X3C26E2-03P [ANAREN]

30 dB Directional Coupler;
X3C26E2-03P
型号: X3C26E2-03P
厂家: ANAREN MICROWAVE    ANAREN MICROWAVE
描述:

30 dB Directional Coupler

文件: 总22页 (文件大小:671K)
中文:  中文翻译
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
30 dB Directional Coupler  
Description  
TheX3C26P1ꢁ30Sisalowprofile,highperformance30dBdirectionalꢀ  
couplerꢀ inꢀ aꢀ newꢀ easyꢀ toꢀ use,ꢀ manufacturingꢀ friendlyꢀ surfaceꢀ mountꢀ  
package.ꢀ Itꢀ isꢀ designedꢀ forꢀ WIMAXꢀ andꢀ LTEꢀ bandꢀ applications.ꢀ Theꢀ  
X3C26P1ꢁ30Sꢀ isꢀ designedꢀ particularlyꢀ forꢀ powerꢀ andꢀ frequencyꢀ  
detection,ꢀ asꢀ wellꢀ asꢀ forꢀ VSWRꢀ monitoring,ꢀ whereꢀ tightlyꢀ controlledꢀ  
couplingꢀandꢀlowꢀinsertionꢀlossꢀisꢀrequired.ꢀItꢀcanꢀbeꢀusedꢀinꢀhighꢀpowerꢀ  
applicationsꢀupꢀtoꢀ200ꢀWatts.ꢀ  
Partsꢀhaveꢀbeenꢀsubjectedꢀtoꢀrigorousꢀqualificationꢀtestingꢀandꢀtheyꢀareꢀ  
manufacturedꢀ usingꢀ materialsꢀ withꢀ coefficientsꢀ ofꢀ thermalꢀ expansionꢀ  
(CTE)compatiblewithcommonꢀsubstratesꢀsuchꢀasꢀFR4,ꢀGꢁ10,ꢀRFꢁ35,ꢀ  
RO4003ꢀ andꢀ polyimide.ꢀ Producedꢀ withꢀ 6ꢀ ofꢀ 6ꢀ RoHSꢀ compliantꢀ tinꢀ  
immersionꢀfinish  
Electrical Specifications **  
Features:  
Mean  
Coupling  
Insertion  
Loss  
Frequency  
VSWR  
Directivity  
2300 - 2900 MHz  
WIMAX and LTE  
High Power  
Very Low Loss  
Tight Coupling  
High Directivity  
Production Friendly  
Tape and Reel  
Lead Free  
MHz  
dB  
dB Max  
Max : 1  
dB Min  
2300ꢀ–ꢀ2900ꢀ 30.0ꢀ±ꢀ1.00ꢀ  
0.10ꢀ  
0.05ꢀ  
1.15ꢀ  
1.12ꢀ  
20ꢀ  
22ꢀ  
2500ꢀ–ꢀ2700ꢀ  
30.0ꢀ±ꢀ0.80ꢀ  
Frequency  
Sensitivity  
Operating  
Temp.  
Power  
ΘJC  
Avg. CW  
Watts  
dB Max  
ºC/Watt  
ºC  
±ꢀ0.25ꢀ  
±ꢀ0.10ꢀ  
200  
200ꢀ  
30  
30ꢀ  
ꢁ55ꢀtoꢀ+95ꢀ  
ꢁ55ꢀtoꢀ+95ꢀ  
**SpecificationbasedonperformanceofunitproperlyinstalledonAnarenTestBoard61015ꢁ0001.Refertoꢀ  
Specificationsꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.ꢀꢀReferꢀtoꢀparameterꢀdefinitionsꢀforꢀdetails.ꢀ  
Mechanical Outline  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀ  
andꢀReelꢀforꢀPickꢀandꢀ  
PlaceꢀManufacturing.  
 
Europe:ꢀ  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Directional Coupler Pin Configuration  
TheꢀX3C26P1ꢁ30SꢀhasꢀanꢀorientationꢀmarkerꢀtoꢀdenoteꢀPinꢀ1.ꢀꢀOnceꢀportꢀoneꢀhasꢀbeenꢀidentifiedꢀtheꢀotherꢀportsꢀareꢀ  
knownꢀautomatically.ꢀꢀPleaseꢀseeꢀtheꢀchartꢀbelowꢀforꢀclarification:ꢀꢀ  
30dB Coupler Pin Configuration  
Pin 1  
Inputꢀ  
Directꢀ  
Pin 2  
Directꢀ  
Inputꢀ  
Pin 3  
Isolatedꢀ  
Coupledꢀ  
Pin 4  
Coupledꢀ  
Isolatedꢀ  
Note:ꢀTheꢀdirectꢀportꢀhasꢀaꢀDCꢀconnectionꢀtoꢀtheꢀinputꢀportꢀandꢀtheꢀcoupledꢀportꢀhasꢀaꢀDCꢀconnectionꢀtoꢀtheꢀ  
isolatedꢀport.ꢀꢀ  
ForꢀoptimumꢀILꢀandꢀpowerꢀhandlingꢀperformance,ꢀuseꢀPinꢀ1ꢀorꢀPinꢀ2ꢀasꢀinputs.ꢀꢀ  
ꢀꢀ  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
Europe:  
ꢀ(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀandꢀ  
ReelꢀforꢀPickꢀandꢀPlaceꢀ  
Manufacturing.  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Insertion Loss and Power Derating Curves  
TypicalꢀInsertionꢀLossꢀDeratingꢀCurveꢀforꢀX3C26P1ꢁ30  
0
X3C26P1ꢁ30ꢀPowerꢀDeratingꢀCurve  
400  
350  
300  
250  
200  
150  
100  
50  
typicalꢀinsertionꢀlossꢀ(f=2700Mhz)  
typicalꢀinsertionꢀlossꢀ(f=2900Mhz)  
ꢁ0.005  
2300ꢀꢁꢀ2900Mhz  
ꢁ0.01  
ꢁ0.015  
ꢁ0.02  
ꢁ0.025  
ꢁ0.03  
0
95  
ꢁ100  
ꢁ50  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
MountingꢀInterfaceꢀTemperatureꢀ(oC)  
TemperatureꢀofꢀtheꢀPartꢀ(oC)  
Insertion Loss Derating:  
Power Derating:  
Theꢀ insertionꢀ loss,ꢀ atꢀ aꢀ givenꢀ frequency,ꢀ ofꢀ aꢀ groupꢀ ofꢀ Theꢀ powerꢀ handlingꢀ andꢀ correspondingꢀ powerꢀ deratingꢀ  
plotsꢀ areꢀ aꢀ functionꢀ ofꢀ theꢀ thermalꢀ resistance,ꢀ mountingꢀ  
surfaceꢀ temperatureꢀ (baseꢀ plateꢀ temperature),ꢀ maximumꢀ  
continuousoperatingtemperatureofthecoupler,andtheꢀ  
thermalꢀ insertionꢀ loss.ꢀ ꢀ Theꢀ thermalꢀ insertionꢀ lossꢀ isꢀ  
definedꢀinꢀtheꢀPowerꢀHandlingꢀsectionꢀofꢀtheꢀdataꢀsheet.ꢀꢀꢀ  
Asꢀ theꢀ mountingꢀ interfaceꢀ temperatureꢀ approachesꢀ theꢀ  
maximumꢀ continuousꢀ operatingꢀ temperature,ꢀ theꢀ powerꢀ  
handlingꢀdecreasesꢀtoꢀzero.ꢀ  
couplersꢀ isꢀ measuredꢀ atꢀ 25°Cꢀ andꢀ thenꢀ averaged.ꢀ ꢀ Theꢀ  
measurementsꢀ areꢀ performedꢀ underꢀ smallꢀ signalꢀ  
conditionsꢀ (i.e.ꢀ usingꢀ aꢀ Vectorꢀ Networkꢀ Analyzer).ꢀ ꢀ Theꢀ  
processꢀisꢀrepeatedꢀatꢀ85°Cꢀandꢀ150°C.ꢀꢀAꢀbestꢁfitꢀlineꢀforꢀ  
theꢀ measuredꢀ dataꢀ isꢀ computedꢀ andꢀ thenꢀ plottedꢀ fromꢀ ꢁ  
55°Cꢀtoꢀ150°C.ꢀ  
Ifꢀ mountingꢀ temperatureꢀ isꢀ greaterꢀ thanꢀ 95°C,ꢀ Xingerꢀ  
couplerwillꢀperformꢀreliablyꢀasꢀlongꢀasꢀtheꢀinputꢀpowerꢀisꢀ  
deratedꢀtoꢀtheꢀcurveꢀabove.  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀ  
andꢀReelꢀforꢀPickꢀandꢀ  
PlaceꢀManufacturing.  
