APL560115AH-TRG [ANPEC]
Low Dropout 600mA Fixed Voltage Linear Regulator; 低压差600毫安固定电压线性稳压器
| 型号： | APL560115AH-TRG |
| 厂家： | 
ANPEC ELECTRONICS COROPRATION |
| 描述： | Low Dropout 600mA Fixed Voltage Linear Regulator |
| 文件： | 总18页 (文件大小：331K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APL5601/5602
Low Dropout 600mA Fixed Voltage Linear Regulator
Features
General Description
·
·
·
·
·
·
·
·
·
·
·
·
Low Dropout Voltage: 220mV (Typical) @600mA
The APL5601/5602 family of low-power and low dropout
linear regulators which operate from 2.9V to 6.5V input
voltage and deliver up to 600mA output current. Typical
dropout voltage is only 220mV (typical) at 600mA output.
The APL5601/5602 regulators with low 140mA quiescent
current are ideal for battery-powered system appliances.
The APL5601/5602 regulators are stable with a 2.2mF
ceramic capacitor. The features of current-limit, short cir-
cuit current-limit, and over-temperature protection protect
the device against currnet over loads and overtemperature.
The APL5601/5602 regulators come in SOT-23-3, SOT-
89, and SOT-223 packages.
Wide Input Voltage from 2.9V~6.5V
Low Quiescent Current: 140mA
Output Voltage Range : 1~5V
Fixed Output Voltage with 2% Accuracy
Stable with a Low ESR, 2.2mF Output Capacitance
Short Circuit Current-Limit
Over-Temperature Protection
Current-Limit Protection
Internal Soft-Start
SOT-23-3, SOT-89, and SOT-223 Packages
Lead Free and Green Devices Available
(RoHS Compliant)
Simplified Application Circuit
Applications
APL5601/5602
VIN
VOUT
·
·
·
·
·
CD/DVD-ROM,CD-R/W
VIN
VOUT
CIN
COUT
NetworkingSystem, LANCard, ADSL/CableModem
Set-Top Box
2.2mF
1mF
GND
PC Peripherals
Battery-Powered System
Pin Configuration
APL5602
APL5601
APL5602
APL5601
VOUT 1
GND 2
VIN 3
GND 1
VOUT 1
GND 1
VIN 2
GND
(Tab)
VIN
(Tab)
GND
(Tab)
VIN
(Tab)
VIN 2
GND 2
VIN 3
VOUT 3
VOUT 3
SOT-89
SOT-223
SOT-89
SOT-223
(Top View)
(Top View)
(Top View)
(Top View)
APL5601
GND 1
3 VIN
VOUT 2
SOT-23-3
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ã ANPEC Electronics Corp.
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Rev. A.7 - Jun., 2012
APL5601/5602
Ordering and Marking Information
Voltage Code (Note 1)
APL5601/2
10 : 1.0V 12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V
28 : 2.8V 30 : 3.0V 31 : 3.1V 33 : 3.3V 48 : 4.8V
50 : 5.0V
Assembly Material
Handling Code
Package Code
A : SOT-23-3 D : SOT-89 V : SOT-223
Operating Ambient Temperature Range
I : -40 to 85 oC H : -40 to 125oC
Handling Code
Temperature Range
Package Code
Voltage Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5601
XXXXX VV
APL5602
XXXXX VV
XXXXX - Date Code
VV - Voltage Code
APL5601/2 D/V:
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Note 1: For other voltage versions please contact ANPEC for details.
Marking for SOT-23-3
Product Name
APL5601-10A
APL5601-12A
APL5601-15A
APL5601-18A
APL5601-25A
APL5601-28A
APL5601-30A
APL5601-31A
APL5601-33A
APL5601-48A
APL5601-50A
Marking
61aX
615X
619X
61CX
61JX
61MX
61OX
61PX
61RX
61XX
61ZX
Note: The last character in the Marking, “X”, refers to date code.
