AS5011_技术文档

AS5011

Data Sheet

Low Power Integrated Hall IC for Human Interface Applications

3 Key Features

1 General Description

ꢀ

2.7 to 3.6V operating voltage

The AS5011 is a complete Hall Sensor IC for smart

navigation key applications to meet the low power

requirements and host SW integration challenges for

products such as cell phones and smart handheld

devices.

Down to 1.8V peripheral supply voltage

Less than 200µA current consumption in Low

Power mode

Due to the on chip processing engine, system

designers are not tasked with integrating complex SW

algorithms on their host processor thus leading to

rapid development cycles.

The AS5011 single-chip IC includes 4 integrated Hall

sensing elements for detecting up to ±2mm lateral

displacement, high resolution ADC, XY coordinate

and motion detection engine combined with a smart

power management controller.

The X and Y positions coordinates and magnetic field

information for each Hall sensor element is

transmitted over a 2-wire I²C compatible interface to

the host processor.

ꢀ

Less than 50µA current consumption in Shutdown

mode

ꢀ

Lateral magnet movement radius up to 2mm

I²C interface up to 4MHz

Configurable interrupt output for motion detection

Three operating modes:

Shutdown mode

Low Power mode

Full Power mode

The AS5011 is available in

a

small 16-pin

5x5x0.55mm QFN package and specified over an

operating temperature of

-20 to +80°C.

4 Applications

The AS5011 is ideal for small factor manual input

devices in battery operated equipment, such as

Figure 1 Typical Arrangement of AS5011 and Axial

Magnet

ꢀ

Mobile phones

MP3 players

PDA’s

GPS receivers

Gaming consoles

2 Benefits

ꢀ

Complete system-on-chip

High reliability due to non-contact sensing

Low power consumption

Figure 2 AS5011 Block Diagram

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Revision 3.10

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AS5011

Data Sheet

5 Package and pinout

Figure 3: QFN-16 package and pinout (TOP view)

Pin#

Symbol

Type

Description

QFN16

1

SDA

SCL

DIO_OD

DI

I²C bus data

2

I²C bus clock

3

Sample

INTn

tb0

DI

Test pin. Connect to VSS

Interrupt output. Active LOW

Test pin. Leave unconnected

Test pin. Connect to VSS

Peripheral power supply, 1.8 ~ 3.6V

Test pin. Connect to VSS

Core power supply, 2.7 ~ 3.6V

Supply ground

4

DO_OD

AIO

-

5

6

tb1

7

tb2

8

tb3

9

Test coil

VDDp

ScanTest

VDD

VSS

10

11

12

13

14

15

16

Epad

S

DI

S

Wakeup

Extclk

Kill

DIO

-

Test pin. Leave unconnected

Center pad not connected

-

Table 1: AS5011 pinout in QFN-16 package

PIN Types:

S

DI

...

…

supply pad

digital input

digital output open drain DIO

AIO

DIO_OD...

...

analog I/O

digital input / output open drain

digital input / output

DO_OD ...

...

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Revision 3.10

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AS5011

Data Sheet

6 Operating the AS5011

6.1 Typical application

The AS5011 requires only a few external components in order to operate immediately when connected to the

host microcontroller.

Only 4 wires are needed for a simple application using a single power supply: two wires for power and two wires

for the I²C communication. A fifth connection can be added in order to send an interrupt to the host CPU when

the magnet is moving away from the center and to inform that a new valid coordinate can be read.

Figure 4: Electrical connection of AS5011 with microcontroller

6.2 XY coordinates interpretation

On Figure 5 the top view of the AS5011 is represented, with a round magnet (scaled) gliding over its surface. The

magnet can be placed under the sensor too, with the PCB between them.

•

Magnet on position 1:

The magnet is in its initial position, centered on the

sensor. The AS5011 is in Shutdown mode. X and Y

register values are (0,0)

•

Magnet on position 2:

The center of the magnet has been moved upon the

horizontal wakeup threshold Xp. An interrupt is sent

to the host microcontroller which sets the AS5011 to

Low Power mode. Wakeup thresholds are

programmable independently for the four directions.

