APM9966OC-TR [ANPEC]
Dual N-Channel Enhancement Mode MOSFET; 双N沟道增强型MOSFET
| 型号： | APM9966OC-TR |
| 厂家： | 
ANPEC ELECTRONICS COROPRATION |
| 描述： | Dual N-Channel Enhancement Mode MOSFET |
| 文件： | 总12页 (文件大小：153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APM9966/C
Dual N-Channel Enhancement Mode MOSFET
Features
Applications
•
SOP-8
•
Power Management in Notebook Computer ,
Portable Equipment and Battery Powered
Systems.
20V/6A , RDS(ON)=19mΩ(typ.) @ VGS=4.5V
RDS(ON)=27mΩ(typ.) @ VGS=2.5V
TSSOP-8
20V/6A , RDS(ON)=21mΩ(typ.) @ VGS=4.5V
RDS(ON)=29mΩ(typ.) @ VGS=2.5V
•
Super High Dense Cell Design for Extremely
Low RDS(ON)
•
•
Reliable and Rugged
SO-8 and TSSOP-8 Packages
Pin Description
APM9966C
APM9966
D1
S1
S1
G1
1
2
3
4
8
7
6
5
D2
S2
S2
G2
D
1
2
3
4
8
7
6
5
D
S1
G1
S2
G2
1
2
3
4
8
7
6
5
D1
D1
D2
D2
S1
G1
S2
G2
1
2
3
4
8
7
6
5
D
D
D
D
S1
S1
G1
S2
S2
G2
SO-8
TSSOP-8
SO-8
TSSOP-8
D
D1
D
D1 D1
G 1
G 1
G1
G1
S1
S1 S1
D2
S1
D
S 1
S 1
D
D2 D2
G 2
G 2
G2
G2
S2
S2 S2
S 2
S 2
S2
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
1
www.anpec.com.tw
APM9966/C
Ordering and Marking Information
APM9966/C
Package Code
K : SO-8
Operation Junction Temp. Range
C : -55 to 150 C
Handling Code
O : TSSOP-8
Handling Code
Temp. Range
Package Code
°
TR : Tape & Reel
APM9966/C
XXXXX
APM9966/C K/O :
XXXXX - Date Code
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol
VDSS
Parameter
Rating
20
Unit
Drain-Source Voltage
Gate-Source Voltage
V
VGSS
±10
6
*
ID
Maximum Drain Current – Continuous
Maximum Drain Current – Pulsed
A
IDM
20
SO-8
1.6
T =25 C
°
A
TSSOP-8
SO-8
1.0
0.625
0.4
W
PD
Maximum Power Dissipation
T =100 C
°
A
TSSOP-8
TJ
Maximum Junction Temperature
Storage Temperature Range
150
C
C
°
°
TSTG
-55 to 150
50
Thermal Resistance – Junction to Ambient
Rθ
C/W
°
jA
* Surface Mounted on FR4 Board, t 10 sec.
≤
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
2
www.anpec.com.tw
APM9966/C
Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)
APM9966/C
Symbol
Static
Parameter
Test Condition
Unit
Min.
Typ.
Max.
