-oscillator as
Clock Generator
ams Datasheet
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AS3933 − Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Current Consumption in
standard listening mode
with three active
channels and
I3CHRC
6.1
μA
RC-oscillator as Clock
Generator
Current Consumption in
scanning mode with
three active channels
and RC-oscillator as
Clock Generator
I3CHSCRC
I3CHOORC
3.1
μA
μA
Current Consumption in
ON/OFF mode with three
active channels and
RC-oscillator as Clock
Generator
11% Duty Cycle
2.3
3.8
50% Duty Cycle
Current Consumption in
standard listening mode
with three active
channels and crystal
oscillator as Clock
Generator
I3CHXT
6.5
8.9
12
μA
Current Consumption in
Preamble detection /
Pattern correlation / Data
receiving mode
With 125 kHz carrier
frequency and 1 kbps
data-rate. No load on the
output pins.
IDATA
8.3
μA
(RC-oscillator)
Additional current
consumption per
channel if gain boost
enabled
IBOOST
150
nA
Input Sensitivity
With 125 kHz carrier
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
Input Sensitivity on all
channels in the Band1
SENS1
SENS1B
SENS2
100
80
μVrms
μVrms
μVrms
With 125 kHz carrier
Input Sensitivity on all
channels in the Band1
with 3dB gain boost
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
With 90 kHz carrier
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
Input Sensitivity on all
channels in the Band2
100
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amsDatasheet
[v1-08] 2015-Sep-02
AS3933 − Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
With 90 kHz carrier
Input Sensitivity on all
channels in the Band2
with 3dB gain boost
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
SENS2B
80
μVrms
With 60 kHz carrier
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
Input Sensitivity on all
channels in the Band3
SENS3
SENS3B
SENS4B
100
80
μVrms
μVrms
μVrms
With 60 kHz carrier
Input Sensitivity on all
channels in the Band3
with 3dB gain boost
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
With 30 kHz carrier
Input Sensitivity on all
channels in the Band4
with 3dB gain boost
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
80
With 18 kHz carrier
Input Sensitivity on all
channels in the Band5
with 3dB gain boost
frequency, chip in default
mode, 4 half bits burst + 4
symbols preamble and
single preamble detection
SENS5B
TSAMP
80
μVrms
μs
Channel Settling Time
Amplifier settling time
250
32.768
300
Crystal Oscillator
FXTAL
TXTAL
IXTAL
Frequency
25
45
1
kHz
s
Crystal dependent
Start-up Time
Current consumption
nA
External Clock Source
IEXTCL
FEXTCL
Current consumption
Frequency
0.8
μA
25
45
kHz
ams Datasheet
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AS3933 − Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RC Oscillator
If no calibration is
performed
FRCNCAL
FRCCAL32
25
31
32.768
32.768
45
If calibration with 32.768
kHz reference signal is
performed
34.5
Frequency
kHz
Maximum achievable
frequency after calibration
FRCCALMAX
FRCCALMIN
TRC
23.75
45
Minimum achievable
frequency after calibration
From RC enable
(R1<0> = 0)
Start-up time
1
s
Periods of
reference
clock
TCALRC
IRC
Calibration time
65
Current consumption
650
15
nA
LC Oscillator
L=47mH (Premo:
SDTR1103-0108+),
C=2.3nF
FLCO
Minimum Frequency
kHz
MIN
L=7.2mH (Premo:
SDTR1103-0720+), C=1nF
FLCO
Maximum Frequency
Minimum Eq. Parallel
150
10
kHz
MAX
RPAR
kΩ
MIN
Tuning Caps
Maximum internal
capacitance (in step of
1pF) on LF1P
LF1Ptuning
LF2Ptuning
LF3Ptuning
31
31
31
pF
pF
pF
Maximum internal
capacitance (in step of
1pF) on LF2P
Capacitance
Maximum internal
capacitance (in step of
1pF) on LF3P
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[v1-08] 2015-Sep-02
AS3933 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 15:
Sensitivity vs Voltage and Temperature
120
95 oC
100
27 oC
-40 o
C
80
60
40
20
0
2.4
3
Supply Voltage [V]
3.6
Figure 16:
Sensitivity vs RSSI
1000000
100000
10000
1000
100
10
1
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
RSSI [dB]
ams Datasheet
[v1-08] 2015-Sep-02
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AS3933 − Typical Operating Characteristics
Figure 17:
RC-Oscillator Frequency vs Voltage (Calibr.)
34.5
34
33.5
33
32.5
32
31.5
31
2.4
2.6
2.8
3
3.2
3.4
3.6
Supply Voltage [V]
Figure 18:
RC-Oscillator Frequency vs Temperature (Calibr.)
34.5
34
33.5
33
32.5
32
31.5
31
-36 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Operating Temperature [oC]
Page 16
amsDatasheet
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AS3933 − Detailed Description
The AS3933 is a three-dimensional low power low-frequency
wake-up receiver. The AS3933 is capable of detecting the
presence of an inductive coupled carrier and can extract the
envelope of the ON-OFF-Keying (OOK) modulated carrier. In
case the carrier is Manchester coded, the clock can be recovered
from the received signal and the data can be correlated with a
programmed pattern. If the detected pattern corresponds to
the stored one, a wake-up signal (IRQ) is risen up. The pattern
correlation can be disabled; in this case the wake-up detection
is based only on the frequency detection.
Detailed Description
The AS3933 is made up of three independent receiving
channels, one envelop detector, one data correlator, one
Manchester decoder, 19 programmable registers with the main
logic and a Clock Generator.
The digital logic can be accessed by an SPI. The Clock Generator
can be based on a crystal oscillator, or an internal RC-oscillator
or an external clock. In case the RC-oscillator is used to improve
its accuracy, a calibration can be performed.
The internal LC-oscillator can deliver the antenna’s oscillation
frequency for each channel and the internal tuning capacitor
bank can provide fine tuning.
The Internal RC-oscillator can be calibrated either over SPI or
using the internal algorithm based on the antenna resonance
frequency.
Figure 19:
Block Diagram of LF Wake-Up Receiver AS3933
LC-Oscillator
Wakeup
IRQ
SCL
Data
Channel
RSSI
Main Logic
SPI
SDI
LF1P
LF2P
Amplifier 1
Tuning
Capacitors
Freq. OK
SDO
CS
Channel
Selector
Envelope Detector /
Data Slicer
Data
Correlator
Channel
Amplifier 2
RSSI
RSSI
Tuning
Capacitors
Manchester
Decoder
DAT
Freq. OK
Data
CL_DAT
Channel
Amplifier 3
LF3P
LFN
Tuning
Capacitors
Clock Generator
I / V
Bias
Freq. OK
Clock Buffer
RC Oscillator
Xtal Oscillator
VCC
GND
Xin
Xout
ams Datasheet
[v1-08] 2015-Sep-02
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AS3933 − Detailed Description
AS3933 needs the following external components:
• Power supply capacitor - CBAT - 100 nF.
• 32.768 kHz crystal with its two pulling capacitors - XTAL
and CL - (it is possible to omit these components if the
internal RC oscillator is used instead of the crystal
oscillator).
• One, two, or three LC resonators according to the number
of used channels.
In case the internal RC-oscillator is used (no crystal oscillator is
mounted), the pin XIN has to be connected to the supply, while
pin XOUT should stay floating. Application diagrams with and
without crystal are shown in Figure 2, Figure 3 and Figure 4.
Operating Modes
The diagram in Figure 20 shows how the AS3933 operates.