•

Magnet on position 3:

The magnet is at the X and Y limit over the sensor

surface (2mm, 2mm) but still in range.

Figure 5: Position range of the magnet

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AS5011

Data Sheet

6.3 Magnet-chip surface airgap range

The relation between the magnet physical position and the resulting XY registers depends on the magnet

type/size/shape, and the airgap between the magnet and the top (or bottom) surface of the AS5011.

The measurements on Figure 6, Figure 6 Figure 8 have been processed with the AS5000-MA2H-1 d2x0.8mm

cylinder magnet, available on austriamicrosystems website. For those magnets, used in EasyPoint modules EP40

and EP50, the airgap range is typically 0~3mm.

The following diagrams show the relation between the X register value and the physical X coordinate (±2mm

horizontal displacement, 0mm is the center of the chip package) of the magnet at different airgaps. The resulting X

value range decreases when the airgap increases

The Y axis measurements are the same as the X axis ones.

80

60

40

30

Airgap 1500um

Airgap 500um

20

40

10

20

0

-2.500 -2.000 -1.500 -1.000 -500

0

500

1.000 1.500 2.000 2.500

0

-10

-20

-30

-40

-50

-2500 -2000 -1500 -1000

-500

0

500

1000

1500

2000

2500

-20

-40

-60

-80

Magnet position (um)

Figure 6: X register / X displacement (500um airgap)

Figure 7: X register / X displacement (1500um airgap)

30

Airgap 2500um

20

10

0

-2.500 -2.000 -1.500 -1.000 -500

0

500

1.000 1.500 2.000 2.500

-10

-20

-30

Magnet position (um)

Figure 8: X register / X displacement (2500um airgap)

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Revision 3.10

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AS5011

Data Sheet

6.4 Power modes

The AS5011 can operate in three different power modes, depending on the power consumption requirements of the

whole system.

Power Mode

Sleep phase

[0x76] Register Description

Power state between wakeups in Shutdown and Low Power modes

RC clock and analog part OFF

Digital part in static mode

Shutdown mode

1001_x00x

Default mode after power on

<50µA current consumption

LP_Pulsed = 1

LP_Active = 0

LP_Continue =

0

INT_wup_en =

1

Wake up every 80ms from Sleep phase

Hall elements in reduced power during wake up

RC clock ON

Interrupt LOW on INTn if the magnet is away from the center above the

Xp Xn Yp Yn threshold values (1)

Low Power mode

110x_100x

<200µA current consumption

Wake up every 20ms from Sleep phase

Hall elements in high power during wake up for better accuracy

RC clock ON

LP_Pulsed = 1

LP_Active = 1

LP_Continue =

0

Interrupt LOW on INTn when XY coordinates are ready to be read (1)

INT_act_en = 1

010x_y00x

Full Power mode

<8mA current consumption

Continuous read

LP_Pulsed = 0

LP_Active = 1

LP_Continue =

0

Hall elements in high power permanently

RC clock ON

Interrupt LOW on INTn when XY coordinates are ready to be read (1)

If INT_act_en = 1, after reading the XY coordinate, the next sample is

INT_act_en = y stored and won’t be updated until the next read of XY with interrupt

release.

If INT_act_int_en = 0, the last converted XY coordinate is read in real

time.

(1) The interrupt will be released to HIGH by reading the X_res_int or Y_res_int registers, or by switching the

device into a different power mode.

Table 2: Overview of typical power modes

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AS5011

Data Sheet

6.4.1 Shutdown mode

LP_Pulsed = 1, LP_Active = 0, LP_Continue = 0, INT_wup_en = 1 ꢁ[0x76] = 1001_x00x

This is the default operating mode when powering up the device, giving the lowest power consumption when the

whole system is in idle mode.