 
Europe:ꢀ  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Typical Performance (-55°C, 25°C and 95°C): 2300-2900 MHz  
ReturnꢀLossꢀforꢀX3C26P1ꢁ30S(Feedingꢀport1)  
ReturnꢀLossꢀforꢀX3C26P1ꢁ30S(Feedingꢀport2)  
0
ꢁ10  
ꢁ20  
ꢁ30  
ꢁ40  
ꢁ50  
ꢁ60  
ꢁ70  
0
ꢁ10  
ꢁ20  
ꢁ30  
ꢁ40  
ꢁ50  
ꢁ60  
ꢁ70  
25ºC  
ꢁ55ºC  
95ºC  
25ºC  
ꢁ55ºC  
95ºC  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
Frequencyꢀ(Mhz)  
Frequencyꢀ(Mhz)  
ReturnꢀLossꢀforꢀX3C26P1ꢁ30S(Feedingꢀport3)  
ReturnꢀLossꢀforꢀX3C26P1ꢁ30S(Feedingꢀport4)  
0
0
25ºC  
25ºC  
ꢁ55ºC  
95ºC  
ꢁ55ºC  
95ºC  
ꢁ10  
ꢁ10  
ꢁ20  
ꢁ30  
ꢁ40  
ꢁ50  
ꢁ60  
ꢁ70  
ꢁ20  
ꢁ30  
ꢁ40  
ꢁ50  
ꢁ60  
ꢁ70  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
Frequencyꢀ(Mhz)  
Frequencyꢀ(Mhz)  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
Europe:  
ꢀ(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀandꢀ  
ReelꢀforꢀPickꢀandꢀPlaceꢀ  
Manufacturing.  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Typical Performance (-55°C, 25°C and 95°C): 2300-2900MHz  
CouplingꢀforꢀX3C26P1ꢁ30S(Feedingꢀport1)  
DirectivityꢀforꢀX3C26P1ꢁ30S(Feedingꢀport1)  
ꢁ29  
ꢁ29.2  
ꢁ29.4  
ꢁ29.6  
ꢁ29.8  
ꢁ30  
0
ꢁ10  
ꢁ20  
ꢁ30  
ꢁ40  
ꢁ50  
ꢁ60  
25ºC  
ꢁ55ºC  
95ºC  
25ºC  
ꢁ55ºC  
95ºC  
ꢁ30.2  
ꢁ30.4  
ꢁ30.6  
ꢁ30.8  
ꢁ31  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
Frequencyꢀ(Mhz)  
Frequencyꢀ(Mhz)  
InsertionꢀLossꢀforꢀX3C26P1ꢁ30S(Feedingꢀport1)  
TransmissionꢀLossꢀforꢀX3C26P1ꢁ30S(Feedingꢀport1)  
0
0
25ºC  
25ºC  
ꢁ55ºC  
95ºC  
ꢁ55ºC  
95ºC  
ꢁ0.02  
ꢁ0.02  
ꢁ0.04  
ꢁ0.06  
ꢁ0.08  
ꢁ0.1  
ꢁ0.04  
ꢁ0.06  
ꢁ0.08  
ꢁ0.1  
ꢁ0.12  
ꢁ0.14  
ꢁ0.16  
ꢁ0.18  
ꢁ0.2  
ꢁ0.12  
ꢁ0.14  
ꢁ0.16  
ꢁ0.18  
ꢁ0.2  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
2300  
2400  
2500  
2600  
2700  
2800  
2900  
Frequencyꢀ(Mhz)  
Frequencyꢀ(Mhz)  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀ  
andꢀReelꢀforꢀPickꢀandꢀ  
PlaceꢀManufacturing.  
 
Europe:ꢀ  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Definition of Measured Specifications  
Parameter  
Definition  
Mathematical Representation  
V
max  
Theꢀimpedanceꢀmatchꢀofꢀ  
theꢀcouplerꢀtoꢀaꢀ50ꢀ  
system.ꢀAꢀVSWRꢀofꢀ1:1ꢀisꢀ  
optimal.ꢀ  
VSWRꢀ=ꢀ  
V
min  
VSWR  
Vmaxꢀ=ꢀvoltageꢀmaximaꢀofꢀaꢀstandingꢀwaveꢀ  
(Voltage Standing Wave Ratio)  
Vminꢀ=ꢀvoltageꢀminimaꢀofꢀaꢀstandingꢀwaveꢀ  
Theꢀimpedanceꢀmatchꢀofꢀ  
theꢀcouplerꢀtoꢀaꢀ50ꢀ  
system.ꢀꢀReturnꢀLossꢀisꢀ  
anꢀalternateꢀmeansꢀtoꢀ  
expressꢀVSWR.ꢀ  
VSWR +1  
VSWR -1  
Return Loss  
ReturnꢀLossꢀ(dB)=ꢀ20logꢀ  
ꢀꢀ  
Atꢀaꢀgivenꢀfrequencyꢀ(ωn),ꢀ  
couplingꢀisꢀtheꢀinputꢀ  
P (ωn  
)
in  
Couplingꢀ(dB)ꢀ=ꢀ  
ꢀꢀ  
C(ω  
n ) = 10log  
P (ωn  
)
cpl  
powerꢀdividedꢀbyꢀtheꢀ  
powerꢀatꢀtheꢀcoupledꢀ  
port.ꢀꢀMeanꢀcouplingꢀisꢀ  
theꢀaverageꢀvalueꢀofꢀtheꢀ  
couplingꢀvaluesꢀinꢀtheꢀ  
band.ꢀꢀNꢀisꢀtheꢀnumberꢀofꢀ  
frequenciesꢀinꢀtheꢀband.ꢀ  
Mean Coupling  
N
C(ωn  
)
n=1  
MeanꢀCouplingꢀ(dB)ꢀ=ꢀ  
N
Theꢀinputꢀpowerꢀdividedꢀ  
byꢀtheꢀsumꢀofꢀtheꢀpowerꢀ  
atꢀtheꢀtwoꢀoutputꢀports.ꢀ  
Theꢀinputꢀpowerꢀdividedꢀ  
byꢀtheꢀpowerꢀatꢀtheꢀdirectꢀ  
port.ꢀ  
P
in  
10logꢀ  
Insertion Loss  
P
cpl +  
P
direct  
P
in  
Transmission Loss  
10logꢀ  
P
direct  
Theꢀpowerꢀatꢀtheꢀꢀ  
P
Directivity  
10logꢀ cpl ꢀ  
coupledꢀportꢀdividedꢀbyꢀ  
theꢀpowerꢀatꢀtheꢀꢀisolatedꢀ  
port.ꢀ  
P
iso  
Theꢀdecibelꢀdifferenceꢀ  
betweenꢀtheꢀmaximumꢀinꢀ  
bandꢀcouplingꢀvalueꢀandꢀ  
theꢀmeanꢀcoupling,ꢀandꢀ  
theꢀdecibelꢀdifferenceꢀ  
betweenꢀtheꢀminimumꢀinꢀ  
bandꢀcouplingꢀvalueꢀandꢀ  
theꢀmeanꢀcoupling.ꢀ  
MaxꢀCouplingꢀ(dB)ꢀ–ꢀMeanꢀCouplingꢀ(dB)ꢀ  
Frequency Sensitivity  
andꢀ  
MinꢀCouplingꢀ(dB)ꢀ–ꢀMeanꢀCouplingꢀ(dB)ꢀ  
ꢀꢀ  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
Europe:  
ꢀ(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀandꢀ  
ReelꢀforꢀPickꢀandꢀPlaceꢀ  
Manufacturing.  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Notes on RF Testing and Circuit Layout  
TheꢀX3C26P1ꢁ30SꢀSurfaceꢀMountꢀCouplersꢀrequireꢀtheꢀuseꢀofꢀaꢀtestꢀfixtureꢀforꢀverificationꢀofꢀRFꢀperformance.ꢀThisꢀ  
testꢀ fixtureꢀ isꢀ designedꢀ toꢀ evaluateꢀ theꢀ couplerꢀ inꢀ theꢀ sameꢀ environmentꢀ thatꢀ isꢀ recommendedꢀ forꢀ installation.ꢀ  
Enclosedꢀinsideꢀtheꢀtestꢀfixture,ꢀisꢀaꢀcircuitꢀboardꢀthatꢀisꢀfabricatedꢀusingꢀtheꢀrecommendedꢀfootprint.ꢀTheꢀpartꢀbeingꢀ  
testedꢀisꢀplacedꢀintoꢀtheꢀtestꢀfixtureꢀandꢀpressureꢀisꢀappliedꢀtoꢀtheꢀtopꢀofꢀtheꢀdeviceꢀusingꢀaꢀpneumaticꢀpiston.ꢀAꢀfourꢀ  
portꢀVectorꢀNetworkꢀAnalyzerꢀisꢀconnectedꢀtoꢀtheꢀfixtureꢀandꢀisꢀusedꢀtoꢀmeasureꢀtheꢀSꢁparametersꢀofꢀtheꢀpart.ꢀWorstꢀ  
caseꢀvaluesꢀforꢀeachꢀparameterꢀareꢀfoundꢀandꢀcomparedꢀtoꢀtheꢀspecification.ꢀTheseꢀworstꢀcaseꢀvaluesꢀareꢀreportedꢀtoꢀ  
theꢀtestꢀequipmentꢀoperatorꢀalongꢀwithꢀaꢀPassꢀorꢀFailꢀflag.ꢀSeeꢀtheꢀillustrationsꢀbelow.ꢀ  
Test Board  
30 dB  
In Fixture  
Test Board  
Test Station  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀ  
andꢀReelꢀforꢀPickꢀandꢀ  
PlaceꢀManufacturing.  
