APL5501-19BC [ANPEC]

Low IQ, Low Dropout 500mA Fixed Voltage Regulator; 低IQ ,低压降500毫安固定电压稳压器
APL5501-19BC
型号: APL5501-19BC
厂家: ANPEC ELECTRONICS COROPRATION    ANPEC ELECTRONICS COROPRATION
描述:

Low IQ, Low Dropout 500mA Fixed Voltage Regulator
低IQ ,低压降500毫安固定电压稳压器

稳压器
文件: 总23页 (文件大小:1497K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APL5501/2/3  
Low IQ, Low Dropout 500mA Fixed Voltage Regulator  
Features  
Design with an internal P-channel MOSFET pass  
·
·
·
·
·
·
·
Low Noise : 50mVRMS (100Hz to 100kHz)  
transistor, the APL5501/2/3 maintains a low supply  
current, independent of the load current and dropout  
voltage. Other features include reverse current  
protection, thermal-shutdown protection, current limit  
protection to ensure specified output current andcon-  
trolled short-circuit current. The APL5501/2/3 regu-  
lator comes in a miniature SOT-23-5, SOT-89, SOT-  
89-5, SOT-223, SO-8, TO-252 and TO-252-5  
packages.  
Low Quiescent Current : 50mA (No load)  
Low Dropout Voltage : 170mV (@500mA)  
Very low Shutdown Current : < 0.5uA  
Fixed Output Voltage : 1.3V ~ 3.4V  
Stable with 4.7uF Output Capacitor  
Stable with Aluminum, Tantalum or Ceramic  
Capacitors  
·
·
Reverse Current Protection  
No Protection DiodesNeeded  
Pin Configuration  
·
·
·
·
·
·
Built in Thermal Protection  
APL5501  
Built in Current Limit Protection  
Controlled Short Circuit Current : 150mA  
Fast Transient Response  
BP  
GND  
SHDN  
T A B i s G N D  
5
1
4
3
1
2
3
Short Setting Time  
2
SOT-23-5, SOT-89, SOT-89-5, SOT-223, SO-8,  
TO-252 and TO-252-5 Packages  
V IN  
VIN  
G N D  
V O U T  
VOUT  
GND  
·
Lead FreeAvailable (RoHSCompliant)  
SOT-89 (Top View)  
SOT-89-5(TopView)  
Applications  
IN  
GND  
GND  
SHDN  
1
2
3
4
8
7
6
5
OUT  
GND  
GND  
BYP  
VIN  
1
5
4
VOUT  
·
·
·
Notebook Computer  
GND  
2
3
PDA or Portable Equipments  
Noise-Sensitive Instrumentation Systems  
SHDN  
BP  
General Description  
SO-8 (Top View)  
SOT-23-5(TopView)  
The APL5501/2/3 is micropower, lownoise, low drop-  
out linear regulator. Operate from 2.7V to 6V input  
voltage and deliver up to 500mA. Typical output noise  
GND  
VOUT  
BP  
is just 50mVRMS with the addition of an external 0.1mF  
bypass capacitor in BP pin and typical dropout volt-  
age is only 170mV at 500mA loading . Designed for  
use in battery-powered system, the low 50uA quies-  
cent current makes it an ideal choice.  
GND  
SHDN  
VIN  
1
2
3
VIN  
VOUT  
TO-252(TopView)  
TO-252-5(TopView)  
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise  
customers to obtain the latest version of relevant information to verify before placing orders.  
Copyright ã ANPEC Electronics Corp.  
1
www.anpec.com.tw  
Rev. B.2 - May., 2005  
APL5501/2/3  
Pin Configuration (Cont.)  