The analog part of the AS5011 is powered off (sleep mode). It is waked up every 80ms by an internal low power

logic, the hall sensors are read and the XY coordinate of the magnet is computed.

If the magnet position is above the threshold limits Xp, Xn, Yp, Yn, an interrupt will be generated on the INTn pin

and the device returns to sleep mode waiting for the next wake up after 80ms. As the host microcontroller receives

the interrupt, it can read the X and Y positions or configure the AS5011 to Low Power mode (see 6.4.2 below) in

order to track the magnet position until it returns to its initial position on the center.

INT_n remains LOW until X_int/Y_int have been read, or after a power mode change. The typical coordinates read

application after an interrupt is to read X first then Y_int.

6.4.2 Low Power mode

LP_Pulsed = 1, LP_Active = 1, LP_Continue = 0, INT_act_en = 1 ꢁ[0x76] = 110x_100x

The Low Power mode is used to track the magnet coordinates when it has been moved from its initial center

position.

The AS5011 is in sleep mode and is waked up every 20ms. As soon as the XY position of the magnet is computed,

an interrupt is sent on the INTn pin to the microcontroller indicating that a valid coordinate is available, then the

sensor returns to sleep mode waiting for the next wake up after 20ms. INT_n remains LOW until X_int/Y_int have

been read, or after a power mode change. The typical coordinates read application after an interrupt is to read X

first then Y_int.

This mode generates a higher power consumption than the Shutdown mode because of the faster sampling rate

and the higher hall sensor current to provide an optimal accuracy of the coordinates.

When the microcontroller detects that the magnet has returned to the initial center position, it has to configure the

AS5011 back to Shutdown mode (see 6.4.1).

6.4.3 Full Power mode

LP_Pulsed = 0, LP_Active = 1, LP_Continue = 0 ꢁ[0x76] = 010x_y00x

This mode allows the fastest coordinates reading. The sensor stays at its full capability, and never enters in sleep

mode.

The interrupt output goes LOW each time a new X and Y result has been computed and the valid data are ready to

be read by the host microcontroller. INT_n remains LOW until X_int/Y_int have been read, or after a power mode

change. The typical coordinates read application after an interrupt is to read X first then Y_int.

The INT_act_en bit (y):

•

If INT_act_en = 1, after reading the X_int or Y_int register, the next sampled XY coordinate is stored and

won’t be updated until the next read of X_int or Y_int.

•

If INT_act_en = 0, the last converted XY coordinate is read in real time.

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AS5011

Data Sheet

6.4.4 Switching the power modes

The following sequence example would be used for a typical mobile application (mobile phone, PDA, MP3 player):

Figure 9: Typical application sequence for mobile device

ꢂ

After a complete system power up, a soft reset should be applied by sending the I²C commands

[0x76] = 0x9A then [0x76] = 0x98.

ꢃ

If needed the host microcontroller writes the configuration once to the AS5011, for example the

inv_spinning register if the magnet is inverted (see 7.2) or the Xp Xn Yp Yn wakeup threshold values. The

cursor is normally centered X,Y = (0,0) as the magnet position 1 on Figure 5 . The AS5011 is in Shutdown

mode by default.

ꢄ

The cursor is moved by the user above the Yp threshold. An interrupt is generated and remains LOW

until an X_int/Y_int read or a power mode changing.

ꢅ

The microcontroller configures the AS5011 in Low Power mode ( [0x76] = 110x_100x ) for faster

reading. The interrupt is released to HIGH automatically by the power mode change.

ꢆ

Interrupts are generated automatically every 20ms when the XY coordinates are ready for reading.

The microcontroller reads the X register [0x41] then Y_int register [0x52] which releases INTn to HIGH.

During this phase, the cursor is still moving and stays out of the wakeup thresholds range.

ꢇ

If the microcontroller doesn’t read X_int or Y_int immediately after an interrupt, the INTn pin remains

LOW until the next read of X_int or Y_int. The last new converted (a new sample every 20ms) coordinate

will be transferred.

