APM3054N [ANPEC]

N-Channel Enhancement Mode MOSFET; N沟道增强型MOSFET
APM3054N
型号: APM3054N
厂家: ANPEC ELECTRONICS COROPRATION    ANPEC ELECTRONICS COROPRATION
描述:

N-Channel Enhancement Mode MOSFET
N沟道增强型MOSFET

文件: 总12页 (文件大小:215K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APM3054N  
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
30V/15A, RDS(ON)=48m(typ.) @ VGS=10V  
RDS(ON)=75m(typ.) @ VGS=4.5V  
Super High Dense Cell Design  
1
2
3
1
2
3
High Power and Current Handling Capability  
TO-252 and SOT-223 Package  
G
D
S
G
D
S
Top View of SOT-223  
Top View of TO-252  
Applications  
1
2
3
Switching Regulators  
Switching Converters  
G
D
S
Top View of SOT-89  
Ordering and Marking Information  
Package C ode  
APM3054N  
D : SO T-89  
U : TO -252  
V : SO T-223  
Handling C ode  
Tem p. R ange  
Package C ode  
O perating Junction Tem p. Range  
°
C : -55 to 125  
Handling C ode  
C
TR : Tape & R eel  
- D ate Code  
XX XXX  
XX XXX  
AP M 3054N U :  
AP M 3054N  
XX XXX  
AP M 3054N  
XX XXX  
AP M 3054N D/V :  
-
Date C ode  
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)  
Symbol  
VDSS  
VGSS  
ID  
Parameter  
Rating  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
±20  
15  
Maximum Drain Current – Continuous  
Maximum Drain Current – Pulsed  
Diode Continuous Forward Current  
A
A
IDM  
30  
IS  
8
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise  
customers to obtain the latest version of relevant information to verify before placing orders.  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
1
www.anpec.com.tw  
APM3054N  
Absolute Maximum Ratings (Cont.) (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Diode Maximum Pulse Current  
Rating  
32  
Unit  
ISM  
A
TO-252  
SOT-223  
TO-252  
62.5  
TA=25°C  
W
W
3
25  
PD  
Maximum Power Dissipation  
TA=100°C  
SOT-223  
1.2  
150  
°C  
°C  
TJ  
Maximum Junction Temperature  
Storage Temperature Range  
TSTG  
-55 to 150  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
APM3054N  
Typ.  
Symbol  
Parameter  
Test Condition  
Unit  
Min.  
Max.  
Static  
Drain-Source Breakdown  
Voltage  
BVDSS  
30  
V
V =0V, I =250 A  
µ
GS  
DS  
Zero Gate Voltage Drain  
Current  
IDSS  
VDS=24V, VGS=0V  
V =V , I =250 A  
1
3
A
µ
VGS(th) Gate Threshold Voltage  
1
V
µ
DS  
GS DS  
IGSS  
Gate Leakage Current  
nA  
V = 20V, V =0V  
±
GS  
DS  
100  
54  
±
VGS=10V, IDS=12A  
VGS=4.5V, IDS=6A  
ISD=8A, VGS=0V  
48  
75  
Drain-Source On-state  
Resistance  
RDS(ON)  
m
90  
VSD  
Dynamic  
Qg  
Diode Forward Voltage  
0.6  
1.3  
V
Total Gate Charge  
9
VDS=15V, VGS=5V,  
IDS=10A  
Qgs  
Gate-Source Charge  
5.4  
nC  
Qgd  
td(ON)  
tr  
Gate-Drain Charge  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
Input Capacitance  
Output Capacitance  
Reverse Transfer  
2.4  
11  
17  
VDD=15V,ID=2A,  
ns  
V =10V, R =6  
td(OFF)  
tf  
37  
GS  
G
20  
Ciss  
400  
75  
VGS=0V  
Coss  
Crss  
VDS=25V  
pF  
Frequency=1.0MHz  
45  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
2
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APM3054N  
Typical Characteristics  