APL5502  
TAB is VIN  
APL5501  
TAB is GND  
APL5502  
APL5503  
TAB is GND  
TAB is VIN  
1
2
3
1
2
3
1
2
3
1
2
3
VIN GND VOUT  
GND VIN  
VOUT  
GND  
VIN  
VOUT  
VOUT GND  
VIN  
SOT-223 (TopView)  
SOT-89 (Top View)  
SOT-223 (TopView)  
SOT-223 (TopView)  
Ordering and Marking Information  
Package Code  
APL5501/2/3 -  
B : SOT-23-5  
U : TO-252  
K : SO-8  
D : S OT-89  
U5 : TO-252-5  
D5 : SOT-89-5  
V : SOT-223  
Lead Free Code  
Handling Code  
Temp. Range  
Temp. Range  
C : 0 to 70  
C
°
Handling Code  
TR : Tape & Reel  
Voltage Code :  
Package Code  
Voltage Code  
13 : 1.3V ~ 34 : 3.4V  
Lead Free Code  
L : Lead Free Device  
Blank : Original Device  
APL5501/2/3  
XXXXX13  
XXXXX  
XXXXX  
-
-
Date Code  
Date Code  
,
,
13 - 1.3V  
APL5501/2/3 - 13 D/V/K :  
APL5501/2/3 - 13 U :  
13  
APL5501/2/3  
XXXXX  
13 - 1.3V  
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-  
tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.  
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-  
tion at lead-free peak reflow temperature.  
Marking Information  
SOT-23-5 package  
Product Name  
APL5501-13B  
APL5501-14B  
APL5501-15B  
APL5501-16B  
APL5501-17B  
APL5501-18B  
APL5501-19B  
APL5501-20B  
Marking  
517X  
518X  
519X  
51AX  
51BX  
51CX  
51DX  
51EX  
Product Name  
APL5501-21B  
APL5501-22B  
APL5501-23B  
APL5501-24B  
APL5501-25B  
APL5501-26B  
APL5501-27B  
Marking  
51FX  
51GX  
51HX  
51IX  
51JX  
51KX  
51LX  
Product Name  
APL5501-28B  
APL5501-29B  
APL5501-30B  
APL5501-31B  
APL5501-32B  
APL5501-33B  
APL5501-34B  
Marking  
51MX  
51NX  
51OX  
51PX  
51QX  
51RX  
51SX  
The last character “X” in the marking is for data code.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Pin Description  
PIN  
I/O  
Description  
No.  
Name  
IN  
1
V
I
I
Supply voltage input.  
(Note1)  
Shutdown control pin, low = off , high = normal. Don’t leave  
open.  
SHDN  
3
2
Ground pins of the circuitry, and all ground pins must be  
soldered to PCB with proper power dissipation.  
GND  
4
5
BP(Note1)  
O
O
Bypass signal pin in fixed output type device  
Output pin of the regulator.  
OUT  
V
Note1: These pins do not exist in 3-pin package.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
IN  
OUT  
V , V  
Input Voltage or Out Voltage  
6.5  
V
Shutdown Control Pin  
SHDN  
6.5  
V
SOT-89 : 180  
SOT-223 : 135  
SO-8 : 150  
TH,JA  
R
Thermal Resistance - Junction to Ambient  
°C/W  
SOT-23-5 : 260  
SOT-89 : 38  
SOT-223 : 15  
SO-8 :20  
RTH,JC  
Thermal Resistance - Junction to Case  
°
C/W  
SOT-23-5 : 130  
Internally Limited  
D
P
Power Dissipation  
W
J
T
Operating Junction Temperature  
Control Section  
°C  
0 to 125  
0 to 150  
-65 to +150  
260  
Power Transistor  
STG  
T
Storage Temperature Range  
Lead Temperature (Soldering, 10 second)  
°C  
TL  
°
C
Electrical Characteristics  
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1mF, COUT=4.7mF,  
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.  
APL5501/2/3  
Min. Typ. Max.  
2.7  
Unit  
Symbol  
Parameter  
Test Conditions  
VIN Input Voltage  
6
V
V
%
%
VOUT VOUT +2  
VOUT Output Voltage  
VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Electrical Characteristics  
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1mF, COUT=4.7mF,  
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.  
Symbol  
APL5501/2/3  
Unit  
Parameter  
Test Conditions  
Min.  