Figure 20:
Operating Modes Flow Chart
Listening Mode
(WAKE=0)
Frequency Detection OK
And
Frequency Detection OK
And
Pattern Detection Disabled
Pattern Detection Enabled
Start RSSI
(Wake=0)
Pattern doesn’t
match
Clear Wake
or
Time out
Pattern
Correlation
(Wake=0)
Start RSSI
(Wake=1)
Pattern matches
Data Receiving
(WAKE=1)
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AS3933 − Detailed Description
Listening Mode
In listening mode, the chip is active and looks continuously for
the presence of the carrier on the input of all active channels.
In this mode, only the active channel amplifiers and the Clock
Generator are running. In case the carrier is detected, then the
RSSI measurements get started on all three channels and the
result is stored in the memory.
If the three dimensional detection is not required, then it is
possible to deactivate one or more channels. In case only two
channels are required, then the deactivated channel must be
the number two; while in case only one channel is needed, then
the active channel must be the number one.
Inside the listening mode, it is possible to distinguish the
following three low power sub modes:
Standard Listening Mode. All channels are active at the same
time.
Scanning Mode (Low Power Mode 1). In this sub-mode, a time
slot T=1ms is defined and in each time slot only one channel
can be active. As shown in Figure 21 when a certain time slot is
over, the current active channel is switched OFF and the next
channel becomes active and so on. If, for example all three
channels are enabled, in the first time slot the only active
channel is the number one. When the first time slot is over, the
channel one is switched OFF and the channel three becomes
active. During the third time slot, the channel two is active while
the other two are OFF. This channel rotation starts back from
the channel one and goes on until the presence of the carrier
is detected by any channel. The Scanning mode (channel
rotation) is managed internally by the AS3933 and doesn’t need
any activity from the host system (MCU). As soon as one channel
detects the frequency, all three channels become immediately
active at the same time. The AS3933 can perform a
simultaneous multidirectional evaluation (on all three
channels) of the field and evaluate which channel has the
strongest RSSI. The channel with the highest RSSI will be put
through to the demodulator. In this way it is possible to perform
multidirectional monitoring of the field with a current
consumption of a single channel, keeping the sensitivity as
good as if all channels are active at the same time.
ams Datasheet
Page 19
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AS3933 − Detailed Description
Figure 21:
Scanning Mode
Channel 1
Channel 3
Channel 2
time
time
time
Presence of
carrier
t0
t0+T
t0+2T
t0+3T
t0+4T
t0+5T
t1
time
ON/OFF Mode (Low Power Mode 2). In this low power
sub-mode the chip sets the receiving channels in polling mode;
all active channels are on at the same time only for a certain
time T (where T is 1 ms). The OFF-time can be defined with the
bits R4<7:6>. If, for example, R4<7:6>=11 (see Figure 25) the
active channels will be 1ms ON and 8ms OFF.
Figure 22:
ON/OFF Mode
Channel 1
Channel 2
Channel 3
time
time
time
Presence of
carrier
t0
t0+T
2*t0
2*t0+T
3*t0
time
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AS3933 − Detailed Description
Artificial Wake-Up
For each of these sub modes it is possible to enable a further
feature called Artificial Wake-up. The Artificial Wake-up is a
counter based on the used Clock Generator. Three bits define a
time window (see R8<2:0>). If no activity is seen within this time
window, the chip will produce an interrupt on the WAKE pin
that lasts 128 μs. With this interrupt the microcontroller (μC)
can get feedback on the surrounding environment (e.g. read
the false wake-up register R13<7:0>) and/or take actions in
order to change the setup.
Preamble Detection / Pattern Correlation
The chip can go in to this mode after detecting a LF carrier only
if the data correlation is enabled (R1<1>=1). The correlator
searches first for preamble bits and then for data pattern. The
paragraph Wake-Up Protocol: Pattern Detection Enabled
describes how the protocol can be implemented. Should the
pattern correlation be disabled (R1<1>=0), the AS3933 goes
directly in Data receiving mode (see paragraph Data Receiving).
If the received pattern matches, then the wake-up interrupt is
displayed on the WAKE output (Wake goes high) and the chip
goes in Data receiving mode. If the pattern fails, then the
internal wake-up (on all active channels) is terminated and no
interrupt is produced.
Having per default DAT_MASK disabled (R0<6>=0), the DAT pin
shows the entire demodulated incoming signal (carrier
burst+preamble+pattern+data).
If DAT_MASK is enabled (R0<6>=1), the data will be displayed
only after the generation of the WAKEUP interrupt.
Note(s): It is important to note that the Manchester decoder
must be enabled (R1<3>=1) for this feature.
Data Receiving
After a successful wake-up the chip enters the data receiving
mode. In this mode the chip can be retained a normal OOK
receiver. The data is provided on the DAT pin and in case the
Manchester decoder is enabled (see R1<3>), the recovered
clock is present on the CL_DAT. It is possible to set the chip back
to listening mode either with a direct command CLEAR_WAKE
(see Figure 29) or by using the timeout feature. This feature
automatically sets the chip back to listening mode after a
certain time defined by the bits R7<7:5>.
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AS3933 − Detailed Description
System and Block Specification
Register Overview
Figure 23:
Register Overview
7
6
5
4
3
2
1
0
DAT_MAS
K
R0
R1
R2
PATT32
ABS_HY
ON_OFF
MUX_123
EN_A2
EN_A3
EN_A1
AGC_TLI
M
EN_MAN
CH
AGC_UD
ATT_ON
EN_PAT2 EN_WPAT EN_XTAL
EN_EXT_
CLK
S_ABS
G_BOOST Reserved
DISPLAY_CLK
S_WU1
FS_ENV
R3
R4
R5
R6
R7
R8
HY_20m
HY_POS
FS_SLC
R_VAL
T_OFF
GR
PATT2B
PATT1B
T_OUT
T_HBIT
BAND_SEL
T_AUTO
BLOCK_A
GC
R9
Reserved
R10
R11
R12
R13
n.a
n.a
n.a
RSSI1
RSSI2
RSSI3
F_WAKE
RC_CAL_
OK
RC_CAL_
KO
R14
R15
R16
RC_OSC_TAPS
LC_OSC_
LC_OSC_
n.a.
n.a.
n.a.
OK
KO
CLOCK_G
EN_DIS
RC_OSC_ RC_OSC_
n.a
LC_OSC_MUX
MIN
MAX
R17
R18
R19
n.a.
n.a.
n.a.
CAP__CH1
CAP__CH2
CAP__CH3
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AS3933 − Detailed Description
Register Description and Default Values
Figure 24:
Default Values of Registers
Default
Value
Register
Name
Type
Description
Pattern extended to 32 bits (PAT32=0 16 bits, PAT32=1
32bits)
R0<7>
R0<6>
R0<5>
PAT32
R/W
R/W
R/W
0
DAT_MAS
K
Masks data on DAT pin before wake-up (DAT_MASK = 0
→ data not masked; DAT_MASK = 1 → data masked)
0
0
ON/OFF operation mode. (Duty-cycle defined in the
register R4<7:6>
ON_OFF
R0<4>
R0<3>
R0<2>
R0<1>
R0<0>
R1<7>
R1<6>
R1<5>
R1<4>
MUX_123
EN_A2
R/W
R/W
R/W
R/W
0
1
1
1
0
0
0
1
0
Scan mode enable
Channel 2 enable
EN_A3
Channel 3 enable
EN_A1
Channel 1 enable
Reserved
ABS_HY
AGC_TLIM
AGC_UD
ATT_ON
Reserved
R/W
R/W
R/W
R/W
Enable Data slicer absolute reference
AGC acting only on the first carrier burst
AGC operating in both direction (up-down)
Antenna damper enable
EN_MANC
H
R1<3>
R/W
0
Manchester decoder enable
R1<2>
R1<1>
R1<0>
R2<7>
EN_PAT2
EN_WPAT
EN_XTAL
S_ABSH
R/W
R/W
R/W
R/W
0
1
1
0
Double wake-up pattern correlation
Correlator enable
Crystal oscillator enable
Data slicer absolute threshold reduction
EN_EXT_C
LK
R2<6>
R/W
R/W
0
Enables external clock generator
R2<5>
R2<5>
G_BOOST
Reserved
0
0
3dB Amplifier Gain Boost (G_BOOST=1)
Reserved
DISPLAY_
CLK
Set to 11 in case the clock generator's frequency is
shown on pin CL_DAT.
