RFP-10-50TVV [ANAREN]
RF/Microwave Termination, 0MHz Min, 4000MHz Max, 50ohm;
| 型号： | RFP-10-50TVV |
| 厂家： | 
ANAREN MICROWAVE |
| 描述： | RF/Microwave Termination, 0MHz Min, 4000MHz Max, 50ohm 射频 微波 |
| 文件： | 总2页 (文件大小：492K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Model RFP-10-50TVV
Flanged Terminations
10 Watts, 50 Ω
General Specifications
Resistive Element:
Thick film
Substrate:
Cover:
Beryllium oxide ceramic
Alumina ceramic
Mounting Flange:
Copper, nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005” thk)
Features
• DC - 4.0 GHz
Electrical Specifications
• 10 Watts
Resistance Value:
Frequency Range:
Power:
50 ohms, 5%
DC - 4.0 GHz
10 Watts
1.25:1
• BeO Ceramic
• Welded Silver Leads
V.S.W.R.:
• Non-Nichrome Resistive
Element
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15” minimum.
• Low VSWR
Specifications subject to change without notice.
• 100% Tested
Outline Drawing
.108
.200
.065
.100
.050
.116 DIA. THRU
(2 PLACES)
.100
.500
.250
50
.300
.058
.100
.130
VER. 12/5/01
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Model RFP-10-50TVV
Typical Performance
Suggested Mounting Procedures
Power Derating
.025 MIN.
(2 PLACES)
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
100
NOT RECOMMENDED APPLICATION
SCALE: NONE
SUGGESTED STRESS RELIEF METHODS
SCALE: NONE
75
50
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
25
0
2. Drill & tap the heatsink for the appropriate thread size to be
used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001” max. thickness).
25
50
75
100
125
150
CASE TEMPERATURE — °C
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
2
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
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