AS3933-BSWB [AMSCO]

3D Low Frequency Wake-Up Receiver;
AS3933-BSWB
型号: AS3933-BSWB
厂家: AMS(艾迈斯)    AMS(艾迈斯)
描述:

3D Low Frequency Wake-Up Receiver

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中文:  中文翻译
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This product, formerly sold by ams AG, and before that optionally by either  
Applied Sensors GmbH, acam-messelectronic GmbH or Cambridge CMOS Sensors,  
is now owned and sold by  
ScioSense  
The technical content of this document under ams / Applied Sensors / acam-  
messelectronic / Cambridge CMOS Sensors is still valid.  
Contact information  
Headquarters:  
ScioSense B.V.  
High Tech Campus 10  
5656 AE Eindhoven  
The Netherlands  
info@sciosense.com  
www.sciosense.com  
AS3933  
3D Low Frequency Wake-Up Receiver  
The AS3933 is a 3-channel low power ASK receiver that is able  
to generate a wake-up upon detection of a data signal which  
uses a LF carrier frequency between 15-150 kHz. The integrated  
correlator can be used for detection of a programmable 16-bit  
or 32-bit Manchester wake-up pattern. The device can operate  
using one, two, or three active channels.  
General Description  
The AS3933 provides a digital RSSI value for each active  
channel, it supports a programmable data rate and Manchester  
decoding with clock recovery. The AS3933 offers an internal  
Clock Generator, which is either derived from a crystal oscillator  
or the internal RC oscillator. The user can decide to use the  
external clock generator instead.  
The programmable features of AS3933 enable to optimize its  
settings for achieving a longer distance while retaining a  
reliable wake-up generation. The sensitivity level of AS3933 can  
be adjusted in presence of a strong field or in noisy  
environments.  
Antenna tuning is greatly simplified, as the automatic tuning  
feature ensures perfect matching to the desired carrier  
frequency.  
The device is available in 16-pin TSSOP and 16-LD QFN (4x4mm)  
packages, and DoW (dice on wafer).  
Ordering Information and Content Guide appear at end of  
datasheet.  
Key Benefits & Features  
The benefits and features of AS3933, 3D Low Frequency  
Wake-Up Receiver are listed below:  
Figure 1:  
Added Value of Using AS3933  
Benefits  
Features  
Enables low power active tags  
Selectable carrier frequency  
3-channel ASK wake-up receiver  
Carrier frequency range 15 – 150 kHz  
1-D, 2-D, or 3-D wake-up pattern detection  
32-bit programmable wake-up pattern  
Supporting doubling of wake-up pattern  
Wake-up without pattern detection selectable  
One, two, or three channel operation  
Highly resistant to false wake-ups  
Improved immunity to false wake-ups  
Allows frequency only detection  
Improved range with best-in-class  
sensitivity  
Wake-up sensitivity 80μVRMS (typ.)  
ams Datasheet  
Page 1  
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AS3933 − General Description  
Benefits  
Features  
Adjustable range  
Sensitivity level adjustable  
False wake-up counter  
Provides tracking of false wake-ups  
Ensures wake-up in a noise environment  
Periodical forced wake-up supported (1s – 2h)  
Current consumption in 3-channel listening mode  
2.3 μA (typ.)  
Extended battery life  
Flexible clock configuration  
Operates from a 3V battery  
Industrial temperature range  
RTC based 32 kHz XTAL, RC-OSC, or external clock  
Operating supply range 2.4V – 3.6V (TA = 25°C)  
Operation temperature range -40°C to 85°C  
Applications  
The AS3933, 3D Low Frequency Wake-Up Receiver is ideal for  
Active RFID tags, Real-time location systems, Operator  
identification, Access control, and Wireless sensors.  
Figure 2:  
AS3933 Typical Application Diagram with Crystal Oscillator  
VCC  
VCC  
CS  
CL_DAT  
DAT  
CBAT  
CL  
CL  
XIN  
XTAL  
XOUT  
LF1P  
LF2P  
TRANSMITTER  
TX  
WAKE  
SCL  
AS3933  
LF3P  
LFN  
SDO  
SDI  
GND  
VSS  
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AS3933 − General Description  
Figure 3:  
AS3933 Typical Application Diagram with RC Oscillator  
VCC  
VCC  
CS  
CL_DAT  
DAT  
CBAT  
XIN  
XOUT  
LF1P  
LF2P  
TRANSMITTER  
TX  
WAKE  
SCL  
AS3933  
LF3P  
LFN  
SDO  
SDI  
GND  
VSS  
Figure 4:  
AS3933 Typical Application Diagram with Clock from External Source  
VCC  
VCC  
CS  
CL_DAT  
DAT  
CBAT  
XIN  
EXT. CLOCK  
XOUT  
TRANSMITTER  
TX  
LF1P  
WAKE  
SCL  
AS3933  
LF2P  
LF3P  
LFN  
SDO  
SDI  
GND  
VSS  
ams Datasheet  
[v1-08] 2015-Sep-02  
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AS3933 − Pin Assignments  
Pin Assignments  
TSSOP-16 Package  
Figure 5:  
TSSOP Pin Assignment (Top View)  
1
2
3
4
5
6
7
CS  
16  
15  
CL_DAT  
DAT  
SCL  
SDI  
SDO  
VCC  
GND  
LF3P  
WAKE  
14  
13  
12  
VSS  
AS3933  
XOUT  
11  
10  
9
XIN  
LFN  
LF2P  
LF1P  
8
Pin Description  
Figure 6:  
TSSOP-16 Pin Description  
Pin  
Number  
Pin Name  
Pin Type  
Description  
CS  
SCL  
SDI  
1
2
3
Chip select  
Digital input  
SDI interface clock  
SDI data input  
Digital output /  
tristate  
SDO  
4
SDI data output (tristate when CS is low)  
V
5
6
Positive supply voltage  
Negative supply voltage  
CC  
Supply pad  
GND  
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AS3933 − Pin Assignments  
Pin  
Number  
Pin Name  
Pin Type  
Description  
LF3P  
LF2P  
LF1P  
LFN  
7
Input antenna channel three  
8
Input antenna channel two  
Input antenna channel one  
Common ground for antenna one, two and three  
Crystal oscillator input  
Crystal oscillator output  
Substrate  
9
Analog I/O  
10  
11  
12  
13  
14  
15  
16  
XIN  
XOUT  
V
Supply pad  
SS  
WAKE  
DAT  
Wake-up output IRQ  
Digital output  
Data output  
CL_DAT  
Manchester recovered clock  
QFN-16 Package  
Figure 7:  
QFN Pin Assignment (Top View)  
16  
13  
15  
14  
1
2
SCL  
CS  
LF3P  
LF2P  
12  
11  
AS3933  
3
4
LF1P  
LFN  
10  
9
CL_DAT  
DAT  
8
6
5
7
ams Datasheet  
[v1-08] 2015-Sep-02  
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AS3933 − Pin Assignments  
Pin Description  
Figure 8:  
QFN-16 Pin Description  
Pin  
Number  
Pin Name  
Pin Type  
Description  
LF3P  
LF2P  
LF1P  
LFN  
1
2
Input antenna channel three  
Input antenna channel two  
Input antenna channel one  
3
Analog I/O  
4
Common ground for antenna one, two and three  
Crystal oscillator input  
Crystal oscillator output  
Substrate  
XIN  
5
XOUT  
6
V
7
Supply pad  
SS  
WAKE  
DAT  
8
Wake-up output IRQ  
Data output  
9
Digital output  
CL_DAT  
CS  
10  
11  
12  
13  
Manchester recovered clock  
Chip select  
SCL  
Digital input  
SDI interface clock  
SDI  
SDI data input  
Digital output /  
tristate  
SDO  
14  
SDI data output (tristate when CS is low)  
V
15  
16  
Positive supply voltage  
Negative supply voltage  
CC  
Supply pad  
GND  
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AS3933 − Pin Assignments  
Dice On Wafer  
DoW Attributes:  
Wafer Diameter: 8”  
Process: 0.35μm  
Wafer Thickness: 725μm 15μm  
Scribe line: 80μm  
Chip Size: 2.070 x 1.700 mm  
Pad Size: 85 x 85 μm  
Figure 9:  
DoW Pad Assignment  
ams Datasheet  
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AS3933 − Pin Assignments  
Figure 10:  
DoW Pad Description and Position  
Position  
Pad  
1
Name  
GND  
GND  
VCC  
Center X (µm)  
381.5  
Center Y (µm)  
1532.5  
1532.5  
1532.5  
1532.5  
1532.5  
1532.5  
257.5  
2
634.5  
3
817.5  
Upper Side  
4
SDO  
SDI  
1000.5  
1230.5  
1417.5  
1902.5  
1902.5  
648.35  
847.5  
5
6
SCL  
1
CL_DAT  
CS  
Right Side  
2
1365.5  
94.5  
1
XIN  
2
XOUT  
VSS  
94.5  
Bottom Side  
3
1203.5  
1387.5  
1569.5  
87.5  
87.5  
4
WAKE  
DAT  
87.5  
5
87.5  
1
LFN  
303.5  
2
LF1P  
LF2P  
LF3P  
87.5  
669.5  
Left Side  
3
87.5  
1103.5  
1356.5  
4
87.5  
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AS3933 − Absolute Maximum Ratings  
Stresses beyond those listed in Absolute Maximum Ratings may  
cause permanent damage to the device. These are stress ratings  
only. Functional operation of the device at these or any other  
conditions beyond those indicated in Operating Conditions is  
not implied. Exposure to absolute maximum rating conditions  
for extended periods may affect device reliability.  
Absolute Maximum Ratings  
Figure 11:  
Absolute Maximum Ratings  
Symbol  
Parameter  
Min  
Max  
Unit  
Note  
Electrical Parameters  
V
DC supply voltage  
Input pin voltage  
-0.5  
-0.5  
5
5
V
V
DD  
V
IN  
Input current  
(latch up immunity)  
I
-100  
100  
mA  
Norm: Jedec 78  
SOURCE  
Electrostatic Discharge  
Norm: MIL 883 E method 3015  
(HBM)  
ESD  
Electrostatic discharge  
2
kV  
Continuous Power Dissipation  
Total power dissipation  
P
0.07  
mW  
t
(all supplies and outputs)  
Temperature Ranges and Storage Conditions  
T
Storage temperature  
-65  
150  
260  
°C  
°C  
strg  
Norm: IPC/JEDEC J-STD-020  
The reflow peak soldering  
temperature (body temperature)  
is specified according IPC/JEDEC  
J-STD-020 “Moisture/Reflow  
Sensitivity Classification for  
Non-hermetic Solid State Surface  
Mount Devices.  