Typ.  
0.7  
Max.  
IN  
V =4.3V  
ILIMIT  
Circuit Current Limit  
Short Current  
A
SHORT  
I
VOUT=0V  
200  
mA  
mA  
mV  
mV  
Load Current  
IOUT  
500  
REGLINE Line Regulation  
Load Regulation  
VOUT+0.5V< VCC<6.0V, IOUT = 1mA  
VIN =VOUT+1.0V, 0mA< IOUT < IMAX  
4
1
10  
6
REGLOAD  
1.3V£VOUT<1.5V  
1100  
900  
1300  
1050  
700  
mV  
OUT  
1.5V£V <2V  
2V£VOUT<2.5V  
2.5V£VOUT<3.4V  
IOUT =500mA  
VDROP Dropout Voltage(Note2)  
500  
280  
65  
380  
F£1kHz, 1Vpp at VIN = VOUT+1.0V  
No load  
PSRR Ripple Rejection  
55  
dB  
50  
100  
450  
mA  
IQ  
Quiescent Current  
IOUT=500mA  
370  
Shutdown = low  
IOUT=0, VCC =6.0V  
Shutdown Supply  
Current(Note3)  
0.01  
1
mA  
100Hz<f<100kHz, typical load,  
50  
40  
mVrms  
BP  
OUT  
C =0.01mF, C  
= 1mF  
Noise(Note3)  
100Hz<f<100kHz, typical load,  
CBP=0.1mF, COUT = 1mF  
BP  
C =0.01mF,COUT=1mF, no load  
7
ms  
Shutdown Recovery  
Delay(Note3)  
BP  
m
m
C =0.1 F,COUT=1 F, no load  
70  
Over Temperature  
Shutdown  
OTS  
150  
°C  
°C  
Over Temperature  
Shutdown Hysteresis  
Hysteries  
10  
Output Voltage  
Temperature  
Coefficient  
ppm/  
°C  
TC  
50  
COUT  
Output Capacitor  
ESR  
4.2  
4.7  
0.1  
5.2  
1
mF  
0.02  
Ohm  
Shutdown Input  
Threshold(Note3)  
Shutdown input Bias  
current(Note3)  
Input Reverse  
Leakage current  
VOUT+1.0V< VIN <6.0V  
0.4  
0.7  
0.01  
0.1  
11  
1.6  
100  
0.5  
50  
V
IN  
ISHDN  
VSHDN =V  
nA  
mA  
mV  
OUT  
IN  
V
-V =0.1V  
Reverse Protection  
Threshold  
Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V  
Note 3 : For 5-pin devices only.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Application Circuit  
INPUT  
VIN  
VOUT  
VOUT  
2.7V to 6V  
APL5501/2/3  
GND  
BP  
SHDN  
on  
COUT  
CIN  
4.7uF  
1uF  
off  
CBP  
0.1uF  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Typical Characteristics  
Current Limit vs. Input Voltage  
Ground Pin Current vs. Output Current  
APL5501/2/3-33  
APL5501/2/3-33  
3
2.5  
2
400  
350  
300  
250  
200  
150  
100  
50  
1.5  
1
0.5  
0
0
0
150  
300  
450  
600  
750  
900  
3.5  
4
4.5  
5
5.5  
6
Output Current (mA)  
Input Voltage (V)  
Ground Pin Current vs. Input Voltage  
Input Voltage vs. Output Voltage  
APL5501/2/3-33  
APL5501/2/3-33  
3.5  
3
350  
300  
250  
200  
150  
100  
50  
2.5  
2
1.5  
1
0.5  
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage (V)  
Input Voltage (V)  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Typical Characteristics  
Output Current vs. Output Voltage  
Dropout Voltage vs. Output Current  
APL5501/2/3-33  
1200  
1100  
0
-2  
VOUT=1.5V  
VOUT=1.8V  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
-4  
VIN=0V  
-6  
-8  
VOUT=3.3V  
VOUT=2.5V  
-10  
-12  
0
100  
200  
300  
400  
500  
0
0.5  
1
1.5  
2
2.5  
3
Output Current (mA)  
Output Voltage (V)  
SHDNThreshold Voltage vs. Input Voltage  
1
PSRR vs. Frequency  
APL5501/2/3-33  
APL5501/2/3-33  
+0  
-10  
-20  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