R2<3:2>
R2<1:0>
R/W
R/W
00
00
S_WU1
Tolerance setting for the stage wake-up (see Figure 37)
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AS3933 − Detailed Description
Default
Value
Register
Name
Type
Description
Data slicer hysteresis
R3<7>
HY_20m
R/W
0
0
if HY_20m = 0 then comparator hysteresis = 40mV
if HY_20m = 1 then comparator hysteresis = 20mV
Data slicer hysteresis only on positive edges (HY_POS=0,
hysteresis on both edges, HY_POS=1, hysteresis only on
positive edges)
R3<6>
HY_POS
R/W
R3<5:3>
R3<2:0>
FS_SCL
FS_ENV
R/W
R/W
100
000
Data slicer time constant (see Figure 45)
Envelop detector time constant (see Figure 44)
OFF time in ON/OFF operation mode
T_OFF=00
T_OFF=01
T_OFF=10
T_OFF=11
1ms
2ms
4ms
8ms
R4<7:6>
T_OFF
R/W
00
R4<5:4>
R4<3:0>
R5<7:0>
R6<7:0>
R7<7:5>
R7<4:0>
R8<7:5>
D_RES
GR
R/W
R/W
R/W
R/W
R/W
R/W
R/W
01
0000
Antenna damping resistor (see Figure 40)
Gain reduction (see Figure 39)
2nd Byte of wake-up pattern
1st Byte of wake-up pattern
TS2
01101001
10010110
000
TS1
T_OUT
T_HBIT
BAND_SEL
Automatic time-out (see Figure 49)
Bit rate definition (see Figure 48)
Band selection (see Figure 36)
Artificial wake-up
01011
000
T_AUTO=000
T_AUTO=001
T_AUTO=010
T_AUTO=011
T_AUTO=100
T_AUTO=101
T_AUTO=110
T_AUTO=111
No artificial wake-up
1 sec
5 sec
R8<2:0>
T_AUTO
R/W
000
20 sec
2 min
15min
1 hour
2 hour
BLOCK_A
GC
R9<7>
R/W
0
Disables AGC
Reserved
R9<6:0>
000000
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AS3933 − Detailed Description
Default
Value
Register
Name
Type
Description
R10<4:0>
R11<4:0>
R12<4:0>
R13<7:0>
RSSI1
RSSI2
R
R
R
R
RSSI channel 1
RSSI channel 2
RSSI channel 3
RSSI3
F_WAK
False wake-up register
RC_CAL_O
K
R14<7>
R14<6>
R14<5:0>
R15<4>
R15<3>
R16<7>
R16<5>
R16<4>
R16<2>
R16<1>
R16<0>
R
R
Successful RC calibration
RC_CAL_K
O
Unsuccessful RC calibration
RC-Oscillator taps setting
LC-Oscillator working
RC_OSC_T
APS
R
LC_OSC_O
K
R
LC_OSC_K
O
R
LC-Oscillator not working
CLOCK_GE
N_DIS
The Clock Generator output signal displayed on CL_DAT
pin
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
RC_OSC_
MIN
Sets the RC-oscillator to minimum frequency
RC_OSC_
MAX
Sets the RC-oscillator to maximum frequency
LC_OSC_
MUX3
Displays the resonance frequency of LF3P on DAT pin
Displays the resonance frequency of LF2P on DAT pin
Displays the resonance frequency of LF1P on DAT pin
LC_OSC_
MUX2
LC_OSC_
MUX1
R17<4:0>
R18<4:0>
R19<4:0>
CAPS_CH1
CAPS_CH1
CAPS_CH1
R/W
R/W
R/W
00000
00000
00000
Capacitor banks on the channel1
Capacitor banks on the channel2
Capacitor banks on the channel3
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AS3933 − Detailed Description
Serial Peripheral Interface (SPI)
This 4-wire interface is used by the Microcontroller (μC) to
program the AS3933. The maximum clock operation frequency
of the SPI is 6MHz.
Figure 25:
Serial Peripheral Interface (SPI) Pins
Name
Signal
Signal Level
Description
CS
Digital Input
CMOS
Chip Select
Serial Data input for writing registers, data
to transmit and/or writing addresses to
select readable register
SIN
Digital Input
CMOS
Serial Data output for received data or
read value of selected registers
SOUT
SCLK
Digital Output
Digital Input
CMOS
CMOS
Clock for serial data read and write
Note(s): SDO is set to tristate if CS is low. In this way more than
one device can communicate on the same SDO bus.
SDI Command Structure. To program the SPI the CS signal has
to go high. A SPI command is made up by a two bytes serial
command and the data is sampled on the falling edge of SCLK.
The Figure 26 shows how the command looks like, from the MSB
(B15) to LSB (B0). The command stream has to be sent to the SPI
from the MSB (B15) to the LSB (B0).
Figure 26:
SDI Command Structure
Mode
Register Address / Direct Command
Register Data
B15
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B3
B2
B1
B0
The first two bits (B15 and B14) define the operating mode.
There are three modes available (write, read, direct command)
plus one spare (not used), as shown in Figure 27.
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AS3933 − Detailed Description
Figure 27:
SDI Command Structure
B15
B14
Mode
WRITE
0
0
1
1
0
1
0
1
READ
NOT ALLOWED
DIRECT COMMAND
In case a write or read command happens the next 6 bits (B13
to B8) define the register address which has to be written
respectively read, as shown in Figure 28.
Figure 28:
SDI Command Structure
B13
0
B12
0
B11
0
B10
0
B9
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
B8
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Read/Write Register
R0
R1
0
0
0
0
0
0
0
0
R2
0
0
0
0
R3
0
0
0
1
R4
0
0
0
1
R5
0
0
0
1
R6
0
0
0
1
R7
0
0
1
0
R8
0
0
1
0
R9
0
0
1
0
R10
R11
R12
R13
R14
R15
R16
R17
0
0
1
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
0
0
1
0
0
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AS3933 − Detailed Description
B13
B12
B11
B10
B9
1
B8
0
Read/Write Register
0
0
1
1
0
0
0
0
R18
R19
1
1
The last 8 bits are the data that has to be written respectively
read. A CS toggle high-low-high terminates the command
mode.
If a direct command is sent (B15-B14=11) the bits from B13 to
B8 defines the direct command while the last 8 bits are omitted.
Figure 29 shows all possible direct commands:
Figure 29:
List of Direct Commands
COMMAND_MODE
clear_wake
B13
B12
B11
B10
B9
0
B8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
reset_RSSI
0
1
trim_osc
1
0
clear_false
1
1
preset_default
Calib_RCO_LC
0
0
0
1
All direct commands are explained below:
• clear_wake: clears the wake state of the chip. In case the
chip has woken up (WAKE pin is high) the chip is set back
to listening mode.
• reset_RSSI: resets the RSSI measurement.
• Calib_RCosc: starts the trimming procedure of the internal
RC oscillator (see page 29).
• clear_false: resets the false wake-up register
(R13<7:0>=00).