BVDSS Drain-Source Breakdown Voltage
20
V
V =0V , I =250 A
µ
GS
DS
IDSS Zero Gate Voltage Drain Current VDS=16V , VGS=0V
1
1
A
µ
VGS(th) Gate Threshold Voltage
IGSS Gate Leakage Current
V
VDS=VGS , I =250 A
µ
DS
0.5
0.7
nA
V = 10V , V =0V
±
GS
DS
100
23
±
VGS=4.5V , IDS=6A
VGS=2.5V , IDS=5.2A
VGS=4.5V , IDS=6A
VGS=2.5V , IDS=5.2A
ISD=1.7A , VGS=0V
19
27
SOP-8
33
Drain-Source On-state
a
RDS(ON)
m
Ω
Resistance
21
29
25
35
TSSOP-8
a
VSD
Diode Forward Voltage
V
0.8
1.1
Dynamicb
Qg
Qgs
Qgd
Total Gate Charge
VDS=10V , IDS= 1A
VGS=4.5V ,
14
3.5
2.1
25
18
Gate-Source Charge
Gate-Drain Charge
nC
ns
td(ON) Turn-on Delay Time
Tr Turn-on Rise Time
td(OFF) Turn-off Delay Time
47
42
VDD=10V , IDS=1A ,
22
VGEN=4.5V , R =0.2
Ω
67
122
67
G
Tf
Turn-off Fall Time
Input Capacitance
36
Ciss
VGS=0V
780
165
105
Coss Output Capacitance
Crss Reverse Transfer Capacitance
VDS=15V
pF
Frequency=1.0MHz
Notes
a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
b : Guaranteed by design, not subject to production testing
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
3
www.anpec.com.tw
APM9966/C
Typical Characteristics
Transfer Characteristics
Output Characteristics
20
15
10
5
20
VGS=2,3,4,5,6,7,8,9,10V
1V
16
12
8
0.5V
TJ=25°C
TJ=-55°C
4
TJ=125°C
0
0
0
1
2
3
4
5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
On-Resistance vs. Drain Current
SOP-8
0.05
1.50
IDS=250uA
1.25
1.00
0.75
0.50
0.25
0.00
0.04
0.03
0.02
0.01
0.00
VGS=4.5V
VGS=2.5V
-50 -25
0
25 50 75 100 125 150
0
4
8
12
16
20
Tj - Junction Temperature (°C)
ID - Drain Current (A)
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
4
www.anpec.com.tw
APM9966/C
Typical Characteristics (Cont.)
On-Resistance vs. Drain Current
On-Resistance vs. Gate-to-Source Voltage
TSSOP-8
SOP-8
0.05
0.10
ID=6A
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
0.04
VGS=4.5V
0.03
VGS=2.5V
0.02
0.01
0.00
0
1
2
3
4
5
6
7
8
9
10
0
4
8
12
16
20
ID - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
TSSOP-8
2.00
0.10
ID=6A
VGS=4.5V
ID=6A
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
-50 -25
0
25 50 75 100 125 150
0
1
2
3
4
5
6
7
8
9
10
TJ - Junction Temperature (°C)
VGS - Gate-to-Source Voltage (V)
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
5
www.anpec.com.tw
APM9966/C
Typical Characteristics (Cont.)
Gate Charge
Capacitance
5
1200
1000
800
600
400
200
0
VDS=10V
Frequency=1MHz
ID=1A
4
Ciss
3
2
1
0
Coss
Crss
0
2
4
6
8
10
12
14
16
0
4
8
12
16
20
VDS - Drain-to-Source Voltage (V)
QG - Gate Charge (nC)
Single Pulse Power
Source-Drain Diode Forward Voltage
80
60
40
20
0
20
10
TJ=150°C
TJ=25°C
1
0.1
30
0.01
0.1
1
10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (sec)
VSD -Source-to-Drain Voltage (V)
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
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APM9966/C
Typical Characteristics (Cont.)
Normalized Thermal Transient Impedence, Junction to Ambient
1
Duty Cycle=0.5
D=0.2
D=0.1
D=0.05
0.1
1.Duty Cycle, D=t1/t2
2.Per Unit Base=RthJA=50°C/W
3.TJM-TA=PDMZthJA
D=0.02
SINGLE PULSE
0.01
1E-4
1E-3
0.01
0.1
1
10
30
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
7
www.anpec.com.tw
APM9966/C
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1
e2
D
A1
A
1
L
0.004max.
Millimeters
Inches
Dim
Min.
Max.
Min.
Max.
0.069
0.010
0.197
0.157
0.244
0.050
0.020
A
A1
D
1.35
0.10
4.80
3.80
5.80
0.40
0.33
1.75
0.25
5.00
4.00
6.20
1.27
0.51
0.053
0.004
0.189
0.150
0.228
0.016
0.013
E
H
L
e1
e2
1.27BSC
0.50BSC
1
8
8
°
φ
°
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
8
www.anpec.com.tw
APM9966/C
Packaging Information (Cont.)