-30  
-40  
VIN=4V  
VIN=0V  
IOUT =50mA  
COUT=10uF  
CBP=0.1uF  
-50  
-60  
-70  
-80  
VIN=5V  
-90  
-100  
3
3.5  
4
4.5  
5
5.5  
6
20  
1k  
2k  
5k  
10k 20k  
50  
100 200  
500  
50k 100k200k  
Input Voltage (V)  
Frequency (HZ)  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Typical Characteristics  
Output Noise  
Output Noise vs. Bypass Capacitor  
APL5501/2/3-33  
100u  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
VIN=4.3V  
IOUT =0mA  
80u  
COUT=10uF  
CBP=0.1uF  
60u  
40u  
20u  
0
-20u  
-40u  
-60u  
-80u  
0
-100u  
0
4m  
6m  
8m  
10m  
2m  
0
0.1  
0.2  
0.3  
0.4  
Time (s)  
Bypass Capacitor (uF)  
Shutdown Exit Delay  
Shutdown Exit Delay  
APL5501/2/3-33  
APL5501/2/3-33  
3.3V  
3.3V  
VOUT  
VOUT  
CBP=10nF  
No Load  
CBP=100nF  
No Load  
0V  
0V  
0V  
0V  
4V  
4V  
vSHDN  
vSHDN  
Time(1ms/div)  
Time(20ms/div)  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Typical Characteristics  
Region of Stable ESR vs. Load Current  
Entering Shutdown  
APL5501/2/3-33  
APL5501/2/3-33  
1
3.3V  
VOUT=3.3V  
VOUT  
0.1  
COUT=1mF  
No Load  
0V  
0V  
stable  
4V  
0.01  
unstable  
0.001  
0
150  
300  
450  
600  
750  
900  
Time(200ms/div)  
Load Current (mA)  
Output Voltage vs. Temperature  
Line-Transient Response  
APL5901/2-33  
APL5501/2/3-33  
3.35  
3.33  
3.31  
3.29  
3.27  
3.25  
VIN  
4V  
3V  
VOUT  
-40  
0
40  
80  
120  
Temperature (°C )  
Time(40ms/div)  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Typical Characteristics  
Load-Transient Response  
APL5501/2/3-33  
VOUT  
COUT=1mF  
VIN=VOUT+1V  
IOUT=1mA~500mA  
Time(10ms/div)  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Application Information  
end-of-lifebattery voltage. Because theAPL5501/2/3  
use a p-channel MOSFET pass transistor, the drop-  
out voltage is a function of drain-to-source on-resis-  
tance (RDS(ON)) multiplied by the load current.  
Capacitor Selection and Regulator  
Stability  
The APL5501/2/3 use at least a 1uF capacitor on the  
input, and this capacitor can be Aluminum, Tantalum  
or Ceramic capacitor. The input capacitor with larger  
value and lower ESR provides better PSRR and line-  
transient response. The output capacitor also can use  
Aluminum, Tantalum or Ceramic capacitor, and a mini-  
mum value of 1uF and ESR above 0.06W is  
recommended. The curve of the stable region in typi-  
cal characteristics shows the appropriate output ca-  
pacitor ESR for different loadcurrent stable operation.  
A larger output capacitor can reduce noise and im-  
prove load-transient response, stability, and PSRR.  
Note that some ceramic dielectrics exhibit large ca-  
pacitanceand ESRvariation with temperature. When  
using this capacitor, a minimum 10uF or more may  
be required to ensure the stability at low temperature  
operation. Use a bypass capacitor at BP pin for low  
output nvise. Increasing the capacitance will slightly  
decrease the output noise, but increase the start-up  
time.  