• preset_default: sets all register in the default mode, as
shown in Figure 24.
• Calib_RCO_LC: calibration of the RC-oscillator with the
external LC tank (see page 31).
Writing of Data to Addressable Registers (WRITE Mode). The
SPI is sampled at the falling edge of SCLK (as shown in the
following diagrams).
A CS toggling high-low-high indicates the end of the WRITE
command after register has been written. The following
example shows a write command.
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AS3933 − Detailed Description
Figure 30:
Writing of a Single Byte (Falling Edge Sampling)
CS
SCLK
X
X
0
0
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SDI
CS falling
edge signals
end of
SCLK rising
edge Data is
transfered from
μC
SCLK
Data is moved
to Address
A5-A0
Two leading
Zeros indicate
WRITE Mode
falling edge
Data is
WRITE Mode
sampled
Figure 31:
Writing of Register Data with Auto-Incrementing Address
CS
SCLK
A A A A A A D D D D D D D D D D D D D D D D D D
D D D D D D D D D D
1 0 7 6 5 4 3 2 1 0
X
X
0 0
SDI
5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6
CS falling
edge signals
end of
Two leading
Zeros indicate
WRITE Mode
Data is moved
to Address
<A5-A0 >
Data is moved
to Address
Data is moved
to Address
Data is moved
to Address
<A5-A0 > +1
<A5-A0 > + (n-1)
<A5-A0 > +n
WRITE Mode
Reading of Data from Addressable Registers (READ Mode).
Once the address has been sent through SPI, the data can be
fed through the SDO pin out to the microcontroller.
A CS LOW toggling high-low-high has to be performed after
finishing the read mode session, in order to indicate the end of
the READ command and prepare the Interface to the next
command control Byte.
To transfer bytes from consecutive addresses, SPI master has to
keep the CS signal high and the SCLK clock has to be active as
long as data need to be read.
ams Datasheet
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AS3933 − Detailed Description
Figure 32:
Reading of Single Register Byte
CS
SCLK
X
X
0
1
A5
A4
A3
A2
A1
A0
SDI
SDO
X
X
D7
D6
D5
D4
D3
D2
D1
D0
SCLK rising
edge Data is
moved from
Address
SCLK rising
edge Data is
transfered from
μC
SCLK falling
edge Data is
transfered to
μC
CS falling
edge signals
end of READ
Mode
SCLK
01 pattern
indicates
falling edge
Data is
READ Mode
sampled
<A5-A0>
Figure 33:
Send Direct COMMAND Byte
CS
SCLK
X
X
1
1
C5
C4
C3
C2
C
1
C0
SDI
Two leading
ONE indicate
COMMAND
Mode
SCLK rising
edge Data is
transfered from
μC
SCLK
falling edge
Data is
CS falling edge
signals the end of
sampled
COMMAND Mode
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AS3933 − Detailed Description
SDI Timing
Figure 34:
SDI Timing Parameters
Symbol
TCSCLK
TDCLK
THCL
Parameter
Conditions
Min Typ Max Units
Time CS to Sampling Data
Time Data to Sampling Data
SCLK High Time
150
100
70
ns
ns
ns
ns
TCLK
SCLK period
166
Time Sampling Data to CS
down
TCLKCS
TCST
150
500
ns
ns
CS Toggling time
Figure 35:
SDI Timing Diagram
TCST
CS
t
t
TCSCLK
SPI
TDCLK
SCLK
SCL
THCL
TCLKCS
t
TCLK
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AS3933 − Detailed Description
Channel Amplifier and Frequency Detector
Each of the 3 channels consists of a variable gain amplifier (VGA)
with automatic gain control (AGC) and a frequency detector.
When the AS3933 is in listening mode (waiting for RF signal)
the gain of all channel amplifiers is set to maximum. The
frequency detector counts the zero crossing of the amplified RF
signal to detect the presence of the wanted carrier. As soon as
the carrier is detected the AGC is enabled, the gain of the VGA
is reduced and set to the right value. The RSSI (Received Signal
Strength Indicator) represents how strong the input signal is
and it is the inverse representation of the gain of the VGA. In
fact, if for example the input signal is very strong the AGC will
reduce the gain of the VGA. The gain reduction will correspond
to a big RSSI, as it is the inverse of the gain setting of the VGA
(small gain corresponds to a big RSSI and vice versa).
The AS3933 is a pretty wide LF wake-up receiver and can work
between 15 kHz and 150 kHz. Once the carrier frequency has
been chosen the user must set the amplifier working in the
appropriate frequency band using the bits R8<7:5>, as
described in the Figure 36.
It is possible to boost the gain of the amplifiers for +3dB with
an improvement of the sensitivity, as shown in the Figure 14
(R2<5>=1). The gain boost will increase the current
consumption of 100nA (typ) per channel. In case the lowest
frequency band is used (15kHz – 23 kHz) the gain boost is
automatically enabled from the logic.
It is possible to enable/disable individual channels, in case not
all three channels are needed. This enables to reduce the
current consumption by 1.5 μA (typ.) per channel.
Frequency Detector / RSSI / Channel Selector
The frequency detection is based on a zero crossing counter
and uses the Clock Generator as time base. This counter counts
the zero crossing of the input signal within a time window
defined by the clock generator and if it matches to the expected
value it enabled the AGC (the RSSI measurement can get
started). The Clock Generator can be based either on the
internal RC-oscillator or on the Crystal oscillator or on the
external clock source. The details on the choice of the Clock
Generator are discussed in the Clock Generator. The Clock
Generator generates time windows equal to N times its period,
where N depends on the operating frequency band, as shown
in the Figure 36.
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AS3933 − Detailed Description
Figure 36:
Bit Setting for the Operating Frequency Range and Time Windows Generation for the Frequency
Detection
R8<7>
R8<6>
R8<5>
N
4
Operating Frequency Range [kHz]
0
0
0
0
1
0
0
1
1
1
0
1
0
1
1
95-150
65-95
40-65
23-40
15-23
6
10
18
14
The frequency detection is successful if in two consecutive time
windows the zero threshold counter detects M zero crossing,
where M depends also on the operating frequency range. The
frequency detection criteria can be tighter or more relaxed
according to the setup described in R2<1:0> (see Figure 36).
Figure 37:
Tolerance Settings for Frequency Detection in the Bands
23-150 kHz
R2<1>
R2<0>
M
0
0
1
1
0
1
0
1
16 6
16 4
16 2
n.a
Figure 37 shows the value of M for the different tolerance
settings for the operating frequency bands from 23 to 150 kHz.
Figure 38 shows M in case the operating frequency range is the
lowest one (15 to 23 kHz).
Figure 38:
Tolerance Settings for Frequency Detection in the Bands
15-23 kHz
R2<1>
R2<0>
M
0
0
1
1
0
1
0
1
8 3
8 2
8 1
n.a
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AS3933 − Detailed Description
The AGC starts working after the frequency detection. At the
beginning the gain in the VGA is set to maximum and the AGC
reduce it according to the received signal input level. The AGC
needs maximum 35 carrier periods to settle, getting a stable
RSSI.
The AGC can operate in two modes:
• AGC down only (R1<5>=0)
• AGC up and down (R1<5>=1)
If the AGC down only mode is selected, the AGC can only
decrease the gain for the whole duration of the data reception;
in this mode the system holds the RSSI peak.
When the AGC up and down mode is selected, the RSSI can
dynamically follow the input signal strength variation in both
directions.