Package body  
temperature  
T
body  
Relative Humidity  
(non-condensing)  
RH  
5
85  
%
NC  
Represents a maximum floor life  
time of 168h  
MSL  
Moisture Sensitivity Level  
3
ams Datasheet  
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AS3933 − Electrical Characteristics  
Electrical Characteristics  
Figure 12:  
Operating Conditions  
Symbol  
Parameter  
Conditions  
Min  
Typ Max Unit  
V
Positive supply voltage  
2.4  
3
3.6  
0
V
V
DD  
Negative supply  
voltage  
V
0
SS  
T
Ambient temperature  
-40  
85  
°C  
AMB  
Figure 13:  
DC/AC Characteristics for Digital Inputs and Outputs  
Symbol  
Parameter  
Conditions  
Min  
Typ Max Unit  
CMOS Input  
0.6*  
0.7*  
0.8*  
V
High level input voltage  
V
IH  
V
V
V
DD  
DD  
DD  
0.12*  
0.2*  
0.3*  
V
Low level input voltage  
Input leakage current  
V
IL  
V
V
V
DD  
DD  
DD  
I
100  
nA  
LEAK  
CMOS Output  
V
0.4  
-
DD  
V
High level output voltage  
With a load current of 1mA  
V
OH  
V
0.4  
+
SS  
V
Low level output voltage  
Capacitive load  
With a load current of 1mA  
V
OL  
C
For a clock frequency of 1 MHz  
400  
pF  
L
Tristate CMOS Output  
V
0.4  
-
DD  
V
High level output voltage  
With a load current of 1mA  
V
OH  
V
0.4  
+
SS  
V
Low level output voltage  
Tristate leakage current  
With a load current of 1mA  
To V and V  
V
OL  
I
100  
nA  
OZ  
DD  
SS  
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AS3933 − Electrical Characteristics  
Figure 14:  
Electrical System Specifications  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Input Characteristics  
AC Input Impedance  
at125kHz  
In case no antenna  
damper is set (R1<4>=0)  
R
2
150  
95  
95  
65  
65  
40  
40  
23  
23  
15  
MΩ  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
IN  
Maximum Input  
Frequency Band1  
F1max  
F1min  
F2max  
F2min  
F3max  
F3min  
F4max  
F4min  
F5max  
F5min  
Minimum Input  
Frequency Band1  
Maximum Input  
Frequency Band2  
Minimum Input  
Frequency Band2  
Maximum Input  
Frequency Band3  
Minimum Input  
Frequency Band3  
Maximum Input  
Frequency Band4  
Minimum Input  
Frequency Band4  
Maximum Input  
Frequency Band5  
Minimum Input  
Frequency Band5  
Current Consumption  
Current Consumption in  
standard listening mode  
with one active channel  
and RC-oscillator as  
I1CHRC  
I2CHRC  
3.1  
4.6  
μA  
μA  
Clock Generator  
Current Consumption in  
standard listening mode  
with two active channels  
and RC-oscillator as  
Clock Generator  
ams Datasheet  
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AS3933 − Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Current Consumption in  
standard listening mode  
with three active  
channels and  
I3CHRC  
6.1  
μA  
RC-oscillator as Clock  
Generator  
Current Consumption in  
scanning mode with  
three active channels  
and RC-oscillator as  
Clock Generator  
I3CHSCRC  
I3CHOORC  
3.1  
μA  
μA  
Current Consumption in  
ON/OFF mode with three  
active channels and  
RC-oscillator as Clock  
Generator  
11% Duty Cycle  
2.3  
3.8  
50% Duty Cycle  
Current Consumption in  
standard listening mode  
with three active  
channels and crystal  
oscillator as Clock  
Generator  
I3CHXT  
6.5  
8.9  
12  
μA  
Current Consumption in  
Preamble detection /  
Pattern correlation / Data  
receiving mode  
With 125 kHz carrier  
frequency and 1 kbps  
data-rate. No load on the  
output pins.  
IDATA  
8.3  
μA  
(RC-oscillator)  
Additional current  
consumption per  
channel if gain boost  
enabled  
IBOOST  
150  
nA  
Input Sensitivity  
With 125 kHz carrier  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
Input Sensitivity on all  
channels in the Band1  
SENS1  
SENS1B  
SENS2  
100  
80  
μVrms  
μVrms  
μVrms  
With 125 kHz carrier  
Input Sensitivity on all  
channels in the Band1  
with 3dB gain boost  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
With 90 kHz carrier  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
Input Sensitivity on all  
channels in the Band2  
100  
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AS3933 − Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
With 90 kHz carrier  
Input Sensitivity on all  
channels in the Band2  
with 3dB gain boost  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
SENS2B  
80  
μVrms  
With 60 kHz carrier  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
Input Sensitivity on all  
channels in the Band3  
SENS3  
SENS3B  
SENS4B  
100  
80  
μVrms  
μVrms  
μVrms  
With 60 kHz carrier  
Input Sensitivity on all  
channels in the Band3  
with 3dB gain boost  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
With 30 kHz carrier  
Input Sensitivity on all  
channels in the Band4  
with 3dB gain boost  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
80  
With 18 kHz carrier  
Input Sensitivity on all  
channels in the Band5  
with 3dB gain boost  
frequency, chip in default  
mode, 4 half bits burst + 4  
symbols preamble and  
single preamble detection  
SENS5B  
TSAMP  
80  
μVrms  
μs  
Channel Settling Time  
Amplifier settling time  
250  
32.768  
300  
Crystal Oscillator  
FXTAL  
TXTAL  
IXTAL  
Frequency  
25  
45  
1
kHz  
s
Crystal dependent  
Start-up Time  
Current consumption  
nA  
External Clock Source  
IEXTCL  
FEXTCL  
Current consumption  
Frequency  
0.8  
μA  
25  
45  
kHz  
ams Datasheet  
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AS3933 − Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
RC Oscillator  
If no calibration is  
performed  
FRCNCAL  
FRCCAL32  
25  
31  
32.768  
32.768  
45  
If calibration with 32.768  
kHz reference signal is  
performed  
34.5  
Frequency  
kHz  
Maximum achievable  
frequency after calibration  
FRCCALMAX  
FRCCALMIN  
TRC  
23.75  
45  
Minimum achievable  
frequency after calibration  
From RC enable  
(R1<0> = 0)  
Start-up time  
1
s
Periods of  
reference  
clock  
TCALRC  
IRC  
Calibration time  
65  
Current consumption  
650  
15  
nA  
LC Oscillator  
L=47mH (Premo:  
SDTR1103-0108+),  
C=2.3nF  
FLCO  
Minimum Frequency  
kHz  
MIN  
L=7.2mH (Premo:  
SDTR1103-0720+), C=1nF  
FLCO  
Maximum Frequency  
Minimum Eq. Parallel  
150  
10  
kHz  
MAX  
RPAR  
kΩ  
MIN  
Tuning Caps  
Maximum internal  
capacitance (in step of  
1pF) on LF1P  
LF1Ptuning  
LF2Ptuning  
LF3Ptuning  
31  
31  
31  
pF  
pF  
pF  
Maximum internal  
capacitance (in step of  
1pF) on LF2P  
Capacitance  
Maximum internal  
capacitance (in step of  
1pF) on LF3P  
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AS3933 − Typical Operating Characteristics  
Typical Operating  
Characteristics  
Figure 15:  
Sensitivity vs Voltage and Temperature  
120  
95 oC  
100  
27 oC  
-40 o  
C
80  
60  
40  
20  
0
2.4  
3
Supply Voltage [V]  
3.6  
Figure 16:  
Sensitivity vs RSSI  
1000000  
100000  
10000  
1000  
100  
10  
1
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30  
RSSI [dB]  
ams Datasheet  
[v1-08] 2015-Sep-02  
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AS3933 − Typical Operating Characteristics  
Figure 17:  
RC-Oscillator Frequency vs Voltage (Calibr.)  
34.5  
34  
33.5  
33  
32.5  
32  
31.5  
31  
2.4  
2.6  
2.8  
3
3.2  
3.4  
3.6  
Supply Voltage [V]  
Figure 18:  
RC-Oscillator Frequency vs Temperature (Calibr.)  
34.5  
34  
33.5  
33  
32.5  
32  
31.5  
31  
-36 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
Operating Temperature [oC]  
Page 16  
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AS3933 − Detailed Description  
The AS3933 is a three-dimensional low power low-frequency  
wake-up receiver. The AS3933 is capable of detecting the  
presence of an inductive coupled carrier and can extract the  
envelope of the ON-OFF-Keying (OOK) modulated carrier. In  
case the carrier is Manchester coded, the clock can be recovered  
from the received signal and the data can be correlated with a  
programmed pattern. If the detected pattern corresponds to  
the stored one, a wake-up signal (IRQ) is risen up. The pattern  
correlation can be disabled; in this case the wake-up detection  
is based only on the frequency detection.  
Detailed Description  
The AS3933 is made up of three independent receiving  
channels, one envelop detector, one data correlator, one  
Manchester decoder, 19 programmable registers with the main  
logic and a Clock Generator.  
The digital logic can be accessed by an SPI. The Clock Generator  
can be based on a crystal oscillator, or an internal RC-oscillator  
or an external clock. In case the RC-oscillator is used to improve  
its accuracy, a calibration can be performed.  
The internal LC-oscillator can deliver the antenna’s oscillation  
frequency for each channel and the internal tuning capacitor  
bank can provide fine tuning.  
The Internal RC-oscillator can be calibrated either over SPI or  
using the internal algorithm based on the antenna resonance  
frequency.  
Figure 19:  
Block Diagram of LF Wake-Up Receiver AS3933  
LC-Oscillator  
Wakeup  
IRQ  
SCL  
Data  
Channel  
RSSI  
Main Logic  
SPI  
SDI  
LF1P  
LF2P  
Amplifier 1  
Tuning  
Capacitors  
Freq. OK  
SDO  
CS  
Channel  
Selector  
Envelope Detector /  
Data Slicer  
Data  
Correlator  
Channel  
Amplifier 2  
RSSI  
RSSI  
Tuning  
Capacitors  
Manchester  
Decoder  
DAT  
Freq. OK  
Data  
CL_DAT  
Channel  
Amplifier 3  
LF3P  
LFN  
Tuning  
Capacitors  
Clock Generator  
I / V  
Bias  
Freq. OK  
Clock Buffer  
RC Oscillator  
Xtal Oscillator  
VCC  
GND  
Xin  
Xout  
ams Datasheet  
[v1-08] 2015-Sep-02  
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AS3933 − Detailed Description  
AS3933 needs the following external components:  
Power supply capacitor - CBAT - 100 nF.  