Reverse Current Protection  
TheAPL5501/2/3 havean internal reverse protection,  
it does not need an external schottky diode to con-  
nect the regulator input and output. If the output volt-  
age is forced above the input voltage by more than  
11mV, the IC will be shutdown and the ground pin  
current is below 0.1uA.  
Shutdown/Enable  
TheAPL5501/2/3haveanactive highenablefunction.  
Force EN high (>1.6V) enables the regulator, EN low  
(<0.4V) disablesthe regulator and enter the shutdown  
mode. In shutdown mode, the quiescent current can  
reduce below 1uA. The EN pin cannot be floating, a  
floating EN pin may cause an indeterminate state on  
the output. If it is no use, connect to VIN for normal  
operation.  
Load-Transient Considerations  
The APL5501/2/3 load-transient response graphs in  
typical characteristics show the transient response.  
A step change in the load current from 0mA to 500mA  
at 1us will cause a 100mV transient spike. Larger  
output capacitor and lower ESR can reduce transient  
spike.  
Current Limit  
The APL5501/2/3 have a current limit protection. The  
ouptut voltage will drop close to zero volt, when load  
current reaches the limit, and then the load current  
will be limited at 150mA after output voltage is below  
0.7V. When the load current back to the value where  
limiting started, the output voltage and current will re-  
turn to normal value. When output is shorted to  
ground, the APL5501/2/3 will keep short circuit cur-  
rent at 150mA .  
Input-Output (Dropout)Voltage  
Theminimum input-outputvoltagedifference(dropout)  
determines the lowest usable supply voltage. In bat-  
tery-powered systems, this will determine the useful  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Thermal Protection  
Thermal protection limitstotal power dissipation inthe  
device. When the junction temperature exceeds  
TJ=+150, the thermal sensor generates a logic sig-  
nal to turn off the pass transistor and allows IC to  
cool. When the IC’s junction temperature is down by  
10, the thermal sensor will turn the pass transistor  
on again, resulting in a pulsed output during continu-  
ousthermal protection. Thermalprotectionisdesigned  
to protect the APL5501/2/3 in the event of fault  
conditions. For continuous operation, do not exceed  
the absolute maximum junction temperature of  
TJ=+150.  
Operating Region and Power Dis-  
sipation  
The thermal resistance of the case to circuit board,  
and the rate of air flow all control the APL5501/2/3’s  
maximum power dissipation. The power dissipation  
across the device is PD = IOUT (VIN-VOUT) and the maxi-  
mum power dissipation is:  
PDMAX = (TJ-TA) / (θJC + θCA)  
where TJ-TA isthetemperaturedifference betweenthe  
junction and ambient air, θJC is the thermal resis-  
tance of the package, andθCA is the thermal resis-  
tance throughthe printed circuit board, copper traces,  
and other materials to the ambient air.  
The GND pin of the APL5501/3 provide an electrical  
connection to ground and channeling heat away. If  
power dissipation is large, connect the GND pin to  
ground using a large pad or ground plane, can im-  
prove theproblem of over heat of IC.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
SOT-23-5  
e1  
5
4
3
E1  
E
1
2
e
b
D
A2  
L 1  
A
a
A1  
L 2  
L
Millimeters  
Inches  
Dim  
Min.  
Max.  
Min.  
0.037  
0.002  
0.035  
0.110  
0.102  
0.059  
0.014  
Max.  
0.057  
0.006  
0.051  
0.118  
0.118  
0.067  
0.022  
A
A1  
A2  
D
E
E1  
L
0.95  
0.05  
0.90  
2.8  
2.6  
1.5  
1.45  
0.15  
1.30  
3.00  
3.00  
1.70  
0.55  
0.35  
L1  
L2  
N
0.20 BSC  
5
0.008 BSC  
5
0.020  
0.028  
0.5  
0.7  
a
0°  
10°  
0°  
10°  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
SOP-8 pin ( Reference JEDEC Registration MS-012)  
E
H
e1  
e2  
D
A1  
A
1
L
0.004max.  