Absolute Maximum Ratings (Note 2)
Symbol
Parameter
Rating
-0.3 to 7
Unit
V
VIN
VIN Supply Voltage (VIN to GND)
VOUT
PD
Output Voltage (VOUT to GND)
Power Dissipation
-0.3 to VIN+0.3
Internally Limited
150
V
TJ
Maximum Junction Temperature
Storage Temperature Range
oC
oC
oC
TSTG
TSDR
-65 to 150
260
Maximum Lead Soldering Temperature, 10 Seconds
Note 2: Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
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Rev. A.7 - Jun., 2012
APL5601/5602
Thermal Characteristics (Note 3, 4)
Symbol
Parameter
Junction to Air Thermal Resistance
Typical Value
Unit
SOT-23-3
SOT-89
SOT-223
260
180
135
qJA
°C/W
Junction to Case Thermal Resistance
SOT-23-3
SOT-89
130
40
qJC
SOT-223
15
Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink
values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to
minimum copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into
thermal shutdown.
Note 4: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – TA) / qJA; TJ =
125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Recommended Operating Conditions
Symbol
VIN
Parameter
Range
2.9 to 6.5V
0 to 0.6
Unit
V
VIN Supply Voltage
Output Current
IOUT
A
CIN
Input Capacitor
0.82 to 470
1 to 330
mF
mF
COUT
TJ
Output Capacitor
Junction Temperature
-40 to 125
-40 to 85
-40 to 125
°C
°C
Ambient Temperature (Temperature Code:I)
Ambient Temperature (Temperature Code:H)
TA
°C
Electrical Characteristics
,
Refer to the typical application circuit. VIN = VOUT+1V or (Minimum VIN=2.9V), IOUT = 1mA, TA = -40 to 85°C unless otherwise specified.
Typical values are at TA = 25°C.
APL5601/APL5602
Symbol
Parameter
Test Conditions
Unit
Min.
Typ.
Max.
SUPPLY CURRENT
IQ
Quiescent Current
VIN =5V, IOUT=0mA
-
140
220
mA
UNDER-VOLTAGE-LOCKOUT
VIN UVLO Threshold
VIN rising
2.1
-
2.5
2.9
-
V
V
VIN UVLO Hysteresis
OUTPUT VOLTAGE
0.15
TA = 25°C
-1
-2
-
-
+1
+2
VOUT
Output Voltage
%VOUT
-
TA = -40 to 85°C
Line Regulation
Load Regulation
VIN = VOUT + 1V to 6V
IOUT = 1mA to 600mA
VOUT=2.8V, IOUT=600mA
VOUT=3.3V, IOUT=600mA
VOUT=5V, IOUT=600mA
0.03
0.6
240
220
200
0.19
1.5
500
450
420
%/V
%/A
-
-
VDROP
Dropout Voltage
mV
-
-
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Rev. A.7 - Jun., 2012
APL5601/5602
Electrical Characteristics(Cont.)
,
Refer to the typical application circuit. VIN = VOUT+1V or (Minimum VIN=2.9V), IOUT = 1mA, TA = -40 to 85°C unless otherwise
specified. Typical values are at TA = 25°C.
APL5601/APL5602
Symbol
Parameter
Test Conditions
Unit
Min.
Typ.
Max.
OUTPUT VOLTAGE (Cont.)
PSRR
Power Supply Ripple Rejection
VIN = VOUT + 2V, f = 1kHz
-
55
-
dB
SOFT-START AND PROTECTION
ILIM
Output Current Limit
700
-
-
mA
°C
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Short Circuit Current Limit
Soft-Start Time
-
-
-
-
150
40
-
-
-
°C
VOUT < 0.6V
250
130
mA
ms
TSS
300
,
Refer to the typical application circuit. VIN = VOUT+1V or (Minimum VIN=2.9V), IOUT = 1mA, TA = -40 to 125°C unless otherwise
specified. Typical values are at TA = 25°C.
APL5601/APL5602
Symbol
Parameter
Test Conditions
Unit
Min.
Typ .
Max.