32.768 kHz crystal with its two pulling capacitors - XTAL  
and CL - (it is possible to omit these components if the  
internal RC oscillator is used instead of the crystal  
oscillator).  
One, two, or three LC resonators according to the number  
of used channels.  
In case the internal RC-oscillator is used (no crystal oscillator is  
mounted), the pin XIN has to be connected to the supply, while  
pin XOUT should stay floating. Application diagrams with and  
without crystal are shown in Figure 2, Figure 3 and Figure 4.  
Operating Modes  
The diagram in Figure 20 shows how the AS3933 operates.  
Figure 20:  
Operating Modes Flow Chart  
Listening Mode  
(WAKE=0)  
Frequency Detection OK  
And  
Frequency Detection OK  
And  
Pattern Detection Disabled  
Pattern Detection Enabled  
Start RSSI  
(Wake=0)  
Pattern doesn’t  
match  
Clear Wake  
or  
Time out  
Pattern  
Correlation  
(Wake=0)  
Start RSSI  
(Wake=1)  
Pattern matches  
Data Receiving  
(WAKE=1)  
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AS3933 − Detailed Description  
Listening Mode  
In listening mode, the chip is active and looks continuously for  
the presence of the carrier on the input of all active channels.  
In this mode, only the active channel amplifiers and the Clock  
Generator are running. In case the carrier is detected, then the  
RSSI measurements get started on all three channels and the  
result is stored in the memory.  
If the three dimensional detection is not required, then it is  
possible to deactivate one or more channels. In case only two  
channels are required, then the deactivated channel must be  
the number two; while in case only one channel is needed, then  
the active channel must be the number one.  
Inside the listening mode, it is possible to distinguish the  
following three low power sub modes:  
Standard Listening Mode. All channels are active at the same  
time.  
Scanning Mode (Low Power Mode 1). In this sub-mode, a time  
slot T=1ms is defined and in each time slot only one channel  
can be active. As shown in Figure 21 when a certain time slot is  
over, the current active channel is switched OFF and the next  
channel becomes active and so on. If, for example all three  
channels are enabled, in the first time slot the only active  
channel is the number one. When the first time slot is over, the  
channel one is switched OFF and the channel three becomes  
active. During the third time slot, the channel two is active while  
the other two are OFF. This channel rotation starts back from  
the channel one and goes on until the presence of the carrier  
is detected by any channel. The Scanning mode (channel  
rotation) is managed internally by the AS3933 and doesn’t need  
any activity from the host system (MCU). As soon as one channel  
detects the frequency, all three channels become immediately  
active at the same time. The AS3933 can perform a  
simultaneous multidirectional evaluation (on all three  
channels) of the field and evaluate which channel has the  
strongest RSSI. The channel with the highest RSSI will be put  
through to the demodulator. In this way it is possible to perform  
multidirectional monitoring of the field with a current  
consumption of a single channel, keeping the sensitivity as  
good as if all channels are active at the same time.  
ams Datasheet  
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AS3933 − Detailed Description  
Figure 21:  
Scanning Mode  
Channel 1  
Channel 3  
Channel 2  
time  
time  
time  
Presence of  
carrier  
t0  
t0+T  
t0+2T  
t0+3T  
t0+4T  
t0+5T  
t1  
time  
ON/OFF Mode (Low Power Mode 2). In this low power  
sub-mode the chip sets the receiving channels in polling mode;  
all active channels are on at the same time only for a certain  
time T (where T is 1 ms). The OFF-time can be defined with the  
bits R4<7:6>. If, for example, R4<7:6>=11 (see Figure 25) the  
active channels will be 1ms ON and 8ms OFF.  
Figure 22:  
ON/OFF Mode  
Channel 1  
Channel 2  
Channel 3  
time  
time  
time  
Presence of  
carrier  
t0  
t0+T  
2*t0  
2*t0+T  
3*t0  
time  
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AS3933 − Detailed Description  
Artificial Wake-Up  
For each of these sub modes it is possible to enable a further  
feature called Artificial Wake-up. The Artificial Wake-up is a  
counter based on the used Clock Generator. Three bits define a  
time window (see R8<2:0>). If no activity is seen within this time  
window, the chip will produce an interrupt on the WAKE pin  
that lasts 128 μs. With this interrupt the microcontroller (μC)  
can get feedback on the surrounding environment (e.g. read  
the false wake-up register R13<7:0>) and/or take actions in  
order to change the setup.  
Preamble Detection / Pattern Correlation  
The chip can go in to this mode after detecting a LF carrier only  
if the data correlation is enabled (R1<1>=1). The correlator  
searches first for preamble bits and then for data pattern. The  
paragraph Wake-Up Protocol: Pattern Detection Enabled  
describes how the protocol can be implemented. Should the  
pattern correlation be disabled (R1<1>=0), the AS3933 goes  
directly in Data receiving mode (see paragraph Data Receiving).  
If the received pattern matches, then the wake-up interrupt is  
displayed on the WAKE output (Wake goes high) and the chip  
goes in Data receiving mode. If the pattern fails, then the  
internal wake-up (on all active channels) is terminated and no  
interrupt is produced.  
Having per default DAT_MASK disabled (R0<6>=0), the DAT pin  
shows the entire demodulated incoming signal (carrier  
burst+preamble+pattern+data).  
If DAT_MASK is enabled (R0<6>=1), the data will be displayed  
only after the generation of the WAKEUP interrupt.  
Note(s): It is important to note that the Manchester decoder  
must be enabled (R1<3>=1) for this feature.  
Data Receiving  
After a successful wake-up the chip enters the data receiving  
mode. In this mode the chip can be retained a normal OOK  
receiver. The data is provided on the DAT pin and in case the  
Manchester decoder is enabled (see R1<3>), the recovered  
clock is present on the CL_DAT. It is possible to set the chip back  
to listening mode either with a direct command CLEAR_WAKE  
(see Figure 29) or by using the timeout feature. This feature  
automatically sets the chip back to listening mode after a  
certain time defined by the bits R7<7:5>.  
ams Datasheet  
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AS3933 − Detailed Description  
System and Block Specification  
Register Overview  
Figure 23:  
Register Overview  
7
6
5
4
3
2
1
0
DAT_MAS  
K
R0  
R1  
R2  
PATT32  
ABS_HY  
ON_OFF  
MUX_123  
EN_A2  
EN_A3  
EN_A1  
AGC_TLI  
M
EN_MAN  
CH  
AGC_UD  
ATT_ON  
EN_PAT2 EN_WPAT EN_XTAL  
EN_EXT_  
CLK  
S_ABS  
G_BOOST Reserved  
DISPLAY_CLK  
S_WU1  
FS_ENV  
R3  
R4  
R5  
R6  
R7  
R8  
HY_20m  
HY_POS  
FS_SLC  
R_VAL  
T_OFF  
GR  
PATT2B  
PATT1B  
T_OUT  
T_HBIT  
BAND_SEL  
T_AUTO  
BLOCK_A  
GC  
R9  
Reserved  
R10  
R11  
R12  
R13  
n.a  
n.a  
n.a  
RSSI1  
RSSI2  
RSSI3  
F_WAKE  
RC_CAL_  
OK  
RC_CAL_  
KO  
R14  
R15  
R16  
RC_OSC_TAPS  
LC_OSC_  
LC_OSC_  
n.a.  
n.a.  
n.a.  
OK  
KO  
CLOCK_G  
EN_DIS  
RC_OSC_ RC_OSC_  
n.a  
LC_OSC_MUX  
MIN  
MAX  
R17  
R18  
R19  
n.a.  
n.a.  
n.a.  
CAP__CH1  
CAP__CH2  
CAP__CH3  
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AS3933 − Detailed Description  
Register Description and Default Values  
Figure 24:  
Default Values of Registers  
Default  
Value  
Register  
Name  
Type  
Description  
Pattern extended to 32 bits (PAT32=0 16 bits, PAT32=1  
32bits)  
R0<7>  
R0<6>  
R0<5>  
PAT32  
R/W  
R/W  
R/W  
0
DAT_MAS  
K
Masks data on DAT pin before wake-up (DAT_MASK = 0  
data not masked; DAT_MASK = 1 data masked)  
0
0
ON/OFF operation mode. (Duty-cycle defined in the  
register R4<7:6>  
ON_OFF  
R0<4>  
R0<3>  
R0<2>  
R0<1>  
R0<0>  
R1<7>  
R1<6>  
R1<5>  
R1<4>  
MUX_123  
EN_A2  
R/W  
R/W  
R/W  
R/W  
0
1
1
1
0
0
0
1
0
Scan mode enable  
Channel 2 enable  
EN_A3  
Channel 3 enable  
EN_A1  
Channel 1 enable  
Reserved  
ABS_HY  
AGC_TLIM  
AGC_UD  
ATT_ON  
Reserved  
R/W  
R/W  
R/W  
R/W  
Enable Data slicer absolute reference  
AGC acting only on the first carrier burst  
AGC operating in both direction (up-down)  
Antenna damper enable  
EN_MANC  
H
R1<3>  
R/W  
0
Manchester decoder enable  
R1<2>  
R1<1>  
R1<0>  
R2<7>  
EN_PAT2  
EN_WPAT  
EN_XTAL  
S_ABSH  
R/W  
R/W  
R/W  
R/W  
0
1
1
0
Double wake-up pattern correlation  
Correlator enable  
Crystal oscillator enable  
Data slicer absolute threshold reduction  
EN_EXT_C  
LK  
R2<6>  
R/W  
R/W  
0
Enables external clock generator  
R2<5>  
R2<5>  
G_BOOST  
Reserved  
0
0
3dB Amplifier Gain Boost (G_BOOST=1)  
Reserved  
DISPLAY_  
CLK  
Set to 11 in case the clock generator's frequency is  
shown on pin CL_DAT.  