 
Europe:ꢀ  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Theꢀeffectsꢀofꢀtheꢀtestꢀfixtureꢀonꢀtheꢀmeasuredꢀdataꢀmustꢀbeꢀminimizedꢀinꢀorderꢀtoꢀaccuratelyꢀdetermineꢀtheꢀ  
performanceꢀ ofꢀ theꢀ deviceꢀ underꢀ test.ꢀ Ifꢀ theꢀ lineꢀ impedanceꢀ isꢀ anythingꢀ otherꢀ thanꢀ 50ꢀ and/orꢀ thereꢀ isꢀ aꢀ  
discontinuityꢀatꢀtheꢀmicrostripꢀtoꢀSMAꢀinterface,ꢀthereꢀwillꢀbeꢀerrorsꢀinꢀtheꢀdataꢀforꢀtheꢀdeviceꢀunderꢀtest.ꢀTheꢀ  
testꢀ environmentꢀ canꢀ neverꢀ beꢀ “perfect”,ꢀ butꢀ theꢀ procedureꢀ usedꢀ toꢀ buildꢀ andꢀ evaluateꢀ theꢀ testꢀ boardsꢀ  
(outlinedbelow)demonstratesanattempttoꢀminimizeꢀtheꢀerrorsꢀassociatedwithtestingthesedevices.Theꢀ  
lowerꢀ theꢀ signalꢀ levelꢀ thatꢀ isꢀ beingꢀ measured,ꢀ theꢀ moreꢀ impactꢀ theꢀ fixtureꢀ errorsꢀ willꢀ haveꢀ onꢀ theꢀ data.ꢀ  
ParameterssuchasReturnLossandIsolation/Directivity,whicharespecifiedaslowas27dBandtypicallyꢀ  
measureꢀatꢀmuchꢀlowerꢀlevels,ꢀwillꢀpresentꢀtheꢀgreatestꢀmeasurementꢀchallenge.ꢀ  
Theꢀtestꢀfixtureꢀerrorsꢀintroduceꢀanꢀuncertaintyꢀtoꢀtheꢀmeasuredꢀdata.ꢀFixtureꢀerrorsꢀcanꢀmakeꢀtheꢀperformanceꢀofꢀtheꢀ  
deviceꢀunderꢀtestꢀlookꢀbetterꢀorꢀworseꢀthanꢀitꢀactuallyꢀis.ꢀForꢀexample,ꢀifꢀaꢀdeviceꢀhasꢀaꢀknownꢀreturnꢀlossꢀofꢀ30dBꢀandꢀ  
aꢀdiscontinuityꢀwithꢀaꢀmagnitudeꢀofꢀ–35dBꢀisꢀintroducedꢀintoꢀtheꢀmeasurementꢀpath,ꢀtheꢀnewꢀmeasuredꢀReturnꢀLossꢀ  
datacouldreadanywherebetween26dBand37dB.Thissamediscontinuitycouldintroduceaninsertionphaseꢀ  
errorꢀofꢀupꢀtoꢀ1°.ꢀ  
Thereꢀ areꢀ differentꢀ techniquesꢀ usedꢀ throughoutꢀ theꢀ industryꢀ toꢀ minimizeꢀ theꢀ affectsꢀ ofꢀ theꢀ testꢀ fixtureꢀ onꢀ theꢀ  
measurementꢀdata.ꢀAnarenꢀusesꢀtheꢀfollowingꢀdesignꢀandꢀdeꢁembeddingꢀcriteria:ꢀ  
ꢀ Testboardshavebeendesignedandparametersspecifiedtoprovidetraceimpedancesof50ꢀ  
±1.ꢀFurthermore,ꢀdiscontinuitiesꢀatꢀtheꢀSMAꢀtoꢀmicrostripꢀinterfaceꢀareꢀrequiredꢀtoꢀbeꢀlessꢀthanꢀ  
–35dBandinsertionphaseerrors(duetodifferencesintheconnectorinterfacediscontinuitiesꢀ  
andꢀ theꢀ electricalꢀ lineꢀ length)ꢀ shouldꢀ beꢀ lessꢀ thanꢀ ±0.25°ꢀ fromꢀ theꢀ medianꢀ valueꢀ ofꢀ theꢀ fourꢀ  
paths.ꢀ  
ꢀ AThru”circuitboardisbuilt.Thisisatwoport,microstripboardthatusesthesameSMAtoꢀ  
microstripꢀinterfaceꢀandꢀhasꢀtheꢀsameꢀtotalꢀlengthꢀ(insertionꢀphase)ꢀasꢀtheꢀactualꢀtestꢀboard.ꢀTheꢀ  
“Thru”boardmustꢀmeetꢀtheꢀsameꢀstringentꢀrequirementsꢀasꢀtheꢀtestboard.Theinsertionlossꢀ  
andꢀ insertionꢀ phaseꢀ ofꢀ theꢀ “Thru”ꢀ boardꢀ areꢀ measuredꢀ andꢀ stored.ꢀ Thisꢀ dataꢀ isꢀ usedꢀ toꢀ  
completelyꢀ deꢁembedꢀ theꢀ deviceꢀ underꢀ testꢀ fromꢀ theꢀ testꢀ fixture.ꢀ Theꢀ deꢁembeddedꢀ dataꢀ isꢀ  
availableꢀinꢀSꢁparameterꢀformꢀonꢀtheꢀAnarenꢀwebsiteꢀ(www.anaren.com). ꢀ  
Note:ꢀ ꢀ Theꢀ Sꢁparameterꢀ filesꢀ thatꢀ areꢀ availableꢀ onꢀ theꢀ anaren.comꢀ websiteꢀ includeꢀ dataꢀ forꢀ frequenciesꢀ thatꢀ areꢀ  
outsideꢀofꢀtheꢀspecifiedꢀband.ꢀItꢀisꢀimportantꢀtoꢀnoteꢀthatꢀtheꢀtestꢀfixtureꢀisꢀdesignedꢀforꢀoptimumꢀperformanceꢀthroughꢀ  
2.3GHz.Somedegradationinthetestfixtureperformancewilloccurabovethisfrequencyandconnectorinterfaceꢀ  
discontinuitiesꢀofꢀ–25dBꢀorꢀmoreꢀcanꢀbeꢀexpected.ꢀThisꢀlargerꢀdiscontinuityꢀwillꢀaffectꢀtheꢀdataꢀatꢀfrequenciesꢀaboveꢀ  
2.3GHz.ꢀ  
Circuit Board Layout  
ThedimensionsfortheAnarentestboardareshownbelow.ThetestboardisprintedonRogersRO4350materialꢀ  
thatꢀisꢀ0.030”ꢀthick.Considerꢀtheꢀcaseꢀwhenꢀaꢀdifferentꢀmaterialꢀisꢀused.ꢀFirst,ꢀtheꢀpadꢀsizeꢀmustꢀremainꢀtheꢀsameꢀtoꢀ  
accommodatethepart.But,ifthematerialthicknessordielectricconstant(orboth)changes,thereactanceattheꢀ  
interfaceꢀtoꢀtheꢀcouplerꢀwillꢀalsoꢀchange.ꢀSecond,ꢀtheꢀlinewidthꢀrequiredꢀforꢀ50ꢀwillꢀbeꢀdifferentꢀandꢀthisꢀwillꢀintroduceꢀ  
aꢀstepꢀinꢀtheꢀlineꢀatꢀtheꢀpadꢀwhereꢀtheꢀcouplerꢀinterfacesꢀwithꢀtheꢀprintedꢀmicrostripꢀtrace.ꢀBothꢀofꢀtheseꢀconditionsꢀwillꢀ  
affectꢀtheꢀperformanceꢀofꢀtheꢀpart.ꢀTo achieve the specified performance, serious attention must be given to the  
design and layout of the circuit environment in which this component will be used.  