ꢈ

The cursor has been released by the user, and returns to the center of the AS5011 (magnet position

1 on Figure 5). The microcontroller will read X,Y = (0,0), and will configure the sensor to Shutdown mode

([0x76] = 1001_x00x).

Note:

Firmware application notes with source code example for AS5011 and EasyPoint modules are available on

www.austriamicrosystems.com website.

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Revision 3.10

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AS5011

Data Sheet

7 I²C interface

The AS5011 supports the 2-wire I²C protocol without “repeat start” as a slave device, the host CPU (master) has to

initiate the data transfers. The 7-bit device address of the AS5011 is ‘1000 000’.

The SDA signal is bidirectional and is used to read and write the serial data. The SCL signal is the clock generated

by the host CPU, to synchronize the SDA data in read and write mode. The maximum I²C clock frequency is 4MHz,

data are triggered on the rising edge of SCL.

7.1 Interface operation

For both read and write data transfers consist of three phases:

1. The master sends a START command by pulling down SDA while SCL remains high. Then the 7-bit device

address is sent followed by a read/write bit indicator. In READ mode (r/w = ‘1’), the slave has to send the

data from its selected register. In WRITE mode (r/w = ‘0’), the master writes the data in the selected

register. The slave has to acknowledge by sending ‘0’ after the r/w bit from the master.

2. The slave register is selected by the second data sent by the master. The address has an 8-bit format. The

slave has to acknowledge by sending ‘0’ after the bit R0.

3. The 8-bit data is transferred from/to the slave selected register, depending on the r/w bit. At the end of the

8-bit data transfer, the master (read mode) or the slave (write mode) acknowledges by sending ‘1’. The

transfer ends when the master sends a STOP command by sending a low to high transition while SCL

remains high.

The AS5011 does not send any acknowledge after the device address or register address (ACK remains High) in

the following cases:

- Wrong address

- Write access to a read-only register

Figure 10: I²C bus Read and Write operation

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AS5011

Data Sheet

7.2 I²C Registers

The following registers / functions are accessible over the serial I²C interface.

Acces

s

Register

size

Address

Format

Reset Value

Bit

Description

Control Register 1

LP_pulsed

LP_active

LP_continue

1

R/W 0x76

1

0

<7>

<6>

<5>

Low Power control register. See Table 2.

For test only. Must be 0.

Interrupt control register.

If set, the interrupt pin goes low in Shutdown mode when

the magnet has moved away from the center, above the

xp, xn, yp yn threshold values.

INT_wup_en

1

R/W 0x76

1

<4>

Interrupt control register.

If set, the interrupt pin goes LOW in Low Power mode

when a new XY value is ready for reading. Stores

coordinate until next read in full power mode,

For test only. Must be 0.

Soft Reset.

soft_rst = 0: normal mode

INT_act_en

ext_clk_en

soft_rst

1

R/W 0x76

1

0

<3>

<2>

<1>

soft_rst = 1: all registers return to their respective reset

value

Data valid.

data_valid

1

R

0x76

0

<0>

data_valid = 0: no valid XY coordinates

data_valid = 1: valid data are ready to be read

Control Register 2

Test 7

Test 6

Test 5

Test 4

ext_sample_en

rc_bias_on

1

R/W 0x75

0

1

0

<7>

<6>

<5>

<4>

<3>

<2>

For test only. Must be 0.

For test only. Must be 1.

For test only. Must be 0.

Invert the channel voltage.

Set if the magnet polarity is reversed.

For test only. Must be 0.

inv_spinning

pptrim_en

1

R/W 0x75

0

<1>

<0>

Range and position values

0x28

Xp

Xn

Yp

Yn

X

8

R/W 0x43 2’ comp

R/W 0x44 2’ comp

R/W 0x53 2’ comp

R/W 0x54 2’ comp

Wakeup threshold on the positive X direction.

(40d)

0xD8

(-40d)

0x28

(40d)

0xD8

(-40d)

Wakeup threshold on the negative X direction.