The RSSI is available for all 3 channels at the same time and it
is stored in 3 registers (R10<4:0>, R11<4:0>, R12<4:0>). Once
the RSSI gets stable (maximum after 35 carrier periods after
frequency detection) the channel selector checks which
channel receives the strongest signal. The channel selector
compares the RSSI on the active channels and freezes the AGC
on the channels which have the smaller RSSI. From this time on
the AGC is active only on the selected channel. It is possible to
set things back having the AGC active on all channels just
sending a clear_wake (sets the chip back to listening mode) or
reset_RSSI (resets the ACG) direct command.
Both AGC modes (only down or down and up) can also operate
with time limitation. This option allows AGC operation only in
time slot of 256ꢀs after the frequency detection (during carrier
burst), then the RSSI is frozen till the wake-up or RSSI reset
occurs (clear_wakeup or reset_RSSI).
The RSSI is reset either with the direct command 'clear_wakeup'
or 'reset_RSSI'. The 'reset_RSSI' command resets only the VGA
setting but does not terminate wake-up frequency detection
condition. This means that if the signal is still present the new
AGC setting (RSSI) will appear not later than 35 LF carrier
periods after the command was received. The AGC setting is
reset during data receiving if for duration of 3 Manchester half
symbols no carrier is detected. If the wake-up IRQ is cleared the
chip will go back to listening mode.
In case the maximum amplification at the beginning is a
drawback (e.g. in noisy environment) it is possible to set a
smaller starting gain on the amplifier, according to the
Figure 39. In this way it is possible to reduce the false frequency
detection.
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AS3933 − Detailed Description
Figure 39:
Bit Setting of Gain Reduction
R4
R4
R4
R4
Gain
<3>
<2>
<1>
<0>
Reduction
No gain
reduction
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
n.a.
n.a.
0 or 1
0 or 1
0 or 1
0 or 1
0 or 1
0 or 1
0 or 1
-4dB
-8dB
-12dB
-16dB
-20dB
-24dB
Antenna Damper
In case the chip needs to deal with higher field strengths the
antenna damper can be enabled. The antenna damper consists
of internal resistors which can be connected in parallel to the
external resonator as shown in Figure 40. It is possible to enable
the antenna damper with the bit R1<4> and the value of the
resistor can be chosen with the bits R4<5:4>. The shunt resistors
degrade the quality factor of the external resonator by reducing
the signal at the input of the amplifier. In this way the resonator
sees a smaller parallel resistance (in the band of interest) which
degrades its quality factor in order to increase the linear range
of the channel amplifier (the amplifier doesn't saturate in
presence of bigger signals). Figure 40 shows the bit setup.
Figure 40:
Antenna Damper Bit Setup
R4<5>
R4<4>
Shunt Resistor
0
0
1
1
0
1
0
1
1 kΩ
3 kΩ
9 kΩ
27 kΩ
ams Datasheet
[v1-08] 2015-Sep-02
Page 35
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AS3933 − Detailed Description
Figure 41:
Antenna Damper
LF1P
Channel
Amplifier1
L
C
R
LF2P
LF3P
Channel
Amplifier2
L
C
R
Channel
Amplifier1
L
C
R
LFN
Demodulator / Data Slicer
As soon as the AS3933 detects successfully the frequency and
the RSSI has got stable the channel selector compares the RSSI
on all active channels and connects the channel amplifier which
has the biggest RSSI to the demodulator. The channel selector
needs 32 RF carrier periods to take this decision. The output
signal (amplified LF carrier) of selected channel is connected to
the input of the demodulator.
The demodulator takes the signal to base-band and recovers
two signals from the amplified RF signal; a fast and a slow
envelop. Those two signals are fed to the data slicer, which is a
comparator with programmable hysteresis. At the output of the
data slicer are streamed the digital received bits. A concept
block diagram is shown in the Figure 42.
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AS3933 − Detailed Description
Figure 42:
Concept Block Diagram
Data Slicer
Fast Envelop
Slow Envelop
Channel Amplifier
Demodulator
Figure 43:
Envelop Detector Signals - Dynamic Threshold
Fast Envelop
(red)
Slow Envelop
(blue)
The performance of the demodulator can be optimized
according to bit rate and preamble length as described in
Figure 44 and Figure 45.
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AS3933 − Detailed Description
Figure 44:
Bit Setup of the Fast Envelope for Different Symbol Rates
Symbol Rate
R3<2> R3<1>
R3<0>
[Manchester
Symbols/s]
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
4096
2184
1490
1130
910
762
655
512
On one hand the fast envelope's time constant ( R3<2:0>) needs
to be adjusted to the desired symbol rate as shown in Figure 44.
However, decreasing the fast envelope's time constant also
means that more noise will be injected due to the wider band.
On the other hand, the slow envelop signal acts as an average
of the incoming data. Therefore, the bigger its time constant is,
the better will be the noise rejection. Yet, a bigger time constant
of the slow envelop (R3<5:3>) requires a longer preamble in
order to settle to the correct value. The minimum preamble
length as a function of the slow envelope's settings is given in
Figure 45.
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AS3933 − Detailed Description
Figure 45:
Minimum Required Preamble Lengths as Function of Slow
Envelop Settings
Minimum Preamble
R3<5> R3<4>
R3<3>
Length [ms]
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.8
1.15
1.55
1.9
2.3
2.65
3
3.5
Note(s) and/or Footnote(s):
1. These times are minimum required, but it is recommended to prolong the
preamble.
With the bits R3<6> and R3<7> it is possible to change the
hysteresis on the data slicer comparator (only positive, positive
negative, 20mV, 40mV).
The slow envelop signal (blue signal in Figure 43) represents
the average of the demodulated signal, therefore acts as a
reference signal for the data slicer. In case the chosen protocol
has a duty cycle far away from 50% (for example in the NRZ
protocol there can be several consecutive ones or zeros) the
slow envelop signal would not be a stable reference signal for
the data slicer. In this case the data slicer can also work with an
absolute threshold (R1<7>), as shown in the Figure 46. Should
the absolute threshold be enabled the bits R3<2:0> would not
influence the performance. It is even possible to reduce the
absolute threshold in case the environment is not particularly
noisy (R2<7>).
As the input signal may be damped due to physical influences
of the transmitter environment, the symbol rate needs to be
adapted (lowered) if absolute threshold is enabled to ensure a
proper detection of the wake-up signal. The peak level of the
signal should be reached within 1/3 of the symbol duration
which is defined as two times the bit duration. The bit duration
is defined in register R7 <4:0> as a function of the Clock
Generator periods.
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AS3933 − Detailed Description
Figure 46:
Envelop Detector Signals - Absolute Threshold
Fast Envelop
(red)
Absolute
Threshold (blue)
Data Slicer Output
Correlator
In order to prevent that the AS3933 wakes up the host system
(MCU) from noise or disturbers (LF transmitter within the field)
the internal correlator checks that the bit sequence delivered
from the data slicer corresponds to stored pattern. The wanted
pattern can be stored in the registers R5<7:0> and R6<7:0>. The
data correlation is performed only if the correlator is enabled
(R1<1>=1) and can start only after frequency detection.
The pattern correlation is successful (Wake goes high) only if
the bits sequence (pattern) and its timing (duration of the single
bit) matches.
Pattern: Bit and Symbol Definition in Manchester
Code
The AS3933 can correlate the incoming pattern without the
help of an external unit (MCU). The chosen pattern must be
Manchester encoded. In the Manchester code each “Symbol” is
defined by a transition (high-to-low for 1 and low-to-high for
0), therefore consists of two “bits”. In the Figure 47 it is shown,
as an example, how the encoding technique works. In this
sequence a simple message made up by 3 symbols (1 0 1) is
Manchester encoded. In the Manchester encoded bit stream
there can not be three consecutive zeros or ones (in each
symbol there is always a transition). This helps the receiver to
recover the clock.