Ifꢀaꢀdifferentꢀcircuitꢀboardꢀmaterialꢀisꢀused,ꢀanꢀattemptꢀshouldꢀbeꢀmadeꢀtoꢀachieveꢀtheꢀsameꢀinterfaceꢀpadꢀreactanceꢀ  
thatꢀisꢀpresentꢀonꢀtheꢀAnarenꢀRO4350ꢀtestꢀboard.ꢀWhenꢀthinnerꢀcircuitꢀboardꢀmaterialꢀisꢀused,ꢀtheꢀgroundꢀplaneꢀwillꢀ  
beclosertoꢀ thepadꢀ yieldingmorecapacitanceforthesamesizeinterfacepad.Thesameistrueꢀ ifthedielectricꢀ  
constantꢀ ofꢀ theꢀ circuitꢀ boardꢀ materialꢀ isꢀ higherꢀ thanꢀ isꢀ usedꢀ onꢀ theꢀ Anarenꢀ testꢀ board.ꢀ Inꢀ bothꢀ ofꢀ theseꢀ cases,ꢀ  
narrowingꢀ theꢀ lineꢀ beforeꢀ theꢀ interfaceꢀ padꢀ willꢀ introduceꢀ aꢀ seriesꢀ inductance,ꢀ which,ꢀ whenꢀ properlyꢀ tuned,ꢀ willꢀ  
compensateꢀforꢀtheꢀextraꢀcapacitiveꢀreactance.ꢀIfꢀaꢀthickerꢀcircuitꢀboardꢀorꢀoneꢀwithꢀaꢀlowerꢀdielectricꢀconstantꢀisꢀused,ꢀꢀ  
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RevꢀAꢀꢀ  
theꢀinterfaceꢀpadꢀwillꢀhaveꢀlessꢀcapacitiveꢀreactanceꢀthanꢀtheꢀAnarenꢀtestꢀboard.ꢀInꢀthisꢀcase,ꢀaꢀwiderꢀsectionꢀofꢀlineꢀ  
beforetheinterfacepad(oralargerinterfacepad)willintroduceashuntcapacitanceandwhenproperlytunedwillꢀ  
matchꢀtheꢀperformanceꢀofꢀtheꢀAnarenꢀtestꢀboard.ꢀ  
ꢀ ꢀ  
Noticeꢀthatꢀtheꢀboardꢀlayoutꢀforꢀtheꢀ3dBꢀandꢀ5dBꢀcouplersꢀisꢀdifferentꢀfromꢀthatꢀofꢀtheꢀ10dBꢀandꢀ20dBꢀcouplers.ꢀTheꢀ  
testꢀboardꢀforꢀtheꢀ3dBꢀandꢀ5dBꢀcouplersꢀhasꢀallꢀfourꢀtracesꢀinterfacingꢀwithꢀtheꢀcouplerꢀatꢀtheꢀsameꢀangle.ꢀTheꢀtestꢀ  
boardꢀforꢀtheꢀ30dB,ꢀ10dBꢀandꢀ20dBꢀcouplersꢀhasꢀtwoꢀtracesꢀapproachingꢀatꢀoneꢀangleꢀandꢀtheꢀotherꢀtwoꢀtracesꢀatꢀaꢀ  
differentꢀangle.ꢀThe entry angle of the traces has a significant impact on the RF performance and these parts  
have been optimized for the layout used on the test boards shown below.ꢀ  
30dB Test Board  
Testing Sample Parts Supplied on Anaren Test Boards  
IfꢀyouꢀhaveꢀreceivedꢀaꢀcouplerꢀinstalledꢀonꢀanꢀAnarenꢀproducedꢀmicrostripꢀtestꢀboard,ꢀpleaseꢀrememberꢀtoꢀremoveꢀtheꢀ  
lossꢀofꢀtheꢀtestꢀboardꢀfromꢀtheꢀmeasuredꢀdata.ꢀTheꢀlossꢀisꢀsmallꢀenoughꢀthatꢀitꢀisꢀnotꢀofꢀconcernꢀforꢀReturnꢀLossꢀandꢀ  
Isolation/Directivity,ꢀbutꢀitꢀshouldꢀcertainlyꢀbeꢀconsideredꢀwhenꢀmeasuringꢀcouplingꢀandꢀcalculatingꢀtheꢀinsertionꢀlossꢀ  
ofꢀtheꢀcoupler.ꢀAnꢀSꢁparameterꢀfileꢀforꢀaꢀ“Thru”ꢀboardꢀ(seeꢀdescriptionꢀofꢀ“Thru”ꢀboardꢀabove)ꢀwillꢀbeꢀsuppliedꢀuponꢀ  
request.ꢀAsꢀaꢀfirstꢀorderꢀapproximation,ꢀoneꢀshouldꢀconsiderꢀtheꢀfollowingꢀlossꢀestimates:ꢀ  
Frequency Band  
410 – 500 MHz  
800 - 1000 MHz  
1700 – 2300 MHz  
2300 – 2700 MHz  
3300 – 3800 MHz  
Avg. Ins. Loss of Test Board @ 25°C  
~ 0.04dB  
~ 0.06dB  
~0.14dB  
~0.155dB  
~0.20dB  
Forexample,a1900MHz,10dBcoupleronatestboardmaymeasure10.30dBfrominputtothecoupledportatꢀ  
someꢀfrequency,ꢀF1.ꢀWhenꢀtheꢀlossꢀofꢀtheꢀtestꢀboardꢀisꢀremoved,ꢀtheꢀcouplingꢀatꢀF1ꢀbecomesꢀꢁ10.18dBꢀ(ꢁ10.30dBꢀ+ꢀ  
0.12dB).ꢀ Thisꢀ compensationꢀ mustꢀ beꢀ madeꢀ toꢀ bothꢀ theꢀ coupledꢀ andꢀ directꢀ pathꢀ measurementsꢀ whenꢀ calculatingꢀ  
insertionꢀloss.ꢀ  
Thelossestimatesinthetableabovecomefromroomtemperaturemeasurements.Itisimportanttonotethattheꢀ  
lossꢀofꢀtheꢀtestꢀboardꢀwillꢀchangeꢀwithꢀtemperature.ꢀThisꢀfactꢀmustꢀbeꢀconsideredꢀifꢀtheꢀcouplerꢀisꢀtoꢀbeꢀevaluatedꢀatꢀ  
otherꢀtemperatures.  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Peak Power Handling  
HighꢁPotꢀtestingꢀofꢀtheseꢀcouplersꢀduringꢀtheꢀqualificationꢀprocedureꢀresultedꢀinꢀaꢀminimumꢀbreakdownꢀvoltageꢀofꢀ1.40ꢀ  
kV.ꢀThisꢀvoltageꢀlevelꢀcorrespondsꢀtoꢀaꢀbreakdownꢀresistanceꢀcapableꢀofꢀhandlingꢀatꢀleastꢀ12dBꢀpeaksꢀoverꢀaverageꢀ  
powerlevels,forveryshortdurations.Thebreakdownlocationconsistentlyoccurredacrosstheairinterfaceattheꢀ  
couplerꢀ contactꢀ padsꢀ (seeꢀ illustrationꢀ below).ꢀ Theꢀ breakdownꢀ levelsꢀ atꢀ theseꢀ pointsꢀ willꢀ beꢀ affectedꢀ byꢀ anyꢀ  
contaminationinthegapareaaroundthesepads.Theseareasmustbekeptcleanforoptimumperformance.Itisꢀ  
recommendedꢀthatꢀtheꢀuserꢀtestꢀforꢀvoltageꢀbreakdownꢀunderꢀtheꢀmaximumꢀoperatingꢀconditionsꢀandꢀoverꢀworstꢀcaseꢀ  
modulationinducedpowerpeaking.Thisevaluationshouldalsoincludeextremeenvironmentalconditions(suchasꢀ  
highꢀhumidity).ꢀ  
Orientation Marker  
AꢀprintedꢀcircularꢀfeatureꢀappearsꢀonꢀtheꢀtopꢀsurfaceꢀofꢀtheꢀcouplerꢀtoꢀdesignateꢀPinꢀ1.ꢀThisꢀorientationꢀmarkerꢀisꢀnotꢀ  
intendedtolimittheuseofthesymmetrythatthesecouplersexhibitbutrathertofacilitateconsistentplacementofꢀ  
thesepartsintothetapeandreelpackage.Thisensuresthatthecomponentsarealwaysdeliveredwiththesameꢀ  
orientation.ꢀReferꢀtoꢀtheꢀtableꢀonꢀpageꢀ2ꢀofꢀtheꢀdataꢀsheetꢀforꢀallowableꢀpinꢀconfigurations.ꢀ  
TestꢀPlanꢀ  
XingerIII30dBcouplersaremanufacturedinlargepanelsandthenseparated.AsamplepopulationofpartsisRFꢀ  
smallꢀsignalꢀtestedꢀatꢀroomꢀtemperatureꢀinꢀtheꢀfixtureꢀdescribedꢀabove.ꢀAllꢀpartsꢀareꢀDCꢀtestedꢀforꢀshorts/opens.ꢀ(Seeꢀ  
“QualificationꢀFlowꢀChart”ꢀsectionꢀforꢀdetailsꢀonꢀtheꢀacceleratedꢀlifeꢀtestꢀprocedures.)  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Power Handling  
Theꢀaverageꢀpowerꢀhandlingꢀ(totalꢀinputꢀpower)ꢀofꢀaꢀXingerꢀcouplerꢀisꢀaꢀfunctionꢀof:ꢀ  
ꢀ Internalꢀcircuitꢀtemperature.ꢀꢀ  
ꢀ Unitꢀmountingꢀinterfaceꢀtemperature.ꢀꢀ  
ꢀ Unitꢀthermalꢀresistanceꢀꢀ  
ꢀ Powerꢀdissipatedꢀwithinꢀtheꢀunit.ꢀꢀꢀ  
Allꢀthermalꢀcalculationsꢀareꢀbasedꢀonꢀtheꢀfollowingꢀassumptions:ꢀ  
ꢀ Theꢀunitꢀhasꢀreachedꢀaꢀsteadyꢀstateꢀoperatingꢀcondition.ꢀ  
ꢀ Maximumꢀmountingꢀinterfaceꢀtemperatureꢀisꢀ95oC.ꢀ  
ꢀ ConductionꢀHeatꢀTransferꢀthroughꢀtheꢀmountingꢀinterface.ꢀ  
ꢀ NoꢀConvectionꢀHeatꢀTransfer.ꢀ  
ꢀ NoꢀRadiationꢀHeatꢀTransfer.ꢀ  
ꢀ Theꢀmaterialꢀpropertiesꢀareꢀconstantꢀoverꢀtheꢀoperatingꢀtemperatureꢀrange.  