Millimeters  
Inches  
Dim  
Min.  
Max.  
Min.  
Max.  
0.069  
0.010  
0.197  
0.157  
0.244  
0.050  
0.020  
A
A1  
D
1.35  
0.10  
4.80  
3.80  
5.80  
0.40  
0.33  
1.75  
0.25  
5.00  
4.00  
6.20  
1.27  
0.51  
0.053  
0.004  
0.189  
0.150  
0.228  
0.016  
0.013  
E
H
L
e1  
e2  
f 1  
1.27BSC  
0.50BSC  
8°  
8°  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
SOT-223( ReferenceJEDEC RegistrationSOT-223)  
D
A
a
B1  
c
H
E
L
K
e
A1  
e1  
b
B
Dim  
Millimeters  
Inches  
Min.  
1.50  
0.02  
0.60  
2.90  
0.28  
6.30  
3.30  
Max.  
1.80  
0.08  
0.80  
3.10  
0.32  
6.70  
3.70  
Min.  
0.06  
Max.  
0.07  
A
A1  
B
B1  
c
0.02  
0.11  
0.01  
0.25  
0.13  
0.03  
0.12  
0.01  
0.26  
0.15  
D
E
e
2.3 BSC  
4.6 BSC  
0.09 BSC  
0.18 BSC  
e1  
H
L
K
a
6.70  
0.91  
1.50  
0°  
7.30  
1.10  
2.00  
10°  
0.26  
0.04  
0.06  
0°  
0.29  
0.04  
0.08  
10°  
b
13°  
13°  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
SOT-89 (ReferenceEIAJ ED-7500A Reg stration SC-62)  
D
D1  
a
E
H
1
2
3
L
C
B1  
B
e
e1  
A
a
Millimeters  
Inches  
Dim  
Min.  
Max.  
1.60  
0.56  
0.48  
0.44  
4.60  
1.83  
Min.  
0.055  
0.016  
0.014  
0.014  
0.173  
0.053  
Max.  
0.063  
0.022  
0.019  
0.017  
0.181  
0.072  
A
B
B1  
C
D
D1  
e
e1  
E
H
L
a
1.40  
0.40  
0.35  
0.35  
4.40  
1.35  
1.50 BSC  
3.00 BSC  
0.059 BSC  
0.118 BSC  
2.29  
3.75  
0.80  
2.60  
4.25  
1.20  
10°  
0.090  
0.148  
0.031  
0.102  
0.167  
0.047  
10°  
Copyright ã ANPEC Electronics Corp.  
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www.anpec.com.tw  
Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
SOT-89-5  
Millimeters  
Inches  
Dim  
Min.  
4.40  
4.05  
1.50  
1.30  
2.40  
0.80  
Max.  
4.60  
4.25  
1.70  
1.50  
2.60  
-
Min.  
0.17  
0.16  
0.06  
0.05  
0.09  
0.03  
Max.  
0.18  
0.17  
0.07  
0.06  
0.1  
A
B
C
D
E
F
G
H
I
-
3.00 REF  
1.50 REF  
0.12 REF  
0.06 REF  
0.40  
1.40  
0.35  
0.52  
1.60  
0.41  
0.01  
0.05  
0.01  
0.02  
0.06  
0.02  
J
K
L
5 TYP  
0.2 TYP  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
TO-252( Reference JEDEC Registration TO-252)  
E
A
b2  
C1  
L2  
D
H
L1  
L
b
C
e1  
A1  
Millimeters  
Inches  
Dim  
Min.  
2.18  
0.89  
0.508  
5.207  
0.46  
0.46  
5.334  
6.35  
3.96  
9.398  
0.51  
0.64  
0.89  
Max.  
Min.  
Max.  