SUPPLY CURRENT
IQ
Quiescent Current
VIN=5V, IOUT=0mA
-
140
300
mA
UNDER-VOLTAGE-LOCKOUT
VIN UVLO Threshold
VIN rising
2.1
-
2.5
2.9
-
V
V
VIN UVLO Hysteresis
OUTPUT VOLTAGE
0.1 5
TA = 25°C
-1
-3
-
-
+1
+3
VOUT
Output Voltage
%VOUT
-
TA = -40 to 125°C
Line Regulation
Load Regulation
VIN = V OUT + 1V to 6V
IOUT = 1mA to 600mA
VOUT=2.8V, IOUT=600mA
VOUT=3.3V, IOUT=600mA
VOUT=5V, IOUT=600mA
0.03
0.6
240
220
200
0.3
2
%/V
%/A
-
-
550
500
470
VDROP
Dropout Voltage
mV
-
-
SOFT-START AND PROTECTION
ILIM
Output Current Limit
Short Circuit Current Limit
Soft-Start Time
700
-
-
-
mA
mA
ms
V
OUT < 0.6V
-
-
250
130
TSS
400
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Rev. A.7 - Jun., 2012
APL5601/5602
Typical Operating Characteristics
VIN=5V, VOUT=3.3V, CIN=1mF, COUT=2.2mF, TA=25OC, unless otherwise specified.
VIN to VOUT Dropout vs. Junction
Temperature
Quiescent Current vs. Input Voltage
200
160
120
80
350
VOUT=3.3V
IOUT=0mA
300
250
200
150
100
50
IOUT=600mA
IOUT=400mA
40
IOUT=200mA
0
0
-50
-25
0
25
50
75
100 125 150
0
1
2
3
4
5
6
Junction Temperature, TJ (oC)
Input Voltage, VIN (V)
VIN to VOUT Dropout vs. Junction
Temperature
Current-Limit vs. Junction Temperature
1.8
300
250
200
150
100
50
VOUT=5V
VIN=5V
1.6
1.4
1.2
1
IOUT=600mA
IOUT=400mA
0.8
0.6
0.4
VIN=3.3V
0.2
IOUT=200mA
0
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Junction Temperature, TJ (oC)
Junction Temperature, TJ (oC)
Power Supply Ripple Rejection
0
VIN=3.3V, VOUT=1.8V, CIN=1mF, COUT=2.2mF,
IOUT=500mA
-10
-20
-30
-40
-50
-60
-70
-80
1000
10000
100000
Frequency (Hz)
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Rev. A.7 - Jun., 2012
APL5601/5602
Operating Waveforms
VIN=5V, VOUT=3.3V, CIN=1mF, COUT=2.2mF, TA=25OC, unless otherwise specified.
Power On
Power Off
VIN
VIN
1
2
3
1
2
3
VOUT
VOUT
IOUT
IOUT
CH1 : VIN , 2V/div
CH1 : VIN , 2V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 200ms/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 1ms/div
Load Transient
Line Transient
VIN=5V, VOUT=3.3V CIN=1mF, COUT=2.2mF,
IOUT rising/falling time=1ms
VIN=4.5~6V, VIN rising/falling=10ms, IOUT=300mA
VOUT
1
VIN
IOUT
1
2
VOUT
2
CH1 : VOUT , 100mV/div (offset=3.3V)
CH2 : IOUT , 200mV/div
Time : 200ms/div
CH1 : VIN , 2V/div
CH2 : VOUT , 20mV/div (offset=3.3V)
Time : 200ms/div
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Rev. A.7 - Jun., 2012
APL5601/5602
Operating Waveforms (Cont.)
VIN=5V, VOUT=3.3V, CIN=1mF, COUT=2.2mF, TA=25OC, unless otherwise specified.
Thermal Shutdown
Current-Limit and Short Circuit Current-Limit
VIN
VIN
1
2
VOUT
1
2
3
VOUT
IOUT
IOUT
3
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 1A/div
Time : 2ms/div
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
Time : 500ms/div
Pin Description
PIN
FUNCTION
NO.