R2<3:2>  
R2<1:0>  
R/W  
R/W  
00  
00  
S_WU1  
Tolerance setting for the stage wake-up (see Figure 37)  
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AS3933 − Detailed Description  
Default  
Value  
Register  
Name  
Type  
Description  
Data slicer hysteresis  
R3<7>  
HY_20m  
R/W  
0
0
if HY_20m = 0 then comparator hysteresis = 40mV  
if HY_20m = 1 then comparator hysteresis = 20mV  
Data slicer hysteresis only on positive edges (HY_POS=0,  
hysteresis on both edges, HY_POS=1, hysteresis only on  
positive edges)  
R3<6>  
HY_POS  
R/W  
R3<5:3>  
R3<2:0>  
FS_SCL  
FS_ENV  
R/W  
R/W  
100  
000  
Data slicer time constant (see Figure 45)  
Envelop detector time constant (see Figure 44)  
OFF time in ON/OFF operation mode  
T_OFF=00  
T_OFF=01  
T_OFF=10  
T_OFF=11  
1ms  
2ms  
4ms  
8ms  
R4<7:6>  
T_OFF  
R/W  
00  
R4<5:4>  
R4<3:0>  
R5<7:0>  
R6<7:0>  
R7<7:5>  
R7<4:0>  
R8<7:5>  
D_RES  
GR  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
01  
0000  
Antenna damping resistor (see Figure 40)  
Gain reduction (see Figure 39)  
2nd Byte of wake-up pattern  
1st Byte of wake-up pattern  
TS2  
01101001  
10010110  
000  
TS1  
T_OUT  
T_HBIT  
BAND_SEL  
Automatic time-out (see Figure 49)  
Bit rate definition (see Figure 48)  
Band selection (see Figure 36)  
Artificial wake-up  
01011  
000  
T_AUTO=000  
T_AUTO=001  
T_AUTO=010  
T_AUTO=011  
T_AUTO=100  
T_AUTO=101  
T_AUTO=110  
T_AUTO=111  
No artificial wake-up  
1 sec  
5 sec  
R8<2:0>  
T_AUTO  
R/W  
000  
20 sec  
2 min  
15min  
1 hour  
2 hour  
BLOCK_A  
GC  
R9<7>  
R/W  
0
Disables AGC  
Reserved  
R9<6:0>  
000000  
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AS3933 − Detailed Description  
Default  
Value  
Register  
Name  
Type  
Description  
R10<4:0>  
R11<4:0>  
R12<4:0>  
R13<7:0>  
RSSI1  
RSSI2  
R
R
R
R
RSSI channel 1  
RSSI channel 2  
RSSI channel 3  
RSSI3  
F_WAK  
False wake-up register  
RC_CAL_O  
K
R14<7>  
R14<6>  
R14<5:0>  
R15<4>  
R15<3>  
R16<7>  
R16<5>  
R16<4>  
R16<2>  
R16<1>  
R16<0>  
R
R
Successful RC calibration  
RC_CAL_K  
O
Unsuccessful RC calibration  
RC-Oscillator taps setting  
LC-Oscillator working  
RC_OSC_T  
APS  
R
LC_OSC_O  
K
R
LC_OSC_K  
O
R
LC-Oscillator not working  
CLOCK_GE  
N_DIS  
The Clock Generator output signal displayed on CL_DAT  
pin  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
0
0
0
0
0
0
RC_OSC_  
MIN  
Sets the RC-oscillator to minimum frequency  
RC_OSC_  
MAX  
Sets the RC-oscillator to maximum frequency  
LC_OSC_  
MUX3  
Displays the resonance frequency of LF3P on DAT pin  
Displays the resonance frequency of LF2P on DAT pin  
Displays the resonance frequency of LF1P on DAT pin  
LC_OSC_  
MUX2  
LC_OSC_  
MUX1  
R17<4:0>  
R18<4:0>  
R19<4:0>  
CAPS_CH1  
CAPS_CH1  
CAPS_CH1  
R/W  
R/W  
R/W  
00000  
00000  
00000  
Capacitor banks on the channel1  
Capacitor banks on the channel2  
Capacitor banks on the channel3  
ams Datasheet  
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AS3933 − Detailed Description  
Serial Peripheral Interface (SPI)  
This 4-wire interface is used by the Microcontroller (μC) to  
program the AS3933. The maximum clock operation frequency  
of the SPI is 6MHz.  
Figure 25:  
Serial Peripheral Interface (SPI) Pins  
Name  
Signal  
Signal Level  
Description  
CS  
Digital Input  
CMOS  
Chip Select  
Serial Data input for writing registers, data  
to transmit and/or writing addresses to  
select readable register  
SIN  
Digital Input  
CMOS  
Serial Data output for received data or  
read value of selected registers  
SOUT  
SCLK  
Digital Output  
Digital Input  
CMOS  
CMOS  
Clock for serial data read and write  
Note(s): SDO is set to tristate if CS is low. In this way more than  
one device can communicate on the same SDO bus.  
SDI Command Structure. To program the SPI the CS signal has  
to go high. A SPI command is made up by a two bytes serial  
command and the data is sampled on the falling edge of SCLK.  
The Figure 26 shows how the command looks like, from the MSB  
(B15) to LSB (B0). The command stream has to be sent to the SPI  
from the MSB (B15) to the LSB (B0).  
Figure 26:  
SDI Command Structure  
Mode  
Register Address / Direct Command  
Register Data  
B15  
B14  
B13  
B12  
B11  
B10  
B9  
B8  
B7  
B6  
B5  
B3  
B2  
B1  
B0  
The first two bits (B15 and B14) define the operating mode.  
There are three modes available (write, read, direct command)  
plus one spare (not used), as shown in Figure 27.  
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AS3933 − Detailed Description  
Figure 27:  
SDI Command Structure  
B15  
B14  
Mode  
WRITE  
0
0
1
1
0
1
0
1
READ  
NOT ALLOWED  
DIRECT COMMAND  
In case a write or read command happens the next 6 bits (B13  
to B8) define the register address which has to be written  
respectively read, as shown in Figure 28.  
Figure 28:  
SDI Command Structure  
B13  
0
B12  
0
B11  
0
B10  
0
B9  
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
B8  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Read/Write Register  
R0  
R1  
0
0
0
0
0
0
0
0
R2  
0
0
0
0
R3  
0
0
0
1
R4  
0
0
0
1
R5  
0
0
0
1
R6  
0
0
0
1
R7  
0
0
1
0
R8  
0
0
1
0
R9  
0
0
1
0
R10  
R11  
R12  
R13  
R14  
R15  
R16  
R17  
0
0
1
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
0
0
1
0
0
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AS3933 − Detailed Description  
B13  
B12  
B11  
B10  
B9  
1
B8  
0
Read/Write Register  
0
0
1
1
0
0
0
0
R18  
R19  
1
1
The last 8 bits are the data that has to be written respectively  
read. A CS toggle high-low-high terminates the command  
mode.  
If a direct command is sent (B15-B14=11) the bits from B13 to  
B8 defines the direct command while the last 8 bits are omitted.  
Figure 29 shows all possible direct commands:  
Figure 29:  
List of Direct Commands  
COMMAND_MODE  
clear_wake  
B13  
B12  
B11  
B10  
B9  
0
B8  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
reset_RSSI  
0
1
trim_osc  
1
0
clear_false  
1
1
preset_default  
Calib_RCO_LC  
0
0
0
1
All direct commands are explained below:  
clear_wake: clears the wake state of the chip. In case the  
chip has woken up (WAKE pin is high) the chip is set back  
to listening mode.  
reset_RSSI: resets the RSSI measurement.  
Calib_RCosc: starts the trimming procedure of the internal  
RC oscillator (see page 29).  
clear_false: resets the false wake-up register  
(R13<7:0>=00).  
preset_default: sets all register in the default mode, as  
shown in Figure 24.  
Calib_RCO_LC: calibration of the RC-oscillator with the  
external LC tank (see page 31).  
Writing of Data to Addressable Registers (WRITE Mode). The  
SPI is sampled at the falling edge of SCLK (as shown in the  
following diagrams).  
A CS toggling high-low-high indicates the end of the WRITE  
command after register has been written. The following  
example shows a write command.  
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AS3933 − Detailed Description  
Figure 30:  
Writing of a Single Byte (Falling Edge Sampling)  
CS  
SCLK  
X
X
0
0
A5  
A4  
A3  
A2  
A1  
A0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
SDI  
CS falling  
edge signals  
end of  
SCLK rising  
edge Data is  
transfered from  
μC  
SCLK  
Data is moved  
to Address  
A5-A0  
Two leading  
Zeros indicate  
WRITE Mode  
falling edge  
Data is  
WRITE Mode  
sampled  
Figure 31:  
Writing of Register Data with Auto-Incrementing Address  
CS  
SCLK  
A A A A A A D D D D D D D D D D D D D D D D D D  
D D D D D D D D D D  
1 0 7 6 5 4 3 2 1 0  
X
X
0 0  
SDI  
5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6  
CS falling  
edge signals  
end of  
Two leading  
Zeros indicate  
WRITE Mode  
Data is moved  
to Address  
<A5-A0 >  
Data is moved  
to Address  
Data is moved  
to Address  
Data is moved  
to Address  
<A5-A0 > +1  
<A5-A0 > + (n-1)  
<A5-A0 > +n  
WRITE Mode  
Reading of Data from Addressable Registers (READ Mode).  
Once the address has been sent through SPI, the data can be  
fed through the SDO pin out to the microcontroller.  
A CS LOW toggling high-low-high has to be performed after  
finishing the read mode session, in order to indicate the end of  
the READ command and prepare the Interface to the next  
command control Byte.  