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AS3933 − Detailed Description
Figure 47:
Manchester Encoding
0
1
1
Symbol
0
1
1
Bits
0
0
1
OOK signal
The bit duration is defined in the register R7<4:0> according to
the Figure 48 as function of the Clock Generator periods.
Figure 48:
Bit Rate Setup
Bit Duration in RTC
R7<4>
R7<3>
R7<2>
R7<1>
R7<0>
Clock Periods
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
4
5
6
7
8
9
10
11
12
13
14
15
16
17
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AS3933 − Detailed Description
Bit Duration in RTC
Clock Periods
R7<4>
R7<3>
R7<2>
R7<1>
R7<0>
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
The user can define the pattern to correlate in the registers
R5<7:0> and R6<7:0> and can decide whether the stored
pattern is a bit representation (16 Manchester bits corresponds
to 8 Symbols) if R0<7>=0 or the symbol representation (16
symbols corresponds to 32 bits) of the pattern if R0<7>=1. The
number of different pattern is 2^SYM, where SYM is the number
of Manchester symbols. In case the R5<7:0> and R6<7:0>
represent the bit sequence of the pattern there are 256 different
possible combinations, while in case they are the symbol
representation there are 65536 different patterns.
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AS3933 − Detailed Description
Wake-Up Protocol
The AS3933 can support different protocols:
• Frequency detection only (no pattern correlation)
• Single pattern detection
• 16-bit pattern
• 32-bit pattern
• Double pattern detection
• 16-bits pattern
• 32-bits pattern
The wake-up state can be terminated either by the host system
(MCU) with the direct command ‘clear_wake’ sent over SPI (see
direct command details in Figure 29) or with a time-out option.
In case the latter is used the host system (MCU) does not need
to take any action to terminate the wake-up state and the chip
is set back to listening mode automatically after a predefined
time. It is possible to set the duration of the time-out with the
register R7<7:5>, as shown in the Figure 49.
Figure 49:
Timeout Setup
R7<7>
R7<6>
R7<5>
Time Out
disabled
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50 msec
100 msec
150 msec
200 msec
250 msec
300 msec
350 msec
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AS3933 − Detailed Description
Wake-Up Protocol: Frequency Detection Only
Figure 50:
Wake-Up Protocol Overview Without Pattern Detection
Carrier Burst
Data
Carrier Burst
DAT
WAKE
Clear_wake
In case the pattern correlation is disabled (R1<1>=0) the
AS3933 wakes up upon detection of the carrier frequency only
as shown in Figure 50. The minimum duration of the carrier
burst in order to ensure that AS3933 wakes up and the RSSI is
settled is specified in the Figure 52. In addition the carrier burst
does not have to be longer than 155 periods of the Clock
Generator (Crystal oscillator or RCO or External Clock). As shown
in the Figure 20, the AS3933 after the detection of the carrier
goes directly from the Listening mode to Data receiving mode
after settling the RSSI.
Wake-Up Protocol: Pattern Detection Enabled
In case the pattern correlation is enabled (R1<1>=1) the AS3933
generates a wake-up interrupt if the wake-up protocol is
fulfilled. The communication protocol consists of a carrier burst,
a preamble (0101010…. ON/OFF modulated carrier) and the
16-bit pattern. In case the double pattern option is enabled
(R1<2>=1) the 16-bit pattern has to be repeated 2 times
consequentially (2 times the same pattern). The signal on the
WAKE pin goes high one bit after the end of the pattern and the
data transmission can get started.
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AS3933 − Detailed Description
A graphic representation of the wake-up protocol is shown in
the Figure 51.
Figure 51:
Wake-Up Protocol Overview if Pattern Detection is Enabled
Carrier Burst
Preamble
Pattern
Data
Separation bit
DAT
WAKE
Clear_wake
The minimum length for the carrier burst depends on the
operating frequency range (see Figure 36 bits R8<7:5>) and is
described in the Figure 52.
Figure 52:
Minimum Duration of the Carrier Burst
Operating Frequency
Range [kHz]
Minimum Duration of the
Carrier Burst
95-150
65-95
40-65
23-40
15-23
16·Tclk+16Tcarr
28·Tclk+16Tcarr
52·Tclk+16Tcarr
96·Tclk+16Tcarr
92·Tclk+8Tcarr
Note(s) and/or Footnote(s):
1. Tclk is the period of the clock generator.
2. Tcarr is the period of the carrier.
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AS3933 − Detailed Description
If the carrier burst is shorter than what has been specified in
the Figure 52, then the frequency detection is not guaranteed.
In order to fulfill the protocol the carrier burst must be shorter
than 155 periods of the clock generator (crystal oscillator or
RCO or external clock). The carrier burst must be followed by a
separation bit and at least 6 bits preamble (101010). The
separation bit must last as half Manchester symbol (see
paragraph Pattern: Bit and Symbol Definition in Manchester
Code). The preamble and the pattern cannot be longer than 30
symbols in sum in case 16-bit pattern detection is enabled and
46 symbols if the 32-bit pattern detection is enabled.
In case the ON/OFF option is enabled (R0<5>=1) the minimum
duration of the carrier burst must be prolonged by the OFF time
defined in the R4<7:6>.
Should the carrier burst be longer than what is defined in the
Figure 52 or the number of preamble bits longer than what has
been specified above a false wake-up event might be recorded
in the register R13<7:0>.
If the Scan Mode be enabled (R0<4>=1) the minimum duration
of the carrier burst is defined in the Figure 53.
Figure 53:
Minimum Duration of the Carrier Burst in Case the Scanning
Mode is Enabled
Operating Frequency
Range [kHz]
Minimum Duration of the
Carrier Burst
95-150
65-95
40-65
23-40
15-23
80·Tclk+16Tcarr
92·Tclk+16Tcarr
180·Tclk+16Tcarr
224Tclk+16Tcarr
220·Tclk+8Tcarr
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AS3933 − Detailed Description
Manchester Decoder and Clock Recovery
In case the Manchester decoder is enabled (R1<3>=1) the
AS3933 decodes the incoming Manchester bits automatically
and the Manchester decoded data are displayed on the DAT pin
and the Manchester recovered clock on the CL_DAT. The data
coming out from the DAT pin are stable (and therefore can be
acquired) on the rising edge of the CL_DAT clock, as shown in
Figure 54.
Figure 54:
Synchronization of Data with the Manchester Recovered Clock
CL_DAT
DAT
In case a Manchester timing violation happens, the signal on
SPO goes high for a duration of 4 periods of internal clock
(either crystal oscillator or RCO or external clock).
False Wake-Up Register
The wake-up strategy in the AS3933 is based on 2 steps:
1. Frequency Detection: In this phase the frequency of the
received signal is checked.
2. Pattern Correlation: Here the pattern is demodulated
and checked whether it corresponds to the valid one.
If there is a disturber or noise capable to overcome the first step
(frequency detection) without producing a valid pattern, then
a false wake-up call happens. Each time this event is recognized
a counter is incremented by one and the respective counter
value is stored in a memory cell (false wake-up register). Thus,
the microcontroller can periodically look at the false wake-up
register, to get a feeling how noisy the surrounding
environment is and can then react accordingly (e.g. reducing
the gain of the LNA during frequency detection, set the AS3933
temporarily to power down etc.), as shown in the Figure 55. The
false wake-up counter is a useful tool to quickly adapt the
system to any changes in the noise environment and thus avoid
false wake-up events.
ams Datasheet
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AS3933 − Detailed Description
Most wake-up receivers have to deal with environments that
can rapidly change. By periodically monitoring the number of
false wake-up events it is possible to adapt the system setup to
the actual characteristics of the environment and enables a
better use of the full flexibility of AS3933.