Wakeup threshold on the positive Y direction.

Wakeup threshold on the negative Y direction.

X position. The zero value means the horizontal center

position on the AS5011.

Y position. The zero value means the vertical center

position on the AS5011.

R

0x41 2’ comp

0x42 2’ comp

0x00

Y

X_res_int

Y_res_int

8

R

0x51 2’ comp

0x52 2’ comp

0x00

X position. Releases INT_n to ‘1’

Y position. Releases INT_n to ‘1’

Table 3: I²C Registers

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Revision 3.10

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AS5011

Data Sheet

8 Device specifications

8.1 Absolute maximum ratings (non operating)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only. Functional operation of the device at these or any other conditions beyond those

indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Parameter

DC supply voltage

Symbol

VDD

Min

-0.3

Max

Unit

V

Note

5

Peripheral supply voltage

VDDp

5

VDD +0.3

VDDp +0.3

3.6

V

Input pin voltage

Vin

-0.3

V

Input pin voltage

-

-100

-

Norm: JEDEC 78

Input current (latchup immunity)

Electrostatic discharge

I_scr

100

mA

kV

Norm: MIL 883 E method

3015

ESD

±1

Velocity=0, Multi Layer

PCB; JEDEC Standard

Testboard

Package Thermal Resistance

Θ_JA

-

30

°C/W

Total power dissipation

Storage temperature

P_t

36

mW

°C

T_strg

T_body

-55

5

125

260

Norm: IPC/JEDEC J-STD-

020C

Package body temperature

°C

Humidity non-condensing

85

%

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AS5011

Data Sheet

8.2 Operating conditions

(operating conditions: Tamb = -20 to +80°C, VDD = 3.3V)

Parameter

Symbol Min

VDD 2.7

Typ

Max

Unit

Note

Core Supply voltage

3.6

V

VDD

+0.3

open drain outputs : SCL, SDA,

INT/

Peripheral Supply voltage

VDDp 1.8

IDD_s

V

average current pin VDD

Current consumption on core

supply,

50

µA

pulsed current IDDf during t_conv

with period t_P,W

Shutdown mode

average current pin VDD

Current consumption on core

supply,

IDD_l

IDD_f

200

8

µA

pulsed current IDDf during t_conv

with period t_P,A

Low Power mode

Current consumption on core

supply,

mA

µA

continuous current pin VDD

Full Power mode

average current pin VDDp, 20ms

i²C polling, 47k pullup resistor on

SDA

Current consumption on IO supply IDDp

Polling clock rate, Shutdown mode t_P,W

1

65.6

16.4

80

20

94.4

23.6

ms

µs

internal

Polling clock rate, Low Power

mode

t_P,A

internal

Coordinate conversion time

t_conv

330 380 455

Full Power mode

vertical magnetic field at magnet

centre, measured at the chip

surface

dx

dy

lateral movement radius

±1.8

2

±2.3

3

mm

type of magnet

d

mm

cylindrical; axial magnetized

Hall array diameter

RH

2.2

vertical magnetic field at magnet

center; measured at chip surface

magnetic field strength

B_Z

30

120

+80

mT

°C

bit

Ambient temperature range

T_amb

-20

Magnetic field measurement

resolution

11

Internal

Resolution of XY displacement

IC package

8

over 2*dx and 2*dy axis

QFN16

5x5x0.55mm

100

nF

Ceramic capacitor VDD - VSS

Ceramic capacitor VDDp - VSS

Power supply filtering capacitors

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Revision 3.10

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AS5011

Data Sheet

8.3

Digital IO pads DC/AC characteristics

Parameter

Symbol

Min

Max

Unit

Note

Inputs: SCL, SDA (receiver)