1
NAME
VIN
Input Supply Pin. Supply voltage can range from 2.9V to 6.5V. Bypass with a 1µF capacitor to the GND
2
VOUT Regulator Output. Sources up to 600mA. A small capacitor is needed from this pin to ground to assure stability.
GND Ground.
3
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Rev. A.7 - Jun., 2012
APL5601/5602
Block Diagram
VIN
Current-Limit
UVLO and
Soft-Start
VREF
0.8V
VOUT
Thermal
Shutdown
Short Circuit
Current-Limit
GND
Typical Application Circuit
APL5601/5602
VOUT
VIN
VOUT
VIN
COUT
2.2mF
CIN
1mF
GND
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APL5601/5602
Function Description
Under Voltage Lockout (UVLO)
Thermal Shutdown
The APL5601/5602 regulators have built-in under-volt-
age lock-out circuits to keep the output shuting off until
internal circuitry is operating properly. The UVLO function
initiates a soft-start process after input voltage exceeds
its rising UVLO threshold during power on. Typical UVLO
threshold is 2.5V with 0.15V hysteresis.
A thermal shutdown circuit limits the junction tempera-
ture of APL5601/5602. When the junction temperature
exceeds +150oC, the thermal shutdown circuitry disables
the output, allowing the device to cool down. The output
circuitry is enabled again after the junction temperature
cools down by 40oC, resulting in a pulsed output during
continuous thermal overload conditions. Thermal pro-
tection is designed to protect the IC in the event of over
temperature conditions. For reliable operation, the junc-
tion temperature cannot exceed TJ=+125 oC.
Soft-Start
The APL5601/5602 provide an internal soft-start circuitry
to control rise rate of the output voltage and limit the cur-
rent surge during start-up. Approximate 20ms delay time
after the VIN is over the UVLO threshold, the output voltage
starts the soft-start. The typical soft-start interval is about
130ms.
Current-Limit
The APL5601/5602 provides a current-limit circuitry, which
monitors and controls P-MOS’s gate voltage, limiting the
output current to 700mA. For reliable operation, the de-
vice should not be operated in current-limit for extended
period.
Short Circuit Current-Limit
When the output voltage drops below 0.6V, which is
caused by the over load or short circuit, the internal short
circuit current-limit circuitry limits the output current down
to 250mA. The short circuit current-limit is used to reduce
the power dissipation during short circuit condition. In
some high VIN-VOUT conditions, if the junction tempera-
ture is over the thermal shutdown temperature, the de-
vice will enter the thermal shutdown. Please refer to the
section on thermal considerations for power dissipation
calculations. The short circuit current-limit has a blank-
ing time feature after the UVLO threshold is reached, so
that it will avoid the output causing short circuit current-
limit protection during start-up; the blanking time is about
600ms.
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Rev. A.7 - Jun., 2012
APL5601/5602
Application Information
Input Capacitor
For normal operation, do not exceed the maximum oper-
ating junction temperature of TJ=125 oC. The calculated
power dissipation should be less than:
The APL5601/5602 require proper input capacitors to
supply surge current during stepping load transients to
prevent the input rail from dropping. Because the para-
sitic inductor from the voltage sources or other bulk ca-
pacitors to the VIN limits the slew rate of the surge current,
it is necessary to place the input capacitors near VIN as
close as possible. Input capacitors should be larger than
0.82mF.
PD =(125-25)/260
= 0.38(W)
The pin 3 of the SOT-23 and the tabs (and pin 2) of the
SOT-89 and SOT-223 provide an electrical connections
and channel heat away. Connect the pins and tabs to a
large area copper plane on PCBs for better heat
dissipation.
Output Capacitor
Layout Consideration
The APL5601/5602 need a proper output capacitor to
maintain circuit stability and to improve transient response
over temperature and current. In order to insure the cir-
cuit stability, the proper output capacitor value should be
larger than 1mF. With X5R and X7R dielectrics, 2.2mF is
sufficient at all operating temperatures. Maximum output
capacitor should be less than 330mF to insure the sys-
tem can be powered on successfully.