0.094  
0.050  
0.035  
0.215  
0.023  
0.023  
0.245  
0.265  
0.204  
0.410  
A
A1  
b
2.39  
1.27  
0.89  
5.461  
0.58  
0.58  
6.22  
6.73  
5.18  
10.41  
0.086  
0.035  
0.020  
0.205  
0.018  
0.018  
0.210  
0.250  
0.156  
0.370  
0.020  
0.025  
0.035  
b2  
C
C1  
D
E
e1  
H
L
L1  
L2  
1.02  
0.040  
0.080  
2.032  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Packaging Information  
TO-252-5  
H
A
B
J
L
S
P
Millimeters  
Inches  
Dim  
Min.  
6.40  
5.20  
6.80  
2.20  
Max.  
6.80  
5.50  
7.20  
2.80  
Min.  
0.25  
0.20  
0.26  
0.08  
Max.  
0.26  
0.21  
0.27  
0.11  
A
B
C
D
P
S
H
J
1.27 REF  
0.05 REF  
0.50  
2.20  
0.45  
0
0.90  
5.40  
0.80  
2.40  
0.55  
0.15  
1.50  
5.80  
0.02  
0.08  
0.01  
0
0.03  
0.21  
0.03  
0.09  
0.02  
0.006  
0.06  
0.22  
K
L
M
Copyright ã ANPEC Electronics Corp.  
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www.anpec.com.tw  
Rev. B.2 - May., 2005  
APL5501/2/3  
Physical Specifications  
Terminal Material  
Lead Solderability  
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn  
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.  
Reflow Condition (IR/Convection or VPR Reflow)  
tp  
TP  
Critical Zone  
TL to TP  
Ramp-up  
TL  
tL  
Tsmax  
Tsmin  
Ramp-down  
ts  
Preheat  
25  
°
t 25 C to Peak  
Time  
Classification Reflow Profiles  
Profile Feature  
Average ramp-up rate  
(TL to TP)  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
°
°
3 C/second max.  
3 C/second max.  
Preheat  
°
°
150 C  
100 C  
- Temperature Min (Tsmin)  
°
°
150 C  
200 C  
- Temperature Max (Tsmax)  
- Time (min to max) (ts)  
Time maintained above:  
- Temperature (TL)  
60-120 seconds  
60-180 seconds  
183°C  
60-150 seconds  
217°C  
60-150 seconds  
- Time (tL)  
Peak/Classificatioon Temperature (Tp)  
See table 1  
See table 2  
°
Time within 5 C of actual  
10-30 seconds  
20-40 seconds  
Peak Temperature (tp)  
Ramp-down Rate  
°
°
6 C/second max.  
6 C/second max.  
6 minutes max.  
8 minutes max.  
Time 25°C to Peak Temperature  
Notes: All temperatures refer to topside of the package .Measured on the body surface.  
(mm)  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Classification Reflow Profiles(Cont.)  
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures  
Package Thickness  
Volume mm3  
<350  
Volume mm3  
350  
<2.5 mm  
³ 2.5 mm  
240 +0/-5°C  
225 +0/-5°C  
225 +0/-5°C  
225 +0/-5°C  
Table 2. Pb-free Process – Package Classification Reflow Temperatures  
Package Thickness  
Volume mm3  
<350  
Volume mm3  
350-2000  
Volume mm3  
>2000  
<1.6 mm  
1.6 mm – 2.5 mm  
³ 2.5 mm  
260 +0°C*  
260 +0°C*  
250 +0°C*  
260 +0°C*  
250 +0°C*  
245 +0°C*  
260 +0°C*  
245 +0°C*  
245 +0°C*  
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and  
including the stated classification temperature (this means Peak reflow temperature +0°C.  
For example 260°C+0°C) at the rated MSL level.  