Finiteꢀ elementꢀ simulationsꢀ areꢀ madeꢀ forꢀ eachꢀ unit.ꢀ ꢀ Theꢀ simulationꢀ resultsꢀ areꢀ usedꢀ toꢀ calculateꢀ theꢀ unitꢀ thermalꢀ  
resistance.ꢀꢀTheꢀfiniteꢀelementꢀsimulationꢀrequiresꢀtheꢀfollowingꢀinputs:ꢀ  
ꢀ Unitꢀmaterialꢀstackꢁup.ꢀ  
ꢀ Materialꢀproperties.ꢀ  
ꢀ Circuitꢀgeometry.ꢀ  
ꢀ Mountingꢀinterfaceꢀtemperature.ꢀ  
ꢀ Thermalꢀloadꢀ(dissipatedꢀpower).ꢀ  
Theꢀ classicalꢀ definitionꢀ forꢀ dissipatedꢀ powerꢀ isꢀ temperatureꢀ deltaꢀ (T)ꢀ dividedꢀ byꢀ thermalꢀ resistanceꢀ (R).ꢀ ꢀ Theꢀ  
dissipatedꢀpowerꢀ(Pdis)ꢀcanꢀalsoꢀbeꢀcalculatedꢀasꢀaꢀfunctionꢀofꢀtheꢀtotalꢀinputꢀpowerꢀ(Pin)ꢀandꢀtheꢀthermalꢀinsertionꢀlossꢀ  
(ILtherm):ꢀ  
IL  
10  
therm  
T  
R
P =  
= P 110  
(W )  
dis  
in  
(1)  
Powerꢀflowꢀandꢀnomenclatureꢀforꢀanꢀ“H”ꢀstyleꢀcouplerꢀisꢀshownꢀinꢀFigureꢀ1.ꢀ  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
P
POut(RL)  
POut(DC)  
In  
InputꢀPort  
Pinꢀ1  
DirectꢀPort  
Pinꢀ4  
CoupledꢀPort  
IsolatedꢀPort  
POut(CPL)  
POut(ISO)  
Figureꢀ1ꢀ  
TheꢀcouplerꢀisꢀexcitedꢀatꢀtheꢀinputꢀportꢀwithꢀPinꢀ(watts)ꢀofꢀpower.ꢀꢀAssumingꢀtheꢀcouplerꢀisꢀnotꢀideal,ꢀandꢀthatꢀthereꢀareꢀ  
noꢀ radiationꢀ losses,ꢀ powerꢀ willꢀ exitꢀ theꢀ couplerꢀ atꢀ allꢀ fourꢀ ports.ꢀ ꢀ Symbolicallyꢀ written,ꢀ Pout(RL)ꢀ isꢀ theꢀ powerꢀ thatꢀ isꢀ  
returnedꢀ toꢀ theꢀ sourceꢀ becauseꢀ ofꢀ impedanceꢀ mismatch,ꢀ Pout(ISO)ꢀ ꢀ isꢀ theꢀ powerꢀ atꢀ theꢀ isolatedꢀ port,ꢀ Pout(CPL)ꢀ isꢀ theꢀ  
powerꢀatꢀtheꢀcoupledꢀport,ꢀandꢀPout(DC)ꢀisꢀtheꢀpowerꢀatꢀtheꢀdirectꢀport.ꢀꢀꢀ  
AtꢀAnaren,ꢀinsertionꢀlossꢀisꢀdefinedꢀasꢀtheꢀlogꢀofꢀtheꢀinputꢀpowerꢀdividedꢀbyꢀtheꢀsumꢀofꢀtheꢀpowerꢀatꢀtheꢀcoupledꢀandꢀ  
directꢀports:ꢀ  
Note:ꢀinꢀthisꢀdocument,ꢀinsertionꢀlossꢀisꢀtakenꢀtoꢀbeꢀaꢀpositiveꢀnumber.ꢀꢀInꢀmanyꢀplaces,ꢀinsertionꢀlossꢀisꢀwrittenꢀasꢀaꢀ  
negativeꢀnumber.ꢀꢀObviously,ꢀaꢀmereꢀsignꢀchangeꢀequatesꢀtheꢀtwoꢀquantities.ꢀꢀꢀꢀꢀꢀꢀ  
P
in  
IL =10log10  
(dB)  
(2)  
(3)  
Pout(CPL) + Pout(DC)  
InꢀtermsꢀofꢀSꢁparameters,ꢀILꢀcanꢀbeꢀcomputedꢀasꢀfollows:ꢀ  
2
2
IL = −10 log  
S31 + S41  
(dB)  
10   
Wenoticethatthisinsertionlossvalueincludesthepowerlostbecauseofreturnlossaswellaspowerlosttotheꢀ  
isolatedꢀport.ꢀ  
Forthermalcalculations,ꢀ weareꢀ onlyꢀ interestedinthepowerꢀ lostinside”theꢀ coupler.SincePout(RL)ꢀ islostintheꢀ  
sourceterminationandꢀ Pout(ISO)isꢀ lostꢀ inꢀ anꢀ externaltermination,theyꢀ areꢀ notꢀ beincludedꢀ intheinsertionlossforꢀ  
thermalꢀcalculations.ꢀꢀTherefore,ꢀweꢀdefineꢀaꢀnewꢀinsertionꢀlossꢀvalueꢀsolelyꢀtoꢀbeꢀusedꢀforꢀthermalꢀcalculations:ꢀ  
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RevꢀAꢀꢀ  
P
in  
ILtherm =10log10  
(dB)  
(4)  
P
+ P  
+ P  
+ P  
out(CPL)  
out(DC)  
out(ISO)  
out(RL)  
InꢀtermsꢀofꢀSꢁparameters,ꢀILthermꢀcanꢀbeꢀcomputedꢀasꢀfollows:ꢀ  
2
2
2
2
ILtherm = −10 log  
S11 + S21 + S31 + S41  
(dB)  
(5)  
10   
Theꢀthermalꢀresistanceꢀandꢀpowerꢀdissipatedꢀwithinꢀtheꢀunitꢀareꢀthenꢀusedꢀtoꢀcalculateꢀtheꢀaverageꢀtotalꢀinputꢀpowerꢀ  
ofꢀtheꢀunit.ꢀꢀTheꢀaverageꢀtotalꢀsteadyꢀstateꢀinputꢀpowerꢀ(Pin)ꢀthereforeꢀis:ꢀ  
T  
P
dis  
ILtherm  
R
P =  
=
(W )  
in  
ILtherm  
(6)  
   
   
   
   
10  
10  
110  
110  
Whereꢀtheꢀtemperatureꢀdeltaꢀisꢀtheꢀcircuitꢀtemperatureꢀ(Tcirc)ꢀminusꢀtheꢀmountingꢀinterfaceꢀtemperatureꢀ(Tmnt):ꢀ  
T = Tcirc Tmnt (oC)  
(7)  
Theꢀmaximumallowablecircuittemperatureisdefinedbythepropertiesofthematerialsusedtoconstructtheunit.ꢀꢀ  
MultiplematerialcombinationsandbondingtechniquesareusedwithintheXingerIIIproductfamilytooptimizeRFꢀ  
performance.ꢀ ꢀ Consequentlyꢀ theꢀ maximumꢀ allowableꢀ circuitꢀ temperatureꢀ varies.ꢀ ꢀ Pleaseꢀ noteꢀ thatꢀ theꢀ circuitꢀ  
temperatureꢀisꢀnotꢀaꢀfunctionꢀofꢀtheꢀXingerꢀcaseꢀ(topꢀsurface)ꢀtemperature.ꢀꢀTherefore,ꢀtheꢀcaseꢀtemperatureꢀcannotꢀ  
beꢀusedꢀasꢀaꢀboundaryꢀconditionꢀforꢀpowerꢀhandlingꢀcalculations.ꢀꢀꢀ  
Dueꢀtoꢀtheꢀnumerousꢀboardꢀmaterialsꢀandꢀmountingꢀconfigurationsꢀusedꢀinꢀspecificꢀcustomerꢀconfigurations,ꢀitꢀisꢀtheꢀ  
endꢀusersꢀresponsibilityꢀtoꢀensureꢀthatꢀtheꢀXingerꢀIIIꢀcouplerꢀmountingꢀinterfaceꢀtemperatureꢀisꢀmaintainedꢀwithinꢀtheꢀ  