Figure 1 illustrates the layout. Below is a checklist for
your layout:
1. Please place the input capacitors close to the VIN.
2. Ceramic capacitors for load must be placed near the
load as close as possible.
3. To place APL5601/5602 and output capacitors near the
load is good for performance.
100
4. Large current paths, the bold lines in figure 1, must
have wide tracks.
Instable region
10
1
APL5601/5602
0.1
Stable region
0.01
VIN
VOUT
VIN
VOUT
0.001
Untested
0.0001
CIN
COUT
GND
1
10
100
1000
Output Capacitor(mF)
Operation Region and Power Dissipation
Figure 1.
The APL5601/5602 maximum power dissipation de-
pends on the thermal resistance and temperature differ-
ence between the die junction and ambient air. The power
dissipation PD across the device is:
Recommended Minimum Footprint
0.076
0.126
PD = (TJ - TA) / θJA
where (TJ-TA) is the temperature difference between the
junction and ambient air. qJA is the thermal resistance
between junction and ambient air. Assuming the TA=25oC,
maximum TJ=150oC (typical thermal limit threshold) and
qJA=260oC/W (SOT-23-3), so the maximum power dissi-
pation is calculated as:
0.059
0.022
Unit : Inch
0.091
0.038
Unit : Inch
PD(max)=(150-25)/260
= 0.48(W)
SOT-223
SOT-89
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Rev. A.7 - Jun., 2012
APL5601/5602
Application Information (Cont.)
Recommended Minimum Footprint (Cont.)
0.037
0.024
0.074
Unit : Inch
SOT-23-3
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Rev. A.7 - Jun., 2012
APL5601/5602
Package Information
SOT-23-3
D
e
SEE
VIEW A
c
b
e1
GAUGE PLANE
SEATING PLANE
L
VIEW A
SOT-23-3
S
Y
M
B
O
MILLIMETERS
MIN. MAX.
INCHES
MIN.
MAX.
0.057
0.006
0.051
0.020
0.009
L
A
1.45
0.15
1.30
0.50
0.22
0.000
0.035
0.012
0.003
A1
A2
b
0.00
0.90
0.30
0.08
c
D
3.10
3.00
1.80
2.70
2.60
1.40
0.106
0.102
0.055
0.122
0.118
0.071
E
E1
e
e1
L
0.95 BSC
1.90 BSC
0.037 BSC
0.075 BSC
0.012
0.024
0.30
0.60
0
0
8
0
8
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
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APL5601/5602
Package Information
SOT-89
D
A
C
D1
e
e1
B
B1
SOT-89
S
Y
M
B
O
L
MILLIMETERS
MIN.
INCHES
MAX.
1.60
0.56
0.48
0.44
4.60
MIN.
MAX.
0.063
0.022
0.019
0.017
0.181
0.072
0.102
0.090
A
1.40
0.44
0.36
0.35
4.40
0.055
0.017
0.014
0.014
0.173
0.064
0.090
0.084
B
B1
C
D
D1
E
1.62
2.29
1.83
2.60
E1
e
2.13
2.29
1.50 BSC
3.00 BSC
0.059 BSC
0.118 BSC
e1
H
0.155
0.035
0.167
0.047
3.94
0.89
4.25
1.20
L
Note : Follow JEDEC TO-243 AA.
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Rev. A.7 - Jun., 2012
APL5601/5602
Package Information
SOT-223
D
b2
SEE
VIEW A
e
c
e1
GAUGE PLANE
SEATING PLANE
L
b
VIEW A
SOT-223
S
Y
M
B
O
MILLIMETERS
MIN. MAX.
INCHES
MIN.
MAX.