Figure 55:
Concept of the False Wake-Up Register Together with the System
Wakeup
Level 1
Wakeup
Level 2
Pattern Correlator
WAKE
Frequency Detector
Unsuccessful
pattern
correlation
False wakeup
register
Register Setup
READ FALSE WAKEUP REGISTER
Microcontroller
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AS3933 − Detailed Description
Clock Generator
The Clock Generator can be based on a crystal oscillator
(R1<0>=1), the internal RC-oscillator (R1<0>=0), or an external
clock source (R1<0>=1). The crystal oscillator has higher
precision of the frequency with higher current consumption
and needs three external components (crystal plus two
capacitors). The RC-oscillator is completely integrated and can
be calibrated to increase its precision. Should a digital clock
already be available it can be applied directly to the XOUT pin
(XIN to VDD).
Regardless which clock generator is chosen, the frequency of
the Clock Generator must be set according to the carrier
frequency. Figure 56 shows the dependency of the Clock
Generator frequency from the carrier frequency and operating
frequency band.
Figure 56:
Clock Generator Frequency vs Frequency Band
Carrier Frequency
Clock Generator Frequency
[kHz]
14
-----
8
fRC = fcarr
fRC = fcarr
fRC = fcarr
fRC = fcarr
⋅
15 – 23
23-40
9
--
⋅
⋅
⋅
8
5
--
40-65
8
3
--
65 – 95
95 - 150
8
fcarr
----------
4
fRC
=
It is possible to display the frequency of the clock generator on
the CL_DAT pin writing R2<3:2>=11 and R16<7>=1.
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AS3933 − Detailed Description
Crystal Oscillator
In case the user decides to use the Crystal Oscillator as reference
clock a 32.768 kHz quartz can be used in case the tolerance
setting for the frequency detection is relaxed (R2<1:0>=00).
Should this not be the case, then Figure 56 shows how the
frequency of the quartz has to be chosen.
If the AS3933 works in the bandwidth 23-40 kHz, then it is
recommended not to use the XTAL oscillator to avoid any
coupling between the input antennas and the quartz.
Figure 57:
Characteristics of XTAL
Symbol
Parameter
Conditions
Min
Typ
Max Units
Crystal accuracy (initial)
Crystal motional resistance
Minimum Frequency
Typical Frequency
Overall accuracy
120
60
ppm
KΩ
25
32.768
45
kHz
kHz
kHz
For 32.768 kHz crystal
Crystal dependent
Maximum Frequency
Contribution of the
oscillator to the frequency
error
5
ppm
Start-up Time
Duty cycle
1
s
%
45
50
55
65
Current consumption
Calibration time
Current consumption
300
nA
Periods of reference clock
cycles
nA
650
RC-Oscillator
Figure 58:
Characteristics of RCO
Symbol
Parameter
Conditions
Min
Typ
Max Units
Calibration time
Periods of reference clock
65
cycles
nA
Current consumption
650
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AS3933 − Detailed Description
In case the pattern detection and the Manchester decoder are
not enabled (R1<1>=0 and R1<3>=1) the calibration on the
RC-oscillator is not needed. Should this not be the case, the
RC-oscillator has to be calibrated. The calibration of the
RC-oscillator can be done in two different ways:
• Over SPI, the host system (MCU) has to be able to provide
65 clock pulses of a reference clock. In this case the host
has to have a precise reference clock (quartz, resonator
etc.).
• Using the internal calibration procedure based on the
antenna resonator. Using this calibration method the
RC-oscillator is automatically trimmed to the proper
frequency, according to the operating frequency band.
The precision of the calibration depends on the tolerances
of the resonator of the first channel (LC connected to
LF1P).
RC-Oscillator: Calibration via SPI. The calibration gets started
with the Calib_RCosc direct command. Since no non-volatile
memory is available on the chip, the calibration must be done
every time after battery replacement. Since the Clock Generator
defines the time base of the frequency detection, the selected
frequency depends on the carrier frequency. The choice of the
reference clock frequency delivered by the host (MCU) is the
same as the choice of the frequency in case the crystal oscillator
is used and it is shown in the Figure 56.
To trim the RC-Oscillator, set the chip select (CS) to high before
sending the direct command Calib_RCosc over SPI. Then 65
digital clock cycles of the reference clock (e.g.
125kHz/4=31.25kHz) have to be sent on the clock bus (SCLK),
as shown in Figure 59. After that the signal on the chip select
(CS) has to be pulled down.
The calibration is effective after the 65th reference clock edge
and it will be stored in a volatile memory. In case the
RC-oscillator is switched OFF or a power-on-reset happens (e.g.
battery change) the calibration has to be repeated.
Figure 59:
RC-Oscillator Calibration via SPI
65 clock cycles
CS
SCLK
X
X
1
1
0
0
0
0
1
0
SDI
DIRECT COMMAND
Trim_osc
REFERENCE CLOCK
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AS3933 − Detailed Description
RC-Oscillator: Self Calibration. This procedure uses the
LC-tank (antenna) connected to the channel 1 (LF1P) not as
antenna but as resonator for an oscillator. The internal LC
oscillator is therefore connected through a multiplexer to the
external tank.
The LC-oscillator generates a clock which corresponds to the
resonance frequency of the LC-tank. In a typical application the
user designs the external resonators such to set the resonance
frequency of the external LC-tank as close as possible to the
carrier frequency. The mathematical relation between the
oscillation frequency and the LC time constant is:
1
(EQ1)
------------------------------
FLC
=
2 ⋅ π ⋅ L ⋅ C
Where:
L is the inductance and
C the capacitance of the external antenna
To start the calibration the direct command Calib_RCO_LC must
be sent over the SPI and as soon as the bit R14<7> is high, the
RC-oscillator will be calibrated. The calibrated frequency of the
RC-oscillator depends on the carrier frequency and is
automatically set to better perform the frequency detection,
according to the Figure 56.
External Clock Source
To clock the AS3933 with an external signal, the external clock
generator (R2<6> =1) and the crystal oscillator (R1<0>=1) need
to be enabled. As shown in the Figure 4 the clock can be directly
applied on the pin XOUT while the pin XIN must be connected
to VDD. The clock characteristics are summarized in Figure 60.
Figure 60:
Characteristics of External Clock
Symbol
Parameter
Conditions
Min
0
Typ
Max
Units
0.1* V
VI
Low level
V
DD
0.9* V
V
Vh
Tr
High level
Rise-time
Fall-time
V
DD
DD
3
μs
μs
Tf
3
Note(s): In power down mode the external clock has to be set
to a definite potential (VDD or ground).
The frequency of the external clock source must be set
according to the Figure 56.
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AS3933 − Detailed Description
Antenna Tuning
The AS3933 offers the possibility to implement a fine antenna
tuning. A block diagram shows how the tuning can be
implemented with the help of the host system (MCU).
Figure 61:
Tuning Implementation
MCU
DAT
SPI
LC-Oscillator
LF1P
Channel
Amplifier1
L
C
R
LF2P
LF3P
Channel
Amplifier2
L
C
R
Channel
Amplifier1
L
C
R
LFN
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AS3933 − Detailed Description
Each of the three antennas can be tuned with the internal
capacitor banks. The capacitor can be connected or
disconnected (adding or subtracting parallel capacitance to the
external resonator) through registers R17<4:0>, R18<4:0> and
R19<4:0>.