limitsdefinedon thepowerderatingplotsfortherequiredaveragepowerhandling.Additionallyappropriatesolderꢀ  
compositionisrequiredtopreventreflowor fatiguefailureattheRFports.Finally,reliabilityisimprovedwhentheꢀ  
mountingꢀinterfaceꢀandꢀRFꢀportꢀtemperaturesꢀareꢀkeptꢀtoꢀaꢀminimum.ꢀ  
Theꢀpowerꢁderatingꢀcurveꢀillustratesꢀhowꢀchangesꢀinꢀtheꢀmountingꢀinterfaceꢀtemperatureꢀresultꢀinꢀconverseꢀchangesꢀ  
ofꢀtheꢀpowerꢀhandlingꢀofꢀtheꢀcoupler.  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Mountingꢀꢀ  
Coupler Mounting Process  
Inꢀ orderꢀ forꢀ Xingerꢀ surfaceꢀ mountꢀ couplersꢀ toꢀ workꢀ ꢀ  
optimally,theremustbe50ꢂtransmissionlinesleadingꢀ Theꢀ processꢀ forꢀ assemblingꢀ thisꢀ componentꢀ isꢀ aꢀ  
toꢀ andꢀ fromꢀ allꢀ ofꢀ theꢀ RFꢀ ports.ꢀ ꢀ Also,ꢀ thereꢀ mustꢀ beꢀ aꢀ conventionalsurfacemountprocessasshowninFigureꢀ  
veryꢀ goodꢀ groundꢀ planeꢀ underneathꢀ theꢀ partꢀ toꢀ ensureꢀ 1.ꢀThisꢀprocessꢀisꢀconduciveꢀtoꢀbothꢀlowꢀandꢀhighꢀvolumeꢀ  
properꢀ electricalꢀ performance.ꢀ ꢀ Ifꢀ eitherꢀ ofꢀ theseꢀ twoꢀ usage.ꢀ  
conditionsꢀisꢀnotꢀsatisfied,ꢀinsertionꢀloss,ꢀcoupling,ꢀVSWRꢀ ꢀ  
andꢀisolationꢀmayꢀnotꢀmeetꢀpublishedꢀspecifications.ꢀ  
Overallꢀ groundꢀ isꢀ improvedꢀ ifꢀ aꢀ denseꢀ populationꢀ ofꢀ  
platedꢀthroughꢀholesꢀconnectꢀtheꢀtopꢀandꢀbottomꢀgroundꢀ  
layersꢀ ofꢀ theꢀ PCB.ꢀ ꢀ Thisꢀ minimizesꢀ groundꢀ inductanceꢀ  
andimprovesgroundcontinuity.AlloftheXingerhybridꢀ  
Figure 1: Surface Mounting Process Steps  
andꢀ directionalꢀ couplersꢀ areꢀ constructedꢀ fromꢀ ceramicꢀ  
Storage of Components: Theꢀ Xingerꢀ IIIꢀ productsꢀ areꢀ  
filledꢀPTFEꢀcompositesꢀwhichꢀpossessꢀexcellentꢀelectricalꢀ  
availableꢀ inꢀ eitherꢀ anꢀ immersionꢀ tinꢀ orꢀ tinꢁleadꢀ finish.ꢀ  
andꢀ mechanicalꢀ stabilityꢀ havingꢀ Xꢀ andꢀ Yꢀ thermalꢀ  
Commonlyꢀ usedꢀ storageꢀ proceduresꢀ usedꢀ toꢀ controlꢀ  
coefficientꢀofꢀexpansionꢀ(CTE)ꢀofꢀ17ꢁ25ꢀppm/oC.ꢀ  
oxidationꢀ shouldꢀ beꢀ followedꢀ forꢀ theseꢀ surfaceꢀ mountꢀ  
components.Thestoragetemperaturesshouldbeheldꢀ  
betweenꢀ15OCꢀandꢀ60OC.ꢀ  
Whenꢀ aꢀ surfaceꢀ mountꢀ hybridꢀ couplerꢀ isꢀ mountedꢀ toꢀ aꢀ  
printedcircuitboard,theprimaryconcernsare;ensuringꢀ  
theRFpadsofthedeviceareincontactwiththecircuitꢀ  
traceꢀofꢀtheꢀPCBꢀandꢀinsuringꢀtheꢀgroundꢀplaneꢀofꢀneitherꢀ  
Substrate: Dependingꢀ uponꢀ theꢀ particularꢀ component,ꢀ  
thecircuitmaterialhasanxandycoefficientofthermalꢀ  
theꢀ componentꢀ norꢀ theꢀ PCBꢀ isꢀ inꢀ contactꢀ withꢀ theꢀ RFꢀ  
expansionꢀofꢀbetweenꢀ17ꢀandꢀ25ꢀppm/°C.ꢀThisꢀcoefficientꢀ  
signal.ꢀ  
minimizessolderjointstressesduetosimilarexpansionꢀ  
ratesofmostcommonlyusedboardsubstratessuchasꢀ  
RF35,ꢀ RO4350,ꢀ FR4,ꢀ polyimideꢀ andꢀ Gꢁ10ꢀ materials.ꢀ  
Mounting Footprint  
Mountingꢀ toꢀ “hard”ꢀ substratesꢀ (aluminaꢀ etc.)ꢀ isꢀ possibleꢀ  
dependingꢀ uponꢀ operationalꢀ temperatureꢀ requirements.ꢀ  
Thesoldersurfacesofthecouplerareallcopperplatedꢀ  
withꢀeitherꢀanꢀimmersionꢀtinꢀorꢀtinꢁleadꢀexteriorꢀfinish.ꢀ  
Solder Paste: Allꢀconventionalꢀsolderꢀpasteꢀformulationsꢀ  
willꢀ workꢀ wellꢀ withꢀ Anaren’sꢀ Xingerꢀ IIIꢀ surfaceꢀ mountꢀ  
components.ꢀSolderꢀpasteꢀcanꢀbeꢀappliedꢀwithꢀstencilsꢀorꢀ  
syringeꢀ dispensers.ꢀ Anꢀ exampleꢀ ofꢀ aꢀ stenciledꢀ solderꢀ  
pasteꢀ depositꢀ isꢀ shownꢀ inꢀ Figureꢀ 2.ꢀ ꢀ Asꢀ shownꢀ inꢀ theꢀ  
figureꢀsolderꢀpasteꢀisꢀappliedꢀtoꢀtheꢀfourꢀRFꢀpadsꢀandꢀtheꢀ  
entireꢀgroundꢀplaneꢀunderneathꢀtheꢀbodyꢀofꢀtheꢀpart.ꢀ  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Reflow: Theꢀsurfaceꢀmountꢀcouplerꢀisꢀconduciveꢀtoꢀmostꢀofꢀ  
today’sꢀ conventionalꢀ reflowꢀ methods.ꢀ Aꢀ lowꢀ andꢀ highꢀ  
temperaturethermalreflowprofileareshowninFigures5ꢀ  
andꢀ6,ꢀrespectively.ꢀManualꢀsolderingꢀofꢀtheseꢀcomponentsꢀ  
canbedonewithconventionalsurfacemountnonꢁcontactꢀ  
hotꢀ airꢀ solderingꢀ tools.ꢀ Boardꢀ preꢁheatingꢀ isꢀ highlyꢀ  
recommendedꢀ forꢀ theseꢀ selectiveꢀ hotꢀ airꢀ solderingꢀ  
methods.ꢀꢀManualꢀsolderingꢀwithꢀconventionalꢀironsꢀshouldꢀ  
beꢀavoided.  