TSSOP-8
e
8 7
2 x E / 2
(
2)
E1
E
GAUGE
PLANE
S
1
2
e/2
0.25
L
D
1
A2
(L1)
A
( 3)
b
A1
Millimeters
Inches
Dim
Min.
Max.
1.2
0.15
1.05
0.30
Min.
Max.
0.047
0.006
0.041
0.012
A
A1
A2
b
0.00
0.80
0.19
0.000
0.031
0.007
D
e
E
2.9
3.1
0.114
0.122
0.65 BSC
6.40 BSC
0.026 BSC
0.252 BSC
E1
L
L1
4.30
0.45
4.50
0.75
0.169
0.018
0.177
0.030
1.0 REF
0.039REF
R
R1
S
0.09
0.09
0.2
0.004
0.004
0.008
1
2
φ
0
°
8
°
0
°
8
°
φ
12 REF
12 REF
°
°
3
φ
12 REF
12 REF
°
°
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
9
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APM9966/C
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Peak temperature
°
183 C
Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/
Convection
VPR
Average ramp-up rate(183 C to Peak)
3 C/second max.
°
10 C /second max.
°
°
120 seconds max
60 – 150 seconds
10 –20 seconds
Preheat temperature 125 ± 25 C)
Temperature maintained above 183 C
°
°
60 seconds
Time within 5 C of actual peak temperature
°
Peak temperature range
Ramp-down rate
220 +5/-0 C or 235 +5/-0 C 215-219 C or 235 +5/-0 C
°
°
°
°
6 C /second max.
10 C /second max.
°
°
6 minutes max.
Time 25 C to peak temperature
°
Package Reflow Conditions
pkg. thickness < 2.5mm and
pkg. volume ≥ 350 mm³
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
pkg. thickness ≥ 2.5mm
and all bgas
Convection 220 +5/-0 C
Convection 235 +5/-0 C
°
°
VPR 215-219 C
VPR 235 +5/-0 C
°
°
IR/Convection 220 +5/-0 C
IR/Convection 235 +5/-0 C
°
°
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
10
www.anpec.com.tw
APM9966/C
Reliability test program
Test item
SOLDERABILITY
Method
Description
245°C,5 SEC
1000 Hrs Bias @ 125°C
168 Hrs, 100% RH, 121°C
-65°C ~ 150°C, 200 Cycles
MIL-STD-883D-2003
MIL-STD 883D-1005.7
JESD-22-B, A102
HOLT
PCT
TST
MIL-STD 883D-1011.9
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
Bo
F
W
Ao
D1
Ko
T2
J
C
A
B
T1
Application
SOP- 8
A
B
C
J
T1
T2
W
P
E
12.75+
0.15
330
1
62 +1.5
2
0.5 12.4 0.2
2
0.2
12 0. 3
8
0.1
1.75 0.1
±
±
±
±
±
±
±
F
D
D1
Po
P1
Ao
Bo
Ko
t
5.5± 1
A
1.55 +0.1 1.55+ 0.25 4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0. 1 2.1± 0.1 0.3±0.013
Application
TSSOP-8
B
62 +1.5
D
C
J
T1
2 + 0.5 12.4 ± 0.2 2 ± 0.2
Po P1 Ao
T2
W
12± 0. 3
Bo
P
E
12.75+
0.15
330 ± 1
8± 0.1
Ko
1.75±0.1
F
D1
t
5.5 0. 1 1.5 + 0.1 1.5 + 0.1 4.0 0.1 2.0 0.1 7.0 0.1 3.6 0.3 1.6 0.1 0.3 0.013
±
±
±
±
±
±
±
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
11
www.anpec.com.tw
APM9966/C
Cover Tape Dimensions
Application
SOP- 8
TSSOP- 8
Carrier Width
Cover Tape Width
Devices Per Reel
12
12
9.3
9.3
2500
2500
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright ANPEC Electronics Corp.
Rev. A.3 - Mar., 2003
12
www.anpec.com.tw
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