To transfer bytes from consecutive addresses, SPI master has to  
keep the CS signal high and the SCLK clock has to be active as  
long as data need to be read.  
ams Datasheet  
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AS3933 − Detailed Description  
Figure 32:  
Reading of Single Register Byte  
CS  
SCLK  
X
X
0
1
A5  
A4  
A3  
A2  
A1  
A0  
SDI  
SDO  
X
X
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
SCLK rising  
edge Data is  
moved from  
Address  
SCLK rising  
edge Data is  
transfered from  
μC  
SCLK falling  
edge Data is  
transfered to  
μC  
CS falling  
edge signals  
end of READ  
Mode  
SCLK  
01 pattern  
indicates  
falling edge  
Data is  
READ Mode  
sampled  
<A5-A0>  
Figure 33:  
Send Direct COMMAND Byte  
CS  
SCLK  
X
X
1
1
C5  
C4  
C3  
C2  
C
1
C0  
SDI  
Two leading  
ONE indicate  
COMMAND  
Mode  
SCLK rising  
edge Data is  
transfered from  
μC  
SCLK  
falling edge  
Data is  
CS falling edge  
signals the end of  
sampled  
COMMAND Mode  
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AS3933 − Detailed Description  
SDI Timing  
Figure 34:  
SDI Timing Parameters  
Symbol  
TCSCLK  
TDCLK  
THCL  
Parameter  
Conditions  
Min Typ Max Units  
Time CS to Sampling Data  
Time Data to Sampling Data  
SCLK High Time  
150  
100  
70  
ns  
ns  
ns  
ns  
TCLK  
SCLK period  
166  
Time Sampling Data to CS  
down  
TCLKCS  
TCST  
150  
500  
ns  
ns  
CS Toggling time  
Figure 35:  
SDI Timing Diagram  
TCST  
CS  
t
t
TCSCLK  
SPI  
TDCLK  
SCLK  
SCL  
THCL  
TCLKCS  
t
TCLK  
ams Datasheet  
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AS3933 − Detailed Description  
Channel Amplifier and Frequency Detector  
Each of the 3 channels consists of a variable gain amplifier (VGA)  
with automatic gain control (AGC) and a frequency detector.  
When the AS3933 is in listening mode (waiting for RF signal)  
the gain of all channel amplifiers is set to maximum. The  
frequency detector counts the zero crossing of the amplified RF  
signal to detect the presence of the wanted carrier. As soon as  
the carrier is detected the AGC is enabled, the gain of the VGA  
is reduced and set to the right value. The RSSI (Received Signal  
Strength Indicator) represents how strong the input signal is  
and it is the inverse representation of the gain of the VGA. In  
fact, if for example the input signal is very strong the AGC will  
reduce the gain of the VGA. The gain reduction will correspond  
to a big RSSI, as it is the inverse of the gain setting of the VGA  
(small gain corresponds to a big RSSI and vice versa).  
The AS3933 is a pretty wide LF wake-up receiver and can work  
between 15 kHz and 150 kHz. Once the carrier frequency has  
been chosen the user must set the amplifier working in the  
appropriate frequency band using the bits R8<7:5>, as  
described in the Figure 36.  
It is possible to boost the gain of the amplifiers for +3dB with  
an improvement of the sensitivity, as shown in the Figure 14  
(R2<5>=1). The gain boost will increase the current  
consumption of 100nA (typ) per channel. In case the lowest  
frequency band is used (15kHz – 23 kHz) the gain boost is  
automatically enabled from the logic.  
It is possible to enable/disable individual channels, in case not  
all three channels are needed. This enables to reduce the  
current consumption by 1.5 μA (typ.) per channel.  
Frequency Detector / RSSI / Channel Selector  
The frequency detection is based on a zero crossing counter  
and uses the Clock Generator as time base. This counter counts  
the zero crossing of the input signal within a time window  
defined by the clock generator and if it matches to the expected  
value it enabled the AGC (the RSSI measurement can get  
started). The Clock Generator can be based either on the  
internal RC-oscillator or on the Crystal oscillator or on the  
external clock source. The details on the choice of the Clock  
Generator are discussed in the Clock Generator. The Clock  
Generator generates time windows equal to N times its period,  
where N depends on the operating frequency band, as shown  
in the Figure 36.  
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AS3933 − Detailed Description  
Figure 36:  
Bit Setting for the Operating Frequency Range and Time Windows Generation for the Frequency  
Detection  
R8<7>  
R8<6>  
R8<5>  
N
4
Operating Frequency Range [kHz]  
0
0
0
0
1
0
0
1
1
1
0
1
0
1
1
95-150  
65-95  
40-65  
23-40  
15-23  
6
10  
18  
14  
The frequency detection is successful if in two consecutive time  
windows the zero threshold counter detects M zero crossing,  
where M depends also on the operating frequency range. The  
frequency detection criteria can be tighter or more relaxed  
according to the setup described in R2<1:0> (see Figure 36).  
Figure 37:  
Tolerance Settings for Frequency Detection in the Bands  
23-150 kHz  
R2<1>  
R2<0>  
M
0
0
1
1
0
1
0
1
16 6  
16 4  
16 2  
n.a  
Figure 37 shows the value of M for the different tolerance  
settings for the operating frequency bands from 23 to 150 kHz.  
Figure 38 shows M in case the operating frequency range is the  
lowest one (15 to 23 kHz).  
Figure 38:  
Tolerance Settings for Frequency Detection in the Bands  
15-23 kHz  
R2<1>  
R2<0>  
M
0
0
1
1
0
1
0
1
8 3  
8 2  
8 1  
n.a  
ams Datasheet  
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AS3933 − Detailed Description  
The AGC starts working after the frequency detection. At the  
beginning the gain in the VGA is set to maximum and the AGC  
reduce it according to the received signal input level. The AGC  
needs maximum 35 carrier periods to settle, getting a stable  
RSSI.  
The AGC can operate in two modes:  
AGC down only (R1<5>=0)  
AGC up and down (R1<5>=1)  
If the AGC down only mode is selected, the AGC can only  
decrease the gain for the whole duration of the data reception;  
in this mode the system holds the RSSI peak.  
When the AGC up and down mode is selected, the RSSI can  
dynamically follow the input signal strength variation in both  
directions.  
The RSSI is available for all 3 channels at the same time and it  
is stored in 3 registers (R10<4:0>, R11<4:0>, R12<4:0>). Once  
the RSSI gets stable (maximum after 35 carrier periods after  
frequency detection) the channel selector checks which  
channel receives the strongest signal. The channel selector  
compares the RSSI on the active channels and freezes the AGC  
on the channels which have the smaller RSSI. From this time on  
the AGC is active only on the selected channel. It is possible to  
set things back having the AGC active on all channels just  
sending a clear_wake (sets the chip back to listening mode) or  
reset_RSSI (resets the ACG) direct command.  
Both AGC modes (only down or down and up) can also operate  
with time limitation. This option allows AGC operation only in  
time slot of 256ꢀs after the frequency detection (during carrier  
burst), then the RSSI is frozen till the wake-up or RSSI reset  
occurs (clear_wakeup or reset_RSSI).  
The RSSI is reset either with the direct command 'clear_wakeup'  
or 'reset_RSSI'. The 'reset_RSSI' command resets only the VGA  
setting but does not terminate wake-up frequency detection  
condition. This means that if the signal is still present the new  
AGC setting (RSSI) will appear not later than 35 LF carrier  
periods after the command was received. The AGC setting is  
reset during data receiving if for duration of 3 Manchester half  
symbols no carrier is detected. If the wake-up IRQ is cleared the  
chip will go back to listening mode.  
In case the maximum amplification at the beginning is a  
drawback (e.g. in noisy environment) it is possible to set a  
smaller starting gain on the amplifier, according to the  
Figure 39. In this way it is possible to reduce the false frequency  
detection.  
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AS3933 − Detailed Description  
Figure 39:  
Bit Setting of Gain Reduction  
R4  
R4  
R4  
R4  
Gain  
<3>  
<2>  
<1>  
<0>  
Reduction  
No gain  
reduction  
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
n.a.  
n.a.  
0 or 1  
0 or 1  
0 or 1  
0 or 1  
0 or 1  
0 or 1  
0 or 1  
-4dB  
-8dB  
-12dB  
-16dB  
-20dB  
-24dB  
Antenna Damper  
In case the chip needs to deal with higher field strengths the  
antenna damper can be enabled. The antenna damper consists  
of internal resistors which can be connected in parallel to the  
external resonator as shown in Figure 40. It is possible to enable  
the antenna damper with the bit R1<4> and the value of the  
resistor can be chosen with the bits R4<5:4>. The shunt resistors  
degrade the quality factor of the external resonator by reducing  
the signal at the input of the amplifier. In this way the resonator  
sees a smaller parallel resistance (in the band of interest) which  
degrades its quality factor in order to increase the linear range  
of the channel amplifier (the amplifier doesn't saturate in  
presence of bigger signals). Figure 40 shows the bit setup.  
Figure 40:  
Antenna Damper Bit Setup  
R4<5>  
R4<4>  
Shunt Resistor  
0
0
1
1
0
1
0
1
1 kΩ  
3 kΩ  
9 kΩ  
27 kΩ  
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AS3933 − Detailed Description  
Figure 41:  
Antenna Damper  
LF1P  
Channel  
Amplifier1  
L
C
R
LF2P  
LF3P  
Channel  
Amplifier2  
L
C
R
Channel  
Amplifier1  
L
C
R
LFN  
Demodulator / Data Slicer  
As soon as the AS3933 detects successfully the frequency and  
the RSSI has got stable the channel selector compares the RSSI  
on all active channels and connects the channel amplifier which  
has the biggest RSSI to the demodulator. The channel selector  
needs 32 RF carrier periods to take this decision. The output  
signal (amplified LF carrier) of selected channel is connected to  
the input of the demodulator.  
The demodulator takes the signal to base-band and recovers  
two signals from the amplified RF signal; a fast and a slow  
envelop. Those two signals are fed to the data slicer, which is a  
comparator with programmable hysteresis. At the output of the  
data slicer are streamed the digital received bits. A concept  
block diagram is shown in the Figure 42.  
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AS3933 − Detailed Description  
Figure 42:  
Concept Block Diagram  
Data Slicer  
Fast Envelop  
Slow Envelop  
Channel Amplifier  
Demodulator  
Figure 43:  
Envelop Detector Signals - Dynamic Threshold  
Fast Envelop  
(red)  
Slow Envelop  
(blue)  
The performance of the demodulator can be optimized  
according to bit rate and preamble length as described in  
Figure 44 and Figure 45.  
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AS3933 − Detailed Description  
Figure 44:  
Bit Setup of the Fast Envelope for Different Symbol Rates  
Symbol Rate  
R3<2> R3<1>  
R3<0>  
[Manchester  
Symbols/s]  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
4096  
2184  
1490  
1130  
910  
762  
655  
512  
On one hand the fast envelope's time constant ( R3<2:0>) needs  
to be adjusted to the desired symbol rate as shown in Figure 44.  
However, decreasing the fast envelope's time constant also  
means that more noise will be injected due to the wider band.  