Figure 2: Solder Paste Application  
Coupler Positioning: Thesurfacemountcouplercanꢀ  
beꢀ placedꢀ manuallyꢀ orꢀ withꢀ automaticꢀ pickꢀ andꢀ placeꢀ  
mechanisms.ꢀCouplersꢀshouldꢀbeꢀplacedꢀ(seeꢀFigureꢀ3ꢀ  
andꢀ 4)ꢀ ontoꢀ wetꢀ pasteꢀ withꢀ commonꢀ surfaceꢀ mountꢀ  
techniquesꢀ andꢀ parameters.ꢀ ꢀ Pickꢀ andꢀ placeꢀ systemsꢀ  
mustꢀ supplyꢀ adequateꢀ vacuumꢀ toꢀ holdꢀ aꢀ 0.115ꢀ gramꢀ  
coupler.ꢀ  
Figure 3: Component Placement  
Figure 4: Mounting Features Example  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Figure 5 – Low Temperature Solder Reflow Thermal Profile  
Figure 6 – High Temperature Solder Reflow Thermal Profile  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Qualification Flow Chart  
XingerꢀIIIꢀProductꢀ  
Qualificationꢀ  
VisualꢀInspectionꢀ  
n=55ꢀ  
SolderabilityꢀTestꢀ  
n=5ꢀ  
MechanicalInspectionꢀ  
n=50ꢀ  
InitialꢀRFꢀTestꢀ  
n=50ꢀ  
VisualꢀInspectionꢀ  
n=50ꢀ  
VTEKTestingꢀ  
n=45ꢀ  
LooseꢀControlꢀUnitsꢀ  
n=5ꢀ  
VisualꢀInspectionꢀ  
n=50ꢀ  
PostꢀVꢁTEKꢀTestꢀRFꢀTestꢀ  
n=50ꢀ  
LooseꢀControlUnitsꢀ  
n=5ꢀ  
VisualꢀInspectionꢀ  
n=50ꢀ  
ResistanceꢀtoꢀSolderꢀMILꢀ202Gꢀ  
Methodꢀ210F,ꢀConditionꢀKꢀHeatꢀ  
n=20ꢀ  
SolderꢀUnitsꢀtoꢀTestꢀ  
PostꢀSolderVisualꢀ  
Inspectionꢀ  
n=25ꢀ  
Boardꢀ  
n=25ꢀ  
PostꢀResistanceꢀHeatꢀRFꢀ  
InitialRFTestꢀBoardꢀ  
Mountedꢀ  
Testꢀ  
n=20ꢀ  
n=25ꢀ  
ControlUnitsꢀRFTestꢀ  
25°Cꢀonlyꢀꢀ  
VisualꢀInspectionꢀ  
n=25ꢀ  
LooseꢀControlUnitsꢀ  
n=5ꢀ  
MechanicalꢀInspectionꢀ  
n=20ꢀ  
n=5ꢀ  
RFꢀTestꢀatꢀꢁ55°C,ꢀ25°C,ꢀ  
95°Cꢀꢀ  
n=20ꢀ  
VoltageꢀBreakdownTestꢀMILꢀ  
202F,ꢀMethodꢀ301ꢀ25°C5KVꢀ  
n=40ꢀ  
VisualꢀInspectionꢀ  
n=25ꢀ  
VisualꢀInspectionꢀ  
n=50ꢀ  
ControlꢀUnitsꢀ  
n=5ꢀ  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
ControlꢀU nitsꢀ  
n=10ꢀ  
PostꢀVoltageꢀRFꢀTestꢀ  
n=50ꢀ  
Therm alꢀCycle100ꢀcycles55°ꢀtoꢀ  
125°C.ꢀDwellꢀtime=30ꢀminꢀꢀ  
n=40ꢀ  
VisualꢀInspectionꢀ  
n=50ꢀ  
PostꢀThermalꢀRFTestꢀ  
n=50ꢀ  
ControlꢀUnitsꢀ  
n=10ꢀ  
MoistureꢀResistanceꢀTestingꢀꢁ25°ꢀtoꢀ 65°Cꢀforꢀ2ꢀ  
hrsꢀ@ꢀ90%ꢀhumidity.ꢀSoakꢀfor168ꢀhrsatꢀ90%ꢀtoꢀ  
85%humidity.ꢀRampꢀtempꢀtoꢀ25°Cꢀinꢀ2ꢀhrs@ꢀ  
90%ꢀhumidity.ꢀThenꢀsoakꢀ@ꢀꢁ10°Cꢀforꢀ3ꢀhrs.ꢀ  
n=40ꢀ  
PostꢀMoistureꢀResistanceꢀ  
RFTest ꢀn=50ꢀ  
PostꢀMoistureꢀResistanceꢀ  
RFTestꢀꢀ  
n=50ꢀ  
VisualꢀInspectionꢀ  
n=50ꢀ  
ControlꢀUnitsꢀ  
n=10ꢀ  
BakeꢀUnitsꢀforꢀ1ꢀhourꢀatꢀ  
100°ꢀtoꢀ120°Cꢀ  
n=40ꢀ  
PostꢀBakeꢀRFꢀTestꢀ  
n=50ꢀ  
VisualꢀInspectionꢀ  
n=30ꢀ  
125%Powerꢀꢀ  
LifeꢀTestꢀ72ꢀhrsꢀ  
n=3ꢀ  
FinalꢀRFꢀTestꢀ@25°Cꢀ  
n=25ꢀ  
Microsectionꢀ  
3ꢀtest ꢀunits1ꢀcontrolꢀ  
Microsectionꢀ  
2ꢀLife,ꢀ1highꢀpowerꢀandꢀ  
1ꢀcontrolꢀ  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
Application Information  
Directional Couplers and Sampling  
Directionalꢀ couplersꢀ areꢀ oftenꢀ usedꢀ inꢀ circuitsꢀ thatꢀ requireꢀ theꢀ samplingꢀ ofꢀ anꢀ arbitraryꢀ signal.ꢀ ꢀ Becauseꢀ theyꢀ areꢀ  
passive,ꢀnonꢁlinearꢀdevices,ꢀAnarenꢀdirectionalꢀcouplersꢀdoꢀnotꢀperturbꢀtheꢀcharacteristicsꢀofꢀtheꢀsignalꢀtoꢀbeꢀsampled,ꢀ  
andcanꢀbeꢀusedꢀforꢀfrequencyꢀmonitoringꢀand/orꢀmeasurementꢀofꢀRFꢀpower.ꢀAnꢀexampleꢀofꢀaꢀsamplingꢀcircuitꢀisꢀtheꢀ  
reflectometer.ꢀ ꢀ Theꢀ purposeꢀ ofꢀ theꢀ reflectometerꢀ isꢀ toꢀ isolateꢀ andꢀ sampleꢀ theꢀ incidentꢀ andꢀ reflectedꢀ signalsꢀ fromꢀ aꢀ  
mismatchedꢀload.ꢀꢀAꢀbasicꢀreflectometerꢀcircuitꢀisꢀshownꢀinꢀFigureꢀap.n.1ꢁ1.ꢀꢀꢀꢀ  
V
input  
1
2
LOAD  
Reflected  
Wave  
4
3
V
VR  
I
Figureꢀap.n.1ꢁ1.ꢀAꢀReflectometerꢀCircuitꢀSchematicꢀ  
Ifꢀtheꢀdirectionalꢀcouplerꢀhasꢀperfectꢀdirectivity,ꢀthenꢀitꢀisꢀclearꢀthatꢀVIisstrictlyasampleꢀofꢀtheꢀincidentꢀvoltageꢀVinput,ꢀ  
andꢀVRꢀisꢀstrictlyꢀaꢀsampleꢀofꢀtheꢀwaveꢀthatꢀisꢀreflectedꢀfromꢀtheꢀload.ꢀꢀSinceꢀdirectivityꢀisꢀneverꢀperfectꢀinꢀpractice,ꢀbothꢀ  
VIꢀandꢀVRꢀwillꢀcontainꢀsamplesꢀofꢀtheꢀinputꢀsignalꢀasꢀwellꢀasꢀtheꢀreflectedꢀsignal.ꢀꢀInꢀthatꢀcase,ꢀꢀ  
θ
VI = C + CDTΓej  
Eq.ꢀap.n.1ꢁ1ꢀ  
andꢀ  
φ
VR = CD + CTΓej  
Eq.ꢀap.n.1ꢁ2ꢀ  
whereCisthecoupling,Disthedirectivity,Γisthecomplexreflectioncoefficientoftheload,Tisthetransmissionꢀ  
coefficient,ꢀandꢀφꢀandꢀθꢀareꢀunknownꢀphaseꢀdelayꢀdifferencesꢀcausedꢀbyꢀtheꢀinterconnectꢀlinesꢀonꢀtheꢀꢀtestꢀboard.ꢀꢀIfꢀweꢀ  
knowꢀVIꢀandꢀVR,ꢀweꢀcanꢀeasilyꢀcalculateꢀtheꢀreflectionꢀcoefficientꢀofꢀtheꢀload.ꢀꢀOneꢀshouldꢀnoticeꢀthatꢀinꢀorderꢀtoꢀmakeꢀ  
forwardꢀ andꢀ reverseꢀ measurementsꢀ usingꢀ onlyꢀ oneꢀ coupler,ꢀ theꢀ directivityꢀ mustꢀ beꢀ reallyꢀ low.ꢀ ꢀ Inꢀ specificꢀ customerꢀ  
applications,ꢀtheꢀpreferredꢀmethodꢀforꢀforwardꢀandꢀreverseꢀsamplingꢀisꢀshownꢀinꢀFigureꢀap.n.1ꢁ2.ꢀ  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
ISOLATOR  
INPUT  
1
2
LOAD  
Reflected  
Wave  
4
3
FORWARD  
MEASUREMENT  
REVERSE  
MEASUREMENT  