Output Characteristics  
Transfer Characteristics  
20  
25  
20  
15  
10  
5
VGS=6,7,8,9,10V  
TJ=-55°C  
TJ=25°C  
15  
VGS=5V  
TJ=125°C  
10  
VGS=4V  
5
VGS=3V  
0
0
0
2
4
6
8
10  
0
1
2
3
4
5
VDS - Drain-to-Source Voltage (V)  
VGS - Gate-to-Source Voltage (V)  
Threshold Voltage vs. Temperature  
On-Resistance vs. Drain Current  
1.2  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
IDS=250uA  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
VGS=4.5V  
VGS=10V  
-50 -25  
0
25 50 75 100 125 150  
0
2
4
6
8
10  
Tj - Junction Temperature (°C)  
ID - Drain Current (A)  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
3
www.anpec.com.tw  
APM3054N  
Typical Characteristics  
On-Resistance vs. Gate-to-Source Voltage  
On-Resistance vs. Junction Temperature  
0.10  
0.35  
VGS=10V  
ID=6A  
0.09 ID=12A  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0.00  
-50 -25  
0
25  
50  
75 100 125 150  
2
3
4
5
6
7
8
9
10  
VGS - Gate-to-Source Voltage (V)  
TJ - Junction Temperature (°C)  
Gate Charge  
On-Resistance vs. Junction Temperature  
0.10  
10  
8
VGS=10V  
IDS=12A  
VDS=15V  
IDS=10A  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0.00  
6
4
2
0
2.5  
5.0  
7.5  
10.0  
12.5  
15.0  
-50 -25  
0
25  
50  
75 100 125 150  
QG - Gate Charge (nC)  
TJ - Junction Temperature (°C)  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
4
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APM3054N  
Typical Characteristics  
Capacitance  
Source-Drain Diode Forward Voltage  
750  
30  
10  
625  
500  
Ciss  
375  
250  
TJ=25°C  
TJ=150°C  
125  
Coss  
Crss  
0
1
0
5
10  
15  
20  
25  
30  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
VDS - Drain-to-Source Voltage (V)  
VSD -Source-to-Drain Voltage (V)  
Single Pulse Power  
Single Pulse Power  
TO-252  
SOT-223  
250  
200  
150  
100  
50  
140  
120  
100  
80  
60  
40  
20  
0
0
1E-3 0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
1000  
Time (sec)  
Time (sec)  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
5
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APM3054N  
Typical Characteristics  
Normalized Thermal Transient Impedence, Junction to Ambient  
TO-252  
1
Duty Cycle=0.5  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
0.1  
SINGLE PULSE  
1.Duty Cycle, D=t1/t2  
2.Per Unit Base=RthJA=50°C/W  
3.TJM-TA=PDMZthJA  
0.01  
1E-4  
1E-3  
0.01  
0.1  
1
10  
100  
1000  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedence, Junction to Ambient  
SOT-223  
1
0.1  
Duty Cycle = 0.5  
D= 0.2  
D= 0.1  
D= 0.05  
D= 0.02  
D= 0.01  
0.01  
1.Duty Cycle, D=t1/t2  
2.Per Unit Base=RthJA=42°C/W  
3.TJM-TA=PDMZthJA  
SINGLEPULSE  
1E-3  
1E-4  
1E-3  
0.01  
0.1  
1
10  
100  
1000  
Square Wave Pulse Duration (sec)  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
6
www.anpec.com.tw  
APM3054N  
Package Information  
SOT-89 (Reference EIAJ ED-7500A Reg stration SC-62)  
D
D1  
a
E
H
1
2
3
L
C
B1  
B
e
e1  
A
a
Millimeters  
Inches  
Dim  
Min.  
Max.  
1.60  
0.56  
0.48  
0.44  
4.60  
1.83  
Min.  
0.055  
0.016  
0.014  
0.014  
0.173  
0.053  
Max.  