On the other hand, the slow envelop signal acts as an average  
of the incoming data. Therefore, the bigger its time constant is,  
the better will be the noise rejection. Yet, a bigger time constant  
of the slow envelop (R3<5:3>) requires a longer preamble in  
order to settle to the correct value. The minimum preamble  
length as a function of the slow envelope's settings is given in  
Figure 45.  
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AS3933 − Detailed Description  
Figure 45:  
Minimum Required Preamble Lengths as Function of Slow  
Envelop Settings  
Minimum Preamble  
R3<5> R3<4>  
R3<3>  
Length [ms]  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.8  
1.15  
1.55  
1.9  
2.3  
2.65  
3
3.5  
Note(s) and/or Footnote(s):  
1. These times are minimum required, but it is recommended to prolong the  
preamble.  
With the bits R3<6> and R3<7> it is possible to change the  
hysteresis on the data slicer comparator (only positive, positive  
negative, 20mV, 40mV).  
The slow envelop signal (blue signal in Figure 43) represents  
the average of the demodulated signal, therefore acts as a  
reference signal for the data slicer. In case the chosen protocol  
has a duty cycle far away from 50% (for example in the NRZ  
protocol there can be several consecutive ones or zeros) the  
slow envelop signal would not be a stable reference signal for  
the data slicer. In this case the data slicer can also work with an  
absolute threshold (R1<7>), as shown in the Figure 46. Should  
the absolute threshold be enabled the bits R3<2:0> would not  
influence the performance. It is even possible to reduce the  
absolute threshold in case the environment is not particularly  
noisy (R2<7>).  
As the input signal may be damped due to physical influences  
of the transmitter environment, the symbol rate needs to be  
adapted (lowered) if absolute threshold is enabled to ensure a  
proper detection of the wake-up signal. The peak level of the  
signal should be reached within 1/3 of the symbol duration  
which is defined as two times the bit duration. The bit duration  
is defined in register R7 <4:0> as a function of the Clock  
Generator periods.  
ams Datasheet  
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AS3933 − Detailed Description  
Figure 46:  
Envelop Detector Signals - Absolute Threshold  
Fast Envelop  
(red)  
Absolute  
Threshold (blue)  
Data Slicer Output  
Correlator  
In order to prevent that the AS3933 wakes up the host system  
(MCU) from noise or disturbers (LF transmitter within the field)  
the internal correlator checks that the bit sequence delivered  
from the data slicer corresponds to stored pattern. The wanted  
pattern can be stored in the registers R5<7:0> and R6<7:0>. The  
data correlation is performed only if the correlator is enabled  
(R1<1>=1) and can start only after frequency detection.  
The pattern correlation is successful (Wake goes high) only if  
the bits sequence (pattern) and its timing (duration of the single  
bit) matches.  
Pattern: Bit and Symbol Definition in Manchester  
Code  
The AS3933 can correlate the incoming pattern without the  
help of an external unit (MCU). The chosen pattern must be  
Manchester encoded. In the Manchester code each “Symbol” is  
defined by a transition (high-to-low for 1 and low-to-high for  
0), therefore consists of two “bits. In the Figure 47 it is shown,  
as an example, how the encoding technique works. In this  
sequence a simple message made up by 3 symbols (1 0 1) is  
Manchester encoded. In the Manchester encoded bit stream  
there can not be three consecutive zeros or ones (in each  
symbol there is always a transition). This helps the receiver to  
recover the clock.  
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AS3933 − Detailed Description  
Figure 47:  
Manchester Encoding  
0
1
1
Symbol  
0
1
1
Bits  
0
0
1
OOK signal  
The bit duration is defined in the register R7<4:0> according to  
the Figure 48 as function of the Clock Generator periods.  
Figure 48:  
Bit Rate Setup  
Bit Duration in RTC  
R7<4>  
R7<3>  
R7<2>  
R7<1>  
R7<0>  
Clock Periods  
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
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AS3933 − Detailed Description  
Bit Duration in RTC  
Clock Periods  
R7<4>  
R7<3>  
R7<2>  
R7<1>  
R7<0>  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
The user can define the pattern to correlate in the registers  
R5<7:0> and R6<7:0> and can decide whether the stored  
pattern is a bit representation (16 Manchester bits corresponds  
to 8 Symbols) if R0<7>=0 or the symbol representation (16  
symbols corresponds to 32 bits) of the pattern if R0<7>=1. The  
number of different pattern is 2^SYM, where SYM is the number  
of Manchester symbols. In case the R5<7:0> and R6<7:0>  
represent the bit sequence of the pattern there are 256 different  
possible combinations, while in case they are the symbol  
representation there are 65536 different patterns.  
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AS3933 − Detailed Description  
Wake-Up Protocol  
The AS3933 can support different protocols:  
Frequency detection only (no pattern correlation)  
Single pattern detection  
• 16-bit pattern  
• 32-bit pattern  
Double pattern detection  
• 16-bits pattern  
• 32-bits pattern  
The wake-up state can be terminated either by the host system  
(MCU) with the direct command ‘clear_wake’ sent over SPI (see  
direct command details in Figure 29) or with a time-out option.  
In case the latter is used the host system (MCU) does not need  
to take any action to terminate the wake-up state and the chip  
is set back to listening mode automatically after a predefined  
time. It is possible to set the duration of the time-out with the  
register R7<7:5>, as shown in the Figure 49.  
Figure 49:  
Timeout Setup  
R7<7>  
R7<6>  
R7<5>  
Time Out  
disabled  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50 msec  
100 msec  
150 msec  
200 msec  
250 msec  
300 msec  
350 msec  
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AS3933 − Detailed Description  
Wake-Up Protocol: Frequency Detection Only  
Figure 50:  
Wake-Up Protocol Overview Without Pattern Detection  
Carrier Burst  
Data  
Carrier Burst  
DAT  
WAKE  
Clear_wake  
In case the pattern correlation is disabled (R1<1>=0) the  
AS3933 wakes up upon detection of the carrier frequency only  
as shown in Figure 50. The minimum duration of the carrier  
burst in order to ensure that AS3933 wakes up and the RSSI is  
settled is specified in the Figure 52. In addition the carrier burst  
does not have to be longer than 155 periods of the Clock  
Generator (Crystal oscillator or RCO or External Clock). As shown  
in the Figure 20, the AS3933 after the detection of the carrier  
goes directly from the Listening mode to Data receiving mode  
after settling the RSSI.  
Wake-Up Protocol: Pattern Detection Enabled  
In case the pattern correlation is enabled (R1<1>=1) the AS3933  
generates a wake-up interrupt if the wake-up protocol is  
fulfilled. The communication protocol consists of a carrier burst,  
a preamble (0101010…. ON/OFF modulated carrier) and the  
16-bit pattern. In case the double pattern option is enabled  
(R1<2>=1) the 16-bit pattern has to be repeated 2 times  
consequentially (2 times the same pattern). The signal on the  
WAKE pin goes high one bit after the end of the pattern and the  
data transmission can get started.  
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AS3933 − Detailed Description  
A graphic representation of the wake-up protocol is shown in  
the Figure 51.  
Figure 51:  
Wake-Up Protocol Overview if Pattern Detection is Enabled  
Carrier Burst  
Preamble  
Pattern  
Data  
Separation bit  
DAT  
WAKE  
Clear_wake  
The minimum length for the carrier burst depends on the  
operating frequency range (see Figure 36 bits R8<7:5>) and is  
described in the Figure 52.  
Figure 52:  
Minimum Duration of the Carrier Burst  
Operating Frequency  
Range [kHz]  
Minimum Duration of the  
Carrier Burst  
95-150  
65-95  
40-65  
23-40  
15-23  
16·Tclk+16Tcarr  
28·Tclk+16Tcarr  
52·Tclk+16Tcarr  
96·Tclk+16Tcarr  
92·Tclk+8Tcarr  
Note(s) and/or Footnote(s):  
1. Tclk is the period of the clock generator.  
2. Tcarr is the period of the carrier.  
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AS3933 − Detailed Description  
If the carrier burst is shorter than what has been specified in  
the Figure 52, then the frequency detection is not guaranteed.  
In order to fulfill the protocol the carrier burst must be shorter  
than 155 periods of the clock generator (crystal oscillator or  
RCO or external clock). The carrier burst must be followed by a  
separation bit and at least 6 bits preamble (101010). The  
separation bit must last as half Manchester symbol (see  
paragraph Pattern: Bit and Symbol Definition in Manchester  
Code). The preamble and the pattern cannot be longer than 30  
symbols in sum in case 16-bit pattern detection is enabled and  
46 symbols if the 32-bit pattern detection is enabled.  
In case the ON/OFF option is enabled (R0<5>=1) the minimum  
duration of the carrier burst must be prolonged by the OFF time  
defined in the R4<7:6>.  
Should the carrier burst be longer than what is defined in the  
Figure 52 or the number of preamble bits longer than what has  
been specified above a false wake-up event might be recorded  
in the register R13<7:0>.  
If the Scan Mode be enabled (R0<4>=1) the minimum duration  
of the carrier burst is defined in the Figure 53.  
Figure 53:  
Minimum Duration of the Carrier Burst in Case the Scanning  
Mode is Enabled  
Operating Frequency  
Range [kHz]  
Minimum Duration of the  
Carrier Burst  
95-150  
65-95  
40-65  
23-40  
15-23  
80·Tclk+16Tcarr  
92·Tclk+16Tcarr  
180·Tclk+16Tcarr  
224Tclk+16Tcarr  
220·Tclk+8Tcarr  
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AS3933 − Detailed Description  
Manchester Decoder and Clock Recovery  
In case the Manchester decoder is enabled (R1<3>=1) the  
AS3933 decodes the incoming Manchester bits automatically  
and the Manchester decoded data are displayed on the DAT pin  
and the Manchester recovered clock on the CL_DAT. The data  
coming out from the DAT pin are stable (and therefore can be  
acquired) on the rising edge of the CL_DAT clock, as shown in  
Figure 54.  
Figure 54:  
Synchronization of Data with the Manchester Recovered Clock  
CL_DAT  
DAT  
In case a Manchester timing violation happens, the signal on  
SPO goes high for a duration of 4 periods of internal clock  
(either crystal oscillator or RCO or external clock).  
False Wake-Up Register  
The wake-up strategy in the AS3933 is based on 2 steps:  
1. Frequency Detection: In this phase the frequency of the  
received signal is checked.  
2. Pattern Correlation: Here the pattern is demodulated  
and checked whether it corresponds to the valid one.  