**TERMINATION  
*Recommended Terminations  
Powerꢀ(Watts)ꢀ  
Modelꢀ  
RFPꢁꢀ060120A15Z50ꢁ2ꢀ  
RFPꢁꢀC10A50Z4ꢀ  
RFPꢁꢀC16A50Z4ꢀ  
RFPꢁꢀC20N50Z4ꢀ  
RFPꢁꢀC50A50Z4ꢀ  
RFPꢁꢀC100N50Z4ꢀ  
RFPꢁꢀC200N50Z4ꢀ  
8ꢀ  
10ꢀ  
16ꢀ  
20ꢀ  
50ꢀ  
100ꢀ  
200ꢀ  
Figureꢀap.n.1ꢁ2.ꢀForwardꢀandꢀReverseꢀSamplingꢀ  
TheꢀisolatorꢀinꢀFigureꢀap.n.1ꢁ2ꢀpreventsꢀtheꢀreflectedꢀwaveꢀfromꢀexcitingꢀtheꢀdirectionalꢀcoupler.ꢀꢀAꢀlistꢀofꢀrecommendedꢀ  
terminationsꢀisꢀshownꢀinꢀtheꢀfigure.ꢀ  
Directional Couplers in Feed-Forward Amplifier Applications  
Feedꢁforwardamplifiersarewidelyusedtoreducedistortionꢀ duetononlinearitiesinpoweramplifiers.Althoughtheꢀ  
levelꢀandꢀcomplexityꢀofꢀfeedꢁforwardꢀamplifiersꢀvariesꢀfromꢀoneꢀmanufacturerꢀtoꢀanother,ꢀtheꢀbasicꢀbuildingꢀblockꢀforꢀthisꢀ  
linearizationꢀschemeꢀremainsꢀtheꢀsame.ꢀꢀAꢀbasicꢀfeedꢁforwardꢀschematicꢀisꢀshownꢀinꢀFigureꢀap.n.2ꢁ1.ꢀꢀTheꢀinputꢀsignalꢀ  
isꢀsplitꢀinꢀtwoꢀusingꢀaꢀhybridꢀcouplerꢀorꢀpowerꢀdivider.ꢀꢀTheꢀoutputꢀofꢀtheꢀmainꢀamplifierꢀisꢀsampledꢀwithꢀaꢀ20dBꢁ30dBꢀ  
directionalꢀcoupler.ꢀꢀTheꢀX3C26P1ꢁ30Sꢀisꢀanꢀexcellentꢀcandidateꢀforꢀthisꢀsamplingꢀsinceꢀitꢀprovidesꢀgreatꢀreturnꢀlossꢀandꢀ  
directivity.ꢀꢀTheꢀsampledꢀsignal,ꢀwhichꢀconsistsꢀofꢀaꢀsampleꢀofꢀtheꢀoriginalꢀinputꢀsignalꢀplusꢀsomeꢀdistortion,ꢀisꢀinvertedꢀ  
andꢀthenꢀcombinedꢀwithꢀtheꢀoutputꢀofꢀtheꢀfirstꢀdelayꢀline.ꢀꢀThisꢀprocedureꢀsubtractsꢀ(throughꢀdestructiveꢀinterference)ꢀtheꢀ  
sampleꢀ ofꢀ theꢀ originalꢀ inputꢀ signal,ꢀ leavingꢀ onlyꢀ theꢀ distortionꢀ orꢀ errorꢀ component.ꢀ ꢀ Theꢀ errorꢀ componentꢀ isꢀ thenꢀ  
amplifiedandcombinedwiththeoutputofꢀtheꢀsecondꢀdelayꢀlineꢀusingꢀanotherꢀdirectionalꢀcoupler.ꢀꢀInꢀmanyꢀcases,ꢀaꢀ  
10dBꢀcouplerꢀisꢀusedꢀtoꢀcombineꢀtheꢀtwoꢀsignals.ꢀꢀTheꢀXC0900Eꢁ10ꢀisꢀaꢀperfectꢀchoiceꢀforꢀthisꢀinjectionꢀbecauseꢀitꢀhasꢀ  
tightꢀcoupling,ꢀsuperiorꢀdirectivity,ꢀandꢀexcellentꢀmatch.ꢀꢀꢀꢀ  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
Europe:  
ꢀ(315)ꢀ432ꢁ8909ꢀ  
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Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀꢀ  
*Recommended Terminations  
Powerꢀ(Watts)ꢀ  
Modelꢀ  
RFPꢁꢀ060120A15Z50ꢁ2ꢀ  
RFPꢁꢀC10A50Z4ꢀ  
RFPꢁꢀC16A50Z4ꢀ  
RFPꢁꢀC20N50Z4ꢀ  
RFPꢁꢀC50A50Z4ꢀ  
RFPꢁꢀC100N50Z4ꢀ  
RFPꢁꢀC200N50Z4ꢀ  
8ꢀ  
10ꢀ  
16ꢀ  
20ꢀ  
50ꢀ  
100ꢀ  
200ꢀ  
Figureꢀap.n.2ꢁ1.ꢀꢀGenericꢀFeedꢀForwardꢀCircuitꢀSchematicꢀ  
Bothꢀ directionalꢀ couplersꢀ inꢀ theꢀ Figureꢀ ap.n.2ꢁ1ꢀ haveꢀ oneꢀ portꢀ terminatedꢀ withꢀ aꢀ 50ꢀ resistor.ꢀ ꢀ Inꢀ orderꢀ toꢀ achieveꢀ  
optimumperformance,theterminationmustꢀbeꢀchosenꢀcarefully.ꢀꢀItꢀisꢀimportantꢀtoꢀrememberꢀthatꢀaꢀgoodꢀterminationꢀ  
willꢀnotꢀonlyꢀproduceꢀaꢀgoodꢀmatchꢀatꢀtheꢀinputꢀofꢀtheꢀcoupler,ꢀbutꢀwillꢀalsoꢀmaximizeꢀtheꢀisolationꢀbetweenꢀtheꢀinputꢀportꢀ  
andꢀisolatedꢀport.ꢀꢀFurthermore,ꢀsinceꢀtheꢀterminationꢀcanꢀpotentiallyꢀabsorbꢀhighꢀlevelsꢀofꢀpower,ꢀitsꢀmaximumꢀpowerꢀ  
ratingshouldbechosenaccordingly.AlistofrecommendedterminationsisshowninFigureap.n.2ꢁ1.Foranidealꢀ  
losslessꢀdirectionalꢀcoupler,ꢀtheꢀpowerꢀatꢀtheꢀcoupledꢀandꢀdirectꢀportsꢀcanꢀbeꢀwrittenꢀas:ꢀ  
Pinput  
Coupling(dB)  
Pcoupled  
=
Watts  
Eq.ꢀap.n.2ꢁ1ꢀ  
10  
10  
P
input  
Pdirect = P −  
Watts  
input  
Coupling(dB)  
Eq.ꢀap.n.2ꢁ2ꢀ  
10  
10  
whereꢀPinputꢀisꢀtheꢀinputꢀpowerꢀinꢀWatts,ꢀandꢀCoupling(dB)ꢀisꢀtheꢀcouplingꢀvalueꢀinꢀdB.ꢀꢀꢀ  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀ  
andꢀReelꢀforꢀPickꢀandꢀ  
PlaceꢀManufacturing.  
 
Europe:ꢀ  
Model X3C26P1-30Sꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
RevꢀAꢀ  
Packaging and Ordering Information  
Partsꢀareꢀavailableꢀinꢀaꢀreelꢀandꢀasꢀlooseꢀpartsꢀinꢀaꢀbag.ꢀꢀPackagingꢀfollowsꢀEIAꢀ481ꢁ2ꢀforꢀreels.ꢀꢀPartsꢀareꢀorientedꢀinꢀ  
tapeꢀandꢀreelꢀasꢀshownꢀbelow.ꢀꢀMinimumꢀorderꢀquantitiesꢀareꢀ2000ꢀperꢀreelꢀandꢀ100ꢀforꢀlooseꢀparts.ꢀSeeꢀModelꢀ  
Numbersꢀbelowꢀforꢀfurtherꢀorderingꢀinformation.ꢀ  
DirectionꢀofꢀPartꢀ  
DimensionsꢀareꢀinꢀInches[MM]  
Feedꢀ(Unloading)  
XXXꢀXXꢀXꢀXꢀꢁꢀXXꢀX  
XingerꢀCoupler Frequencyꢀ(MHz) Sizeꢀ(Inches) Powerꢀ(Watts) CouplingꢀValue  
PlatingꢀFinish  
04ꢀ=ꢀ410ꢁ500  
07ꢀ=ꢀ600ꢁ900  
Aꢀ=ꢀ0.56ꢀxꢀ0.35 1ꢀ=ꢀ100  
Bꢀ=ꢀ1.0ꢀxꢀ0.50 2ꢀ=ꢀ200  
Eꢀ=ꢀ0.56ꢀxꢀ0.20 3ꢀ=ꢀ300  
Lꢀ=ꢀ0.65ꢀxꢀ0.48  
M=ꢀ0.40ꢀxꢀ0.20  
Pꢀ=ꢀ0.25ꢀxꢀ0.20  
03ꢀ=ꢀ3dB  
05ꢀ=ꢀ5dB  
10ꢀ=ꢀ10dB  
20ꢀ=ꢀ20dB  
30ꢀ=ꢀ30dB  
Pꢀ=ꢀTinꢀLead  
Sꢀ=ꢀImmersionꢀTin  
09ꢀ=ꢀ800ꢁ1000  
19ꢀ=ꢀ1700ꢁ2000  
21ꢀ=ꢀ2000ꢁ2300  
25ꢀ=ꢀ2300ꢁ2500  
26ꢀ=ꢀ2650ꢁ2800  
35ꢀ=ꢀ3300ꢁ3800  
X3C  
Example:ꢀX3Cꢀ19ꢀPꢀ1ꢀꢁꢀ03ꢀS  
USA/Canada:ꢀ  
TollꢀFree:ꢀ  
Europe:  
ꢀ(315)ꢀ432ꢁ8909ꢀ  
(800)ꢀ411ꢁ6596ꢀ  
+44ꢀ2392ꢁ232392  
AvailableꢀonꢀTapeꢀandꢀ  
ReelꢀforꢀPickꢀandꢀPlaceꢀ  
Manufacturing.  

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