Figure 62:
Parallel Tuning Capacitance on the LF1P
R17
Capacitance on LF1P
Adds 1pF to LF1P
R17<0>=1
R17<1>=1
R17<2>=1
R17<3>=1
R17<4>=1
Adds 2pF to LF1P
Adds 4pF to LF1P
Adds 8pF to LF1P
Adds 16pF to LF1P
Figure 63:
Parallel Tuning Capacitance on the LF2P
R18
Capacitance on LF2P
R18<0>=1
R18<1>=1
R18<2>=1
R18<3>=1
R18<4>=1
Adds 1pF to LF2P
Adds 2pF to LF2P
Adds 4pF to LF2P
Adds 8pF to LF2P
Adds 16pF to LF2P
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AS3933 − Detailed Description
Figure 64:
Parallel Tuning Capacitance on the LF3P
R19
Capacitance on LF3P
R19<0>=1
R19<1>=1
R19<2>=1
R19<3>=1
R19<4>=1
Adds 1pF to LF3P
Adds 2pF to LF3P
Adds 4pF to LF3P
Adds 8pF to LF3P
Adds 16pF to LF3P
The Three channels can be tuned separately. The host system
(MCU) has to connect the LC-oscillator to the antenna to
measure the resonance frequency on the pin DAT. The host
should measure the frequency on this pin and just changing
register setting fine tune it to get it as close as possible to the
nominal value of the carrier frequency. With the bits R16<2:0>
it is possible to connect the LC-oscillator to the three different
antennas.
Channel Selection in Scanning Mode and
ON/OFF Mode
In case only 2 channels are active and one of the Low Power
modes is enabled, then the channels 1 and 3 have to be active.
If the chip works in ON-OFF mode and only one channel is active
then the active channel has to be the channel 1. Both Low Power
modes are not allowed to be enabled at the same time.
ams Datasheet
Page 55
[v1-08] 2015-Sep-02
Document Feedback
AS3933 − Package Drawings & Markings
The devices are available in a 16-pin TSSOP and QFN 4×4 16LD
package.
Package Drawings & Markings
Figure 65:
16-pin TSSOP Package Drawing
AS3933 @
YYWWMZZ
RoHS
Green
Symbol
Min
-
Nom
Max
1.20
0.15
1.05
0.30
0.20
5.10
-
4.50
-
0.75
-
Symbol
R
Min
0.09
0.09
0.20
0°
-
-
-
-
Nom
-
Max
-
-
-
8°
-
-
-
-
-
A
A1
A2
b
c
D
E
E1
e
L
L1
-
-
0.05
0.80
0.19
0.09
4.90
-
4.30
-
0.45
-
R1
S
-
-
-
1.00
-
-
5.00
6.40BSC
4.40
0.65BSC
0.60
1.00REF
Θ1
Θ2
12REF
12REF
0.10
0.10
0.05
0.20
16
Θ3
aaa
bbb
ccc
ddd
N
-
-
-
Note(s) and/or Footnote(s):
1. Dimensions & tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
Figure 66:
Marking: YYWWMZZ@
YY
WW
M
ZZ
@
Manufacturing
Week
Assembly plant
identifier
Assembly
traceability code
Year (i.e. 10 for 2010)
Sublot identifier
Page 56
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[v1-08] 2015-Sep-02
AS3933 − Package Drawings & Markings
Figure 67:
QFN 4× 4 16LD Package Drawing
AS3933 @
YYWWXZZ
Symbol
Min
0.80
0.00
Nom
0.85
Max
0.90
0.05
A
A1
A3
b
0.203REF
0.23
0.18
0.28
D
E
D2
E2
e
4.00BSC
4.00BSC
2.70
2.70
0.65BSC
0.40
2.60
2.60
2.80
2.80
L
0.35
0.00
0.45
0.10
L1
aaa
bbb
ccc
ddd
eee
0.10
0.10
0.10
0.05
0.08
Green
RoHS
Note(s) and/or Footnote(s):
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
3. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip. Dimension L1
represents terminal full back from package edge up to 0.15mm is acceptable.
4. Coplanarity applies to the exposed heat slug as well as the terminal.
5. Radius on terminal is optional.
Figure 68:
Marking: YYWWXZZ@
YY
WW
X
ZZ
@
Manufacturing
Week
Assembly plant
identifier
Assembly
traceability code
Year (i.e. 10 for 2010)
Sublot identifier
ams Datasheet
[v1-08] 2015-Sep-02
Page 57
Document Feedback
AS3933 − Ordering & Contact Information
The devices are available as the standard products shown in
Figure 69.
Ordering & Contact Information
Figure 69:
Ordering Information
Ordering
Type
Delivery Form(1)
Marking
Delivery Quantity
Code
AS3933-BTST
AS3933-BQFT
AS3933-BSWB
16-pin TSSOP
QFN (4×4) 16LD
DoW
AS3933
AS3933
AS3933
7 inches Tape & Reel
7 inches Tape & Reel
Wafer Box
1000 pcs/reel
1000 pcs/reel
ca. 8000 dice/wafer
Note(s) and/or Footnote(s):
1. Dry Pack: Moisture Sensitivity Level (MSL) = 3, according to IPC/JEDEC J-STD-033A.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 58
amsDatasheet
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[v1-08] 2015-Sep-02
AS3933 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
RoHS Compliant & ams Green
Statement
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
Page 59
[v1-08] 2015-Sep-02
Document Feedback
AS3933 − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Copyrights & Disclaimer
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 60
amsDatasheet
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[v1-08] 2015-Sep-02
AS3933 − Document Status
Document Status
Document Status
Product Status
Definition
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Product Preview
Pre-Development
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Preliminary Datasheet
Datasheet
Pre-Production
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Datasheet (discontinued)
Discontinued
ams Datasheet
Page 61
[v1-08] 2015-Sep-02
Document Feedback
AS3933 − Revision Information
Revision Information
Changes from 1-07 (2015-Mar-02) to current revision 1-08 (2015-Sep-02)
Page
Updated text under Figure 45
39
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 62
amsDatasheet
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[v1-08] 2015-Sep-02
AS3933 − Content Guide
1
1
2
General Description
Key Benefits & Features
Applications
Content Guide
5
5
5
6
7
Pin Assignments
TSSOP-16 Package
Pin Description
QFN-16 Package
Pin Description
8
9
Absolute Maximum Ratings
Electrical Characteristics
14 Typical Operating Characteristics
16 Detailed Description
17 Operating Modes
18 Listening Mode
20 Artificial Wake-Up
20 Preamble Detection / Pattern Correlation
20 Data Receiving
21 System and Block Specification
21 Register Table
22 Register Table Description and Default Values
25 Serial Peripheral Interface (SPI)
30 SDI Timing
31 Channel Amplifier and Frequency Detector
31 Frequency Detector / RSSI / Channel Selector
34 Antenna Damper
35 Demodulator / Data Slicer
39 Correlator
39 Pattern: Bit and Symbol Definition in Manchester Code
42 Wake-Up Protocol
43 Wake-Up Protocol: Frequency Detection Only
43 Wake-Up Protocol: Pattern Detection Enabled
46 Manchester Decoder and Clock Recovery
46 False Wake-Up Register
48 Clock Generator
49 Crystal Oscillator
49 RC-Oscillator
51 External Clock Source
52 Antenna Tuning
54 Channel Selection in Scanning Mode and ON/OFF Mode
55 Package Drawings & Markings
57 Ordering & Contact Information
58 RoHS Compliant & ams Green Statement
59 Copyrights & Disclaimer
60 Document Status
61 Revision Information
ams Datasheet
Page 63
[v1-08] 2015-Sep-02
Document Feedback
相关型号:
AS393G-G1
Comparator, 2 Func, 7000uV Offset-Max, 1300ns Response Time, BIPolar, PDSO8, GREEN, TSSOP-8
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