If there is a disturber or noise capable to overcome the first step  
(frequency detection) without producing a valid pattern, then  
a false wake-up call happens. Each time this event is recognized  
a counter is incremented by one and the respective counter  
value is stored in a memory cell (false wake-up register). Thus,  
the microcontroller can periodically look at the false wake-up  
register, to get a feeling how noisy the surrounding  
environment is and can then react accordingly (e.g. reducing  
the gain of the LNA during frequency detection, set the AS3933  
temporarily to power down etc.), as shown in the Figure 55. The  
false wake-up counter is a useful tool to quickly adapt the  
system to any changes in the noise environment and thus avoid  
false wake-up events.  
ams Datasheet  
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AS3933 − Detailed Description  
Most wake-up receivers have to deal with environments that  
can rapidly change. By periodically monitoring the number of  
false wake-up events it is possible to adapt the system setup to  
the actual characteristics of the environment and enables a  
better use of the full flexibility of AS3933.  
Figure 55:  
Concept of the False Wake-Up Register Together with the System  
Wakeup  
Level 1  
Wakeup  
Level 2  
Pattern Correlator  
WAKE  
Frequency Detector  
Unsuccessful  
pattern  
correlation  
False wakeup  
register  
Register Setup  
READ FALSE WAKEUP REGISTER  
Microcontroller  
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AS3933 − Detailed Description  
Clock Generator  
The Clock Generator can be based on a crystal oscillator  
(R1<0>=1), the internal RC-oscillator (R1<0>=0), or an external  
clock source (R1<0>=1). The crystal oscillator has higher  
precision of the frequency with higher current consumption  
and needs three external components (crystal plus two  
capacitors). The RC-oscillator is completely integrated and can  
be calibrated to increase its precision. Should a digital clock  
already be available it can be applied directly to the XOUT pin  
(XIN to VDD).  
Regardless which clock generator is chosen, the frequency of  
the Clock Generator must be set according to the carrier  
frequency. Figure 56 shows the dependency of the Clock  
Generator frequency from the carrier frequency and operating  
frequency band.  
Figure 56:  
Clock Generator Frequency vs Frequency Band  
Carrier Frequency  
Clock Generator Frequency  
[kHz]  
14  
-----  
8
fRC = fcarr  
fRC = fcarr  
fRC = fcarr  
fRC = fcarr  
15 – 23  
23-40  
9
--  
8
5
--  
40-65  
8
3
--  
65 – 95  
95 - 150  
8
fcarr  
----------  
4
fRC  
=
It is possible to display the frequency of the clock generator on  
the CL_DAT pin writing R2<3:2>=11 and R16<7>=1.  
ams Datasheet  
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AS3933 − Detailed Description  
Crystal Oscillator  
In case the user decides to use the Crystal Oscillator as reference  
clock a 32.768 kHz quartz can be used in case the tolerance  
setting for the frequency detection is relaxed (R2<1:0>=00).  
Should this not be the case, then Figure 56 shows how the  
frequency of the quartz has to be chosen.  
If the AS3933 works in the bandwidth 23-40 kHz, then it is  
recommended not to use the XTAL oscillator to avoid any  
coupling between the input antennas and the quartz.  
Figure 57:  
Characteristics of XTAL  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
Crystal accuracy (initial)  
Crystal motional resistance  
Minimum Frequency  
Typical Frequency  
Overall accuracy  
120  
60  
ppm  
KΩ  
25  
32.768  
45  
kHz  
kHz  
kHz  
For 32.768 kHz crystal  
Crystal dependent  
Maximum Frequency  
Contribution of the  
oscillator to the frequency  
error  
5
ppm  
Start-up Time  
Duty cycle  
1
s
%
45  
50  
55  
65  
Current consumption  
Calibration time  
Current consumption  
300  
nA  
Periods of reference clock  
cycles  
nA  
650  
RC-Oscillator  
Figure 58:  
Characteristics of RCO  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
Calibration time  
Periods of reference clock  
65  
cycles  
nA  
Current consumption  
650  
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AS3933 − Detailed Description  
In case the pattern detection and the Manchester decoder are  
not enabled (R1<1>=0 and R1<3>=1) the calibration on the  
RC-oscillator is not needed. Should this not be the case, the  
RC-oscillator has to be calibrated. The calibration of the  
RC-oscillator can be done in two different ways:  
Over SPI, the host system (MCU) has to be able to provide  
65 clock pulses of a reference clock. In this case the host  
has to have a precise reference clock (quartz, resonator  
etc.).  
Using the internal calibration procedure based on the  
antenna resonator. Using this calibration method the  
RC-oscillator is automatically trimmed to the proper  
frequency, according to the operating frequency band.  
The precision of the calibration depends on the tolerances  
of the resonator of the first channel (LC connected to  
LF1P).  
RC-Oscillator: Calibration via SPI. The calibration gets started  
with the Calib_RCosc direct command. Since no non-volatile  
memory is available on the chip, the calibration must be done  
every time after battery replacement. Since the Clock Generator  
defines the time base of the frequency detection, the selected  
frequency depends on the carrier frequency. The choice of the  
reference clock frequency delivered by the host (MCU) is the  
same as the choice of the frequency in case the crystal oscillator  
is used and it is shown in the Figure 56.  
To trim the RC-Oscillator, set the chip select (CS) to high before  
sending the direct command Calib_RCosc over SPI. Then 65  
digital clock cycles of the reference clock (e.g.  
125kHz/4=31.25kHz) have to be sent on the clock bus (SCLK),  
as shown in Figure 59. After that the signal on the chip select  
(CS) has to be pulled down.  
The calibration is effective after the 65th reference clock edge  
and it will be stored in a volatile memory. In case the  
RC-oscillator is switched OFF or a power-on-reset happens (e.g.  
battery change) the calibration has to be repeated.  
Figure 59:  
RC-Oscillator Calibration via SPI  
65 clock cycles  
CS  
SCLK  
X
X
1
1
0
0
0
0
1
0
SDI  
DIRECT COMMAND  
Trim_osc  
REFERENCE CLOCK  
ams Datasheet  
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AS3933 − Detailed Description  
RC-Oscillator: Self Calibration. This procedure uses the  
LC-tank (antenna) connected to the channel 1 (LF1P) not as  
antenna but as resonator for an oscillator. The internal LC  
oscillator is therefore connected through a multiplexer to the  
external tank.  
The LC-oscillator generates a clock which corresponds to the  
resonance frequency of the LC-tank. In a typical application the  
user designs the external resonators such to set the resonance  
frequency of the external LC-tank as close as possible to the  
carrier frequency. The mathematical relation between the  
oscillation frequency and the LC time constant is:  
1
(EQ1)  
------------------------------  
FLC  
=
2 ⋅ π ⋅ L C  
Where:  
L is the inductance and  
C the capacitance of the external antenna  
To start the calibration the direct command Calib_RCO_LC must  
be sent over the SPI and as soon as the bit R14<7> is high, the  
RC-oscillator will be calibrated. The calibrated frequency of the  
RC-oscillator depends on the carrier frequency and is  
automatically set to better perform the frequency detection,  
according to the Figure 56.  
External Clock Source  
To clock the AS3933 with an external signal, the external clock  
generator (R2<6> =1) and the crystal oscillator (R1<0>=1) need  
to be enabled. As shown in the Figure 4 the clock can be directly  
applied on the pin XOUT while the pin XIN must be connected  
to VDD. The clock characteristics are summarized in Figure 60.  
Figure 60:  
Characteristics of External Clock  
Symbol  
Parameter  
Conditions  
Min  
0
Typ  
Max  
Units  
0.1* V  
VI  
Low level  
V
DD  
0.9* V  
V
Vh  
Tr  
High level  
Rise-time  
Fall-time  
V
DD  
DD  
3
μs  
μs  
Tf  
3
Note(s): In power down mode the external clock has to be set  
to a definite potential (VDD or ground).  
The frequency of the external clock source must be set  
according to the Figure 56.  
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AS3933 − Detailed Description  
Antenna Tuning  
The AS3933 offers the possibility to implement a fine antenna  
tuning. A block diagram shows how the tuning can be  
implemented with the help of the host system (MCU).  
Figure 61:  
Tuning Implementation  
MCU  
DAT  
SPI  
LC-Oscillator  
LF1P  
Channel  
Amplifier1  
L
C
R
LF2P  
LF3P  
Channel  
Amplifier2  
L
C
R
Channel  
Amplifier1  
L
C
R
LFN  
ams Datasheet  
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AS3933 − Detailed Description  
Each of the three antennas can be tuned with the internal  
capacitor banks. The capacitor can be connected or  
disconnected (adding or subtracting parallel capacitance to the  
external resonator) through registers R17<4:0>, R18<4:0> and  
R19<4:0>.  
Figure 62:  
Parallel Tuning Capacitance on the LF1P  
R17  
Capacitance on LF1P  
Adds 1pF to LF1P  
R17<0>=1  
R17<1>=1  
R17<2>=1  
R17<3>=1  
R17<4>=1  
Adds 2pF to LF1P  
Adds 4pF to LF1P  
Adds 8pF to LF1P  
Adds 16pF to LF1P  
Figure 63:  
Parallel Tuning Capacitance on the LF2P  
R18  
Capacitance on LF2P  
R18<0>=1  
R18<1>=1  
R18<2>=1  
R18<3>=1  
R18<4>=1  
Adds 1pF to LF2P  
Adds 2pF to LF2P  
Adds 4pF to LF2P  
Adds 8pF to LF2P  
Adds 16pF to LF2P  
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AS3933 − Detailed Description  
Figure 64:  
Parallel Tuning Capacitance on the LF3P  
R19  
Capacitance on LF3P  
R19<0>=1  
R19<1>=1  
R19<2>=1  
R19<3>=1  
R19<4>=1  
Adds 1pF to LF3P  
Adds 2pF to LF3P  
Adds 4pF to LF3P  
Adds 8pF to LF3P  
Adds 16pF to LF3P  
The Three channels can be tuned separately. The host system  
(MCU) has to connect the LC-oscillator to the antenna to  
measure the resonance frequency on the pin DAT. The host  
should measure the frequency on this pin and just changing  
register setting fine tune it to get it as close as possible to the  
nominal value of the carrier frequency. With the bits R16<2:0>  
it is possible to connect the LC-oscillator to the three different  
antennas.  
Channel Selection in Scanning Mode and  
ON/OFF Mode  
In case only 2 channels are active and one of the Low Power  
modes is enabled, then the channels 1 and 3 have to be active.  