0.063  
0.022  
0.019  
0.017  
0.181  
0.072  
A
B
B1  
C
D
D1  
e
e1  
E
H
1.40  
0.40  
0.35  
0.35  
4.40  
1.35  
1.50 BSC  
3.00 BSC  
0.059 BSC  
0.118 BSC  
2.29  
3.75  
0.80  
2.60  
4.25  
1.20  
0.090  
0.148  
0.031  
0.102  
0.167  
0.047  
L
10  
10  
°
α
°
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
7
www.anpec.com.tw  
APM3054N  
Package Information  
TO-252( Reference JEDEC Registration TO-252)  
E
A
b2  
C1  
L2  
D
H
L1  
L
b
C
e1  
A1  
Millimeters  
Inches  
Dim  
Min.  
2.18  
0.89  
0.508  
5.207  
0.46  
0.46  
5.334  
6.35  
3.96  
9.398  
0.51  
0.64  
0.89  
Max.  
Min.  
Max.  
0.094  
0.050  
0.035  
0.215  
0.023  
0.023  
0.245  
0.265  
0.204  
0.410  
A
A1  
b
2.39  
1.27  
0.89  
5.461  
0.58  
0.58  
6.22  
6.73  
5.18  
10.41  
0.086  
0.035  
0.020  
0.205  
0.018  
0.018  
0.210  
0.250  
0.156  
0.370  
0.020  
0.025  
0.035  
b2  
C
C1  
D
E
e1  
H
L
L1  
L2  
1.02  
0.040  
0.080  
2.032  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
8
www.anpec.com.tw  
APM3054N  
Package Information  
SOT-223( Reference JEDEC Registration SOT-223)  
D
A
a
B1  
c
H
E
L
K
e
A1  
e1  
b
B
Dim  
Millimeters  
Inches  
Min.  
1.50  
0.02  
0.60  
2.90  
0.28  
6.30  
3.30  
Max.  
1.80  
0.08  
0.80  
3.10  
0.32  
6.70  
3.70  
Min.  
0.06  
Max.  
0.07  
A
A1  
B
B1  
c
0.02  
0.11  
0.01  
0.25  
0.13  
0.03  
0.12  
0.01  
0.26  
0.15  
D
E
e
2.3 BSC  
4.6 BSC  
0.09 BSC  
0.18 BSC  
e1  
H
L
6.70  
0.91  
1.50  
7.30  
1.10  
2.00  
0.26  
0.04  
0.06  
0.29  
0.04  
0.08  
K
0
10  
0
10  
°
α
°
°
°
13  
13  
°
β
°
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
9
www.anpec.com.tw  
APM3054N  
Physical Specifications  
Terminal Material  
Lead Solderability  
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)  
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.  
Reflow Condition (IR/Convection or VPR Reflow)  
Reference JEDEC Standard J-STD-020A APRIL 1999  
Peak temperature  
°
183 C  
Pre-heat temperature  
Time  
Classification Reflow Profiles  
Convection or IR/  
Convection  
VPR  
Average ramp-up rate(183 C to Peak)  
3 C/second max.  
°
10 C /second max.  
°
°
120 seconds max  
60 – 150 seconds  
10 –20 seconds  
Preheat temperature 125 ± 25 C)  
Temperature maintained above 183 C  
°
°
60 seconds  
Time within 5 C of actual peak temperature  
°
Peak temperature range  
Ramp-down rate  
220 +5/-0 C or 235 +5/-0 C 215-219 C or 235 +5/-0 C  
°
°
°
°
6 C /second max.  
10 C /second max.  
°
°
6 minutes max.  