High level input voltage

Low level input voltage

V_IH

0.7 *

VDDp

V

0.3 *

VDDp

VDDp ≥ 2.7V

VDDp < 2.7V

VDDp = 3.6V

V_IL

V

0.25 *

VDDp

Input leakage current

Capacitive load

I_LEAK

C_L

1

µA

pF

35

Outputs: INTn, SDA (transmitter)

High level output voltage

Low level output voltage

V_OH

V_OL

Open drain

VSS + 0.4

Leakage current 1 µA

-2mA

V

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Revision 3.10

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AS5011

Data Sheet

9 Package Drawings

DIM

(mm)

A

MIN

NOM

0.55

MAX

0.60

0.50

A1

b

0.152 REF

0.35

0.40

0.45

D

E

D1

E1

e

5.00 BSC

3.5

3.15

0.80 BSC

0.35

3.6

3.7

3.25

3.35

L

0.40

0.45

0.10

L1

0.00

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Revision 3.10

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AS5011

Data Sheet

10 Recommended footprint

DIM

(mm)

C1

C2

E

X1

X2

Y1

Y2

Typ

4.8

0.8

0.45

3.7

0.9

3.7

RED: Top layer (AS5011 side)

BLUE: Bottom layer (mechanics side)

YELLOW: Top overlay

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Revision 3.10

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AS5011

Data Sheet

Table of contents

1

2

3

4

5

6

General Description........................................................................................................................................ 1

Benefits.......................................................................................................................................................... 1

Key Features.................................................................................................................................................. 1

Applications ................................................................................................................................................... 1

Package and pinout........................................................................................................................................ 2

Operating the AS5011.................................................................................................................................... 3

Typical application ..................................................................................................................................... 3

XY coordinates interpretation..................................................................................................................... 3

Magnet-chip surface airgap range.............................................................................................................. 4

Power modes............................................................................................................................................. 5

I²C interface ................................................................................................................................................... 8

Interface operation..................................................................................................................................... 8

I²C Registers.............................................................................................................................................. 9

Device specifications.................................................................................................................................... 10

Absolute maximum ratings (non operating) .............................................................................................. 10

Operating conditions................................................................................................................................ 11

Digital IO pads DC/AC characteristics...................................................................................................... 12

Package Drawings ....................................................................................................................................... 13

Recommended footprint ............................................................................................................................... 14

6.1

6.2

6.3

6.4

7

8

7.1

7.2

8.1

8.2

8.3

9

10

Table of contents .................................................................................................................................................. 15

Revision History.................................................................................................................................................... 15

Revision History

Revision

Date

Description

3.10

November.3.2009

•

Added recommended footprint

Added 0x75 register description

Added AS5000-MA2H-1 Magnet reference

QFN 5x5x0.55mm package

I²C @ 4MHz max.

3.6

3.5

July. 3. 2009

June. 8.2009

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Revision 3.10

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AS5011

Data Sheet

Copyrights

translated, stored, or used without the prior written consent of the copyright owner.

All products and companies mentioned are trademarks or registered trademarks of their respective companies.

Disclaimer

Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions

appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by

description regarding the information set forth herein or regarding the freedom of the described devices from patent

infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and

without notice. Therefore, prior to designing this product into a system, it is necessary to check with

austriamicrosystems AG for current information. This product is intended for use in normal commercial

applications. Applications requiring extended temperature range, unusual environmental requirements, or high

reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not

recommended without additional processing by austriamicrosystems AG for each application.

The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,

austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited

to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special,

incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or

use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of

austriamicrosystems AG rendering of technical or other services.

Contact Information

Headquarters

austriamicrosystems AG

A-8141 Schloss Premstaetten, Austria

Tel: +43 (0) 3136 500 0

Fax: +43 (0) 3136 525 01

For Sales Offices, Distributors and Representatives, please visit:

http://www.austriamicrosystems.com/contact

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型号：	AS5011
厂家：	AMS(艾迈斯)
描述：	Low Power Integrated Hall IC for Human Interface Applications 低功耗集成霍尔IC，适用于人机界面的应用
文件：	总16页 (文件大小：546K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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