L
A
1.80
0.10
1.70
0.84
3.10
0.071
0.004
0.067
0.033
0.122
0.013
0.264
0.287
0.146
0.001
0.059
0.026
0.114
0.009
0.248
0.264
0.130
A1
A2
b
0.02
1.50
0.66
2.90
b2
c
0.23
6.30
6.70
3.30
0.33
6.70
D
E
7.30
3.70
E1
e
2.30 BSC
4.60 BSC
0.091 BSC
0.181 BSC
e1
L
0.75
0.030
0
10
0
10
0
Note : 1. Follow from JEDEC TO-261 AA.
2. Dimension D and E1 are determined at the outermost extremes
of the plastic exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
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Rev. A.7 - Jun., 2012
APL5601/5602
Carrier Tape & Reel Dimensions
P0
P2
P1
A
OD0
K0
A0
OD1
A
B
B
SECTION A-A
SECTION B-B
d
T1
Application
SOT-23-3
Application
SOT-89
A
H
T1
C
d
D
W
E1
8.0±0.30 1.75±0.10
A0 B0
F
3.5±0.05
K0
8.4+2.00 13.0+0.50
178.0±2.00 50 MIN.
1.5 MIN.
D1
20.2 MIN.
-0.00 -0.20
P0
4.0±0.10
A
P1
4.0±0.10
H
P2 D0
T
1.5+0.10
-0.00
0.6+0.00
-0.40
2.0±0.05
1.0 MIN.
d
3.20±0.20 3.10±0.20 1.50±0.20
E1
T1
C
D
W
F
12.4+2.00 13.0+0.50
-0.00 -0.20
178.0±2.00 50 MIN.
1.5 MIN.
D1
20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.05
P0
4.0±0.10
A
P1
8.0±0.10
H
P2 D0
T
A0
4.80±0.20 4.50±0.20 1.80±0.20
E1
B0
K0
1.5+0.10
-0.00
0.6+0.00
-0.40
2.0±0.05
1.5 MIN.
d
Application
SOT-223
T1
C
D
W
F
12.4+2.00 13.0+0.50
-0.00 -0.20
320.0±2.00 50 MIN.
P0 P1
1.5 MIN.
20.2 MIN. 12.00±0.30 1.75±0.10 5.50±0.05
P2 D0
D1
T
A0
B0
K0
1.5+0.10
-0.00
0.6+0.00
-0.40
4.00±0.10 8.00±0.10 2.00±0.50
1.5 MIN.
6.90±0.20 7.50±0.20 2.10±0.20
(mm)
Copyright ã ANPEC Electronics Corp.
15
www.anpec.com.tw
Rev. A.7 - Jun., 2012
APL5601/5602
Devices Per Unit
Package type
SOT-23-3
SOT-89
Unit
Quantity
3000
Tape & Reel
Tape & Reel
Tape & Reel
1000
SOT-223
2500
Taping Direction Information
SOT-23-3
USER DIRECTION OF FEED
SOT-89
USER DIRECTION OF FEED
SOT-223
USER DIRECTION OF FEED
Copyright ã ANPEC Electronics Corp.
16
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Rev. A.7 - Jun., 2012
APL5601/5602
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat & Soak
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Temperature min (Tsmin
)
Temperature max (Tsmax
)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
3 °C/second max.
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body Temperature
(Tp)*
See Classification Temp in table 1
20** seconds
See Classification Temp in table 2
30** seconds
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax
)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright ã ANPEC Electronics Corp.
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www.anpec.com.tw
Rev. A.7 - Jun., 2012
APL5601/5602
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Volume mm3
350
Package
Thickness
<2.5 mm
³ 2.5 mm
Volume mm3
<350
235 °C
220 °C
220 °C
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
Volume mm3
Volume mm3
350-2000
260 °C
Volume mm3
<350
260 °C
260 °C
250 °C
>2000
260 °C
245 °C
245 °C
1.6 mm – 2.5 mm
³ 2.5 mm
250 °C
245 °C
Reliability Test Program
Test item
SOLDERABILITY
HOLT
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
PCT
TCT
HBM
MM
168 Hrs, 100 RH, 2atm, 121 C
%
°
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Latch-Up
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright ã ANPEC Electronics Corp.
Rev. A.7 - Jun., 2012
18
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