Time 25 C to peak temperature  
°
Package Reflow Conditions  
pkg. thickness < 2.5mm and  
pkg. volume 350 mm³  
pkg. thickness < 2.5mm and pkg.  
volume < 350mm³  
pkg. thickness 2.5mm  
and all bgas  
Convection 220 +5/-0 C  
Convection 235 +5/-0 C  
°
°
VPR 215-219 C  
VPR 235 +5/-0 C  
°
°
IR/Convection 220 +5/-0 C  
IR/Convection 235 +5/-0 C  
°
°
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
10  
www.anpec.com.tw  
APM3054N  
Reliability test program  
Test item  
SO LD ER A BILITY  
H O LT  
PC T  
TST  
M ethod  
D escription  
M IL-STD -883D -2003  
M IL-STD -883D -1005.7  
JESD -22-B, A102  
M IL-STD -883D -1011.9  
M IL-STD -883D -3015.7  
JESD 78  
245 C , 5 S EC  
°
1000 H rs Bias @ 125  
C
°
168 H rs, 100 % R H , 121 C  
°
-65 C ~ 150 C , 200 C ycles  
VH B M > 2KV, VM M > 200V  
10m s , Itr > 100m A  
°
°
ESD  
Latch-U p  
Carrier Tape  
t
D
P
Po  
E
F
P1  
Bo  
W
Ko  
Ao  
D1  
T2  
J
C
A
B
T1  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
11  
www.anpec.com.tw  
APM3054N  
A
B
C
J
T1  
T2  
W
P
E
Application  
12 + 0.3  
12 - 0.1  
178 1  
70  
2
13.5 0.15 3 0.15  
14  
2
1.3 0.3  
8
0.1  
1.75 0.1  
±
±
±
±
±
±
±
±
F
D
D1  
Po  
P1  
Ao  
Bo  
Ko  
t
SOT-89  
5.5 0.05 1.5 0.1  
1.5 0.1 4.0 0.1 2.0 0.1 4.8 0.1 4.5 0.1 1.80 0.1 0.3 0.013  
±
±
±
±
±
±
±
±
±
A
B
C
J
T1  
T2  
W
P
E
Application  
TO-252  
16.4 + 0.3  
-0.2  
16+ 0.3  
- 0.1  
330 3  
100  
2
13 0. 5  
2
0.5  
2.5 0.5  
8
0.1  
1.75 0.1  
±
±
±
±
±
±
±
F
D
D1  
Po  
P1  
Ao  
Bo  
Ko  
t
7.5 0.1 1.5 +0.1 1.5 0.25 4.0 0.1 2.0 0.1 6.8 0.1 10.4 0.1 2.5 0.1 0.3 0.05  
±
±
±
±
±
±
±
±
A
B
C
J
T1  
T2  
W
P
E
Application  
SOT-223  
12.75  
0.15  
±
330 1  
62 1.5  
±
2
0.6  
12.4 +0.2  
2 0.2  
±
12 0.3  
8
0.1  
1.75 0.1  
±
±
±
±
±
F
D
D1  
Po  
P1  
Ao  
Bo  
Ko  
t
5.5 0.05 1.5+ 0.1 1.5+ 0.1 4.0 0.1 2.0 0.05 6.9 0.1 7.5 0.1  
2.1 0.1 0.3 0.05  
± ±  
±
±
±
±
±
Cover Tape Dimensions  
Application  
SOT- 89  
SOT- 223  
TO- 252  
Carrier Width  
Cover Tape Width  
Devices Per Reel  
12  
12  
16  
9.3  
9.3  
13.3  
1000  
2500  
2500  
Customer Service  
Anpec Electronics Corp.  
Head Office :  
5F, No. 2 Li-Hsin Road, SBIP,  
Hsin-Chu, Taiwan, R.O.C.  
Tel : 886-3-5642000  
Fax : 886-3-5642050  
Taipei Branch :  
7F, No. 137, Lane 235, Pac Chiao Rd.,  
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.  
Tel : 886-2-89191368  
Fax : 886-2-89191369  
Copyright ANPEC Electronics Corp.  
Rev. A.2 - Aug., 2002  
12  
www.anpec.com.tw  

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