Reliability Test Program  
Test item  
SOLDERABILITY  
HOLT  
PCT  
Method  
MIL-STD-883D-2003  
MIL-STD-883D-1005.7  
JESD-22-B,A102  
Description  
245°C, 5 SEC  
1000 Hrs Bias @125°C  
168 Hrs, 100%RH, 121°C  
TST  
ESD  
Latch-Up  
MIL-STD-883D-1011.9  
MIL-STD-883D-3015.7  
JESD 78  
°
°
-65 C~150 C, 200 Cycles  
VHBM > 2KV, VMM > 200V  
10ms, 1tr > 100mA  
Carrier Tape & Reel Dimensions  
t
D
P
Po  
E
F
P1  
Bo  
W
Ko  
Ao  
D1  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Carrier Tape & Reel Dimensions(Cont.)  
T2  
J
C
A
B
T1  
Reel Dimensions  
A
330 ± 1  
F
B
62 +1.5  
D
C
12.75+ 0.15  
D1  
J
T1  
12.4 ± 0.2  
P1  
T2  
2 ± 0.2  
Ao  
W
P
E
Application  
2 ± 0.5  
Po  
12± 0. 3  
8± 0.1  
Ko  
1.75±0.1  
Bo  
t
SOP- 8  
5.5± 1  
A
1.55 +0.1 1.55+ 0.25  
4.0 ± 0.1  
2.0 ± 0.1  
T1  
6.4 ± 0.1  
T2  
5.2± 0. 1  
2.1± 0.1  
P
0.3±0.013  
E
B
70 ± 2  
D
C
J
W
Application  
SOT-89  
12 + 0.3  
12 - 0.1  
178 ±1  
13.5 ± 0.15 3 ± 0.15  
D1 Po  
14 ± 2  
1.3 ± 0.3  
8 ± 0.1  
1.75± 0.1  
F
P1  
Ao  
Bo  
Ko  
t
5.5 0.05 1.5 0.1  
1.5 0.1  
4.0 0.1  
2.0 0.1  
4.8 0.1  
4.5 0.1  
1.80 0.1 0.3 0.013  
±
±
±
±
±
±
±
±
±
A
B
C
J
T1  
12.4 +0.2  
P1  
T2  
W
P
E
Application  
SOT-223  
12.75  
0.15  
±
330 1  
62 1.5  
±
2
0.6  
2
0.2  
12 0.3  
8
0.1  
1.75 0.1  
±
±
±
±
±
±
F
D
D1  
Po  
Ao  
Bo  
Ko  
t
5.5 0.05 1.5+ 0.1  
1.5+ 0.1  
C
4.0 0.1 2.0 0.05 6.9 0.1  
7.5 0.1  
2.1 0.1  
0.3 0.05  
±
±
±
±
±
±
±
A
B
J
T1  
T2  
W
P
E
Application  
TO-252  
16.4 + 0.3  
-0.2  
16+ 0.3  
- 0.1  
330  
3
100  
2
13 0. 5  
2
0.5  
2.5 0.5  
8
0.1  
1.75 0.1  
±
±
±
±
±
±
±
F
D
D1  
Po  
P1  
Ao  
Bo  
Ko  
2.5 0.1  
t
7.5 0.1  
1.5 +0.1  
1.5 0.25 4.0 0.1  
2.0 0.1  
6.8 0.1 10.4 0.1  
0.3 0.05  
±
±
±
±
±
±
±
±
(mm)  
Cover Tape Dimensions  
Application  
SOP- 8  
SOT- 89  
SOT- 223  
TO- 252  
Carrier Width  
Cover Tape Width  
Devices Per Reel  
12  
12  
12  
16  
9.3  
9.3  
9.3  
2500  
1000  
2500  
2500  
13.3  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.2 - May., 2005  
APL5501/2/3  
Customer Service  
Anpec Electronics Corp.  
Head Office :  
5F, No. 2 Li-Hsin Road, SBIP,  
Hsin-Chu, Taiwan, R.O.C.  
Tel : 886-3-5642000  
Fax : 886-3-5642050  
Taipei Branch :  
7F, No. 137, Lane 235, Pac Chiao Rd.,  
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.  
Tel : 886-2-89191368  
Fax : 886-2-89191369  
Copyright ã ANPEC Electronics Corp.  
Rev. B.2 - May., 2005  
23  
www.anpec.com.tw  

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