If the chip works in ON-OFF mode and only one channel is active  
then the active channel has to be the channel 1. Both Low Power  
modes are not allowed to be enabled at the same time.  
ams Datasheet  
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AS3933 − Package Drawings & Markings  
The devices are available in a 16-pin TSSOP and QFN 4×4 16LD  
package.  
Package Drawings & Markings  
Figure 65:  
16-pin TSSOP Package Drawing  
AS3933 @  
YYWWMZZ  
RoHS  
Green  
Symbol  
Min  
-
Nom  
Max  
1.20  
0.15  
1.05  
0.30  
0.20  
5.10  
-
4.50  
-
0.75  
-
Symbol  
R
Min  
0.09  
0.09  
0.20  
0°  
-
-
-
-
Nom  
-
Max  
-
-
-
8°  
-
-
-
-
-
A
A1  
A2  
b
c
D
E
E1  
e
L
L1  
-
-
0.05  
0.80  
0.19  
0.09  
4.90  
-
4.30  
-
0.45  
-
R1  
S
-
-
-
1.00  
-
-
5.00  
6.40BSC  
4.40  
0.65BSC  
0.60  
1.00REF  
Θ1  
Θ2  
12REF  
12REF  
0.10  
0.10  
0.05  
0.20  
16  
Θ3  
aaa  
bbb  
ccc  
ddd  
N
-
-
-
Note(s) and/or Footnote(s):  
1. Dimensions & tolerancing conform to ASME Y14.5M-1994.  
2. All dimensions are in millimeters. Angles are in degrees.  
Figure 66:  
Marking: YYWWMZZ@  
YY  
WW  
M
ZZ  
@
Manufacturing  
Week  
Assembly plant  
identifier  
Assembly  
traceability code  
Year (i.e. 10 for 2010)  
Sublot identifier  
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AS3933 − Package Drawings & Markings  
Figure 67:  
QFN 4× 4 16LD Package Drawing  
AS3933 @  
YYWWXZZ  
Symbol  
Min  
0.80  
0.00  
Nom  
0.85  
Max  
0.90  
0.05  
A
A1  
A3  
b
0.203REF  
0.23  
0.18  
0.28  
D
E
D2  
E2  
e
4.00BSC  
4.00BSC  
2.70  
2.70  
0.65BSC  
0.40  
2.60  
2.60  
2.80  
2.80  
L
0.35  
0.00  
0.45  
0.10  
L1  
aaa  
bbb  
ccc  
ddd  
eee  
0.10  
0.10  
0.10  
0.05  
0.08  
Green  
RoHS  
Note(s) and/or Footnote(s):  
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.  
2. All dimensions are in millimeters. Angles are in degrees.  
3. Dimension b applies to metallized terminal and is measured between 0.25mm and 0.30mm from terminal tip. Dimension L1  
represents terminal full back from package edge up to 0.15mm is acceptable.  
4. Coplanarity applies to the exposed heat slug as well as the terminal.  
5. Radius on terminal is optional.  
Figure 68:  
Marking: YYWWXZZ@  
YY  
WW  
X
ZZ  
@
Manufacturing  
Week  
Assembly plant  
identifier  
Assembly  
traceability code  
Year (i.e. 10 for 2010)  
Sublot identifier  
ams Datasheet  
[v1-08] 2015-Sep-02  
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AS3933 − Ordering & Contact Information  
The devices are available as the standard products shown in  
Figure 69.  
Ordering & Contact Information  
Figure 69:  
Ordering Information  
Ordering  
Type  
Delivery Form(1)  
Marking  
Delivery Quantity  
Code  
AS3933-BTST  
AS3933-BQFT  
AS3933-BSWB  
16-pin TSSOP  
QFN (4×4) 16LD  
DoW  
AS3933  
AS3933  
AS3933  
7 inches Tape & Reel  
7 inches Tape & Reel  
Wafer Box  
1000 pcs/reel  
1000 pcs/reel  
ca. 8000 dice/wafer  
Note(s) and/or Footnote(s):  
1. Dry Pack: Moisture Sensitivity Level (MSL) = 3, according to IPC/JEDEC J-STD-033A.  
Buy our products or get free samples online at:  
www.ams.com/ICdirect  
Technical Support is available at:  
www.ams.com/Technical-Support  
Provide feedback about this document at:  
www.ams.com/Document-Feedback  
For further information and requests, e-mail us at:  
ams_sales@ams.com  
For sales offices, distributors and representatives, please visit:  
www.ams.com/contact  
Headquarters  
ams AG  
Tobelbaderstrasse 30  
8141 Unterpremstaetten  
Austria, Europe  
Tel: +43 (0) 3136 500 0  
Website: www.ams.com  
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AS3933 − RoHS Compliant & ams Green Statement  
RoHS: The term RoHS compliant means that ams AG products  
fully comply with current RoHS directives. Our semiconductor  
products do not contain any chemicals for all 6 substance  
categories, including the requirement that lead not exceed  
0.1% by weight in homogeneous materials. Where designed to  
be soldered at high temperatures, RoHS compliant products are  
suitable for use in specified lead-free processes.  
RoHS Compliant & ams Green  
Statement  
ams Green (RoHS compliant and no Sb/Br): ams Green  
defines that in addition to RoHS compliance, our products are  
free of Bromine (Br) and Antimony (Sb) based flame retardants  
(Br or Sb do not exceed 0.1% by weight in homogeneous  
material).  
Important Information: The information provided in this  
statement represents ams AG knowledge and belief as of the  
date that it is provided. ams AG bases its knowledge and belief  
on information provided by third parties, and makes no  
representation or warranty as to the accuracy of such  
information. Efforts are underway to better integrate  
information from third parties. ams AG has taken and continues  
to take reasonable steps to provide representative and accurate  
information but may not have conducted destructive testing or  
chemical analysis on incoming materials and chemicals. ams AG  
and ams AG suppliers consider certain information to be  
proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
ams Datasheet  
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AS3933 − Copyrights & Disclaimer  
Copyright ams AG, Tobelbader Strasse 30, 8141  
Copyrights & Disclaimer  
Unterpremstaetten, Austria-Europe. Trademarks Registered. All  
rights reserved. The material herein may not be reproduced,  
adapted, merged, translated, stored, or used without the prior  
written consent of the copyright owner.  
Devices sold by ams AG are covered by the warranty and patent  
indemnification provisions appearing in its General Terms of  
Trade. ams AG makes no warranty, express, statutory, implied,  
or by description regarding the information set forth herein.  
ams AG reserves the right to change specifications and prices  
at any time and without notice. Therefore, prior to designing  
this product into a system, it is necessary to check with ams AG  
for current information. This product is intended for use in  
commercial applications. Applications requiring extended  
temperature range, unusual environmental requirements, or  
high reliability applications, such as military, medical  
life-support or life-sustaining equipment are specifically not  
recommended without additional processing by ams AG for  
each application. This product is provided by ams AG “AS IS”  
and any express or implied warranties, including, but not  
limited to the implied warranties of merchantability and fitness  
for a particular purpose are disclaimed.  
ams AG shall not be liable to recipient or any third party for any  
damages, including but not limited to personal injury, property  
damage, loss of profits, loss of use, interruption of business or  
indirect, special, incidental or consequential damages, of any  
kind, in connection with or arising out of the furnishing,  
performance or use of the technical data herein. No obligation  
or liability to recipient or any third party shall arise or flow out  
of ams AG rendering of technical or other services.  
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AS3933 − Document Status  
Document Status  
Document Status  
Product Status  
Definition  
Information in this datasheet is based on product ideas in  
the planning phase of development. All specifications are  
design goals without any warranty and are subject to  
change without notice  
Product Preview  
Pre-Development  
Information in this datasheet is based on products in the  
design, validation or qualification phase of development.  
The performance and parameters shown in this document  
are preliminary without any warranty and are subject to  
change without notice  
Preliminary Datasheet  
Datasheet  
Pre-Production  
Production  
Information in this datasheet is based on products in  
ramp-up to full production or full production which  
conform to specifications in accordance with the terms of  
ams AG standard warranty as given in the General Terms of  
Trade  
Information in this datasheet is based on products which  
conform to specifications in accordance with the terms of  
ams AG standard warranty as given in the General Terms of  
Trade, but these products have been superseded and  
should not be used for new designs  
Datasheet (discontinued)  
Discontinued  
ams Datasheet  
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AS3933 − Revision Information  
Revision Information  
Changes from 1-07 (2015-Mar-02) to current revision 1-08 (2015-Sep-02)  
Page  
Updated text under Figure 45  
39  
Note(s) and/or Footnote(s):  
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.  
2. Correction of typographical errors is not explicitly mentioned.  
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AS3933 − Content Guide  
1
1
2
General Description  
Key Benefits & Features  
Applications  
Content Guide  
5
5
5
6
7
Pin Assignments  
TSSOP-16 Package  
Pin Description  
QFN-16 Package  
Pin Description  
8
9
Absolute Maximum Ratings  
Electrical Characteristics  
14 Typical Operating Characteristics  
16 Detailed Description  
17 Operating Modes  
18 Listening Mode  
20 Artificial Wake-Up  
20 Preamble Detection / Pattern Correlation  
20 Data Receiving  
21 System and Block Specification  
21 Register Table  
22 Register Table Description and Default Values  
25 Serial Peripheral Interface (SPI)  
30 SDI Timing  
31 Channel Amplifier and Frequency Detector  
31 Frequency Detector / RSSI / Channel Selector  
34 Antenna Damper  
35 Demodulator / Data Slicer  
39 Correlator  
39 Pattern: Bit and Symbol Definition in Manchester Code  
42 Wake-Up Protocol  
43 Wake-Up Protocol: Frequency Detection Only  
43 Wake-Up Protocol: Pattern Detection Enabled  
46 Manchester Decoder and Clock Recovery  
46 False Wake-Up Register  
48 Clock Generator  
49 Crystal Oscillator  
49 RC-Oscillator  
51 External Clock Source  
52 Antenna Tuning  
54 Channel Selection in Scanning Mode and ON/OFF Mode  
55 Package Drawings & Markings  
57 Ordering & Contact Information  
58 RoHS Compliant & ams Green Statement  
59 Copyrights & Disclaimer  
60 Document Status  
61 Revision Information  
ams Datasheet  
Page 63  
[v1-08] 2015-Sep-02  
Document Feedback  

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